KR20180075137A - Electrically insulated and heat radiated non-substrate tape and manufacturing method thereof - Google Patents

Abstract

The present invention relates to an insulative and heat radiating inorganic tape and to a manufacturing method therefor, and more specifically, to an insulative and heat radiating inorganic tape exhibiting excellent insulation and adhesive force, notably enhanced thermal conductivity, and at the same time, excellent heat-radiation properties, and to a manufacturing method therefor. Accordingly, the present invention may be widely applied in all industries requiring insulation and heat-radiation properties.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an insulating insulated inorganic material tape,

The present invention relates to an insulating heat-radiating inorganic material tape and a method of manufacturing the same. More particularly, the present invention relates to an insulating heat-radiating inorganic material tape excellent in insulation property and adhesive force and remarkably improved in thermal conductivity and excellent in heat-

Generally, when an electronic product is driven, heat is generated inside the electronic device included in the electronic product. When the heat generated as described above is not emitted to the outside as quickly as possible, heat affects the electronic device, The result of failing to perform the function is generated.

Particularly, as electronic products are aimed at high performance and high functionality, accordingly, large capacity and high integration of electronic devices are inevitably generated. Therefore, solving the heat generation problem caused by a large number of electronic devices affects the performance and quality of electronic products It is a key element.

Conventionally, as means for solving the above-mentioned problems, there have been proposed a cooling system using a fin fan cooling method, a Peltier cooling method, a liquid-jet cooling method, an immersion cooling method, a heat pipe ) Cooling system to remove heat generated from electronic devices, a cooling device for electronic devices is required to meet the trend of slimmer and smaller electronic products.

Conventionally, a heat dissipation pad made of a silicon component having thermal conductivity is used as a cooling means. The heat dissipation pad is attached between a circuit board and a heat sinker, and heat generated from an electronic device mounted on the circuit board is dissipated Allow the pad to pass smoothly through the heat sink.

However, in the case of the heat dissipation pad made of the silicon component, the powder is excessively mixed with silicon in order to improve the thermal conductivity. However, even if the mixing ratio of the powder is increased, there is a problem that the improved thermal conductivity is limited. In the case of the heat dissipation pad made of the silicone component, liquid silicone rubber is mainly used for securing the adhesive force. However, in the case of the liquid silicone rubber, there is a problem that a sufficient adhesive force to the attachment site can not be secured.

Therefore, there is an urgent need to study a cooling means which is excellent in insulation and adhesive force, has remarkably improved thermal conductivity, and is excellent in heat radiation characteristics.

KR 10-1125743 B1

Disclosure of the Invention The present invention has been conceived to solve the problems described above, and it is an object of the present invention to provide an insulating heat-radiating inorganic material tape excellent in insulation property and adhesive force and remarkably improved in thermal conductivity, There is.

According to an aspect of the present invention, there is provided a method of manufacturing a semiconductor device, including: (1) preparing a heat radiation composition comprising a heat radiation powder and a polymer resin including a first heat radiation powder and a second heat radiation powder; (2) applying the heat radiation composition to one surface of the release film; (3) drying and stabilizing the release film on which the heat radiation composition is applied to form an adhesive layer; And (4) roll-pressing a release film on which an adhesive layer is formed, wherein the first heat radiation powder and the second heat radiation powder satisfy the following conditions 1) and 2) .

1) When the average particle size ratio of the first heat radiation powder and the second heat radiation powder is 1: 0.05 to 1

임.2)

being.

According to an embodiment of the present invention, the first heat dissipating powder may include boron nitride (BN), and the second heat dissipating powder may include alumina (Al ₂ O ₃ ).

Further, the first heat dissipating powder and the second heat dissipating powder may satisfy the following conditions 1) and 2).

1) When the average particle size ratio of the first heat radiation powder and the second heat radiation powder is 1: 0.06 to 0.8

임.2)

being.

In addition, the heat-dissipating powder may not further include the third heat-dissipating powder.

The shape of the first heat-dissipating powder may be spherical, and the first heat-dissipating powder may have an average particle diameter of 17 to 33 탆.

The shape of the second heat dissipation powder may be spherical, and the second heat dissipation powder may have an average particle diameter of 2-13 탆.

The heat radiation composition may include 150 to 250 parts by weight of the heat radiation powder per 100 parts by weight of the polymer resin.

The polymer resin may include at least one member selected from the group consisting of an acrylic resin, a rubber resin, a silicone resin and a urethane resin.

The application of step (2) may be performed at a line speed of 2 to 8 m / min at 15 to 40 ° C.

The drying in step (3) may be performed at 40 to 120 ° C for 1 to 10 minutes, and the stabilization may be performed at 50 to 70 ° C for 40 to 56 hours.

In addition, the step (4) may include the steps of: (1) positioning the release substrate on the release film on which the adhesive layer is formed; And (4) roll-pressing the release film on which the two release type substrates are placed at a linear pressure of 3 to 13 kgf at a line speed of from 2 to 8 m / min at 80 to 120 캜.

On the other hand, the present invention provides an insulating heat-radiating inorganic material tape manufactured by the above-described manufacturing method and having a vertical thermal conductivity of 1.7 W / m · K or more.

According to an embodiment of the present invention, the insulating heat-radiating inorganic material tape may have an adhesive strength of 450 to 750 gf / 25 mm.

The insulating heat-radiating inorganic material tape may have a thickness of 80 to 120 탆.

The insulating heat-radiating inorganic material tape may have a volume resistivity of 3.5 × 10 ¹¹ to 6.5 × 10 ¹¹ Ω · cm.

INDUSTRIAL APPLICABILITY The insulating heat-radiating inorganic tape of the present invention exhibits an excellent insulating property and adhesive force, a remarkably improved thermal conductivity and an excellent heat radiation property. Accordingly, it can be widely applied to all industries requiring insulation and heat radiation characteristics.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. The present invention may be embodied in many different forms and is not limited to the embodiments described herein.

As described above, a heat dissipation pad made of a silicon component has been disclosed. However, such a structure has a problem in that the powder has excessively mixed with silicon in order to enhance the thermal conductivity. However, even if the mixing ratio of the powder is increased, there was. In the case of the heat dissipation pad made of the silicone component, liquid silicone rubber is mainly used for securing the adhesive force. However, in the case of the liquid silicone rubber, there is a problem that a sufficient adhesive force to the attachment site can not be secured.

Accordingly, the present invention provides a method of manufacturing a heat dissipation structure, comprising the steps of: (1) preparing a heat radiation composition comprising a heat dissipation powder including a first heat dissipation powder and a second heat dissipation powder and a polymer resin; (2) applying the heat radiation composition to one surface of the release film; (3) drying and stabilizing the release film on which the heat radiation composition is applied to form an adhesive layer; And (4) a step of roll-pressing the release film on which the adhesive layer is formed, to thereby solve the above-mentioned problems. As a result, unlike the conventional invention, it has an excellent insulating property and adhesive force, a remarkably improved thermal conductivity and an excellent heat radiation property.

The insulating heat-radiating inorganic tape according to one embodiment of the present invention includes the steps of (1) preparing a heat radiation composition comprising a heat radiation powder and a polymer resin including a first heat radiation powder and a second heat radiation powder; (2) applying the heat radiation composition to one surface of the release film; (3) drying and stabilizing the release film on which the heat radiation composition is applied to form an adhesive layer; And (4) roll-pressing the release film having the adhesive layer formed thereon.

On the other hand, in order to produce an insulating heat-radiating inorganic material tape excellent in insulation and adhesive force, remarkably improved in thermal conductivity and exhibiting an excellent heat radiation characteristic, the first heat radiation powder and the second heat radiation powder contained in the heat radiation powder satisfy the following conditions 1) and Condition 2).

이고, 바람직하게는

일 수 있다.Condition 1), the average particle size ratio of the first heat dissipating powder and the second heat dissipating powder may be 1: 0.05 to 1, preferably 0.06 to 0.8, and condition 2)

, And preferably

Lt; / RTI >

If the average particle size ratio of the first heat dissipating powder and the second heat dissipating powder is less than 1: 0.05 in the condition 1), the heat dissipating powder may protrude from the surface of the produced insulating heat dissipating inorganic tape, And the surface quality may be deteriorated, and the adhesive force of the insulating heat-radiating inorganic material tape may be lowered. Further, the heat radiation powder may come out from the surface of the inorganic tape, and the thermal conductivity may be lowered. In addition, if the average mouth ratio exceeds 1: 1, the density of the heat dissipation powder may be lowered in the manufactured insulating heat dissipation inorganic tape, and the thermal conductivity may be lowered.

이 80 미만이면 방열분말의 밀도가 저하될 수 있고, 열전도도 및 절연성이 저하될 수 있다. 또한, 만일

이 120을 초과하면 방열분말이 무기재 테이프의 표면에서 묻어나올 수 있고, 열전도도 및 점착력이 저하될 수 있다.If, in the above condition 2)

Is less than 80, the density of the heat dissipation powder may be lowered, and the thermal conductivity and the insulation may be lowered. Also,

If it exceeds 120, the heat radiation powder may come out from the surface of the inorganic material tape, and the thermal conductivity and adhesion may be lowered.

First, a step (1) of manufacturing a heat radiation composition comprising a heat radiation powder containing a first heat radiation powder and a second heat radiation powder and a polymer resin will be described.

The polymer resin may be any resin as long as it is capable of forming an adhesive layer in the art. But it may preferably include at least one member selected from the group consisting of an acrylic resin, a rubber resin, a silicone resin and a urethane resin so as to improve the dispersibility of the heat dissipating powder and to produce a uniform adhesive layer, Resin, more preferably acrylic resin having an acrylate ester-based monomer. The polymer resin may have a solid content of 30 to 70% by weight, preferably 40 to 60% by weight, based on the total polymer resin content.

