TW200701489A - Elastic bump layout method and its packaging body - Google Patents
Elastic bump layout method and its packaging bodyInfo
- Publication number
- TW200701489A TW200701489A TW094120788A TW94120788A TW200701489A TW 200701489 A TW200701489 A TW 200701489A TW 094120788 A TW094120788 A TW 094120788A TW 94120788 A TW94120788 A TW 94120788A TW 200701489 A TW200701489 A TW 200701489A
- Authority
- TW
- Taiwan
- Prior art keywords
- metal layer
- reconfiguration
- elastic base
- plural
- bottom metal
- Prior art date
Links
Landscapes
- Wire Bonding (AREA)
Abstract
This invention relates to an elastic bump layout method performed on a wafer. The plural soldering pads are exposed on the wafer surface and the regions with no soldering pad are planned as the circuit projection regions. The method comprises the following procedures: (a) firstly, it forms a bottom metal layer upon the wafer surface. (b) Further, it forms plural elastic base bodies upon the bottom metal layer inside the circuit projection region such that each elastic base body corresponds to at least one of the soldering pads. (c) Furthermore, it forms a top metal layer to cover the bottom metal layer and the elastic base body. (d) Moreover, it defines the reconfiguration pattern with plural reconfiguration lines on the top metal layer surface, such that one terminal of each reconfiguration line is located on the corresponding elastic base body. The other terminal of each reconfiguration line electrically connects with at least one corresponding soldering pad. (e) Eventually, it removes the top metal layer and the bottom metal layer that are not located on the reconfiguration line.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94120788A TWI267993B (en) | 2005-06-22 | 2005-06-22 | Elastic bump layout method and its packaging body |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94120788A TWI267993B (en) | 2005-06-22 | 2005-06-22 | Elastic bump layout method and its packaging body |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI267993B TWI267993B (en) | 2006-12-01 |
TW200701489A true TW200701489A (en) | 2007-01-01 |
Family
ID=38220512
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94120788A TWI267993B (en) | 2005-06-22 | 2005-06-22 | Elastic bump layout method and its packaging body |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI267993B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7928588B2 (en) | 2007-05-30 | 2011-04-19 | Au Optronics Corporation | Circuit signal connection interface, a manufacture method thereof, and an electronic device using the same |
TWI799226B (en) * | 2022-04-07 | 2023-04-11 | 頎邦科技股份有限公司 | Chip-on-film package |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI590215B (en) | 2016-07-11 | 2017-07-01 | 友達光電股份有限公司 | Display panel |
-
2005
- 2005-06-22 TW TW94120788A patent/TWI267993B/en not_active IP Right Cessation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7928588B2 (en) | 2007-05-30 | 2011-04-19 | Au Optronics Corporation | Circuit signal connection interface, a manufacture method thereof, and an electronic device using the same |
US8193082B2 (en) | 2007-05-30 | 2012-06-05 | Au Optronics Corporation | Circuit signal connection interface |
TWI799226B (en) * | 2022-04-07 | 2023-04-11 | 頎邦科技股份有限公司 | Chip-on-film package |
Also Published As
Publication number | Publication date |
---|---|
TWI267993B (en) | 2006-12-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |