WO2014129776A1 - Film composite utilisant un film mince en cuivre comprenant une couche d'isolation et une couche adhésive conductrice, et procédé pour sa réalisation - Google Patents

Film composite utilisant un film mince en cuivre comprenant une couche d'isolation et une couche adhésive conductrice, et procédé pour sa réalisation Download PDF

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Publication number
WO2014129776A1
WO2014129776A1 PCT/KR2014/001280 KR2014001280W WO2014129776A1 WO 2014129776 A1 WO2014129776 A1 WO 2014129776A1 KR 2014001280 W KR2014001280 W KR 2014001280W WO 2014129776 A1 WO2014129776 A1 WO 2014129776A1
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Prior art keywords
nickel
thermal conductivity
resin
composite film
multilayer composite
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PCT/KR2014/001280
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English (en)
Korean (ko)
Inventor
이경섭
최현석
강민성
이동현
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동현전자 주식회사
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Publication of WO2014129776A1 publication Critical patent/WO2014129776A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/283—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysiloxanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/42—Layered products comprising a layer of synthetic resin comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/20—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of continuous webs only
    • B32B37/203—One or more of the layers being plastic
    • B32B37/206—Laminating a continuous layer between two continuous plastic layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/06—Coating on the layer surface on metal layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/105—Metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/107—Ceramic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0245—Flakes, flat particles or lamellar particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Definitions

  • the present invention relates to a composite film using a copper thin film layer, a method for producing the same, and utilization thereof.
  • the present invention relates to a multilayer composite film having anisotropic thermal conductivity using a copper thin film layer including a conductive adhesive layer so as to rapidly release heat generated from a heat source such as an electronic substrate of an electronic device.
  • a heat sink or a heat radiating fan is used as a means for effectively dissipating heat generated from an electronic device.
  • the heat dissipation means that can be employed in the field where the thickness should be thin is preferably provided in the form of a sheet to reduce the volume.
  • the heat dissipation means provided in the form of a sheet is mainly used is expanded graphite or expanded resin, such as copper or aluminum, or expanded natural graphite.
  • metal has a large specific gravity, which limits the weight of the product, and due to its structure, heat generated from a heat source is rapidly accepted in the vertical direction, but a hot spot is spread because the distance to spread the heat in the horizontal direction is short. There is a problem that occurs.
  • This hot spot is a local high temperature phenomenon of the substrate, causing a poor resolution of the display or degradation of the product performance.
  • Graphite sheet which is typically used as a material for thin and short reduction and effective thermal diffusion, can compensate for the shortcomings of metal sheets.
  • graphite sheets require surface coating such as a protective film due to lack of electrical insulation. There is a problem.
  • the sheet made of resin Due to the characteristics of the material, the sheet made of resin has a low heat conductivity, and thus has a small heat dissipation effect, a problem of excessive flexibility, and difficulty in handling.
  • Patent Document 1 Korean Patent No. 10-1143524 relates to a heat diffusion sheet, and more specifically, one side of a copper sheet or an aluminum sheet is coated with carbon nanotubes to form a coating, or an adhesive is formed on a copper sheet or an aluminum sheet. Carbon nanotubes are formed on both sides of the stacked sheets, or clad sheets formed by rolling aluminum sheets between copper sheets are formed, carbon nanotubes are formed on both surfaces of the clad sheets, or a plurality of aluminum sheets are rolled.
  • the present invention relates to a heat diffusion sheet having improved conductivity.
  • a high-performance thermal diffusion material which is excellent in durability and reliability of the thermal diffusion material itself and also replaces the graphite sheet.
  • Graphite sheets using representative graphite-based thermal diffusion materials lack electrical insulation and must be accompanied by a surface coating such as attaching a protective film, have a limitation in rework, and cut graphite having graphite characteristics.
  • a surface coating such as attaching a protective film
  • cut graphite having graphite characteristics When the cutting surface is not clean, defects occur, and the interlayer bonding of the powder is weak due to the graphite structure in the cutting process, the graphite powder is easily peeled off and dust is generated, which threatens worker's health.
  • Overcoming problems such as electrical trouble of the final electronic device, film itself brittle and difficult to handle, and in particular, the composite thermal conductivity in the vertical to horizontal direction can replace the graphite-based thermal diffusion material The purpose is to produce a film.
  • the above problem is solved by a multilayer composite film having anisotropic thermal conductivity using a copper thin film layer including an insulating layer and a conductive adhesive layer.
  • a thermally conductive material having an excellent thermal conductivity of about 395 W / mK or a material has the same vertical and horizontal thermal conductivity, and thus a short heat transfer distance in the horizontal direction is not suitable for use as a thermal diffusion material.
  • a ceramic powder of Flake and a metal powder of Flake coated with silver (Ag) were used in combination with a copper thin film.
  • a multilayer composite film having anisotropic thermal conductivity having a structure of a copper thin film layer, a ceramic insulating layer over the copper thin film layer, and a conductive adhesive layer under the copper thin film layer is proposed.
  • the present invention it is possible to manufacture a composite sheet using a multilayer composite film in which the ceramic insulating layer and the conductive adhesive layer are combined with the copper thin film layer to increase the thermal conductivity in the horizontal direction compared to the vertical thermal conductivity, thereby increasing the anisotropy of the thermal conductivity.
  • the multilayer composite film produced by the present invention and the composite sheet using the same have an effect of 50 times or more in the horizontal thermal conductivity ratio in the vertical direction.
  • FIG. 1 shows a method for producing a multilayer composite film having anisotropic thermal conductivity according to an embodiment of the present invention.
  • FIG. 2 is a schematic view of an electronic substrate including a multilayer composite film having anisotropic thermal conductivity according to an embodiment of the present invention.
  • FIG 3 is a cross-sectional view of a multilayer composite film having anisotropic thermal conductivity according to an embodiment of the present invention.
  • Figure 4 shows the thermal conductivity in the horizontal direction relative to the vertical direction of the multilayer composite film having anisotropic thermal conductivity according to an embodiment of the present invention.
  • FIGS. 2 and 3 show a schematic view of a multilayer composite film having anisotropic thermal conductivity and an electronic substrate including the same as a thermally conductive material according to an embodiment of the present invention.
  • the multilayer composite film having anisotropic thermal conductivity includes a copper thin film layer, a ceramic insulating layer over the copper thin film layer, and a conductive adhesive layer under the copper thin film layer.
  • the ceramic insulating layer is at least any one of an acrylic resin, an epoxy resin, an epoxy propylene diene monomer (EPDM) resin, a chlorinated polyethylene (CPE) resin, a silicone, a polyurethane, a urea resin, a melamine resin, a phenol resin, and an unsaturated ester resin. It would be desirable to be dispersed on a polymer resin containing one.
  • the ceramic powder is boron nitride (BN), aluminum oxide (Al 2 O 3 ), silicon carbide (SiC), magnesium oxide (MgO), aluminum hydroxide (Al (OH) 3 ), magnesium hydroxide in the form (Flake) At least one selected from (Mg (OH) 2 ) may be selected, but is not limited thereto.
