CN106634657A - Composite material with characteristics of electromagnetic radiation resistance and high thermal conductivity, and preparation method thereof - Google Patents
Composite material with characteristics of electromagnetic radiation resistance and high thermal conductivity, and preparation method thereof Download PDFInfo
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- CN106634657A CN106634657A CN201510512193.3A CN201510512193A CN106634657A CN 106634657 A CN106634657 A CN 106634657A CN 201510512193 A CN201510512193 A CN 201510512193A CN 106634657 A CN106634657 A CN 106634657A
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Abstract
The present invention relates to a composite material with characteristics of electromagnetic radiation resistance and high thermal conductivity. The composite material comprises a first compound layer, a uniform heat layer, a second compound layer and a heat conduction layer, wherein the first compound layer, the uniform heat layer, the second compound layer and the heat conduction layer are sequentially compounded to form the integrate, the total thickness of the composite material is less than or equal to 2 mm, the first compound layer comprises a single-layer or multi-layer viscous colloid, the second compound layer is prepared from the following components by weight: 3-5% of a curing agent and 95-97% of an auxiliary adhesion component, and the uniform heat layer is formed by combining one or two materials selected from a metal and graphite. The present invention further provides a preparation method of the composite material. According to the present invention, the composite material has advantages of good thermal conductivity and good radiation resistance, and the preparation method is simple, is easy to operate, and is suitable for industrial application.
Description
Technical field
The present invention relates to Material Field, and in particular to a kind of compound with anti-electromagnetic-radiation and high thermal conductivity
Material and preparation method thereof.
Background technology
As contemporary electronic technology rapidly develops, the degree of integration and packing density of electronic devices and components are constantly carried
Height, while there is provided powerful use function, also results in the drastically increasing of its operating power consumption and caloric value
Greatly.High temperature will produce injurious effects to the stability of electronic devices and components, reliability and life-span, for example mistake
The node of high temperature entail dangers to quasiconductor, damages the linkage interface of circuit, increases the resistance of conductor and causes
Mechanical stress is damaged.Thereby, it is ensured that the heat produced by heating electronic component can be discharged timely, own Jing
Become an importance of microelectronic product system assembles.It is all higher for degree of integration and packing density
Portable type electronic product (such as mobile phone, panel computer, notebook computer, automotive electronics and communication class product),
Radiating even becomes the technical bottleneck problem of whole product.
At present the more extensive Heat Conduction Material of application is heat-conducting silica gel sheet.At present with regard to heat-conducting silica gel sheet in conductivity of heat
Deficiency analysis in terms of energy and process and assemble are as follows：1st, the heat conductivity of heat-conducting silica gel sheet is typically in 1-5W
Between, specification is more than 0.2-2 millimeters, and the heat-conducting silica gel sheet cost of higher heat conductivity is very high；2nd, lead
Hot silica gel piece thermal impedance is high, and big thickness heat-conducting silica gel sheet capacity of heat transmission is low, and can only point-to-point longitudinal direction
Heat transfer, lateral heat diffusion ability extreme difference, the radiating of the electronic product higher for degree of integration and packing density
Even hot ability；3rd, heat-conducting silica gel sheet assembly performance is not good, and efficiency of assembling is low, is easy in assembling process
Damage, the mechanical stability extreme difference after assembling, the electronic product for needing repairing and reprocessing is not reproducible to be used,
Waste of resource；4th, without the ability of anti-EMI filter interference, and for the applying force extreme difference of radiator structure part；5、
The big heat-conducting silica gel sheet ageing resistance of thickness is weak, and has the risk for oozing out silicone oil, and can produce boil-off gas,
Electronic device (the photographic head, display device) product of gas sensitization is endangered.
The content of the invention
It is an object of the invention to provide a kind of heat conduction efficiency height, low cost, easy processing with anti-electromagnetism
Radiation and the composite of high thermal conductivity, the present invention also provides the preparation method of the composite.
