WO2014129776A1

WO2014129776A1 - Composite film using copper thin film including insulation layer and conductive adhesive layer and method for fabricating same

Info

Publication number: WO2014129776A1
Application number: PCT/KR2014/001280
Authority: WO
Inventors: 이경섭; 최현석; 강민성; 이동현
Original assignee: 동현전자 주식회사
Priority date: 2013-02-19
Filing date: 2014-02-18
Publication date: 2014-08-28
Also published as: KR101458832B1; KR20140104555A

Abstract

The present invention makes it possible to fabricate a composite sheet using a multiply layered composite film with a higher anisotropy of heat conductivity obtained by compositely laying a ceramic insulation layer and an electrical conduction layer on a copper thin film so as to increase the horizontal heat conductivity compared to the vertical heat conductivity. Particularly, it is possible to fabricate a composite film with higher horizontal heat conductivity than the vertical heat conductivity that can replace a graphitic heat-diffusion material. To this end is provided a multiply layered composite film with an anisotropic heat conductivity using a copper thin film including an insulation layer and an electrical conduction layer. The present invention proposes a multi-layered composite sheet with a higher anisotropy of heat conductivity obtained by compositely laying a ceramic insulation layer and an electrical conduction layer on a copper thin film so as to increase the horizontal heat conductivity compared to the vertical heat conductivity.

Description

Composite film using the copper thin film layer containing an insulating layer and an electroconductive adhesive layer, and its manufacturing method.

The present invention relates to a composite film using a copper thin film layer, a method for producing the same, and utilization thereof.

More specifically, the present invention relates to a multilayer composite film having anisotropic thermal conductivity using a copper thin film layer including a conductive adhesive layer so as to rapidly release heat generated from a heat source such as an electronic substrate of an electronic device.

In general, electronic products such as computers, portable personal terminals and communication devices should release excessive heat energy generated inside the system to the outside, and if heat diffusion is not properly performed, safety problems are more likely to occur, and such heat energy This can shorten the life of the product and cause product failure or malfunction, which can reduce the reliability of the product.

In addition, in recent years, a large number of electronic components have to be installed in a narrow space according to the trend of high-density integration design between electronic device semiconductor chips and chips, and light and small electronic devices, which greatly increases the amount of heat generated per unit volume.

Therefore, the need for heat dissipation means for effectively dissipating the heat generated from the heat source in order to prevent the deterioration of the electronic device is emerging.

Due to this necessity, a heat sink or a heat radiating fan is used as a means for effectively dissipating heat generated from an electronic device.

However, these heat dissipation means has a disadvantage in that the heat dissipation effect is large, but the volume is large, so that it is difficult to employ in the field where the thickness is thin, and the weight of the whole product is increased because of the high density of the material itself.

Therefore, the heat dissipation means that can be employed in the field where the thickness should be thin is preferably provided in the form of a sheet to reduce the volume.

Thus, the heat dissipation means provided in the form of a sheet is mainly used is expanded graphite or expanded resin, such as copper or aluminum, or expanded natural graphite.

In general, metal has a large specific gravity, which limits the weight of the product, and due to its structure, heat generated from a heat source is rapidly accepted in the vertical direction, but a hot spot is spread because the distance to spread the heat in the horizontal direction is short. There is a problem that occurs.

This hot spot is a local high temperature phenomenon of the substrate, causing a poor resolution of the display or degradation of the product performance.

Graphite sheet, which is typically used as a material for thin and short reduction and effective thermal diffusion, can compensate for the shortcomings of metal sheets. However, graphite sheets require surface coating such as a protective film due to lack of electrical insulation. There is a problem.

In addition, there is a disadvantage in that the graphite powder is easily peeled off due to weak bonding between powder layers on the graphite structure.

Due to the characteristics of the material, the sheet made of resin has a low heat conductivity, and thus has a small heat dissipation effect, a problem of excessive flexibility, and difficulty in handling.

As a method for compensating for these problems, there are methods for overcoming the shortcomings by compounding graphite powder in a polymer binder. However, since there is a limit to uniformity and filling rate of the graphite powder in the binder, There is a limitation in implementing suitable vertical to horizontal thermal conductivity, and the flexibility of the final product is also significantly reduced.

Therefore, it is necessary to develop a high-performance thermal diffusion material that is excellent in durability and reliability of the thermal diffusion material itself and also replaces the graphite sheet.

(Patent Document 1) Korean Patent No. 10-1143524 relates to a heat diffusion sheet, and more specifically, one side of a copper sheet or an aluminum sheet is coated with carbon nanotubes to form a coating, or an adhesive is formed on a copper sheet or an aluminum sheet. Carbon nanotubes are formed on both sides of the stacked sheets, or clad sheets formed by rolling aluminum sheets between copper sheets are formed, carbon nanotubes are formed on both surfaces of the clad sheets, or a plurality of aluminum sheets are rolled. It is formed of a laminated sheet, carbon nanotubes are formed on both sides of the laminated sheet, a PET film is formed on the uppermost of the laminated sheets, and an acrylic double-sided adhesive tape is formed on the lowermost, so that thermal conductivity in the thickness direction is achieved. Thermally coated carbon nanotubes with high thermal conductivity on high copper sheets or aluminum sheets The present invention relates to a heat diffusion sheet having improved conductivity. However, there is still a need for developing a high-performance thermal diffusion material which is excellent in durability and reliability of the thermal diffusion material itself and also replaces the graphite sheet.

Graphite sheets using representative graphite-based thermal diffusion materials lack electrical insulation and must be accompanied by a surface coating such as attaching a protective film, have a limitation in rework, and cut graphite having graphite characteristics. When the cutting surface is not clean, defects occur, and the interlayer bonding of the powder is weak due to the graphite structure in the cutting process, the graphite powder is easily peeled off and dust is generated, which threatens worker's health. Overcoming problems such as electrical trouble of the final electronic device, film itself brittle and difficult to handle, and in particular, the composite thermal conductivity in the vertical to horizontal direction can replace the graphite-based thermal diffusion material The purpose is to produce a film.

As a method for solving the above problems, the above problem is solved by a multilayer composite film having anisotropic thermal conductivity using a copper thin film layer including an insulating layer and a conductive adhesive layer.

In general, in the case of a copper thin film, a thermally conductive material having an excellent thermal conductivity of about 395 W / mK or a material has the same vertical and horizontal thermal conductivity, and thus a short heat transfer distance in the horizontal direction is not suitable for use as a thermal diffusion material.

As a means to solve this problem, a ceramic powder of Flake and a metal powder of Flake coated with silver (Ag) were used in combination with a copper thin film.

That is, a multilayer composite film having anisotropic thermal conductivity having a structure of a copper thin film layer, a ceramic insulating layer over the copper thin film layer, and a conductive adhesive layer under the copper thin film layer is proposed.

In the present invention, it is possible to manufacture a composite sheet using a multilayer composite film in which the ceramic insulating layer and the conductive adhesive layer are combined with the copper thin film layer to increase the thermal conductivity in the horizontal direction compared to the vertical thermal conductivity, thereby increasing the anisotropy of the thermal conductivity.

Insufficient electrical insulation must be accompanied by a surface coating such as attaching a protective film, a limitation in reworking, and a defect due to unclear cutting edges when cutting graphite having graphite properties. In the cutting process, due to the weak bonding between powder layers due to the graphite structure, graphite powder is easily peeled off and dust is generated, which threatens worker's health. It is possible to overcome the disadvantages of the graphite sheet, such as the fact that it can be difficult to handle due to brittleness of the film itself, and in particular, it is possible to manufacture a composite film in which the thermal conductivity in the vertical direction and the horizontal direction can replace the graphite-based thermal diffusion material. .

The multilayer composite film produced by the present invention and the composite sheet using the same have an effect of 50 times or more in the horizontal thermal conductivity ratio in the vertical direction.

1 shows a method for producing a multilayer composite film having anisotropic thermal conductivity according to an embodiment of the present invention.

2 is a schematic view of an electronic substrate including a multilayer composite film having anisotropic thermal conductivity according to an embodiment of the present invention.

3 is a cross-sectional view of a multilayer composite film having anisotropic thermal conductivity according to an embodiment of the present invention.

Figure 4 shows the thermal conductivity in the horizontal direction relative to the vertical direction of the multilayer composite film having anisotropic thermal conductivity according to an embodiment of the present invention.

100: multilayer composite film having anisotropic thermal conductivity according to the present invention

110: ceramic insulating layer 111: ceramic powder

112: polymer resin of the ceramic insulating layer

120: copper thin film layer 121: coating layer of the copper thin film layer

130: conductive adhesive layer 131: Flake metal powder

132: polymer resin of the conductive adhesive layer

200: electronic substrate

2 and 3 show a schematic view of a multilayer composite film having anisotropic thermal conductivity and an electronic substrate including the same as a thermally conductive material according to an embodiment of the present invention.

The multilayer composite film having anisotropic thermal conductivity includes a copper thin film layer, a ceramic insulating layer over the copper thin film layer, and a conductive adhesive layer under the copper thin film layer.

The ceramic insulating layer is at least any one of an acrylic resin, an epoxy resin, an epoxy propylene diene monomer (EPDM) resin, a chlorinated polyethylene (CPE) resin, a silicone, a polyurethane, a urea resin, a melamine resin, a phenol resin, and an unsaturated ester resin. It would be desirable to be dispersed on a polymer resin containing one.

In addition, the ceramic powder is boron nitride (BN), aluminum oxide (Al ₂ O ₃ ), silicon carbide (SiC), magnesium oxide (MgO), aluminum hydroxide (Al (OH) ₃ ), magnesium hydroxide in the form (Flake) At least one selected from (Mg (OH) ₂ ) may be selected, but is not limited thereto.

More preferably, it will be possible to disperse the Flake boron nitride (BN) powder on an acrylic resin or an ethylene propylene diene monomer (EPDM) resin.

The conductive adhesive layer is a metal powder of a flake (Flake) containing at least one of copper (Cu), silver (Ag), silver coated copper (Ag coated Cu), silver coated nickel (Ag coated Ni) on the polymer resin It will be desirable to be dispersed.

The polymer resin may include at least one of acrylic resin, epoxy resin, EPDM (Ethylene Propylene Diene Monomer) resin, CPE (Chlorinated Polyethylene) resin, silicone, polyurethane, urea resin, melamine resin, phenol resin, and unsaturated ester resin. It would be desirable to have the Flake metal powder dispersed on the resin.

More preferably it will be possible to disperse the Flake copper powder coated with silver (Ag) on an acrylic resin or an epoxy resin.

The copper thin film layer is formed on the upper and lower surfaces of nickel (Ni), nickel-chromium (Ni-Cr), iron-chromium-nickel (Fe-Cr-Ni), iron-nickel-cobalt (Fe-Ni-Co), and iron. Nickel-tungsten (Fe-Ni-W), iron-nickel-molybdenum (Fe-Ni-Mo), iron-nickel-copper (Fe-Ni-Cu), iron-nickel-manganese (Fe-Ni-Mn) , Tin-nickel-titanium (Sn-Ni-Ti), copper-nickel-tin (Cu-Ni-Sn), nickel-cobalt-copper (Ni-Co-Cu), nickel-cobalt-zinc (Ni-Co- Zn), nickel-cobalt-tungsten (Ni-Co-W) may further include a coating layer using a material containing at least one.

More preferably, the copper thin film layer may form a coating layer including nickel (Ni) on the upper and lower surfaces thereof.

The thickness of the ceramic insulating layer and the conductive adhesive layer may be 5 to 20 μm, and may be about 10 μm.

The copper thin film layer may have a thickness of 15 to 45 μm, more preferably about 30 μm.

The thickness of the coating layer on the upper and lower surfaces of the copper thin film layer may be manufactured to 0.1 to 1.5 ㎛, more preferably 0.1 to 1.0 ㎛.

This coating layer has the effect of preventing corrosion of the copper thin film, improving durability, and increasing anisotropy of thermal conductivity.

In addition, the multilayer composite film having anisotropic thermal conductivity having a structure of a copper thin film layer, a ceramic insulating layer over the copper thin film layer, and a conductive adhesive layer under the copper thin film layer according to the present invention, each layer is composed of a plurality, It would be possible to form a multilayer structure beyond the layer structure.

As can be seen in Figure 4, the multilayer composite film having anisotropic thermal conductivity according to the present invention is characterized in that the ratio of the thermal conductivity in the horizontal direction to 50 times or more. More preferably, it is possible that the ratio of the thermal conductivity in the horizontal direction to the vertical direction is 100 times or more.

In addition, the ceramic insulating layer of the multilayer composite film having the anisotropic thermal conductivity

The conductive adhesive layer of the multilayer composite film having a vertical thermal conductivity of 1 W / mK or more and a horizontal thermal conductivity of 5 W / mK or more and having the anisotropic thermal conductivity has a vertical thermal conductivity of 1 W / mK or more and a horizontal direction It will be possible to be prepared to have an anisotropic thermal conductivity, characterized in that the thermal conductivity is 5 W / mK or more.

As can be seen in Figure 1, the method for producing a multilayer composite film having anisotropic thermal conductivity of the present invention comprises the steps of (i) dispersing and complexing ceramic powder in a polymer resin to prepare a slurry, (ii) (i) Preparing the ceramic insulation layer using at least one of a tape casting process, a spray coating process, a screen printing process, and a dipping process; and (iii) copper (Cu), silver (Ag), and silver coating. Dispersing and compounding a metal powder comprising at least one of Ag coated Cu and Ag coated Ni in a polymer resin to prepare a slurry, (iv) tape the slurry of step (iii) Preparing a conductive adhesive layer using at least one of a casting process, a spray coating process, a screen printing process, and a dipping process, (v) forming a thin upper and lower surface of the copper thin film layer. (Ni), nickel-chromium (Ni-Cr), iron-chromium-nickel (Fe-Cr-Ni), iron-nickel-cobalt (Fe-Ni-Co), iron-nickel-tungsten (Fe-Ni-W ), Iron-nickel-molybdenum (Fe-Ni-Mo), iron-nickel-copper (Fe-Ni-Cu), iron-nickel-manganese (Fe-Ni-Mn), tin-nickel-titanium (Sn-Ni Ti), copper-nickel-tin (Cu-Ni-Sn), nickel-cobalt-copper (Ni-Co-Cu), nickel-cobalt-zinc (Ni-Co-Zn), nickel-cobalt-tungsten (Ni Coating by using at least one of -Co-W), (vi) nickel (Ni), nickel-chromium (Ni-Cr), iron-chromium-nickel (Fe-Cr-Ni) ), Iron-nickel-cobalt (Fe-Ni-Co), iron-nickel-tungsten (Fe-Ni-W), iron-nickel-molybdenum (Fe-Ni-Mo), iron-nickel-copper (Fe-Ni -Cu), iron-nickel-manganese (Fe-Ni-Mn), tin-nickel-titanium (Sn-Ni-Ti), copper-nickel-tin (Cu-Ni-Sn), nickel-cobalt-copper (Ni -Co-Cu), nickel-cobalt-zinc (Ni-Co-Zn), nickel-cobalt-tungsten (Ni-Co-W) using at least one of the upper and lower surfaces of the copper thin film layer on the coating (ii) three steps Placing a mIC insulating layer, (vii) placing the conductive adhesive layer of step (iv) below a copper thin film layer on which the ceramic insulating layer of step (vi) is placed, (viii) (vii) It will be possible to include the step of completing the multilayer composite film using at least one of a method of pressing, laminating, and autoclaving a film composed of a plurality of layers in the step).

