CN218417081U - Radiator, semiconductor power assembly and electronic product - Google Patents
Radiator, semiconductor power assembly and electronic product Download PDFInfo
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- CN218417081U CN218417081U CN202222101965.2U CN202222101965U CN218417081U CN 218417081 U CN218417081 U CN 218417081U CN 202222101965 U CN202222101965 U CN 202222101965U CN 218417081 U CN218417081 U CN 218417081U
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Abstract
The utility model discloses a radiator, semiconductor power component and electronic product, wherein, the power device is applied to the radiator, and the radiator is formed with the installation face including heat dissipation main part, insulating heat-conducting layer and heat conduction adhesive linkage, heat dissipation main part, and insulating heat-conducting layer is scribbled and is located the installation face, and the one side that deviates from the installation face is located to the heat conduction adhesive linkage scribbled to the insulating heat-conducting layer, and the one side that the heat conduction adhesive linkage deviates from insulating heat-conducting layer still is used for bonding the power device. The utility model discloses a form insulating heat-conducting layer and heat conduction adhesive linkage in the heat dissipation main part to can fix the power device at the heat conduction adhesive linkage, reduce the space that fixed power device needs, realize the small size installation of power device.
Description
Technical Field
The utility model relates to an electronic product technical field, in particular to radiator, semiconductor power component and electronic product.
Background
Among the correlation technique, high-voltage power device is too high because of the heat that its during operation produced, can adopt extra radiator to dispel the heat usually, need increase insulating heat conduction measure between high-voltage power device and the radiator, in order to obtain better radiating effect simultaneously, need make high-voltage power device fix on the radiator, and the heat conduction insulation measure of commonly used has: the heat radiator has one ceramic substrate and silicone grease on the casing, or one heat conducting insulating film on the casing, and the related technology adopts screw and pressing strip or single screw and single pressing strip to fix the high voltage power device and the heat radiator together. The high-voltage power tube needs extra auxiliary fixing measures in the assembling process, occupies larger space and is not beneficial to the miniaturization design of products.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a main objective forms insulating heat-conducting layer and heat conduction adhesive linkage in the heat dissipation main part to can fix the power device at the heat conduction adhesive linkage, reduce the space that fixed power device needs, realize the small size installation of power device.
In order to achieve the above object, the utility model provides a heat radiator is applied to power device, the heat radiator includes:
the heat dissipation device comprises a heat dissipation body, a first heat dissipation body and a second heat dissipation body, wherein the heat dissipation body is provided with a mounting surface;
the insulating heat conduction layer is coated on the mounting surface; and
the heat conduction adhesive layer is coated on one surface, deviating from the mounting surface, of the insulating heat conduction layer, and the surface, deviating from the insulating heat conduction layer, of the heat conduction adhesive layer is also used for bonding the power device.
In an embodiment of the present application, the material of the thermal conductive adhesive layer is one of silicone, polyurethane, or acrylic.
In an embodiment of the present application, the material of the insulating and heat conducting layer is one of epoxy resin and polyurethane.
In an embodiment of the present application, a thickness of the thermal conductive adhesive layer is defined as a, and satisfies a relationship: a is more than or equal to 0.04mm and less than or equal to 0.06mm.
In an embodiment of the present application, the adhesion strength of the thermal conductive adhesive layer is defined as B, and satisfies the relationship: b is more than or equal to 1Mpa.
In an embodiment of the present application, an insulation strength of the insulating and heat conducting layer is defined as C, and satisfies a relationship: c is more than or equal to 40KV/mm.
In an embodiment of the present application, a thickness of the insulating and heat conducting layer is defined as D, and satisfies a relationship: d is more than or equal to 0.04mm and less than or equal to 0.06mm.
In an embodiment of the present application, the heat dissipation main body includes a main body plate and heat dissipation fins, the heat dissipation fins are disposed on one surface of the main body plate, and a mounting surface is formed on one side of the main body plate away from the heat dissipation fins.
The utility model also provides a semiconductor power component, including power device and foretell radiator, power device locates the heat conduction adhesive linkage deviates from the one side of radiator.
The utility model also provides an electronic product, including foretell semiconductor power component.
In the radiator of this application, the radiator includes heat dissipation main part, insulating heat-conducting layer and heat conduction adhesive linkage, and the heat dissipation main part is formed with the installation face, and the installation face is scribbled to insulating heat-conducting layer, through scribbling insulating heat-conducting layer and establishing in the installation face, can play insulating heat-conducting's effect. Through the processes of screen printing, steel mesh printing, spraying and the like, a layer of insulating heat conduction material can be coated on the mounting surface of the radiator; the insulating heat conduction material can form a compact insulating heat conduction layer on the mounting surface of the radiator through fixing modes such as heating curing, natural curing, moisture absorption curing, UV curing and the like. The heat-conducting bonding layer is coated on one surface, away from the mounting surface, of the insulating heat-conducting layer, the heat-conducting bonding material is printed on one surface, away from the mounting surface, of the formed insulating heat-conducting layer by adopting the processes of silk-screen printing, steel mesh printing, spraying and the like on the insulating heat-conducting layer which is solidified into a film, so that the power device can be fixed on the heat-radiating main body through the heat-conducting bonding layer, and the structural stability of the power device and the heat-radiating main body in connection is improved; meanwhile, the insulating heat conduction layer and the heat conduction bonding layer play roles of insulation and heat conduction at the same time, and normal heat dissipation of the power device during working is guaranteed. The radiator of this application does not need other auxiliary mounting spare, just can accomplish through the heat conduction adhesive linkage with power device's being connected, has reduced the space that fixed power device needs, has realized power device's small size installation.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a semiconductor power module according to an embodiment of the present invention;
FIG. 2 is an enlarged view of a portion of FIG. 1 at A;
fig. 3 is a schematic structural diagram of an embodiment of the heat sink of the present invention.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 1000 | |
15 | |
| 100 | |
30 | Insulating heat-conducting |
| 10 | Heat radiation |
50 | Thermally conductive |
| 11 | |
300 | |
| 13 | Heat radiation fin |
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that all the directional indicators (such as upper, lower, left, right, front, and rear … …) in the embodiments of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit ly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
The utility model provides a radiator 100, be applied to power device 300, radiator 100 includes heat dissipation main part 10, insulating heat-conducting layer 30 and heat conduction adhesive linkage 50, and heat dissipation main part 10 is formed with installation face 15, and insulating heat-conducting layer 30 scribbles and is established in installation face 15; the heat-conducting adhesive layer 50 is coated on one surface of the insulating and heat-conducting layer 30, which is away from the mounting surface 15, and the surface of the heat-conducting adhesive layer 50, which is away from the insulating and heat-conducting layer 30, is also used for adhering the power device 300.
In the heat sink 100 of the present application, the heat sink 100 includes a heat dissipation body 10, an insulating and heat conducting layer 30, and a heat conducting adhesive layer 50, the heat dissipation body 10 is formed with a mounting surface 15, the insulating and heat conducting layer 30 is coated on the mounting surface 15, and the insulating and heat conducting layer 30 is coated on the mounting surface 15, so that the insulating and heat conducting function can be performed. Through the processes of screen printing, steel mesh printing, spraying and the like, a layer of insulating heat conduction material can be coated on the mounting surface 15 of the heat sink 100; the insulating and heat conducting material can form a compact insulating and heat conducting layer 30 on the mounting surface 15 of the heat sink 100 by fixing methods such as heating curing, natural curing, moisture absorption curing, UV curing and the like. The heat-conducting adhesive layer 50 is coated on one surface of the insulating and heat-conducting layer 30, which is far away from the mounting surface 15, and a layer of heat-conducting adhesive material is printed on one surface of the formed insulating and heat-conducting layer 30, which is far away from the mounting surface 15, by adopting the processes of screen printing, steel mesh printing, spraying and the like on the insulating and heat-conducting layer 30 which is solidified into a film, so that the power device 300 can be fixed on the heat-dissipating main body 10 through the heat-conducting adhesive layer 50, and the structural stability of the power device 300 and the heat-dissipating main body 10 in connection is improved; meanwhile, the insulating heat conduction layer 30 and the heat conduction adhesive layer 50 play roles of insulation and heat conduction at the same time, and normal heat dissipation of the power device 300 during working is guaranteed. The radiator 100 of the application does not need other auxiliary installation parts, can be connected with the power device 300 through the heat conduction adhesive layer 50, reduces the space required by fixing the power device 300, and realizes small-volume installation of the power device 300.
