US20120298329A1 - Heat sink device and air flow adjusting frame for the same - Google Patents
Heat sink device and air flow adjusting frame for the same Download PDFInfo
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- US20120298329A1 US20120298329A1 US13/221,987 US201113221987A US2012298329A1 US 20120298329 A1 US20120298329 A1 US 20120298329A1 US 201113221987 A US201113221987 A US 201113221987A US 2012298329 A1 US2012298329 A1 US 2012298329A1
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- air flow
- fixing
- fan
- adjusting frame
- fixing plate
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Definitions
- the disclosure relates to a heat sink device and an air flow adjusting frame thereof, and more particularly to a heat sink device for computer and an air flow adjusting frame thereof.
- Electronic devices is not only heading to the direction of being light in weight and small in size, but also to the direction of having the finest functionality at the same time.
- the volume of the integrated circuit inside the computers is miniaturized.
- the integrated circuit today is able to contain multiple times more of computing elements than the past integrated circuit with the same size.
- the integrated circuit contains more computing elements inside, more thermal energy will be generated during the operation.
- the heat sink modules for removing the heat generated by the computing elements are important.
- the heat sink modules on display cards are heat dissipation fins made of metal having high thermal conductivity.
- the heat dissipation fins are disposed on a computing chip on the display card, to absorb the heat generated by the computing chip.
- a fan is further installed on the heat dissipation fins for fan generating forced convection to dissipate the heat of the heat dissipation fin.
- the fan is generally stacked on the heat dissipation fins, and an air exhaust direction of the fan is always vertical to a circuit board of the display card.
- an air exhaust direction of the fan is always vertical to a circuit board of the display card.
- the disclosure is a heat sink device and an air flow adjusting frame thereof for preventing the problem that when a conventional fan blows, a turbulent flow is easily generated between the fan and the circuit board resulting in decrease of heat dissipation ability and increase of the load of the fan.
- An embodiment discloses a heat sink device, which comprises a heat dissipation fin, an air flow adjusting frame, and a fan.
- the air flow adjusting frame comprises a first fixing plate and a second fixing plate.
- the first fixing plate is fixed to the heat dissipation fin, and the second fixing plate is pivoted to the first fixing plate.
- the fan is fixed to the second fixing plate, and an air flow angle of the fan is adjusted through the air flow adjusting frame.
- the air flow adjusting frame for connecting a heat dissipation fin with a fan to change an air flow angle of fan relative to the heat dissipation fin.
- the air flow adjusting frame comprises a first fixing plate and a second fixing plate.
- the first fixing plate is fixed to the heat dissipation fin, and the second fixing plate is pivoted to the first fixing plate and is used for fixing the fan.
- the fan is enabled to pivot relative to the heat dissipation fin due to the air flow adjusting frame, so as to adjust the air flow angle of the fan. Consequently, the vertical interference of the air flow generated by the fan and the circuit board can be prevented, and the turbulent flow between the fan and the circuit board may also be reduced. Also, the heat dissipation ability of the heat sink is enhanced with the work load of the fan being reduced.
- FIG. 1 is a schematic structural view of a heat sink device according to an embodiment of the disclosure
- FIG. 2 is a schematic exploded structural view of a heat sink device according to an embodiment of the disclosure
- FIG. 3 is a schematic exploded structural view of an air flow adjusting frame according to an embodiment of the disclosure.
- FIG. 4 is a schematic view of an air flow of a heat sink device according to an embodiment of the disclosure.
- FIG. 5 is a schematic exploded structural view of an air flow adjusting frame according to another embodiment of the disclosure.
- FIG. 6 is a schematic exploded structural view of an air flow adjusting frame according to another embodiment of the disclosure.
- FIG. 7 is a schematic exploded structural view of an air flow adjusting frame according to another embodiment of the disclosure.
- FIG. 8 is a schematic structural view of a heat sink device according to anther embodiment of the disclosure.
- FIG. 1 is a schematic structural view of a heat sink device according to an embodiment of the disclosure
- FIG. 2 is a schematic exploded structural view of a heat sink device according to an embodiment of the disclosure.
- the heat sink device 10 of this embodiment is used to dissipate heat generated from an electronic device 20 .
- the electronic device 20 is, but not limited to, a graphics card used inside a computer.
- the electronic device 20 may also be a main board inside the computer.
- the electronic device 20 comprises a circuit board 22 and a heat source 21 located on the circuit board 22 .
- the heat source 21 may be a computing chip, for example, a central processing unit (CPU) or graphics chip.
- the heat sink device 10 of this embodiment comprises a heat dissipation fin 200 , two air flow adjusting frames 100 and a fan 300 .
- the heat dissipation fin 200 has a first side 201 facing the heat source 21 and a second side 202 opposite to the first side 201 .
- the fan 300 is disposed on the second side 202 of the heat dissipation fin 200 , and the fan 300 has an air outlet 310 and an air inlet 320 opposite to the air outlet 310 .
- the air outlet 310 faces the heat dissipation fin 200
- the air inlet 320 is opposite to the heat dissipation fin 200 .
- the position of the air outlet 310 and the air inlet 320 relative to the heat dissipation fin 200 is not intended to limit the disclosure.
- the air outlet 310 may be opposite to the heat dissipation fin 200
- the air inlet 320 may face the heat dissipation fin 200 .
- the air flow adjusting frame 100 of this embodiment is fixed to the heat dissipation fin 200 and the fan 300 respectively for changing an air flow angle of the fan 300 relative to the heat dissipation fin 200 .
- the fan 300 may be pivoted relative to the heat dissipation fin 200 due to the air flow adjusting frame 100 , so as to adjust an angle of the air outlet 310 of the fan 300 to the heat dissipation fin 200 .
- the pivoting direction of the fan 300 relative to the heat sink fin 200 is parallel to the long side of the electronic device 20 , but above pivoting direction of the fan 300 is not intended to limit this disclosure. People skilled in the art can adjust the pivoting direction of the fan 300 relative to the heat dissipation fin 200 according to actual requirements.
- the pivoting direction of the fan 300 relative to the heat dissipation fin 200 may be parallel to the short side of the electronic device 20 , as shown in FIG. 8 .
- the second side 202 of the heat dissipation fin 200 has a cone-like protruding structure, and the central portion of the second side 202 is higher than two opposite ends of the second side 202 .
- the heat dissipation fin 200 is connected to the fan 300 through two air flow adjusting frames 100 , but the number of the air flow adjusting frame 100 is not intended to limit the disclosure.
- the heat sink device 10 may also have only one air flow adjusting frame 100 to connect the heat dissipation fin 200 with the fan 300 .
- FIG. 3 is a schematic exploded structural view of an air flow adjusting frame according to an embodiment of the disclosure.
- the air flow adjusting frame 100 of this embodiment comprises a first fixing plate 110 and a second fixing plate 120 .
- the air flow adjusting frame 100 further comprises a pivot 140 and a holding plate 130 .
- the first fixing plate 110 and the second fixing plate 120 are pivoted to each other through the pivot 140 .
- the first fixing plate 110 is fixed to the heat dissipation fin 200 , and the second fixing plate 120 and the holding plate 130 are combined together.
- the pivot 140 may be a damping pivot, so that the second fixing plate 120 is able to pivot relative to the first fixing plate 110 to a position desirable for a user and remain in such position.
- the first fixing plate 110 of this embodiment has two fixing holes 112 , and the first fixing plate 110 is fastened on the heat dissipation fin 200 through two locking members 111 penetrating the two fixing holes 112 .
- the fixing hole 112 may be, but not limited to, a screw hole
- the locking member 111 may be, but not limited to, a screw.
- the holding plate 130 comprises a body 1301 and two fixing portions 134 located at two opposite ends of the body 1301 .
- the body 1301 has two fixing holes 133 thereon, and the second fixing plate 120 has two fixing holes 122 .
- holding plate 130 and the second fixing plate 120 are combined together through two locking members 121 penetrating the fixing hole 133 and the fixing hole 122 .
- the fixing hole 122 and the fixing holes 133 may be, but not limited to, a through hole, and the locking member 121 may be, but not limited to, a rivet.
- the two fixing portions 134 of the holding plate 130 each have a fixing hole 132 , and the air flow adjusting frame 100 is fastened on the fan 300 through the two locking members 131 penetrating the fixing hole 132 so that the fan 300 and the air flow adjusting frame 100 are combined together.
- the distance between the two fixing portions 134 of the holding plate 130 is designed according to the size of the fan 300 .
- a holding plate 130 with greater interval between the two fixing portions 134 will be used, when the fan 300 is big.
- another holding plate 130 with smaller interval between the two fixing portions 134 will be used, when the fan 300 is small. That is, the holding plates 130 having different intervals between the two fixing portions 134 may be prepared to cooperate with fans 300 of various sizes.
- the above air flow adjusting frame 100 having the holding plate 130 is not intended to limit the disclosure.
- the air flow adjusting frame 100 does not have any holding plate 130 , and the second fixing plate 120 are directly combined to the fan 300 .
- FIG. 4 is a schematic view of an air flow of a heat sink device according to an embodiment of the disclosure.
- the circuit board 22 is horizontally disposed.
- the fan 300 of this embodiment is able to pivot relative to the heat dissipation fin 200 due to the air flow adjusting frame 100 , so that an angle ⁇ is formed between a side face of the fan 300 having the air outlet 310 and a horizontal plane.
- the angle ⁇ is an acute angle.
- an acute angle is formed between the side of the fan 300 having the air outlet 310 and the circuit board 22 , so that an incident angle from the air flow path, generated by the fan 300 , to the circuit board 22 is an acute angle rather than a right angle.
- the pivoting angle of the fan 300 relative to the heat dissipation fin 200 may be adjusted according to various heat sink conditions, so as to enable the heat sink device 100 to achieve the optimal heat dissipation ability.
- the heat-dissipation structure 10 of this embodiment further has a heat conducting plate 210 and a plurality of heat conducting pipes 220 , such as heat pipes.
- the heat conducting plate 210 is thermally contacted with the heat source 21 , and the heat conducting pipe 220 is connected to the heat conducting plate 210 and the heat dissipation fin 200 .
- the heat conducting plate 210 absorbs the heat from the heat source 21 and transfers the heat to the heat dissipation fin 200 through the heat conducting pipes 220 .
- the heat dissipation fin 200 may also be directly formed on the heat conducting plate 210 .
- FIG. 5 is a schematic exploded structural view of an air flow adjusting frame according to another embodiment of the disclosure. As this embodiment has the similar structure of the embodiment in FIG. 3 , the same parts will not be repeated herein.
- the holding plate 130 comprises a body 1301 and two fixing portions 134 located at two opposite ends of the body 1301 .
- the fixing portions 134 and the body 1301 are independent members.
- the body 1301 has two slots 137 , and each fixing portion 134 further has a fixing hole 1341 corresponding to one slot 137 .
- the fixing portion 134 is fastened to the body 1301 through a locking member 135 penetrating the slot 137 and the fixing hole 1341 .
- the slot 137 is an elongated slot, and the position of the fixing portion 134 relative to the body 1301 may be changed with the displacement of fixing portion 134 along the slot 137 . Therefore, by changing the positions of the two fixing portion 134 fixed to the body 1301 to adjust the distance between the two fixing portions 134 , the distance between the two fixing portions 134 may be adjusted so that the holding plate 130 can cooperate with various sizes of fans 300 .
- FIG. 6 is a schematic exploded structural view of an air flow adjusting frame according to another embodiment of the present disclosure. As this embodiment has the similar structure of the embodiment in FIG. 3 , the same parts will not be repeated herein.
- the air flow adjusting frame 100 of this embodiment comprises a first fixing plate 110 and a second fixing plate 120 .
- the air flow adjusting frame 100 further comprises a pivot 140 and a holding plate 130 .
- the holding plate 130 comprises a body 1301 and two fixing portions 134 located at two opposite ends of the body 1301 .
- the body 1301 has two slots 138 , and two fixing holes 122 of the second fixing plate 120 correspond to the slots 138 .
- the holding plate 130 is fastened on the second fixing plate 120 through the locking member 121 penetrating the slot 138 and the fixing hole 122 .
- the slot 138 is an elongated slot in the horizontal direction, and the position of second fixing plate 120 relative to the slot 138 may be changed with the displacement of the holding plate 130 .
- the displacement of the fan 300 relative to the heat dissipation fin 200 in the horizontal direction is adjusted to achieve the optimal heat dissipation effect of the heat sink device 10 .
- FIG. 7 is a schematic exploded structural view of an air flow adjusting frame according to another embodiment of the disclosure. As this embodiment has the similar structure of the embodiment in FIG. 3 , the same parts will not be repeated herein.
- the air flow adjusting frame 100 of this embodiment comprises a first fixing plate 110 and a second fixing plate 120 .
- the air flow adjusting frame 100 further comprises a pivot 140 and a holding plate 130 .
- the holding plate 130 comprises a body 1301 and two fixing portions 134 located at two opposite ends of the body 1301 .
- the body 1301 has two slots 139 , and the two fixing holes 122 of the second fixing plate 120 correspond to the slots 139 .
- the holding plate 130 is fastened to the second fixing plate 120 by the locking members 121 penetrating the slots 139 and the fixing holes 122 .
- the slot 139 is an elongated slot in the vertical direction, and the position of the second fixing plate 120 relative to the holding plate 130 may be changed with the displacement of the second fixing plate 120 along the slot 139 . Therefore, by changing the relative position of the second fixing plate 120 and the holding plate 130 , the displacement of the fan 300 relative to the heat dissipation fin 200 in the vertical direction is adjusted achieve the optimal heat dissipation effect of the heat sink device 10 .
- the fan is enabled to pivot relative to the heat dissipation fin to adjust the air flow angle of the fan due to the air flow adjusting frame.
- the problems including the air flow path generated by the fan being perpendicular to the circuit board, the collision of the air flow generated by the fan and the air flow rebounded off the circuit board, and the turbulent flow generated between the fan and the circuit board may be prevented. Therefore, due to the design of the air flow adjusting frame of above embodiments, the turbulent flow between the fan and the circuit board can be reduced, thereby the heat dissipation effect of the heat sink device is improved and the work load of the fan is reduced.
Abstract
An air flow adjusting frame for a heat sink device which includes a first fixing plate and a second fixing plate is disclosed. The first fixing plate is fixed to a heat dissipation fin with the second fixing plate pivoted to the first fixing plate. Besides, the second fixing plate is for being fixed to a fan. An air flow angle of the fan is adjusted through the air flow adjusting frame.
Description
- This non-provisional application claims priority under 35 U.S.C. §119(a) on Patent Application No(s). 100209674 filed in Taiwan, R.O.C. on May 27, 2011, the entire contents of which are hereby incorporated by reference.
- 1. Technical Field
- The disclosure relates to a heat sink device and an air flow adjusting frame thereof, and more particularly to a heat sink device for computer and an air flow adjusting frame thereof.
- 2. Related Art
- In recent years, with the advanced technology, the method of developing and manufacturing electronic devices is well enhanced. Electronic devices is not only heading to the direction of being light in weight and small in size, but also to the direction of having the finest functionality at the same time.
- Using computers as an example, with the advanced technology of semiconductors, the volume of the integrated circuit inside the computers is miniaturized. For the purpose of obtaining an integrated circuit capable of dealing with more data, the integrated circuit today is able to contain multiple times more of computing elements than the past integrated circuit with the same size. When the integrated circuit contains more computing elements inside, more thermal energy will be generated during the operation.
- Thus, the heat sink modules for removing the heat generated by the computing elements are important. Taking the heat sink modules on display cards as an example, most of the heat sink modules are heat dissipation fins made of metal having high thermal conductivity. The heat dissipation fins are disposed on a computing chip on the display card, to absorb the heat generated by the computing chip. In order to improve the heat dissipation ability of the heat sink module, a fan is further installed on the heat dissipation fins for fan generating forced convection to dissipate the heat of the heat dissipation fin.
- However, the fan is generally stacked on the heat dissipation fins, and an air exhaust direction of the fan is always vertical to a circuit board of the display card. Thus, when the air flow generated by the fan blows to the circuit board, the air flow is rebounded back due to the obstruction of the circuit board. The rebounded air flow and the air flow generated by the fan interfere with each other, so that a turbulent flow is generated between the fan and the circuit board. Thus, the heat dissipation ability of the heat sink module is greatly reduced and the operation load of the fan increases. With the increasing operation load, the service life of the fan is shortened.
- The disclosure is a heat sink device and an air flow adjusting frame thereof for preventing the problem that when a conventional fan blows, a turbulent flow is easily generated between the fan and the circuit board resulting in decrease of heat dissipation ability and increase of the load of the fan.
- An embodiment discloses a heat sink device, which comprises a heat dissipation fin, an air flow adjusting frame, and a fan. The air flow adjusting frame comprises a first fixing plate and a second fixing plate. The first fixing plate is fixed to the heat dissipation fin, and the second fixing plate is pivoted to the first fixing plate. The fan is fixed to the second fixing plate, and an air flow angle of the fan is adjusted through the air flow adjusting frame.
- Another embodiment discloses an air flow adjusting frame for connecting a heat dissipation fin with a fan to change an air flow angle of fan relative to the heat dissipation fin. The air flow adjusting frame comprises a first fixing plate and a second fixing plate. The first fixing plate is fixed to the heat dissipation fin, and the second fixing plate is pivoted to the first fixing plate and is used for fixing the fan.
- According to the above heat sink device and the air flow adjusting frame for the same, the fan is enabled to pivot relative to the heat dissipation fin due to the air flow adjusting frame, so as to adjust the air flow angle of the fan. Consequently, the vertical interference of the air flow generated by the fan and the circuit board can be prevented, and the turbulent flow between the fan and the circuit board may also be reduced. Also, the heat dissipation ability of the heat sink is enhanced with the work load of the fan being reduced.
- The disclosure will become more fully understood from the detailed description given herein below for illustration only, and thus are not limitative of the disclosure, and wherein:
-
FIG. 1 is a schematic structural view of a heat sink device according to an embodiment of the disclosure; -
FIG. 2 is a schematic exploded structural view of a heat sink device according to an embodiment of the disclosure; -
FIG. 3 is a schematic exploded structural view of an air flow adjusting frame according to an embodiment of the disclosure; -
FIG. 4 is a schematic view of an air flow of a heat sink device according to an embodiment of the disclosure; -
FIG. 5 is a schematic exploded structural view of an air flow adjusting frame according to another embodiment of the disclosure; -
FIG. 6 is a schematic exploded structural view of an air flow adjusting frame according to another embodiment of the disclosure; -
FIG. 7 is a schematic exploded structural view of an air flow adjusting frame according to another embodiment of the disclosure; and -
FIG. 8 is a schematic structural view of a heat sink device according to anther embodiment of the disclosure. -
FIG. 1 is a schematic structural view of a heat sink device according to an embodiment of the disclosure, andFIG. 2 is a schematic exploded structural view of a heat sink device according to an embodiment of the disclosure. - As shown in
FIG. 1 andFIG. 2 , theheat sink device 10 of this embodiment is used to dissipate heat generated from anelectronic device 20. Theelectronic device 20 is, but not limited to, a graphics card used inside a computer. For example, theelectronic device 20 may also be a main board inside the computer. Theelectronic device 20 comprises acircuit board 22 and aheat source 21 located on thecircuit board 22. Theheat source 21 may be a computing chip, for example, a central processing unit (CPU) or graphics chip. - The
heat sink device 10 of this embodiment comprises aheat dissipation fin 200, two airflow adjusting frames 100 and afan 300. Theheat dissipation fin 200 has afirst side 201 facing theheat source 21 and asecond side 202 opposite to thefirst side 201. Thefan 300 is disposed on thesecond side 202 of theheat dissipation fin 200, and thefan 300 has anair outlet 310 and anair inlet 320 opposite to theair outlet 310. In this embodiment, theair outlet 310 faces theheat dissipation fin 200, and theair inlet 320 is opposite to theheat dissipation fin 200. It should be noted that, the position of theair outlet 310 and theair inlet 320 relative to theheat dissipation fin 200 is not intended to limit the disclosure. In some embodiments, theair outlet 310 may be opposite to theheat dissipation fin 200, and theair inlet 320 may face theheat dissipation fin 200. - The air
flow adjusting frame 100 of this embodiment is fixed to theheat dissipation fin 200 and thefan 300 respectively for changing an air flow angle of thefan 300 relative to theheat dissipation fin 200. Thefan 300 may be pivoted relative to the heat dissipation fin 200 due to the airflow adjusting frame 100, so as to adjust an angle of theair outlet 310 of thefan 300 to theheat dissipation fin 200. Moreover, the pivoting direction of thefan 300 relative to theheat sink fin 200 is parallel to the long side of theelectronic device 20, but above pivoting direction of thefan 300 is not intended to limit this disclosure. People skilled in the art can adjust the pivoting direction of thefan 300 relative to theheat dissipation fin 200 according to actual requirements. For example, in embodiments, the pivoting direction of thefan 300 relative to theheat dissipation fin 200 may be parallel to the short side of theelectronic device 20, as shown inFIG. 8 . - The
second side 202 of theheat dissipation fin 200 has a cone-like protruding structure, and the central portion of thesecond side 202 is higher than two opposite ends of thesecond side 202. Thus, when thefan 300 pivots an angle relative to theheat dissipation fin 200, the collision and interference of thefan 300 and theheat dissipation fin 200 are avoided. - It should be noted that, in the
heat sink device 10 of this embodiment, theheat dissipation fin 200 is connected to thefan 300 through two airflow adjusting frames 100, but the number of the airflow adjusting frame 100 is not intended to limit the disclosure. In another embodiment of the disclosure, theheat sink device 10 may also have only one airflow adjusting frame 100 to connect theheat dissipation fin 200 with thefan 300. -
FIG. 3 is a schematic exploded structural view of an air flow adjusting frame according to an embodiment of the disclosure. - As shown in
FIG. 3 andFIG. 2 , the airflow adjusting frame 100 of this embodiment comprises afirst fixing plate 110 and asecond fixing plate 120. The airflow adjusting frame 100 further comprises apivot 140 and a holdingplate 130. Thefirst fixing plate 110 and thesecond fixing plate 120 are pivoted to each other through thepivot 140. Thefirst fixing plate 110 is fixed to theheat dissipation fin 200, and thesecond fixing plate 120 and the holdingplate 130 are combined together. Thepivot 140 may be a damping pivot, so that thesecond fixing plate 120 is able to pivot relative to thefirst fixing plate 110 to a position desirable for a user and remain in such position. - The
first fixing plate 110 of this embodiment has two fixingholes 112, and thefirst fixing plate 110 is fastened on theheat dissipation fin 200 through two lockingmembers 111 penetrating the two fixingholes 112. The fixinghole 112 may be, but not limited to, a screw hole, and the lockingmember 111 may be, but not limited to, a screw. - The holding
plate 130 comprises abody 1301 and two fixingportions 134 located at two opposite ends of thebody 1301. Thebody 1301 has two fixingholes 133 thereon, and thesecond fixing plate 120 has two fixingholes 122. In the airflow adjusting frame 100, holdingplate 130 and thesecond fixing plate 120 are combined together through two lockingmembers 121 penetrating the fixinghole 133 and the fixinghole 122. The fixinghole 122 and the fixingholes 133 may be, but not limited to, a through hole, and the lockingmember 121 may be, but not limited to, a rivet. The two fixingportions 134 of the holdingplate 130 each have a fixinghole 132, and the airflow adjusting frame 100 is fastened on thefan 300 through the two lockingmembers 131 penetrating the fixinghole 132 so that thefan 300 and the airflow adjusting frame 100 are combined together. - The distance between the two fixing
portions 134 of the holdingplate 130 is designed according to the size of thefan 300. A holdingplate 130 with greater interval between the two fixingportions 134 will be used, when thefan 300 is big. On the other hand, another holdingplate 130 with smaller interval between the two fixingportions 134 will be used, when thefan 300 is small. That is, the holdingplates 130 having different intervals between the two fixingportions 134 may be prepared to cooperate withfans 300 of various sizes. - It should be noted that, the above air
flow adjusting frame 100 having the holdingplate 130 is not intended to limit the disclosure. In some embodiments, the airflow adjusting frame 100 does not have any holdingplate 130, and thesecond fixing plate 120 are directly combined to thefan 300. -
FIG. 4 is a schematic view of an air flow of a heat sink device according to an embodiment of the disclosure. As shown inFIG. 4 , in this embodiment, thecircuit board 22 is horizontally disposed. Thefan 300 of this embodiment is able to pivot relative to theheat dissipation fin 200 due to the airflow adjusting frame 100, so that an angle θ is formed between a side face of thefan 300 having theair outlet 310 and a horizontal plane. Furthermore, the angle θ is an acute angle. In other words, an acute angle is formed between the side of thefan 300 having theair outlet 310 and thecircuit board 22, so that an incident angle from the air flow path, generated by thefan 300, to thecircuit board 22 is an acute angle rather than a right angle. When the air flow blows from theair outlet 310 to theheat source 21 and hits thecircuit board 22, the air flow rebounds off thecircuit board 22 at an acute emergent angle because of the acute incident angle from the air flow path to thecircuit board 22. Thus, the interference between the air flow rebounded by thecircuit board 22 and the air flow generated by thefan 300 is avoided. The turbulent flow between thefan 300 and thecircuit board 22 is then reduced, thereby the heat dissipation ability is improved. Therefore, according to theheat sink device 100 of this embodiment, the pivoting angle of thefan 300 relative to theheat dissipation fin 200 may be adjusted according to various heat sink conditions, so as to enable theheat sink device 100 to achieve the optimal heat dissipation ability. - The heat-
dissipation structure 10 of this embodiment further has aheat conducting plate 210 and a plurality ofheat conducting pipes 220, such as heat pipes. Theheat conducting plate 210 is thermally contacted with theheat source 21, and theheat conducting pipe 220 is connected to theheat conducting plate 210 and theheat dissipation fin 200. Theheat conducting plate 210 absorbs the heat from theheat source 21 and transfers the heat to theheat dissipation fin 200 through theheat conducting pipes 220. It should be noted that, in some embodiments, theheat dissipation fin 200 may also be directly formed on theheat conducting plate 210. -
FIG. 5 is a schematic exploded structural view of an air flow adjusting frame according to another embodiment of the disclosure. As this embodiment has the similar structure of the embodiment inFIG. 3 , the same parts will not be repeated herein. - As shown in
FIG. 5 together withFIG. 2 , the holdingplate 130 comprises abody 1301 and two fixingportions 134 located at two opposite ends of thebody 1301. The fixingportions 134 and thebody 1301 are independent members. Thebody 1301 has twoslots 137, and each fixingportion 134 further has afixing hole 1341 corresponding to oneslot 137. The fixingportion 134 is fastened to thebody 1301 through a lockingmember 135 penetrating theslot 137 and thefixing hole 1341. Furthermore, theslot 137 is an elongated slot, and the position of the fixingportion 134 relative to thebody 1301 may be changed with the displacement of fixingportion 134 along theslot 137. Therefore, by changing the positions of the two fixingportion 134 fixed to thebody 1301 to adjust the distance between the two fixingportions 134, the distance between the two fixingportions 134 may be adjusted so that the holdingplate 130 can cooperate with various sizes offans 300. -
FIG. 6 is a schematic exploded structural view of an air flow adjusting frame according to another embodiment of the present disclosure. As this embodiment has the similar structure of the embodiment inFIG. 3 , the same parts will not be repeated herein. - As shown in
FIG. 6 andFIG. 2 , the airflow adjusting frame 100 of this embodiment comprises afirst fixing plate 110 and asecond fixing plate 120. The airflow adjusting frame 100 further comprises apivot 140 and a holdingplate 130. - The holding
plate 130 comprises abody 1301 and two fixingportions 134 located at two opposite ends of thebody 1301. Thebody 1301 has twoslots 138, and two fixingholes 122 of thesecond fixing plate 120 correspond to theslots 138. The holdingplate 130 is fastened on thesecond fixing plate 120 through the lockingmember 121 penetrating theslot 138 and the fixinghole 122. Furthermore, theslot 138 is an elongated slot in the horizontal direction, and the position ofsecond fixing plate 120 relative to theslot 138 may be changed with the displacement of the holdingplate 130. Therefore, by changing the relative position of thesecond fixing plate 120 with respect to the holdingplate 130, the displacement of thefan 300 relative to theheat dissipation fin 200 in the horizontal direction is adjusted to achieve the optimal heat dissipation effect of theheat sink device 10. -
FIG. 7 is a schematic exploded structural view of an air flow adjusting frame according to another embodiment of the disclosure. As this embodiment has the similar structure of the embodiment inFIG. 3 , the same parts will not be repeated herein. - As shown in
FIG. 7 andFIG. 2 , the airflow adjusting frame 100 of this embodiment comprises afirst fixing plate 110 and asecond fixing plate 120. The airflow adjusting frame 100 further comprises apivot 140 and a holdingplate 130. - The holding
plate 130 comprises abody 1301 and two fixingportions 134 located at two opposite ends of thebody 1301. Thebody 1301 has twoslots 139, and the two fixingholes 122 of thesecond fixing plate 120 correspond to theslots 139. The holdingplate 130 is fastened to thesecond fixing plate 120 by the lockingmembers 121 penetrating theslots 139 and the fixing holes 122. Furthermore, theslot 139 is an elongated slot in the vertical direction, and the position of thesecond fixing plate 120 relative to the holdingplate 130 may be changed with the displacement of thesecond fixing plate 120 along theslot 139. Therefore, by changing the relative position of thesecond fixing plate 120 and the holdingplate 130, the displacement of thefan 300 relative to theheat dissipation fin 200 in the vertical direction is adjusted achieve the optimal heat dissipation effect of theheat sink device 10. - According to the heat sink device and the air flow adjusting frame for the heat sink device of above embodiments, the fan is enabled to pivot relative to the heat dissipation fin to adjust the air flow angle of the fan due to the air flow adjusting frame. Thus, the problems including the air flow path generated by the fan being perpendicular to the circuit board, the collision of the air flow generated by the fan and the air flow rebounded off the circuit board, and the turbulent flow generated between the fan and the circuit board may be prevented. Therefore, due to the design of the air flow adjusting frame of above embodiments, the turbulent flow between the fan and the circuit board can be reduced, thereby the heat dissipation effect of the heat sink device is improved and the work load of the fan is reduced.
Claims (10)
1. A heat sink device, comprising:
a heat dissipation fin;
an air flow adjusting frame, comprising:
a first fixing plate, fixed to the heat dissipation fin; and
a second fixing plate, pivoted to the first fixing plate; and
a fan, fixed to the second fixing plate, wherein an air flow angle of the fan is adjusted through the air flow adjusting frame.
2. The heat sink device according to claim 1 , wherein the air flow adjusting frame further comprises a holding plate having a body and at least one fixing portion, wherein the fixing portion is disposed on body, the body and the second fixing plate are combined together, and the fan is fixed to the fixing portion.
3. The heat sink device according to claim 2 , wherein the air flow adjusting frame further comprises two locking members, the number of the at least one fixing portion is two, the body has two slots, the fixing portions each have a fixing hole corresponding to one of the slots, each of the locking members penetrates the corresponding slot and the corresponding fixing hole, and a position of each of the fixing portions relative to the body is changed along the corresponding slot.
4. The heat sink device according to claim 2 , wherein the air flow adjusting frame further comprises at least one locking member, the body further has at least one slot, the second fixing plate has at least one fixing hole, the locking member penetrates the slot and the fixing hole, and a position of the second fixing plate relative to the body is changed along the slot.
5. The heat sink device according to claim 1 , wherein the air flow adjusting frame further comprises a damping pivot, and the first fixing plate and the second fixing plate are pivoted to each other through the damping pivot.
6. An air flow adjusting frame, for connecting a heat dissipation fin and a fan for changing an air flow angle of the fan to the heat dissipation fin, and the air flow adjusting frame comprising:
a first fixing plate for being fixed to the heat dissipation fin; and
a second fixing plate, pivoted to the first fixing plate, and for fixing the fan.
7. The air flow adjusting frame according to claim 6 , further comprising a holding plate, wherein the holding plate has a body and at least one fixing portion, the fixing portion is disposed on the body, the body and the second fixing plate are combined together, and the fan is fixed to the fixing portion.
8. The air flow adjusting frame according to claim 7 , wherein the number of the at least one fixing portion is two, the body has two slots, the two fixing portions each have a fixing hole corresponding to one of the slots, each of the locking members penetrates the corresponding slot and the corresponding fixing hole, and a position of each of the fixing portions relative to the body is changed along the corresponding slot.
9. The air flow adjusting frame according to claim 7 , further comprising at least one locking member, wherein the body further has at least one slot, the second fixing plate has at least one fixing hole, the locking member penetrates the slot and the fixing hole, and a position of the second fixing plate relative to the body is changed along the slot.
10. The air flow adjusting frame according to claim 6 , further comprising a damping pivot, and the first fixing plate and the second fixing plate pivoted to each other through the damping pivot.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW100209674U TWM417595U (en) | 2011-05-27 | 2011-05-27 | Heat dissipating device and airflow regulating rack |
TW100209674 | 2011-05-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
US20120298329A1 true US20120298329A1 (en) | 2012-11-29 |
Family
ID=45522714
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/221,987 Abandoned US20120298329A1 (en) | 2011-05-27 | 2011-08-31 | Heat sink device and air flow adjusting frame for the same |
Country Status (4)
Country | Link |
---|---|
US (1) | US20120298329A1 (en) |
JP (1) | JP3172184U (en) |
CN (1) | CN202133951U (en) |
TW (1) | TWM417595U (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014126249A (en) * | 2012-12-26 | 2014-07-07 | Furukawa Electric Co Ltd:The | Heat sink |
CN106155192A (en) * | 2015-04-14 | 2016-11-23 | 鸿富锦精密工业(武汉)有限公司 | Computer |
JP6391749B2 (en) * | 2017-04-07 | 2018-09-19 | 古河電気工業株式会社 | heatsink |
CN109302827A (en) * | 2017-07-25 | 2019-02-01 | 鸿富锦精密工业(武汉)有限公司 | Heat radiation module and the electronic device for using the heat radiation module |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080041561A1 (en) * | 2006-08-18 | 2008-02-21 | Foxconn Technology Co., Ltd. | Heat dissipation device |
US7580259B2 (en) * | 2005-06-24 | 2009-08-25 | Micro-Star Int'l Co., Ltd. | Heat dissipation device |
US7701708B2 (en) * | 2007-02-08 | 2010-04-20 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Heat dissipation assembly |
US20110100600A1 (en) * | 2009-11-05 | 2011-05-05 | Hon Fu Jin Precision Industry(Shenzhen) Co., Ltd. | Heat dissipation device |
-
2011
- 2011-05-27 TW TW100209674U patent/TWM417595U/en not_active IP Right Cessation
- 2011-07-22 CN CN2011202701012U patent/CN202133951U/en not_active Expired - Lifetime
- 2011-08-31 US US13/221,987 patent/US20120298329A1/en not_active Abandoned
- 2011-09-26 JP JP2011005583U patent/JP3172184U/en not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7580259B2 (en) * | 2005-06-24 | 2009-08-25 | Micro-Star Int'l Co., Ltd. | Heat dissipation device |
US20080041561A1 (en) * | 2006-08-18 | 2008-02-21 | Foxconn Technology Co., Ltd. | Heat dissipation device |
US7701708B2 (en) * | 2007-02-08 | 2010-04-20 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Heat dissipation assembly |
US20110100600A1 (en) * | 2009-11-05 | 2011-05-05 | Hon Fu Jin Precision Industry(Shenzhen) Co., Ltd. | Heat dissipation device |
Also Published As
Publication number | Publication date |
---|---|
JP3172184U (en) | 2011-12-08 |
TWM417595U (en) | 2011-12-01 |
CN202133951U (en) | 2012-02-01 |
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Legal Events
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AS | Assignment |
Owner name: MICRO-STAR INT'L CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LIN, YI-CHIEH;LIN, YU-JING;REEL/FRAME:026833/0745 Effective date: 20110808 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |