CN210958937U - Heat dissipation type PCB plate structure - Google Patents
Heat dissipation type PCB plate structure Download PDFInfo
- Publication number
- CN210958937U CN210958937U CN201921505790.3U CN201921505790U CN210958937U CN 210958937 U CN210958937 U CN 210958937U CN 201921505790 U CN201921505790 U CN 201921505790U CN 210958937 U CN210958937 U CN 210958937U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printing layer
- heat
- heating panel
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a heat dissipation type PCB plate structure, it includes the base plate, is located the circuit board printing layer on the base plate up end and installs the electronic components that generate heat on the circuit board printing layer, still include the heating panel and set up the ventilation hole in base plate bottom department, wherein the heating panel is straight board appearance structure, the heating panel sets up on the up end of the electronic components that generate heat through the adhesive linkage that is provided with, the heating panel is through the fastening assembly fixed mounting that is provided with on the circuit board printing layer; its top surface through at the electronic components that generate heat is provided with the heating panel and is provided with the ventilation hole on the bottom face of base plate in this scheme heat dissipation type PCB plate structure, and during the use, its produced heat of the electronic components that generate heat can dispel the heat through the heating panel above that, and the ventilation hole that lies in the base plate below simultaneously can accelerate the air flow around the PCB board, further dispels the heat to the electronic components that generate heat.
Description
Technical Field
The utility model relates to a circuit board technical field, concretely relates to heat dissipation type PCB plate structure.
Background
In the related art, a printed circuit board is known, which includes a printed wiring board and a high heat-generating electronic component mounted on the printed wiring board.
In the disclosed printed circuit board, a metal block is bonded to the upper part of an integrated circuit by using a heat-conducting adhesive, and heat generated by electronic components is taken away by adopting a flowing mode of air; the cooling efficiency of the circuit board is low, so that the performance of electronic components on the circuit board is unstable.
Disclosure of Invention
To the defect that exists among the prior art, the utility model aims to provide a heat dissipation type PCB plate structure, its structural design of this heat dissipation type PCB plate structure is reasonable, dispels the heat to the electronic components above that.
In order to achieve the above object, the utility model adopts the following technical scheme:
the utility model provides a heat dissipation type PCB plate structure, the PCB plate structure is including the base plate, be located circuit board printing layer on the base plate up end and installing the last electronic components that generate heat of circuit board printing layer, the PCB plate structure is still including heating panel and setting up the ventilation hole of base plate bottom department, wherein it is straight board appearance structure of straight of heating panel, the heating panel sets up through the adhesive linkage that is provided with on the up end of electronic components that generate heat, the heating panel is through the fastening components fixed mounting that is provided with on the circuit board printing layer.
Further, the ventilation hole is semicircular arc-shaped structure in cross section, wherein a plurality of the ventilation holes are arranged on the bottom end face of the substrate at intervals.
Furthermore, the fastening assembly comprises a connecting bolt, bolt mounting holes respectively formed in the heat dissipation plate and the circuit board printing layer, an insulating sleeve arranged in the bolt mounting hole in the circuit board printing layer and a threaded connecting sleeve fixedly arranged in the bolt mounting hole in the circuit board printing layer, wherein a connecting thread matched with the connecting bolt is arranged on the inner end face of the threaded connecting sleeve.
Furthermore, the threaded connection sleeve is made of copper materials.
Compared with the prior art, the scheme has the beneficial technical effects that: in the heat dissipation type PCB structure, the heat dissipation plate is arranged on the upper end face of the heating electronic component, and the vent holes are arranged on the bottom end face of the substrate, so that heat generated by the heating electronic component can be dissipated through the heat dissipation plate on the heating electronic component when the heat dissipation type PCB structure is used, and meanwhile, the vent holes positioned below the substrate can accelerate air flow around the PCB to further dissipate heat of the heating electronic component; in addition, through be provided with the threaded connection sleeve with connecting bolt matched with on circuit board printing layer in this scheme, it can avoid causing the harm to the printing layer because of seting up the screw hole on circuit board printing layer, guarantees the use steadiness on circuit board printing layer.
Drawings
Fig. 1 is a schematic diagram of a heat dissipation type PCB structure in this embodiment.
Fig. 2 is a schematic view of the mounting structure of the upper fastening assembly in the present embodiment.
The reference numerals in the figures illustrate:
100-heat dissipation type PCB structure, 1-substrate, 11-ventilation hole, 2-circuit board printing layer, 3-heating electronic component, 4-adhesive layer, 5-heat dissipation plate, 6-fastening component, 61-connecting bolt, 62-threaded connecting sleeve and 63-insulating sleeve.
Detailed Description
The present invention will be described in further detail with reference to the drawings and the following detailed description.
This scheme is to its radiating mode of electronic components on the current circuit board for dispel the heat through the mode that adopts the air to flow, and it has the problem that radiating efficiency is low, and then the radiating type PCB plate structure that proposes, its structural design of this radiating type PCB plate structure is reasonable, dispels the heat to electronic components above that.
Referring to fig. 1 to 2, a heat dissipation type PCB structure 100 in this embodiment includes a substrate 1, a circuit board printed layer located on an upper end surface of the substrate 1, and a heating electronic component 3 mounted on the circuit board printed layer, and further includes a heat dissipation plate 5 and a vent hole 11 disposed at a bottom end of the substrate 1, where the heat dissipation plate 5 is a straight plate shape structure, it can be understood that the heat dissipation plate 5 is formed by a metal plate with a high thermal conductivity coefficient, the heat dissipation plate 5 is disposed on an upper end surface of the heating electronic component 3 through a disposed adhesive layer 4, and meanwhile, the heat dissipation plate 5 is fixedly mounted on the circuit board printed layer through a disposed fastening assembly 6 around the heat dissipation plate 5.
In order to have a better ventilation and heat dissipation effect, the ventilation holes 11 in this embodiment preferably have an arc-shaped configuration with a semicircular cross section, and the bottom end surface of the substrate 1 in this embodiment is provided with a plurality of ventilation holes 11 at intervals.
Referring to fig. 2 in combination, the fastening assembly 6 in this embodiment includes a connection bolt 61, bolt mounting holes respectively disposed on the heat dissipation plate 5 and the circuit board printed layer 2, an insulating sleeve 63 disposed in the bolt mounting hole on the circuit board printed layer 2, and a threaded connection sleeve 62 fixedly disposed in the bolt mounting hole on the circuit board printed layer, wherein the threaded connection sleeve 62 has a connection thread on an inner end surface thereof for engaging with the connection bolt 61; it should be noted here that, the structural form of providing the bolt mounting hole and the threaded connection sleeve 62 on the printed circuit board layer, rather than directly providing the threaded hole in the form of a threaded structure on the printed circuit board layer, is that the structural form of providing the through hole is adopted, and the processing mode is simpler than that of the threaded hole, so that the printed circuit on the printed circuit board layer is prevented from being damaged due to the threaded processing mode; but by directly adding the threaded coupling sleeve 62 into the threaded mounting hole (e.g., riveting), the normal coupling of the coupling bolt 61 can be ensured; preferably, the threaded sleeve 62 in this embodiment is constructed of brass.
In summary, in the heat dissipation type PCB structure in the present embodiment, the heat dissipation plate 5 is disposed on the upper end surface of the heat-generating electronic component 3, and the ventilation hole 11 is disposed on the bottom end surface of the substrate 1, so that, in use, heat generated by the heat-generating electronic component 3 can be dissipated through the heat dissipation plate 5 thereon, and meanwhile, the ventilation hole 11 located below the substrate 1 can accelerate air flow around the PCB, so as to further dissipate heat of the heat-generating electronic component 3; in addition, through being provided with the threaded connection sleeve 62 with connecting bolt 61 matched with on circuit board printing layer 2 in this scheme, it can avoid causing the harm to the printing layer because of seting up the screw hole on circuit board printing layer 2, guarantees the use steadiness of circuit board printing layer 2.
It will be apparent to those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims and their equivalent technologies, the present invention is also intended to include such modifications and variations.
Claims (4)
1. The utility model provides a heat dissipation type PCB plate structure, the PCB plate structure is including the base plate, be located circuit board printing layer on the base plate up end and installing the electronic components that generate heat on the circuit board printing layer, its characterized in that: the PCB plate structure is still including heating panel and setting up the ventilation hole of base plate bottom department, wherein it is straight board appearance structure of straight of heating panel, the heating panel sets up through the adhesive linkage that is provided with on the up end of the electronic components that generate heat, the heating panel is through the fastening components fixed mounting that is provided with on the circuit board printing layer.
2. The heat dissipation type PCB board structure of claim 1, wherein: the ventilation hole is the semicircular arc structure of cross section, wherein a plurality of the ventilation hole interval sets up on the bottom face of base plate.
3. A heat dissipating PCB board structure according to claim 1 or 2, wherein: the fastening assembly comprises a connecting bolt, bolt mounting holes respectively formed in the heat dissipation plate and the circuit board printing layer, an insulating sleeve arranged in the bolt mounting hole in the circuit board printing layer and a threaded connecting sleeve fixedly arranged in the bolt mounting hole in the circuit board printing layer, wherein connecting threads matched with the connecting bolt are arranged on the inner end face of the threaded connecting sleeve.
4. A heat dissipating PCB board structure according to claim 3, wherein: the threaded connection sleeve is made of copper materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921505790.3U CN210958937U (en) | 2019-09-09 | 2019-09-09 | Heat dissipation type PCB plate structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921505790.3U CN210958937U (en) | 2019-09-09 | 2019-09-09 | Heat dissipation type PCB plate structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210958937U true CN210958937U (en) | 2020-07-07 |
Family
ID=71379918
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921505790.3U Active CN210958937U (en) | 2019-09-09 | 2019-09-09 | Heat dissipation type PCB plate structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210958937U (en) |
-
2019
- 2019-09-09 CN CN201921505790.3U patent/CN210958937U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP2031952B1 (en) | Shielding and heat-dissipating device | |
| JP4969332B2 (en) | Substrate and lighting device | |
| JP2010153803A (en) | Electronic component mounting module and electrical apparatus | |
| KR20020074073A (en) | Heat dissipation structure of ic | |
| JP2011155056A (en) | Shielding structure | |
| CN210958937U (en) | Heat dissipation type PCB plate structure | |
| JP6652144B2 (en) | Electronic parts, manufacturing method of electronic parts, mechanical parts | |
| CN211352964U (en) | Heat dissipation installation base that PCB board was used | |
| CN201629939U (en) | Solid-state hard disk | |
| EP3209102B1 (en) | Communication system and communication device therefor | |
| CN208016227U (en) | A kind of assembly substrate of circuit board | |
| JP5088939B2 (en) | Laminated board | |
| CN211656523U (en) | Heat dissipation type PCB board | |
| CN212278531U (en) | Novel circuit board containing heat abstractor | |
| CN210928149U (en) | Circuit board design structure with heat dissipation structure | |
| KR101307273B1 (en) | Printed circuit board and housing thereof | |
| CN220711703U (en) | Antistatic multilayer HDI circuit board | |
| CN216146509U (en) | PCB circuit board convenient to ventilation cooling | |
| CN111836460B (en) | Circuit board and preparation method thereof | |
| CN209419366U (en) | A kind of motor radiating piece mechanism | |
| CN211655992U (en) | Frequency converter and heat radiation structure thereof | |
| CN207475964U (en) | A kind of radiator structure of pcb board | |
| CN207652764U (en) | A kind of double-sided wiring board | |
| CN207399739U (en) | A kind of Assembled cooling fin | |
| JP2006308623A (en) | Plasma display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |