M417595 、五、新型說明： ；'【新型所屬之技術領域】 本新型係關於-種散熱裳置及其風流調 於電腦設備的散熱裝置及其風流調節架。ο特另U-種用 【先前技術】 近年來，隨著科技與資訊的日新月里， 亦曰漸進步。電子產品除了追求輕 '薄Γ短、小^=造技術 著優越的性能邁進。 、知^生外，更朝 以電腦為例，隨著半導體技術的進步， =體積亦逐漸縮小。為了使積體電路能處理 =電路 體電路多上數倍以上的—二往積 量越來越乡時，Γ當龍魏⑽元電子件數 门奸轉運騎所產生的—熱能亦越來越大。 要的電:元件所產生之熱能的散熱模 心熱係數的金屬材質來製造。 片k置於顯示卡上的運算晶片，以吸收運算晶片所產生 :。並且為了提高散熱模組對運算晶片的散熱效果，更可於 i 賴_，使纖磁嶋流而對散熱 然而’-般散熱風4係4設於散_片上，且散熱風扇的— /風方向往往垂直於顯示卡的一電路板。如此-來，當散熱風扇 斤產生的風流吹送至電路板時，風流會因電路板的阻擋而產生正 柃，、借二Γ彈的風仇與持續由散熱風扇所產生的風流互相干 二:的::風扇與電路板之間產生擾流的現象。如此-來，將 荷^成==竭触絲，並械增加散賊扇的運轉負 啊而is·成散熱風扇的壽命降低。 【新型内容】 架，提供—雜鮮置及纽流調節 层、 胁排風時’散熱風扇與電路板之間容 的問題 象，造成散熱效果降低以及增加散熱風扇之負荷 =所揭露之散缝置，其包含—散熱則、—風流調節 条及-風4。顺含—第—固定肢 一固定片固定於散埶銼月，田—μ4 U疋片弟 固定㈣π —^ n片樞設於第—固定片。風扇 度 f 第二固疋片，且風扇透過風流調節架調整風扇的一出風角 知片及一風 第 本新型所揭露之風流調節架，用以連接一散熱〜 以改變風扇對散熱則的—出風角度。風流調料包 及:第Γ固定片。第一固定片用以固定於散熱韓片，第 疋e°又於第—固定片，且第二固定片用以固定風扇。 根據上述本新型所揭露之散熱裝置及其風流調節架 風流調節架而使風扇可相對散熱則樞轉，以調整風屬的出^ 、git 了避免風扇所產生的風流路徑與電路板呈垂直正六 以減J風扇與電路板之間流現象，進而提升 效果以及減輕風扇的工作貞荷量。 1的政熱 ㈣新:之-細特徵與實作’兹配合圖式在實施方式中詳 術内容並树何睛目驗術者了解本新型之技 孰習相關針本 根據本說明書所揭露之内容及圖式，任何 =相關技術者可輕易地理解本新型相關之目的及優點。 L员施方式】 型一二'、、、^ 1圖」及「第2圖」’「第1圖」所示為根據本新 =例之散熱裝置的結構示意圖，「第2圖」所示為根據本新 型一，、施例之散熱裝置的結構分解示意圖。 本^狀散録置1Q _於對—電子毅％進行散熱。 .^/子褒置2()可為運用於電腦主機内部之緣圖顯示卡，但不 j f。舉例來說，電子裝置20也可以是電腦主機内部的主機 21复置2〇包含一電路板22及位於電路板22上的發熱源 曰^中，發細21可以為—運算晶片，例如中央處理器或義 日日月等。 知例之散熱裝置1G包含—散熱則、兩風流調節架 -風扇300。本實施例之散熱鰭片具有相對的一第一側 及一第二側202，散熱韓片200以第-侧201朝向發教源2卜 風扇300設置於散熱㈣2〇〇的第二側2〇2上，且風扇具有 :對的-出風口 及一入風口 32G。在本實施例當中，出風口 係_散熱則，而人風口汹則背向散熱則。需 〇是出風口 310及入風口 320相對於散熱轉片2〇〇的位置 、北限疋本新型。在本新型另一實施例當中，出風σ 310也可 以月向散熱，鰭片2〇〇，而入風口32G則朝向散熱錄片·。 M417595 本貫施例之風流調節架應係分別連接固定散熱鰭片如 風扇風流調節架100用以改變風扇3〇〇對散熱籍片200的— 出風角度。換句話說’風扇可藉由風流調節架觸而 鱗片細樞轉’以調整風扇之出風口 3K)朝向散熱韓片· 的角度。亚且’本實施例之風扇勤相對散熱 =與電f裝置20的長邊為同-方向，然而此特徵非用以限= ，減、此項技蟄者可根據實際需求而調整風扇相對 熱鰭片200的樞轉軸向。舉例來說，在另一實施例當中，風扇· 相對散熱H片2〇0的樞轉軸向也可與電子裝置π的短邊為同方 向’如「第8圖」.所示。 … 值得-提的，散錢片，的第二側2〇2係具有類似三角錐 之隆起的結構。詳細而言’第二側搬的中央部較第二側观的 相對兩端緣處高。藉此，當風扇_麵散熱鰭片插轉一角 度時，可避免風扇300錄熱韓片20〇產生碰撞干涉的現象。 需庄意献’本實施狀散熱|置1G係以兩風流調節架ι〇〇 來連接散熱鰭>；2GG及風扇300’然而風流調節架}⑽的數量非用 以限定本新型。在本新型另-實施例當中，散熱裝置ig也可僅具 一個風流調節架100來連接散熱鰭片2〇〇及風扇3〇〇。 八 請接著參照「第3圖」並同時搭配「第2圖」，「第3圖」所 示為根據本新型一實施例之風流調節架的結構分解示意圖。 本實施例之風流調節架100包含一第一固定片及一第二 固定片12〇。此外，風流調節架100更可.包含一錄14〇及一職 片⑽。其中，第-固定片no與第二固定片⑽透過樞轴14〇 M417595 而互相樞設。第-固定；n1Q用以固定於散熱，而第二固 定片120顺轉接片13〇相結合。其中，拖轴⑽可以是一阻尼 枢轴，以令第二固^ 12G可相對第一固U⑽枢轉並同時保 持第二固定片120與第一固定片則兩者當下的相對位置。 在本貫施例中第一固疋片11〇具有兩固定孔I!]，第一固定片 110藉由兩鎖固件m分财設於兩固定孔112而鎖固於散熱鑛片 200其中’固疋孔112可為螺孔，細件in可為螺絲，但不以 此為限。 轉接片130包含-本體⑽及位於本體13〇ι相對兩端的雨 固疋部134。其中，本體⑽上具有兩固定孔133，第二固定片 120具有兩固定孔122。風流調節架1〇〇透過兩鎖固件⑵穿設過 固定孔133及固定孔122而使轉糾13〇與第二固定片12〇相結 合。其令，ϋ定孔i22及固定孔133為一穿孔，鎖固件⑵為一 拉釘(鉚釘），但不以此為限。在本實施例中，轉翻⑽的兩固定 =34分別具有一固定孔132，風流調節架1〇〇透過兩鎖固件i3i 穿設固定孔132而鎖固於風扇300上，以使風扇3〇〇與風流調節 架100相結合。 值得-提的是’轉接片130的兩固定部134之間的距離係配 合風扇300的大小來設計。因此若使用體積較大的風扇_，則配 合兩固定部134之間距離較大的轉接片130。若使用體積較小的風 扇300’則配合兩固定部丨34之間距離較小的轉接片Go。換古之， 風流調節架1Q0的轉接片130係為可替換的型態，以匹配各種尺 寸大小的風扇300。 M417595 而/主思的是，風流調節架1〇〇具有轉接片13〇的型態非用以 限定本新型。在本新—實施例當中，風流調節架100也可不 /、有轉接片130 ’而第二固定片12〇則直接與風扇細相結合。 請接著參照「第4圖」，「第4圖」所示為根據本新型一實施 例之散置的顺示_。在本實施射，板22係以水平 擺放的α樣呈現。本貫施例之風扇可藉由風流調節架而 相對散熱韓片2GG樞轉，使得風扇具有出風口 31()的一側面 ” ]c平面《肖度θ。並且’角度θ係為一銳角。換句話說，風扇 300具有域π 31G的細與電路板22之間係也夾-銳角，使得 風扇300運_4所產生的風流路徑至電路板22上的一入射角即為銳 角而^直角。當風流由出風口 31()吹向發熱源21而與電路板22 相石亚㈣，由於職输至電路板η的人射肖為銳肖，因此由電 路板22所反彈的風流㈣—為銳肖的出射角離開電路板 22。如此 來即可避免電路板22所反彈的風流直接與風扇勘運轉所產 生的風，互相干擾’以減少風扇與電路板22之間的擾流現 象，以提升散熱效果。因此本實施例之散_置2⑻，可藉由調整 風扇相對散熱則的樞轉角度以匹配各種類型的散熱條 件.，以使散熱裝置100能夠達到最佳的散熱效果。 值得-提的是，本實施例之散熱結構10還可且有一導孰片 2K)及多個導熱管220 ’導熱片210熱接觸於發熱源21，而導熱管 220則連接導熱片210及散熱籍片2⑻。導熱片21〇吸㈣熱源^ 的熱月。，it透導熱官220的熱傳-遞-而-將熱能-傳遞至散熱縛片2〇〇。 需注意的是’在本發明例-實施例當中，散熱則也可以直 L In文又第"'固定片120與轉接片130的相對位置，以調整風 =相對於散熱鰭片之垂直方向的位移，使散熱 到取佳的散熱效杲。 由風；==所揭露之散熱裝置及其風流調節架，係藉 心卩㈣使風射相對散熱㈣樞轉，以調整風扇的出風 、^ =此’可避免風顧產生的風流路徑與電路板呈垂直正交， 聯由嫩她嶋目駿，使風扇與 計可減小肝盘擾的縣。因此，本實施例之風流調節架的設 熱效果二輕:Τ：：Τ象，提升散熱裝置的散 凡依本新型巾請麵賴之形狀、構t新=3=園内’舉 之變更，因此★如⑴^ 将徵及精砷當可做些許 利範圍所界物準Γ利保細須視她書所附之申請專 【圖式簡單說明】 第1圖所示為根據本新 第2圖所亍从姑二 散熱裝置的結構示意圖。 意圖。為根據本新型—實施例之散熱裝置的結構分解示 ㈣根據本_-實施例之風流調節架™ 第4圖所示為根據本新 第5圖所絲W示意圖。 4另一“β例之風流調節架的結構分 M417595 解示意圖。 第6圖所示為根據本新型另一實施例之風流調節架的結構分 解示意圖。 第7圖所示為根據本新型另一實施例之風流調節架的結構分 解示意圖。 第8圖所示為根據本新型另一實施例之散熱裝置的結構示意 圖。 【主要元件符號說明】 10 散熱裝置 20 電子裝置 21 發熱源’ 22 電路板 100 風流調節架 110 第一固定片 111 鎖固件 112 固定孔 120 第二固定片 121 鎖固件 122 固定孔 130 轉接片 1301 本體 131 鎖固件 132 固定孔M417595, V, new description: ; '[New technology field] This new type is about a kind of heat sink and its air flow adjustment to the computer equipment heat sink and its air flow adjustment frame. οSpecial U-species [Prior Art] In recent years, with the new moon in technology and information, it has gradually improved. In addition to the pursuit of light, the electronic products are thin, short, and small. In addition to knowing the life of the computer, the computer is taken as an example. With the advancement of semiconductor technology, the volume is gradually reduced. In order to make the integrated circuit capable of processing = circuit body circuit more than several times - the amount of two-way product is getting more and more hometown, when the dragon Wei (10) yuan electronic pieces are generated by the transfer of the rider - the heat is also getting more and more Big. The required electricity: the thermal energy of the heat generated by the component is made of a metal material with a thermal coefficient of heat. The slice k is placed on the operational chip on the display card to absorb the operation of the wafer. In order to improve the heat dissipation effect of the heat dissipation module on the computing chip, it is also possible to make the fiber turbulence and heat dissipation. However, the heat dissipation wind 4 is set on the dispersion film, and the cooling fan is cooled. The direction is often perpendicular to a board of the display card. In this way, when the airflow generated by the cooling fan is blown to the circuit board, the wind flow will be positive due to the blockage of the circuit board, and the wind and the cold generated by the cooling fan and the airflow generated by the cooling fan will dry each other: :: A phenomenon of spoiler between the fan and the board. In this way, the load will be touched, and the operation of the thief fan will be increased. The life of the heat sink fan will be reduced. [New content] The rack provides the problem of the difference between the cooling fan and the circuit board when the air conditioning and the nuisance adjustment layer are provided, and the heat dissipation effect is reduced and the load of the cooling fan is