TW200701489A - Elastic bump layout method and its packaging body - Google Patents

Elastic bump layout method and its packaging body

Info

Publication number
TW200701489A
TW200701489A TW094120788A TW94120788A TW200701489A TW 200701489 A TW200701489 A TW 200701489A TW 094120788 A TW094120788 A TW 094120788A TW 94120788 A TW94120788 A TW 94120788A TW 200701489 A TW200701489 A TW 200701489A
Authority
TW
Taiwan
Prior art keywords
metal layer
reconfiguration
elastic base
plural
bottom metal
Prior art date
Application number
TW094120788A
Other languages
Chinese (zh)
Other versions
TWI267993B (en
Inventor
song-ping Lu
Kun-Yung Huang
Original Assignee
Fupo Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fupo Electronics Corp filed Critical Fupo Electronics Corp
Priority to TW94120788A priority Critical patent/TWI267993B/en
Application granted granted Critical
Publication of TWI267993B publication Critical patent/TWI267993B/en
Publication of TW200701489A publication Critical patent/TW200701489A/en

Links

Landscapes

  • Wire Bonding (AREA)

Abstract

This invention relates to an elastic bump layout method performed on a wafer. The plural soldering pads are exposed on the wafer surface and the regions with no soldering pad are planned as the circuit projection regions. The method comprises the following procedures: (a) firstly, it forms a bottom metal layer upon the wafer surface. (b) Further, it forms plural elastic base bodies upon the bottom metal layer inside the circuit projection region such that each elastic base body corresponds to at least one of the soldering pads. (c) Furthermore, it forms a top metal layer to cover the bottom metal layer and the elastic base body. (d) Moreover, it defines the reconfiguration pattern with plural reconfiguration lines on the top metal layer surface, such that one terminal of each reconfiguration line is located on the corresponding elastic base body. The other terminal of each reconfiguration line electrically connects with at least one corresponding soldering pad. (e) Eventually, it removes the top metal layer and the bottom metal layer that are not located on the reconfiguration line.
TW94120788A 2005-06-22 2005-06-22 Elastic bump layout method and its packaging body TWI267993B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94120788A TWI267993B (en) 2005-06-22 2005-06-22 Elastic bump layout method and its packaging body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94120788A TWI267993B (en) 2005-06-22 2005-06-22 Elastic bump layout method and its packaging body

Publications (2)

Publication Number Publication Date
TWI267993B TWI267993B (en) 2006-12-01
TW200701489A true TW200701489A (en) 2007-01-01

Family

ID=38220512

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94120788A TWI267993B (en) 2005-06-22 2005-06-22 Elastic bump layout method and its packaging body

Country Status (1)

Country Link
TW (1) TWI267993B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7928588B2 (en) 2007-05-30 2011-04-19 Au Optronics Corporation Circuit signal connection interface, a manufacture method thereof, and an electronic device using the same
TWI799226B (en) * 2022-04-07 2023-04-11 頎邦科技股份有限公司 Chip-on-film package

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI590215B (en) 2016-07-11 2017-07-01 友達光電股份有限公司 Display panel

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7928588B2 (en) 2007-05-30 2011-04-19 Au Optronics Corporation Circuit signal connection interface, a manufacture method thereof, and an electronic device using the same
US8193082B2 (en) 2007-05-30 2012-06-05 Au Optronics Corporation Circuit signal connection interface
TWI799226B (en) * 2022-04-07 2023-04-11 頎邦科技股份有限公司 Chip-on-film package

Also Published As

Publication number Publication date
TWI267993B (en) 2006-12-01

Similar Documents

Publication Publication Date Title
GB2441265A (en) Method for manufacturing a circuit board structure, and a circuit board structure
EP1662564A4 (en) Semiconductor package and manufacturing method thereof
TW200509331A (en) Semiconductor chip package and method for making the same
TWI264807B (en) Semiconductor package and method for manufacturing the same
TW200802652A (en) Method of forming solder connection portions, method of forming wiring substrate and method of producing semiconductor device
TW200701398A (en) Interconnect structure for integrated circuits
TW200633172A (en) Semiconductor package and method for manufacturing the same
TW200711018A (en) Microfeature assemblies including interconnect structures and methods for forming such interconnect structures
TW200610078A (en) Packaging with metal studs formed on solder pads
SG145777A1 (en) Methods and apparatus for flip-chip-on-lead semiconductor package
GB2438788B (en) Structure and method for fabricating flip chip devices
TW200737536A (en) Bendable solid state planar light source, a flexible substrate therefor, and a manufacturing method therewith
TW200644187A (en) Semiconductor device and method for manufacturing semiconductor device
TW200623382A (en) Electronic package having down-set leads and method
JP2012256741A5 (en)
EP1748476A4 (en) Electrode pad on conductive semiconductor substrate
SG136004A1 (en) Semiconductor constructions having interconnect structures, methods of forming interconnect structures, and methods of forming semiconductor constructions
TW200719419A (en) Wafer structure and method for fabricating the same
TW200701489A (en) Elastic bump layout method and its packaging body
TW200501381A (en) Parasitic capacitance-preventing dummy solder bump structure and method of making the same
TW200644138A (en) Semiconductor device and method for manufacturing same
TW200723972A (en) Circuit board module and forming method thereof
EP1515366A3 (en) Techniques for pad arrangements on circuit chips
US7968984B2 (en) Universal pad arrangement for surface mounted semiconductor devices
TW200735315A (en) Package substrate and the manufacturing method making the same

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees