CN219738101U - Network card - Google Patents

Abstract

The utility model discloses a network card, and relates to the technical field of computer expansion. The network card comprises a circuit board and a heat dissipation assembly, wherein a chip is arranged on the circuit board; the heat dissipation assembly is in heat exchange connection with the chip, the heat dissipation assembly comprises a plurality of airflow channels arranged at intervals along a first direction, the airflow channels penetrate through the heat dissipation assembly along a second direction, the heat dissipation assembly covers the chip, at least one end of the heat dissipation assembly extends out of normal projection of the circuit board along the first direction, and the first direction and the second direction are arranged at an included angle. The network card improves the heat radiation capability of the heat radiation component, so that the network card can work normally with higher power.

Description

Network card

Technical Field

The utility model relates to the technical field of computer expansion, in particular to a network card.

Background

With the development of computer equipment technology, the functions and applications of the server are becoming wider and wider. A server is a type of computer that runs faster, is more loaded, and has more performance than a normal computer. The server is capable of providing computing or application services to other clients in the network, so the server has a high demand for the performance of the network card.

In the prior art, the network card complies with the design standard of OCP 3.0, so that not only is the signal performance improved, but also the physical form is greatly changed. However, the size of the network card in the height direction following the OCP 3.0 design standard has a certain limit, and cannot exceed the standard, so that the size of the heat dissipation component on the circuit board of the network card is limited, the heat dissipation capability is low, and when the power consumption of the network card is high, the temperature of the chip is easily too high, so that potential safety hazards exist.

In order to solve the above problems, a network card device needs to be developed.

Disclosure of Invention

The utility model aims to provide a network card, which improves the heat radiation capability of a heat radiation component and enables the network card to work normally with higher power.

To achieve the purpose, the utility model adopts the following technical scheme:

a network card, comprising:

the circuit board is provided with a chip;

the heat dissipation assembly is in heat exchange connection with the chip, the heat dissipation assembly comprises a plurality of airflow channels arranged at intervals along a first direction, the airflow channels penetrate through the heat dissipation assembly along a second direction, the heat dissipation assembly covers the chip, at least one end of the heat dissipation assembly extends out of normal projection of the circuit board along the first direction, and the first direction and the second direction are arranged at an included angle.

In this embodiment, the network card further includes a fixing plate, the fixing plate is fixedly connected with the circuit board, and the portion of the heat dissipation assembly extending beyond the normal projection of the circuit board along the first direction is fixedly connected with the fixing plate.

In this embodiment, a groove is formed at one end of the fixing plate, and the circuit board is inserted into the groove.

In this embodiment, the network card further includes a front frame, the fixing plate and the circuit board are fixedly connected with the front frame, the front frame is provided with a heat dissipation hole, and one end of the air flow channel faces the heat dissipation hole.

In this embodiment, a data interface is further disposed on the circuit board, and at least one end of a portion of the airflow channel faces the data interface.

In this embodiment, the network card further includes a protection board, where the protection board is fixedly disposed on a side of the circuit board facing away from the chip.

In this embodiment, the heat dissipation assembly includes a heat conduction plate and a heat dissipation member, the heat conduction plate is in heat exchange connection with the chip, the heat conduction plate extends beyond a normal projection of the circuit board along the first direction, and the heat dissipation member is provided with a plurality of air flow channels.

In this embodiment, the heat dissipation member includes a top plate and a plurality of heat dissipation fins disposed on the top plate at intervals along a first direction, where the heat dissipation fins are in heat exchange connection with the heat conducting plate, and the air flow channel is formed between two adjacent heat dissipation fins.

In this embodiment, the heat conducting plate includes a plate body and a heat conducting member, where the heat conducting member is disposed on a side of the plate body facing the heat dissipating member, and the heat conducting member is abutted to the heat dissipating member and the chip.

