CN106349965A - preparing method of heat-conducting adhesive tape for consumer electronic product - Google Patents
preparing method of heat-conducting adhesive tape for consumer electronic product Download PDFInfo
- Publication number
- CN106349965A CN106349965A CN201610777536.3A CN201610777536A CN106349965A CN 106349965 A CN106349965 A CN 106349965A CN 201610777536 A CN201610777536 A CN 201610777536A CN 106349965 A CN106349965 A CN 106349965A
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- Prior art keywords
- heat
- adhesive tape
- graphite
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/0427—Coating with only one layer of a composition containing a polymer binder
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1207—Heat-activated adhesive
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/15—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state
- B32B37/153—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state at least one layer is extruded and immediately laminated while in semi-molten state
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- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/15—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state
- B32B37/156—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state at least one layer is calendered and immediately laminated
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
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- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
- B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B9/045—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- C—CHEMISTRY; METALLURGY
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- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/52—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite
- C04B35/522—Graphite
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
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- C04B35/52—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite
- C04B35/524—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite obtained from polymer precursors, e.g. glass-like carbon material
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/62218—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products obtaining ceramic films, e.g. by using temporary supports
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
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- B32B2250/00—Layers arrangement
- B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
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- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
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- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/54—Yield strength; Tensile strength
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- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
- C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
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- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
- C04B2235/66—Specific sintering techniques, e.g. centrifugal sintering
- C04B2235/661—Multi-step sintering
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- C—CHEMISTRY; METALLURGY
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- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
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- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2479/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2461/00 - C08J2477/00
- C08J2479/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C—CHEMISTRY; METALLURGY
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/005—Presence of polyester in the release coating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Carbon And Carbon Compounds (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Abstract
The invention discloses a preparing method of a heat-conducting adhesive tape for a consumer electronic product. The heat-conducting adhesive tape is fit between a heat-dissipating piece and a heating part. The process method comprises the following steps: step 1, heating a polyimide film from room temperature to 250 DEG C at a speed of 4 to 6 DEG C/min, maintaining for 0.9 to 1.1 hours, heating to 400 DEG C at a speed of 2.5 to 3.5 DEG C/min, maintaining for 1 hour and then cooling to room temperature; step 2, coating the upper surface and the lower surface of the polyimide film subjected to treatment in the step 1 with one layer of graphite modifier to obtain the treated polyimide film, wherein the viscosity of the graphite modifier is 30000 to 48000 CP; the graphite modifier consists of the following components in parts by weight: benzophenone tetra-acid dianhydride, 1,2,4,5-benzene tetracarboxylic anhydride, diaminodiphenylmethane, dimethyl formamide, glycol and polydimethylsiloxane. By the preparing method, local overheating of the adhesive tape is avoided, the uniformity of the heat-conducting property of the adhesive tape is realized, the stability and the reliability of the heat-dissipating property of the product are improved and the cost of the product is greatly reduced.
Description
Technical field
The present invention relates to a kind of manufacture method of heat conduction adhesive tape, belong to double faced adhesive chip technology field.
Background technology
The trend of development of computer is to develop lighter and thinner product, and for example, panel computer and notebook computer are more nextMore popular, because the profile of their dexterities. Because the size of these products becomes less, heat radiation be all the time one considerableAspect,, high temperature can reduce performance, reliability and the service life of electronic equipment. Therefore, current electron trade is for as thermal controlThe heat sink material of system core parts proposes more and more higher requirement, rapid in the urgent need to a kind of high-efficiency heat conduction, light materialHeat is passed, ensure that electronic equipment normally moves. All backing is that one is transmitted between thermal source and secondary unitThe heat exchanger of heat, its surf zone and shape are more conducive to heat radiation compared with thermal source. By equal backing, the heat being produced by thermal source" diffusion ", to secondary unit, so well eliminated the heat accumulation in thermal source.
In prior art, Kapton is used for greatly flexible PCB, although there be polyimide film sintered the obtaining of employingGraphite heat radiation fin, thereby paste on thermal source, but be limited to Kapton product quality and performances the good and the bad notTogether, have influence on the performance of the two-sided pad pasting heat dispersion that dispels the heat, had following technical problem: dispel the heat inhomogeneous, be prone to adhesive tapeHot-spot, the heat dispersion that improved product is unstable, reliability performance is poor, is unfavorable for product quality management control, affects productCompetitiveness, how to overcome above-mentioned technical problem become those skilled in the art make great efforts direction.
Summary of the invention
The object of the invention is to provide the manufacture method of a kind of consumption electronic product heat conduction adhesive tape, and this manufacture method obtainsHeat conduction adhesive tape all improved heat conductivility with horizontal direction in the vertical direction, avoid adhesive tape hot-spot, realized adhesive tape and ledThe inhomogeneity while of hot property, improve heat dispersion stability, the reliability of product, greatly reduce the cost of product.
For achieving the above object, the technical solution used in the present invention is: the system of heat conduction adhesive tape for a kind of consumption electronic productMaking method, described heat conduction adhesive tape fits between radiating piece and heat generating components, and the two-sided pad pasting of described heat radiation comprises light strippable PETFilm and heavy strippable PET film, between this light strippable PET film and heavy strippable PET film, be disposed with the first heat-conducting glue adhesion coating,Graphite linings and the second heat-conducting glue adhesion coating; It is characterized in that: described graphite linings obtains by following process this process bagDraw together following steps:
Step 1, Kapton is risen to 250 DEG C with 4 ~ 6 degree/min speed from room temperature, keep 0.9 ~ 1.1 hour, thenWith 2.5 ~ 3.5 degree/min, rise to 400 DEG C, keep near room temperature after 1 hour;
Step 2, obtain and process all applying graphite modified dose of one deck through the upper and lower surface of the Kapton of step 1After Kapton, the viscosity of described graphite modified dose is 30000 ~ 48000CP;
Described graphite modified dose of component by following weight portion forms: 23 parts of benzophenone tetracarboxylic dianhydrides, pyromellitic acid anhydride12 parts, 26.5 parts of MDAs, 34 parts of dimethyl formamides, 2.2 parts of ethylene glycol, 2 parts of dimethyl silicone polymers;
Step 3, rise to 800 DEG C with the speed of 4 ~ 6 degree/min, keep 0.9 ~ 1.1 hour; Again with the speed liter of 9 ~ 11 degree/minTo 1200 DEG C, preserve cooling after 0.9 ~ 1.1 hour, thereby obtain the carbonized film of pre-burned;
Step 4, employing calender roll the carbonized film of the pre-burned of described step 4;
Step 5, rise to 2400 DEG C with the speed of 19 ~ 21 degree/min, keep 0.9 ~ 1.1 hour, then with the speed of 19 ~ 21 degree/minDegree rises to 2900 DEG C, keeps cooling after 1.8 ~ 2.2 hours, thereby obtains the main graphite film of firing;
Thereby step 6, the graphite film that then master of step 3 gained fires roll and obtain described graphite linings.
In technique scheme, further improved plan is as follows:
1,, in such scheme, described step 4 is obtained to graphite linings and carry out calendering process.
2,, in such scheme, the grammes per square metre of described light strippable PET film peeling force is 5 ~ 10g/m2, described heavy strippable PETThe grammes per square metre of film peeling force is 50 ~ 100g/m2。
Because technique scheme is used, the present invention compared with prior art has following advantages and effect:
The manufacture method of heat conduction adhesive tape for consumption electronic product of the present invention, in its structure, graphite linings all applies one by upper and lower surfaceThe layer Kapton of graphite modified dose be prepared from, and improved in the vertical direction and the heat conductivility of horizontal direction, avoidsAdhesive tape hot-spot, has realized the uniformity of adhesive tape heat conductivility; Secondly, it is positioned at the graphite modified of Kapton surfaceAgent is by benzophenone tetracarboxylic dianhydride, pyromellitic acid anhydride, MDA, dimethyl formamide, ethylene glycol, poly-diformazanRadical siloxane composition, is coated on Kapton, has filled the pin hole in heating process, has improved degree of crystallinity simultaneously, alsoOvercome excessive cause inhomogeneous of thermal contraction, improved graphite linings biaxial tension performance; Again, Kapton surface toolThere is graphite modified dose, improved graphite linings and heat-conducting glue adhesion coating heat conductivility in two-sided pad pasting, and adopt described in calender calenderingThe carbonized film of pre-burned, has avoided the volume contraction in fold and graphitization sintering process, has improved compactness and degree of crystallinity, entersOne step has improved in the vertical direction the heat conductivility with horizontal direction.
Detailed description of the invention
Below in conjunction with embodiment, the invention will be further described:
Embodiment: the manufacture method of heat conduction adhesive tape for a kind of consumption electronic product, the two-sided pad pasting of described heat radiation fits in radiating pieceAnd between heat generating components, the two-sided pad pasting of described heat radiation comprises light strippable PET film and heavy strippable PET film, this light strippable PETBetween film and heavy strippable PET film, be disposed with the first heat-conducting glue adhesion coating, graphite linings and the second heat-conducting glue adhesion coating; Described graphiteLayer obtains by following process, and this process comprises the following steps:
Step 1, Kapton is risen to 250 DEG C with 4 ~ 6 degree/min speed from room temperature, keep 0.9 ~ 1.1 hour, thenWith 2.5 ~ 3.5 degree/min, rise to 400 DEG C, keep being down to room temperature after 1 hour;
Step 2, obtain and process all applying graphite modified dose of one deck through the upper and lower surface of the Kapton of step 1After Kapton, described graphite modified dose of component by following weight portion forms: 23 parts of benzophenone tetracarboxylic dianhydrides,12 parts of pyromellitic acid anhydrides, 26.5 parts of MDAs, 34 parts of dimethyl formamides, 2.2 parts of ethylene glycol, poly-diformazan2 parts of radical siloxanes; The viscosity of graphite modified dose of embodiment is 32000CP;
Step 3, rise to 800 DEG C with the speed of 4 ~ 6 degree/min, keep 0.9 ~ 1.1 hour; Again with the speed liter of 9 ~ 11 degree/minTo 1200 DEG C, preserve cooling after 0.9 ~ 1.1 hour, thereby obtain the carbonized film of pre-burned;
Step 4, employing calender roll the carbonized film of the pre-burned of described step 4;
Step 5, rise to 2400 DEG C with the speed of 19 ~ 21 degree/min, keep 0.9 ~ 1.1 hour, then with the speed of 19 ~ 21 degree/minDegree rises to 2900 DEG C, keeps cooling after 1.8 ~ 2.2 hours, thereby obtains the main graphite film of firing;
Thereby step 6, the graphite film that then master of step 5 gained fires roll and obtain described graphite linings.
Described step 6 is obtained to graphite linings and carry out calendering process.
The grammes per square metre of above-mentioned light strippable PET film 1 peeling force is 5 ~ 10g/m2, described heavy strippable PET film peeling force gramBe heavily 50 ~ 100g/m2。
While adopting the manufacture method of above-mentioned consumption electronic product heat conduction adhesive tape, in its structure, graphite linings is by upper and lower surfaceThe Kapton that all applies graphite modified dose of one deck is prepared from, and improved in the vertical direction the thermal conductivity with horizontal directionCan, avoid adhesive tape hot-spot, realize the uniformity of adhesive tape heat conductivility; Secondly, it is positioned at Kapton surfaceGraphite modified dose by benzophenone tetracarboxylic dianhydride, pyromellitic acid anhydride, MDA, dimethyl formamide, second twoAlcohol, dimethyl silicone polymer composition, be coated on Kapton, filled the pin hole in heating process, improved crystallizationDegree simultaneously, has also overcome excessive cause inhomogeneous of thermal contraction, has improved graphite linings biaxial tension performance; Again, polyimidesFilm surface has graphite modified dose, has improved graphite linings and heat-conducting glue adhesion coating heat conductivility in two-sided pad pasting, and adopts calenderingMachine rolls the carbonized film of described pre-burned, has avoided the volume contraction in fold and graphitization sintering process, has improved compactnessAnd degree of crystallinity, further improve in the vertical direction the heat conductivility with horizontal direction.
Above-described embodiment is only explanation technical conceive of the present invention and feature, and its object is to allow person skilled in the artScholar can understand content of the present invention and implement according to this, can not limit the scope of the invention with this. All according to the present inventionThe equivalence that Spirit Essence is done changes or modifies, within all should being encompassed in protection scope of the present invention.
Claims (3)
1. a manufacture method for heat conduction adhesive tape for consumption electronic product, described heat conduction adhesive tape fits in radiating piece and heat generating componentsBetween, the two-sided pad pasting of described heat radiation comprises light strippable PET film and heavy strippable PET film, this light strippable PET film and heavily peeling offBetween type PET film, be disposed with the first heat-conducting glue adhesion coating, graphite linings and the second heat-conducting glue adhesion coating; It is characterized in that: described stoneChina ink layer obtains by following process, and this process comprises the following steps:
Step 1, Kapton is risen to 250 DEG C with 4 ~ 6 degree/min speed from room temperature, keep 0.9 ~ 1.1 hour, thenWith 2.5 ~ 3.5 degree/min, rise to 400 DEG C, keep near room temperature after 1 hour;
Step 2, obtain and process all applying graphite modified dose of one deck through the upper and lower surface of the Kapton of step 1After Kapton, the viscosity of described graphite modified dose is 30000 ~ 48000CP;
Described graphite modified dose of component by following weight portion forms: 23 parts of benzophenone tetracarboxylic dianhydrides, pyromellitic acid anhydride12 ~ 18 parts, 20 ~ 28 parts of MDAs, 30 ~ 35 parts of dimethyl formamides, 2.2 parts of ethylene glycol, dimethyl silicone polymer 2Part;
Step 3, rise to 800 DEG C with the speed of 4 ~ 6 degree/min, keep 0.9 ~ 1.1 hour; Again with the speed liter of 9 ~ 11 degree/minTo 1200 DEG C, preserve cooling after 0.9 ~ 1.1 hour, thereby obtain the carbonized film of pre-burned;
Step 4, employing calender roll the carbonized film of the pre-burned of described step 4;
Step 5, rise to 2400 DEG C with the speed of 19 ~ 21 degree/min, keep 0.9 ~ 1.1 hour, then with the speed of 19 ~ 21 degree/minDegree rises to 2900 DEG C, keeps cooling after 1.8 ~ 2.2 hours, thereby obtains the main graphite film of firing;
Thereby step 6, the graphite film that then master of step 3 gained fires roll and obtain described graphite linings.
2. according to the manufacture method of the consumption electronic product use heat conduction adhesive tape described in claim 1, it is characterized in that: described in inciting somebody to actionStep 4 obtains graphite linings and carries out calendering process.
3. the manufacture method with heat conduction adhesive tape according to the consumption electronic product described in claim 1, is characterized in that: described lightThe grammes per square metre of strippable PET film peeling force is 5 ~ 10g/m2, the grammes per square metre of described heavy strippable PET film peeling force is 50 ~ 100g/m2。
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CN201610777340.4A Pending CN106398566A (en) | 2014-01-26 | 2014-01-26 | Double-face pad pasting with heat radiation |
CN201610705884.XA Pending CN106332522A (en) | 2014-01-26 | 2014-01-26 | High-heat-conductivity graphite film |
CN201610787521.5A Pending CN106535560A (en) | 2014-01-26 | 2014-01-26 | Manufacturing process for heat-conducting graphite paste films for flat computers |
CN201610794749.7A Pending CN106398570A (en) | 2014-01-26 | 2014-01-26 | High-compactness graphite soaking adhesive tape |
CN201610704135.5A Pending CN106281087A (en) | 2014-01-26 | 2014-01-26 | Heat-conducting double-sided adhesive tape |
CN201610799197.9A Pending CN106381083A (en) | 2014-01-26 | 2014-01-26 | Isothermal pressure-sensitive adhesive tape used for intelligent mobile phones |
CN201610777909.7A Pending CN106366971A (en) | 2014-01-26 | 2014-01-26 | High-heat-conductivity double-sided adhesive tape |
CN201610696862.1A Active CN106304780B (en) | 2014-01-26 | 2014-01-26 | Manufacturing process for high thermal conductivity graphite film |
CN201610777339.1A Pending CN106349964A (en) | 2014-01-26 | 2014-01-26 | Process for preparing heat-conduction double-sided adhesive tape |
CN201610787504.1A Pending CN106520002A (en) | 2014-01-26 | 2014-01-26 | Heat-conducting pressure-sensitive double-sided tape |
CN201610696479.6A Pending CN106332521A (en) | 2014-01-26 | 2014-01-26 | Manufacturing method for double-sided adhesive graphite flake |
CN201610696475.8A Pending CN106318251A (en) | 2014-01-26 | 2014-01-26 | Manufacture method of thermal transfer film |
CN201610696474.3A Pending CN106318250A (en) | 2014-01-26 | 2014-01-26 | Preparation process of thermal double-sided adhesive tape |
CN201410037378.9A Active CN103763892B (en) | 2014-01-26 | 2014-01-26 | Heat conduction graphite patch for microelectronic device |
CN201610705947.1A Active CN106304783B (en) | 2014-01-26 | 2014-01-26 | Thermal conductivity both-sided adhesive graphite flake |
CN201610777536.3A Pending CN106349965A (en) | 2014-01-26 | 2014-01-26 | preparing method of heat-conducting adhesive tape for consumer electronic product |
CN201610777537.8A Pending CN106398567A (en) | 2014-01-26 | 2014-01-26 | Pressure sensitive adhesive tape for notebook computer |
CN201610700227.6A Pending CN106413340A (en) | 2014-01-26 | 2014-01-26 | Heat conducting adhesive film for electronic product |
CN201610778259.8A Pending CN106634658A (en) | 2014-01-26 | 2014-01-26 | Manufacturing process for heat-conducting adhesive tape used for laptop |
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CN201610705884.XA Pending CN106332522A (en) | 2014-01-26 | 2014-01-26 | High-heat-conductivity graphite film |
CN201610787521.5A Pending CN106535560A (en) | 2014-01-26 | 2014-01-26 | Manufacturing process for heat-conducting graphite paste films for flat computers |
CN201610794749.7A Pending CN106398570A (en) | 2014-01-26 | 2014-01-26 | High-compactness graphite soaking adhesive tape |
CN201610704135.5A Pending CN106281087A (en) | 2014-01-26 | 2014-01-26 | Heat-conducting double-sided adhesive tape |
CN201610799197.9A Pending CN106381083A (en) | 2014-01-26 | 2014-01-26 | Isothermal pressure-sensitive adhesive tape used for intelligent mobile phones |
CN201610777909.7A Pending CN106366971A (en) | 2014-01-26 | 2014-01-26 | High-heat-conductivity double-sided adhesive tape |
CN201610696862.1A Active CN106304780B (en) | 2014-01-26 | 2014-01-26 | Manufacturing process for high thermal conductivity graphite film |
CN201610777339.1A Pending CN106349964A (en) | 2014-01-26 | 2014-01-26 | Process for preparing heat-conduction double-sided adhesive tape |
CN201610787504.1A Pending CN106520002A (en) | 2014-01-26 | 2014-01-26 | Heat-conducting pressure-sensitive double-sided tape |
CN201610696479.6A Pending CN106332521A (en) | 2014-01-26 | 2014-01-26 | Manufacturing method for double-sided adhesive graphite flake |
CN201610696475.8A Pending CN106318251A (en) | 2014-01-26 | 2014-01-26 | Manufacture method of thermal transfer film |
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CN201410037378.9A Active CN103763892B (en) | 2014-01-26 | 2014-01-26 | Heat conduction graphite patch for microelectronic device |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107551392A (en) * | 2017-08-29 | 2018-01-09 | 成都三乙医疗科技有限公司 | A kind of thermal conducting piece for thermotherapy |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
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CN113444499B (en) * | 2021-06-25 | 2022-03-11 | 深圳市三科斯电子材料有限公司 | Double-sided adhesive high-thermal-conductivity synthetic graphite flake and preparation method thereof |
CN113880595B (en) * | 2021-11-16 | 2023-03-28 | 江西鸿美新能源科技有限公司 | Graphite film with high heat conductivity in vertical direction and preparation method thereof |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101289544A (en) * | 2007-04-18 | 2008-10-22 | 宇部兴产株式会社 | Process for producing polyimide film and polyimide film |
CN103043657A (en) * | 2012-12-28 | 2013-04-17 | 苏州斯迪克新材料科技股份有限公司 | Graphite radiation fin for adhesive tapes |
CN202936356U (en) * | 2012-11-01 | 2013-05-15 | 斯迪克新型材料(江苏)有限公司 | Double-sided adhesive for heat dissipation of electronic elements |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1826288A (en) * | 2003-09-02 | 2006-08-30 | 株式会社钟化 | Filmy graphite and process for producing the same |
CN2696285Y (en) * | 2004-04-27 | 2005-04-27 | 天瑞企业股份有限公司 | Radiation structure of elatroluminescent display element |
EP2154109B1 (en) * | 2007-05-17 | 2018-09-19 | Kaneka Corporation | Graphite film and graphite composite film |
WO2011007510A1 (en) * | 2009-07-13 | 2011-01-20 | パナソニック株式会社 | Graphite sheet and heat transfer structure using same |
KR101125266B1 (en) * | 2010-02-17 | 2012-03-21 | 그린스타 주식회사 | Heat radiating sheet comprising adhesives with improved heat conductivity |
JP5460569B2 (en) * | 2010-12-17 | 2014-04-02 | 株式会社カネカ | Film-like graphite and method for producing the same |
KR101458561B1 (en) * | 2011-03-28 | 2014-11-07 | 가부시키가이샤 가네카 | Process for producing graphite film |
CN103045199A (en) * | 2011-10-13 | 2013-04-17 | 张彪 | Process for preparing drilling fluid based on control of dosage of viscosity reducer |
CN202322703U (en) * | 2011-11-07 | 2012-07-11 | 吴志高 | Adhesive tape with heat conduction performance |
CN103911084B (en) * | 2012-12-18 | 2016-03-02 | 苏州斯迪克新材料科技股份有限公司 | Acrylate adhesive tape |
CN103059761B (en) * | 2012-12-28 | 2014-09-03 | 斯迪克新型材料(江苏)有限公司 | High-heat conductivity coefficient graphite heat-radiation adhesive tape |
CN103045119B (en) * | 2012-12-28 | 2014-04-23 | 苏州斯迪克新材料科技股份有限公司 | Heat-dissipating double-sided adhesive tape with ultrahigh heat conductivity coefficient |
CN203181498U (en) * | 2013-03-25 | 2013-09-04 | 深圳市跨越电子有限公司 | A graphite film with high thermal conductivity |
CN203243663U (en) * | 2013-04-24 | 2013-10-16 | 常州碳元科技发展有限公司 | High heat conductivity graphite film heat-dissipating structure applied to shell of electronic terminal |
CN203289811U (en) * | 2013-05-27 | 2013-11-13 | 苏州沛德导热材料有限公司 | A graphite heat conduction and wave absorption device |
-
2014
- 2014-01-26 CN CN201610777925.6A patent/CN106427180B/en active Active
- 2014-01-26 CN CN201610777340.4A patent/CN106398566A/en active Pending
- 2014-01-26 CN CN201610705884.XA patent/CN106332522A/en active Pending
- 2014-01-26 CN CN201610787521.5A patent/CN106535560A/en active Pending
- 2014-01-26 CN CN201610794749.7A patent/CN106398570A/en active Pending
- 2014-01-26 CN CN201610704135.5A patent/CN106281087A/en active Pending
- 2014-01-26 CN CN201610799197.9A patent/CN106381083A/en active Pending
- 2014-01-26 CN CN201610777909.7A patent/CN106366971A/en active Pending
- 2014-01-26 CN CN201610696862.1A patent/CN106304780B/en active Active
- 2014-01-26 CN CN201610777339.1A patent/CN106349964A/en active Pending
- 2014-01-26 CN CN201610787504.1A patent/CN106520002A/en active Pending
- 2014-01-26 CN CN201610696479.6A patent/CN106332521A/en active Pending
- 2014-01-26 CN CN201610696475.8A patent/CN106318251A/en active Pending
- 2014-01-26 CN CN201610696474.3A patent/CN106318250A/en active Pending
- 2014-01-26 CN CN201410037378.9A patent/CN103763892B/en active Active
- 2014-01-26 CN CN201610705947.1A patent/CN106304783B/en active Active
- 2014-01-26 CN CN201610777536.3A patent/CN106349965A/en active Pending
- 2014-01-26 CN CN201610777537.8A patent/CN106398567A/en active Pending
- 2014-01-26 CN CN201610700227.6A patent/CN106413340A/en active Pending
- 2014-01-26 CN CN201610778259.8A patent/CN106634658A/en active Pending
- 2014-01-26 CN CN201610787557.3A patent/CN106520003A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101289544A (en) * | 2007-04-18 | 2008-10-22 | 宇部兴产株式会社 | Process for producing polyimide film and polyimide film |
CN202936356U (en) * | 2012-11-01 | 2013-05-15 | 斯迪克新型材料(江苏)有限公司 | Double-sided adhesive for heat dissipation of electronic elements |
CN103043657A (en) * | 2012-12-28 | 2013-04-17 | 苏州斯迪克新材料科技股份有限公司 | Graphite radiation fin for adhesive tapes |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107551392A (en) * | 2017-08-29 | 2018-01-09 | 成都三乙医疗科技有限公司 | A kind of thermal conducting piece for thermotherapy |
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CN106304783A (en) | 2017-01-04 |
CN106634658A (en) | 2017-05-10 |
CN103763892A (en) | 2014-04-30 |
CN106535560A (en) | 2017-03-22 |
CN106304780A (en) | 2017-01-04 |
CN103763892B (en) | 2017-01-11 |
CN106349964A (en) | 2017-01-25 |
CN106366971A (en) | 2017-02-01 |
CN106304780B (en) | 2019-01-01 |
CN106520003A (en) | 2017-03-22 |
CN106427180A (en) | 2017-02-22 |
CN106413340A (en) | 2017-02-15 |
CN106381083A (en) | 2017-02-08 |
CN106398570A (en) | 2017-02-15 |
CN106427180B (en) | 2018-09-18 |
CN106304783B (en) | 2019-01-01 |
CN106281087A (en) | 2017-01-04 |
CN106318251A (en) | 2017-01-11 |
CN106398567A (en) | 2017-02-15 |
CN106332521A (en) | 2017-01-11 |
CN106318250A (en) | 2017-01-11 |
CN106520002A (en) | 2017-03-22 |
CN106398566A (en) | 2017-02-15 |
CN106332522A (en) | 2017-01-11 |
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