On the other hand, the heat radiation composition may further include a curing agent so as to realize sufficient adhesion of the insulating heat radiation inorganic material tape and to easily cure the heat radiation composition. The curing agent is not particularly limited as long as it is a curing agent capable of forming an adhesive layer in the art, and is preferably an isocyanate curing agent.

The curing agent may be added in an amount of 0.5 to 2 parts by weight based on 100 parts by weight of the polymer resin. If the amount of the curing agent is less than 0.5 parts by weight based on 100 parts by weight of the polymer resin, a sufficient adhesive force may not be realized because of uncured curing agent, and there may be a tape remaining when the insulating heat-radiating inorganic material tape is peeled off from the adherend surface. If the amount of the curing agent exceeds 2 parts by weight, the flexibility of the insulating heat-radiating inorganic material tape may be deteriorated due to excessive curing.

The heat radiation powder may be selected without limitation as long as it has both insulation and heat radiation. Further, the shape and structure of the insulating heat-dissipating powder are not limited, but preferably, the heat-dissipating powder may be spherical.

The first heat dissipation powder may be any material as long as it can exhibit insulation and heat radiation characteristics in the art, but boron nitride (BN) may be preferably used.

The first heat-dissipating powder may be a powder having a particle size that can be generally used in the art. In order to increase the density of the heat dissipation powder and to exhibit excellent heat dissipation characteristics, the first heat dissipation powder preferably has an average particle diameter of 17 to 33 탆, more preferably an average particle diameter of 20 to 50 탆, Lt; / RTI > If the average particle diameter of the first heat-dissipating powder is less than 17 탆, the heat-dissipating powder may be deposited on the surface of the first heat-dissipating powder, and the adhesive strength and thermal conductivity may be lowered. In addition, if the average particle size exceeds 33 탆, the heat dissipation powder may have a low density and thermal conductivity may be lowered. In addition, there may be a large amount of heat radiation powder protruding from the surface of the manufactured insulating heat-radiating inorganic tape, thereby increasing the surface roughness and reducing the surface quality.

Although there is no limitation on the particle diameter distribution of the first heat dissipating powder, preferably D10 is 2 to 6 占 퐉 and D90 is 28 to 42 占 퐉, more preferably D10 is 3 to 5 占 퐉, and D90 is 30 to 40 占 퐉 Lt; / RTI >

The second heat dissipation powder may be any material that can exhibit heat dissipation and insulation characteristics that can be commonly used in the art, but alumina (Al ₂ O ₃ ) may be preferably used.

The second heat-dissipating powder may be a powder having a particle diameter that can be generally used in the art. However, in order to increase the density of the heat dissipation powder and to exhibit excellent insulation and heat dissipation characteristics, the first heat dissipation powder preferably has an average particle diameter of 2 to 13 탆, more preferably 5 to 10 탆, Lt; / RTI > If the average particle diameter of the second heat dissipation powder is less than 2 탆, the heat dissipation powder may be increased and the adhesion and thermal conductivity may be lowered. If the average particle diameter exceeds 13 mu m, the heat dissipation powder may have a lower density and thermal conductivity may be lowered. In addition, there may be a large amount of heat radiation powder protruding from the surface of the manufactured insulating heat-radiating inorganic tape, thereby increasing the surface roughness and reducing the surface quality.

On the other hand, the second heat dissipating powder preferably has an average particle diameter of 2 to 7 μm, preferably an average particle diameter of 3 to 6 μm, and an average particle diameter of 8 to 13 μm, Heat dissipation powders of 9 to 12 占 퐉 at a weight ratio of 1: 0.5 to 2 can be used. Although there is no limitation on the particle size distribution of the 2-1 heat dissipating powder and the 2-2 heat dissipating powder, when the 2-1 heat dissipating powder and the 2-2 heat dissipating powder are mixed and used, D10 may be 0.1 to 1.5 占 퐉 and D90 may be 8 to 12 占 퐉, preferably D10 may be 0.1 to 1 占 퐉 and D90 may be 9 to 11 占 퐉, the second heat dissipating powder may have D10 of 1 to 5 占 퐉 and D90 15 to 19 占 퐉, preferably D10 is 2 to 4 占 퐉, and D90 is 16 to 18 占 퐉.

The heat radiation composition may include 150 to 250 parts by weight, preferably 180 to 245 parts by weight of the heat radiation powder per 100 parts by weight of the polymer resin. If the amount of the heat dissipating powder is less than 150 parts by weight based on 100 parts by weight of the polymer resin, a desired thermal conductivity characteristic may not be exhibited, and heat radiation and insulation characteristics may be deteriorated. If the amount of the heat dissipating powder is more than 250 parts by weight, the adhesive force of the insulating heat dissipating inorganic material tape may be deteriorated, the cohesion phenomenon may occur between the heat dissipating powders, and the dispersibility may be deteriorated. As the amount of the heat dissipation powder increases, the surface roughness may increase and the surface quality of the tape may be deteriorated. In addition, even if the heat radiation powder is further provided, the degree of improvement in insulation and heat radiation performance may be insignificant.

Meanwhile, the heat dissipating powder including the first heat dissipating powder and the second heat dissipating powder may not further include the third heat dissipating powder. Even if the third heat dissipation powder is included, the thermal conductivity is not improved, or when the same amount of heat dissipation powder is used, the content of the first heat dissipation powder and the second heat dissipation powder is relatively decreased, Or the adhesive force of the tape may be lowered.

The heat radiation composition and the heat dissipation powder of the first heat dissipation powder and the second heat dissipation powder may be mixed with a paste mixer, and then mixed for 5 to 15 minutes through a paste mixer.

Next, the step (2) of applying the heat radiation composition to one surface of the release film will be described.

The releasing film may be any type of releasing film that can be used for producing a tape in the related art. Preferably, the releasing film may be a PET film. More preferably, the releasing film may be a one- or two- Can be used. The thickness of the release film is not limited and may be selected depending on the purpose. For example, the thickness of the release film may be 30 to 60 탆, more preferably 38 to 50 탆, but is not limited thereto.

The application is not particularly limited as long as it is a method of applying in the manufacture of tapes in the art, and preferably, the heat radiation composition described above can be applied to the release film through a comma coater. The application may be performed at a line speed of 2 to 8 m / min at 15 to 40 ° C, preferably at a line speed of 3 to 7 m / min at 15 to 35 ° C. If the temperature of the application is less than 15 DEG C or the line speed is less than 2 m / min, the production yield may be poor. If the temperature of the application exceeds 40 ° C or the line speed exceeds 8 m / min, drying can be performed rapidly in a single process, so that bubbles that may remain in the adhesive layer may burst, As a result, bubbles are formed on the surface of the insulating heat-radiating inorganic material tape thus produced, which may result in poor surface quality and may deteriorate thermal conductivity and adhesion.

Next, the step (3) for drying and stabilizing the release film coated with the heat radiation composition to form an adhesive layer will be described.

The drying can be carried out without any limitation as long as it is a drying condition in a tape manufacturing process. The drying is preferably carried out at 40 to 120 ° C for 1 to 10 minutes, more preferably at 45 to 115 ° C for 3 to 7 Min. More preferably, the drying can be carried out by first drying at 45 to 55 ° C, second drying at 65 to 75 ° C, tertiary drying at 85 to 95 ° C, Drying and drying at 105 to 115 ° C, but not limited thereto.

The stabilization can be used without limitation as long as it is stabilized in a conventional tape manufacturing process. Preferably, the stabilization is carried out at 50 to 70 ° C for 40 to 56 hours, more preferably at 50 to 66 ° C for 44 To < / RTI > 52 hours to form an adhesive layer.

Next, the step (4) for roll-pressing the release film on which the adhesive layer is formed will be described.

The step (4) may include a step of positioning the release substrate on the release film on which the adhesive layer is formed, and (4) a step of roll pressing the release film on which the release substrate is placed.

The roll press improves the adhesion of the heat dissipation powder contained in the formed pressure sensitive adhesive layer and proceeds to improve adhesion by applying heat. In this case, in order to prevent the adhesive layer from transferring to the calendering roll, roll-pressing may be performed by laminating a release substrate on the adhesive layer formed on the upper surface of the release film. The releasing base material may be a releasing base material of the same material having a different releasing force from the releasing film described above. Preferably, the releasing base material may be a PET film having a different releasing force from the releasing film and having one side or both sides thereof treated with silicone.

The roll press has a line pressure of 3 to 13 kgf, preferably 5 to 10 kgf, at a line speed of 2 to 8 m / min at 80 to 120 ° C, preferably 90 to 110 ° C, And can be performed at a line speed of 7 m / min. If the line pressure of the roll press is less than 3 kgf, the adhesion of the heat radiation powder may not be improved to a desired level and the adhesion may be deteriorated. If the line pressure exceeds 13 kgf, The tape can not be manufactured and a problem that the adhesive layer is pushed out of the PET may occur.

The present invention provides an insulating heat-radiating inorganic material tape produced by the above-described manufacturing method.

The insulating heat-radiating inorganic tape may have a vertical thermal conductivity of 1.7 W / m · K or more, and preferably 1.8 to 2.2 W / m · K. If the vertical thermal conductivity is less than 1.7 W / m · K, a heat radiation characteristic of a desired level can not be exhibited, so that the heat of the adhered surface can not be dissipated smoothly.

The insulating heat-radiating inorganic material tape may have a thickness of 80 to 120 탆, and preferably 90 to 110 탆. If the thickness of the insulating heat-radiating inorganic material tape is less than 80 mu m, there may be a large amount of heat-radiating powder protruding from the surface, thereby increasing the surface roughness and reducing the surface quality. If the thickness exceeds 120 占 퐉, the density of the insulating heat-radiating inorganic tape is lowered, which may result in a problem that the desired insulation and heat radiation characteristics can not be exhibited.

