CN205623048U - Radiating module - Google Patents

Radiating module Download PDF

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Publication number
CN205623048U
CN205623048U CN201620304407.8U CN201620304407U CN205623048U CN 205623048 U CN205623048 U CN 205623048U CN 201620304407 U CN201620304407 U CN 201620304407U CN 205623048 U CN205623048 U CN 205623048U
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China
Prior art keywords
heat
plate
wind scooper
radiator
dispel
Prior art date
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CN201620304407.8U
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Chinese (zh)
Inventor
陈钦洲
陈进铭
谢志昇
柯佩君
刘程
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shaoxing Jicheng Packaging Machinery Co ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Shaoxing Jicheng Packaging Machinery Co ltd
Hon Hai Precision Industry Co Ltd
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Publication date
Application filed by Shaoxing Jicheng Packaging Machinery Co ltd, Hon Hai Precision Industry Co Ltd filed Critical Shaoxing Jicheng Packaging Machinery Co ltd
Priority to CN201620304407.8U priority Critical patent/CN205623048U/en
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Publication of CN205623048U publication Critical patent/CN205623048U/en
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Abstract

The utility model provides a radiating module for dispel the heat to an electronic component, including a radiator and a radiator fan, radiating module still include one with radiator fan fixed connection's wind scooper, the wind scooper both sides all are equipped with a clamping part, the clamping part includes a pothook, the radiator includes a base plate, the pothook can arrive by the buckle thereby will on the base plate the wind scooper is fixed to be arrived on the radiator.

Description

Heat radiation module
Technical field
This utility model relates to a kind of heat radiation module.
Background technology
The electronic devices and components being installed on computer main board operationally can produce substantial amounts of heat, if these heats can not be dispersed effectively, will result directly in temperature and steeply rises, and badly influence the work efficiency of electronic devices and components.Dispel the heat to this end, generally install a heat abstractor on electronic devices and components.
Traditional heat abstractor includes that one is installed on the radiator on central processing unit (CPU) and the fan being fixed on radiator.In order to improve the airflow efficiency of fan, install a wind scooper the most on a heat sink additional.Described wind scooper, for intensively guiding air-flow produced by fan to radiator, makes radiator rapidly and extraneous heat exchange, and then makes CPU can obtain higher radiating efficiency.
But, the fixed form of traditional heat-dissipating device is nothing more than being fixed on radiator with screwed lock or locking in mainboard structure with screw.But when assembling in systems or dismantling heat abstractor, it is necessary to use the instruments such as screwdriver, assembling or dismounting to heat abstractor bring great inconvenience, also can reduce packaging efficiency simultaneously.
Utility model content
In view of the foregoing, it is necessary to a kind of heat radiation module being easily installed is provided.
A kind of heat radiation module, in order to an electronic component is dispelled the heat, including a radiator and a radiator fan, described heat radiation module also includes that one fixes, with described radiator fan, the wind scooper being connected, described wind scooper both sides are equipped with a clamping part, described clamping part includes that a grab, described radiator include that a substrate, described grab can be snapped on described substrate thus be fixed on described radiator by described wind scooper.
Preferably, described wind scooper includes that a cover plate and two is vertically connected on the side plate of described cover plate both sides, and described clamping part is opened on described side plate.
Preferably, described clamping part includes that a pinch plate, described grab are opened in described side plate bottom, and described pinch plate is pressed and drives described grab to move so that described side plate elastic deformation.Preferably, each side plate bottom the most vertically bends two fixed plates, be pasted with bottom each fixed plate one can elastically-deformable flexure strip, described flexure strip can play the effect of shock dropping.
Preferably, being wherein also convexly equipped with a locating dowel bottom two fixed plates, described substrate is provided with hole, some location, and described locating dowel is inserted in hole, described location thus is alignd with described radiator by described wind scooper.
Preferably, described wind scooper also includes a supporting plate being connected with described biside plate, and described radiator fan can be fixed on described supporting plate.
Preferably, described supporting plate is equipped with some spacing holes on described side plate junction and described supporting plate, described radiator fan is provided with the perforation that some and described spacing hole is corresponding, and some fixtures can be through described perforation and insert in described spacing hole thus be fixed on described supporting plate by described radiator fan.
Preferably, described cover plate, described biside plate and described supporting plate are collectively forming an air inlet, and air-flow can enter described wind scooper from described air inlet.
Preferably, described wind scooper also includes a leading-out portion being connected with described cover plate and described side plate, and described leading-out portion is provided with an air outlet, and air-flow can be from described air outlet discharges described wind scooper.
Preferably, described radiator also includes a heat absorbing sheet being fixed on described substrate side, and described heat absorbing sheet can be close on described electronic component absorb the heat that described electronic component produces.
Compared to prior art, above-mentioned heat radiation module by offering described clamping part on described wind scooper, utilizes the grab of described clamping part to be snapped on described radiator thus the purpose of the module that realizes dispelling the heat described in easy disassembly.
Accompanying drawing explanation
Fig. 1 is a three-dimensional exploded view of a better embodiment of this utility model heat radiation module.
Fig. 2 is another three-dimensional exploded view of the heat radiation module in Fig. 1.
Fig. 3 is a three-dimensional assembly diagram of the heat radiation module in Fig. 1.
Main element symbol description
Radiator 10
Substrate 20
Fixed part 21
Fixing hole 215
Hole, location 22
Securing member 25
Heat absorbing sheet 30
Radiating fin 40
Wind scooper 50
Cover plate 60
Side plate 70
Clamping part 71
Pinch plate 711
Grab 715
Fixed plate 72
Flexure strip 73
Locating dowel 74
Supporting plate 75
Through hole 751
Spacing hole 752
Air inlet 755
Leading-out portion 80
Air outlet 81
Radiator fan 90
Perforation 91
Heat radiation module 100
Following detailed description of the invention will further illustrate this utility model in conjunction with above-mentioned accompanying drawing.
Detailed description of the invention
Referring to Fig. 1, in a better embodiment of the present utility model, a kind of heat radiation module 100 is in order to dispel the heat to an electronic component (not shown), and in one embodiment, described electronic component can be a central processing unit (Central being arranged on mainboard Processing Unit).Described heat radiation module 100 includes that a wind scooper 50 and being fixed on described radiator 10 in order to absorb the radiator 10, of described electronic component heat is fixed on the radiator fan 90 on described wind scooper 50.
Referring to Fig. 1 and Fig. 2, described radiator 10 includes that a substrate 20, is fixed on the heat absorbing sheet 30 on described substrate 20 side and some radiating fins 40 being fixed on described substrate 20 opposite side.Described substrate 20 edge is convexly equipped with four fixed parts 21, and each fixed part 21 is equipped with a fixing hole 215.Some securing members 25 are inserted into described fixing hole 215 thus are fixed on a mainboard (not shown) by described radiator 10.Described substrate 20 wherein one end is additionally provided with two holes, location 22, and described wind scooper 50 is inserted in hole, described location 22.
Described heat absorbing sheet 30 is fixed on described substrate 20 side, and described heat absorbing sheet 30 is in order to absorb the heat of described electronic component generation and to pass to described substrate 20.Described radiating fin 40 is parallel to each other and is vertically connected on described substrate 20 opposite side, and described radiating fin 40 is in order to absorb the heat on described substrate 20.Further, described heat absorbing sheet 30 is typically also coated with one layer of heat-conducting silicone grease on electronic component contact surface so that the heat that described electronic component produces more efficiently is transmitted on described heat absorbing sheet 30.The material of described heat absorbing sheet 30 is metal material.In one embodiment, the material of described heat absorbing sheet 30 can be the alloy material such as copper alloy, aluminium alloy.
Described radiating fin 40 is vertically fixed on described substrate 20 opposite side, and described radiating fin 40 is the most almost parallel, and between form some air channels to facilitate air-flow to pass.Described substrate 20 passes to described radiating fin 40 after absorbing the heat of described heat absorbing sheet 30, can take away the heat of described radiating fin 40 when external air flow is through the air channel described radiating fin 40.
Described wind scooper 50 includes that a cover plate 60, two is vertically connected on the side plate 70, of described cover plate 60 both sides and is connected to the supporting plate 75 and of described side plate 70 one end and is connected to the leading-out portion 80 of described cover plate 60 and described biside plate 70 other end.
Described cover plate 60 can cover above described radiator 10.Being equipped with a clamping part 71 outside every side plate 70, described clamping part 71 includes that a pinch plate 711 and is opened in the grab 715 bottom described side plate 70, presses described pinch plate 711 and makes the elastic deformation of described side plate 70 drive described grab 715 to move.The most vertical bending bottom every side plate 70 and go out two fixed plates 72, be pasted with bottom each fixed plate 72 one can elastically-deformable flexure strip 73, described flexure strip 73 can elastic compression and play the effect of shock dropping.Wherein going back projection one locating dowel 74 bottom two fixed plates 72, described locating dowel 74 is inserted in hole, described location 22.
Described supporting plate 75, in order to fixing described radiator fan 90, is provided with a through hole 751 in the middle of described supporting plate 75, and described through hole 751 is in order to allow air-flow pass.Being equipped with a spacing hole 752 on junction between described supporting plate 75 and described biside plate 70 and described supporting plate 75, described radiator fan 90 is inserted in described spacing hole 752.Being collectively forming an air inlet 755 between described cover plate 60, described biside plate 70 and described supporting plate 75, described radiator fan 90 in order to blow to described air inlet 755 by air-flow.Described leading-out portion 80 offers an air outlet 81, and air-flow can discharge described wind scooper 50 from described air outlet 81.
Described radiator fan 90 is formed around the perforation 91 that some and described spacing hole 752 is corresponding, and some fixture (not shown) can be through described perforation 91 and insert in described spacing hole 752 thus be fixed on the supporting plate 75 of described wind scooper 50 by described radiator fan 90.In one embodiment, described radiator fan 90 is vortex flow fan, and air-flow can enter described radiator fan 90 from described through hole 751 and enter wind scooper 50 from described air inlet 755.
Referring to Fig. 3, during assembling, be placed into by described wind scooper 50 above described radiator 10, described cover plate 60 covers above described radiating fin 40, and described radiating fin 40 is housed between described biside plate 70.The locating dowel 74 of described side plate 70 is inserted in the hole, location 22 on described substrate 20.Press described two pinch plates 711 and make the elastic deformation of described side plate 70 so that described grab 715 is through described substrate 20, unclamp described pinch plate 711 and make described side plate 70 elastic recovery so that described grab 715 is snapped on described substrate 20, thus described wind scooper 50 is installed on described radiator 10.Described fixed plate 72 is close on described substrate 20, and described flexure strip 73 is squeezed elastic shrinkage and is housed between described fixed plate 72 and described substrate 20.
The perforation 91 of described radiator fan 90 being alignd with described spacing hole 752, described radiator fan 90 is fixed on described wind scooper 50 in described spacing hole 752 by described fixture through described perforation 91 inserting again.Now, described heat radiation module 100 is completed.Being placed on mainboard by described heat radiation module 100, the heat absorbing sheet 30 of described radiator 10 is close on electronic component, and described securing member 25 is through described fixing hole 215 and is inserted on mainboard thus is fixed on mainboard by described heat radiation module 100.
When described electronic component works, described heat radiation module 100 is started working, and described heat absorbing sheet 30 absorbs the heat of described electronic component generation and transfers heat to described radiating fin 40 by described substrate 20.Air-flow is blown into described wind scooper 50 by described radiator fan 90 from described air inlet 755, air-flow through the air channel described radiating fin 40 and take away described radiating fin 40 heat after discharge from described air outlet 81 thus realize the heat radiation to described electronic component.
Heat radiation module described in the utility model 100 by offering described clamping part 71 on described wind scooper 50, grab 715 elastic deformation of described clamping part 71 and be snapped on the substrate 20 of described radiator 10 thus realize the tool-free purpose that can dismount described heat radiation module 100 conveniently and efficiently.
Those skilled in the art will be appreciated that; above embodiment is intended merely to this utility model is described; and it is not used as to restriction of the present utility model; as long as within spirit of the present utility model, made above example suitably change and change all falls within the scope of this utility model is claimed.

Claims (10)

1. a heat radiation module, in order to an electronic component is dispelled the heat, including a radiator and a radiator fan, it is characterized in that: described heat radiation module also includes that one fixes, with described radiator fan, the wind scooper being connected, described wind scooper both sides are equipped with a clamping part, described clamping part includes that a grab, described radiator include that a substrate, described grab can be snapped on described substrate thus be fixed on described radiator by described wind scooper.
Dispel the heat module the most as claimed in claim 1, it is characterised in that: described wind scooper includes that a cover plate and two is vertically connected on the side plate of described cover plate both sides, and described clamping part is opened on described side plate.
Dispel the heat module the most as claimed in claim 2, it is characterised in that: described clamping part includes that a pinch plate, described grab are opened in described side plate bottom, and described pinch plate is pressed and drives described grab to move so that described side plate elastic deformation.
Dispel the heat module the most as claimed in claim 3, it is characterised in that: each side plate bottom the most vertically bends two fixed plates, be pasted with bottom each fixed plate one can elastically-deformable flexure strip, described flexure strip can play the effect of shock dropping.
Dispel the heat module the most as claimed in claim 4, it is characterized in that: be wherein also convexly equipped with a locating dowel bottom two fixed plates, described substrate is provided with hole, some location, and described locating dowel is inserted in hole, described location thus is alignd with described radiator by described wind scooper.
Dispel the heat module the most as claimed in claim 2, it is characterised in that: described wind scooper also includes a supporting plate being connected with described biside plate, and described radiator fan can be fixed on described supporting plate.
Dispel the heat module the most as claimed in claim 6, it is characterized in that: described supporting plate is equipped with some spacing holes on described side plate junction and described supporting plate, described radiator fan is provided with the perforation that some and described spacing hole is corresponding, and some fixtures can be through described perforation and insert in described spacing hole thus be fixed on described supporting plate by described radiator fan.
Dispel the heat module the most as claimed in claim 7, it is characterised in that: described cover plate, described biside plate and described supporting plate are collectively forming an air inlet, and air-flow can enter described wind scooper from described air inlet.
Dispel the heat module the most as claimed in claim 2, it is characterised in that: described wind scooper also includes a leading-out portion being connected with described cover plate and described side plate, and described leading-out portion is provided with an air outlet, and air-flow can be from described air outlet discharges described wind scooper.
Dispel the heat module the most as claimed in claim 1, it is characterised in that: described radiator also includes a heat absorbing sheet being fixed on described substrate side, and described heat absorbing sheet can be close on described electronic component absorb the heat that described electronic component produces.
CN201620304407.8U 2016-04-13 2016-04-13 Radiating module Active CN205623048U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201620304407.8U CN205623048U (en) 2016-04-13 2016-04-13 Radiating module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201620304407.8U CN205623048U (en) 2016-04-13 2016-04-13 Radiating module

Publications (1)

Publication Number Publication Date
CN205623048U true CN205623048U (en) 2016-10-05

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Family Applications (1)

Application Number Title Priority Date Filing Date
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108966585A (en) * 2017-05-26 2018-12-07 富瑞精密组件(昆山)有限公司 The heat dissipating method of radiator and heating module
CN110121251A (en) * 2018-02-07 2019-08-13 鸿富锦精密工业(武汉)有限公司 Wind scooper and the electronic device for using the wind scooper

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108966585A (en) * 2017-05-26 2018-12-07 富瑞精密组件(昆山)有限公司 The heat dissipating method of radiator and heating module
CN110121251A (en) * 2018-02-07 2019-08-13 鸿富锦精密工业(武汉)有限公司 Wind scooper and the electronic device for using the wind scooper

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