CN103763892A - Heat conduction graphite patch for microelectronic device - Google Patents

Heat conduction graphite patch for microelectronic device Download PDF

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Publication number
CN103763892A
CN103763892A CN201410037378.9A CN201410037378A CN103763892A CN 103763892 A CN103763892 A CN 103763892A CN 201410037378 A CN201410037378 A CN 201410037378A CN 103763892 A CN103763892 A CN 103763892A
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CN
China
Prior art keywords
graphite
film
parts
heat
polyimide film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201410037378.9A
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Chinese (zh)
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CN103763892B (en
Inventor
金闯
杨晓明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sidike New Materials Jiangsu Co Ltd
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Sidike New Materials Jiangsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority to CN201610777909.7A priority Critical patent/CN106366971A/en
Priority to CN201610787557.3A priority patent/CN106520003A/en
Application filed by Sidike New Materials Jiangsu Co Ltd filed Critical Sidike New Materials Jiangsu Co Ltd
Priority to CN201610696479.6A priority patent/CN106332521A/en
Priority to CN201610704135.5A priority patent/CN106281087A/en
Priority to CN201610696474.3A priority patent/CN106318250A/en
Priority to CN201610794749.7A priority patent/CN106398570A/en
Priority to CN201610787504.1A priority patent/CN106520002A/en
Priority to CN201610777537.8A priority patent/CN106398567A/en
Priority to CN201610799197.9A priority patent/CN106381083A/en
Priority to CN201610777340.4A priority patent/CN106398566A/en
Priority to CN201610696862.1A priority patent/CN106304780B/en
Priority to CN201610777536.3A priority patent/CN106349965A/en
Priority to CN201610777339.1A priority patent/CN106349964A/en
Priority to CN201610705884.XA priority patent/CN106332522A/en
Priority to CN201410037378.9A priority patent/CN103763892B/en
Priority to CN201610705947.1A priority patent/CN106304783B/en
Priority to CN201610700227.6A priority patent/CN106413340A/en
Priority to CN201610778259.8A priority patent/CN106634658A/en
Priority to CN201610787521.5A priority patent/CN106535560A/en
Priority to CN201610777925.6A priority patent/CN106427180B/en
Priority to CN201610696475.8A priority patent/CN106318251A/en
Publication of CN103763892A publication Critical patent/CN103763892A/en
Application granted granted Critical
Publication of CN103763892B publication Critical patent/CN103763892B/en
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    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
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    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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    • C09J2467/005—Presence of polyester in the release coating

Abstract

The invention discloses a heat conduction graphite patch for a microelectronic device. The heat conduction graphite patch comprises a first heat conduction adhesive layer, a graphite layer and a second heat conduction adhesive layer, the graphite layer is obtained through the following technique, and the technique comprises the following steps that the upper surface and the lower surface of a polyimide film after the first step are coated with graphite modifiers to obtain the processed polyimide film; the processed polyimide film is heated to 800 DEG C, heat preservation is carried out, and then the film is heated to 1200 DEG C to obtain a pre-burned carbonization film; a calender is adopted to calender the pre-burned carbonization film in the fourth step; the carbonization film is heated to 2400 DEG C, heat preservation is carried out, then the film is heated to 2900 DEG C, and therefore a mainly-burnt graphite film is obtained; the mainly-burnt graphite film obtained in the fifth step is calendered to obtain the graphite layer. The method avoids local overheating of adhesive tape, uniformity of heat conduction performance of the adhesive tape is achieved, the stability and reliability of heat dissipation performance of the patch are improved, and the cost of the patch is greatly reduced.

Description

Conductive graphite paster for microelectronic component
Technical field
The present invention relates to a kind of conductive graphite paster for microelectronic component, belong to double faced adhesive chip technology field.
Background technology
Along with modern microelectric technique high speed development, electronic equipment (as notebook computer, mobile phone, panel computer etc.) becomes ultra-thin, light day by day, this structure obviously improves electronic equipment internal power density, and in service produced heat is difficult for discharging, be easy to run-up and form high temperature.On the other hand, high temperature can reduce performance, reliability and the useful life of electronic equipment.Therefore, current electron trade proposes more and more higher requirement for the heat sink material as heat control system core component, in the urgent need to a kind of high-efficiency heat conduction, light material, rapidly heat is passed, and ensures that electronic equipment normally moves.
In prior art, polyimide film is used for greatly flexible PCB, although there is the polyimide film sintered acquisition graphite heat radiation fin of employing, thereby paste on thermal source, but be limited to product quality and performances very different of polyimide film, had influence on the performance of the two-sided pad pasting heat dispersion that dispels the heat, there is following technical problem: dispel the heat inhomogeneous, be prone to adhesive tape local overheating, the heat dispersion that improved product is unstable, reliability performance is poor, be unfavorable for product quality management control, affect the competitiveness of product.
Summary of the invention
The object of the invention is to provide a kind of conductive graphite paster for microelectronic component, should all improve heat conductivility with horizontal direction in the vertical direction for the conductive graphite paster of microelectronic component, avoid adhesive tape local overheating, realized the inhomogeneity while of adhesive tape heat conductivility, improve heat dispersion stability, the reliability of product, greatly reduced the cost of product.
For achieving the above object, the technical solution used in the present invention is: a kind of conductive graphite paster for microelectronic component, the two-sided pad pasting of described heat radiation fits between heat sink and heat generating components, the two-sided pad pasting of described heat radiation comprises light strippable PET film and heavy strippable PET film, is disposed with the first heat-conducting glue adhesion coating, graphite linings and the second heat-conducting glue adhesion coating between this light strippable PET film and heavy strippable PET film; Described graphite linings obtains by following process, and this process comprises the following steps:
Step 1, polyimide film is risen to 250 ℃ from room temperature, be down to room temperature after rising to 400 ℃ after insulation;
Step 2, all apply graphite modified dose of one deck obtain the polyimide film after processing on the upper and lower surface of the polyimide film through step 1, the viscosity of described graphite modified dose is 30000 ~ 48000CP;
Described graphite modified dose of component by following weight portion forms:
20 ~ 25 parts of benzophenone tetracarboxylic dianhydrides,
12 ~ 18 parts of pyromellitic acid anhydrides,
20 ~ 28 parts of MDAs,
30 ~ 35 parts of dimethyl formamides,
1.5 ~ 2.5 parts of ethylene glycol,
2 ~ 3 parts of dimethyl silicone polymers;
Step 3, the polyimide film after processing is warming up to 800 ℃, after insulation, is being warming up to 1200 ℃, cooling after insulation, thus obtain the carbonized film of pre-burned;
Step 4, employing calender roll the carbonized film of the pre-burned of described step 4;
Step 5, be warming up to 2400 ℃, after insulation, be warming up to again 2900 ℃, cooling after insulation, thus obtain the main graphite film of firing;
Thereby step 6, the graphite film that then master of step 5 gained fires roll and obtain described graphite linings (6).
In technique scheme, further improved plan is as follows:
1,, in such scheme, described graphite modified dose of component by following weight portion forms:
20 ~ 25 parts of benzophenone tetracarboxylic dianhydrides,
14 ~ 16 parts of pyromellitic acid anhydrides,
22 ~ 26 parts of MDAs,
32 ~ 35 parts of dimethyl formamides,
1.8 ~ 2.5 parts of ethylene glycol,
2.5 ~ 3 parts of dimethyl silicone polymers.
2, in such scheme, described graphite linings obtains by following process, and this process comprises the following steps:
Step 1, polyimide film is risen to 250 ℃ with 4 ~ 6 degree/min speed from room temperature, keep 0.9 ~ 1.1 hour, then with 2.5 ~ 3.5 degree/min, rise to 400 ℃, keep near room temperature after 1 hour;
Step 2, on the upper and lower surface of the polyimide film through step 1, all apply graphite modified dose of one deck and obtain the polyimide film after processing;
Step 3, with the speed of 4 ~ 6 degree/min, rise to 800 ℃, keep 0.9 ~ 1.1 hour; Speed with 9 ~ 11 degree/min rises to 1200 ℃ again, preserve cooling after 0.9 ~ 1.1 hour, thereby obtain the carbonized film of pre-burned;
Step 4, employing calender roll the carbonized film of the pre-burned of described step 4;
Step 5, with the speed of 19 ~ 21 degree/min, rise to 2400 ℃, keep 0.9 ~ 1.1 hour, then rise to 2900 ℃ with the speed of 19 ~ 21 degree/min, keep cooling after 1.8 ~ 2.2 hours, thereby obtain the main graphite film of firing;
Thereby step 6, the graphite film that then master of step 3 gained fires roll and obtain described graphite linings (6).
3,, in such scheme, described step 4 is obtained to graphite film and carry out calendering process.
4,, in such scheme, the grammes per square metre of described light strippable PET film peeling force is 5 ~ 10g/m 2, the grammes per square metre of described heavy strippable PET film peeling force is 50 ~ 100g/m 2.
Because technique scheme is used, the present invention compared with prior art has following advantages and effect:
The present invention is for the conductive graphite paster of microelectronic component, the polyimide film that in its structure, graphite linings all applies graphite modified dose of one deck by upper and lower surface is prepared from, improved in the vertical direction the heat conductivility with horizontal direction, avoid adhesive tape local overheating, realized the uniformity of adhesive tape heat conductivility; Secondly, it is positioned at graphite modified dose of polyimide film surface and is comprised of 2 ~ 3 parts of 20 ~ 25 parts of benzophenone tetracarboxylic dianhydrides, 12 ~ 18 parts of pyromellitic acid anhydrides, 20 ~ 28 parts of MDAs, 30 ~ 35 parts of dimethyl formamides, 1.5 ~ 2.5 parts of ethylene glycol, dimethyl silicone polymer, be coated on polyimide film, filled the pin hole in heating process, improved degree of crystallinity simultaneously, also overcome excessive cause inhomogeneous of thermal contraction, improved graphite linings biaxial tension performance; Again, polyimide film surface has graphite modified dose, graphite linings and heat-conducting glue adhesion coating heat conductivility in two-sided pad pasting have been improved, and adopt calender to roll the carbonized film of described pre-burned, avoided the volume contraction in fold and graphitization sintering process, improve compactness and degree of crystallinity, further improved in the vertical direction the heat conductivility with horizontal direction.
Accompanying drawing explanation
Accompanying drawing 1 is the conductive graphite paster structure schematic diagram of the present invention for microelectronic component;
Accompanying drawing 2 is the conductive graphite paster application schematic diagram of the present invention for microelectronic component.
In above accompanying drawing: 1, heat sink; 2, heat generating components; 3, light strippable PET film; 4, heavy strippable PET film; 5, the first heat-conducting glue adhesion coating; 6, graphite linings; 7, the second heat-conducting glue adhesion coating.
Embodiment
Below in conjunction with embodiment, the invention will be further described:
Embodiment: a kind of conductive graphite paster for microelectronic component, the two-sided pad pasting of described heat radiation fits between heat sink 1 and heat generating components 2, the two-sided pad pasting of described heat radiation comprises light strippable PET film 3 and heavy strippable PET film 4, is disposed with the first heat-conducting glue adhesion coating 5, graphite linings 6 and the second heat-conducting glue adhesion coating 7 between this light strippable PET film 3 and heavy strippable PET film 4; Described graphite linings 6 obtains by following process, and this process comprises the following steps:
Step 1, polyimide film is risen to 250 ℃ with 4 ~ 6 degree/min speed from room temperature, keep 0.9 ~ 1.1 hour, then with 2.5 ~ 3.5 degree/min, rise to 400 ℃, keep being down to room temperature after 1 hour;
Step 2, all apply graphite modified dose of one deck obtain the polyimide film after processing on the upper and lower surface of the polyimide film through step 1, described graphite modified dose of component by following weight portion forms, as shown in table 1:
Table 1
? Embodiment 1 Embodiment 2 Embodiment 3 Embodiment 4 Embodiment 5
Benzophenone tetracarboxylic dianhydride 23 25 23.5 22 20
Pyromellitic acid anhydride 12 17 16 15.6 13
MDA 26.5 22 25 26 28
Dimethyl formamide 34 33 32.5 32 31
Ethylene glycol 2.2 1.6 2.5 1.8 2
Dimethyl silicone polymer 2 2.7 2.5 2.2 3
The viscosity of graphite modified dose of note: embodiment 1 is 32000CP, the viscosity of graphite modified dose of embodiment 2 is 35000CP, the viscosity of graphite modified dose of embodiment 3 is 38000CP, the viscosity of graphite modified dose of embodiment 4 is 42000CP, and the viscosity of graphite modified dose of embodiment 5 is 45000CP.
Step 3, with the speed of 4 ~ 6 degree/min, rise to 800 ℃, keep 0.9 ~ 1.1 hour; Speed with 9 ~ 11 degree/min rises to 1200 ℃ again, preserve cooling after 0.9 ~ 1.1 hour, thereby obtain the carbonized film of pre-burned;
Step 4, employing calender roll the carbonized film of the pre-burned of described step 4;
Step 5, with the speed of 19 ~ 21 degree/min, rise to 2400 ℃, keep 0.9 ~ 1.1 hour, then rise to 2900 ℃ with the speed of 19 ~ 21 degree/min, keep cooling after 1.8 ~ 2.2 hours, thereby obtain the main graphite film of firing;
Thereby step 6, the graphite film that then master of step 5 gained fires roll and obtain described graphite linings (6).
Described step 6 is obtained to graphite linings and carry out calendering process.
The grammes per square metre of above-mentioned light strippable PET film 1 peeling force is 5 ~ 10g/m 2, the grammes per square metre of described heavy strippable PET film 2 peeling forces is 50 ~ 100g/m 2.
While adopting the above-mentioned conductive graphite paster for microelectronic component, the polyimide film that in its structure, graphite linings all applies graphite modified dose of one deck by upper and lower surface is prepared from, improved in the vertical direction the heat conductivility with horizontal direction, avoid adhesive tape local overheating, realized the uniformity of adhesive tape heat conductivility; Secondly, it is positioned at graphite modified dose of polyimide film surface and is comprised of 2 ~ 3 parts of 20 ~ 25 parts of benzophenone tetracarboxylic dianhydrides, 12 ~ 18 parts of pyromellitic acid anhydrides, 20 ~ 28 parts of MDAs, 30 ~ 35 parts of dimethyl formamides, 1.5 ~ 2.5 parts of ethylene glycol, dimethyl silicone polymer, be coated on polyimide film, filled the pin hole in heating process, improved degree of crystallinity simultaneously, also overcome excessive cause inhomogeneous of thermal contraction, improved graphite linings biaxial tension performance; Again, polyimide film surface has graphite modified dose, graphite linings and heat-conducting glue adhesion coating heat conductivility in two-sided pad pasting have been improved, and adopt calender to roll the carbonized film of described pre-burned, avoided the volume contraction in fold and graphitization sintering process, improve compactness and degree of crystallinity, further improved in the vertical direction the heat conductivility with horizontal direction.
Above-described embodiment is only explanation technical conceive of the present invention and feature, and its object is to allow person skilled in the art can understand content of the present invention and implement according to this, can not limit the scope of the invention with this.All equivalences that Spirit Essence is done according to the present invention change or modify, within all should being encompassed in protection scope of the present invention.

