CN106535560A - Manufacturing process for heat-conducting graphite paste films for flat computers - Google Patents

Manufacturing process for heat-conducting graphite paste films for flat computers Download PDF

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Publication number
CN106535560A
CN106535560A CN201610787521.5A CN201610787521A CN106535560A CN 106535560 A CN106535560 A CN 106535560A CN 201610787521 A CN201610787521 A CN 201610787521A CN 106535560 A CN106535560 A CN 106535560A
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CN
China
Prior art keywords
graphite
film
degree
manufacturing process
pad pasting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610787521.5A
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Chinese (zh)
Inventor
金闯
梁豪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sidike New Materials Jiangsu Co Ltd
Original Assignee
Sidike New Materials Jiangsu Co Ltd
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Publication date
Application filed by Sidike New Materials Jiangsu Co Ltd filed Critical Sidike New Materials Jiangsu Co Ltd
Priority to CN201610787521.5A priority Critical patent/CN106535560A/en
Publication of CN106535560A publication Critical patent/CN106535560A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1207—Heat-activated adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/0427—Coating with only one layer of a composition containing a polymer binder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/15—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state
    • B32B37/153—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state at least one layer is extruded and immediately laminated while in semi-molten state
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    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/15—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state
    • B32B37/156—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state at least one layer is calendered and immediately laminated
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B38/18—Handling of layers or the laminate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • C04B35/52—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite
    • C04B35/522—Graphite
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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    • C04B35/52—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite
    • C04B35/524—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite obtained from polymer precursors, e.g. glass-like carbon material
    • C—CHEMISTRY; METALLURGY
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    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
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    • C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
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    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/66—Specific sintering techniques, e.g. centrifugal sintering
    • C04B2235/661—Multi-step sintering
    • C—CHEMISTRY; METALLURGY
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J2467/00—Presence of polyester
    • C09J2467/005—Presence of polyester in the release coating

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)

Abstract

The invention discloses a manufacturing process for heat-conducting graphite paste films for flat computers. The manufacturing process comprises the following steps of coating a layer of graphite modifier on upper and lower surfaces of a polyimide film to obtain a processed polyimide film; rising the temperature of the processed polyimide film to 800 DEG C, performing thermal insulation and rising the temperature to 1200 DEG C to obtain a pre-fired carbonized film; using a calender to calender the pre-fired carbonized film; rising the temperature of the calendered carbonized film to 2400 DEG C, performing thermal insulation and rising the temperature to 2900 DEG C to obtain a main fired graphite film; and then calendering the main fired graphite film to obtain a graphite layer. The invention avoids the local overheating of the tape, realizes the uniformity of the thermal conductivity of the tape, and avoids the volume shrinkage in the process of wrinkling and graphitization sintering.

