KR20170010179A - Heatsink comprising electro conductive push pin - Google Patents

Heatsink comprising electro conductive push pin Download PDF

Info

Publication number
KR20170010179A
KR20170010179A KR1020150100609A KR20150100609A KR20170010179A KR 20170010179 A KR20170010179 A KR 20170010179A KR 1020150100609 A KR1020150100609 A KR 1020150100609A KR 20150100609 A KR20150100609 A KR 20150100609A KR 20170010179 A KR20170010179 A KR 20170010179A
Authority
KR
South Korea
Prior art keywords
heat sink
push pin
heat
push pins
head portion
Prior art date
Application number
KR1020150100609A
Other languages
Korean (ko)
Other versions
KR101723499B1 (en
Inventor
이용덕
Original Assignee
주식회사 테인엘티에스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 테인엘티에스 filed Critical 주식회사 테인엘티에스
Priority to KR1020150100609A priority Critical patent/KR101723499B1/en
Publication of KR20170010179A publication Critical patent/KR20170010179A/en
Application granted granted Critical
Publication of KR101723499B1 publication Critical patent/KR101723499B1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The present invention relates to heat sink comprising push pins made of an electrically conductive material. The heat sink comprising push pins made of an electrically conductive material according to the present invention comprises: a heat-sink unit which comes into contact with a semiconductor part installed on a PCB substrate, and which transfers heat generated by the semiconductor part; and push pins which couple the heat-sink unit to the PCB substrate. In this case, the push pins comprise pressure portions adapted to have a predetermined area, head portions adapted to be inserted into insertion openings formed in the heat-sink unit, and connection portions adapted to connect the pressure portions to the head portions. Furthermore, portions of the heat-sink unit in which the push pins are installed are formed to be recessed, the push pins are installed in the recessed portions with springs disposed between the push pins and the recessed portions, and the push pins are made of an electrically conductive material. According to the present invention, an antenna effect attributable to the heat sink can be eliminated. The heat sink has a simple structure, thereby facilitating production. Furthermore, the heat sink can be easily installed on the PCB substrate, thereby improving usability.

Description

HEATSINK COMPRISING ELECTRO CONDUCTIVE PUSH PIN [0002]

The present invention relates to a heat sink, and more particularly, to a heat sink that includes an electrically conductive push pin that can be easily installed on a PCB substrate, thereby improving assembling performance on a PCB substrate and eliminating an antenna effect generated in the heat sink And a push pin of an electrically conductive material.

The heat sink refers to a cooling device for absorbing heat from an electronic component or a memory device to dissipate heat to the outside.

The interior of a computer or digital TV includes components that generate heat, such as a central processing unit (CPU) or a graphics card, that are essential to its operation.

Such heat generating parts generate a lot of heat by themselves when power is supplied and operated.

If the generated heat is left untreated, the performance of the component itself may deteriorate, the service life may be shortened, and the operation may be stopped in severe cases.

Therefore, by providing a heat dissipating device on the heat-generating components as described above, the temperature of the heat-generating component is not raised to a certain level or more.

In recent years, as the speed of technology development has rapidly increased, the performance of industrially available products has been greatly improved, and the size of the product has become very compact. As the performance of a device such as a digital TV develops, .

In order to effectively dissipate the semiconductor components, heat sinks made of copper (Cu) or aluminum (Al), which are excellent in thermal conductivity, have been released. Such a heat sink is configured to diffuse heat to a large area and discharge it to the outside.

However, when the heat sink is installed inside the digital device, electric noise is transmitted through the heat sink made of a metal material, and this phenomenon is referred to as an antenna effect.

Such an antenna effect must be removed because it may disturb the signal of the digital device or be harmful to the human body.

Conventionally, EMI (Electro Magnetic Interference) bumpers have been mainly used to eliminate the antenna effect of the heat sink.

That is, the heat sink is fixed on the PCB substrate while the EMI bumper is placed between the heat sink and the PCB substrate, and the electrical noise generated in the heat sink is transmitted to the PCB board through the EMI bumper, which is an electrical conductor, .

However, since the EMI bumper has a certain elasticity, the EMI bumper disposed between the PCB substrate and the heat sink receives a force to continuously lift the heat sink.

With this state, the heat sink may be lifted from the initial position with the passage of time. In this case, the heat sink may not completely adhere to the surface of the semiconductor component and may be spaced apart.

The heat transfer efficiency is proportional to the size of the contact area. When the heat sink is spaced from the surface of the semiconductor component as described above, heat generated from the semiconductor component can not be smoothly discharged to the outside through the heat sink.

In order to solve the above problems, when the heat sink is fixed on the PCB of the PCB using a spring having a strong elasticity, there is a problem that the PCB of the PCB having the heat sink is locally bent due to the elastic force of the spring.

It is an object of the present invention to provide a heat sink including an electrically conductive push pin configured to eliminate an antenna effect caused by a heat sink.

It is still another object of the present invention to provide a heat sink including an electrically conductive push pin configured to be simple in structure and easy to install on a PCB.

According to an aspect of the present invention, there is provided a heat sink including a push pin of an electrically conductive material, the heat sink including a heat sink portion contacting a semiconductor semiconductor component provided on a PCB substrate and receiving heat generated from the semiconductor component, The push pin includes a pressing portion having an area of a predetermined size, a head portion inserted into the insertion opening formed in the heat sink portion, and a pressing portion connecting the pressing portion and the head portion Wherein the push pin is formed in a concave shape in which the push pin is installed in the heat sink portion, the push pin is installed in the push pin mounting portion via a spring, the push pin is electrically conductive And is made of a material.

Preferably, the semiconductor contact portion contacting the semiconductor component in the heat sink portion is concave.

Here, the head portion may be configured to have a narrower width toward the lower end of the side end surface.

Preferably, the pressing portion, the head portion, and the connecting portion are integrally formed, and a cut portion is formed in the head portion and the connecting portion.

In addition, contact protrusions may be formed on the connection portion.

Here, the connection section may be formed so that the width on the side surface becomes wider as it goes downward from the center in the height direction.

Preferably, the heat sink portion is formed of aluminum or an aluminum alloy, and a black coating portion is formed on the surface.

According to the present invention, the antenna effect by the heat sink can be eliminated.

Further, since the structure of the push pin is simple, it is easy to manufacture, and the heat sink can be easily mounted on the PCB of the PCB through the push pin, so that the workability can be improved.

BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.
1 is a perspective view of a heat sink including an electrically conductive push pin according to the present invention,
FIG. 2 is a partial perspective view of a push pin mounting portion provided with a push pin in the heat sink,
3 is a front view of the push pin,
4 is a side cross-sectional view of the heat sink mounted on the PCB.

Hereinafter, the configuration of the present invention will be described in detail with reference to the accompanying drawings.

Prior to this, the terms used in the specification and claims should not be construed in a dictionary sense, and the inventor may, on the principle that the concept of a term can be properly defined in order to explain its invention in the best way And should be construed in light of the meanings and concepts consistent with the technical idea of the present invention.

Therefore, the embodiments shown in the present specification and the drawings are only exemplary embodiments of the present invention, and not all of the technical ideas of the present invention are presented. Therefore, various equivalents It should be understood that water and variations may exist.

FIG. 1 is a perspective view of a heat sink including an electrically conductive push pin according to the present invention, FIG. 2 is a partial perspective view of a push pin installation portion provided with a push pin in the heat sink, FIG. 3 is a front view of the push pin, And Fig. 4 is a side cross-sectional view of the heat sink mounted on the PCB.

1 to 4, a heat sink including an electrically conductive push pin according to the present invention contacts a semiconductor component 110 provided on a PCB substrate 100 to transmit heat generated from the semiconductor component 110 And a push pin (20) for connecting the heat sink part (10) to the PCB substrate (100), wherein the push pin (20) A head portion 24 inserted into the insertion opening 13 formed in the heat sink portion 10 and a connecting portion 26 connecting the pressing portion 22 and the head portion 24, Wherein the push pin installation portion of the heat sink portion 10 is formed with a recess 14 and the push pin 20 is connected to the push pin installation portion via a spring 30, (14), and the push pin (20) is formed of an electrically conductive material.

The heat sink unit 10 is disposed on the semiconductor component 110 mounted on the PCB substrate 100 and receives heat generated from the semiconductor component 110 and discharges the heat to the outside.

The heat sink part 10 is formed in a thin plate shape using a metal such as aluminum or an aluminum alloy and the semiconductor contact part 12 which is in contact with the semiconductor part 110 is formed to be somewhat recessed

In the heat sink unit 10 according to the present invention, a coating layer 16 is formed on the surface, and the coating layer 16 is formed in black.

Thus, a black coating layer is formed on the surface of the heat sink portion 10 while heat transfer is conducted through the heat sink portion 10 formed of a metal material such as aluminum, Thereby increasing the emission efficiency.

As the coating layer 16, black synthetic resin such as polyethylene, silicone or a paint using an inorganic material may be used.

Also, the push pin mounting portion 14 on which the push pin 20 is mounted is also concavely recessed in the heat sink portion 10.

The push pin 20 is inserted into the push pin mounting portion 14 through the spring 30 in a state in which the push pin mounting portion 14 in which the push pin 20 is installed is concavely recessed, Respectively.

The lower end of the head portion 24 of the push pin 20 is positioned below the semiconductor contact portion 20 while minimizing the height at which the push portion 22 of the push pin 20 protrudes from the upper surface of the heat sink portion 10. [ 12 projecting downwardly from the bottom surface.

The head portion 24 is disposed in the fastening opening formed in the PCB substrate 100 in a state where the push pin 20 is mounted to the heat sink portion 10 via the spring 30, The head portion 24 is inserted into the fastening opening by pressing the pressing portion 22 so that the heat sink portion 10 is coupled onto the PCB.

The lower end of the head portion 24 protrudes downward from the bottom surface of the semiconductor contact portion 12 to sense the position of the fastening opening formed on the PCB substrate 100 through the head portion 24 sensibly can do.

That is, when the heat sink unit 10 is fastened to the PCB substrate 100, the heat sink unit 10 itself visually obscures the fastening openings. If the lower end of the head unit 24 contacts the semiconductor contact 100, It is difficult to accurately insert the head portion 24 into the fastening opening in a situation where the fastening opening formed on the PCB substrate 100 is not seen unless the fastening portion is formed so as to protrude downward from the bottom surface of the head portion 12, Which makes it difficult to connect the sink portion 10 to the PCB substrate 100.

Therefore, the lower end portion of the head portion 24 protrudes downward from the bottom surface of the semiconductor contact portion 12, so that it can be visually recognized by the sense transmitted through the head portion 24 without confirming the fastening opening The position of the fastening opening can be confirmed and combined.

Here, the head portion 24 is formed to have a somewhat sharp shape so that the width of the head portion 24 becomes narrower toward the lower end portion of the side end surface so that the head portion 24 can be easily coupled to the fastening opening formed in the PCB.

At this time, the head portion 24 and the connection portion 26 are formed with a cut-out portion 23 so that the head portion 24 can be slightly deformed and inserted easily in the process of inserting the head portion 24 into the fastening opening.

The pressing portion 22, the head portion 24 and the connecting portion 26 are integrally formed using a synthetic resin material. The head portion 24 and the connecting portion 26 have a substantially triangular cutout portion 23 are formed, and as a result, the thickness of the head portion 24 and the lower portion of the connecting portion 26 is reduced.

Thus, when the head portion 24 is inserted into the fastening opening, the portion where the cut-out portion 23 is formed can be easily deformed and inserted.

Further, after the head portion 24 is inserted into the fastening opening, the portion where the cut-out portion 23 is formed is returned to its original shape, so that the head portion 24 does not come off from the fastening opening of the PCB.

A contact protrusion 28 is formed in the connection portion 26 connecting the pressing portion 22 and the head portion 24 and is in contact with the spring 30 through the contact protrusion 28.

3, the contact protrusion 28 protrudes upward from the central portion of the connection portion 26 in the form of a protrusion for elastic contact between the connection portion 26 and the spring 30, And the connecting portion 26 is configured to be in contact with the spring 30 through the contact protrusion 28.

Further, as shown in FIG. 3, the connecting portion 26 is formed to have a side surface SW having a wider side width in a downward direction from the center in the height direction thereof.

Thus, the connecting portion 26 can be stably contacted with the spring 30 through the side surface SW having the wide width as described above.

The push pin 20 is made of an electrically conductive material and transmits electrical noise transmitted to the heat sink unit 10 to the PCB substrate 100 which is grounded through the push pin 20.

Thus, the antenna effect generated by the heat sink unit 10 can be eliminated.

The push pin 20 may be made of an electrically conductive synthetic resin, a metal, a plated synthetic resin material, or a synthetic resin through which an electrically conductive material such as a metal is inserted. No particular limitation is imposed on the material that can transmit noise to the PCB substrate.

While the present invention has been described with reference to the exemplary embodiments and the drawings, it is to be understood that the technical scope of the present invention is not limited to these embodiments and that various changes and modifications will be apparent to those skilled in the art. Various modifications and variations may be made without departing from the scope of the appended claims.

10: Heatsink section
12: semiconductor contact
14: Push pin mounting portion
20: push pin
22:
24:
26: Connection
30: spring
100: PCB substrate
110: Semiconductor parts

Claims (7)

A heat sink part for contacting the semiconductor part provided on the PCB substrate and receiving heat generated from the semiconductor part;
And a push pin for coupling the heat sink to the PCB,
The push-
A pressing portion having an area of a predetermined size;
A head portion inserted into the insertion opening formed in the heat sink portion;
And a connecting portion connecting the pressing portion and the head portion,
Wherein the push pin mounting portion on which the push pin is mounted is recessed in the heat sink portion,
Wherein the push pin is installed in the push pin mounting portion via a spring,
Wherein the push pin is made of an electrically conductive material. The method according to claim 1,
Wherein the semiconductor contact portion in contact with the semiconductor component in the heat sink portion is recessed. The method according to claim 1,
Wherein the head portion is configured such that the width of the head portion decreases toward the lower end portion of the side end surface. The method according to claim 1,
Wherein the push portion, the head portion, and the connection portion are integrally formed, and the cutout portion is formed in the head portion and the connection portion. The method according to claim 1,
And a contact protrusion is formed on the connection portion. The method according to claim 1,
And the width of the connection portion is increased from the center of the connection portion in the height direction toward the downside. The method according to claim 1,
Wherein the heat sink portion is formed of aluminum or an aluminum alloy material, and a black coating portion is formed on a surface of the heat sink portion.
KR1020150100609A 2015-07-15 2015-07-15 Heatsink comprising electro conductive push pin KR101723499B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020150100609A KR101723499B1 (en) 2015-07-15 2015-07-15 Heatsink comprising electro conductive push pin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150100609A KR101723499B1 (en) 2015-07-15 2015-07-15 Heatsink comprising electro conductive push pin