increased. Set, which includes - heat dissipation, - air flow adjustment bar and - wind 4. Subsidiary - the first fixed limb A fixed piece is fixed in the sputum, the Tian - μ4 U 疋 固定 fixed (four) π - ^ n piece pivoted on the first - fixed piece. The fan degree f is a second solid piece, and the fan adjusts an air outlet angle of the fan through the air flow adjustment frame and a wind flow adjustment frame disclosed by the wind, which is used to connect a heat dissipation unit to change the heat dissipation of the fan. - the angle of the wind. Airflow seasoning package and: Γ fixed piece. The first fixing piece is fixed to the heat dissipating piece, the first piece is further set to the first piece, and the second piece is used for fixing the fan. According to the heat dissipating device and the air flow adjusting frame air flow adjusting frame disclosed in the present invention, the fan can be pivoted relative to the heat dissipation to adjust the wind output, and the git prevents the wind flow path generated by the fan from being perpendicular to the circuit board. In order to reduce the flow between the J fan and the circuit board, the effect is improved and the working load of the fan is reduced. 1 political heat (four) new: - fine features and implementation 'zine with the schema in the implementation of the details of the content and the tree of the eye to understand the skill of this new type of technical skills related to the needle according to this specification Content and schema, any = related art can easily understand the related purposes and advantages of this new model. The method of the L-members is as follows: Figure 1 and Figure 2 and Figure 2 and Figure 1 show the structure of the heat sink according to this new example. It is a schematic exploded view of the heat dissipating device according to the first embodiment of the present invention. This type of scatter is set to 1Q _ to the heat of the electronic-%. .^/子褒2() can be used to display the card inside the computer's internal computer, but not j f. For example, the electronic device 20 may also be a host 21 in the mainframe of the computer, which includes a circuit board 22 and a heat generating source located on the circuit board 22. The hair chip 21 may be an operation chip, for example, a central processing unit. Or the sun, the sun, the moon, etc. The heat dissipating device 1G of the known example includes a heat dissipating device and two air flow adjusting frames - a fan 300. The heat dissipation fins of the embodiment have a first side and a second side 202. The heat sinks 200 are disposed on the second side of the heat dissipation (four) 2〇〇 with the first side 201 facing the teaching source 2 fan 300. 2, and the fan has: a pair of - air outlets and an air inlet 32G. In this embodiment, the air outlet is _ heat-dissipating, and the air vent is back-cooled. The need for the air outlet 310 and the air inlet 320 relative to the position of the heat transfer fin 2 、, the north limit 疋 this new type. In another embodiment of the present invention, the outlet σ 310 can also dissipate heat in the moon direction, the fins 2 〇〇, and the air inlet 32G faces the heat-dissipating film. M417595 The airflow adjusting frame of the present embodiment should be connected with fixed heat dissipating fins such as fan airflow adjusting frame 100 to change the air outlet angle of the fan 3〇〇 to the heat radiating film 200. In other words, the fan can be pivoted by the wind flow adjustment frame to adjust the fan's air outlet 3K to the angle of the heat sink. The fan of the present embodiment has a relative heat dissipation = the same direction as the long side of the electric device f. However, this feature is not limited to =, and the technician can adjust the relative heat of the fan according to actual needs. The pivot axis of the fin 200. For example, in another embodiment, the pivoting axis of the fan relative to the heat sinking H piece 2〇0 may be in the same direction as the short side of the electronic device π, as shown in Fig. 8. ... worthy of mentioning, the loose side of the second side 2〇2 series has a structure similar to the triangular cone. Specifically, the central portion of the second side shift is higher than the opposite end edges of the second side. Thereby, when the fan_face heat sink fin is inserted at an angle, the phenomenon that the fan 300 records the thermal interference of the Korean film 20〇 can be avoided. It is necessary to make a contribution to the heat dissipation of the present embodiment. The 1G system is connected to the heat-dissipating fins by two airflow adjusting frames ι;; 2GG and the fan 300', however, the number of airflow adjusting frames} (10) is not limited to the present invention. In another embodiment of the present invention, the heat sink ig may have only one air flow adjusting frame 100 for connecting the heat radiating fins 2 and the fan 3〇〇. [8] Please refer to "Fig. 3" and at the same time, together with "Fig. 2", and Fig. 3 is a schematic exploded view of the air flow adjusting frame according to an embodiment of the present invention. The airflow adjusting frame 100 of this embodiment includes a first fixing piece and a second fixing piece 12'. In addition, the airflow adjusting frame 100 can include a recording and a job (10). The first fixing piece no and the second fixing piece (10) are pivoted to each other through the pivot 14 〇 M417595. First-fixed; n1Q is fixed to heat dissipation, and second fixed piece 120 is coupled to the transfer piece 13〇. Wherein, the towing shaft (10) may be a damping pivot to pivot the second fixing member 12 relative to the first fixing member (10) while maintaining the relative position of the second fixing piece 120 and the first fixing piece. In the present embodiment, the first fixing piece 11 has two fixing holes I!], and the first fixing piece 110 is locked in the heat dissipation slab 200 by two locking pieces m. The fixing hole 112 can be a screw hole, and the thin part in can be a screw, but is not limited thereto. The adapter piece 130 includes a body (10) and a rain-solid crotch portion 134 located at opposite ends of the body 13〇. The main body (10) has two fixing holes 133, and the second fixing piece 120 has two fixing holes 122. The air flow adjusting frame 1 穿 passes through the fixing holes 133 and the fixing holes 122 through the two locking pieces (2) to join the second fixing piece 12〇. Therefore, the fixing hole i22 and the fixing hole 133 are a perforation, and the locking member (2) is a rivet (rivet), but not limited thereto. In this embodiment, the two fixings=34 of the turningover (10) respectively have a fixing hole 132, and the airflow adjusting frame 1 is fixed to the fan 300 through the fixing holes 132 through the two locking members i3i, so that the fan 3〇 The crucible is combined with the airflow adjustment frame 100. It is worth mentioning that the distance between the two fixing portions 134 of the adapter piece 130 is designed to match the size of the fan 300. Therefore, if a fan _ having a large volume is used, the adapter piece 130 having a large distance between the two fixing portions 134 is engaged. If the smaller size fan 300' is used, the adapter piece Go having a smaller distance between the two fixing portions 丨34 is engaged. In other words, the adapter piece 130 of the air flow adjusting frame 1Q0 is of an alternative type to match the fan 300 of various sizes. M417595 and / / the main idea is that the airflow regulator 1 〇〇 has the shape of the adapter piece 13〇 is not used to limit the new. In the present embodiment, the airflow adjusting frame 100 may also have an adapter piece 130' and the second fixing piece 12'' is directly combined with the fan. Please refer to Fig. 4, and Fig. 4 is a diagram showing the arrangement of the interleaving according to an embodiment of the present invention. In this embodiment, the plate 22 is presented in a horizontally placed alpha. The fan of the present embodiment can be pivoted relative to the heat-dissipating Korean piece 2GG by the air flow adjusting frame, so that the fan has a side surface of the air outlet 31 (), the "c" degree θ, and the angle θ is an acute angle. In other words, the fan 300 has a field π 31G and the circuit board 22 is also clipped - an acute angle, so that the air flow path generated by the fan 300 _4 to the incident angle on the circuit board 22 is an acute angle When the wind flow is blown to the heat source 21 by the air outlet 31 () and is in phase with the circuit board 22 (four), since the person's shot to the circuit board η is sharp, the wind flow rebounded by the circuit board 22 (four) - sharp The exit angle of the shaws leaves the circuit board 22. This prevents the wind current rebounded by the circuit board 22 from directly interfering with the wind generated by the fan survey operation to reduce the turbulence between the fan and the circuit board 22 to improve Therefore, the heat dissipation effect can be matched by adjusting the pivoting angle of the fan relative to the heat dissipation to match the various types of heat dissipation conditions, so that the heat sink 100 can achieve the best heat dissipation effect. The heat dissipation of this embodiment The structure 10 can also have a guiding piece 2K) and a plurality of heat conducting tubes 220. The heat conducting sheet 210 is in thermal contact with the heat source 21, and the heat conducting tube 220 is connected to the heat conducting sheet 210 and the heat radiating sheet 2 (8). The heat conducting sheet 21 sucks (4) heat source ^ The hot month., It transmits the heat transfer of the heat-conducting officer 220 - and - transfers the heat energy to the heat-dissipating tab 2 〇〇. It should be noted that in the example of the invention - the heat dissipation can also be straight L In the second and the second position of the fixed piece 120 and the adapter piece 130, to adjust the displacement of the wind = relative to the vertical direction of the heat sink fin, so as to dissipate heat to a better heat dissipation effect. By the wind; == The disclosed heat dissipating device and the airflow adjusting frame thereof are used by the heart (4) to make the wind radiation relatively cool (four) pivoting to adjust the fan's air outlet, and the current flow path which is avoided by the wind can be prevented from being perpendicular to the circuit board. The balance is made by the tenderness of her, so that the fan and the meter can reduce the liver disturbance. Therefore, the heat regulation effect of the airflow adjustment frame of this embodiment is two light: Τ:: Τ, lifting the heat sink Any shape that depends on this new towel, the structure of the new t = 3 = change in the park, so ★ (1) ^ will be enlisted Arsenic can be used to make some profit. The scope of the application is as follows. The application attached to her book is specific. [Simple description of the drawing] Figure 1 shows the heat dissipation device according to this new figure 2 Schematic diagram of the structure. The structure of the heat dissipating device according to the present invention is shown in an exploded view. (IV) The air flow adjusting frame according to the present embodiment is shown in Fig. 4 as a schematic view of the wire W according to the new fifth drawing. A schematic diagram of the structure of the β-type airflow regulation frame is divided into M417595. Fig. 6 is a schematic exploded view showing the structure of a wind flow regulating frame according to another embodiment of the present invention. Fig. 7 is a schematic exploded view showing the structure of a wind flow regulating frame according to another embodiment of the present invention. Fig. 8 is a view showing the construction of a heat sink according to another embodiment of the present invention. [Main component symbol description] 10 Heat sink 20 Electronic device 21 Heat source ' 22 Circuit board 100 Air flow adjustment frame 110 First fixing piece 111 Locking block 112 Fixing hole 120 Second fixing piece 121 Locking piece 122 Fixing hole 130 Transfer piece 1301 Body 131 locking member 132 fixing hole
12 M41759512 M417595
133 固定孔 134 固定部 1341 固定孔 135 鎖固件 137 開槽 138 開槽 139 開槽 140 枢軸 200 散熱鰭片 201 第一侧 202 .第二侧 210 導熱片 220 導熱管 300 風扇 310 出風口 320 入風口133 fixing hole 134 fixing part 1341 fixing hole 135 locking member 137 slotting 138 slotting 139 slotting 140 pivot 200 heat sink fin 201 first side 202 . second side 210 heat transfer plate 220 heat pipe 300 fan 310 air outlet 320 air inlet