CN207475964U - A kind of radiator structure of pcb board - Google Patents
A kind of radiator structure of pcb board Download PDFInfo
- Publication number
- CN207475964U CN207475964U CN201721247341.4U CN201721247341U CN207475964U CN 207475964 U CN207475964 U CN 207475964U CN 201721247341 U CN201721247341 U CN 201721247341U CN 207475964 U CN207475964 U CN 207475964U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- groove
- cooling mechanism
- pcb board
- blind hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model system provides a kind of radiator structure of pcb board, including PCB substrate, PCB substrate is equipped with C faces copper foil and S faces copper foil, several heat dissipation blind holes are equipped in PCB substrate, the opening for the blind hole that radiates is connected with heat dissipation groove positioned at the side of C faces copper foil, each bottom for radiating blind hole, and the opening for the groove that radiates is positioned at the side of S faces copper foil, heat dissipation blind hole is connected with heat dissipation groove, and cooling mechanism is fixed in the groove that radiates；Radiate diameter of blind hole is d, a diameter of D, d of the groove that radiates<D.Cooling mechanism is embedded in PCB substrate by the utility model, the heat dissipation effect of cooling mechanism can be improved, and cooling mechanism is set to S faces side, it can avoid influencing the normal work of electronic component, the heat accumulation in C faces is more, the another side of PCB substrate is extended through in the bottom setting slot of the heat dissipation groove of setting cooling mechanism, the heat dissipation effect of pcb board can be further improved.
Description
Technical field
The utility model is related to the structures of pcb board, specifically disclose a kind of radiator structure of pcb board.
Background technology
Pcb board is applied in various electronic devices, in the current information-based epoch, the indispensable angle of pcb board performer
Color.With the development of science and technology, electronic device, constantly to miniaturization, lightening design, the electronic component integrated on pcb board is also more next
More, a large amount of electronic components will generate a large amount of heat at work, and heat accumulation, which excessively fails to dissipate, will cause electronics first
Part and pcb board are damaged, and seriously affect the service life of electronic component and pcb board.
The scheme for strengthening heat dissipation at present mainly sets radiator fan in outside, increases the flowing velocity of air, accelerates heat and hands over
Throw-over degree, but such method does not meet the theory of miniaturization, while cost is also higher；Also a kind of scheme is the S in pcb board
Face (solder side pins welding surface) sets cooling fin, but heat dissipation effect is not good enough outside.
Utility model content
Based on this, it is necessary to for prior art problem, provide a kind of radiator structure of pcb board, good heat dissipation effect, and tie
Structure is simple, and combination is convenient, low manufacture cost.
To solve prior art problem, the utility model discloses a kind of radiator structure of pcb board, including PCB substrate, PCB
The both sides of substrate are respectively equipped with C faces copper foil and S faces copper foil, and several heat dissipation blind holes, the opening position for the blind hole that radiates are equipped in PCB substrate
In the side of C faces copper foil, each bottom for radiating blind hole is connected with heat dissipation groove, and the opening for the groove that radiates is located at S faces copper foil
Side, heat dissipation blind hole with heat dissipation groove be connected, heat dissipation groove in be fixed with cooling mechanism；Radiate diameter of blind hole is d, dissipates
The a diameter of D, d of hot groove<D.
Further, several installation slotted eyes are additionally provided in PCB substrate, for connecting two of electronic component installations
Slot is one group of mounting base, and heat dissipation groove is located at the centre of mounting base.
Further, heat dissipation blind hole and heat dissipation groove have same axle center.
Further, the spacing of two installation slotted eyes in mounting base is L, D<L.
Further, cooling mechanism is the metallic plate equipped with several heat conduction fins.
Further, it radiates and insulating layer is additionally provided between groove and cooling mechanism, insulating layer is covered in the interior of heat dissipation groove
Wall.
The beneficial effects of the utility model are：The utility model discloses a kind of radiator structure of pcb board, and cooling mechanism is inlayed
In PCB substrate, the contact area of cooling mechanism and PCB substrate can be effectively improved, improves the heat dissipation effect of cooling mechanism,
And cooling mechanism is set to S faces side, can avoid influencing the normal work of electronic component, C faces (component side, member
Part face) heat accumulation it is more, setting cooling mechanism heat dissipation groove bottom set slot extend through the another of PCB substrate
The heat that C areas gather effectively can be transmitted to cooling mechanism, then realize that heat is handed over extraneous by cooling mechanism by face by slot
It changes, further improves the heat dissipation effect of pcb board, extend pcb board and the thereon service life of electronic component.
Description of the drawings
Fig. 1 is the structure diagram of the utility model.
Reference numeral is：PCB substrate 10, C faces copper foil 11, S faces copper foil 12, installation slotted eye 13, heat dissipation blind hole 21, heat dissipation are recessed
Slot 22, cooling mechanism 23, insulating layer 24.
Specific embodiment
For that can further appreciate that the feature, technological means and the specific purposes reached, function of the utility model, below
The utility model is described in further detail with specific embodiment with reference to attached drawing.
With reference to figure 1.
The utility model embodiment discloses a kind of radiator structure of pcb board, including PCB substrate 10, the both sides of PCB substrate 10
C faces copper foil 11 and S faces copper foil 12 are respectively equipped with, several heat dissipation blind holes 21, the opening position for the blind hole 21 that radiates are equipped in PCB substrate 10
In the side of C faces copper foil 11, each bottom for radiating blind hole 21 is connected with heat dissipation groove 22, and the opening of heat dissipation groove 22 is located at
The side of S faces copper foil 12, heat dissipation blind hole 21 are connected with heat dissipation groove 22, and cooling mechanism 23 is fixed in the groove 22 that radiates；It dissipates
A diameter of d of hot blind hole 21, a diameter of D, d of the groove 22 that radiates<D.