It will be preferable that the content of the ceramic powder in the slurry of step (i) is 30 to 70% by weight. More preferably it will be possible for the content of ceramic powder to be from 20 to 60% by weight.

It will be preferable that the content of the metal powder in the slurry of step (iii) is 30 to 70% by weight. More preferably it will be possible for the content of ceramic powder to be from 20 to 60% by weight.

In addition, the step (v) may be coated using at least one of a tape casting process, a spray coating process, a screen printing process, and a dipping process.

1) Uniformly dispersing and complexing boron nitride (BN) powder with an acrylic resin or EPDM (Ethylene Propylene Diene Monomer) resin to prepare a slurry (boron nitride (BN) content of 40 to 60 wt %) Boron nitride (BN) composite film is produced through a tape casting process.

2) Copper (Cu) powder coated with silver of Ag is uniformly dispersed and compounded in an acrylic or epoxy resin to make a uniform slurry (Cu coated with silver (Ag) Content of 40 to 60 wt%)) to produce a conductive composite film through tape casting.

3) Boron nitride (BN) in each of the above prepared films is located on the upper layer of nickel (Ni) coated copper thin film (rolled copper thin film or electrolytic copper thin film), and the conductive film is located on the lower layer of nickel (Ni) coated copper thin film The final film is completed by pressing or laminating the film having a total of three layers.

4) The thickness of the nickel (Ni) layer coated on the copper thin film is 0.1 to 1.0 μm.

The composite sheet (rolled copper thin film) including the multilayer composite film having anisotropic thermal conductivity prepared by Example 1 was confirmed that the ratio of the thermal conductivity in the horizontal direction to the vertical direction is 100 times or more as shown in Table 1 below.

This is because the present invention has a performance equal to or higher than that of existing graphite-based thermal diffusion sheets.

Table 1

division	Vertical thermal conductivity	Horizontal thermal conductivity	Horizontal Thermal Conductivity / Vertical Thermal Conductivity (Anisotropy)
Rolled Copper Thin Film (W / mK)	395	395	One
Graphite Sheet (W / mK)	4.5	300	66.7
Composite Sheet (Rolled Copper Thin Film) (W / mK)	2.3	234	101.7

Although the present invention has been described with reference to the accompanying drawings, it is merely one embodiment of various embodiments including the gist of the present invention, which can be easily implemented by those skilled in the art. It is clear that the present invention is not limited to the above-described embodiment only. Therefore, the protection scope of the present invention should be interpreted by the following claims, and all technical ideas within the scope equivalent to the change, substitution, substitution, etc. within the scope not departing from the gist of the present invention shall be the right of the present invention. It will be included in the scope. In addition, some of the components of the drawings are intended to more clearly describe the configuration, and it is clear that the exaggerated or reduced size is provided.

In particular, it is possible to manufacture a composite film that can replace the graphite-based heat diffusion material in the horizontal thermal conductivity relative to the vertical direction, the present invention has high industrial applicability.

Claims

In the multilayer composite film having anisotropic thermal conductivity,

Copper thin film layer,

A ceramic insulating layer on the copper thin film layer,

A multilayer composite film having anisotropic thermal conductivity, characterized in that it comprises a conductive adhesive layer under the copper thin film layer.
The method according to claim 1,

The ceramic insulating layer is a multilayer composite film having anisotropic thermal conductivity, characterized in that the ceramic powder is dispersed on the polymer resin.
The method according to claim 2,

The ceramic powder is a flake boron nitride (BN), aluminum oxide (Al 2 O 3 ), silicon carbide (SiC), magnesium oxide (MgO), aluminum hydroxide (Al (OH) 3 ), magnesium hydroxide (Mg At least any one of (OH) 2 ), the multilayer composite film having anisotropic thermal conductivity.
The method according to claim 2,

