JP2006308623A - Plasma display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a plasma display device whose characteristics are improved by suppressing a rise in internal temperature. <P>SOLUTION: The plasma display device is equipped with a plasma panel 22, a metal panel 24 which is arranged on the reverse surface of the plasma panel 22 across an adhesive 23 and radiates heat of the plasma panel 22, and a circuit unit 26 which is formed by fitting a heat component unit 28 to a circuit board 30 and fitted and arranged on the reverse surface of the metal panel 24; and the heat component unit 28 is provided with a heat radiation plate 42 formed by laminating an insulator 38 on a metal flat plate 36 and laminating a metal pattern 40 on the insulator 38 and a heat generating component 44 brought into surface contact with the metal pattern 40, and the metal flat plate 36 of the heat radiation plate 42 is brought into surface contact with the metal panel 24. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a plasma display device.

  FIG. 7 is a plan view of the back side of a conventional plasma display device, and FIG. 8 is an enlarged perspective view of portion A in FIG.

  In recent years, a plasma display device has been put to practical use as a large screen, thin and light image display device. In FIG. 7, a conventional plasma display device includes a plasma panel 2 for plasma display, a metal panel 4 disposed on the back surface of the plasma panel 2 to dissipate heat from the plasma panel 2, and a back surface of the metal panel 4. And a circuit unit 5 arranged in the above.

  In FIG. 8, the circuit unit 5 is formed by attaching a plurality of thermal component units 16 to the circuit board 6. The circuit board 6 is a SCAN circuit, a SUS circuit, a power supply circuit, or the like that controls the scan electrodes or sustain electrodes of the plasma panel 2 and has electronic components 8 such as inductors, capacitors, and resistors mounted thereon. The thermal component unit 16 includes an aluminum heat radiating component 14 having a plurality of fins 12 and a heat generating component 10 such as a switching IC or a transformer in surface contact with the heat radiating component 14.

  An LC resonance circuit is formed by using the inductor and capacitor mounted on the circuit board 6 and the switching IC in surface contact with the heat radiation component 14 of the thermal component unit 16 to supply a high voltage to the SCAN circuit.

  At this time, the heat generated from the heat generating component 10 is radiated into the air from the fins 12 of the heat radiating component 14 to suppress an increase in the internal temperature of the plasma display device.

As prior art document information related to the invention of this application, for example, Patent Document 1 and Patent Document 2 are known.
JP-A-8-45748 JP 2002-150954 A

  In the above conventional configuration, the heat-generating component 10 is brought into contact with the heat-dissipating component 14 and the heat of the heat-generating component 10 is radiated from the heat-radiating component 14 into the air. The internal temperature of the display device is likely to increase, and the characteristics are deteriorated.

  The present invention solves the above-described problems, and an object of the present invention is to provide a plasma display device that suppresses an increase in internal temperature and has improved characteristics.

  In order to achieve the above object, the present invention attaches a circuit unit having a thermal component unit attached to a circuit board to a metal panel disposed on the back surface of the plasma panel, and an insulator is laminated on the metal flat plate in the thermal component unit. A heat dissipation plate in which a metal pattern is laminated on the insulator and a heat generating component in surface contact with the metal pattern are provided, and the metal flat plate is in surface contact with the metal panel.

  With the above configuration, an insulator is laminated on a metal flat plate, and the heat generating component is brought into surface contact with the metal pattern laminated on the insulator, and the metal flat plate is brought into surface contact with the metal panel disposed on the back surface of the plasma panel. Heat can be dissipated to the metal panel. Since the metal flat plate and the metal panel are both metal, the thermal conductivity is good, and heat can be efficiently radiated from the metal flat plate to the metal panel. The metal panel has a larger surface area than the heat dissipation component having a plurality of fins, Since heat does not stay between them, heat can be efficiently radiated from the metal panel into the air. That is, the heat dissipation rate for radiating the heat of the heat-generating component can be improved, and an increase in the internal temperature of the plasma display device can be suppressed.

  In particular, when heat-generating parts such as switching ICs and transformers that require insulation resistance are used, it is necessary to suppress short-circuiting between the heat-generating parts and the metal panel, but an insulator is provided between the metal pattern and the metal flat plate. Since it is provided, even if a heat-generating component that requires insulation resistance is used, problems such as a short circuit do not occur.

  Hereinafter, the invention described in all claims of the present invention will be described using embodiments with reference to the drawings.

  1 is a cross-sectional view of a plasma display device according to an embodiment of the present invention, FIG. 2 is a plan view of the back side of the plasma display device, FIG. 3 is an enlarged perspective view of a portion A in FIG. FIG. 5 is a perspective view of the thermal component unit.

  1 to 3, a plasma display device according to an embodiment of the present invention includes a plasma panel 22 for plasma display and the heat of the plasma panel 22 disposed on the back surface of the plasma panel 22 with an adhesive 23 interposed therebetween. A metal panel 24 for radiating heat and a circuit unit 26 mounted on the back surface of the metal panel 24 are provided.

  The circuit unit 26 is formed by attaching a thermal component unit 28 to a circuit board 30.

  The circuit board 30 is a SCAN circuit, a SUS circuit, a power supply circuit, or the like that controls the scan electrodes or sustain electrodes of the plasma panel 22 and has electronic components 32 such as inductors, capacitors, and resistors mounted thereon.

  As shown in FIGS. 4 and 5, the thermal component unit 28 is brought into surface contact with the metal pattern 40 and a radiator plate 42 in which an insulator 38 is laminated on a metal flat plate 36 and a metal pattern 40 is laminated on the insulator 38. And a heat generating component 44 such as a switching IC or a transformer. The terminal 47 of the heat generating component 44 and the metal pattern 40 are electrically connected, and the end of the metal pattern 40 and the wiring of the circuit board 30 are electrically connected.

  At this time, the thermal component unit 28 is attached to the circuit board 30 so that the metal flat plate 36 and the circuit board 30 face each other. As shown in FIG. It becomes the facing part 45. As shown in FIGS. 4 and 5, the end of the metal pattern 40 is a lead wire 46 bent toward the circuit board 30, and the lead wire 46 is inserted into a through hole provided at the wiring position of the circuit board 30. Are electrically connected to the wiring.

  An LC resonance circuit is formed using the inductor and the capacitor mounted on the circuit board 30 and the switching IC brought into surface contact with the metal pattern 40 of the thermal component unit 28 to supply a high voltage to the SCAN circuit. In particular, the inductor and the capacitor forming the LC resonance circuit are mounted on the facing portion 45 shown in FIG. 3 so that the wiring length with the switching IC is shortened.

  Further, as shown in FIG. 4, the metal pattern 40 laminated on the insulator 38 is embedded in the insulator 38 so that only the upper surface of the metal pattern 40 is exposed. The insulator 38 is an insulating resin containing an inorganic filler, and the thermal conductivity of the inorganic filler is larger than the thermal conductivity of the insulating resin. The particle size of the inorganic filler is 0.1 to 100 μm, and the insulator 38 contains 70 to 95% by weight of the inorganic filler.

  When such a circuit unit 26 is mounted and arranged on the back surface of the metal panel 24, the metal flat plate 36 of the heat radiating plate 42 is brought into surface contact below the center of the metal panel 24.

  With the above configuration, the insulator 38 is laminated on the metal flat plate 36, the heat generating component 44 is brought into surface contact with the metal pattern 40 laminated on the insulator 38, and the metal flat plate 36 is disposed on the back surface of the plasma panel 22. Because of the surface contact, the heat of the heat generating component 44 can be radiated to the metal panel 24. Since both the metal flat plate 36 and the metal panel 24 are metal, the thermal conductivity is good, and heat can be efficiently radiated from the metal flat plate 36 to the metal panel 24. Also, the metal panel 24 has a surface area larger than that of a heat dissipation component having a plurality of fins. Since heat is not retained between the fins, heat can be efficiently radiated from the metal panel 24 into the air. That is, the heat dissipation rate for radiating the heat of the heat generating component 44 can be improved, and an increase in the internal temperature of the plasma display device can be suppressed.

  In particular, when a heat generating component 44 such as a switching IC or a transformer that requires insulation resistance is used, it is necessary to suppress a short circuit between the heat generating component 44 and the metal panel 24, but between the metal pattern 40 and the metal flat plate 36. Since the insulator 38 is provided, no trouble such as a short circuit occurs even if the heat-generating component 44 that requires insulation resistance is used. At this time, the insulator 38 is an insulating resin containing an inorganic filler, and the thermal conductivity of the inorganic filler is larger than the thermal conductivity of the insulating resin. The insulation resistance can be improved without impairing the properties. It is desirable that the insulator 38 contains 70 to 95% by weight of an inorganic filler and the particle size of the inorganic filler is 0.1 to 100 μm. The desired characteristics can be freely obtained by changing the area of the insulator 38, selecting the material of the inorganic filler, or selecting the material of the substrate according to the necessity of heat dissipation or insulation.

  Further, since the metal flat plate 36 is in surface contact with the metal panel 24 below the center of the metal panel 24, the heat distribution on the back side of the metal panel 24 can be made uniform, and the plasma panel 22 caused by temperature variation can be achieved. The heat effect of can be suppressed. Generally, heat in the air rises from below to above, but according to the above configuration, heat radiated from the metal panel 24 to the air convects in the air between the bottom and top of the metal panel 24, The heat distribution is made uniform. If the metal flat plate 36 is brought into surface contact with the upper side of the metal panel 24, the temperature above the lower side of the metal panel 24 is likely to rise, and the temperature of the plasma panel 22 also rises to increase the brightness caused by temperature variation. There is a risk of unevenness.

  Further, since the terminal 47 of the heat generating component 44 and the metal pattern 40 are electrically connected, and the end of the metal pattern 40 and the wiring of the circuit board 30 are electrically connected, the heat generating component 44 of the heat component unit 28 The wiring of the circuit board 30 can be easily electrically connected.

  In particular, since the thermal component unit 28 is attached to the circuit board 30 so that the metal flat plate 36 and the circuit board 30 face each other, it is possible to reduce the height of the circuit unit 26 and to achieve a desired position of the circuit board 30. The end of the metal pattern 40 and the wiring of the circuit board 30 can be electrically connected. Therefore, it is possible to shorten the routing of the wiring between the electronic component 32 mounted on the circuit board 30 at the position facing the metal flat plate 36 and the heat generating component 44, thereby reducing the impedance due to the wiring length and improving the characteristics.

  In the thermal component unit 28 according to the embodiment of the present invention, a switching IC, a transformer, or the like is used as the heat generating component 44. However, depending on the specifications, only a plurality of switching ICs are used as shown in FIG. The metal pattern 40 may be brought into surface contact or may be brought into surface contact with the metal pattern 40 using another heat generating component 44.

  As described above, the present invention can be used in a plasma display device because an increase in internal temperature can be suppressed.

Sectional drawing of the plasma display apparatus in one embodiment of this invention Plan view of the back side of the plasma display device Enlarged perspective view of part A in FIG. Enlarged sectional view of part A in FIG. Perspective view of thermal component unit Perspective view of another thermal component unit Plan view of the back side of a conventional plasma display device Enlarged perspective view of part A in FIG.

Explanation of symbols

22 Plasma Panel 23 Adhesive 24 Metal Panel 26 Circuit Unit 28 Thermal Component Unit 30 Circuit Board 32 Electronic Component 36 Metal Flat Plate 38 Insulator 40 Metal Pattern 42 Heat Dissipating Plate 44 Heating Component 45 Opposing Portion 46 Lead Wire 47 Terminal

Claims (7)

A circuit unit having a thermal component unit mounted on a circuit board is mounted on a metal panel disposed on the back surface of the plasma panel, and the thermal component unit has a heat radiating plate in which an insulator is laminated on a metal plate and a metal pattern is laminated on the insulator. And a heat-generating component in surface contact with the metal pattern, and the metal flat plate in surface contact with the metal panel. Below the center of the metal panel. The plasma display device according to claim 1, wherein the metal flat plate is brought into surface contact with the metal panel. The plasma display device according to claim 1, wherein a terminal of the heat generating component and the metal pattern are electrically connected, and an end portion of the metal pattern and a wiring of the circuit board are electrically connected. The plasma display device according to claim 1, wherein the thermal component unit is attached to the circuit board so that the metal flat plate and the circuit board face each other. The plasma display device according to claim 1, wherein the insulator is an insulating resin containing an inorganic filler, and the thermal conductivity of the inorganic filler is larger than the thermal conductivity of the insulating resin. The plasma display device according to claim 5, wherein the inorganic filler has a particle size of 0.1 to 100 µm. The plasma display apparatus according to claim 5, wherein the insulator contains 70 to 95% by weight of the inorganic filler.

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