Referring to fig. 1 to 3, in an embodiment of the present application, the thermal adhesive layer 50 is made of silicon gel.
Silica gel's adsorption affinity is strong, and the heat conductivility is good, have certain insulating properties, so in this embodiment with the optional silica gel of the material of heat conduction adhesive linkage 50, heat conduction adhesive linkage 50 is when can fixed connection power device 300 promptly, also can make the heat that its produced can pass to radiator 100 to carry out timely heat dissipation.
Referring to fig. 1 to 3, in an embodiment of the present application, the thermal adhesive layer 50 is made of polyurethane.
The insulation strength of the polyurethane is high, the adhesive property and the heat conductivity are high, and the material of the heat conductive adhesive layer 50 in this embodiment may be selected from polyurethane, that is, the heat conductive adhesive layer 50 can be fixedly connected to the power device 300, and at the same time, the heat generated by the heat conductive adhesive layer can be transferred to the heat sink 100, so as to dissipate the heat in time.
Referring to fig. 1 to 3, in an embodiment of the present application, the thermal adhesive layer 50 is made of acrylic.
The acrylic acid has high insulating strength, high adhesive property and high heat conductivity, and the material of the heat conductive adhesive layer 50 in this embodiment may be selected to be acrylic acid, that is, the heat conductive adhesive layer 50 can be fixedly connected to the power device 300, and at the same time, the heat generated by the heat conductive adhesive layer can be transferred to the heat sink 100 to dissipate heat timely.
It should be noted that the material of the heat conductive adhesive layer 50 may also be a material with good adhesive property, heat conductive property and insulating property, and is not limited herein.
Referring to fig. 1 to fig. 3, in an embodiment of the present application, the material of the insulating and heat conducting layer 30 is epoxy resin.
The epoxy resin has high insulating strength, good puncture resistance, high insulating property, high structural strength, good sealing property, good heat resistance and good electrical insulation property, so the material of the insulating and heat conducting layer 30 in the embodiment can be selected from the epoxy resin.
Referring to fig. 1 to 3, in an embodiment of the present application, the material of the insulating and heat conducting layer 30 is polyurethane.
The polyurethane has high insulation strength, good puncture resistance, high insulation performance, high structural strength, good sealing performance, good heat resistance and good electrical insulation, so the material of the insulating and heat conducting layer 30 in the embodiment can be selected from polyurethane.
In other embodiments of the present application, the material of the insulating and heat conducting layer 30 may also be heat-resistant, and the insulating strength of the insulating and heat conducting layer is within the range of the insulating strength of the present application, which is not limited herein.
Referring to fig. 1 to 3, in an embodiment of the present application, a thickness of the thermal conductive adhesive layer 50 is defined as a, and satisfies a relationship: a is more than or equal to 0.04mm and less than or equal to 0.06mm.
The thickness of the thermal conductive adhesive layer 50 ranges from 0.04mm to 0.06mm, for example, the thickness of the thermal conductive adhesive layer 50 may be 0.04mm, 0.041mm, 0.043mm, 0.047mm, 0.05mm, 0.055mm, 0.059mm, or 0.06mm, or may be any value within the thickness range, when the thickness of the thermal conductive adhesive layer 50 is within the range, a better thermal conductivity may be obtained, and the heat generated by the power device 300 may be transferred to the heat sink 100 to dissipate the heat of the power device 300 in time. In this embodiment, the thickness of the thermal adhesive layer 50 may be 0.05mm.
Referring to fig. 1 to 3, in an embodiment of the present application, the bonding strength of the thermal conductive adhesive layer 50 is defined as B, and satisfies the relationship: b is more than or equal to 1Mpa.
The range of the bonding strength of the heat conductive adhesive layer 50 is 1Mpa or more, for example, the bonding strength of the heat conductive adhesive layer 50 may be 1Mpa, 2Mpa, 3Mpa, 4Mpa, 5Mpa, 6Mpa, 7Mpa, or 8Mpa, or may be any value within the range of the bonding strength, and when the bonding strength of the heat conductive adhesive layer 50 is within the range, the power device 300 may be better fixed on the heat conductive adhesive layer 50, thereby improving the stability of the connection between the power device 300 and the heat sink 100.
In this embodiment, the heat conductive adhesive layer 50 may be a two-component mixture curing, or a one-component heat curing or moisture absorption curing, which is not limited herein.
Referring to fig. 1 to 3, in an embodiment of the present application, the dielectric strength of the thermally and electrically conductive layer 30 is defined as C, and satisfies the relationship: c is more than or equal to 40KV/mm.
The range of the insulation strength of the insulating and heat conducting layer 30 is greater than or equal to 40KV/mm, for example, the insulation strength of the insulating and heat conducting layer 30 may be 40KV/mm, 41KV/mm, 42KV/mm, 45KV/mm, 50KV/mm, 70KV/mm, 75KV/mm, 80KV/mm, or may be any value within the range of the insulation strength, when the insulation strength of the insulating and heat conducting layer 30 is within the range, the insulating and heat conducting layer 30 may have a better ability to resist electrical breakdown, and the puncture resistance is also better.
Referring to fig. 1 to 3, in an embodiment of the present application, a thickness D of the insulating and heat conducting layer 30 is defined to satisfy the relationship: d is more than or equal to 0.04mm and less than or equal to 0.06mm.
The thickness of the insulating and heat conducting layer 30 ranges from 0.04mm to 0.06mm, for example, the thickness of the insulating and heat conducting layer 30 may be 0.04mm, 0.045mm, 0.047mm, 0.049mm, 0.05mm, 0.053mm, 0.058mm, 0.06mm, or any value in the thickness range, and when the thickness of the insulating and heat conducting layer 30 is within the range, the insulating property and the heat conducting property of the insulating and heat conducting layer 30 may be better, so that the heat dissipation of the power device 300 may be better. Of course, if the thermal conductivity is further improved, the thickness of the insulating and heat conducting layer may be increased, and the insulating strength of the insulating and heat conducting layer may also be reduced, which is not described in detail herein.
Meanwhile, an insulating material is coated on the mounting surface 15 of the heat dissipation main body 10, a compact insulating heat conduction layer 30 is formed after curing, the coating cost of the insulating heat conduction layer 30 is low because the formed insulating heat conduction layer 30 is thin, the heat conduction adhesive layer 50 printed on the insulating heat conduction layer 30 generates a cross-linking reaction under the heating or moisture absorption condition, no additional fixing piece is needed, the connection between the power device 300 and the radiator 100 can be completed, the mounting step of the power device 300 is simplified, and the assembly cost of the power device 300 can be reduced.
Referring to fig. 1 to 3, in an embodiment of the present application, the heat dissipation body 10 includes a body plate 11 and heat dissipation fins 13, the heat dissipation fins 13 are disposed on one surface of the body plate 11, and a mounting surface 15 is formed on one side of the body plate 11 away from the heat dissipation fins 13.
