CN113265227A - Boron nitride composite thermal interface material - Google Patents
Boron nitride composite thermal interface material Download PDFInfo
- Publication number
- CN113265227A CN113265227A CN202010095363.3A CN202010095363A CN113265227A CN 113265227 A CN113265227 A CN 113265227A CN 202010095363 A CN202010095363 A CN 202010095363A CN 113265227 A CN113265227 A CN 113265227A
- Authority
- CN
- China
- Prior art keywords
- boron nitride
- heat
- thermal interface
- interface material
- conducting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/02—Materials undergoing a change of physical state when used
- C09K5/06—Materials undergoing a change of physical state when used the change of state being from liquid to solid or vice versa
- C09K5/063—Materials absorbing or liberating heat during crystallisation; Heat storage materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a boron nitride composite thermal interface material, which comprises: the heat-conducting material comprises a high polymer material matrix, boron nitride heat-conducting fillers and phase-change heat-conducting fillers; and the boron nitride heat-conducting filler and the phase-change heat-conducting filler are filled into the high polymer material matrix in a blending mode. According to the invention, the boron nitride heat-conducting filler can remarkably improve the overall heat conductivity of the thermal interface material and ensure the insulating property of the thermal interface material; the phase change heat conduction filler utilizes the phase change latent heat thereof to provide the capability of solving instantaneous high heat flow or periodic high heat flow for the thermal interface material; the polymer material substrate ensures the flexibility and compressibility of the thermal interface material, can fully fill the gap between the electronic element and the heat dissipation module, and also serves as a carrier of the phase change heat conduction filler, so that the problem of overflow of the traditional phase change material is avoided.
Description
Technical Field
The invention belongs to the technical field of thermal interface materials, and particularly relates to a boron nitride composite thermal interface material.
Background
In recent years, microelectronic devices have become more miniaturized, lightweight, and highly integrated, and therefore, heat dissipation problems of heat generating elements such as chips in electronic devices have become one of the important factors that restrict their development. In order to solve the heat dissipation problem, the most common method at present is to fill a thermal interface material in a gap between the electronic component and the heat dissipation module to reduce the thermal contact resistance and improve the heat conduction efficiency. Generally, thermal interface materials are required to have high out-of-plane thermal conductivity, while having good insulating properties to prevent electrical component leakage or short circuit induced failures, and some flexibility or compressibility to ensure a gap-filling effect between the thermal interface material and the heat dissipation module.
Boron nitride is an ideal filler of the current thermal interface material as a material with high thermal conductivity and good insulating property. The boron nitride is filled into the polymer matrix to prepare the composite material, so that the heat transfer performance of the thermal interface material can be obviously improved. However, the thermal interface material prepared in this way has good heat transfer effect in a steady state, but has poor heat transfer effect on transient high heat flow and periodic heat flow. For transient high heat flow and periodic heat flow, the current solution is to use phase change material to make thermal interface material, and absorb the transient excess heat by the latent heat of phase change of the phase change material. However, phase change materials tend to flow when molten, leading to bleeding of the thermal interface material, failure of the thermal interface layer, and even contamination of the electronic device.
Disclosure of Invention
The invention provides a boron nitride composite thermal interface material, which aims at solving the problems that the traditional thermal interface material has poor conduction performance on transient high heat flow and periodic heat flow, and a phase change material serving as the thermal interface material easily overflows from the contact surface of an electronic element and a radiating module to cause thermal interface layer failure and pollution to the electronic element.
In order to achieve the technical purpose and achieve the technical effects, the invention is realized by the following technical scheme:
a boron nitride composite thermal interface material, comprising: the heat-conducting material comprises a high polymer material matrix, boron nitride heat-conducting fillers and phase-change heat-conducting fillers; and the boron nitride heat-conducting filler and the phase-change heat-conducting filler are filled into the high polymer material matrix in a blending mode.
Optionally, the boron nitride thermally conductive filler comprises boron nitride particles, boron nitride micro-platelets, or boron nitride nano-platelets.
Optionally, the phase change thermally conductive filler includes polyethylene glycol, paraffin wax, or acetic acid.
Optionally, the polymer material matrix comprises polysiloxane, polyacrylic acid, polyurethane, or a thermoplastic elastomer.
Optionally, the phase change temperature of the phase change heat conducting filler is 20-60 ℃.
Optionally, the boron nitride composite thermal interface material has an out-of-plane thermal conductivity of no less than 2.0W/m · K.
Optionally, the boron nitride composite thermal interface material has a resistivity greater than or equal to 1011Ω·m。
Compared with the prior art, the invention has the beneficial effects that:
according to the invention, the boron nitride heat-conducting filler can remarkably improve the overall heat conductivity of the thermal interface material and ensure the insulating property of the thermal interface material; the phase change heat conduction filler utilizes the phase change latent heat thereof to provide the capability of solving instantaneous high heat flow or periodic high heat flow for the thermal interface material; the polymer material substrate ensures the flexibility and compressibility of the thermal interface material, can fully fill the gap between the electronic element and the heat dissipation module, and also serves as a carrier of the phase change heat conduction filler, so that the problem of overflow of the traditional phase change material is avoided.
Drawings
In order that the present disclosure may be more readily and clearly understood, reference is now made to the following detailed description of the present disclosure taken in conjunction with the accompanying drawings, in which:
FIG. 1 is a schematic structural diagram of a boron nitride composite thermal interface material according to an embodiment of the present invention
FIG. 2 is a schematic illustration of the thermal interface material of FIG. 1 in use in an electronic component;
fig. 3 is an enlarged view of the contact interface between the electronic component and the heat dissipation module of fig. 2;
wherein:
the heat dissipation module comprises 10-boron nitride composite thermal interface material, 11-high polymer material matrix, 12-boron nitride heat conduction filler, 13-phase change heat conduction filler, 21-heat dissipation module and 22-electronic element.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and do not limit the scope of the invention.
The following detailed description of the principles of the invention is provided in connection with the accompanying drawings.
As shown in fig. 1, the present invention provides a boron nitride composite thermal interface material 10, comprising: a polymer material matrix 11, a boron nitride heat-conducting filler 12 and a phase-change heat-conducting filler 13; the boron nitride heat-conducting filler 12 and the phase-change heat-conducting filler 13 are filled in the polymer material matrix 11 in a blending manner.
In a specific embodiment of the present invention, the boron nitride thermal conductive filler 12 includes boron nitride particles, boron nitride micro-platelets, or boron nitride nano-platelets. The phase change heat conductive filler 13 includes polyethylene glycol, paraffin, or acetic acid. The high polymer material matrix comprises polysiloxane, polyacrylic acid, polyurethane and thermoplastic elastomer. The phase change temperature of the phase change heat conduction filler 13 is 20-60 ℃. The out-of-plane thermal conductivity of the boron nitride composite thermal interface material 10 is not less than 2.0W/m.K. The boron nitride composite thermal interface material 10 has a resistivity greater than or equal to 1011Ω·m。
As shown in fig. 2, the boron nitride composite thermal interface material 10 of the present invention may be applied between an electronic component 22 and a heat dissipation module 21.
As shown in fig. 3, the contact surfaces of the electronic component 22, the thermal interface material 10, and the heat dissipation module 21 are rough, and pressure is applied to make them adhere tightly during mounting. In a steady state, the thermal interface material 10 has a good thermal conduction effect due to the addition of the boron nitride thermal conductive filler 12. When the electronic element 22 is subjected to transient high heat flow and periodic heat flow, the phase-change heat conducting filler 13 melts from a solid state and absorbs excessive heat, and at this time, the polymer material matrix 11 serving as a carrier of the phase-change heat conducting filler 13 can completely wrap the phase-change heat conducting filler 13, so as to prevent the phase-change heat conducting filler 13 from leaking or overflowing to cause failure or pollution to the electronic element 22.
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (7)
1. A boron nitride composite thermal interface material, comprising: the heat-conducting material comprises a high polymer material matrix, boron nitride heat-conducting fillers and phase-change heat-conducting fillers; and the boron nitride heat-conducting filler and the phase-change heat-conducting filler are filled into the high polymer material matrix in a blending mode.
2. The boron nitride composite thermal interface material of claim 1, wherein: the boron nitride heat conduction filler comprises boron nitride particles, boron nitride micron sheets or boron nitride nano sheets.
3. The boron nitride composite thermal interface material of claim 1, wherein: the phase change heat conduction filler comprises polyethylene glycol, paraffin or acetic acid.
4. The boron nitride composite thermal interface material of claim 1, wherein: the high polymer material matrix comprises polysiloxane, polyacrylic acid, polyurethane and thermoplastic elastomer.
5. The boron nitride composite thermal interface material of claim 1, wherein: the phase change temperature of the phase change heat conduction filler is 20-60 ℃.
6. The boron nitride composite thermal interface material of claim 1, wherein: the out-of-plane thermal conductivity of the boron nitride composite thermal interface material is not less than 2.0W/m.K.
7. The boron nitride composite thermal interface material of claim 1, wherein: the resistivity of the boron nitride composite thermal interface material is more than or equal to 1011Ω·m。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010095363.3A CN113265227A (en) | 2020-02-17 | 2020-02-17 | Boron nitride composite thermal interface material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010095363.3A CN113265227A (en) | 2020-02-17 | 2020-02-17 | Boron nitride composite thermal interface material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113265227A true CN113265227A (en) | 2021-08-17 |
Family
ID=77227380
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010095363.3A Withdrawn CN113265227A (en) | 2020-02-17 | 2020-02-17 | Boron nitride composite thermal interface material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113265227A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114316497A (en) * | 2021-12-28 | 2022-04-12 | 青岛理工大学 | Phase change trigger type thermal interface material with low contact thermal resistance and preparation method thereof |
-
2020
- 2020-02-17 CN CN202010095363.3A patent/CN113265227A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114316497A (en) * | 2021-12-28 | 2022-04-12 | 青岛理工大学 | Phase change trigger type thermal interface material with low contact thermal resistance and preparation method thereof |
| CN114316497B (en) * | 2021-12-28 | 2024-04-19 | 青岛理工大学 | Phase-change triggering type thermal interface material with low contact thermal resistance and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11610831B2 (en) | Methods for establishing thermal joints between heat spreaders or lids and heat sources | |
| CN205789935U (en) | Reusable thermoplasticity thermal interfacial material, electronic equipment and thermal interfacial material | |
| CN101247715B (en) | Thermal diffusion sheet and manufacturing method of the same | |
| CN103545273B (en) | Energy-storage radiating sheet and production method thereof | |
| JP5237254B2 (en) | HEAT CONDUCTIVE MEMBER, ELECTRONIC DEVICE, AND METHOD OF USING THE HEAT CONDUCTIVE MEMBER | |
| US11375639B2 (en) | Additive manufactured multi-layer thermally conductive parts | |
| JP2011040565A (en) | Thermal conductive sheet, semiconductor device using the same, and method of manufacturing the same | |
| JP7307099B2 (en) | Thermal contact filler and battery assembly with thermal contact filler | |
| EP0696630A2 (en) | Heat conductive material and method for producing the same | |
| US20030151898A1 (en) | Heat-dissipating member, manufacturing method and installation method | |
| CN113265227A (en) | Boron nitride composite thermal interface material | |
| CN206059377U (en) | A kind of power device single tube and its chiller | |
| CN115692343A (en) | Composite heat conduction structure and electronic equipment | |
| CN210103830U (en) | Copper foil patch for mobile phone display screen | |
| CN209806148U (en) | Electronic assembly with heat dissipation paste layer | |
| CN209794770U (en) | Low-melting-point alloy composite heat conduction material | |
| CN203573969U (en) | Energy storage radiating fin | |
| KR101627327B1 (en) | Polymer composite for heat emission property and method of manufacturing the same | |
| CN215453740U (en) | Heat conduction phase transition potsherd | |
| CN101657063B (en) | Method for manufacturing radiating circuit board and radiating circuit board | |
| CN217103668U (en) | Foam copper base material conducting strip | |
| CN111263575B (en) | Heat dissipation system | |
| CN210560208U (en) | Bonding layer for heat dissipation of electronic device and heat dissipation structure thereof | |
| CN206134720U (en) | LED packaging structure | |
| Khatri et al. | " Dry-to-the-touch" thermal grease |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20210817 |