KR20200055189A - The manufacturing method for heat radiation adhesive and heat radiation tape with excellent in-plane thermal conductivity comprising the same - Google Patents

Abstract

The present invention relates to a manufacturing method of a heat radiation adhesive, and to a heat radiation tape comprising the same and, more specifically, to a manufacturing method of a heat radiation adhesive, wherein the heat radiation adhesive comprises: an optimized heat dissipation filler; and a heat radiation adhesive layer on upper and lower parts of a metal film substrate and having high thermal conductivity by combination thereof, and the heat radiation adhesive layer is placed on the upper and lower parts of the metal film substrate, thereby improving thermal conductivity in the horizontal direction, and to a heat radiation tape comprising the same, wherein the heat radiation tape is applied to TV, mobile devices, and the like.

Description

Manufacturing method of heat-resistant adhesive and heat-radiating tape comprising the same {THE MANUFACTURING METHOD FOR HEAT RADIATION ADHESIVE AND HEAT RADIATION TAPE WITH EXCELLENT IN-PLANE THERMAL CONDUCTIVITY COMPRISING THE SAME}

The present invention relates to a method of manufacturing a heat dissipating adhesive and a heat dissipating tape comprising the same, more specifically, in a heat dissipating tape applied to a mobile device such as a TV or a smartphone, a heat dissipating adhesive layer is formed on the upper and lower parts of a metal film substrate, A method of manufacturing a heat dissipating adhesive that improves thermal conductivity in the horizontal direction by constructing a heat dissipating adhesive layer as an heat dissipating adhesive having a high thermal conductivity and configuring it on the upper and lower parts of a metal film base by an optimized heat dissipating filler and a combination thereof, and the same It relates to a heat dissipation tape.

In general, as large-area and high-resolution displays of displays applied to mobile devices such as TVs and smartphones are implemented, the use of devices is inhibited and performance is reduced due to heat generated with power consumption when driving devices, especially the frivolity of display driving parts The problem of heat generation due to the trend of small and high integration greatly affects the proper operation and performance of the device, so it is very important to solve the problem.

For example, a display driver IC (DDI) is a semiconductor chip that controls a pixel constituting a display to express a desired screen on a display, and a DDI attached to a double flexible display is a chip on film (COF) for a display panel. As a printed circuit board (PCB) and a panel (glass), it also plays a role of connecting, and the COF increases in use according to the large area of the display, and when a semiconductor chip such as a DDI mounted on the COF drives the display panel, This will happen.

Moreover, as the resolution of the display gradually increases, heat generation becomes more severe, and thus it is necessary to solve the heat generation problem for display productivity or processor performance.

To this end, in the past, the heating element was molded with a heat dissipation resin to increase the heat dissipation effect, but the heat dissipation effect does not meet expectations, and the semiconductor chip is damaged due to the difference in the coefficient of expansion of heterogeneous materials and increases in production. It was not widely used due to the burden of expansion of the heat dissipation resin coating equipment.

Korean Patent Registration No.1558418 "Conductive adhesive tape with heat dissipation function and its manufacturing method" (2015.10.01) Korean Patent Registration No. 1361105 "Heat-radiating tape with excellent thermal conductivity" (2014.02.04)

The present invention is to solve the above problems, in order to realize an optimal heat dissipation structure, a heat dissipation adhesive layer is stacked on the upper and lower portions of a metal film, and a heat dissipation filler optimized for the heat dissipation adhesive layer and a combination thereof are applied. An object of the present invention is to provide a method of manufacturing a heat dissipating adhesive and a heat dissipating tape comprising the same, to maximize heat dissipation performance of a metal film by efficiently transferring and dissipating heat generated from a heat source to a metal film by imparting thermal conductivity.

In order to achieve the above object, a method of manufacturing a heat-sensitive adhesive according to a preferred embodiment of the present invention includes adding a heat-radiating filler to a silicone-based adhesive resin or an acrylic-based adhesive resin; Agitating for 15-20 minutes at 1,500-1,800 rpm to disperse and mix the heat dissipating filler in the adhesive resin to obtain an adhesive mixture; And obtaining a pressure-sensitive adhesive by adding a curing agent and a catalyst to the pressure-sensitive adhesive mixture, wherein the heat-radiating filler is selected from inorganic ceramic-based heat-radiating fillers or carbon-based heat-radiating fillers.