The heat dissipation area of the heat dissipation body 10 can be enlarged by arranging the heat dissipation fins 13, the heat dissipation effect is good, the heat dissipation speed is high, and the material of the heat dissipation fins 13 can be aluminum or copper, which is not limited herein.
The utility model also provides a semiconductor power module 1000, including power device 300 and foretell radiator 100, power device 300 locates the one side that heat conduction adhesive linkage 50 deviates from radiator 100. The semiconductor power module 1000 in the present application may be an electronic device such as a rectifier, an oscillator, a light emitter, or the like. The specific structure of the heat sink 100 refers to the above embodiments, and since the semiconductor power module 1000 adopts all technical solutions of all the above embodiments, at least all the beneficial effects brought by the technical solutions of the above embodiments are achieved, and no further description is given here.
The utility model discloses still provide an electronic product, including foretell semiconductor power module 1000, semiconductor power module 1000's specific structure refers to above-mentioned embodiment, because this electronic product has adopted the whole technical scheme of above-mentioned all embodiments, consequently has all beneficial effects that the technical scheme of above-mentioned embodiment brought at least, and the repeated description is no longer given here.
The above only is the preferred embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structure changes made by the contents of the specification and the drawings under the inventive concept of the present invention, or the direct/indirect application in other related technical fields are included in the patent protection scope of the present invention.
Claims (10)
1. A heat sink applied to a power device, the heat sink comprising:
a heat dissipating body formed with a mounting surface;
the insulating heat conduction layer is coated on the mounting surface; and
the heat conduction adhesive layer is coated on one surface, deviating from the mounting surface, of the insulating heat conduction layer, and the surface, deviating from the insulating heat conduction layer, of the heat conduction adhesive layer is also used for bonding the power device.
2. The heat sink as claimed in claim 1, wherein the thermally conductive adhesive layer is made of one of silicone, polyurethane, or acrylic.
3. The heat sink of claim 1, wherein the insulating and heat conducting layer is made of one of epoxy resin and polyurethane.
4. The heat sink of claim 1, wherein the thermally conductive adhesive layer is defined to have a thickness a that satisfies the relationship: a is more than or equal to 0.04mm and less than or equal to 0.06mm.
5. The heat sink of claim 1, wherein the bond strength of the thermally conductive adhesive layer is defined as B, satisfying the relationship: b is more than or equal to 1Mpa.
6. The heat sink of claim 1, wherein the dielectric strength of the insulating and heat conducting layer is defined as C, and the relationship: c is more than or equal to 40KV/mm.
7. The heat sink of claim 1, wherein the thickness of the insulating and heat conducting layer is defined as D, and satisfies the relationship: d is more than or equal to 0.04mm and less than or equal to 0.06mm.
8. The heat sink according to any one of claims 1 to 7, wherein the heat dissipating body comprises a body plate and heat dissipating fins, the heat dissipating fins are disposed on one surface of the body plate, and a mounting surface is formed on one side of the body plate away from the heat dissipating fins.
9. A semiconductor power module comprising a power device and a heat sink according to any one of claims 1 to 8, the power device being provided on a side of the thermally conductive adhesive layer facing away from the heat sink.
10. An electronic product comprising the semiconductor power module according to claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222101965.2U CN218417081U (en) | 2022-08-10 | 2022-08-10 | Radiator, semiconductor power assembly and electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222101965.2U CN218417081U (en) | 2022-08-10 | 2022-08-10 | Radiator, semiconductor power assembly and electronic product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218417081U true CN218417081U (en) | 2023-01-31 |
Family
ID=85026103
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222101965.2U Active CN218417081U (en) | 2022-08-10 | 2022-08-10 | Radiator, semiconductor power assembly and electronic product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218417081U (en) |
-
2022
- 2022-08-10 CN CN202222101965.2U patent/CN218417081U/en active Active
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