  • BN Flake boron nitride
  • EPDM ethylene propylene diene monomer
  • the conductive adhesive layer is a metal powder of a flake (Flake) containing at least one of copper (Cu), silver (Ag), silver coated copper (Ag coated Cu), silver coated nickel (Ag coated Ni) on the polymer resin It will be desirable to be dispersed.
  • the polymer resin may include at least one of acrylic resin, epoxy resin, EPDM (Ethylene Propylene Diene Monomer) resin, CPE (Chlorinated Polyethylene) resin, silicone, polyurethane, urea resin, melamine resin, phenol resin, and unsaturated ester resin. It would be desirable to have the Flake metal powder dispersed on the resin.
  • the copper thin film layer is formed on the upper and lower surfaces of nickel (Ni), nickel-chromium (Ni-Cr), iron-chromium-nickel (Fe-Cr-Ni), iron-nickel-cobalt (Fe-Ni-Co), and iron.
  • Nickel-tungsten Fe-Ni-W
  • iron-nickel-molybdenum Fe-Ni-Mo
  • iron-nickel-copper Fe-Ni-Cu
  • iron-nickel-manganese Fe-Ni-Mn
  • Tin-nickel-titanium Sn-Ni-Ti
  • copper-nickel-tin Cu-Ni-Sn
  • nickel-cobalt-copper Ni-Co-Cu
  • nickel-cobalt-zinc Ni-Co- Zn
  • nickel-cobalt-tungsten Ni-Co-W
  • the copper thin film layer may form a coating layer including nickel (Ni) on the upper and lower surfaces thereof.
  • the thickness of the ceramic insulating layer and the conductive adhesive layer may be 5 to 20 ⁇ m, and may be about 10 ⁇ m.
  • the copper thin film layer may have a thickness of 15 to 45 ⁇ m, more preferably about 30 ⁇ m.
  • the thickness of the coating layer on the upper and lower surfaces of the copper thin film layer may be manufactured to 0.1 to 1.5 ⁇ m, more preferably 0.1 to 1.0 ⁇ m.
  • This coating layer has the effect of preventing corrosion of the copper thin film, improving durability, and increasing anisotropy of thermal conductivity.
  • the multilayer composite film having anisotropic thermal conductivity having a structure of a copper thin film layer, a ceramic insulating layer over the copper thin film layer, and a conductive adhesive layer under the copper thin film layer according to the present invention, each layer is composed of a plurality, It would be possible to form a multilayer structure beyond the layer structure.
  • the multilayer composite film having anisotropic thermal conductivity according to the present invention is characterized in that the ratio of the thermal conductivity in the horizontal direction to 50 times or more. More preferably, it is possible that the ratio of the thermal conductivity in the horizontal direction to the vertical direction is 100 times or more.
  • the conductive adhesive layer of the multilayer composite film having a vertical thermal conductivity of 1 W / mK or more and a horizontal thermal conductivity of 5 W / mK or more and having the anisotropic thermal conductivity has a vertical thermal conductivity of 1 W / mK or more and a horizontal direction It will be possible to be prepared to have an anisotropic thermal conductivity, characterized in that the thermal conductivity is 5 W / mK or more.
  • the method for producing a multilayer composite film having anisotropic thermal conductivity of the present invention comprises the steps of (i) dispersing and complexing ceramic powder in a polymer resin to prepare a slurry, (ii) (i) Preparing the ceramic insulation layer using at least one of a tape casting process, a spray coating process, a screen printing process, and a dipping process; and (iii) copper (Cu), silver (Ag), and silver coating.
  • Ni nickel-chromium
  • Ni-Cr nickel-chromium
  • Fe-Cr-Ni iron-chromium-nickel
  • Fe-nickel-cobalt Fe-Ni-Co
  • Fe-Ni-W Iron-nickel-molybdenum
  • Fe-Ni-Mo iron-nickel-copper
  • Fe-Ni-Cu iron-nickel-manganese
  • Sn-Ni Ti copper-nickel-tin
  • Cu-Ni-Sn nickel-cobalt-copper
  • Ni-Co-Zn nickel-cobalt-tungsten
  • Ni Coating by using at least one of -Co-W (vi) nickel (Ni), nickel-chromium (Ni-Cr), iron-chromium-nickel (Fe-Cr-Ni)
  • the content of the ceramic powder in the slurry of step (i) is 30 to 70% by weight. More preferably it will be possible for the content of ceramic powder to be from 20 to 60% by weight.
  • the content of the metal powder in the slurry of step (iii) is 30 to 70% by weight. More preferably it will be possible for the content of ceramic powder to be from 20 to 60% by weight.
  • step (v) may be coated using at least one of a tape casting process, a spray coating process, a screen printing process, and a dipping process.
  • boron nitride (BN) powder with an acrylic resin or EPDM (Ethylene Propylene Diene Monomer) resin to prepare a slurry (boron nitride (BN) content of 40 to 60 wt %) Boron nitride (BN) composite film is produced through a tape casting process.
  • EPDM Ethylene Propylene Diene Monomer
  • Copper (Cu) powder coated with silver of Ag is uniformly dispersed and compounded in an acrylic or epoxy resin to make a uniform slurry (Cu coated with silver (Ag) Content of 40 to 60 wt%)) to produce a conductive composite film through tape casting.
  • the thickness of the nickel (Ni) layer coated on the copper thin film is 0.1 to 1.0 ⁇ m.
  • the composite sheet (rolled copper thin film) including the multilayer composite film having anisotropic thermal conductivity prepared by Example 1 was confirmed that the ratio of the thermal conductivity in the horizontal direction to the vertical direction is 100 times or more as shown in Table 1 below.
  • the present invention has a performance equal to or higher than that of existing graphite-based thermal diffusion sheets.
  • the present invention it is possible to manufacture a composite sheet using a multilayer composite film in which the ceramic insulating layer and the conductive adhesive layer are combined with the copper thin film layer to increase the thermal conductivity in the horizontal direction compared to the vertical thermal conductivity, thereby increasing the anisotropy of the thermal conductivity.
  • Graphite sheets using representative graphite-based thermal diffusion materials lack electrical insulation and must be accompanied by a surface coating such as attaching a protective film, have a limitation in rework, and cut graphite having graphite characteristics.
  • a surface coating such as attaching a protective film
  • cut graphite having graphite characteristics When the cutting surface is not clean, defects occur, and the interlayer bonding of the powder is weak due to the graphite structure in the cutting process, the graphite powder is easily peeled off and dust is generated, which threatens worker's health.
  • Overcoming problems such as electrical trouble of the final electronic device, film itself brittle and difficult to handle, and in particular, the composite thermal conductivity in the vertical to horizontal direction can replace the graphite-based thermal diffusion material The purpose is to produce a film.
  • the present invention has high industrial applicability.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

La présente invention pour objet de permettre la réalisation d'une feuille composite en utilisant un film composite multicouche présentant une anisotropie accrue de conductivité thermique obtenue en posant de manière composite une couche d'isolation en céramique et une couche de conduction électrique sur un film mince en cuivre de façon à accroître la conductivité thermique horizontale par comparaison à la conductivité thermique verticale. En particulier, il est possible de réaliser un film composite présentant une conductivité thermique horizontale supérieure à la conductivité thermique verticale, susceptible de remplacer un matériau graphitique de diffusion de la chaleur. À cette fin, un film composite multicouche est mis en place, présentant une conductivité thermique anisotrope, utilisant un film mince en cuivre comprenant une couche d'isolation et une couche de conduction électrique. La présente invention propose une feuille composite multicouche présentant une anisotropie accrue de conductivité thermique, obtenue en posant de manière composite une couche d'isolation en céramique et une couche de conduction électrique sur un film mince en cuivre de façon à accroître la conductivité thermique horizontale par comparaison à la conductivité thermique verticale.
PCT/KR2014/001280 2013-02-19 2014-02-18 Film composite utilisant un film mince en cuivre comprenant une couche d'isolation et une couche adhésive conductrice, et procédé pour sa réalisation WO2014129776A1 (fr)

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KR1020130017314A KR101458832B1 (ko) 2013-02-19 2013-02-19 절연층과 도전성 접착층을 포함하는 구리 박막층을 이용한 복합 필름과 그 제조방법.
KR10-2013-0017314 2013-02-19

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EP3239243A4 (fr) * 2014-12-25 2018-10-10 Shengyi Technology Co. Ltd. Composition de résine de silicone céramisée et pré-imprégné et stratifié utilisant la composition

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CN108352387B (zh) * 2015-10-26 2022-05-31 京瓷株式会社 拍摄装置、车辆及壳体

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