Here, the silicone-based adhesive resin is a polydimethylsiloxane as a main component and a platinum catalyst or a curing catalyst made of benzoyl peroxide is used.

The acrylic adhesive resin is an acrylic acid ester-based copolymer of 2-ethylhexyl acrylate, butyl acrylate, vinyl acetate, acrylic acid, methyl methacrylate, ethyl methacrylate, butyl methacrylate, methyl acrylate, ethyl acrylate, Maleic acid, 2-hydroxypropyl methacrylate, 2-hydroxyethyl methacrylate, 2-hydroxyethyl acrylate, and 2-hydroxypropyl acrylate are used by mixing two or more monomers.

In addition, the inorganic ceramic-based heat dissipation filler is used alone or in combination among alumina, boron nitride, aluminum nitride, magnesium oxide, zinc oxide, and silica.

In addition, the carbon-based heat dissipation filler is used alone or in combination among natural graphite, artificial graphite, graphene, carbon nanotubes, and silicon carbide.

In addition, the heat dissipation tape comprising a heat dissipation adhesive prepared by the above method comprises: a heat dissipation tape attached to a semiconductor chip, comprising: a base layer made of a metal film; An insulating layer made of a polymer film and disposed on the base layer for internal combustion and insulation; An upper heat dissipation adhesive layer disposed on the lower portion of the insulating layer and applied to the upper portion of the base layer to prevent heat condensation due to the insulating layer; A lower heat dissipation adhesive layer applied to the lower portion of the base layer and vertically transferring heat generated from the semiconductor chip toward the base layer; And a liner layer detachably coupled to the lower heat dissipation adhesive layer.

Here, the metal film is selected from aluminum foil, copper foil, graphene or graphite coated aluminum foil, graphene or graphite coated copper foil.

The insulating layer is selected from polyester, polyimide, polyethylene naphthalate, polyetherether ketone, polytetrafluoro ethylene, polybutylene terephthalate, polyamide, polyetherimide, polyethersulfone, polyamideimide.

As described above, according to the method of manufacturing the heat dissipating adhesive of the present invention and the heat dissipating tape comprising the same, the heat dissipation in the horizontal direction is increased by using a metal film base material, but silicone or acrylic pressure sensitive adhesive (PSA) is the main component. In addition to forming a heat-sensitive adhesive to be laminated in the upper and lower parts of a metal film base, and applying a heat-dissipating filler optimized for the heat-sensitive adhesive, it quickly transfers heat to the metal film substrate and additionally imparts a heat dissipation effect, thereby increasing horizontal thermal conductivity. It has the advantage of improving the performance and extending the life of mobile devices such as TVs and smartphones.

1 is a cross-sectional configuration of a heat-radiating tape according to the present invention

Hereinafter, preferred embodiments of the present invention will be described in detail so that those skilled in the art to which the present invention pertains can easily implement the technical spirit of the present invention. However, the present invention may be implemented in various different forms, and is not limited to the embodiments described herein.

1 is a cross-sectional configuration diagram of a heat dissipating tape having excellent horizontal thermal conductivity according to the present invention. "Bottom" in the drawing indicates a direction in contact with the semiconductor chip.

The present invention relates to a heat dissipation tape that is attached directly to a semiconductor chip to perform effective heat dissipation as it spreads heat horizontally in a metal film base layer when heat is vertically transmitted from a heat generating element used as a heat source, and optimized heat dissipation By applying a filler and a combination thereof, a heat dissipating adhesive having high thermal conductivity is manufactured, thereby maximizing the heat dissipation performance of the metal film.

According to the drawings, the heat radiation tape of the present invention includes a base layer 10; Insulating layer 20; And a liner layer 30, the heat dissipating adhesive layers 40 and 50 are formed on the upper and lower portions of the metal film constituting the base layer 10, respectively, to efficiently heat the heat generated from the heat generating source to the metal film. It is characterized in that the delivery, release.

This will be described in more detail.

[1] structure of heat dissipation tape

The base layer 10 is made of a metal film as described above and has excellent characteristics in heat dissipation in the horizontal direction.

The metal film is preferably used from among aluminum foil, copper foil, graphene or graphite coated aluminum foil, graphene or graphite coated copper foil.

At this time, if the metal film is too thin, the heat dissipation performance is deteriorated, whereas if it is too thick, the heat dissipation tape is attached if the heat dissipation tape of the present invention is attached to an adherend such as a semiconductor chip due to the rigidity of the metal film itself, and then banded as necessary. Since there is a possibility of delamination, it is preferable to be formed to a thickness of 12 to 80㎛.

The insulating layer 20 is made of a polymer film and is disposed on the uppermost layer of the base material layer for heat resistance and insulation, that is, the outermost layer of the heat dissipating tape constituting the present invention.

The polymer film is polyester (PET, Polyethylene Terephthalate), polyimide (PI, Poly Imide), polyethylene naphthalate (PEN, Polyethylene Naphthalate), polyetherether ketone (PEEK, Polyetherether Ketone), polytetrafluoroethylene (PTFE , Poly Tetra Fluoro Ethylene), Polybutylene terephthalate (PBT), Polyamide (PA), Poly Ether Imide (PEI), Polyethersulfone (PES), Polyamideimide (PAI, Poly Amide Imide).

At this time, if the thickness of the insulating layer is too thin, the insulating property is deteriorated, whereas if it exceeds a certain thickness, the vertical heat dissipation effect is lowered and, like the metal film, there is a fear that peeling (dropping) occurs when bending due to self-resilience. Therefore, it is preferable to be formed to a thickness of 12 to 50㎛.

The upper heat dissipation adhesive layer 40 is formed of a heat dissipation adhesive and is disposed under the insulating layer for bonding with a metal film as a base layer. That is, the upper heat dissipation adhesive layer 40 is applied to the upper portion of the base layer to prevent heat condensation due to the heat insulation and the insulation layer for the purpose of insulation, thereby serving to realize more effective heat dissipation performance.

The lower heat dissipation adhesive layer 50 is applied to the lower portion of the base layer, and is directly attached to the semiconductor chip to perform heat dissipation, and due to the excellent vertical heat transfer effect of the lower heat dissipation adhesive layer, heat is applied to the metal film as the base layer. It reaches quickly and functions to maximize the horizontal heat dissipation effect of the metal film.

A release liner layer 30 is detachably coupled to the lowermost portion of the heat dissipation tape having the above structure.

[2] Construction of heat-resistant adhesive layer

Next, the upper and lower heat dissipation adhesive layers 40 and 50, which are the most characteristic components of the present invention, will be described in more detail.

The upper and lower heat dissipation adhesive layers 40 and 50 are made of silicone-based pressure sensitive adhesive (PSA) or acrylic pressure-sensitive adhesive (Acrylic PSA), that is, silicone-based resin or acrylic-based resin is used as the main component. It is made by adding a heat dissipation filler (filler).

The silicone adhesive is a polydimethylsiloxane (PDMS, Polydimethylsiloxane) as a main raw material, a curing catalyst such as a platinum (Pt) catalyst or benzoyl peroxide is used.

The acrylic pressure-sensitive adhesive is an acrylic acid ester-based copolymer, 2-ethylhexyl acrylate, 2-butyl acrylate, vinyl acetate, acrylic acid, methyl methacrylate methacrylate, ethyl methacrylate, butyl methacrylate, methyl acrylate, ethyl acrylate, maleic acid, 2-hydroxypropyl meta 2-hydroxypropyl methacrylate, 2-Hydroxyethyl methacrylate, 2-Hydroxyethyl acrylate, 2-Hydroxypropyl acrylate ) Are used by mixing two or more kinds of monomers.

In addition, aziridine, isocyanate, epoxy, and metal chelate compounds are used as curing agents, and tin catalyst is used to control the reaction rate when using isocyanate-based curing agents. It is also used.