The insulating heat-radiating inorganic material tape may have an adhesive strength of 450 to 750 gf / 25 mm, and preferably an adhesive force of 500 to 700 gf / 25 mm. If the adhesive force of the insulating heat-radiating inorganic material tape is less than 450 gf / 25 mm, adhesion with the adherend surface may be poor. If the adhesive strength exceeds 750 gf / 25 mm, It may not be easy to remove the tape again.

The insulating heat-radiating inorganic material tape may have a volume resistivity of 3.5 × 10 ¹¹ to 6.5 × 10 ¹¹ Ω · cm, preferably 4 × 10 ¹¹ to 6 × 10 ¹¹ Ω · cm. If the volume resistivity of the insulating heat-radiating inorganic material tape is less than 3.5 x 10 < ¹¹ > OMEGA .cm, the insulating heat-insulating inorganic material tape can not be brought into direct contact with an electrical component such as a circuit board There arises a problem such as electric short-circuiting, which may cause a problem that is difficult to use in an application requiring electrical insulation.

On the other hand, the insulating heat-radiating inorganic tape of the present invention exhibits an excellent insulating property and adhesive force, remarkably improved thermal conductivity, and exhibits an excellent heat radiation property. Accordingly, it can be widely applied to all industries requiring insulation and heat radiation characteristics.

The present invention will now be described more specifically with reference to the following examples. However, the following examples should not be construed as limiting the scope of the present invention, and should be construed to facilitate understanding of the present invention.

≪ Example 1 >

(1) Preparation of heat radiation composition

An acrylic resin having an acrylic ester monomer as a polymer resin and having a solid content of 50% by weight, 2.28 parts by weight of boron nitride (BN) having an average particle diameter of 25 mu m as a first heat-dissipating powder to 100 parts by weight of the polymer resin, 227.72 parts by weight of alumina (Al ₂ O ₃ ) having an average particle diameter of 7.5 μm as a heat radiation powder was mixed for 10 minutes using a paste mixer to prepare a heat radiation composition. The second heat dissipation powder had a second heat dissipation powder D10 of 0.5 mu m and a D90 of 10 mu m, an average particle diameter of 5 mu m, a second heat dissipation powder D10 of 3 mu m and a D90 of 17 mu m and an average particle diameter of 10 mu m -2 heat dissipation powders were mixed at a ratio of 1: 1.

(2) Formation of adhesive layer

The heat radiation composition prepared above was applied as a release film to a PET film having a mold release force of 10 gf / 25 mm and a double-sided silicone treatment and a thickness of 50 탆, dried and stabilized to form an adhesive layer on the release film. Specifically, the heat radiation composition was applied at a line speed of 5 m / min at 25 캜 using a comma coater, followed by primary drying at a temperature of 50 캜 for 1 minute, secondary drying at a temperature of 70 캜 for 1 minute, Followed by a fourth drying step at a temperature of 110 캜 for one minute and a fifth drying step at a temperature of 110 캜 for one minute, followed by stabilization at 55 캜 for 48 hours to form an adhesive layer on the upper surface of the release film .

 (3) Manufacturing of insulating heat-radiating inorganic material tape

In order to prevent the adhesive layer from transferring to the calendering roll, a PET film having a releasing force of 30 gf / 25 mm and a double-side silicone treatment and having a thickness of 50 탆 was laminated on the adhesive layer formed on the upper surface of the release film, Roll press at a line pressure of 8 kgf at a line speed of 5 m / min at 100 캜. Thereafter, the releasing base material and release film laminated on the upper and lower surfaces of the roll-pressed adhesive layer were removed to prepare an insulating heat-radiating inorganic material tape having a thickness of 100 mu m.

≪ Examples 2 to 21 and Comparative Examples 1 to 4 >

And the average particle diameter, content and kind of the heat dissipating powder were changed as shown in Tables 1 to 4 below to prepare an insulating heat-radiating inorganic tape as shown in Tables 1 to 4. [

<Experimental Example>

1. Evaluation of vertical thermal conductivity

Thermal conductivity, specific heat and density were measured for the insulating heat-radiating inorganic tape made according to Examples 1 to 21 and Comparative Examples 1 to 4, and the vertical thermal conductivity was calculated.

First, the insulating heat-radiating inorganic material tape prepared according to Examples 1 to 21 and Comparative Examples 1 to 4 was cut into a square of 12.7 mm x 12.7 mm in width and placed in a standard holder (for vertical measurement) , The prepared holder was placed in a furnace in a thermal diffusion coefficient measuring device (NETZSCH, LFA467), and the thermal diffusion coefficient was measured by applying laser 10 times.

Then, the insulating heat-radiating inorganic material tape produced according to Examples 1 to 21 and Comparative Examples 1 to 4 was cut into a circle having a diameter of 4 mm, placed on an aluminum pan, and covered with a lid. It was placed in a furnace in a specific heat measuring equipment (NETZSCH, DSC 214) and the specific heat at 25 캜 was measured.

Then, the density of the insulating heat-radiating inorganic tape prepared according to Examples 1 to 21 and Comparative Examples 1 to 4 was measured by the Archimedes method, and the vertical thermal conductivity was calculated by the following equation. These are shown in Tables 1 to 4 below.

[Mathematical Expression]

Thermal conductivity (W / mK) = Thermal Diffusivity (mm ² / s) * Specific heat (J / g / K) * Density (g / cm ³⁾

2. Insulation Evaluation

Insulating insulating inorganic material tapes prepared according to Examples 1 to 21 and Comparative Examples 1 to 4 under the conditions of an electric current of 500 V, an electrode area of 20 cm ² , an electrode pressurizing condition of 1.0 N / cm ^2, and a temperature of 23 캜, And the volume resistivity was measured through a volume resistance measuring device (Mitsubishi, MCP-HT450) to evaluate the insulation property. These are shown in Tables 1 to 4 below.

3. Adhesion evaluation

The insulating heat-radiating inorganic tape made in accordance with Examples 1 to 21 and Comparative Examples 1 to 4 was cut to a width of 25 mm x 150 mm, and a cut heat-insulating inorganic tape was attached to the adherend (SUS304) And was reciprocated once by a roller at a speed of 300 mm / min. After 30 minutes of squeezing, the adhesive was peeled off at a rate of 300 mm / min at a 90 ° angle, and the adhesive force of the lower surface, which was in contact with the releasing film and the lower surface, which was in contact with the releasing film, was measured through a Tinius olsen (Peel adhesion strength tester). These are shown in Tables 1 to 4 below.

4. Surface quality evaluation

In order to confirm the surface quality of the insulating heat-radiating inorganic tape made according to Examples 1 to 21 and Comparative Examples 1 to 4, it was confirmed by touching the surface with hand to have a rugged feeling. If there is no bumpy feeling on the surface 5, the area of the bumpy feeling area is 4, 2% or more than 3% or 5% or more when the area is less than 5% 2 for 10% or less area, 1 for area exceeding 10% and 20% or less, and 0 for area exceeding 20%.

division Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 1st
radiation
powder Kinds Boron Age
Triade Boron Age
Triade Boron Age
Triade Boron Age
Triade Boron Age
Triade Boron Age
Triade Boron Age
Triade Average particle diameter (占 퐉) 25 13 20 30 45 19 30 content
(Parts by weight) 2.28 2.28 2.28 2.28 2.28 2.28 2.28 Second
radiation
powder Kinds Alumina Alumina Alumina Alumina Alumina Alumina Alumina Average particle diameter (占 퐉) 7.5 12 12 3 2.5 One 5 content
(Parts by weight) 227.72 227.72 227.72 227.72 227.72 227.72 227.72 Third
radiation
powder Kinds - - - - - - - Average particle diameter (占 퐉) - - - - - - - content
(Parts by weight) - - - - - - - Total content of heat-resisting powder (parts by weight) 230 230 230 230 230 230 230 Condition 1) 1: 0.3 1: 0.92 1: 0.6 1: 0.1 1: 0.056 1: 0.053 1: 0.17 Condition 2) 99.88 99.88 99.88 99.88 99.88 99.88 99.88 Vertical thermal conductivity (W / mK) 2.127 1.549 1.988 1.914 1.610 1.552 1.893 Volumetric resistance (Ω · cm) 5.7 × 10 ¹¹ 2.9 × 10 ¹¹ 4.9 × 10 ¹¹ 4.8 × 10 ¹¹ 3.3 × 10 ¹¹ 3.0 × 10 ¹¹ 4.6 × 10 ¹¹ Top surface adhesion (gf / 25 mm) 689.0 516.3 679.8 647.6 371.6 524.5 661.6 Adhesion force (gf / 25 mm) 627.0 487.8 618.3 601.5 351.4 473.2 608.7 Surface quality ○ ○ ○ ○ × ○ ○

division Example 8 Example 9 Example 10 Example 11 Example 12 Example 13 1st
radiation
powder Kinds Boron Age
Triade Boron Age
Triade Boron Age
Triade Boron Age
Triade Boron Age
Triade Boron Age
Triade Average particle diameter (占 퐉) 18 18 25 25 25 25 Content (parts by weight) 2.28 2.28 2.57 2.38 2.19 2.08 Second
radiation
powder Kinds Alumina Alumina Alumina Alumina Alumina Alumina Average particle diameter (占 퐉) 10 17 7.5 7.5 7.5 7.5 Content (parts by weight) 227.72 227.72 227.43 227.62 227.81 229.92 Third
radiation
powder Kinds - - - - - - Average particle diameter (占 퐉) - - - - - - Content (parts by weight) - - - - - - Total content of heat-resisting powder (parts by weight) 230 230 230 230 230 230 Condition 1) 1: 0.56 1: 0.94 1: 0.3 1: 0.3 1: 0.3 1: 0.3 Condition 2) 99.88 99.88 88.49 95.64 104.02 110.54 Vertical thermal conductivity (W / mK) 2.074 1.584 1.617 2.108 2.089 1.599 Volumetric resistance (Ω · cm) 5.1 × 10 ¹¹ 3.0 × 10 ¹¹ 3.3 × 10 ¹¹ 5.2 × 10 ¹¹ 5.2 × 10 ¹¹ 3.9 × 10 ¹¹ Top surface adhesion (gf / 25 mm) 652.2 429.1 592.9 663.1 679.2 488.6 Adhesion force (gf / 25 mm) 600.4 402.6 551.6 621.9 621.5 454.4 Surface quality ○ × ○ ○ ○ ○