The polymer resin includes at least one of acrylic resin, epoxy resin, EPDM (Ethylene Propylene Diene Monomer) resin, CPE (Chlorinated Polyethylene) resin, silicone, polyurethane, urea resin, melamine resin, phenol resin, unsaturated ester resin Multilayer composite film having anisotropic thermal conductivity, characterized in that.
The method according to claim 1,

The conductive adhesive layer is a multilayer composite film having anisotropic thermal conductivity, characterized in that the metal powder in the form of (Flake) is dispersed on the polymer resin.
The method according to claim 5,

The metal powder is a multilayer composite film having anisotropic thermal conductivity, characterized in that it comprises at least one of copper (Cu), silver (Ag), silver coated copper (Ag coated Cu), silver coated nickel (Ag coated Ni) .
The method according to claim 5,

The polymer resin includes at least one of acrylic resin, epoxy resin, EPDM (Ethylene Propylene Diene Monomer) resin, CPE (Chlorinated Polyethylene) resin, silicone, polyurethane, urea resin, melamine resin, phenol resin, unsaturated ester resin Multilayer composite film having anisotropic thermal conductivity, characterized in that.
The method according to claim 1,

Nickel (Ni), nickel-chromium (Ni-Cr), iron-chromium-nickel (Fe-Cr-Ni), iron-nickel-cobalt (Fe-Ni-Co), iron on the upper and lower surfaces of the copper thin film layer Nickel-tungsten (Fe-Ni-W), iron-nickel-molybdenum (Fe-Ni-Mo), iron-nickel-copper (Fe-Ni-Cu), iron-nickel-manganese (Fe-Ni-Mn) , Tin-nickel-titanium (Sn-Ni-Ti), copper-nickel-tin (Cu-Ni-Sn), nickel-cobalt-copper (Ni-Co-Cu), nickel-cobalt-zinc (Ni-Co- Zn), a nickel-cobalt-tungsten (Ni-Co-W) is a multi-layered composite film having anisotropic thermal conductivity, characterized in that the coating layer is formed.
The method according to claim 1,

The thickness of the ceramic insulating layer is a multilayer composite film having anisotropic thermal conductivity, characterized in that 5 to 20 ㎛.
The method according to claim 1,

The thickness of the conductive adhesive layer is a multilayer composite film having anisotropic thermal conductivity, characterized in that 5 to 20 ㎛.
The method according to claim 1,

The copper thin film layer has a thickness of 15 to 45 ㎛ multilayer composite film having anisotropic thermal conductivity.
The method according to claim 8,

The multilayer composite film having anisotropic thermal conductivity, characterized in that the thickness of the coating layer on the upper, lower surfaces of the copper thin film layer is 0.1 to 1.5 ㎛.
The method according to claim 1,

The multilayer composite film having the anisotropic thermal conductivity

A multilayer composite film having anisotropic thermal conductivity, characterized in that the ratio of the thermal conductivity in the vertical direction to the horizontal direction is 50 times or more.
The method according to claim 1,

The ceramic insulating layer of the multilayer composite film having the anisotropic thermal conductivity

A multilayer composite film having anisotropic thermal conductivity, wherein the vertical thermal conductivity is 1 W / mK or more and the horizontal thermal conductivity is 5 W / mK or more.
The method according to claim 1,

The conductive adhesive layer of the multilayer composite film having the anisotropic thermal conductivity

A multilayer composite film having anisotropic thermal conductivity, wherein the vertical thermal conductivity is 1 W / mK or more and the horizontal thermal conductivity is 5 W / mK or more.
In the method for producing a multilayer composite film having anisotropic thermal conductivity,

(i) dispersing and complexing the ceramic powder in the polymer resin to prepare a slurry;

(ii) preparing the ceramic insulation layer using the slurry of step (i) using at least one of a tape casting process, a spray coating process, a screen printing process, and a dipping process;

(iii) preparing a slurry by dispersing and compounding a metal powder containing at least one of copper (Cu), silver (Ag), silver coated copper (Ag coated Cu), and silver coated nickel (Ag coated Ni) in a polymer resin. Making;

(iv) preparing the conductive adhesive layer using the slurry of step (iii) using at least one of a tape casting process, a spray coating process, a screen printing process, and a dipping process;

(v) The upper and lower surfaces of the copper thin film layer are nickel (Ni), nickel-chromium (Ni-Cr), iron-chromium-nickel (Fe-Cr-Ni), and iron-nickel-cobalt (Fe-Ni-Co). , Iron-nickel-tungsten (Fe-Ni-W), iron-nickel-molybdenum (Fe-Ni-Mo), iron-nickel-copper (Fe-Ni-Cu), iron-nickel-manganese (Fe-Ni-W) Mn), tin-nickel-titanium (Sn-Ni-Ti), copper-nickel-tin (Cu-Ni-Sn), nickel-cobalt-copper (Ni-Co-Cu), nickel-cobalt-zinc (Ni- Coating with at least one of Co—Zn) and nickel-cobalt-tungsten (Ni—Co—W);

(vi) the nickel (Ni), nickel-chromium (Ni-Cr), iron-chromium-nickel (Fe-Cr-Ni), iron-nickel-cobalt (Fe-Ni-Co), iron of step (v) Nickel-tungsten (Fe-Ni-W), iron-nickel-molybdenum (Fe-Ni-Mo), iron-nickel-copper (Fe-Ni-Cu), iron-nickel-manganese (Fe-Ni-Mn) , Tin-nickel-titanium (Sn-Ni-Ti), copper-nickel-tin (Cu-Ni-Sn), nickel-cobalt-copper (Ni-Co-Cu), nickel-cobalt-zinc (Ni-Co- Zn), by using at least one of nickel-cobalt-tungsten (Ni-Co-W) to place the ceramic insulating layer of the step (ii) above the copper thin film layer coated on the upper and lower surfaces;

(vii) placing the conductive adhesive layer of step (iv) below the copper thin film layer on which the ceramic insulating layer of step (vi) is placed;

(viii) completing the multilayer composite film using at least one of a method of pressing, laminating, and autoclaving a film comprising a plurality of layers of step (vii);

Method for producing a multilayer composite film having anisotropic thermal conductivity comprising a.
The method according to claim 16,

The ceramic powder of step (i) is boron nitride (BN), aluminum oxide (Al 2 O 3 ), silicon carbide (SiC), magnesium oxide (MgO), aluminum hydroxide (Al (OH) 3 ) of the phase (Flake) And magnesium hydroxide (Mg (OH) 2 ).
The method according to claim 16,

The polymer resin of step (i) is at least of acrylic resin, epoxy resin, EPDM (Ethylene Propylene Diene Monomer) resin, CPE (Chlorinated Polyethylene) resin, silicone, polyurethane, urea resin, melamine resin, phenol resin, unsaturated ester resin The manufacturing method of the multilayer composite film which has anisotropic thermal conductivity characterized by including any one.
The method according to claim 16,

The metal powder of step (iii) is anisotropic thermal conductivity, characterized in that it comprises at least one of copper (Cu), silver (Ag), silver coated copper (Ag coated Cu), silver coated nickel (Ag coated Ni) Method for producing a multilayer composite film having a.
The method according to claim 16,

Step (v) is a method of manufacturing a multilayer composite film having anisotropic thermal conductivity, characterized in that the coating by using at least one of the tape casting process, spray coating process, screen printing process, dipping process.
The method according to claim 16,

The polymer resin of step (iii) is at least one of acrylic resin, epoxy resin, EPDM (Ethylene Propylene Diene Monomer) resin, CPE (Chlorinated Polyethylene) resin, silicone, polyurethane, urea resin, melamine resin, phenol resin, unsaturated ester resin The manufacturing method of the multilayer composite film which has anisotropic thermal conductivity characterized by including any one.