In addition, the application of the heat dissipation filler applied to the heat dissipation adhesive layer is very important in order to obtain excellent heat conductivity by providing a heat dissipation effect to the silicone or acrylic resin. In the present invention, an inorganic ceramic heat dissipation filler of 1 to 20 μm or Carbon-based heat dissipation fillers of 1 to 15 µm are used.

That is, when the size of the heat dissipation filler exceeds 20 μm, it may occur that the heat dissipation filler protrudes onto the adhesive surface, so that the heat dissipation filler is not exceeded, but most preferably, a size of about 1 to 10 μm is applied. .

Inorganic ceramic heat dissipation fillers are alumina (Al ₂ O ₃ ), boron nitride (BN, Boron Nitride), aluminum nitride (AlN), magnesium oxide (MgO, Magnesium oxide), zinc oxide (ZnO, Zinc Oxide) ), Silica (SiO ₂ ), and the like.

Carbon-based heat-dissipating fillers can be selectively selected from fillers such as natural graphite, artificial graphite, graphene, carbon nanotube (CNT), silicon carbide (SiC), etc. It is used and has higher thermal conductivity than inorganic ceramic heat dissipation fillers.

The carbon-based heat-dissipating filler can most typically use graphite, which is formed in a sheet form, has a horizontal thermal conductivity of 600 w / mk or more, and a vertical thermal conductivity of 5 w / mk or more, and horizontal thermal conductivity rather than vertical thermal conductivity. The degree is higher, and there is no significant difference between the two, but the thermal conductivity of artificial graphite is superior to that of natural graphite.

The graphite is good for use as a heat dissipation material by adding it to the adhesive layer by its shape, but since graphite generates dust when cutting the graphite sheet and heat transfer performance decreases due to a decrease in thermal conductivity due to the addition of the adhesive layer, graphite may cause problems. The problem of lowering thermal conductivity was improved by dispersing the powder in an adhesive.

In addition, when the upper and lower heat dissipation adhesive layers (40, 50) to which the heat dissipation filler is applied are too thick, when manufacturing heat dissipation tapes containing such an adhesive layer, an insulation effect is generated due to air bubbles in the adhesive layer, and the heat transfer network On the other hand, if the thickness is too thin, it is difficult to see the effect of applying the heat-radiating filler in various sizes, so it is set to 20 ~ 50㎛, preferably about 30㎛ in consideration of the heat-radiating filler size and adhesion to the base layer. This is preferred.

[3] Method for manufacturing heat-sensitive adhesive

Next, a method of manufacturing a heat dissipating adhesive by adding a heat dissipation filler to secure heat dissipation performance to the acrylic resin or the silicone resin will be described.

⑴ Use of inorganic ceramic heat dissipation filler

The present invention relates to a method of manufacturing a heat-sensitive adhesive by using an acrylic adhesive resin having excellent heat resistance as a main component and applying an inorganic ceramic-based heat-radiating filler such as alumina and boron nitride having a heat dissipation effect.

A heat dissipation filler is added to the acrylic adhesive resin and stirred for 15-20 minutes at 1,500-1,800 rpm to disperse and mix the heat dissipation filler in the resin. In the process, when friction heat generated by the heat dissipation filler occurs, it is cooled at room temperature and used as a curing agent selected from aziridine, isocyanate, epoxy, or metal chelate compounds, or an isocyanate curing agent is added with a tin catalyst to prepare a heat dissipating pressure-sensitive adhesive.

At this time, the heat dissipation filler is preferably different in size and filling rate depending on the type mixed with the acrylic adhesive resin.

For example, alumina is the most commonly used heat dissipation filler, and it is inexpensive and has a variety of particle sizes and shapes. Instead, it has a slightly low thermal conductivity of 20 w / mk, and these alumina uses a size of 1 to 20 µm and a filling rate of 50. It can be applied alone for each size with ~ 70phr, or a mixing ratio can be applied for each size.

Boron nitride (BN) has a high thermal conductivity of 120 w / mk and has recently been used for a high trend, but it is expensive and difficult to fill due to its high specific surface area. As such, boron nitride (BN) uses a size of 1 to 10 μm. And with a filling rate of 10 ~ 30phr, it can be applied individually for each size or a mixing ratio for each size can be applied.

Aluminum nitride (AIN) has a high thermal conductivity of 180 w / mk, but is expensive and can be used in small amounts due to hydrolysis.

Magnesium oxide (MgO) has a thermal conductivity of 40w / mk, and zinc oxide has a thermal conductivity of 45w / mk, and since the price is slightly higher, it may be used by filling in a small amount.

Silica is mainly used in conjunction with other heat dissipation fillers to prevent sedimentation of other heat dissipation fillers and to fill gaps.

In this way, considering the conditions such as thermal conductivity and price of the heat dissipating filler, it may be used alone or in combination.

In addition, when mixing the heat dissipation filler, for example, boron nitride: alumina: boron nitride, each of the size of 6㎛: 3㎛: 1㎛ by mixing in a ratio of 6 to 8: 3 to 1: 1 heat transfer network more efficiently By forming, it is possible to obtain high thermal conductivity. That is, the heat conduction efficiency can be increased when mixing and using the heat dissipation filler alone, and when the heat dissipation filler is mixed, the heat conductivity of the heat dissipation filler itself and the price of the heat dissipation filler may be considered and used selectively. .

In addition, in the above description, although the main component is illustrated as an acrylic resin, silicone resin can also be obtained in the same way.

This will be described in more detail through the following test examples.

탄소 Carbon-based heat dissipation filler used for acrylic resin

It relates to a method of manufacturing a heat-sensitive adhesive by using an acrylic adhesive resin having excellent heat resistance as a main component and applying a carbon-based heat-radiating filler such as graphite having a heat-radiating effect.

The method of mixing and dispersing the carbon-based heat-radiating filler in the acrylic pressure-sensitive adhesive is performed in the same manner as described in 상기, and the heat-radiating filler is different in size and filling rate according to the type mixed with the acrylic-based pressure-sensitive resin as in the inorganic ceramic-based heat-resistant filler. It is good.

For example, graphite may have a size of 1 to 15 µm, and a filling rate of 10 to 30 phr may be applied individually for each size or a mixing ratio for each size may be applied.

In addition, an inorganic ceramic-based heat dissipation filler and a carbon-based heat dissipation filler can be mixed, that is, graphite and boron nitride are mixed in a size of 5 µm: 1 µm, respectively, at a ratio of 7 to 9: 3 to obtain high thermal conductivity. It becomes possible.

In addition, in the above test example, a method of mixing and dissipating a heat-radiating filler in an acrylic adhesive resin was described, but when adding the heat-radiating filler to a silicone adhesive resin, the same method as described above may be performed.

As described above, the base layer is made of a metal film to perform heat diffusion in the horizontal direction, and the upper and lower heat dissipation adhesive layers are stacked on the upper and lower portions, respectively, and optimization as obtained in [3] above. By applying the heat dissipation filler and a combination thereof to the adhesive layer, it is possible to impart additional heat dissipation effect with rapid heat transfer.

[4] Test example

Next, the thermal conductivity performance of the heat-radiating tape according to the present invention will be described in detail through the following test examples. However, the following test examples are only examples to aid understanding of the present invention, and the present invention is not limited thereto.

<Test Example 1>

This test example is for evaluating the thermal conductivity of a heat dissipation tape according to the addition (content) of an inorganic ceramic heat dissipation filler, and the main raw material of the heat dissipation adhesive is an acrylic adhesive resin, and the heat dissipation filler uses alumina, but the thickness and filling rate are different. It was set as Test Zone 1 to Test Zone 6, and a heat dissipation tape to which an adhesive having no heat dissipation filler was applied was used as a control.

Here, the thicknesses of the upper and lower heat dissipating adhesives (pressure-sensitive adhesive: PSA) were formed to be 30 μm, and accordingly, the thicknesses of the heat dissipating fillers were 3 μm, 5 μm, and 10 μm, respectively.

The curing agent, an acrylic adhesive excluding the catalyst, and alumina, which is a heat dissipation filler, were added to the solvent mix, followed by stirring at 1800 rpm for 15-20 minutes using a stirrer. In this process, as the heat generation phenomenon occurred due to friction between materials, it was prepared by adding a curing agent and a catalyst after sufficiently cooling at room temperature. Table 1 shows the results of evaluating the vertical and horizontal thermal conductivity of the test and control groups obtained therefrom.