In this embodiment, the network card further includes a fixing component, where the fixing component includes a fixing element and an elastic element, the fixing element is fixedly connected with the circuit board, and two ends of the elastic element respectively abut against the fixing element and the heat dissipation component.

The utility model has the beneficial effects that:

the utility model provides a network card. When the chip works and heats, heat can be transferred to the heat dissipation assembly and is transferred inside the heat dissipation assembly, so that the temperature of the whole heat dissipation assembly is increased. The fan in the server can blow air into the airflow channel, and the heat of the heat dissipation component is taken away through the flowing of the air. The heat radiation component of the network card extends out of the normal projection of the circuit board along the first direction, and the heat radiation area of the heat radiation component is increased on the premise of not increasing the height, so that the heat radiation capability of the heat radiation component is improved, and the network card can work normally with higher power.

Drawings

Fig. 1 is a schematic structural diagram of a network card provided by the present utility model;

FIG. 2 is an exploded view of the network card provided by the present utility model;

FIG. 3 is an exploded view of a heat dissipating assembly provided by the present utility model;

fig. 4 is a schematic structural view of a fixing plate according to the present utility model.

In the figure:

1. a circuit board; 2. a chip; 3. a heat dissipation assembly; 4. a fixing plate; 5. a front frame; 6. a guard board; 7. a fixing assembly;

11. a data interface; 31. a heat conductive plate; 32. a heat sink; 33. a heat-conducting adhesive; 41. a groove; 42. reinforcing ribs; 51. a heat radiation hole; 71. a fixing member; 72. an elastic member;

311. a plate body; 312. a heat conductive member; 321. an air flow channel; 322. a heat sink; 323. and a top plate.

Detailed Description

Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative and intended to explain the present utility model and should not be construed as limiting the utility model.

In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. Wherein the terms "first position" and "second position" are two different positions.

Unless specifically stated or limited otherwise, the terms "mounted," "connected," and "fixed" are to be construed broadly, and may be, for example, either fixed or removable; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

Unless expressly stated or limited otherwise, a first feature being "above" or "below" a second feature may include the first feature and the second feature being in direct contact, or may include the first feature and the second feature not being in direct contact but being in contact with each other by way of additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

The technical scheme of the utility model is further described below by the specific embodiments with reference to the accompanying drawings.

The embodiment provides a network card, as shown in fig. 1-3, the network card includes a circuit board 1 and a heat dissipation component 3, wherein the circuit board 1 is provided with a chip 2, the heat dissipation component 3 is in heat exchange connection with the chip 2, the heat dissipation component 3 includes a plurality of airflow channels 321 arranged along a first direction at intervals, the plurality of airflow channels 321 penetrate through the heat dissipation component 3 along a second direction, the heat dissipation component 3 covers the chip 2, and at least one end of the heat dissipation component 3 extends out of a normal projection of the circuit board 1 along the first direction, and the first direction and the second direction are arranged at an included angle.

When the chip 2 works and heats, heat is transferred to the heat dissipation component 3 and is transferred inside the heat dissipation component 3, so that the temperature of the whole heat dissipation component 3 rises. The fan in the server can blow air into the airflow channel 321, and take away the heat of the heat dissipation component 3 through the flow of the air, so that the chip 2 is cooled. The heat dissipation component 3 of the network card extends out of the normal projection of the circuit board 1 along the first direction, so that the heat dissipation area of the heat dissipation component 3 can be increased on the premise of not increasing the height, and the heat dissipation capacity of the heat dissipation component 3 is improved, so that the network card can work normally with higher power.

It can be understood that the effective area of the heat dissipation assembly 3 when dissipating heat is a projected area along the air flow direction in the server, and the dimensional relationship between the effective area and the heat dissipation assembly 3 in the air flow direction is not great, so that improving the projected area can effectively improve the heat dissipation capability of the heat dissipation assembly 3. That is, when the first direction is perpendicular to the second direction, the arrangement direction of the air flow channels 321 is perpendicular to the extending direction, and the projected area is maximized with the same external dimension, so that the heat dissipation capability of the heat dissipation assembly 3 can be maximized.

As shown in fig. 2 and 4, the network card further includes a fixing plate 4, the fixing plate 4 is fixedly connected with the circuit board 1, and a portion of the heat dissipation assembly 3 extending beyond a normal projection of the circuit board 1 along the first direction is fixedly connected with the fixing plate 4. The radiator module 3 extending beyond the normal projection of the circuit board 1 can be supported and fixed by the fixing piece 71, so that the force of the fixing plate 4 for fixing the radiator module 3 can be shared by the circuit board 1, damage is prevented when the circuit board 1 is used for fixing the oversized radiator module 3, the stability for fixing the radiator module 3 can be improved, and when air flows through the radiator module 3, vibration of the radiator module 3 can be reduced, noise is reduced, and the service life can be prolonged.

Further, a groove 41 is provided at one end of the fixing plate 4, and the circuit board 1 is inserted into the groove 41. The recess 41 can provide the initial location for the equipment of circuit board 1 and fixed plate 4, and after circuit board 1 and fixed plate 4 are fixed, recess 41 can also make circuit board 1 and fixed plate 4 atress jointly, improves the stability of fixed radiator unit 3.

Wherein the groove 41 is provided at a side wall of the fixing plate 4 facing the circuit board 1, and the circuit board 1 is inserted into the groove 41 along the first direction.

Specifically, the fixing plate 4 is made of plastic material, which is light, thin, wear-resistant, and strong in impact resistance, and can protect the heat dissipation assembly 3. As shown in fig. 4, in this embodiment, the side of the fixing plate 4 facing the heat dissipating component 3 and the side facing away from the heat dissipating component 3 are each provided with a reinforcing rib 42, so as to improve the strength of the fixing plate 4 and prevent the fixing plate 4 from being deformed to damage the heat dissipating component 3.

As shown in fig. 1 and 2, the network card further includes a front frame 5, and the fixing plate 4 and the circuit board 1 are fixedly connected with the front frame 5. The front frame 5 is mainly used for fixing the circuit board 1 and the fixing board 4, so that the circuit board 1 and the fixing board 4 are integrated to fix the heat dissipation component 3. Meanwhile, the front frame 5 is also a structure that the network card is fixed with the shell of the server, so that the network card can be prevented from shaking in the server.

Further, the front frame 5 is provided with a heat dissipation hole 51, and one end of the air flow channel 321 faces the heat dissipation hole 51. The gas passing through the heat sink 32 can flow outside the server through the heat dissipation holes 51 of the front frame 5, thereby discharging heat.

As shown in fig. 1 and 2, the network card needs to exchange data with external devices to provide computing or application services for other clients in the network, so that a data interface 11 is further provided on the circuit board 1, and the data interface 11 passes through the front frame 5, so that the external devices are in plug-in fit with the data interface 11. Specifically, the data interface 11 is a 100G dual-port DSFP interface, and the data transmission efficiency is high.

In order to prevent the data interface 11 from being excessively hot due to heat generation, at least part of one end of the air flow path 321 faces the data interface 11. The gas flowing through gas flow channel 321 toward data interface 11 is able to continue to exchange heat with data interface 11, thereby dissipating heat from data interface 11.

As shown in fig. 3, in the present embodiment, the heat dissipation assembly 3 includes a heat conductive plate 31 and a heat dissipation member 32, the heat conductive plate 31 is connected to the chip 2 by heat exchange, the heat conductive plate 31 extends beyond the normal projection of the circuit board 1 along the first direction, and the heat dissipation member 32 is provided with a plurality of airflow channels 321. The heat conducting plate 31 has good heat conductivity, and can conduct heat generated by the chip 2 to the whole heat radiating member 32, so that heat generated by the chip 2 is prevented from being concentrated in a small range, and the heat radiating effect is prevented from being influenced.

