TW200520643A - Circuit device - Google Patents

Circuit device

Info

Publication number
TW200520643A
TW200520643A TW093131947A TW93131947A TW200520643A TW 200520643 A TW200520643 A TW 200520643A TW 093131947 A TW093131947 A TW 093131947A TW 93131947 A TW93131947 A TW 93131947A TW 200520643 A TW200520643 A TW 200520643A
Authority
TW
Taiwan
Prior art keywords
circuit device
tongues
shield case
approximately
clearance
Prior art date
Application number
TW093131947A
Other languages
Chinese (zh)
Other versions
TWI287953B (en
Inventor
Hirokazu Okuno
Original Assignee
Sanyo Electric Co
Sanyo Tuner Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co, Sanyo Tuner Ind Co Ltd filed Critical Sanyo Electric Co
Publication of TW200520643A publication Critical patent/TW200520643A/en
Application granted granted Critical
Publication of TWI287953B publication Critical patent/TWI287953B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/2049—Pressing means used to urge contact, e.g. springs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0049—Casings being metallic containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A conventional circuit device has a clearance between a tongue and an upper ceiling of a shield case, from which clearance a circuit board, semiconductor ICs and chip type electronic components are visible. Therefore, circuit device can easily be changed unlawfully, damaged or allows foreign material to enter easily to cause deterioration of quality. The present invention provides a circuit device capable of avoiding the above said problem. The circuit device of this invention has a shield case provided with a plurality of tongues at an upper ceiling and/or bottom thereof for dissipating heat. The tongues are so formed to constitute a plurality a interface lines between the tongues and the shield case surface, the interface lines being in an approximately polygonal shape, approximately circular shape, or approximately elliptic shape. The tongues are formed to extend in a downwards, inclined direction with their tips abutting a heat generating component.
TW93131947A 2003-10-27 2004-10-21 Circuit device TWI287953B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003366603A JP4052995B2 (en) 2003-10-27 2003-10-27 Circuit equipment

Publications (2)

Publication Number Publication Date
TW200520643A true TW200520643A (en) 2005-06-16
TWI287953B TWI287953B (en) 2007-10-01

Family

ID=34510248

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93131947A TWI287953B (en) 2003-10-27 2004-10-21 Circuit device

Country Status (3)

Country Link
JP (1) JP4052995B2 (en)
TW (1) TWI287953B (en)
WO (1) WO2005041628A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108966618A (en) * 2017-05-26 2018-12-07 南宁富桂精密工业有限公司 The electronic device of shielding case and the application shielding case

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011176096A (en) * 2010-02-24 2011-09-08 Mitsumi Electric Co Ltd Electronic apparatus
US9769966B2 (en) * 2015-09-25 2017-09-19 Intel Corporation EMI shielding structure to enable heat spreading and low cost assembly
JP7253048B2 (en) * 2019-05-23 2023-04-05 株式会社ソニー・インタラクティブエンタテインメント Electronics

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2679729B1 (en) * 1991-07-23 1994-04-29 Alcatel Telspace HEATSINK.
JPH1065385A (en) * 1996-08-21 1998-03-06 Mitsubishi Electric Corp Substrate case structure
JP3330893B2 (en) * 1999-02-04 2002-09-30 シャープ株式会社 Heat dissipation structure for electronic components surrounded by a metal housing
DE10026353A1 (en) * 2000-05-27 2001-11-29 Mannesmann Vdo Ag Shielded electronic circuit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108966618A (en) * 2017-05-26 2018-12-07 南宁富桂精密工业有限公司 The electronic device of shielding case and the application shielding case

Also Published As

Publication number Publication date
JP4052995B2 (en) 2008-02-27
JP2005129873A (en) 2005-05-19
TWI287953B (en) 2007-10-01
WO2005041628A1 (en) 2005-05-06

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees