CN211655992U

CN211655992U - Frequency converter and heat radiation structure thereof

Info

Publication number: CN211655992U
Application number: CN202020666466.6U
Authority: CN
Inventors: 洪汉栋; 陈兆东
Original assignee: Fick Electric Shenzhen Co ltd
Current assignee: Fick Electric Shenzhen Co ltd
Priority date: 2020-04-27
Filing date: 2020-04-27
Publication date: 2020-10-09
Anticipated expiration: 2030-04-27

Abstract

The utility model provides a frequency converter, the frequency converter includes: the mounting part comprises an inner side surface facing the accommodating space and an outer side surface arranged opposite to the inner side surface; the heat source element is accommodated in the accommodating space and is tightly attached to the inner side surface; install in the heat abstractor of installation department, one side of heat abstractor with the lateral surface is closely laminated, the heat abstractor keeps away from the opposite side of installation department forms the heat radiation fins that a plurality of intervals set up, two liang form the runner that the air current circulates between the heat radiation fins. Furthermore, the utility model also provides a heat radiation structure of converter.

Description

Frequency converter and heat radiation structure thereof

Technical Field

The utility model relates to a converter technical field especially relates to a converter and heat radiation structure thereof.

Background

An Insulated Gate Bipolar Transistor (IGBT) is a composite fully-controlled voltage-driven power semiconductor device composed of a Bipolar Transistor BJT and an Insulated Gate field effect Transistor MOS, and has the advantages of high input impedance and low conduction voltage drop. Meanwhile, functions such as logic, control, detection and protection circuits are integrated in the IGBT module, so that the IGBT module is suitable for the development direction of modularization and compounding of the current power electrical appliance and power integrated circuits, and is more and more widely applied to the field of power electronics.

The IGBT module applied to the frequency converter can generate a large amount of heat in the using process, so that the temperature of the frequency converter is increased, and the operation of the frequency converter is influenced. Therefore, the heat generated by the IGBT module needs to be dissipated in time during the use of the IGBT module. The conventional frequency converter generally adopts a fan installed in the frequency converter to dissipate heat of the IGBT module. However, the fan is installed in the frequency converter, so that the volume of the frequency converter is increased, and the frequency converter is not beneficial to installation and use.

Therefore, heat dissipation of the IGBT module is an urgent problem to be solved.

SUMMERY OF THE UTILITY MODEL

The utility model provides a converter and heat radiation structure thereof directly utilizes heat radiation fins to dispel the heat for the heat source component.

In a first aspect, an embodiment of the present invention provides a frequency converter, the frequency converter includes:

the mounting part comprises an inner side surface facing the accommodating space and an outer side surface arranged opposite to the inner side surface;

the heat source element is accommodated in the accommodating space and is tightly attached to the inner side surface;

install in the heat abstractor of installation department, one side of heat abstractor with the lateral surface is closely laminated, the heat abstractor keeps away from the opposite side of installation department forms the heat radiation fins that a plurality of intervals set up, two liang form the runner that the air current circulates between the heat radiation fins.

In a second aspect, an embodiment of the present invention provides a heat dissipation structure of a frequency converter, the frequency converter includes a casing, a circuit board, and a heat source element disposed on the circuit board, the heat dissipation structure includes:

the heat source element is tightly attached to the inner side face;

Above-mentioned converter and heat radiation structure thereof through installation heat abstractor in converter casing bottom, can not occupy the inside accommodation space of converter for heat source component heat dissipation when.

Drawings

Fig. 1 is an exploded schematic view of a frequency converter provided in an embodiment of the present invention.

Fig. 2 is a longitudinal sectional view of a frequency converter according to an embodiment of the present invention.

Fig. 3 is a transverse cross-sectional view of a frequency converter according to an embodiment of the present invention.

Detailed Description

For a clearer and more accurate understanding of the present invention, reference will now be made to the following detailed description taken in conjunction with the accompanying drawings. Description of drawings the accompanying drawings illustrate examples of embodiments of the present invention, in which like reference numerals refer to like elements. It is to be understood that the drawings are not to scale as the actual practice of the invention, but are for illustrative purposes and are not drawn to scale.

Please refer to fig. 1, fig. 2 and fig. 3, which are an exploded schematic view of the frequency converter 99, a longitudinal sectional view of the frequency converter 99 and a transverse sectional view of the frequency converter 99 according to an embodiment of the present invention. The frequency converter 99 includes a housing 10, a heat source element 20, a heat sink 30, a circuit board 40, and a component 50. Specifically, the housing 10 is provided with an accommodating space 100 inside, and the accommodating space 100 is used for accommodating the heat source element 20, the circuit board 40, and the component 50. The bottom of the housing 10 forms a mounting portion 11, and the mounting portion 11 includes an inner side 111 and an outer side 112. The inner side 111 faces the accommodating space 100, and the outer side 112 is opposite to the inner side 111. In the present embodiment, a platform 12 is further formed at the bottom of the housing 10, and specifically, the platform 12 is located at one side of the mounting portion 11 and protrudes outward from the bottom of the housing 10, so that the mounting portion 11 and the platform 12 have an L-shaped cross section. The housing 10 is made of a metal material, which may be, but not limited to, iron, and alloys thereof.

The heat sink 30 is attached to the mounting portion 11. In the present embodiment, the size of the mounting portion 11 is adapted to the size of the heat dissipation device 30, so that the heat dissipation device 30 is properly mounted on the mounting portion 11. When the heat sink 30 is mounted on the mounting portion 11, one side of the heat sink 30 is closely attached to the outer side surface 112. Specifically, the heat dissipation device 30 includes a heat dissipation plate 31, a plurality of first screw holes (not shown) are formed on one side of the heat dissipation plate 31, and the mounting portion 11 is provided with first mounting holes 113 corresponding to the first screw holes. The heat sink 30 is fixedly mounted to the housing 10 by passing a screw (not shown) through the first mounting hole 113 and screwing the screw into the first screw hole, and the heat sink 30 is tightly attached to the mounting portion 11. The heat sink 30 has a plurality of spaced heat dissipating fins 32 formed on the other side thereof away from the mounting portion 11, and the heat dissipating fins 32 are arranged along a direction perpendicular to the mounting portion 11. Specifically, the heat dissipation fins 32 are disposed at intervals on a side of the heat dissipation plate 31 away from the housing 10, and a flow channel 320 for air flow is formed between every two heat dissipation fins 32. The heat dissipation fins 32 are arranged in a thin plate shape, and the gap between every two heat dissipation fins 32 is larger than the thickness of the heat dissipation fins 32. Preferably, the heat fins 32 are disposed in a direction perpendicular to the platform 12. In some possible embodiments, the heat dissipation fins 32 may also be disposed at an angle with respect to the vertical direction of the platform 12, which is not limited herein. When the heat sink 30 is mounted on the mounting portion 11, an end of the heat sink fin 32 away from the mounting portion 11 is located on the same horizontal plane as a side of the platform 12 away from the accommodating space 100. The heat sink 30 is made of a metal material, and the metal may be, but is not limited to, iron, an alloy, and the like.

The circuit board 40 is accommodated in the accommodating space 100. Specifically, the circuit board 40 is provided with a plurality of second mounting holes 400, and the circuit board 40 is fixedly mounted in the accommodating space 100 by passing screws (not shown) through the second mounting holes 400 and screwing the screws into second screw holes (not shown) located in the accommodating space 100. The circuit board 40 is located at a position just opposite to the mounting portion 11 in the accommodating space 100. The circuit board 40 includes an upper end surface 42, and a lower end surface 41. The lower end surface 41 faces the inner side surface 111, and the upper end surface 42 is opposite to the lower end surface 41.

The heat source element 20 is accommodated in the accommodating space 100, and the heat source element 20 is closely attached to the inner side surface 111. Specifically, the heat source element 20 is an IGBT module including a metal plate 21, and the metal plate 21 is closely attached to the inner side surface 111. The IGBT module is disposed on the lower end surface 41 of the circuit board 40, and the metal plate 21 is located on the side away from the circuit board 40. Preferably, the IGBT module includes a long side, and the IGBT module is disposed on the circuit board 40 along the direction in which the long side is parallel to the heat dissipation fins 32. Wherein, the IGBT module generates a large amount of heat during operation, and the heat dissipation device 30 is used for dissipating heat from the heat source element 20. Specifically, heat generated when the heat source element 20 operates is conducted to the mounting portion 11 through the metal plate 21, and the mounting portion 11 conducts the heat to the heat dissipation plate 31. Since the heat dissipating fins 32 are spaced apart from each other along the vertical mounting portion 11 and the direction perpendicular to the platform 12 to form the flow channels 320, the heat dissipating fins 32 can conduct heat to the air in the flow channels 320, and the heat generated by the heat source element 20 can be dissipated quickly by the air flowing in the flow channels 320.

The component 50 is accommodated in the accommodation space 100. The component 50 is disposed on the upper end surface 42 of the circuit board 40. Specifically, the component 50 is soldered to the circuit board 40 by solder or the like. The components 50 include, but are not limited to, electronic components with low heat generation, such as capacitors and resistors.

In the above embodiment, the heat dissipation fins are used for dissipating heat of the IGBT module, and the heat dissipation fins are arranged at intervals along the direction perpendicular to the mounting portion, so that a flow channel for air flow circulation along the direction perpendicular to the mounting portion is formed between every two heat dissipation fins, and meanwhile, the IGBT module is arranged along the direction parallel to the heat dissipation fins along the long side of the IGBT module, so that heat generated by the IGBT module can be effectively and quickly dissipated, and the heat dissipation problem of the IGBT module is effectively solved. And the IGBT module with large heat production quantity and other components with small heat production quantity are respectively arranged on the upper end surface and the lower end surface of the circuit board, so that the heat dissipation fins can more efficiently dissipate heat for the IGBT module. The design of the radiating fins greatly increases the contact area between the radiating device and the air, and the radiating device is arranged on the mounting part of the shell of the frequency converter, so that the radiating effect is achieved, meanwhile, the containing space inside the frequency converter is not occupied, and the design of the frequency converter is optimal. In addition, the IGBT module arranged on the circuit board is installed through the matching of the circuit board and the shell, so that the IGBT module is directly and tightly attached to the inner side face of the bottom of the shell, and coatings which are used for fixing the IGBT module on the inner side face and are made of soldering tin or heat-conducting silicone grease and the like do not need to be additionally coated on the IGBT module, so that the material is saved, meanwhile, the installation steps are also reduced, and the installation is more convenient and faster.

It will be apparent to those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention. Thus, to the extent that such modifications and variations fall within the scope of the invention and the equivalent techniques thereof, it is intended that the present invention also encompass such modifications and variations.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the scope of the present invention, therefore, the present invention is not limited by the following claims.

Claims

1. A frequency converter, characterized in that the frequency converter comprises:

2. The frequency converter according to claim 1, wherein the heat sink is sized to fit the size of the mounting portion.

3. The frequency converter according to claim 1, wherein said heat dissipating fins are arranged in a direction perpendicular to said mounting portion.

4. The inverter as claimed in claim 1, wherein the heat dissipating fins are arranged in a thin plate shape, and a gap between every two heat dissipating fins is larger than a thickness of the heat dissipating fins.

5. The frequency converter according to claim 1, wherein the heat source element is an IGBT module including a metal plate closely attached to the inner side surface.

6. The frequency converter according to claim 5, further comprising a circuit board accommodated in the accommodation space, and a component, wherein the circuit board comprises a lower end surface facing the inner side surface, and an upper end surface disposed opposite to the lower end surface; the component is arranged on the upper end face of the circuit board, the IGBT module is arranged on the lower end face of the circuit board, and the metal plate is located on one side far away from the circuit board.

7. The frequency converter according to claim 6, wherein the IGBT module comprises a long side, and the IGBT module is disposed on the circuit board along a direction in which the long side is parallel to the heat dissipation fins.

8. A heat radiation structure of a frequency converter, the frequency converter includes a casing, a circuit board, and a heat source element disposed on the circuit board, characterized in that the heat radiation structure includes:

the heat source element is tightly attached to the inner side face;

9. The heat dissipating structure of claim 8, wherein the heat dissipating device is sized to fit the size of the mounting portion.

10. The heat dissipating structure of claim 8, wherein said heat dissipating fins are arranged in a direction perpendicular to said mounting portion; the radiating fins are arranged in a thin plate shape, and the gap between every two radiating fins is larger than the thickness of each radiating fin.