In this embodiment, the combination of heat dissipation fillers with different sizes was applied to the Horsfield's packing model formula, which is a filler combination calculation formula, and the addition amount according to the size of the heat dissipation filler was calculated by calculating the initial volume ratio and multiplying the specific gravity of the fillers, and actually converting it into a mass ratio. Was added, and an adhesive was prepared in the same manner as in Test Example 1.

According to the results of Table 1, while the test pieces 5 and 6 having the highest alumina thickness showed the highest thermal conductivity, the surface of the lower heat dissipation adhesive layer was rough and rather unpolished. Accordingly, due to the surface roughness of the lower heat dissipation adhesive layer, it is expected that there will be a decrease in actual heat generation performance due to a decrease in adhesion with a heat generating source. In addition, in the case of Test Zones 1 to 4, the thermal conductivity was lower than that of Test Zones 5 and 6, but it was found that there was no surface roughness of the lower heat dissipation adhesive layer. On the other hand, the difference according to the filling rate of the heat dissipation filler did not appear significantly.

In addition, the vertical thermal conductivity of the test sphere was slightly higher than that of the control, and in the case of horizontal thermal conductivity, the test sphere was high due to a significant difference. In the case of a heat-radiating tape having a multi-layer structure as in the present invention, -When evaluating the vertical thermal conductivity through the lower or lower-top portion, the thermal conductivity of each layer is different, and due to the thermal resistance of each layer, there is no significant difference between the test and control, whereas the heat transfer effect of the upper and lower heat dissipation adhesive layers Therefore, it was judged to be effective in improving the horizontal thermal conductivity by quickly transferring heat to the metal film, which is the base layer, and it was confirmed that the thermal conductivity was improved when the heat dissipation filler was used.

<Test Example 2>

This test example is for improving the thermal conductivity of the heat dissipation tape according to the present invention, the heat conductivity of the heat dissipation tape used in combination with a heat dissipation filler having the same size (thickness) alone or with a different size. Was evaluated.

Table 2 shows the mixing ratio of alumina, and Table 3 shows the thermal conductivity according to the combination of heat dissipation fillers according to size according to Table 2, and the same control as Test Example 1 was used in this test example.

According to the results of Table 3, compared to Test Example 1, the overall thermal conductivity was higher. This is because the heat dissipation filler of the small particles fills the gap between the heat dissipation fillers of the large particles according to the application of Horsfield's packing model. It is judged that it showed better thermal conductivity than the heat dissipation filler of the same size.

However, in the case of Test Zone 7 in which alumina 10 µm was added, the thermal conductivity was the highest, but in Test Example 1, the surface of the lower heat dissipation adhesive layer was rough as in Test Examples 5 and 6 to which alumina 10 µm was applied. A decrease in heat dissipation performance was expected. Accordingly, in Test Zone 9, the mixing ratio of alumina 10 µm and alumina 5 µm was changed, but surface irregularities occurred and thermal conductivity also decreased compared to Test Zone 7 under the influence of alumina 10 µm, and the surface condition and thermal conductivity of the lower heat dissipation adhesive layer. Considering the figure, it is judged that the best results can be obtained when the test sphere 8 is applied.

Thus, according to the results of Test Examples 1 and 2, it can be seen that it is more effective to apply a combination of heat dissipation fillers of different sizes than to apply heat dissipation fillers of a certain size alone, which is described later. In Test Example 3, even when boron nitride was applied instead of alumina, it was confirmed that the thermal conductivity was high when the heat dissipation fillers of different sizes were combined.

<Test Example 3>

In this test example, a heat dissipating adhesive was prepared in the same manner as in Test Example 1, but the heat dissipating filler used 1 μm and 6 μm plate-like boron nitride instead of spherical alumina. At this time, the filling rate of the heat-dissipating filler is determined by the level of filling of the adhesive according to the specific surface area among the properties of the heat-dissipating filler. The specific surface area of the alumina is 0.2 to 0.4 m2 / g and the boron nitride is 10 to 25 m2 / g. The smaller the specific surface area, the larger the heat dissipation filler can be filled into the pressure-sensitive adhesive, so the filling rate of boron nitride, which has a larger specific surface area than alumina, is inevitably lower.

The filling rate of boron nitride exceeded 30 phr as a result of application of 10, 20, and 30 phr, and when added, it was difficult to increase viscosity and effectively disperse. This resulted in a decrease in coating properties, and a boron nitride filling ratio of 30 phr was applied, and upper and lower heat dissipating adhesives were prepared according to the ratio in Table 4 below.

According to this test example, unlike when alumina was applied, the surface roughness problem of the adhesive layer did not occur, and the initial adhesive strength was also excellent, so it was expected that there would be no problem in adhesion with a heat generating source. In addition, in order to confirm the effect reproducibility according to the combination of the heat radiation filler size, the samples obtained by mixing the heat radiation filler alone and by size were tested. At this time, the tendency of thermal conductivity was grasped in this test example by adjusting the mixing ratio, and the results are displayed. It is shown in 5.

According to the results of Table 5, in the case of horizontal thermal conductivity, the test sphere 14 was the highest, which is a mixture of plate-shaped heat dissipation fillers, as in the spherical shape, a large size heat dissipation filler and a small size heat dissipation filler in a certain ratio. When mixing, it is judged to be advantageous for obtaining high thermal conductivity, and the thermal conductivity was higher than those of Test Zones 1 and 2 in which alumina was used as a heat radiation filler.

<Test Example 4>

In this test example, a heat dissipating adhesive was prepared in the same manner as in Test Example 1, but in order to fill the gap between the heat dissipating fillers to improve the efficiency of the heat transfer network of boron nitride having good thermal conductivity as a heat dissipating filler, alumina and The thermal conductivity was measured by mixing and the results are shown in Table 7. At this time, the filling rate of the heat dissipation filler was set to 30phr.

According to the above Table 7, it was found that the overall thermal conductivity was high, which formed an excellent heat transfer network by filling the gap with the size of boron nitride, which is in the form of a plate shape, through a combination with other sizes. I knew it. However, in the case of test sphere 18, which consists of alumina as a main component and a boron nitride additionally as a heat dissipating filler, and constitutes a heat transfer network, it shows a lower thermal conductivity than those of the test elements based on boron nitride, which is itself in the case of alumina. This is because the thermal conductivity of is lower than that of boron nitride, and the function of compensating for the heat transfer network is reduced when the plate-shaped boron nitride is added to the heat transfer network formed by spherical alumina.

<Test Example 5>

In this test example, the thermal conductivity was measured using a carbon-based heat-radiating filler, and graphite 3,5 μm was used as the carbon-based heat-radiating filler, and a heat-radiating adhesive was prepared in the same manner as in Test Example 1. In addition, the specific surface area of graphite was 26 m 2 / g, similar to that of boron nitride, and accordingly, a test was performed by applying a filling rate of 30%. Table 8 below shows the graphite mixing ratio and the thermal conductivity measured in this test is shown in Table 9.

According to Table 9, test spheres 18 and 19 applied with graphite alone by size showed approximately similar horizontal thermal conductivity, and test spheres 20 to 22 applied with combinations by size were higher than those applied alone, but the difference according to the mixing ratio It turned out not to be big. It is judged that this is due to the fact that there is no significant difference in size between the graphite size 3 µm and 5 µm in the form of a plate.

In addition, it showed a higher thermal conductivity than the heat-sensitive adhesive obtained in Test Examples 1 to 4 in which the inorganic ceramic-based heat-radiating filler was used.

<Test Example 6>

In this test example, a heat dissipating adhesive was prepared in the same manner as in Test Example 1, but boron nitride was mixed with graphite having good thermal conductivity as a heat dissipation filler, and the specific surface area of graphite and boron nitride was 20 to 26 m2 / g. Since the filling rate was applied as 30%. At this time, as for the mixing ratio of the heat dissipation filler, as shown in Table 10 below, 7: 3, which is considered to have the best mixing result between sizes, was applied, and Table 11 shows thermal conductivity.