Claims (5)

1. the conductive graphite paster for microelectronic component, the two-sided pad pasting of described heat radiation fits between heat sink (1) and heat generating components (2), the two-sided pad pasting of described heat radiation comprises light strippable PET film (3) and heavy strippable PET film (4), between this light strippable PET film (3) and heavy strippable PET film (4), is disposed with the first heat-conducting glue adhesion coating (5), graphite linings (6) and the second heat-conducting glue adhesion coating (7); It is characterized in that: described graphite linings (6) obtains by following process, and this process comprises the following steps:
Step 1, polyimide film is risen to 250 ℃ from room temperature, be down to room temperature after rising to 400 ℃ after insulation;
Step 2, all apply graphite modified dose of one deck obtain the polyimide film after processing on the upper and lower surface of the polyimide film through step 1, the viscosity of described graphite modified dose is 30000 ~ 48000CP;
Described graphite modified dose of component by following weight portion forms:
20 ~ 25 parts of benzophenone tetracarboxylic dianhydrides,
12 ~ 18 parts of pyromellitic acid anhydrides,
20 ~ 28 parts of MDAs,
30 ~ 35 parts of dimethyl formamides,
1.5 ~ 2.5 parts of ethylene glycol,
2 ~ 3 parts of dimethyl silicone polymers;
Step 3, the polyimide film after processing is warming up to 800 ℃, after insulation, is being warming up to 1200 ℃, cooling after insulation, thus obtain the carbonized film of pre-burned;
Step 4, employing calender roll the carbonized film of the pre-burned of described step 4;
Step 5, be warming up to 2400 ℃, after insulation, be warming up to again 2900 ℃, cooling after insulation, thus obtain the main graphite film of firing;
Thereby step 6, the graphite film that then master of step 5 gained fires roll and obtain described graphite linings (6).
2. conductive graphite paster according to claim 1, is characterized in that: described graphite modified dose (4) are comprised of the component of following weight portion:
20 ~ 25 parts of benzophenone tetracarboxylic dianhydrides,
14 ~ 16 parts of pyromellitic acid anhydrides,
22 ~ 26 parts of MDAs,
32 ~ 35 parts of dimethyl formamides,
1.8 ~ 2.5 parts of ethylene glycol (viscosity adjusting),
2.5 ~ 3 parts of dimethyl silicone polymers (viscosity adjusting).
3. conductive graphite paster according to claim 1, is characterized in that: described graphite linings (6) obtains by following process, and this process comprises the following steps:
Step 1, polyimide film is risen to 250 ℃ with 4 ~ 6 degree/min speed from room temperature, keep 0.9 ~ 1.1 hour, then with 2.5 ~ 3.5 degree/min, rise to 400 ℃, keep near room temperature after 1 hour;
Step 2, on the upper and lower surface of the polyimide film through step 1, all apply graphite modified dose of one deck and obtain the polyimide film after processing;
Step 3, with the speed of 4 ~ 6 degree/min, rise to 800 ℃, keep 0.9 ~ 1.1 hour; Speed with 9 ~ 11 degree/min rises to 1200 ℃ again, preserve cooling after 0.9 ~ 1.1 hour, thereby obtain the carbonized film of pre-burned;
Step 4, employing calender roll the carbonized film of the pre-burned of described step 4;
Step 5, with the speed of 19 ~ 21 degree/min, rise to 2400 ℃, keep 0.9 ~ 1.1 hour, then rise to 2900 ℃ with the speed of 19 ~ 21 degree/min, keep cooling after 1.8 ~ 2.2 hours, thereby obtain the main graphite film of firing;
Thereby step 6, the graphite film that then master of step 3 gained fires roll and obtain described graphite linings (6).
4. according to the conductive graphite paster described in any one in claim 1 ~ 3, it is characterized in that: described step 4 is obtained to graphite linings (6) and carry out calendering process.
5. according to the conductive graphite paster described in any one in claim 1 ~ 3, it is characterized in that: the grammes per square metre of described light strippable PET film (1) peeling force is 5 ~ 10g/m 2, the grammes per square metre of described heavy strippable PET film (2) peeling force is 50 ~ 100g/m 2.
CN201410037378.9A 2014-01-26 2014-01-26 Heat conduction graphite patch for microelectronic device Active CN103763892B (en)

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CN201610777536.3A CN106349965A (en) 2014-01-26 2014-01-26 preparing method of heat-conducting adhesive tape for consumer electronic product
CN201610696479.6A CN106332521A (en) 2014-01-26 2014-01-26 Manufacturing method for double-sided adhesive graphite flake
CN201610704135.5A CN106281087A (en) 2014-01-26 2014-01-26 Heat-conducting double-sided adhesive tape
CN201610696474.3A CN106318250A (en) 2014-01-26 2014-01-26 Preparation process of thermal double-sided adhesive tape
CN201610794749.7A CN106398570A (en) 2014-01-26 2014-01-26 High-compactness graphite soaking adhesive tape
CN201610787504.1A CN106520002A (en) 2014-01-26 2014-01-26 Heat-conducting pressure-sensitive double-sided tape
CN201610777537.8A CN106398567A (en) 2014-01-26 2014-01-26 Pressure sensitive adhesive tape for notebook computer
CN201610799197.9A CN106381083A (en) 2014-01-26 2014-01-26 Isothermal pressure-sensitive adhesive tape used for intelligent mobile phones
CN201610777340.4A CN106398566A (en) 2014-01-26 2014-01-26 Double-face pad pasting with heat radiation
CN201610696862.1A CN106304780B (en) 2014-01-26 2014-01-26 Manufacturing process for high thermal conductivity graphite film
CN201610777909.7A CN106366971A (en) 2014-01-26 2014-01-26 High-heat-conductivity double-sided adhesive tape
CN201610777339.1A CN106349964A (en) 2014-01-26 2014-01-26 Process for preparing heat-conduction double-sided adhesive tape
CN201610696475.8A CN106318251A (en) 2014-01-26 2014-01-26 Manufacture method of thermal transfer film
CN201410037378.9A CN103763892B (en) 2014-01-26 2014-01-26 Heat conduction graphite patch for microelectronic device
CN201610705947.1A CN106304783B (en) 2014-01-26 2014-01-26 Thermal conductivity both-sided adhesive graphite flake
CN201610700227.6A CN106413340A (en) 2014-01-26 2014-01-26 Heat conducting adhesive film for electronic product
CN201610778259.8A CN106634658A (en) 2014-01-26 2014-01-26 Manufacturing process for heat-conducting adhesive tape used for laptop
CN201610787557.3A CN106520003A (en) 2014-01-26 2014-01-26 Thermal conductive graphite tape used for laptops
CN201610777925.6A CN106427180B (en) 2014-01-26 2014-01-26 Preparation method for the two-sided pad pasting of soaking
CN201610705884.XA CN106332522A (en) 2014-01-26 2014-01-26 High-heat-conductivity graphite film
CN201610787521.5A CN106535560A (en) 2014-01-26 2014-01-26 Manufacturing process for heat-conducting graphite paste films for flat computers

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CN201610799197.9A Division CN106381083A (en) 2014-01-26 2014-01-26 Isothermal pressure-sensitive adhesive tape used for intelligent mobile phones
CN201610777537.8A Division CN106398567A (en) 2014-01-26 2014-01-26 Pressure sensitive adhesive tape for notebook computer
CN201610794749.7A Division CN106398570A (en) 2014-01-26 2014-01-26 High-compactness graphite soaking adhesive tape
CN201610705947.1A Division CN106304783B (en) 2014-01-26 2014-01-26 Thermal conductivity both-sided adhesive graphite flake
CN201610696479.6A Division CN106332521A (en) 2014-01-26 2014-01-26 Manufacturing method for double-sided adhesive graphite flake
CN201610777909.7A Division CN106366971A (en) 2014-01-26 2014-01-26 High-heat-conductivity double-sided adhesive tape
CN201610787504.1A Division CN106520002A (en) 2014-01-26 2014-01-26 Heat-conducting pressure-sensitive double-sided tape
CN201610787557.3A Division CN106520003A (en) 2014-01-26 2014-01-26 Thermal conductive graphite tape used for laptops
CN201610696474.3A Division CN106318250A (en) 2014-01-26 2014-01-26 Preparation process of thermal double-sided adhesive tape
CN201610787521.5A Division CN106535560A (en) 2014-01-26 2014-01-26 Manufacturing process for heat-conducting graphite paste films for flat computers
CN201610777925.6A Division CN106427180B (en) 2014-01-26 2014-01-26 Preparation method for the two-sided pad pasting of soaking
CN201610777339.1A Division CN106349964A (en) 2014-01-26 2014-01-26 Process for preparing heat-conduction double-sided adhesive tape
CN201610777536.3A Division CN106349965A (en) 2014-01-26 2014-01-26 preparing method of heat-conducting adhesive tape for consumer electronic product
CN201610696475.8A Division CN106318251A (en) 2014-01-26 2014-01-26 Manufacture method of thermal transfer film
CN201610700227.6A Division CN106413340A (en) 2014-01-26 2014-01-26 Heat conducting adhesive film for electronic product
CN201610704135.5A Division CN106281087A (en) 2014-01-26 2014-01-26 Heat-conducting double-sided adhesive tape
CN201610778259.8A Division CN106634658A (en) 2014-01-26 2014-01-26 Manufacturing process for heat-conducting adhesive tape used for laptop
CN201610705884.XA Division CN106332522A (en) 2014-01-26 2014-01-26 High-heat-conductivity graphite film
CN201610696862.1A Division CN106304780B (en) 2014-01-26 2014-01-26 Manufacturing process for high thermal conductivity graphite film

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CN201610787521.5A Pending CN106535560A (en) 2014-01-26 2014-01-26 Manufacturing process for heat-conducting graphite paste films for flat computers
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CN201610700227.6A Pending CN106413340A (en) 2014-01-26 2014-01-26 Heat conducting adhesive film for electronic product
CN201610794749.7A Pending CN106398570A (en) 2014-01-26 2014-01-26 High-compactness graphite soaking adhesive tape
CN201610704135.5A Pending CN106281087A (en) 2014-01-26 2014-01-26 Heat-conducting double-sided adhesive tape
CN201610777340.4A Pending CN106398566A (en) 2014-01-26 2014-01-26 Double-face pad pasting with heat radiation
CN201610777339.1A Pending CN106349964A (en) 2014-01-26 2014-01-26 Process for preparing heat-conduction double-sided adhesive tape
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CN201610799197.9A Pending CN106381083A (en) 2014-01-26 2014-01-26 Isothermal pressure-sensitive adhesive tape used for intelligent mobile phones
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