division Example 14 Example 15 Example 16 Example 17 Example 18 Example 19 1st
radiation
powder Kinds Boron Age
Triade Boron Age
Triade Boron Age
Triade Boron Age
Triade Boron Age
Triade nitrification
aluminum Average particle diameter (占 퐉) 25 25 25 25 25 25 Content (parts by weight) 1.20 1.80 2.45 2.70 2.28 2.28 Second
radiation
powder Kinds Alumina Alumina Alumina Alumina nitrification
aluminum Alumina Average particle diameter (占 퐉) 7.5 7.5 7.5 7.5 7.5 7.5 Content (parts by weight) 118.8 178.2 242.55 267.3 227.72 227.72 Third
radiation
powder Kinds - - - - - - Average particle diameter (占 퐉) - - - - - - Content (parts by weight) - - - - - - Total content of heat-resisting powder (parts by weight) 120 180 245 270 230 230 Condition 1) 1: 0.3 1: 0.3 1: 0.3 1: 0.3 1: 0.3 1: 0.3 Condition 2) 99 99 99 99 99.88 99.88 Vertical thermal conductivity (W / mK) 1.419 1.983 2.031 2.192 1.670 1.509 Volumetric resistance (Ω · cm) 2.6 × 10 ¹¹ 4.9 × 10 ¹¹ 5.1 × 10 ¹¹ 5.9 × 10 ¹¹ 3.4 × 10 ¹¹ 2.8 × 10 ¹¹ Top surface adhesion (gf / 25 mm) 748.4 739.0 651.5 434.9 683.8 691.23 Adhesion force (gf / 25 mm) 699.6 681.7 605.2 386.6 629.3 640.4 Surface quality ○ ○ ○ × ○ ○

division Example 20 Example 21 Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 1st
radiation
powder Kinds Boron Age
Triade Alumina Boron Age
Triade Boron Age
Triade Boron Age
Triade Boron Age
Triade Average particle diameter (占 퐉) 25 25 13 35 25 25 Content (parts by weight) 2.00 2.28 2.28 2.28 3.01 1.80 Second
radiation
powder Kinds Alumina Boron Age
Triade Alumina Alumina Alumina Alumina Average particle diameter (占 퐉) 7.5 7.5 17 One 7.5 7.5 Content (parts by weight) 198.00 227.72 227.72 227.72 226.99 228.2 Third
radiation
powder Kinds nitrification
aluminum - - - - - Average particle diameter (占 퐉) 5 - - - - - Content (parts by weight) 30 - - - - - Total content of heat-resisting powder (parts by weight) 230 230 230 230 230 230 Condition 1) 1: 0.3 1: 0.3 1: 1.31 1: 0.029 1: 0.3 1: 0.3 Condition 2) 99 99 99.88 99.88 75.41 126.78 Vertical thermal conductivity (W / mK) 1.587 1.211 1.025 1.136 1.581 1.489 Volumetric resistance (Ω · cm) 3.0 × 10 ¹¹ 2.1 × 10 ¹¹ 1.5 × 10 ¹¹ 1.9 × 10 ¹¹ 3.0 × 10 ¹¹ 2.7 × 10 ¹¹ Top surface adhesion (gf / 25 mm) 679.6 688.9 505.0 441.5 478.9 489.1 Adhesion force (gf / 25 mm) 623.1 631.8 456.7 408.6 431.3 443.9 Surface quality ○ ○ ○ × ○ ○

As shown in Tables 1 to 4 above,

Example 1, Example 3 and Example 4 satisfying the particle size range of the first heat radiation powder according to the present invention were superior in the vertical thermal conductivity, the volume resistance and the adhesive force as compared with Example 2 which did not satisfy the range, 5, vertical thermal conductivity, volume resistance, adhesion and surface quality were superior.

In addition, Examples 1, 7, and 8 satisfying the particle size range of the second heat radiation powder according to the present invention were superior in vertical thermal conductivity, volume resistivity, and adhesive strength as compared with Example 6, The vertical thermal conductivity, the volume resistivity, the adhesive force and the surface quality were superior to those of Example 9.

In addition, Example 1, Example 15, and Example 16 satisfying the content of the heat radiation powder according to the present invention were superior in vertical thermal conductivity and volume resistance to Example 14 which did not satisfy the requirements, Adhesion and surface quality were excellent.

Example 1 further comprising boron nitride as the first heat-dissipating powder and alumina as the second heat-dissipating powder comprises boron nitride as the first heat-dissipating powder and aluminum nitride as the second heat- The vertical thermal conductivity and the volume resistivity were superior to those of Example 18, and the vertical thermal conductivity and the volume resistivity were superior to those of Example 19 including aluminum nitride as the first heat radiation powder and alumina as the second heat radiation powder.

Example 1 comprising alumina as the first heat-dissipating powder and boron nitride as the first heat-dissipating powder and alumina as the second heat-dissipating powder includes boron nitride as the first heat-dissipating powder and alumina as the second heat- And the vertical thermal conductivity and the volume resistivity were superior to those of Example 20 including aluminum nitride as the third heat dissipating powder.

Example 1 in which boron nitride was contained as the first heat-dissipating powder and alumina was contained as the second heat-dissipating powder was carried out in the same manner as in Example 1 except that alumina was contained as the first heat-dissipating powder and boron nitride was contained as the second heat- The vertical thermal conductivity and the volume resistivity were superior to those of Example 21.

In addition, Example 1 satisfying the condition 1) according to the present invention was significantly superior in vertical thermal conductivity and volume resistance to Comparative Example 1, which was lower than the value of the condition 1) according to the present invention, and had excellent adhesion. The vertical thermal conductivity, the volume resistivity, the adhesive strength and the surface quality were significantly superior to those of Comparative Example 2, which exceeded the value of the condition 1) according to the present invention.

In addition, Example 1 satisfying the condition 2) of the present invention was superior in the vertical thermal conductivity, the volume resistance and the adhesive force as compared with the Comparative Example 3 which was lower than the value of the condition 2) according to the present invention. In addition, the vertical thermal conductivity, the volume resistivity and the adhesive strength were superior to those of Comparative Example 4, which exceeded the value of the condition 2) according to the present invention.

Claims (15)

(1) preparing a heat radiation composition comprising a heat radiation powder and a polymer resin including a first heat radiation powder and a second heat radiation powder;
(2) applying the heat radiation composition to one surface of the release film;
(3) drying and stabilizing the release film on which the heat radiation composition is applied to form an adhesive layer; And
(4) roll-pressing the release film on which the adhesive layer is formed,
Wherein the first heat dissipating powder and the second heat dissipating powder satisfy the following conditions 1) and 2).
1) When the average particle size ratio of the first heat radiation powder and the second heat radiation powder is 1: 0.05 to 1
2)

being. The method according to claim 1,
Wherein the first heat dissipating powder comprises boron nitride (BN)
Wherein the second heat dissipating powder comprises alumina (Al ₂ O ₃ ). 3. The method of claim 2,
Wherein the first heat dissipating powder and the second heat dissipating powder satisfy the following conditions 1) and 2).
1) When the average particle size ratio of the first heat radiation powder and the second heat radiation powder is 1: 0.06 to 0.8
2)

being. 3. The method of claim 2,
Wherein the heat-dissipating powder further contains no third heat-dissipating powder. 3. The method of claim 2,
The shape of the first heat dissipation powder is spherical,
Wherein the first heat-dissipating powder has an average particle diameter of 17 to 33 占 퐉. 3. The method of claim 2,
The shape of the second heat dissipation powder is spherical,
Wherein the second heat dissipating powder has an average particle diameter of 2 to 13 占 퐉. The method according to claim 1,
Wherein the heat radiation composition comprises 150 to 250 parts by weight of the heat radiation powder per 100 parts by weight of the polymer resin. The method according to claim 1,
Wherein the polymer resin comprises at least one member selected from the group consisting of an acrylic resin, a rubber resin, a silicone resin and a urethane resin. The method according to claim 1,
Wherein the application of the step (2) is performed at a line speed of 2 to 8 m / min at 15 to 40 ° C. The method according to claim 1,
The drying in the step (3) is performed at 40 to 120 ° C for 1 to 10 minutes,
Wherein the stabilization is performed at 50 to 70 DEG C for 40 to 56 hours. The method according to claim 1,
The step (4)
(4) positioning the release substrate on the release film on which the adhesive layer is formed; And
(4) roll-pressing a release film on which the release type substrate is placed at a line pressure of 3 to 13 kgf at a line speed of 2 to 8 m / min at 80 to 120 ° C .; . 13. A process for producing a polyurethane foam, which is produced by the production method of any one of claims 1 to 11,
An insulating heat-radiating inorganic tape having a vertical thermal conductivity of 1.7 W / m · K or more. 13. The method of claim 12,
Wherein the insulating heat-radiating inorganic material tape has an adhesive strength of 450 to 750 gf / 25 mm. 13. The method of claim 12,
Wherein the insulating heat-radiating inorganic material tape has a thickness of 80 to 120 占 퐉. 13. The method of claim 12,
Wherein the insulating heat-radiating inorganic material tape has a volume resistivity of 3.5 x 10 ¹¹ to 6.5 x 10 ¹¹ ? Cm.