CN220894853U - Solid state disk, mainboard and computer - Google Patents

Abstract

The application provides a solid state disk, a main board and a computer, and relates to the technical field of storage equipment. Wherein, the solid state disk includes: the solid state disk comprises a solid state disk body, first radiating fins and a heat conducting component, wherein the first radiating fins are connected with the solid state disk, and one ends of the first radiating fins with a plurality of first convex fins are fin radiating ends; the heat conducting component comprises a first part and a second part, wherein the first part is in contact with at least part of the fin radiating end for conducting heat, and the second part is used for being in contact with the shell for conducting heat. The technical scheme of the application can solve the technical problem that the notebook computer or the notebook computer does not have enough space to install the additional fan and the water cooling equipment to radiate the solid state disk.

Description

Solid state disk, mainboard and computer

Technical Field

The present application relates to the field of storage devices, and in particular, to a solid state disk, a motherboard, and a computer.

Background

Solid state disk (Solid STATE DISK or Solid STATE DRIVE, abbreviated as SSD), also called Solid state drive, is a hard disk made of Solid state electronic memory chip array. With the rapid development of computer storage equipment, the performance of the solid state disk is improved continuously, but with the continuous improvement of the performance, the power of the solid state disk is increased continuously, and the requirement on heat dissipation is higher.

In the prior art, an additional fan is adopted to provide air flow for the surface of the solid state disk, heat generated by the solid state disk is brought out through the air flow, or the water cooling equipment is in contact with the surface of the solid state disk, and heat generated by the solid state disk is brought out through solution in the water cooling equipment.

In the prior art, although the problem of heat dissipation of the solid state disk is solved, no matter an additional fan is adopted, or a water cooling device is adopted to dissipate heat of the solid state disk, the host computer is required to have enough installation space, and for an integrated computer with smaller volume or a notebook computer, no sufficient space is required to install the additional fan and the water cooling device to dissipate heat of the solid state disk.

Disclosure of utility model

The embodiment of the application aims to provide a solid state disk, a main board and a computer, so as to solve the problem that an integrated computer with smaller volume or a notebook computer does not have enough space to install an additional fan and water cooling equipment to dissipate heat of the solid state disk.

In order to solve the technical problems, the embodiment of the application provides the following technical scheme:

the first aspect of the present application provides a solid state disk, including: a solid state disk body; the first radiating fins are connected with the solid state disk, and one ends of the first radiating fins with a plurality of first convex fins are fin radiating ends; the heat conducting component comprises a first part and a second part, wherein the first part is in contact with at least part of the fin radiating end for conducting heat, and the second part is used for being in contact with the shell for conducting heat.

In some modified embodiments of the first aspect of the present application, the heat conducting component is a heat conducting paste, the first surface of the heat conducting paste is provided with a plurality of grooves as a first part of the heat conducting component, each groove is at least coated with one first fin, and the second surface of the heat conducting paste is a second part of the heat conducting component.

In some modified embodiments of the first aspect of the present application, the heat conducting component is a second heat dissipating fin, one end of the second heat dissipating fin having a plurality of second fins forms a first portion, the adjacent second fins forms a plurality of grooves, each groove at least covers one first fin, and the end facing away from the first portion is a second portion.

In some modified embodiments of the first aspect of the present application, the number of grooves is the same as the number of first fins, the grooves are covered with the first fins one to one, and the surface of the heat conducting member where the grooves are disposed is in contact with a portion of the fin heat dissipation end from which the first fins are removed.

In some modified embodiments of the first aspect of the present application, a projected area of the first portion toward a center section in a thickness direction of the first radiator fin is smaller than a projected area of the second portion toward the center section in the thickness direction of the first radiator fin.

In some variations of the first aspect of the present application, the first heat sink fin comprises:

The first clamping piece is arranged on the side periphery of the first radiating fin, the clamping end of the first clamping piece is positioned on one side, close to the solid state disk body, of the first radiating fin, and the clamping end of the first clamping piece is used for clamping the solid state disk body.

In some variations of the first aspect of the present application, the second heat sink fin comprises:

The second clamping piece is arranged on the side periphery of the second radiating fin, the clamping end of the second clamping piece is positioned on one side, close to the first radiating fin, of the second radiating fin, and the clamping end of the second clamping piece is used for clamping the first radiating fin.

A second aspect of the present application provides a motherboard, comprising: the solid state disk provided by the first aspect of the application.

The solid state disk provided in the first aspect may be directly used by the motherboard provided in the second aspect, and specific implementation structures may refer to the related content described in the first aspect, which is not described herein again.

A third aspect of the present application provides a computer comprising: a housing; and the main board provided by the second aspect of the application is arranged in the shell, and the second part of the heat conduction component of the solid state disk in the main board is contacted with the inner surface of the shell.

In some variations of the third aspect of the present application, the housing comprises:

The heat dissipation part is provided with a shell heat dissipation end and a shell attaching end, the shell attaching end is attached to the second part, and the shell heat dissipation end is of a sawtooth structure or a wave structure.

Compared with the prior art, the solid state disk provided in the first aspect of the present application includes: the solid state disk comprises a solid state disk body, first radiating fins and a heat conducting component, wherein the first radiating fins are provided with a plurality of first convex fins, one ends of the first convex fins are fin radiating ends, the first radiating fins are connected with the solid state disk, the heat conducting component comprises a first part and a second part, the first part is in contact with at least part of fin radiating ends for conducting heat, and the second part is used for being in contact with a shell for conducting heat. A large amount of heat is generated in the working process of the solid state disk body, and the heat is conducted to the fin radiating ends of the first radiating fins through the first radiating fins which are in contact with the solid state disk body. And then the heat is at least partially contacted with the radiating end of the fin through the first part and is transferred to the second part of the heat conducting component, the second part is contacted with the shell, the heat is transferred from the second part to the shell, and the heat is transferred to the outer side of the computer through the shell, so that the heat-conducting type solid state disk heat dissipation device can be realized as a small-size integrated computer with insufficient installation space for installing an additional fan and water cooling equipment, or a notebook computer provides good heat dissipation, and the problem that the small-size integrated computer or the notebook computer does not have sufficient space for installing the additional fan and water cooling equipment to dissipate heat of the solid state disk can be solved.

Drawings

The above, as well as additional purposes, features, and advantages of exemplary embodiments of the present application will become readily apparent from the following detailed description when read in conjunction with the accompanying drawings. In the drawings, wherein like or corresponding reference numerals indicate like or corresponding parts, there are shown by way of illustration, and not limitation, several embodiments of the application, in which:

FIG. 1 schematically illustrates a schematic structural diagram of a first solid state disk;

FIG. 2 schematically illustrates a schematic structural diagram of a second solid state disk;

fig. 3 schematically shows a schematic structural diagram of a third solid state disk.

Reference numerals illustrate:

The solid state disk comprises a solid state disk body 1, a first radiating fin 2, a first convex fin 21 and a first clamping piece 22;

The heat conduction component 3, the heat conduction paste 31, the second heat radiation fins 32, the second convex fins 321 and the second clamping piece 322;

and a housing 4.

Detailed Description

Embodiments of the present application are described in further detail below with reference to the accompanying drawings and examples. The following detailed description of the embodiments and the accompanying drawings are provided to illustrate the principles of the application and are not intended to limit the scope of the application, which may be embodied in many different forms and not limited to the specific embodiments disclosed herein, but rather to include all technical solutions falling within the scope of the claims.

These embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the application to those skilled in the art. It should be noted that: the relative arrangement of parts and steps, the composition of materials, numerical expressions and numerical values set forth in these embodiments should be construed as exemplary only and not limiting unless otherwise specifically stated.

In the description of the present application, unless otherwise indicated, the meaning of "plurality of" means greater than or equal to two; the terms "upper," "lower," "left," "right," "inner," "outer," and the like are merely used for convenience in describing the present application and to simplify the description, and do not denote or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be construed as limiting the present application. When the absolute position of the object to be described is changed, the relative positional relationship may be changed accordingly.

Furthermore, the use of the terms first, second, and the like in the present application are not used for any order, quantity, or importance, but rather are used for distinguishing between different parts. The "vertical" is not strictly vertical but is within the allowable error range. "parallel" is not strictly parallel but is within the tolerance of the error. The word "comprising" or "comprises" and the like means that elements preceding the word encompass the elements recited after the word, and not exclude the possibility of also encompassing other elements.

It should also be noted that, in the description of the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the above terms in the present application can be understood as appropriate by those of ordinary skill in the art. When a particular device is described as being located between a first device and a second device, there may or may not be an intervening device between the particular device and either the first device or the second device.

All terms used herein have the same meaning as understood by one of ordinary skill in the art to which the present application pertains, unless specifically defined otherwise. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the techniques, methods, and apparatus should be considered part of the specification.

Example 1

As shown in fig. 1, a first aspect of the present application proposes a solid state disk, including: the solid state disk comprises a solid state disk body 1, a first heat radiation fin 2 and a heat conduction component 3; the first radiating fins 2 are connected with the solid state disk, and one ends of the first radiating fins 2 with a plurality of first convex fins 21 are fin radiating ends; comprising a first portion in thermal conduction contact with at least part of the fin radiating end and a second portion for thermal conduction in contact with the housing 4.

Specifically, the solid state disk body 1 is used in a solid state disk in the prior art, and is only required to be installed on a computer, and is not specifically limited.

The first heat dissipation fin 2 may use the existing heat dissipation fin, or may use a heat dissipation fin defined by a special structure, and not specifically defined, where the solid state disk is connected to a surface of the first heat dissipation fin 2 without any protruding fin, in this embodiment, the first heat dissipation fin 2 may have a mounting surface, where the mounting surface is attached to a surface of the solid state disk body 1 opposite to the connection end of the main board, and the other surface opposite to the mounting surface has a plurality of protruding fins, where the specific number of protruding fins is not defined, and may be determined according to a heat dissipation requirement and a size, and a connection manner between the first heat dissipation fin 2 and the solid state disk body 1 may be by fastening a clip, or may be provided with a slot on the mounting surface of the first heat dissipation fin 2, so that the solid state disk body 1 is fastened into the slot to implement connection, and a specific connection manner is not limited, and separation between the first heat dissipation fin 2 and the solid state disk body 1 may not occur in a working process.

The heat conducting member 3 may be a heat conducting paste 31 or another heat dissipating fin, and the specific type of the heat conducting member 3 is not limited. The first part of the heat conducting component 3 is contacted with the fin radiating end, and the contact between the first part and the fin radiating end can be that the heat conducting component 3 is completely jointed with the fin radiating end, or can be that part of the heat conducting component is jointed with the fin radiating end, and the joint area is not limited specifically. The first portion and the second portion may be two surfaces facing away from the heat conductive member 3, or may be two surfaces having a certain angle, or the first portion and the second portion may be formed of a plurality of surfaces, and in this embodiment, the second portion may be a plane completely bonded to the housing 4, and the form thereof is not particularly limited.

Compared with the prior art, the solid state disk provided in the first aspect of the present application includes: the solid state disk comprises a solid state disk body 1, a first radiating fin 2 and a heat conducting component 3, wherein the first radiating fin 2 is provided with a plurality of first convex fins 21, one end of each first convex fin 21 is a fin radiating end, the first radiating fin 2 is connected with the solid state disk, the heat conducting component 3 comprises a first part and a second part, the first part is in contact with at least part of fin radiating ends for heat conduction, and the second part is used for being in contact with a shell 4 for heat conduction. A large amount of heat is generated in the working process of the solid state disk body 1, and the heat is conducted to the fin radiating end of the first radiating fin 2 through the first radiating fin 2 in contact with the solid state disk body 1. And then the heat is at least partially contacted with the radiating end of the fin through the first part and is transferred to the second part of the heat conducting component 3, the second part is contacted with the shell 4, the heat is transferred from the second part to the shell 4, and the heat is transferred to the outer side of the computer through the shell 4, so that the heat-conducting component can be realized as a small-size integrated computer with insufficient installation space for installing an additional fan and water cooling equipment, or a notebook computer provides good heat dissipation, and the problem that the small-size integrated computer, or the notebook computer has insufficient space for installing the additional fan and water cooling equipment to dissipate heat of a solid state disk can be solved.

As shown in fig. 1, in some embodiments, the heat conducting component 3 is a heat conducting paste 31, a first surface of the heat conducting paste 31 is provided with a plurality of grooves as a first portion of the heat conducting component 3, each groove is at least wrapped with one first fin 21, and a second surface of the heat conducting paste 31 is a second portion of the heat conducting component 3.

Specifically, the shape and the size of the plurality of grooves provided on the first surface of the heat conducting paste 31 are not specifically limited, and are specifically determined according to the shape of the first fin 21 and the size of the first fin 21 of the first heat dissipating fin 2, and the specific number of grooves is also not specifically limited, and are specifically determined according to the number of the first fins 21 of the first heat dissipating fin 2, and each groove may cover a plurality of the first fins 21 or may cover one first fin 21, and in this embodiment, the first surface and the second surface may be two surfaces facing away from each other of the heat conducting paste 31.

The heat conduction paste 31 has high heat conduction efficiency and good heat conduction effect, and the first surface of the heat conduction paste 31 is provided with a plurality of grooves, and each groove is at least coated with one first convex fin 21, so that the contact area between the heat conduction part 3 and the first heat dissipation fins 2 is increased, and the heat dissipation efficiency is increased.

In some embodiments, the number of grooves is the same as the number of first fins 21, the grooves are one-to-one clad with the first fins 21, and the surface of the heat conductive member 3 where the grooves are provided is in contact with the portion of the fin heat dissipation end from which the first fins 21 are removed.

In this embodiment, the surface of the heat conducting member 3 with the groove is in contact with the portion of the fin heat dissipation end except for the first fin 21, specifically, the surface of the heat conducting member 3 with the groove abuts against the surface of the first fin 2 with the fin, so that the groove completely covers the first fin 21 as much as possible, which is understood as that the inner surface of the groove covers the outer surface of the first fin as much as possible. The grooves and the first protruding fins 21 are coated one to one, and the grooves completely coat the first protruding fins 21 as much as possible, so that the contact area between the heat conducting component 3 and the first heat radiating fins 2 can be further increased, and the heat radiating efficiency is further improved.

As shown in fig. 2, in some embodiments, the projected area of the first portion toward the center section in the thickness direction of the first radiator fin 2 is smaller than the projected area of the second portion toward the center section in the thickness direction of the first radiator fin 2. The purpose of this arrangement is to increase the contact area between the second part and the casing 4, so that the heat transferred to the heat conducting component 3 is transferred to the casing 4 more quickly, and the heat dissipation efficiency of the solid state disk is further increased. In this embodiment, the surface of the casing 4 contacting the heat conducting member 3 is a plane, and the corresponding second portion is also a plane, so that the two parts are completely bonded.

In some embodiments, the first heat sink fin 2 includes: the first clamping piece 22 is arranged on the side periphery of the first radiating fin 2, the clamping end of the first clamping piece 22 is positioned on one side of the first radiating fin 2, which is close to the solid state disk body 1, and the clamping end of the first clamping piece is used for clamping the solid state disk body 1.

The first clamping member 22 may be a buckle or a slot, which is not limited to a specific structure, so that the first heat dissipation fin 2 can be stably attached to the solid state disk body 1 in the working process without separation. The first clamping piece 22 is arranged at the side periphery of the first heat radiation fin 2, and the clamping end of the first clamping piece 22 is positioned at one side of the first heat radiation fin 2, which is close to the solid state disk body 1, so that the clamping of the first clamping piece 22 to the solid state disk body 1 is convenient, and the contact surface between the first heat radiation fin 2 and the solid state disk body 1 is prevented from being influenced by the first clamping piece 22 at the periphery, and the heat radiation effect is further influenced.

Example two

As shown in fig. 3, in the solid state disk provided in the second embodiment of the present application, the heat conducting component 3 is a second heat dissipating fin 32, one end of the second heat dissipating fin 32 having a plurality of second fins 321 forms a first portion, the adjacent second fins 321 forms a plurality of grooves, each groove at least covers one first fin 21, and one end of the second fin, which is away from the first portion, is a second portion.

Specifically, the second heat dissipation fins 32 may be the same heat dissipation fins as the first heat dissipation fins 2, or may be different heat dissipation fins, and the specific type of the heat dissipation fins is not limited, and the adjacent second fins 321 are surrounded to form a plurality of grooves, and the formed grooves may cover a plurality of first fins 21, or may cover one first fin 21. The shape and size of the grooves are determined according to the choice of the second heat sink fins 32.

The heat conducting component 3 adopts the radiating fins, so that the heat conducting efficiency is high, the heat conducting effect is good, the convex fins of the second radiating fins 32 form a plurality of grooves, each groove can be coated with at least one first convex fin 21, the contact area between the heat conducting component 3 and the first radiating fins 2 is increased, and the heat radiating efficiency is increased.

In this embodiment, the top end of the second fin 321 may abut against the surface of the first heat dissipation fin 2 where the fin is disposed, which can be understood that the grooves formed by the plurality of adjacent second fins 321 cover the first fin 21 as much as possible, the grooves cover the first fins 21 one to one, and the grooves cover the first fins 21 as much as possible completely, so that the contact area between the heat conduction member 3 and the first heat dissipation fin 2 can be further increased, and the heat dissipation efficiency is further increased.

In some embodiments, the second heat sink fin comprises: the second clamping piece 322 is arranged on the side periphery of the second radiating fin, the clamping end of the second clamping piece 322 is positioned on one side of the second radiating fin, which is close to the first radiating fin, and the clamping end of the second clamping piece is used for clamping the first radiating fin.

The second clamping member 322 may be a buckle or a slot, which is not limited to the structure, so that the second heat dissipation fin 32 and the first heat dissipation fin 2 can be stably attached in the working process without separation. The second clamping piece 322 is disposed on the peripheral side of the second heat dissipation fin 32, and the clamping end of the second clamping piece 322 is located on the side of the second heat dissipation fin close to the first heat dissipation fin 2, so as to facilitate the clamping of the second clamping piece 322 on the first heat dissipation fin 2, and the contact surface between the second heat dissipation fin 32 and the first heat dissipation fin 2 is prevented from being affected by the second clamping piece 322 on the peripheral side, so that the heat dissipation effect is further affected.

The remaining features of the second embodiment are the same as those of the first embodiment, and reference is specifically made to the description of the first embodiment.

Example III

The second aspect of the present application provides a motherboard, which includes the solid state disk of the first embodiment or the second embodiment of the present application.

Specifically, the solid state disk described in the third embodiment may directly use the solid state disk provided in the first embodiment or the second embodiment, and specific implementation structures may refer to the related contents described in the first embodiment and the second embodiment, which are not described herein again.

Compared with the prior art, the motherboard provided in the second aspect of the present application adopts the solid state disk with good heat dissipation effect in the first embodiment and the second embodiment of the present application, and during the working process, a large amount of heat is generated in the working process of the solid state disk body 1, and the heat is conducted to the fin heat dissipation end of the first heat dissipation fin 2 through the first heat dissipation fin 2 in contact with the solid state disk body 1. And then the heat is at least partially contacted with the radiating end of the fin through the first part and is transferred to the second part of the heat conducting component 3, the second part is contacted with the shell 4, the heat is transferred from the second part to the shell 4, and the heat is transferred to the outer side of the computer through the shell 4, so that the radiating efficiency of the solid state disk is improved, the radiating efficiency of the main board is further improved, and the heat radiating efficiency of the main board is smaller, and an additional fan and water cooling equipment integrated computer or a notebook computer is provided with better radiating effect because of insufficient installation space.

Example IV

A third aspect of the present application provides a computer comprising: a housing 4 and a motherboard in a third embodiment of the present application.

Specifically, the computer in the fourth embodiment may directly use the motherboard provided in the third embodiment, and the specific implementation structure may refer to the related content described in the third embodiment, which is not described herein.

Compared with the prior art, the third embodiment of the application has good heat dissipation capability, is suitable for a motherboard with smaller volume, does not have enough installation space to install an additional fan and water cooling equipment integrated computer, and provides better heat dissipation for the computer.

As shown in fig. 1, 2, and 3, in some embodiments, the housing 4 includes: the radiating component is provided with a radiating end of the shell 4 and a fitting end of the shell 4, the fitting end of the shell 4 is fitted with the second part, and the radiating end of the shell 4 is of a sawtooth structure or a wave structure.

The heat dissipation member may be a product designed separately or may be integrally formed with the housing 4. The attaching end of the casing 4 may be a plane, and the second portion is also a plane, so that the attaching end of the casing 4 may be a curved surface, and the corresponding second portion should also be a curved surface, so that the specific structure of the attaching end of the casing 4 is not limited. The heat dissipation end of the casing 4 is positioned at the outer side of the computer, and the temperature is conducted to the external environment, so that the heat dissipation efficiency of the computer can be further improved through the sawtooth structure or the wave structure.

The foregoing is merely illustrative of the present application, and the present application is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (10)

1. A solid state disk, comprising:

a solid state disk body;

The first radiating fins are connected with the solid state disk body, and one ends of the first radiating fins with a plurality of first convex fins are fin radiating ends;

And the heat conduction part comprises a first part and a second part, the first part is in contact with at least part of the fin radiating end for heat conduction, and the second part is used for being in contact with the shell for heat conduction.

2. The solid state disk of claim 1 wherein,

The heat conduction part is a heat conduction paste, a plurality of grooves are formed in the first surface of the heat conduction paste and are used for being first parts of the heat conduction part, each groove is at least coated with one first convex fin, and the second surface of the heat conduction paste is used for being second parts of the heat conduction part.

3. The solid state disk of claim 1 wherein,

The heat conduction component is a second heat radiation fin, one end of the second heat radiation fin, which is provided with a plurality of second convex fins, forms the first part, the adjacent second convex fins form a plurality of grooves, each groove at least coats one first convex fin, and one end, which is away from the first part, is the second part.

4. A solid state disk as claimed in claim 2 or 3, wherein,

The number of the grooves is the same as that of the first convex fins, the grooves are coated with the first convex fins one to one, and the surface of the heat conduction component, on which the grooves are arranged, is contacted with the part of the fin radiating end, from which the first convex fins are removed.

5. The solid state disk of claim 1 wherein,

The projection area of the first part to the central section of the first radiating fin in the thickness direction is smaller than the projection area of the second part to the central section of the first radiating fin in the thickness direction.

6. The solid state disk of claim 1, wherein the first heat sink fin comprises:

the first clamping piece is arranged on the side periphery of the first radiating fin, the clamping end of the first clamping piece is positioned on one side, close to the solid state disk body, of the first radiating fin, and the clamping end of the first clamping piece is used for clamping the solid state disk body.

7. The solid state disk of claim 3, wherein the second heat sink fin comprises:

The second clamping piece is arranged on the side periphery of the second radiating fin, the clamping end of the second clamping piece is positioned on one side, close to the first radiating fin, of the second radiating fin, and the clamping end of the second clamping piece is used for clamping the first radiating fin.

8. A motherboard comprising the solid state disk of any one of claims 1-7.

9. A computer, comprising:

A housing;

the motherboard of claim 8, wherein said motherboard is disposed in said housing, and wherein a second portion of said thermally conductive member of said solid state disk in said motherboard is in contact with said interior surface of said housing.

10. The computer of claim 9, wherein the housing comprises:

The heat dissipation part is provided with a shell heat dissipation end and a shell attaching end, the shell attaching end is attached to the second part, and the shell heat dissipation end is of a sawtooth structure or a wave structure.