Preferably, the heat sink 32 includes a plurality of heat dissipating fins 322 disposed at intervals along the first direction, the heat dissipating fins 322 are connected to the heat conducting plate 31 by heat exchange, and an air flow channel 321 is formed between two adjacent heat dissipating fins 322. The heat-conductive plate 31 can absorb heat of the chip 2 and transfer the heat to the heat-dissipating fins 322, and the plurality of heat-dissipating fins 322 increase the overall heat-dissipating area. When the air flow flows through the air flow channel 321 between two adjacent cooling fins 322, the heat on the cooling fins 322 can be taken away rapidly, so that the cooling fins 322 are cooled, the heat dissipation effect is improved, and the normal operation of the chip 2 is ensured.

Preferably, the heat sink 32 further includes a top plate 323, the plurality of heat dissipating fins 322 are fixedly connected to the top plate 323, and the top plate 323 is spaced from the heat conductive plate 31. The top plate 323 can cover the gas flow channel 321, and the gas flow channel 321 is formed as a channel with only two ends open, so that the gas flow rate is increased, and the heat exchange between the first heat sink 322 and the gas can be more sufficient.

Further, the heat dissipation assembly 3 further includes a heat-conducting adhesive 33, and the heat-conducting adhesive 33 is respectively abutted against the heat-conducting plate 31 and the chip 2. The heat conducting glue 33 has fluidity, after the heat radiating component 3 is fixed on the circuit board 1, the heat conducting plate 31 and the chip 2 extrude the heat conducting glue 33, so that no gap between the heat conducting plate 31 and the heat conducting glue 33 and between the chip 2 and the heat conducting glue 33 can be ensured, thereby improving the heat conducting efficiency, and avoiding the condition that the heat conducting efficiency is influenced due to gaps between abutting surfaces when the heat conducting plate 31 and the chip 2 are directly abutted. In the present embodiment, the heat conductive adhesive 33 is silicone grease.

Specifically, the heat conducting plate 31 includes a plate body 311 and a heat conducting member 312, the heat conducting member 312 is disposed on a side of the plate body 311 facing the heat dissipating member 32, and the heat conducting member 312 abuts against the heat dissipating member 32 and the chip 2. The heat generated by the chip 2 can directly reach the heat conducting member 312 and be diffused to the whole heat dissipating member 32 under the conduction of the heat conducting member 312, so as to ensure that the plurality of heat dissipating fins 322 can all play a role in heat dissipation.

In the present embodiment, the heat conductive plate 31 and the heat conductive member 312 may be made of metal, such as silver, copper, aluminum, or the like, which has good heat conductivity. The heat conducting member 312 may be a heat pipe, which makes full use of the heat conduction principle and the rapid heat transfer property of the phase change medium, and can rapidly transfer heat through the heat pipe, and the heat conducting capability of the heat pipe exceeds that of any known metal. The heat pipe is the prior art and is not described in detail herein.

As shown in fig. 3, the network card further includes a fixing component 7, where the fixing component 7 includes a fixing component 71 and an elastic component 72, the fixing component 71 is fixedly connected with the circuit board 1, and two ends of the elastic component 72 respectively abut against the fixing component 71 and the heat dissipation component 3. The elastic piece 72 can elastically press the heat dissipation assembly 3 against the circuit board 1, so as to prevent the heat dissipation assembly 3 from crushing the chip 2.

In this embodiment, the fixing member 71 is a screw, the elastic member 72 is a spring, the spring is sleeved outside the screw, and two ends of the spring respectively abut against the heat dissipation assembly 3 and the screw cap. The screw passes through the heat dissipation assembly 3 and is in threaded connection with the circuit board 1, and in the process of rotating the screw, the spring is gradually compressed, so that the pressure of the spring to the heat dissipation assembly 3 is gradually increased, thereby protecting the heat dissipation assembly 3 and the chip 2, and preventing the heat dissipation assembly 3 and the chip 2 from being damaged due to hard collision.