To solve the above problems, the technical solution adopted in the present invention is as follows：
A kind of composite with anti-electromagnetic-radiation and high thermal conductivity, the composite includes multiple successively
The first composite bed, even thermosphere, the second composite bed and the heat-conducting layer being integrated, the total thickness of the composite
Degree≤2mm；First composite bed is made up of the sticky gum of monolayer or multilamellar, and the sticky gum is
Conducting resinl and/or heat-conducting glue；The material of the even thermosphere is a material or two kinds of materials in metal and graphite
With reference to, specially metal forming, graphite flake, be compounded with the graphite flake of layer of metal, be compounded with one layer of graphite
Metal forming, it is compounded with one or several combination in the metal forming of one layer of carbon nano coating；Described second answers
Close layer by according to percent by weight as lower component make：Firming agent 3-5%, help viscous component 95-97%；
It is described to help viscous component for one or more the combination in silica gel treatment, viscosifier, thickening silane coupling agent；
The heat-conducting layer is made up of at least one material in heat conductive silica gel, heat-conducting glue band, heat-absorbing material.
In the present invention, the first composite bed can be good at laminating, moistening heater members, fully and heater members
Surface contacts, and squeezes away air, reduces the thermal resistance on surface, and heat is preferably conducted to even thermosphere, and with
Even thermosphere combines closely to ensure the radiation resistance of product；It can be in conducting resinl, heat-conducting glue, insulating cement etc.
Selected in binding agent, concrete species can be selected according to the needs of user.Even thermosphere, can be efficient
Each tropism conduction of heat diffusivity and anti-electromagnetic-radiation ability, make focus switch to hot face, strengthen the horizontal stroke of product
To even heat energy power；Graphite flake can be selected from, the graphite flake of layer of metal be compounded with, be compounded with one layer of graphite
Metal forming, the metal forming for being compounded with one layer of carbon nano coating, metal forming；Metal forming therein is at least by one layer
Sheet metal is made, the metal forming that such as copper sheet and stannum piece are composited, and complex method can be composite electroplated grade side
Formula.Second composite bed, the surface polarity for helping viscous component to be effectively improved heat conduction layer material therein, carries significantly
High adhesiveness energy.Heat-conducting layer, can be sufficiently humidified so as to the surface of heater members, allow it to be fully contacted device, squeeze
Air is walked, surface thermal contact resistance is reduced, heat is conducted to even thermosphere；Another side by the second composite bed with
Even thermosphere is combined closely.
In the composite of the present invention, the second composite bed of selection can improve the surface polarity of heat-conducting layer, make
Preferably bonding is integrated with even thermosphere to obtain heat-conducting layer, increases the heat conductivility of material；In use, adopt
Heat-conducting layer, the first composite bed (conducting resinl and/or heat-conducting glue material) can be good at laminating, moistening heating
Device, fully contacts with heater members surface, squeezes away air, reduces the thermal resistance on surface, and heat is more preferable
Conduct to even thermosphere；Metal and/or the material of graphite that even thermosphere is adopted, with good heat conductivility and anti-
Radiance, at horizontal and vertical aspect good conductive force can be reached, and further lift overall leading
Hot property；In sum, composite of the invention, with good heat conduction efficiency and radiation resistance,
Additionally there is low cost, easy processing.
Heat-conducting glue band in the present invention, including but not limited to bond plies；Heat-absorbing material in the present invention,
Including but not limited to silica gel.
In the present invention, preferred scheme is made up of for the metal forming least one layer of sheet metal.
In the present invention, it is silica gel firming agent that preferred scheme is the firming agent；The viscosifier are selected from as follows
Material：Siloxane oligomer containing phenyl or ester group, the polymethyl hydrogen siloxane containing phenyl, hetero nitrogen silicon tricyclic
The secondary amine of derivant, base containing trialkoxy silane and ester group；The silane coupling agent is as follows by parts by weight
Component is made：Chlorinated polypropylene 16.2-48.3 parts, organosilicon polymer 7.8-46.6 parts, crylic acid resin
Copolymer 2.3-44.5 parts, titanate coupling agent 0.7-31.9 parts, benzene kind solvent 14.2-161.3 parts, quinoline
0.8-34.2 parts, solvent 0.9-9.4 parts；Wherein, described organosilicon polymer is selected from aminopropyldimethoxy
The polydimethylsiloxane of end-blocking, polydimethylsiloxane, the chlorobutyl three of aminobutyl dimethoxy end-blocking
Methoxy silane, methylvinyldiethoxysilane and polydimethylsiloxane；The molecular weight of chlorinated polypropylene is
1500-25000；The titanate coupling agent is butyl titanate；The benzene kind solvent is selected from benzene, toluene and two
Toluene；The solvent is selected from isopropanol, ethanol, ethyl acetate, dichloromethane, dichloroethanes, three chloroethenes
Alkane and sym-tetrachloroethane；Described acrylic acid esters co-polymer is selected from acrylic acid, acrylic acid methyl ester., acrylic acid second
The random copolymer of ester, propyl acrylate, butyl acrylate or Hydroxypropyl acrylate；Described stabilizer choosing
From double (2,2,6,6- tetramethyl -4- piperidyls) sebacates, poly-succinic (4- hydroxyl -2,2,6,6- tetramethyls
Base -1- piperidine ethanols) ester, it is poly- [6- [(1,1,3,3- tetramethyl butyl)-imino group] -1,3,5-triazines -2,
4- diyls] [2- (2,2,6,6- tetramethyl-piperidyl)-nitrilo]-hexylidene-[4- (2,2,6,6- tetramethyl piperidines
Base)-amino], double (1,2,2,6,6- pentamethyl -4- piperidines) sebacates and 1- methyl -8- (1,2,2,6,
6- pentamethyl -4- piperidines) sebacate mixture, four [β-(3,5- di-tert-butyl-hydroxy phenyl) propionic ester]
Pentaerythritol ester and 2- hydroxyls -4- n-octyloxies-benzophenone.
In the present invention, preferred scheme be first composite bed thickness be 0.001-0.2mm, the even heat
The thickness of layer is 0.01-0.48mm；The thickness of second composite bed be 0.001-0.2mm, the heat-conducting layer
Thickness be 0.05-1.0mm.
In the present invention, preferred scheme is second composite bed by the following component according to percent by weight
Make：Firming agent 3.5%, help viscous component 96.5%；The thickness of first composite bed is 0.06mm, described
The thickness of even thermosphere is 0.42mm；The thickness of second composite bed be 0.08mm, the thickness of the heat-conducting layer
Spend for 0.82mm.
In the present invention, preferred scheme is the leafing type that is also respectively compounded with two surfaces of the composite
Film or release paper.
In the present invention, preferred scheme be the mould release membrance be PET mould release membrances, PE mould release membrances and OPP from
One kind in type film.The addition of mould release membrance or release paper, can preferably protect the products from external dust and
The pollution of debris, and keep the outward appearance and performance of glue-line unaffected.When in use, directly mould release membrance torn
Fall, then the composite is fitted with heater members.
In the present invention, it is Dongguan City rapid development rubber plastic company limited that preferred scheme is the silica gel treatment
The silica gel treatment of production；The firming agent is the silica gel firming agent of Jinan Ying Yu Chemical Co., Ltd.s production.
The present invention also provides the preparation method of the composite with anti-electromagnetic-radiation and high thermal conductivity, bag
Include following steps：
A. conducting resinl and/or heat-conducting glue are compounded on even thermosphere using coating or the mode fitted, are combined
There is the even thermosphere of the first composite bed；
B. viscous component will be helped to mix homogeneously with firming agent, will be then coated with heat-conducting layer, and obtain being compounded with second
The heat-conducting layer of composite bed；
C. by the even thermosphere for being compounded with the first composite bed obtained through a steps and answering for obtaining through b step
The heat-conducting layer that conjunction has the second composite bed fits together, and then drying or natural air drying, obtain final product product.
The present invention also provides the preparation method of the composite with anti-electromagnetic-radiation and high thermal conductivity, bag
Include following steps：
A. conducting resinl and/or heat-conducting glue are compounded on even thermosphere using coating or the mode fitted, are combined
There is the even thermosphere of the first composite bed；
B. viscous component will be helped to mix homogeneously with firming agent, will be then coated with the even thermosphere crossed through a step process
On, obtain being compounded with the even thermosphere of the second composite bed；
C. heat-conducting layer is processed into what is obtained by a kind of mode in laminating, coating and spraying with through b step
Even thermosphere is combined with each other, and then drying or natural air drying, obtain final product product.
The selection of heat-conducting layer and even thermosphere complex method in step c in preparation method, can be according to heat-conducting layer
Thickness being selected, in general, the mode and even thermosphere of the preferred laminating of the bigger heat-conducting layer of thickness
It is combined with each other；More relatively thin heat-conducting layer, the mode being preferably coated with is combined with each other with even thermosphere；It is thinner
The heat-conducting layer of a bit, the mode of preferred spraying is combined with each other with even thermosphere.
Compared with prior art, the invention has the advantages that：From the second composite bed can improve heat conduction
The surface polarity of layer so that preferably bonding is integrated heat-conducting layer with even thermosphere, increases the heat conductivility of material；
In use, the heat-conducting layer of employing, the first composite bed (conducting resinl and/or heat-conducting glue material) can be good at
Laminating, moistening heater members, fully contact with heater members surface, squeeze away air, reduce the thermal resistance on surface,
Heat is preferably conducted to even thermosphere；Metal and/or the material of graphite that even thermosphere is adopted, with good
Heat conductivility and radiation resistance, can reach good conductive force, further at horizontal and vertical aspect
Lift overall heat conductivility；In sum, composite of the invention, with good heat conduction efficiency
And radiation resistance, additionally there is low cost, easy processing；Its preparation method is simple, easy to operate,
It is easy to commercial Application.
Below in conjunction with the accompanying drawings and specific embodiment the present invention is described in detail.
Description of the drawings
Fig. 1 is the structural representation with anti-electromagnetic-radiation and the composite of high thermal conductivity of embodiment 1.
Wherein, the 1, first composite bed；2nd, even thermosphere；3rd, the second composite bed；4th, heat conduction silicone.
Specific embodiment
In the specific embodiment of the present invention, in embodiment, comparative example, heat-conducting glue is Nanjing Heineken spy's glue
The heat-conducting glue of model W-3 of stick company limited production；Conducting resinl, is that the auspicious brightness electronic material in granary is limited
Company production model E630-C without base material conducting resinl；Silica gel treatment, is Dongguan City rapid development rubber plastic
The silica gel treatment of model TF-222 of material company limited production；Firming agent, is that win abundant chemical industry in Jinan is limited
The silica gel firming agent of the model 107 of company's production；Even thermosphere is tinfoil paper；Heat-conducting layer is made up of heat conductive silica gel
Heat conduction silicone；Thickening silane coupling agent, is the thickening primary coat of model 3M94# of Minnesota Mining and Manufacturing Company's production
Agent.
There should be the preparation method of the composite of anti-electromagnetic-radiation and high thermal conductivity, comprise the steps：
A. conducting resinl and/or heat-conducting glue are compounded on even thermosphere using coating or the mode fitted, are combined
There is the even thermosphere of the first composite bed；
B. viscous component will be helped to mix homogeneously with firming agent, will be then coated with heat-conducting layer, and obtain being compounded with second
The heat-conducting layer of composite bed；
C. by the even thermosphere for being compounded with the first composite bed obtained through a steps and answering for obtaining through b step
The heat-conducting layer that conjunction has the second composite bed fits together, and then drying or natural air drying, obtain final product product.
Embodiment 1
A kind of composite with anti-electromagnetic-radiation and high thermal conductivity, the composite includes multiple successively
The first composite bed, even thermosphere, the second composite bed and the heat conduction silicone being integrated, second composite bed
It is made up of the following component according to percent by weight：Firming agent 3.5%, silica gel treatment 96.5%；It is described
The thickness of the first composite bed is 0.06mm, and the thickness of the even thermosphere is 0.42mm；Second composite bed
Thickness be 0.08mm, the thickness of the heat conduction silicone is 0.82mm.
Embodiment 2
A kind of composite with anti-electromagnetic-radiation and high thermal conductivity, it is characterised in that：The composite wood
Material includes the first composite bed, even thermosphere, the second composite bed and the heat conduction silicone being complex as a whole successively, institute
State the second composite bed to be made up of the following component according to percent by weight：Firming agent 3%, silica gel treatment 97%；
The thickness of first composite bed is 0.001mm, and the thickness of the even thermosphere is 0.01mm；Described second answers
The thickness for closing layer is 0.001mm, and the thickness of the heat conduction silicone is 0.05mm.
Embodiment 3
A kind of composite with anti-electromagnetic-radiation and high thermal conductivity, it is characterised in that：The composite wood
Material includes the first composite bed, even thermosphere, the second composite bed and the heat conduction silicone being complex as a whole successively, institute
State the second composite bed to be made up of the following component according to percent by weight：Firming agent 5%, silica gel treatment 95%；
The thickness of first composite bed is 0.2mm, and the thickness of the even thermosphere is 0.48mm；Described second is combined
The thickness of layer is 0.2mm, and the thickness of the heat conduction silicone is 1mm.
Embodiment 4
A kind of composite with anti-electromagnetic-radiation and high thermal conductivity, the composite includes multiple successively
The first composite bed, even thermosphere, the second composite bed and the heat conduction silicone being integrated, second composite bed
It is made up of the following component according to percent by weight：Firming agent 3.5%, silica gel treatment 96.5%；It is described
The thickness of the first composite bed is 0.08mm, and the thickness of the even thermosphere is 0.36mm；Second composite bed
Thickness be 0.12mm, the thickness of the heat conduction silicone is 0.78mm.
Embodiment 5
A kind of composite with anti-electromagnetic-radiation and high thermal conductivity, the composite includes multiple successively
The first composite bed, even thermosphere, the second composite bed and the heat conduction silicone being integrated, second composite bed
It is made up of the following component according to percent by weight：Firming agent 3.5%, silica gel treatment 96.5%；It is described
The thickness of the first composite bed is 0.15mm, and the thickness of the even thermosphere is 0.46mm；Second composite bed
Thickness be 0.06mm, the thickness of the heat conduction silicone is 0.92mm.
Embodiment 6
A kind of composite with anti-electromagnetic-radiation and high thermal conductivity, it is characterised in that：The composite wood
Material includes the first composite bed, even thermosphere, the second composite bed and the heat conduction silicone being complex as a whole successively, institute
State the second composite bed to be made up of the following component according to percent by weight：Firming agent 5%, thickening silane coupling agent 95%；
The thickness of first composite bed is 0.2mm, and the thickness of the even thermosphere is 0.48mm；Described second is combined
The thickness of layer is 0.2mm, and the thickness of the heat conduction silicone is 1mm.
Comparative example 1
A kind of composite with anti-electromagnetic-radiation and high thermal conductivity, second composite bed is by according to weight
The following component of amount percent meter is made：Firming agent 2%, silica gel treatment 98%；Remaining structure, parameter are equal
It is same as Example 1.
Comparative example 2
A kind of composite with anti-electromagnetic-radiation and high thermal conductivity, second composite bed is by according to weight
The following component of amount percent meter is made：Firming agent 6%, silica gel treatment 94%；Remaining structure, parameter are equal
It is same as Example 1.
Comparative example 3
A kind of composite with anti-electromagnetic-radiation and high thermal conductivity, the thickness of first composite bed is
0.01mm, the thickness of the even thermosphere is 0.52mm；The thickness of second composite bed be 0.005mm, institute
The thickness for stating heat conduction silicone is 1.5mm, and remaining structure, parameter are same as Example 1.
Comparative example 4
A kind of composite with anti-electromagnetic-radiation and high thermal conductivity, the thickness of first composite bed is
0.005mm, the thickness of the even thermosphere is 0.005mm；The thickness of second composite bed is 0.23mm,
The thickness of the heat conduction silicone is 0.52mm, and remaining structure, parameter are same as Example 1.
Comparative example 5
A kind of composite with anti-electromagnetic-radiation and high thermal conductivity, second composite bed is by silicon AB glue
Make, remaining structure, parameter are same as Example 1.
Comparative example 6
A kind of composite with anti-electromagnetic-radiation and high thermal conductivity, second composite bed is by AB glue systems
Into remaining structure, parameter are same as Example 2.
Experimental example
The obtained composite with anti-electromagnetic-radiation and high thermal conductivity of Example 1-6, comparative example 1-6,
Then using ASTM E1461-2013 flicker methods the standard test method of solid conductive heat is determined to above-mentioned each reality
Apply heat conductivity of the composite of example, comparative example at 20 DEG C to be tested, concrete test refers to table 1 below：
Table 1：Determination of conductive coefficients tables of data
The compound with anti-electromagnetic-radiation and high thermal conductivity of the present invention is can be seen that by data in upper table 1
Material, heat conductivity is apparently higher than comparative example, it is seen that with good heat conductivility.Additionally, the present invention
Embodiment has the composite of anti-electromagnetic-radiation and high thermal conductivity, employs metallic tin so that material is obtained
Obtained good radiation resistance.
Above-mentioned embodiment is only the preferred embodiment of the present invention, it is impossible to present invention protection is limited with this
Scope, the change and replacement of any unsubstantiality that those skilled in the art is done on the basis of the present invention
Belong to scope of the present invention.
Claims (10)
1. a kind of composite with anti-electromagnetic-radiation and high thermal conductivity, it is characterised in that：It is described compound
Material includes the first composite bed, even thermosphere, the second composite bed and the heat-conducting layer being complex as a whole successively, described
Gross thickness≤the 2mm of composite；
First composite bed is made up of the sticky gum of monolayer or multilamellar, and the sticky gum is conducting resinl
And/or heat-conducting glue；
The material of the even thermosphere is the combination of a material or two kinds of materials in metal and graphite, specially gold
Belong to paper tinsel, graphite flake, be compounded with the graphite flake of layer of metal, be compounded with the metal forming of one layer of graphite, be compounded with
One or several combination in the metal forming of one layer of carbon nano coating；
Second composite bed by according to percent by weight as lower component make：Firming agent 3-5%, help
Viscous component 95-97%；It is described help viscous component for silica gel treatment, viscosifier, thickening silane coupling agent in one kind or
Two or more combinations；
The heat-conducting layer is made up of at least one material in heat conductive silica gel, heat-conducting glue band, heat-absorbing material.
2. the composite with anti-electromagnetic-radiation and high thermal conductivity according to claim 1, it is special
Levy and be：The metal forming is made up of least one layer of sheet metal.
3. the composite with anti-electromagnetic-radiation and high thermal conductivity according to claim 1, it is special
Levy and be：The firming agent is silica gel firming agent；
The viscosifier are selected from following material：Siloxane oligomer containing phenyl or ester group, the poly- first containing phenyl
The secondary amine of base hydrogen siloxane, Silatrane Derivatives, base containing trialkoxy silane and ester group；
The silane coupling agent is made up of following component in parts by weight：Chlorinated polypropylene 16.2-48.3 parts, have
Organosilicon polymer 7.8-46.6 parts, acrylic resin analog copolymer 2.3-44.5 parts, titanate coupling agent 0.7-31.9
Part, benzene kind solvent 14.2-161.3 parts, quinoline 0.8-34.2 parts, solvent 0.9-9.4 parts；Wherein, it is described
Polydimethylsiloxane, aminobutyl dimethoxy of the organosilicon polymer selected from aminopropyldimethoxy end-blocking
Polydimethylsiloxane, chlorobutyl trimethoxy silane, the methylvinyldiethoxysilane and poly- two of base end-blocking
Methylsiloxane；The molecular weight of chlorinated polypropylene is 1500-25000；The titanate coupling agent is metatitanic acid four
Butyl ester；The benzene kind solvent is selected from benzene, toluene and dimethylbenzene；The solvent is selected from isopropanol, ethanol, second
Acetoacetic ester, dichloromethane, dichloroethanes, trichloroethane and sym-tetrachloroethane；Described acrylic ester copolymerization
Thing is selected from acrylic acid, acrylic acid methyl ester., ethyl acrylate, propyl acrylate, butyl acrylate or acrylic acid
The random copolymer of hydroxypropyl acrylate；Described stabilizer is selected from double (2,2,6,6- tetramethyl -4- piperidyls) last of the ten Heavenly stems two
Acid esters, poly-succinic (4- hydroxyl -2,2,6,6- tetramethyl -1- piperidine ethanols) ester, it is poly- [6- [(1,1,3,
3- tetramethyl butyls)-imino group] -1,3,5-triazines -2,4- diyls] [2- (2,2,6,6- tetramethyl-piperidyl) -
Nitrilo]-hexylidene-[4- (2,2,6,6- tetramethyl-piperidyl)-amino], double (1,2,2,6,6- pentamethyls
- 4- piperidines) sebacate and 1- methyl -8- (1,2,2,6,6- pentamethyl -4- piperidines) sebacate mixture,
Four [β-(3,5- di-tert-butyl-hydroxy phenyl) propionic ester] pentaerythritol esters and 2- hydroxyls -4- n-octyloxies-hexichol
Ketone.
4. the composite wood with anti-electromagnetic-radiation and high thermal conductivity according to any one of claim 1-3
Material, it is characterised in that：The thickness of first composite bed is 0.001-0.2mm, and the thickness of the even thermosphere is
0.01-0.48mm；The thickness of second composite bed is 0.001-0.2mm, and the thickness of the heat-conducting layer is
0.05-1.0mm。
5. the composite with anti-electromagnetic-radiation and high thermal conductivity according to claim 4, it is special
Levy and be：Second composite bed is made up of the following component according to percent by weight：Firming agent 3.5%,
Help viscous component 96.5%；The thickness of first composite bed is 0.06mm, and the thickness of the even thermosphere is
0.42mm；The thickness of second composite bed is 0.08mm, and the thickness of the heat-conducting layer is 0.82mm.
6. the composite wood with anti-electromagnetic-radiation and high thermal conductivity according to any one of claim 1-3
Material, it is characterised in that：One layer of mould release membrance or release paper are also respectively compounded with two surfaces of the composite.
7. the composite with anti-electromagnetic-radiation and high thermal conductivity according to claim 6, it is special
Levy and be：The mould release membrance is the one kind in PET mould release membrances, PE mould release membrances and OPP mould release membrances.
8. the composite wood with anti-electromagnetic-radiation and high thermal conductivity according to any one of claim 1-3
Material, it is characterised in that：The silica gel treatment is the silica gel of Dongguan City rapid development rubber plastic company limited production
Inorganic agent；The firming agent is the silica gel firming agent of Jinan Ying Yu Chemical Co., Ltd.s production.
9. the preparation with anti-electromagnetic-radiation and the composite of high thermal conductivity according to claim 1
Method, it is characterised in that comprise the steps：
A. conducting resinl and/or heat-conducting glue are compounded on even thermosphere using coating or the mode fitted, are combined
There is the even thermosphere of the first composite bed；
B. viscous component will be helped to mix homogeneously with firming agent, will be then coated with heat-conducting layer, and obtain being compounded with second
The heat-conducting layer of composite bed；
C. by the even thermosphere for being compounded with the first composite bed obtained through a steps and answering for obtaining through b step
The heat-conducting layer that conjunction has the second composite bed fits together, and then drying or natural air drying, obtain final product product.
10. the system with anti-electromagnetic-radiation and the composite of high thermal conductivity according to claim 1
Preparation Method, it is characterised in that comprise the steps：
A. conducting resinl and/or heat-conducting glue are compounded on even thermosphere using coating or the mode fitted, are combined
There is the even thermosphere of the first composite bed；
B. viscous component will be helped to mix homogeneously with firming agent, will be then coated with the even thermosphere crossed through a step process
On, obtain being compounded with the even thermosphere of the second composite bed；
C. heat-conducting layer is processed into what is obtained by a kind of mode in laminating, coating and spraying with through b step
Even thermosphere is combined with each other, and then drying or natural air drying, obtain final product product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510512193.3A CN106634657B (en) | 2015-08-19 | 2015-08-19 | Composite material with electromagnetic radiation resistance and high thermal conductivity and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510512193.3A CN106634657B (en) | 2015-08-19 | 2015-08-19 | Composite material with electromagnetic radiation resistance and high thermal conductivity and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106634657A true CN106634657A (en) | 2017-05-10 |
| CN106634657B CN106634657B (en) | 2020-10-16 |
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| CN201510512193.3A Active CN106634657B (en) | 2015-08-19 | 2015-08-19 | Composite material with electromagnetic radiation resistance and high thermal conductivity and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110421941A (en) * | 2019-08-08 | 2019-11-08 | 邦威防护科技股份有限公司 | A kind of electric heating fabric that heat preservation protection is taken |
| US11759726B2 (en) | 2018-09-06 | 2023-09-19 | China Petroleum & Chemical Corporation | Process for separating alkylation product, alkylation reaction and separation process, and related apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202322703U (en) * | 2011-11-07 | 2012-07-11 | 吴志高 | Adhesive tape with heat conduction performance |
| CN103059760A (en) * | 2012-12-18 | 2013-04-24 | 斯迪克新型材料（江苏）有限公司 | Heat conductive adhesive film with heat dissipation function and manufacturing method thereof |
| CN103113789A (en) * | 2011-11-17 | 2013-05-22 | 上海杰事杰新材料(集团)股份有限公司 | Primer for hard-bonding materials and preparation method thereof |
| CN202953976U (en) * | 2012-10-17 | 2013-05-29 | 东莞市航达电子有限公司 | Conductive cloth adhesive tape |
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2015
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202322703U (en) * | 2011-11-07 | 2012-07-11 | 吴志高 | Adhesive tape with heat conduction performance |
| CN103113789A (en) * | 2011-11-17 | 2013-05-22 | 上海杰事杰新材料(集团)股份有限公司 | Primer for hard-bonding materials and preparation method thereof |
| CN202953976U (en) * | 2012-10-17 | 2013-05-29 | 东莞市航达电子有限公司 | Conductive cloth adhesive tape |
| CN103059760A (en) * | 2012-12-18 | 2013-04-24 | 斯迪克新型材料（江苏）有限公司 | Heat conductive adhesive film with heat dissipation function and manufacturing method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11759726B2 (en) | 2018-09-06 | 2023-09-19 | China Petroleum & Chemical Corporation | Process for separating alkylation product, alkylation reaction and separation process, and related apparatus |
| CN110421941A (en) * | 2019-08-08 | 2019-11-08 | 邦威防护科技股份有限公司 | A kind of electric heating fabric that heat preservation protection is taken |
| CN110421941B (en) * | 2019-08-08 | 2021-09-10 | 邦威防护科技股份有限公司 | Electric heating fabric for thermal insulation protective clothing |
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| CN106634657B (en) | 2020-10-16 |
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