CN209861261U - Chip heat dissipation device - Google Patents

Abstract

The utility model provides a chip heat abstractor, including the cover body, heat-conducting part and heat-conducting plate, the upper surface laminating of heat-conducting plate is in on the internal surface of the cover body, the partial surface of heat-conducting part with the heat-conducting plate is laminated mutually, keeping away from of heat-conducting part the partial surface of heat-conducting plate is used for laminating with the radiating surface of the electronic components on the PCB board. The heat conducting part in the shielding case is attached to the heat conducting plate, and the heat conducting plate is attached to the cover body, so that heat can be quickly and uniformly transferred to all positions of the cover body, the purposes of uniform heat dissipation and quick heat dissipation are achieved, and the problems that the heat dissipation is uneven and the heat dissipation is slow due to the fact that the contact area of the heat conducting part and the cover body is limited and the heat conducting coefficient of the shielding case is low are solved.

Description

A chip heat sink

technical field

The utility model relates to the technical field of heat dissipation of electronic components, in particular to a chip heat dissipation device.

Background technique

The development of electronic products is more and more inclined to the direction of thinness, high speed, multi-functional compatibility, high reliability and stability. The interior of electronic products is full of various electronic components, such as CPU, LED, resistors, capacitors and Inductors, etc. These electronic components are covered with shields to prevent electromagnetic interference. Due to the development trend of thinness, high speed and multi-function, a large number of various electronic components must be obtained in a limited space limited by the shield. Good heat dissipation effect to ensure reliable and stable operation of electronic products.

In order to solve the problem of heat dissipation of electronic components, in the prior art, a heat-conducting component is filled between the electronic component and the shielding case, so that the heat generated by the electronic component is conducted to the shielding case through the heat-conducting component, and then dissipated to the outside through the shielding case. However, due to the limited contact area between the thermally conductive components and the shielding cover and the low thermal conductivity of the shielding cover itself (the shielding cover is made of white copper and tinplate), this heat dissipation method still has the problem of not uniform heat dissipation and slow heat dissipation.

Utility model content

The technical problem to be solved by the present invention is to provide a chip heat dissipation device, which can dissipate heat evenly in the shielding case and dissipate heat quickly.

In order to solve the above-mentioned technical problems, the present invention is realized in this way, a chip heat dissipation device includes a cover body, a heat-conducting component and a heat-conducting plate, and the upper surface of the heat-conducting plate is attached to the inner surface of the cover body, so A part of the surface of the heat-conducting component is attached to the heat-conducting plate, and a part of the surface of the heat-conducting component that is far from the heat-conducting plate is used for attaching to the heat dissipation surface of the electronic component on the PCB.

Further, the heat-conducting component is in the shape of a column, the number of heat-conducting components is at least one, the number of the heat-conducting plates is multiple, each heat-conducting component is sandwiched between two adjacent heat-conducting plates, and the upper end surface of the heat-conducting component is attached. on the inner surface of the casing.

Furthermore, the heat-conducting component is in the shape of a column, the upper end surface of the heat-conducting component is provided with a groove, the heat-conducting plate includes a base plate and a convex column, the upper surface of the base plate is attached to the inner surface of the cover body, and the convex The pillars are arranged on the lower surface of the substrate, and the protruding pillars are embedded in the grooves.

Furthermore, the heat-conducting component is in the shape of a column, the heat-conducting plate includes a bottom plate and a convex wall, the upper surface of the bottom plate is attached to the inner surface of the cover body, the convex wall is arranged on the lower surface of the bottom plate, each The thermally conductive member is sandwiched between two adjacent convex walls.

Further, the thermally conductive plate also includes a suspension plate and a wall-mounted plate, between the adjacent convex walls and the hollow areas of the convex walls, and between the adjacent convex walls and the inner side of the cover body. There is at least one said suspension board in each room, and the upper surface of the suspension board is attached to the bottom plate and extends toward the PCB board; the bottom plate is along the inner side wall of the cover body, and then along the The PCB board is extended to form an L-shaped wall-attached board.

Furthermore, all the four sides of the heat-conducting plate have bending portions bent downward, and the outer surface of the bending portion is in contact with the inner surface of the shielding case.

Further, the heat-conducting plate is a copper piece, an aluminum piece, a graphite piece, a nano-copper-carbon piece or a nano-aluminum-carbon piece.

Further, the thermally conductive component is a thermally conductive silicone pad, a thermally conductive silicone grease piece, a graphite piece or a ceramic piece.

Compared with the prior art, the utility model has the beneficial effects that the shielding cover of the utility model comprises a cover body, a heat-conducting part and a heat-conducting plate; In this case, the heat can be transmitted to each position of the cover more quickly and evenly, so as to achieve the purpose of uniform heat dissipation and rapid heat dissipation, and avoid the limited contact area between the thermally conductive components and the cover and the low thermal conductivity of the shield itself. The problem of uneven heat dissipation and slow heat dissipation.

Description of drawings

Fig. 1 is the structural representation of Embodiment 1 of the present utility model;

Fig. 2 is the structural representation of the utility model embodiment 2;

3 is a schematic structural diagram of Embodiment 3 of the present utility model;

4 is a schematic structural diagram of Embodiment 4 of the present utility model;

5 is a schematic structural diagram of Embodiment 5 of the present utility model;

FIG. 6 is a schematic structural diagram of Embodiment 6 of the present invention.

In the drawings, each reference sign denotes:

1. Cover body; 2. Heat-conducting components; 3. Heat-conducting plate; 4. Bending part; 31. Base plate; 100, PCB board; 200, electronic components.

Detailed ways

The following describes in detail the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary, and are intended to be used to explain the present invention, but should not be construed as a limitation of the present invention.

In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inside", "Outside", "Clockwise", "Counterclockwise" etc. The positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation , so it cannot be construed as a limitation of the present invention.

In addition, the terms "first" and "second" are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, a feature defined as "first" or "second" may expressly or implicitly include one or more of that feature. In the description of the present invention, "plurality" means two or more, unless otherwise expressly and specifically defined.

In the present utility model, unless otherwise expressly specified and limited, the terms "installation", "connection", "connection", "fixed" and other terms should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection Connection, or integration; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal communication between the two elements or the interaction relationship between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

In the present invention, unless otherwise expressly specified and limited, a first feature "on" or "under" a second feature may include the first and second features in direct contact, or may include the first and second features The features are not in direct contact but through additional features between them. Also, the first feature being "above", "over" and "above" the second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is level higher than the second feature. The first feature is "below", "below" and "below" the second feature includes the first feature being directly below and diagonally below the second feature, or simply means that the first feature has a lower level than the second feature.

Example 1:

As shown in FIG. 1 , the present embodiment provides a chip heat dissipation device, which includes a cover body 1 , a heat-conducting component 2 and a heat-conducting plate 3 . The upper surface of the heat-conducting plate 3 is attached to the inner surface of the cover body 1 . A part of the surface of the thermally conductive component 2 is attached to the thermally conductive plate 3 , and a part of the surface of the thermally conductive component 2 away from the thermally conductive plate 3 is used for attaching to the heat dissipation surface of the electronic component 200 on the PCB board 100 . The chip heat dissipation device can provide uniform and fast heat dissipation for the electronic components 200 mounted on the PCB board 100 .

The thermally conductive component 2 is preferably a material with good thermal conductivity such as thermally conductive silica gel, thermally conductive silicone grease, graphite or ceramics. Of course, other materials with good thermal conductivity can also be selected.

The heat-conducting plate 3 in this embodiment is a piece, which is attached to the inner surface of the cover body 1, and the attached part may be the upper inner surface of the inner surface of the cover body 1 or the entire inner surface including the inner surface of the side portion. For example, it is attached to the upper part of the inner surface of the cover body 1. In this embodiment, the thermally conductive member 2 is in the shape of a column. Since the electronic component 200 is attached to the thermally conductive member 2, the thermally conductive member 2 is attached to the thermally conductive plate 3, and the thermally conductive plate 3 is attached. It is also attached to the cover body 1, in this way, the heat can be transmitted to various positions of the cover body 1 more quickly and evenly, so as to achieve the purpose of uniform heat dissipation and rapid heat dissipation, and avoid the contact between the thermal conductive component 2 and the cover body 1. The problem of uneven heat dissipation and slow heat dissipation caused by the limited area and the low thermal conductivity of the shield itself. In this embodiment, the cover body 1 is generally made of a metal material with good thermal conductivity and electromagnetic shielding function.

Example 2:

As shown in FIG. 2 , the difference between this embodiment and Embodiment 1 is that the heat-conducting component 2 is in the shape of a column, and the number of the heat-conducting component 2 is at least one (it can be one, two, three, four, or even more). ), the number of the heat-conducting plates 3 is multiple, each heat-conducting component 2 is sandwiched between two adjacent heat-conducting plates 3, and the upper end surface of the heat-conducting component 2 is attached to the inner surface of the cover body 1 . In this embodiment, the heat-conducting component 2 is in contact with the cover body 1 and the heat-conducting plate 3 at the same time, which also achieves the purpose of uniform heat dissipation and rapid heat dissipation.

Example 3:

As shown in FIG. 3 , the difference between this embodiment and Embodiment 1 is that the heat-conducting component 2 is in the shape of a column, and the upper end surface of the heat-conducting component 2 is provided with a groove (because it is fitted with the convex column 32 described below, FIG. (not shown), the thermally conductive plate 3 includes a base plate 31 and protruding posts 32 , the upper surface of the base plate 31 is attached to the inner surface of the cover 1 , and the protruding posts 32 are arranged on the lower part of the base plate 31 . On the surface, the protruding post 32 is embedded in the groove. In this embodiment, the convex posts 32 and the grooves are provided, so that the contact area between the heat-conducting plate 3 and the heat-conducting component 2 is further enlarged, which better achieves the purpose of uniform heat dissipation and faster heat dissipation. The grooves are fitted with each other, so that the heat-conducting plate 3 and the heat-conducting component 2 can always maintain stable contact, and will not be out of contact due to the vibration of the electronic product and the vibration of the electronic component 200, so as to affect the conduction and heat dissipation, and will not be caused by the cover body. 1 Disengagement due to unexpected deformation, which also ensures uniform heat dissipation and faster heat dissipation.

Example 4:

As shown in FIG. 4 , the difference between this embodiment and Embodiment 1 is that the thermally conductive member 2 is in the shape of a column, the thermally conductive plate 3 includes a bottom plate 33 and a convex wall 34 , and the upper surface of the bottom plate 33 is attached to the On the inner surface of the cover body 1 , the protruding walls 34 are disposed on the lower surface of the bottom plate 33 , and each heat conducting component 2 is sandwiched between two adjacent protruding walls 34 .

Since the convex wall 34 is provided in this embodiment, the contact area between the heat-conducting plate 3 and the heat-conducting component 2 is further enlarged, which better achieves the purpose of uniform heat dissipation and rapid heat-dissipation. 2 are interlocked with each other, so that the heat-conducting plate 3 and the heat-conducting component 2 can always maintain stable contact, and will not be out of contact due to the vibration of the electronic product and the vibration of the electronic component 200, so as to affect the conduction and heat dissipation, and will not be caused by the cover body. 1 Disengagement due to unexpected deformation, which also ensures uniform heat dissipation and faster heat dissipation.

Example 5:

As shown in FIG. 5 , the difference between the present embodiment and the embodiment 4 is that the thermal conductive plate 3 further includes a suspension plate 35 and a wall-attached plate 36 , and between the adjacent convex walls 34 and the hollow areas of the convex walls 34 , and At least one suspension plate 35 is provided between the adjacent convex walls 34 and the inner side surface of the cover body 1 (the number of the suspension plates 35 can be one, two or three, etc., which are determined according to actual needs, and are not omitted here. Detailed description), the upper surface of the suspension plate 35 is attached to the bottom plate 33 and extends toward the PCB board 100; the bottom plate 33 extends along the inner side wall of the cover body 1, and then extends along the PCB board 100 to form an L-shaped wall-mounted board 36.