Description

Manufacturing process of the panel computer with conductive graphite pad pasting
Technical field
The present invention relates to a kind of manufacturing process of conductive graphite pad pasting, belongs to double faced adhesive chip technology field.
Background technology
Nowadays, with the development of computer technology, the trend of development of computer is to develop lighter and thinner product.Example Such as, panel computer and notebook computer become more and more popular, because the profile of their dexterities.As the size of these products becomes more Little, radiating is a considerable aspect all the time, high temperature can reduce performance, reliability and the service life of electronic equipment.Cause This, Current electronic industry proposes higher and higher requirement for the heat sink material as heat control system core component, in the urgent need to A kind of high-efficiency heat conduction, light material are transferred heat away from rapidly, ensure that electronic equipment normally runs.Backing is that one kind exists The heat exchanger of heat is transmitted between thermal source and secondary unit, and its surface region and shape are more beneficial for radiating compared with thermal source. By equal backing, by the heat " diffusion " of thermal source generation to secondary unit, so it is able to eliminate the heat product in thermal source well Store.
In prior art, Kapton is mostly used for flexible PCB, although has and is obtained using polyimide film sintered Graphite heat radiation fin, so as to be covered on thermal source, but be constrained to Kapton product quality and performances the good and the bad not Together, the performance of the two-sided pad pasting heat dispersion of radiating has been had influence on, has there is following technical problem：Radiating is uneven, adhesive tape easily occurs Hot-spot, the heat dispersion that improve product is unstable, reliability performance is poor, is unfavorable for product quality management control, affects product Competitiveness, how to overcome above-mentioned technical problem become those skilled in the art effort direction.
The content of the invention
It is an object of the present invention to provide a kind of manufacturing process of panel computer with conductive graphite pad pasting, the manufacturing process is led Hot graphite pad pasting is both vertically and horizontally improve heat conductivility, it is to avoid adhesive tape hot-spot, realizes adhesive tape and leads Heat dispersion stability, the reliability of product while the uniformity of hot property, is improve, the cost of product is greatly reduced.
For reaching above-mentioned purpose, the technical solution used in the present invention is：A kind of system of panel computer with conductive graphite pad pasting Technique is made, between radiating piece and heat generating components, the two-sided pad pasting that radiates includes light stripping to the conductive graphite attachment film Type PET film and re-release type PET film, are disposed with the first heat-conducting glue between this light strippable PET film and re-release type PET film Adhesion coating, graphite linings and the second heat conduction adhesive layer；It is characterized in that：The graphite linings are obtained by following process, this technique Method is comprised the following steps：
Step one, Kapton is risen to into 250 DEG C from room temperature, after rising to 400 DEG C after insulation, be down to room temperature；
Step 2, one layer graphite modified dose is coated with the upper and lower surface of the Kapton through step one and is processed Kapton afterwards, described graphite modified dose of viscosity is 30000 ~ 48000CP；
The graphite modified dose of component by following weight portion is constituted：20 parts of benzophenone tetracarboxylic dianhydride, pyromellitic acid anhydride 13 parts, 28 parts of MDA, 31 parts of dimethylformamide, 2 parts of ethylene glycol, 3 parts of dimethyl silicone polymer；
Step 3,800 DEG C are risen to the speed of 4 ~ 6 degree/min, kept for 0.9 ~ 1.1 hour；Again with the speed liter of 9 ~ 11 degree/min To 1200 DEG C, cool down after preserving 0.9 ~ 1.1 hour, so as to obtain the carbonized film of pre-burned；
Step 4, rolled using calender the step 4 pre-burned carbonized film；
Step 5,2400 DEG C are risen to the speed of 19 ~ 21 degree/min, kept for 0.9 ~ 1.1 hour, then with the speed of 19 ~ 21 degree/min Degree rises to 2900 DEG C, cools down, so as to obtain the graphite film of main firing after being kept for 1.8 ~ 2.2 hours；
The graphite film of the main firing obtained by step 6 and then step 3 is rolled so as to obtain the graphite linings.
In above-mentioned technical proposal, further improved scheme is as follows：
1st, in such scheme, Kapton is risen to into 250 DEG C with 4 ~ 6 degree/min speed from room temperature in the step one, is protected Hold 0.9 ~ 1.1 hour, then with 2.5 ~ 3.5 degree/min, rise to 400 DEG C, near room temperature after being kept for 1 hour.
2nd, in such scheme, step 4 acquisition graphite film is carried out into calendering process.
3rd, in such scheme, the grammes per square metre of the light strippable PET film peeling force is 5 ~ 10g/m2, re-release type PET The grammes per square metre of film peeling force is 50 ~ 100g/m2。
As above-mentioned technical proposal is used, the present invention has following advantages and effect compared with prior art：
Manufacturing process of the panel computer of the present invention with conductive graphite pad pasting, in its structure, graphite linings are coated with one by upper and lower surface The Kapton of graphite modified dose of layer is prepared from, and improves in heat conductivility both vertically and horizontally, it is to avoid Adhesive tape hot-spot, realizes the uniformity of adhesive tape heat conductivility；Secondly, which is located at the graphite modified of Kapton surface Agent is by benzophenone tetracarboxylic dianhydride, pyromellitic acid anhydride, MDA, dimethylformamide, ethylene glycol, poly- diformazan Radical siloxane constitute, be coated on Kapton, the pin hole being filled with heating process, improve degree of crystallinity while, Overcome thermal contraction excessive caused uneven, improve graphite linings biaxial tension performance；Again, Kapton surface tool There is graphite modified dose, improve graphite linings and heat conduction adhesive layer heat conductivility in two-sided pad pasting, and it is described using calender calendering The carbonized film of pre-burned, it is to avoid the volume contraction in fold and graphitization sintering process, improves compactness and degree of crystallinity, enters One step is improve in heat conductivility both vertically and horizontally.
Specific embodiment
With reference to embodiment, the invention will be further described：
Embodiment：A kind of manufacturing process of panel computer with conductive graphite pad pasting, the two-sided pad pasting of the radiating fit in radiating piece 1 And heat generating components 2 between, the two-sided pad pasting that radiates includes light strippable PET film 3 and re-release type PET film 4, and this is light exfoliated The first heat conduction adhesive layer 5, graphite linings 6 and the second heat conduction adhesive layer 7 is disposed between PET film 3 and re-release type PET film 4； The graphite linings 6 are obtained by following process, and this process is comprised the following steps：
Step one, Kapton is risen to into 250 DEG C with 4 ~ 6 degree/min speed from room temperature, kept for 0.9 ~ 1.1 hour, then With 2.5 ~ 3.5 degree/min, 400 DEG C are risen to, after being kept for 1 hour, be down to room temperature；
Step 2, one layer graphite modified dose is coated with the upper and lower surface of the Kapton through step one and is processed Kapton afterwards, the graphite modified dose of component by following weight portion are constituted：20 parts of benzophenone tetracarboxylic dianhydride, 13 parts of PMDA, 28 parts of MDA, 31 parts of dimethylformamide, 2 parts of ethylene glycol, dimethyl silicone polymer 3 parts；Graphite modified dose of viscosity is 45000CP；
Step 3,800 DEG C are risen to the speed of 4 ~ 6 degree/min, kept for 0.9 ~ 1.1 hour；Again with the speed liter of 9 ~ 11 degree/min To 1200 DEG C, cool down after preserving 0.9 ~ 1.1 hour, so as to obtain the carbonized film of pre-burned；
Step 4, rolled using calender the step 4 pre-burned carbonized film；
Step 5,2400 DEG C are risen to the speed of 19 ~ 21 degree/min, kept for 0.9 ~ 1.1 hour, then with the speed of 19 ~ 21 degree/min Degree rises to 2900 DEG C, cools down, so as to obtain the graphite film of main firing after being kept for 1.8 ~ 2.2 hours；
The graphite film of the main firing obtained by step 6 and then step 5 is rolled so as to obtain the graphite linings.
Step 6 acquisition graphite linings are carried out into calendering process.
The grammes per square metre of above-mentioned light 1 peeling force of strippable PET film is 5 ~ 10g/m2, 2 peeling force of re-release type PET film gram Weight is 50 ~ 100g/m2。
During using above-mentioned panel computer with the manufacturing process of conductive graphite pad pasting, in its structure, graphite linings are by upper and lower surface The Kapton for being coated with one layer graphite modified dose is prepared from, and improves in thermal conductivity both vertically and horizontally Can, it is to avoid adhesive tape hot-spot, realize the uniformity of adhesive tape heat conductivility；Secondly, which is located at Kapton surface Graphite modified dose by benzophenone tetracarboxylic dianhydride, pyromellitic acid anhydride, MDA, dimethylformamide, second two Alcohol, dimethyl silicone polymer composition, are coated on Kapton, and the pin hole being filled with heating process improves crystallization Degree simultaneously, also overcome thermal contraction it is excessive caused by it is uneven, improve graphite linings biaxial tension performance；Again, polyimides Film surface has graphite modified dose, improves graphite linings and heat conduction adhesive layer heat conductivility in two-sided pad pasting, and using calendering Machine rolls the carbonized film of the pre-burned, it is to avoid the volume contraction in fold and graphitization sintering process, improves compactness And degree of crystallinity, further increase in heat conductivility both vertically and horizontally.
Above-described embodiment technology design only to illustrate the invention and feature, its object is to allow person skilled in the art Scholar will appreciate that present disclosure and implement according to this, can not be limited the scope of the invention with this.It is all according to the present invention Equivalence changes or modification that Spirit Essence is made, should all be included within the scope of the present invention.

