CN212278531U - Novel circuit board containing heat abstractor - Google Patents
Novel circuit board containing heat abstractor Download PDFInfo
- Publication number
- CN212278531U CN212278531U CN201920225244.8U CN201920225244U CN212278531U CN 212278531 U CN212278531 U CN 212278531U CN 201920225244 U CN201920225244 U CN 201920225244U CN 212278531 U CN212278531 U CN 212278531U
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- Prior art keywords
- heat dissipation
- hole
- heat
- copper foil
- circuit board
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Abstract
The utility model discloses a novel circuit board containing a heat dissipation device, which comprises a substrate and copper foil wiring covered on the upper surface of the substrate, wherein a plurality of heat dissipation through holes are arranged on the substrate, the heat dissipation through holes are positioned below the copper foil wiring, graphite heat dissipation blocks are arranged in the heat dissipation through holes, and the novel circuit board also comprises insulating heat-conducting glue for connecting the graphite heat dissipation blocks and the copper foil wiring; the heat dissipation through hole comprises an upper through hole and a lower through hole, the aperture of the lower through hole is larger than that of the upper through hole, and the graphite heat dissipation block comprises an upper heat dissipation column positioned in the upper through hole and a lower heat dissipation column positioned in the lower through hole. The utility model provides a novel circuit board that contains heat abstractor sets up the heat dissipation through-hole that is located the copper foil and walks line below on the base plate, connect the graphite radiating block in the heat dissipation through-hole through insulating heat conduction glue and walk the line contact with the copper foil, make the heat that the copper foil walked the line derive fast with the graphite radiating block through insulating heat conduction glue, because the graphite radiating block is big with external area of contact, heat radiating area is big, the copper foil of being convenient for walks the line and in time dispels the heat.
Description
Technical Field
The utility model relates to a circuit board technical field, concretely relates to novel circuit board that contains heat abstractor.
Background
Generally, a circuit board includes a substrate and copper foils, the substrate is usually made of insulating materials such as glass fibers, a section of zigzag copper foils is left after etching the copper foils, the copper foils are called traces (trace), the copper foil traces function as those of the circuit schematic diagram, which are responsible for connecting the pins of the components together, some drill holes are drilled on the copper foil traces for installing the components, the circuit board can provide mechanical support for fixing and assembling the components, and electrical connection or insulation between the components can be realized. As shown in fig. 1, a circuit board in the prior art is provided with a heat dissipation through hole below a copper foil trace on a substrate, so that the copper foil trace dissipates heat, but the heat dissipation efficiency is low and the heat dissipation is not timely.
In view of the above, there is a need for an improved circuit board in the prior art to solve the above problems.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to disclose novel circuit board that contains heat abstractor, set up the heat dissipation through-hole that is located the copper foil and walks line below on the base plate, connect the graphite radiating block in the heat dissipation through-hole through insulating heat conduction glue and walk the line contact with the copper foil, make the heat that the copper foil walked the line derive fast through insulating heat conduction glue and graphite radiating block, because graphite radiating block is big with external area of contact, heat radiating area is big, the copper foil of being convenient for walks the line and in time dispels the heat.
In order to achieve the purpose, the utility model provides a novel circuit board comprising a heat dissipation device, which comprises a substrate and a copper foil wiring covered on the upper surface of the substrate, wherein the substrate is provided with a plurality of heat dissipation through holes, the heat dissipation through holes are positioned below the copper foil wiring, graphite heat dissipation blocks are arranged in the heat dissipation through holes, and the novel circuit board further comprises an insulating heat conduction adhesive for connecting the graphite heat dissipation blocks and the copper foil wiring; the heat dissipation through-hole includes through-hole and lower through-hole, the through-hole aperture is greater than the through-hole aperture down, the graphite radiating block is including the last heat dissipation post that is arranged in the through-hole and the lower heat dissipation post that is arranged in the through-hole down.
In some embodiments, the graphite heat slug further includes a heat sink plate layer on the lower surface of the substrate, and the lower heat-dissipating stud is attached to the heat sink plate layer.
In some embodiments, the graphite heatslug is a unitary structure.
In some embodiments, the graphite heat slug is a split structure.
In some embodiments, the insulating and thermally conductive adhesive is coated on the surfaces of the upper and lower heat-dissipating studs.
In some embodiments, the copper foil trace has a plurality of holes drilled thereon.
Compared with the prior art, the beneficial effects of the utility model are that: the utility model provides a novel circuit board that contains heat abstractor sets up the heat dissipation through-hole that is located the copper foil and walks line below on the base plate, connect the graphite radiating block in the heat dissipation through-hole through insulating heat conduction glue and walk the line contact with the copper foil, make the heat that the copper foil walked the line derive fast with the graphite radiating block through insulating heat conduction glue, because the graphite radiating block is big with external area of contact, heat radiating area is big, the copper foil of being convenient for walks the line and in time dispels the heat.
Drawings
FIG. 1 is a schematic diagram of a circuit board shown in the prior art;
fig. 2 is a schematic structural view of the novel circuit board including the heat dissipation device of the present invention;
fig. 3 is a schematic structural view of the novel circuit board (without graphite heat dissipation block) including the heat dissipation device of the present invention;
fig. 4 is a schematic structural view of the graphite heat dissipation block shown in fig. 2.
Detailed Description
The present invention is described in detail with reference to the embodiments shown in the drawings, but it should be understood that these embodiments are not intended to limit the present invention, and those skilled in the art should understand that the functions, methods, or structural equivalents or substitutions made by these embodiments are within the scope of the present invention.
The novel circuit board including the heat dissipation device shown in fig. 2-4 comprises a substrate 1 and a copper foil trace 2 covering the upper surface of the substrate 1. A plurality of heat dissipation through holes are formed in the substrate 1 and located below the copper foil wiring 2, and heat dissipation of the copper foil wiring 2 is facilitated. The copper foil trace 2 is provided with a plurality of drilled holes 20 for mounting electronic components (not shown). The copper foil wire 2 has various directions, and in this embodiment, only the linear copper foil wire 2 is shown for reference.
Be equipped with the graphite radiating block in the heat dissipation through-hole, still including connecting graphite radiating block and copper foil and walk insulating heat-conducting glue 3 of line 2, make the heat of copper foil walk line 2 derive fast through insulating heat-conducting glue 3 and graphite radiating block, the copper foil of being convenient for walks line 2 and in time dispels the heat.
The heat dissipation through-hole includes through-hole 11 and lower through-hole 12, through-hole 12 aperture is greater than through-hole 11 aperture down, the graphite radiating block is including last heat dissipation post 41 that is arranged in last through-hole 11 and lower heat dissipation post 42 that is arranged in through-hole 12 down, has increased the area of contact of graphite radiating block with the outside air, has increased heat radiating area, and the quick outside heat dissipation of graphite radiating block of being convenient for.
The graphite radiating block further comprises a radiating plate layer 43 positioned on the lower surface of the substrate 1, and the lower radiating column 42 is connected to the radiating plate layer 43, so that the contact area of the graphite radiating block and the outside air is further increased, the radiating area is increased, and the graphite radiating block is convenient to radiate outwards quickly.
The graphite radiating block is of an integrated structure, and can also be of a split structure. The insulating heat-conducting glue 3 is coated on the surfaces of the upper heat-dissipating stud 41 and the lower heat-dissipating stud 42. In stuffing the graphite radiating block into the radiating through hole, the top of the upper radiating column 41 is connected with the copper foil wiring 2 through the insulating heat-conducting glue 3, the surfaces of the upper radiating column 41 and the lower radiating column 42 are connected with the inner wall of the radiating through hole through the insulating heat-conducting glue 3, the structure is firm, the graphite radiating block is not easy to drop, and the installation is convenient. The insulating heat-conducting glue 3 plays both a connecting role and a heat-conducting role.
The heat of the copper foil wiring 2 is quickly led out through the insulating heat-conducting adhesive 3 and the graphite radiating block, and the contact area of the graphite radiating block and the outside is large, so that the heat radiating area is large, and the copper foil wiring 2 can conveniently radiate heat in time.
The above list of details is only for the practical implementation of the present invention, and they are not intended to limit the scope of the present invention, and all equivalent implementations or modifications that do not depart from the technical spirit of the present invention should be included in the scope of the present invention.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (6)
1. The novel circuit board comprises a heat dissipation device, and comprises a substrate (1) and copper foil wiring (2) covering the upper surface of the substrate (1), and is characterized in that a plurality of heat dissipation through holes are formed in the substrate (1), the heat dissipation through holes are positioned below the copper foil wiring (2), graphite heat dissipation blocks are arranged in the heat dissipation through holes, and the novel circuit board further comprises insulating heat conduction glue (3) connecting the graphite heat dissipation blocks and the copper foil wiring (2); the heat dissipation through-hole includes through-hole (11) and lower through-hole (12), through-hole (12) aperture is greater than through-hole (11) aperture down, the graphite radiating block is including last heat dissipation post (41) that is arranged in last through-hole (11) and lower heat dissipation post (42) that is arranged in through-hole (12) down.
2. The novel circuit board containing the heat dissipation device as defined in claim 1, wherein the graphite heat dissipation block further comprises a heat dissipation plate layer (43) located on the lower surface of the substrate (1), and the lower heat dissipation column (42) is connected to the heat dissipation plate layer (43).
3. The novel circuit board containing a heat dissipation device as defined in claim 2, wherein the graphite heat dissipation block is of an integrated structure.
4. The novel circuit board containing a heat dissipation device as defined in claim 2, wherein the graphite heat dissipation block is a split structure.
5. The novel circuit board containing a heat dissipation device according to claim 3 or 4, wherein the insulating and heat-conducting glue (3) is coated on the surfaces of the upper heat dissipation column (41) and the lower heat dissipation column (42).
6. The novel circuit board containing the heat dissipation device as claimed in claim 1, wherein the copper foil trace (2) is provided with a plurality of drilled holes (20).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920225244.8U CN212278531U (en) | 2019-02-22 | 2019-02-22 | Novel circuit board containing heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920225244.8U CN212278531U (en) | 2019-02-22 | 2019-02-22 | Novel circuit board containing heat abstractor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212278531U true CN212278531U (en) | 2021-01-01 |
Family
ID=73871353
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920225244.8U Active CN212278531U (en) | 2019-02-22 | 2019-02-22 | Novel circuit board containing heat abstractor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212278531U (en) |
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2019
- 2019-02-22 CN CN201920225244.8U patent/CN212278531U/en active Active
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