Cooling mechanism 23 is embedded in PCB substrate 10 by the utility model, can effectively improve cooling mechanism 23 and PCB bases
The contact area of plate 10 improves the heat dissipation effect of cooling mechanism 23, and cooling mechanism 23 is set to S faces side, while it is blind to radiate
The diameter in hole 21 is less than the diameter of heat dissipation groove 22, can effectively consolidate the position of cooling mechanism 23, prevent cooling mechanism 23 from getting over
Boundary reaches C faces, and cooling mechanism 23 is avoided to influence the normal work of electronic component；The heat accumulation in C faces is more, in setting heat dissipation machine
The bottom setting heat dissipation blind hole 21 of the heat dissipation groove 22 of structure 23 extends through the another side of PCB substrate 10, can be effectively by the product in C faces
Poly- heat is transmitted to by the blind hole 21 that radiates in cooling mechanism 23, then realizes heat exchange by cooling mechanism 23 and external environment,
The heat dissipation effect of pcb board is further improved, extends pcb board and the thereon service life of electronic component.
Based on above-described embodiment, several installation slotted eyes 13 are additionally provided in PCB substrate 10, for connecting an electronic component
Two installation slotted eyes 13 for one group of mounting base, heat dissipation groove 22 is located at the centre of mounting base, can improve the uniformity of heat dissipation.
Based on above-described embodiment, installation slotted eye 13 can be blind hole or through-hole, and heat dissipation blind hole 21 and heat dissipation groove 22 have
Same axle center, the spacing of two installation slotted eyes 13 in mounting base is L, D<L, it is ensured that when installation slotted eye 13 is through-hole, heat dissipation is recessed
Slot 22 does not interfere with the setting of installation slotted eye 13, it is ensured that the normal work of electronic component.
Based on above-described embodiment, cooling mechanism 23 is the metallic plate equipped with several heat conduction fins, in general, the heat conduction of metal
Performance is good, and heat conduction fin can improve radiating efficiency.
Based on above-described embodiment, radiate and be additionally provided with insulating layer 24 between groove 22 and cooling mechanism 23, insulating layer 24 covers
In the inner wall of heat dissipation groove 22, cooling mechanism 23 and S faces copper foil 12 are realized electric partition, can effectively prevent S faces by insulating layer 24
Solder joint contact cooling mechanism 23 and influence the function of monoblock pcb board.
Embodiment described above only expresses the several embodiments of the utility model, and description is more specific and detailed,
But it should not be interpreted as limiting the scope of the present invention.It should be pointed out that for the common of this field
For technical staff, without departing from the concept of the premise utility, various modifications and improvements can be made, these all belong to
In the scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (6)
1. a kind of radiator structure of pcb board, including PCB substrate (10), the both sides of the PCB substrate (10) are respectively equipped with C faces copper
Foil (11) and S faces copper foil (12), which is characterized in that several heat dissipation blind holes (21), the heat dissipation are equipped in the PCB substrate (10)
The opening of blind hole (21) is located at the side of C faces copper foil (11), and each bottom for radiating blind hole (21) is connected with scattered
Hot groove (22), the opening of the heat dissipation groove (22) are located at the side of S faces copper foil (12), the heat dissipation blind hole (21) and
The heat dissipation groove (22) is connected, and cooling mechanism (23) is fixed in the heat dissipation groove (22)；The heat dissipation blind hole (21)
A diameter of d, it is described heat dissipation groove (22) a diameter of D, d<D.
2. the radiator structure of a kind of pcb board according to claim 1, which is characterized in that also set in the PCB substrate (10)
There are several installation slotted eyes (13), two installation slotted eyes (13) for connecting an electronic component are one group of mounting base,
The heat dissipation groove (22) is positioned at the centre of the mounting base.
3. the radiator structure of a kind of pcb board according to claim 2, which is characterized in that the heat dissipation blind hole (21) and institute
Stating heat dissipation groove (22) has same axle center.
A kind of 4. radiator structure of pcb board according to claim 3, which is characterized in that two institutes in the mounting base
The spacing for stating installation slotted eye (13) is L, D<L.
5. the radiator structure of a kind of pcb board according to claim 1, which is characterized in that the cooling mechanism (23) is sets
There is the metallic plate of several heat conduction fins.
6. the radiator structure of a kind of pcb board according to claim 1, which is characterized in that the heat dissipation groove (22) and institute
It states and insulating layer (24) is additionally provided between cooling mechanism (23), the insulating layer (24) is covered in the interior of the heat dissipation groove (22)
Wall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721247341.4U CN207475964U (en) | 2017-09-26 | 2017-09-26 | A kind of radiator structure of pcb board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721247341.4U CN207475964U (en) | 2017-09-26 | 2017-09-26 | A kind of radiator structure of pcb board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207475964U true CN207475964U (en) | 2018-06-08 |
Family
ID=62267276
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721247341.4U Expired - Fee Related CN207475964U (en) | 2017-09-26 | 2017-09-26 | A kind of radiator structure of pcb board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207475964U (en) |
-
2017
- 2017-09-26 CN CN201721247341.4U patent/CN207475964U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180608 Termination date: 20190926 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |