RU137635U1 - ELECTRONIC MODULE IN THE HOUSING FOR CONDUCTIVE COOLING OF HEAT FUEL COMPONENTS - Google Patents

Abstract

1. An electronic module in a housing for conductive cooling of fuel components, comprising a printed circuit board with heat-generating components installed on it, a housing containing an external surface and an internal surface on which at least one protrusion is made in thermal contact with said heat-generating components characterized in that at least one high component and at least one low component, characterized by increased heat, are installed on the edges of the furnace of the circuit board, the remaining heat-generating components are installed both in the central part of the printed circuit board and at its edges, the housing contains a top cover, a frame and a lower cover having internal surfaces and forming the internal space in which the printed circuit board is placed, on the inner surface of the upper cover is made the said protrusion and at least one emphasis, while at least one heat-generating component installed in the Central part of the printed circuit board is in thermal contact with the said protrusion, n and the inner surface of the frame is made of at least one bracket and at least one beam protrusion, at least one of the mentioned high component is in thermal contact with the inner surface of the top cover and the corresponding bracket, at least one beam protrusion is in thermal contact with the corresponding low component and focus, while at least one rib is present on the outer surface of the housing. 2. The electronic module according to claim 1, characterized in that the frame is made in the form of a contour, p�

Description

The utility model relates to electronic equipment, in particular, to electronic modules placed in blocks and frames made in accordance with the Euromechanics 19 standards of IEC60797, and used in electronic equipment operated in “harsh” operating conditions as part of moving objects, for example , aircraft control systems, as well as stationary industrial facilities, for example, control cabinets, etc.

When designing electronic devices that use heat-generating electronic components, it is necessary to solve the problems of their cooling at various stages of the life cycle, namely, at the stages of manufacturing, tuning, operation, repair, etc. Most well-known technical solutions do not provide for the possibility of heat removal from electronic components that are critical to overheating at the stage of setting up and testing electronic assemblies.

When repairing electronic modules to ensure access of diagnostic equipment to electronic components, as a rule, it is necessary to dismantle radiators while using additional devices to remove the heat generated by electronic components during diagnostics, for example, temporarily installed heat sinks. When performing diagnostics of the causes of failures of electronic modules, it is also necessary to maintain the nominal thermal regime of their operation during the period of diagnostics. The dismantling of the case elements through which heat was removed from the electronic components can lead to an unacceptable change in the thermal regime of their operation. Therefore, it is advisable to introduce structural elements into the design of electronic modules that provide effective heat removal from electronic components operating both in the assembled housing and in the housing with its parts removed.

A known electronic assembly with elements for removing heat from electronic components (US 6055158, H05K 7/20, publ. 04/25/2000), comprising a housing, a printed circuit board containing a rigid or flexible substrate with electronic components mounted on it and an electrical connector. The housing consists of a main part and a cover containing a base. The cover comprises a first side facing inward of the housing and a second side facing outward of the housing. The main part of the body and the base of the cover are made of heat-conducting plastic by injection molding. A printed circuit board with electronic components is installed in the main part of the case. The base of the lid contains at least one heat sink made of heat-conducting metal-aluminum sheet, installed at the base of the lid at the stage of its manufacture by casting. The heat sink contains two parts, one of which is made in the form of a cold L-shaped pin with a flexible leg and support, comes from the first side of the cover and is designed to receive heat from the corresponding electronic component into the body of the heat sink, and the second part is designed to dissipate heat from the body heat sink to the ambient air, made in the form of a cooling fin and comes from the second side of the cover. The flexible legs of the heat sinks have different heights depending on the height of the electronic components connected to the respective supports of the heat sink using a heat-conducting adhesive. When assembling the cover with the main part of the housing, the heatsink supports are in contact with electronic components, and the flexible legs of the heatsinks can be deflected and bent to adjust to different heights of the electronic components.

A disadvantage of the analogue is that the elements for heat dissipation in contact with electronic components have a large length, a small cross-sectional area and a large surface area facing the inner volume of the housing. As a result, there is an ineffective heat removal with a significant dissipation of heat into the interior of the housing in which the printed circuit board with electronic components is installed. In addition, when diagnosing the functioning of electronic components or the electronic module as a whole, it is necessary to remove the cover made of heat-conducting plastic, in which the thermal contacts of the elements for heat removal from the electronic components are broken.

The closest technical solution (prototype) is an electronic module with a housing for conductive heat dissipation (US No. 7778033, F28F 7/00, H05K 7/20, publ. 08/17/2010), containing a printed circuit board with heat-generating components installed on it and a housing, made of heat-conducting material. The housing contains side and upper walls forming the internal cavity of the housing, as well as upper and lower surfaces. At least one rib, consisting of a main part and at least one additional part, made perpendicularly or at an angle to the main part, comes from the lower surface of the body. When installing the housing on the electronic module, the fuel components are placed in the internal cavity of the housing. In this case, the high heat-generating component having the highest height is in thermal contact with the lower surface of the housing, and the remaining heat-generating components with at least one rib. The heat released by the component having the highest height is transferred to the body through the bottom surface, and the heat released by the other components is transferred to the body through the rib. Then, all the heat removed from the heat-generating components is dissipated from the upper surface of the housing into the surrounding air, that is, the housing acts as a large radiator for cooling the heat-generating components mounted on the printed circuit board.

The disadvantage of the prototype is that the housing is made in the form of one part, and for access to the electronic components it is necessary to remove the entire housing, which is not acceptable when diagnosing and repairing the electronic module, since removing the housing breaks the thermal contacts of at least one rib and the lower surface of the housing with electronic components, as a result of which the latter remain without cooling, necessary when performing diagnostic work. In addition, for the removal and transfer of heat from electronic components, the “rib” structural element was used, consisting of the main part and additional protrusions. To pass to the side wall of the casing, the heat flux passes first additional protrusions, and then the main part of the ribs, while part of the heat is dissipated into the internal cavity of the casing. Thus, the design of the prototype does not provide heat removal with maximum efficiency.

The proposed utility model implements the shortest way to remove heat from heat-generating components to heat-dissipating surfaces. At the same time, access to the components installed on the printed circuit board is provided, while maintaining heat dissipation during diagnostic work and repair of the electronic module.

The technical result of the proposed utility model is the effective removal of heat from the fuel components of the electronic module at all stages of its life cycle, including during diagnosis and repair.

The specified technical result is achieved by the fact that the electronic module in the housing for conductive cooling of the fuel components contains a printed circuit board with heat components installed on it, a housing containing an external surface and an internal surface on which at least one protrusion located in thermal contact is made with said fuel components, wherein at least one high component and at least one low component, characterized by increased heat they are installed at the edges of the printed circuit board, and the remaining heat-generating components are installed both in the central part of the printed circuit board and at its edges, the housing contains a top cover, a frame and a lower cover having internal surfaces and forming an internal space in which the printed circuit board is located, said protrusion and at least one stop are made on the inner surface of the upper cover, and at least one heat-generating component installed in the central part of the printed circuit board is in heat contact with said protrusion, at least one bracket is made on the inner surface of the frame and at least one beam protrusion, at least one high component is in thermal contact with the inner surface of the top cover and the corresponding bracket, at least one beam protrusion is in thermal contact with the corresponding low component and emphasis, and at least one rib is present on the outer surface of the housing.

In particular cases of execution, the proposed electronic module in a housing for conductive cooling of fuel components can be characterized by the following features. The frame is made in the form of a contour repeating the shape of the printed circuit board. At least one heat-generating component is installed on the printed circuit board, which is in thermal contact with the inner surface of the bottom cover.

The proposed technical solution is presented in the drawings:

FIG. 1 - An electronic module in a housing for conductive cooling of electronic components (without a top cover);

FIG. 2 - Case

FIG. 3 - Top cover

FIG. 4 - Frame

FIG. 5 - An electronic module in a housing for conductive cooling of electronic components (sectional view A-A)

where the following notation is given:

1 - electronic module

2 - printed circuit board

3 - high components characterized by the highest heat

4 - low components characterized by the highest heat

5 - fuel components

6 - case

7 - top cover

8 - frame

9 - bottom cover

10 - screw

11 - ledge

12 - contact surface of the protrusion 11

13 - emphasis

14 - contact surface of the stop 13

15 - the inner surface of the frame 8

16 - the outer surface of the frame 8

17 - the upper surface of the frame 8

18 - bottom surface of the frame 8

19 - mounting emphasis

20 - bracket

21 - contact surface of the bracket 20

22 - beam protrusion

23 - contact surface of the beam protrusion 22

24 - rib

25 - thermally conductive material

26 - the inner surface of the top cover 7

27 - the inner surface of the bottom cover 9.

The electronic module 1 (Fig. 1) contains a printed circuit board 2 with heat-generating components 3, 4, 5 installed on it and a housing 6. Heat-generating components 3 and 4 are installed on the front side of the printed circuit board 2, and heat-generating components 5 are installed on both the front and and the reverse sides of the printed circuit board 2. At the same time, on the edges of the printed circuit board 2 are installed high components 3, which are characterized by the highest heat generation, for example, transformers, chokes, and low components 4, which are characterized by the highest heat generation, for example, surface mount mye resistors, diodes.

The housing 6 (Fig. 2) consists of an upper cover 7, a frame 8 and a lower cover 9 made of heat-conducting material, for example, AD1 according to GOST 4784-97, and connected by screws 10, for example, screws according to GOST 10619-80. The upper cover 7, the frame 8 and the lower cover 9 have inner surfaces forming the inner space of the housing 6. On the inner surface of the upper cover 7 (Fig. 3) there are protrusions 11 with contact surfaces 12 and stops 13 with contact surfaces 14. Frame 8 (Fig. 4) is made in the form of a circuit repeating the shape of the printed circuit board 2, and contains the inner, outer, upper and lower surfaces 15, 16, 17 and 18, respectively. Mounting stops 19 are made on the inner surface 15 of the frame 8, brackets 20 with contact surfaces 21, beam protrusions 22 with the contact surfaces 23, and at least one rib 24 is made on the outer surface 16 of the frame 8. In the frame 8, on the mounting stops 19 a printed circuit board 2 with heat-generating components 3, 4 and 5 is installed. The upper and lower covers 7 and 9 are installed on the upper and lower surfaces 17 and 18, respectively, using heat-conducting material 25, for example, gasket material KPTD-2 TU RB 100009933.004-2001.

Between the high components 3 and the corresponding contact surfaces 21 of the brackets 20, between the high components 3 and the inner surface 26 of the upper cover 7, between the low components 4 and the corresponding contact surfaces 23 of the beam protrusions 22, between the beam protrusions 22 and the corresponding contact surfaces 14 of the stops 13, between heat-conducting components 5 and the corresponding contact surfaces 12 of the protrusions 11 installed heat-conducting material 25.

In particular cases of the implementation of the proposed electronic module, heat-generating components 5, for example, surface-mounted radio elements, are installed on the back of the printed circuit board 2. Between these heat-generating components 5 and the inner surface 27 of the lower cover 9, heat-conducting material 25 is installed. Frame 8 is made in the form of a contour repeating the shape of the printed circuit board 2.

In FIG. Figure 5 shows the cooling process of an electronic module using a housing for conductive heat removal from heat-generating components during operation. The directions of heat flow and heat dissipation are shown by arrows.

The heat flux from the high components 3 mounted on the edges of the printed circuit board 2 is divided into two heat fluxes. The first heat flux from the high components 3 through the heat-conducting material 25 and the contact surfaces 21 enters the brackets 20, spreads over the body of the frame 8 and dissipates from its outer surface into the environment. The second heat flux from the high components 3 through the heat-conducting material 25 and the inner surface 26 enters and spreads over the body of the top cover 7, and then dissipates from its outer surface into the environment.

The heat flux from the low components 4 through the heat-conducting material 25 and the contact surface 23 enters the beam protrusions 22, spreads through the body of the frame 8 and diffuses from its outer surface into the environment, while part of the heat flow entering the beam protrusions 22 through the heat-conducting material 25 and the surface 14 enters the stops 13 and then dissipates from the outer surface of the frame 8 into the environment.

At least one rib 24, made in the most heated part of the frame 8, serves to ensure thermal contact of the housing 6 with an external heat sink (not shown), for example, chassis guides in accordance with the standard "Euromechanics 19" IEC60797 / VITA20 when installed in them electronic module. In this case, part of the heat removed from the heat-generating components 3 and 4 to the frame 8 is transferred to the external heat pipe through at least one rib 24.

The heat flux from the heat-generating components 5 through the heat-conducting material 25 and the contact surfaces 12 enters the protrusions 11, spreads through the body of the top cover 7 and is scattered from its outer surface into the environment.

In particular cases of the execution of the electronic module, in addition to the above-described directions of heat removal from the heat-generating components, the heat flux from the heat-generating components 5 mounted on the reverse side of the printed circuit board 2, through the heat-conducting material 25 and the inner surface 27 of the lower cover 9 extends through the body of the lower cover 27 and dissipates from its outer surface into the environment.

Due to the fact that the total heat flux from the heat-generating components mounted on the printed circuit board consists of several heat fluxes, namely, the heat flux from the high and low components, characterized by the highest heat generated by brackets and beam protrusions, the heat flux from high components characterized by the greatest heat generated by the inner surface of the top cover, heat flow from the heat-generating components installed in the central parts of the printed circuit board formed by the protrusions of the top cover, thermal energy is quickly distributed in the body of the case, and heat dissipation into the environment occurs with maximum efficiency. The separation of heat fluxes and the organization of heat removal from the components into the frame body ensures the functioning of the electronic module in the assembled housing, as well as in the housing with the upper and / or lower cover removed during manufacture, operation, diagnostic work and repair.

The utility model makes it possible to increase the possibilities of heat removal from heat-generating components mounted on a printed circuit board by installing the upper and / or lower covers, as well as by attaching an electronic module to an external heat sink, which increases the total surface area that dissipates heat into the environment, and The ability of the electronic module to operate in harsh operating conditions is ensured.

By using removable upper and lower covers in the housing design, it is possible to access components on both sides of the printed circuit board when repairing the electronic module.

Thus, effective removal of heat from the heat-generating components of the electronic module at all stages of its life cycle is achieved due to the fact that the electronic module contains a housing for conductive heat removal, containing a top cover, a frame and a lower cover, in the inner space of which there is a printed circuit board with installed on it heat-generating components, while at the edges of the printed circuit board installed high and low components, characterized by the greatest heat. Brackets and beam protrusions are made on the inner surface of the frame for contact with components characterized by the highest heat generation, and at least one rib is made on the outer surface of the frame. On the inner surface of the upper cover, protrusions are made for thermal contact with other heat-generating components. Due to the fact that the high and low components, characterized by the greatest heat release, are in thermal contact with the brackets and beam protrusions, respectively, heat is removed through the body of the frame and at least one rib to the external heat sink, and is also dissipated into the environment. Due to the fact that the remaining heat-generating components are in thermal contact with the protrusions of the upper cover, heat is transferred to the body of the upper cover and dissipated from its outer surface into the environment.

When manufactured in the conditions of an instrument-making enterprise and tested as part of aviation equipment operating in difficult climatic conditions, the effectiveness of the proposed conductive cooling system of the electronic module, as well as its operability at various stages of the life cycle, was confirmed.

Claims (3)

1. An electronic module in a housing for conductive cooling of fuel components, comprising a printed circuit board with heat-generating components installed on it, a housing containing an external surface and an internal surface on which at least one protrusion is made in thermal contact with said heat-generating components characterized in that at least one high component and at least one low component, characterized by increased heat, are installed on the edges of the furnace of the circuit board, the remaining heat-generating components are installed both in the central part of the printed circuit board and at its edges, the housing contains a top cover, a frame and a lower cover having internal surfaces and forming the internal space in which the printed circuit board is placed, on the inner surface of the upper cover is made the said protrusion and at least one emphasis, while at least one heat-generating component installed in the Central part of the printed circuit board is in thermal contact with the said protrusion, n and the inner surface of the frame is made of at least one bracket and at least one beam protrusion, at least one of the mentioned high component is in thermal contact with the inner surface of the top cover and the corresponding bracket, at least one beam protrusion is in thermal contact with the corresponding low component and emphasis, while on the outer surface of the housing there is at least one rib. 2. The electronic module according to claim 1, characterized in that the frame is made in the form of a contour repeating the shape of a printed circuit board. 3. The electronic module according to claim 2, characterized in that at least one component mounted on the printed circuit board is in thermal contact with the inner surface of the bottom cover.

Images