Claims (4)

1. manufacturing process of a kind of panel computer with conductive graphite pad pasting, the conductive graphite attachment film is in radiating piece and heating Between part, the two-sided pad pasting of the radiating includes light strippable PET film and re-release type PET film, this light strippable PET film and weight The first heat conduction adhesive layer, graphite linings and the second heat conduction adhesive layer is disposed between strippable PET film；It is characterized in that：Institute State graphite linings to obtain by following process, this process is comprised the following steps：
Step one, Kapton is risen to into 250 DEG C from room temperature, after rising to 400 DEG C after insulation, be down to room temperature；
Step 2, one layer graphite modified dose is coated with the upper and lower surface of the Kapton through step one and is processed Kapton afterwards, described graphite modified dose of viscosity is 30000 ~ 48000CP；
The graphite modified dose of component by following weight portion is constituted：20 parts of benzophenone tetracarboxylic dianhydride, pyromellitic acid anhydride 13 parts, 28 parts of MDA, 30 ~ 35 parts of dimethylformamide, 1.5 ~ 2.5 parts of ethylene glycol, dimethyl silicone polymer 3 Part；
Step 3,800 DEG C are risen to the speed of 4 ~ 6 degree/min, kept for 0.9 ~ 1.1 hour；Again with the speed liter of 9 ~ 11 degree/min To 1200 DEG C, cool down after preserving 0.9 ~ 1.1 hour, so as to obtain the carbonized film of pre-burned；
Step 4, rolled using calender the step 4 pre-burned carbonized film；
Step 5,2400 DEG C are risen to the speed of 19 ~ 21 degree/min, kept for 0.9 ~ 1.1 hour, then with the speed of 19 ~ 21 degree/min Degree rises to 2900 DEG C, cools down, so as to obtain the graphite film of main firing after being kept for 1.8 ~ 2.2 hours；
The graphite film of the main firing obtained by step 6 and then step 3 is rolled so as to obtain the graphite linings.
2. manufacturing process of the panel computer according to claim 1 with conductive graphite pad pasting, it is characterised in that：The step Kapton is risen to into 250 DEG C with 4 ~ 6 degree/min speed from room temperature in one, is kept for 0.9 ~ 1.1 hour, then with 2.5 ~ 3.5 degree/min, 400 DEG C are risen to, near room temperature after being kept for 1 hour.
3. manufacturing process of the panel computer according to claim 1 with conductive graphite pad pasting, it is characterised in that：By the step Rapid four acquisitions graphite linings carry out calendering process.
4. manufacturing process of the panel computer according to claim 1 with conductive graphite pad pasting, it is characterised in that：The light stripping The grammes per square metre of release PET film peeling force is 5 ~ 10g/m2, the grammes per square metre of the re-release type PET film peeling force is 50 ~ 100g/m2。
CN201610787521.5A 2014-01-26 2014-01-26 Manufacturing process for heat-conducting graphite paste films for flat computers Pending CN106535560A (en)

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CN201610778259.8A Pending CN106634658A (en) 2014-01-26 2014-01-26 Manufacturing process for heat-conducting adhesive tape used for laptop
CN201610696479.6A Pending CN106332521A (en) 2014-01-26 2014-01-26 Manufacturing method for double-sided adhesive graphite flake
CN201610696474.3A Pending CN106318250A (en) 2014-01-26 2014-01-26 Preparation process of thermal double-sided adhesive tape
CN201610794749.7A Pending CN106398570A (en) 2014-01-26 2014-01-26 High-compactness graphite soaking adhesive tape
CN201610700227.6A Pending CN106413340A (en) 2014-01-26 2014-01-26 Heat conducting adhesive film for electronic product
CN201610777340.4A Pending CN106398566A (en) 2014-01-26 2014-01-26 Double-face pad pasting with heat radiation
CN201610696862.1A Active CN106304780B (en) 2014-01-26 2014-01-26 Manufacturing process for high thermal conductivity graphite film
CN201610787557.3A Pending CN106520003A (en) 2014-01-26 2014-01-26 Thermal conductive graphite tape used for laptops
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CN201610799197.9A Pending CN106381083A (en) 2014-01-26 2014-01-26 Isothermal pressure-sensitive adhesive tape used for intelligent mobile phones
CN201610787504.1A Pending CN106520002A (en) 2014-01-26 2014-01-26 Heat-conducting pressure-sensitive double-sided tape
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CN201610777339.1A Pending CN106349964A (en) 2014-01-26 2014-01-26 Process for preparing heat-conduction double-sided adhesive tape
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CN201610777909.7A Pending CN106366971A (en) 2014-01-26 2014-01-26 High-heat-conductivity double-sided adhesive tape
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CN201610696479.6A Pending CN106332521A (en) 2014-01-26 2014-01-26 Manufacturing method for double-sided adhesive graphite flake
CN201610696474.3A Pending CN106318250A (en) 2014-01-26 2014-01-26 Preparation process of thermal double-sided adhesive tape
CN201610794749.7A Pending CN106398570A (en) 2014-01-26 2014-01-26 High-compactness graphite soaking adhesive tape
CN201610700227.6A Pending CN106413340A (en) 2014-01-26 2014-01-26 Heat conducting adhesive film for electronic product
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CN201610787557.3A Pending CN106520003A (en) 2014-01-26 2014-01-26 Thermal conductive graphite tape used for laptops
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CN201610799197.9A Pending CN106381083A (en) 2014-01-26 2014-01-26 Isothermal pressure-sensitive adhesive tape used for intelligent mobile phones
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