CN106413340A - Heat conducting adhesive film for electronic product - Google Patents

Heat conducting adhesive film for electronic product Download PDF

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Publication number
CN106413340A
CN106413340A CN201610700227.6A CN201610700227A CN106413340A CN 106413340 A CN106413340 A CN 106413340A CN 201610700227 A CN201610700227 A CN 201610700227A CN 106413340 A CN106413340 A CN 106413340A
Authority
CN
China
Prior art keywords
film
graphite
heat conduction
pet film
kapton
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610700227.6A
Other languages
Chinese (zh)
Inventor
金闯
梁豪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sidike New Materials Jiangsu Co Ltd
Original Assignee
Sidike New Materials Jiangsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sidike New Materials Jiangsu Co Ltd filed Critical Sidike New Materials Jiangsu Co Ltd
Priority to CN201610700227.6A priority Critical patent/CN106413340A/en
Publication of CN106413340A publication Critical patent/CN106413340A/en
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04Coating
    • C08J7/0427Coating with only one layer of a composition containing a polymer binder
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1207Heat-activated adhesive
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/18Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/28Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/36Layered products comprising a layer of synthetic resin comprising polyesters
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/15Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state
    • B32B37/153Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state at least one layer is extruded and immediately laminated while in semi-molten state
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/15Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state
    • B32B37/156Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state at least one layer is calendered and immediately laminated
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/18Handling of layers or the laminate
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/06Interconnection of layers permitting easy separation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B32B9/007Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/045Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/52Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite
    • C04B35/522Graphite
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/52Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite
    • C04B35/524Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite obtained from polymer precursors, e.g. glass-like carbon material
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/62218Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products obtaining ceramic films, e.g. by using temporary supports
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00Layers arrangement
    • B32B2250/40Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/30Properties of the layers or laminate having particular thermal properties
    • B32B2307/302Conductive
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/50Properties of the layers or laminate having particular mechanical properties
    • B32B2307/54Yield strength; Tensile strength
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/70Other properties
    • B32B2307/732Dimensional properties
    • B32B2307/734Dimensional stability
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/656Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
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    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/66Specific sintering techniques, e.g. centrifugal sintering
    • C04B2235/661Multi-step sintering
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2479/00Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2461/00 - C08J2477/00
    • C08J2479/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2479/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/10Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
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    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00Presence of inorganic and organic materials
    • C09J2400/10Presence of inorganic materials
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    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00Presence of inorganic and organic materials
    • C09J2400/10Presence of inorganic materials
    • C09J2400/12Ceramic
    • C09J2400/123Ceramic in the substrate
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00Presence of polyester
    • C09J2467/005Presence of polyester in the release coating

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Structural Engineering (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)

Abstract

The invention discloses a heat conducting adhesive film for an electronic product. A graphite layer is obtained by the following technological method through the steps of coating the upper and lower surfaces of a polyimide film which is processed in the step 1 with a layer of graphite modifying agent to obtain a processed polyimide film; heating the processed polyimide film to 800 DEG C, and performing thermal insulation, and then heating to 1,200 DEG C to obtain a pre-sintered carbonized film; performing calendering on the pre-sintered carbonized film in the step 4 through a calendering machine; heating to 2,400 DEG C, performing thermal insulation, and then heating to 2,900 DEG C so as to obtain a main-sintered graphite film; and performing calendering on the main-sintered graphite film obtained in the step 5 so as to obtain the graphite layer. By calendering the pre-sintered carbonized film through the calendering machine, wrinkles and volume shrinkage in a graphitizing sintering process are avoided, thereby improving density and degree of crystallinity.

Description

Use for electronic products heat conduction pad pasting
Technical field
The present invention relates to a kind of use for electronic products heat conduction pad pasting, belong to double faced adhesive chip technology field.
Background technology
With the development of modern microelectronic technology high-speed, electronic equipment(As notebook computer, mobile phone, panel computer etc.)Increasingly Become ultra-thin, light, this structure makes electronic equipment internal power density significantly improve, and in operation, produced heat is difficult Discharge, be easy to accumulate rapidly and form high temperature.On the other hand, high temperature can reduce the performance of electronic equipment, reliability and use the longevity Life.Therefore, Current electronic industry proposes higher and higher requirement for the heat sink material as heat control system core component, urgently Need a kind of high-efficiency heat conduction, light material to transfer heat away from rapidly, ensure that electronic equipment normally runs.
In prior art, Kapton is mostly used for flexible PCB and is obtained using polyimide film sintered although having Obtaining graphite heat radiation fin, thus being covered on thermal source, but being constrained to the good and the bad of the product quality and performances of Kapton not Together, have influence on the performance of radiating two-sided pad pasting heat dispersion, there is following technical problem:Radiating is uneven, adhesive tape easily Hot-spot, the heat dispersion that improve product is unstable, reliability performance is poor, is unfavorable for product quality management control, affects product Competitiveness.
Content of the invention
It is an object of the present invention to provide a kind of use for electronic products heat conduction pad pasting, this use for electronic products heat conduction pad pasting is in vertical direction All improve heat conductivility with horizontal direction, it is to avoid adhesive tape hot-spot it is achieved that while the uniformity of adhesive tape heat conductivility, Improve heat dispersion stability, the reliability of product, greatly reduce the cost of product.
For reaching above-mentioned purpose, the technical solution used in the present invention is:A kind of use for electronic products heat conduction pad pasting, described radiating Two-sided pad pasting fits between radiating piece and heat generating components, and the two-sided pad pasting of described radiating includes light strippable PET film and re-release Type PET film, is disposed with the first heat conduction adhesive layer, graphite linings and between this light strippable PET film and re-release type PET film Two heat conduction adhesive layers;Described graphite linings are obtained by following process, and this process comprises the following steps:
Step one, Kapton is risen to 250 DEG C from room temperature, after rising to 400 DEG C after insulation, be down to room temperature;
Step 2, it is coated with one layer of graphite modified dose of acquisition on the upper and lower surface of the Kapton through step one and processes Kapton afterwards, described graphite modified dose of viscosity is 30000 ~ 48000CP;
The described graphite modified dose of group by following weight portion is grouped into:25 parts of benzophenone tetracarboxylic dianhydride, pyromellitic acid anhydride 17 parts, 22 parts of MDA, 33 parts of dimethylformamide, 1.6 parts of ethylene glycol, 2.7 parts of dimethyl silicone polymer;
Step 3, the Kapton after processing is warming up to 800 DEG C, being warming up to 1200 DEG C after insulation, cools down after insulation, Thus obtaining the carbonized film of pre-burned;
Step 4, using calender roll described step 4 pre-burned carbonized film;
Step 5, it is warming up to 2400 DEG C, after insulation, is warming up to 2900 DEG C again, cool down after insulation, thus obtaining the graphite that master fires Film;
The graphite film that the master of step 6 and then step 5 gained fires is rolled thus being obtained described graphite linings.
In technique scheme, further improved scheme is as follows:
In such scheme, described step 4 acquisition graphite film is carried out calendering process.
In such scheme, the grammes per square metre of described light strippable PET film peeling force is 5 ~ 10g/m2, described re-release type PET film The grammes per square metre of peeling force is 50 ~ 100g/m2.
Because technique scheme is used, the present invention compared with prior art has following advantages and effect:
Use for electronic products heat conduction pad pasting of the present invention, in its structure, graphite linings are coated with one layer graphite modified dose by upper and lower surface Kapton is prepared from, and improves in heat conductivility both vertically and horizontally, it is to avoid adhesive tape hot-spot, real Show the uniformity of adhesive tape heat conductivility;Next, it is located at graphite modified dose of Kapton surface by benzophenone four Acid dianhydride, pyromellitic acid anhydride, MDA, dimethylformamide, ethylene glycol, dimethyl silicone polymer composition, It is coated on Kapton, is filled with the pin hole in heating process, improve degree of crystallinity simultaneously, also overcome thermal contraction Lead to greatly is uneven, improves graphite linings biaxial tension performance;Again, Kapton surface has graphite modified dose, Improve graphite linings and heat conduction adhesive layer heat conductivility in two-sided pad pasting, and roll the carbonization of described pre-burned using calender Film, it is to avoid the volume contraction in fold and graphitization sintering process, improves compactness and degree of crystallinity, further increases Heat conductivility both vertically and horizontally.
Brief description
Accompanying drawing 1 is use for electronic products heat conduction film structure schematic diagram of the present invention;
Accompanying drawing 2 is use for electronic products heat conduction pad pasting application schematic diagram of the present invention;
Accompanying drawing 3 is the partial structural diagram of accompanying drawing 2.
In the figures above:1st, radiating piece;2nd, heat generating components;3rd, light strippable PET film;4th, re-release type PET film;5th, first Heat conduction adhesive layer;6th, graphite linings;7th, the second heat conduction adhesive layer.
Specific embodiment
With reference to embodiment, the invention will be further described:
Embodiment:A kind of use for electronic products heat conduction pad pasting, the two-sided pad pasting of described radiating fit in radiating piece 1 and heat generating components 2 it Between, the two-sided pad pasting of described radiating includes light strippable PET film 3 and re-release type PET film 4, this light strippable PET film 3 and again shelling It is disposed with the first heat conduction adhesive layer 5, graphite linings 6 and the second heat conduction adhesive layer 7 between release PET film 4;Described graphite linings 6 Obtained by following process, this process comprises the following steps:
Step one, Kapton is risen to 250 DEG C with 4 ~ 6 degree/min speed from room temperature, keep 0.9 ~ 1.1 hour, then With 2.5 ~ 3.5 degree/min, rise to 400 DEG C, after keeping 1 hour, be down to room temperature;
Step 2, it is coated with one layer of graphite modified dose of acquisition on the upper and lower surface of the Kapton through step one and processes Kapton afterwards, the described graphite modified dose of group by following weight portion is grouped into, as shown in table 1:
Table 1
Embodiment
Benzophenone tetracarboxylic dianhydride 25
Pyromellitic acid anhydride 17
MDA 22
Dimethylformamide 33
Ethylene glycol 1.6
Dimethyl silicone polymer 2.7
The viscosity of graphite modified dose of embodiment is 35000CP;
Step 3, rise to 800 DEG C with the speed of 4 ~ 6 degree/min, keep 0.9 ~ 1.1 hour;Again with the speed liter of 9 ~ 11 degree/min To 1200 DEG C, cool down after preserving 0.9 ~ 1.1 hour, thus obtaining the carbonized film of pre-burned;
Step 4, using calender roll described step 4 pre-burned carbonized film;
Step 5, rise to 2400 DEG C with the speed of 19 ~ 21 degree/min, keep 0.9 ~ 1.1 hour, then the speed with 19 ~ 21 degree/min Degree rises to 2900 DEG C, cools down after keeping 1.8 ~ 2.2 hours, thus obtaining the graphite film that master fires;
The graphite film that the master of step 6 and then step 5 gained fires is rolled thus being obtained described graphite linings(6).
Described step 6 acquisition graphite linings are carried out calendering process.
The grammes per square metre of above-mentioned light strippable PET film 1 peeling force is 5 ~ 10g/m2, described re-release type PET film 2 peeling force gram It is 50 ~ 100g/m again2.
During using above-mentioned use for electronic products heat conduction pad pasting, in its structure, graphite linings are coated with one layer of graphite by upper and lower surface The Kapton of modifying agent is prepared from, and improves in heat conductivility both vertically and horizontally, it is to avoid adhesive tape office Portion overheated it is achieved that the uniformity of adhesive tape heat conductivility;Secondly, it is located at graphite modified dose of Kapton surface by two Benzophenone tetracarboxylic dianhydride, pyromellitic acid anhydride, MDA, dimethylformamide, ethylene glycol, polydimethylsiloxanes Alkane forms, and is coated on Kapton, is filled with the pin hole in heating process, improves degree of crystallinity simultaneously, also overcome Thermal contraction is excessive lead to uneven, improve graphite linings biaxial tension performance;Again, Kapton surface has graphite Modifying agent, improves graphite linings and heat conduction adhesive layer heat conductivility in two-sided pad pasting, and rolls described pre-burned using calender Carbonized film, it is to avoid the volume contraction in fold and graphitization sintering process, improve compactness and degree of crystallinity, carry further High in heat conductivility both vertically and horizontally.
Above-described embodiment only technology design to illustrate the invention and feature, its object is to allow person skilled in the art Scholar will appreciate that present disclosure and implements according to this, can not be limited the scope of the invention with this.All according to the present invention Equivalence changes or modification that Spirit Essence is made, all should be included within the scope of the present invention.

Claims (3)

1. a kind of use for electronic products heat conduction pad pasting, described heat conduction attachment film is in radiating piece(1)And heat generating components(2)Between, institute State heat conduction pad pasting and include light strippable PET film(3)With re-release type PET film(4), this light strippable PET film(3)With re-release type PET film(4)Between be disposed with the first heat conduction adhesive layer(5), graphite linings(6)With the second heat conduction adhesive layer(7);Its feature exists In:Described graphite linings(6)Obtained by following process, this process comprises the following steps:
Step one, Kapton is risen to 250 DEG C from room temperature, after rising to 400 DEG C after insulation, be down to room temperature;
Step 2, it is coated with one layer of graphite modified dose of acquisition on the upper and lower surface of the Kapton through step one and processes Kapton afterwards, described graphite modified dose of viscosity is 30000 ~ 48000CP;
The described graphite modified dose of group by following weight portion is grouped into:25 parts of benzophenone tetracarboxylic dianhydride, pyromellitic acid anhydride 17 parts, 22 parts of MDA, 33 parts of dimethylformamide, 1.6 parts of ethylene glycol, 2.7 parts of dimethyl silicone polymer;
Step 3, the Kapton after processing is warming up to 800 DEG C, being warming up to 1200 DEG C after insulation, cools down after insulation, Thus obtaining the carbonized film of pre-burned;
Step 4, using calender roll described step 4 pre-burned carbonized film;
Step 5, it is warming up to 2400 DEG C, after insulation, is warming up to 2900 DEG C again, cool down after insulation, thus obtaining the graphite that master fires Film;
The graphite film that the master of step 6 and then step 5 gained fires is rolled thus being obtained described graphite linings(6).
2. use for electronic products heat conduction pad pasting according to claim 1 it is characterised in that:Described step 4 is obtained graphite linings (6)Carry out calendering process.
3. use for electronic products heat conduction pad pasting according to claim 1 it is characterised in that:Described light strippable PET film(1)Stripping It is 5 ~ 10g/m from the grammes per square metre of power2, described re-release type PET film(2)The grammes per square metre of peeling force is 50 ~ 100g/m2.
CN201610700227.6A 2014-01-26 2014-01-26 Heat conducting adhesive film for electronic product Pending CN106413340A (en)

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CN201610787557.3A Pending CN106520003A (en) 2014-01-26 2014-01-26 Thermal conductive graphite tape used for laptops
CN201610705884.XA Pending CN106332522A (en) 2014-01-26 2014-01-26 High-heat-conductivity graphite film
CN201610777909.7A Pending CN106366971A (en) 2014-01-26 2014-01-26 High-heat-conductivity double-sided adhesive tape
CN201610704135.5A Pending CN106281087A (en) 2014-01-26 2014-01-26 Heat-conducting double-sided adhesive tape
CN201610777537.8A Pending CN106398567A (en) 2014-01-26 2014-01-26 Pressure sensitive adhesive tape for notebook computer
CN201610696862.1A Active CN106304780B (en) 2014-01-26 2014-01-26 Manufacturing process for high thermal conductivity graphite film
CN201610794749.7A Pending CN106398570A (en) 2014-01-26 2014-01-26 High-compactness graphite soaking adhesive tape
CN201610799197.9A Pending CN106381083A (en) 2014-01-26 2014-01-26 Isothermal pressure-sensitive adhesive tape used for intelligent mobile phones
CN201610696474.3A Pending CN106318250A (en) 2014-01-26 2014-01-26 Preparation process of thermal double-sided adhesive tape
CN201610705947.1A Active CN106304783B (en) 2014-01-26 2014-01-26 Thermal conductivity both-sided adhesive graphite flake
CN201610696479.6A Pending CN106332521A (en) 2014-01-26 2014-01-26 Manufacturing method for double-sided adhesive graphite flake
CN201610777536.3A Pending CN106349965A (en) 2014-01-26 2014-01-26 preparing method of heat-conducting adhesive tape for consumer electronic product
CN201610778259.8A Pending CN106634658A (en) 2014-01-26 2014-01-26 Manufacturing process for heat-conducting adhesive tape used for laptop
CN201610777339.1A Pending CN106349964A (en) 2014-01-26 2014-01-26 Process for preparing heat-conduction double-sided adhesive tape
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CN201610705884.XA Pending CN106332522A (en) 2014-01-26 2014-01-26 High-heat-conductivity graphite film
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CN201610794749.7A Pending CN106398570A (en) 2014-01-26 2014-01-26 High-compactness graphite soaking adhesive tape
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