According to Table 11, the test piece 23, in which graphite was mixed as a main component, showed higher thermal conductivity than the test piece 24, in which boron nitride was used as a main component in comparison with graphite. It was confirmed that the heat transfer network was efficiently formed by filling the gap appropriately by the size difference of boron nitride.

As described above, in the case of a heat dissipation tape having a structure as shown in FIG. 1, a heat transfer network is formed by filling a gap between heat dissipation fillers generated when a heat dissipation filler having high heat conductivity is dispersed in an adhesive to obtain high horizontal heat conductivity. It was confirmed that it is very important to perform efficiently.

10: base layer 20: insulating layer
30: liner layer 40: upper heat dissipation adhesive layer
50: lower heat dissipation adhesive layer

Claims (9)

Adding a heat dissipation filler to the silicone adhesive resin or the acrylic adhesive resin;
Agitating for 15 to 20 minutes at 1,500 to 1,800 rpm to disperse and mix the heat dissipating filler in the adhesive resin to obtain an adhesive mixture; And
Including the step of obtaining a pressure-sensitive adhesive by adding a curing agent and a catalyst to the adhesive mixture,
The heat dissipation filler is a method for manufacturing a heat dissipating adhesive, characterized in that selected from inorganic ceramic heat dissipation filler or carbon-based heat dissipation filler. According to claim 1,
The silicone-based adhesive resin is a method for producing a heat-sensitive adhesive, characterized in that a polydimethylsiloxane as a main component and a platinum catalyst or a curing catalyst made of benzoyl peroxide is used. According to claim 1,
The acrylic adhesive resin is an acrylic acid ester-based copolymer, 2-ethylhexyl acrylate, butyl acrylate, vinyl acetate, acrylic acid, methyl methacrylate, ethyl methacrylate, butyl methacrylate, methyl acrylate, ethyl acrylate, Features used by mixing two or more monomers selected from maleic acid, 2-hydroxypropyl methacrylate, 2-hydroxyethyl methacrylate, 2-hydroxyethyl acrylate, and 2-hydroxypropyl acrylate Manufacturing method of heat-resistant pressure-sensitive adhesive. According to claim 1,
The inorganic ceramic heat dissipation filler is used alone or in combination among alumina, boron nitride, aluminum nitride, magnesium oxide, zinc oxide, and silica, and its size is 1 to 20 μm. According to claim 1,
The carbon-based heat-radiating filler is used alone or in combination among natural graphite, artificial graphite, graphene, carbon nanotubes, and silicon carbide, and its size is 1 to 15 μm. In the heat dissipation tape attached to the semiconductor chip,
A base layer 10 made of a metal film;
An insulating layer 20 made of a polymer film and disposed on the base layer for internal combustion and insulation;
An upper heat dissipation adhesive layer 40 disposed on the lower portion of the insulating layer and applied to the upper portion of the base layer to prevent heat condensation due to the insulating layer;
A lower heat dissipation adhesive layer 50 applied to the lower portion of the base layer and vertically transferring heat generated from the semiconductor chip toward the base layer; And
Includes; liner layer 30 that is detachably coupled to the lower heat dissipation adhesive layer;
The upper and lower heat dissipation adhesive layer (40, 50) is a heat dissipation tape, characterized in that formed of a heat dissipation adhesive prepared by any one of claims 1 to 5. The method of claim 6,
The metal film forming the base layer 10 is selected from aluminum foil, copper foil, graphene or graphite coated aluminum foil, graphene or graphite coated copper foil, and the thickness is 12 to 80 μm. Heat resistant tape. The method of claim 6,
The polymer film constituting the insulating layer 20 is polyester, polyimide, polyethylene naphthalate, polyether ether ketone, polytetrafluoro ethylene, polybutylene terephthalate, polyamide, polyetherimide, polyether sulfone, poly A heat radiation tape, which is selected from amideimide, and has a thickness of 12 to 50 µm. The method of claim 6,
The upper and lower heat dissipation adhesive layers 40 and 50 have a thickness of 20 to 50 μm.

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