Publications (2)

Publication Number Publication Date
KR20170010179A true KR20170010179A (en) 2017-01-26
KR101723499B1 KR101723499B1 (en) 2017-04-07

Family

ID=57992757

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150100609A KR101723499B1 (en) 2015-07-15 2015-07-15 Heatsink comprising electro conductive push pin

Country Status (1)

Country Link
KR (1) KR101723499B1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111901733A (en) * 2020-07-28 2020-11-06 维沃移动通信有限公司 Electronic device
WO2022211237A1 (en) * 2021-04-02 2022-10-06 주식회사 태인엘티에스 Heat dissipation device for display, and manufacturing method therefor

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102651389B1 (en) 2022-02-03 2024-03-28 주식회사 태인엘티에스 Manufacturing method of the radiating device for displaying apparatus

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002510881A (en) * 1998-04-03 2002-04-09 エリクソン インコーポレイテッド Capacitive mounting device for securing an integrated circuit package to a heat sink
KR100457220B1 (en) * 2002-02-27 2004-11-16 잘만테크 주식회사 Heat sink device for cooling chipset
JP2011023491A (en) * 2009-07-15 2011-02-03 Nec Corp Lock jig, and semiconductor device
KR101534232B1 (en) * 2008-12-23 2015-07-06 최훈석 Heat sink having high radiation ceramic coating layer, method of manufacturing the same and metal PCB

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002510881A (en) * 1998-04-03 2002-04-09 エリクソン インコーポレイテッド Capacitive mounting device for securing an integrated circuit package to a heat sink
KR100457220B1 (en) * 2002-02-27 2004-11-16 잘만테크 주식회사 Heat sink device for cooling chipset
KR101534232B1 (en) * 2008-12-23 2015-07-06 최훈석 Heat sink having high radiation ceramic coating layer, method of manufacturing the same and metal PCB
JP2011023491A (en) * 2009-07-15 2011-02-03 Nec Corp Lock jig, and semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111901733A (en) * 2020-07-28 2020-11-06 维沃移动通信有限公司 Electronic device
CN111901733B (en) * 2020-07-28 2021-10-12 维沃移动通信有限公司 Electronic device
WO2022211237A1 (en) * 2021-04-02 2022-10-06 주식회사 태인엘티에스 Heat dissipation device for display, and manufacturing method therefor

Also Published As

Publication number Publication date
KR101723499B1 (en) 2017-04-07

Similar Documents

Publication Publication Date Title
JP5881666B2 (en) Manufacturing method of receptacle connector
US8956179B2 (en) Receptacle connector with detection function
CA2355037C (en) Circuit board assembly with heat sinking
US8821192B2 (en) Electrical connector have a grounding terminal with a tongue for improving mechanical stability
KR101723499B1 (en) Heatsink comprising electro conductive push pin
US20140016272A1 (en) Circuit board and heat dissipation device thereof
EP2706828B1 (en) Coupling assembly of power semiconductor device and PCB and method for manufacturing the same
JP6045953B2 (en) connector
US20100309632A1 (en) Motherboard with mounting holes
JP3140115U (en) Composite circuit board structure
US9743556B1 (en) Electrical connector structure
US6469912B1 (en) Electrical apparatus having a cover member adapted to provide electromagnetic interference shielding to an electronic component
EP3051634B1 (en) Connector
US9184520B2 (en) Electrical connector
JP2013254925A (en) Electronic circuit device
WO2016117276A1 (en) Jack connector and connector
US20140335705A1 (en) Electrical connector
US8215966B2 (en) Interposer connector assembly
US11509080B2 (en) Electrical connector assembly having hybrid conductive polymer contacts
US20210105898A1 (en) Electronic Module
US20020039285A1 (en) Device for reducing electromagnetic interference in a processor assembly
CN101404265B (en) Integrated circuit semiconductor device
KR20150103830A (en) Connecting pin for electronic circuit board
CN219678773U (en) Quick heat dissipation PCB circuit board
KR100700697B1 (en) Expansion type cooling plate structure

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right