In this embodiment, since the suspension plate 35 is arranged, the heat can be further dissipated into the air; because the wall-attached plate 36 is arranged, the contact area between the heat-conducting plate 3 and the heat-conducting component 2 is further enlarged, which better achieves uniform heat dissipation, The purpose of faster heat dissipation.

Example 6:

As shown in FIG. 6 , the difference between this embodiment and Embodiment 1 is that the heat conducting plate 3 has bending parts 4 that are bent downwards all around, and the outer surface of the bending part 4 is in contact with the inner surface of the shielding cover In this case, the bonding surface of the heat conducting plate 3 and the cover body 1 covers the upper part and the side part of the inner surface of the cover body 1 .

In the above embodiments 1 to 6, the thermal conductive plate 3 is preferably a material with good thermal conductivity such as copper, aluminum, graphite, nano-copper carbon or nano-aluminum carbon; of course, the thermal conductive plate 3 can also use other materials with good thermal conductivity. Alternatively, the heat-conducting plate 3 is directly a conventional metal radiator with regular or irregular shape, and at the same time, the metal radiator can be surface-treated (nano-carbon spraying, anode treatment, electrophoresis, painting and other surface treatment methods) according to actual needs. , but not limited to the above surface treatment).

The above are only preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention shall be included in the present invention. within the scope of protection of the utility model.

Claims (8)

1. The chip heat dissipation device is characterized by comprising a cover body (1), a heat conduction part (2) and a heat conduction plate (3), wherein the upper surface of the heat conduction plate (3) is attached to the inner surface of the cover body (1), part of the surface of the heat conduction part (2) is attached to the heat conduction plate (3), and part of the surface of the heat conduction part (2) far away from the heat conduction plate (3) is used for being attached to the heat dissipation surface of an electronic component (200) on a PCB (100).

2. The chip heat sink according to claim 1, wherein the heat conducting member (2) has a cylindrical shape, the number of the heat conducting members (2) is at least one, the number of the heat conducting plates (3) is plural, each heat conducting member (2) is sandwiched between two adjacent heat conducting plates (3), and an upper end surface of the heat conducting member (2) is attached to an inner surface of the cover (1).

3. The heat sink according to claim 1, wherein the heat conducting member (2) is cylindrical, a groove is formed on an upper end surface of the heat conducting member (2), the heat conducting plate (3) comprises a substrate (31) and a protruding pillar (32), an upper surface of the substrate (31) is attached to an inner surface of the housing (1), the protruding pillar (32) is disposed on a lower surface of the substrate (31), and the protruding pillar (32) is embedded in the groove.

4. The heat sink according to claim 1, wherein the heat conducting members (2) are in a cylindrical shape, the heat conducting plate (3) includes a bottom plate (33) and convex walls (34), an upper surface of the bottom plate (33) is attached to an inner surface of the housing (1), the convex walls (34) are disposed on a lower surface of the bottom plate (33), and each heat conducting member (2) is sandwiched between two adjacent convex walls (34).

5. The chip heat sink according to claim 4, wherein the heat conducting plate (3) further comprises a suspension plate (35) and an attachment plate (36), at least one suspension plate (35) is disposed between the hollow areas of the adjacent protruding walls (34) and between the adjacent protruding walls (34) and the inner side of the cover body (1), and the upper surface of the suspension plate (35) is attached to the bottom plate (33) and extends toward the PCB (100); the bottom plate (33) extends along the inner side wall of the cover body (1) and the upper surface of the PCB (100) to form an L-shaped pasting plate.

6. The heat sink according to claim 1, wherein the heat conducting plate (3) has a bent portion (4) bent downward around the periphery thereof, and the outer surface of the bent portion (4) is attached to the inner surface of the shielding case.

7. The chip heat sink according to any of claims 1 to 6, wherein the thermally conductive plate (3) is a copper piece, an aluminum piece, a graphite piece, a nano-copper carbon piece, a nano-aluminum carbon piece or a ceramic piece.

8. The chip heat sink according to any one of claims 1 to 6, wherein the heat conducting member (2) is a heat conducting silicone pad, a heat conducting silicone grease member, a graphite member, or a ceramic member.