As shown in fig. 2, in this embodiment, the network card further includes a protection board 6, where the protection board 6 is fixedly disposed on a side of the circuit board 1 facing away from the chip 2. The circuit board 1 is provided with a lot of electronic components on the side that deviates from chip 2, and the stitch of chip 2 also can pass circuit board 1 and stretch out from the side that deviates from chip 2, and the circuit board 1 does not have such big subassembly of radiator unit 3 on the side that deviates from chip 2, so need to utilize backplate 6 to protect, prevent electronic components or the stitch of chip 2 from interfering with other structures and leading to damaging in dismantling or installation.

The foregoing is merely exemplary of the present utility model, and those skilled in the art should not be considered as limiting the utility model, since modifications may be made in the specific embodiments and application scope of the utility model in light of the teachings of the present utility model.

Claims (10)

1. A network card, comprising:

the circuit board (1), the said circuit board (1) has chips (2);

the heat dissipation assembly (3), the heat dissipation assembly (3) with chip (2) heat transfer is connected, the heat dissipation assembly (3) include along a plurality of air current passageway (321) that first direction interval set up, and is a plurality of air current passageway (321) link up along the second direction heat dissipation assembly (3), heat dissipation assembly (3) cover chip (2), just heat dissipation assembly (3) at least one end is followed first direction extends to outside the normal projection of circuit board (1), first direction with the second direction is the contained angle setting.

2. The network card according to claim 1, further comprising a fixing plate (4), wherein the fixing plate (4) is fixedly connected with the circuit board (1), and wherein the heat dissipating component (3) extends beyond a normal projection of the circuit board (1) along the first direction and is fixedly connected with the fixing plate (4).

3. Network card according to claim 2, characterized in that one end of the fixing plate (4) is provided with a groove (41), and the circuit board (1) is inserted into the groove (41).

4. The network card according to claim 2, further comprising a front frame (5), wherein the fixing plate (4) and the circuit board (1) are fixedly connected with the front frame (5), the front frame (5) is provided with a heat dissipation hole (51), and one end of the air flow channel (321) faces the heat dissipation hole (51).

5. The network card according to claim 4, wherein a data interface (11) is further provided on the circuit board (1), and at least a part of one end of the air flow channel (321) faces the data interface (11).

6. The network card according to claim 1, characterized in that the network card further comprises a guard plate (6), the guard plate (6) being fixedly arranged on the side of the circuit board (1) facing away from the chip (2).

7. The network card according to any one of claims 1 to 6, wherein the heat dissipation assembly (3) comprises a heat conduction plate (31) and a heat dissipation member (32), the heat conduction plate (31) is in heat exchange connection with the chip (2), the heat conduction plate (31) extends beyond a normal projection of the circuit board (1) along the first direction, and the heat dissipation member (32) is provided with a plurality of air flow channels (321).

8. The network card according to claim 7, wherein the heat dissipating member (32) includes a top plate (323) and a plurality of heat dissipating fins (322) disposed on the top plate (323) at intervals along the first direction, the heat dissipating fins (322) are in heat exchange connection with the heat conducting plate (31), and the air flow channel (321) is formed between two adjacent heat dissipating fins (322).

9. The network card according to claim 7, wherein the heat conducting plate (31) comprises a plate body (311) and a heat conducting member (312), the heat conducting member (312) is disposed on a side of the plate body (311) facing the heat dissipating member (32), and the heat conducting member (312) abuts against the heat dissipating member (32) and the chip (2).

10. The network card according to claim 1, further comprising a fixing component (7), wherein the fixing component (7) comprises a fixing piece (71) and an elastic piece (72), the fixing piece (71) is fixedly connected with the circuit board (1), and two ends of the elastic piece (72) are respectively abutted against the fixing piece (71) and the heat dissipation component (3).