CN114752363B - Application method of high-heat-conductivity composite thermal interface material - Google Patents
Application method of high-heat-conductivity composite thermal interface material Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention provides an application method of a high-heat-conductivity composite thermal interface material, which is characterized in that the high-heat-conductivity composite thermal interface material is arranged between a heat generating element and a radiating fin and is compressed, a direct-current power supply is connected with a substrate in the high-heat-conductivity composite thermal interface material, so that indium layers on two sides of the substrate are heated to 130-160 ℃ within 0.2 seconds, the heat generating element and the radiating fin are firmly connected, the heat generating element can effectively radiate heat, and the application method is suitable for mass production and application.
Description
Technical Field
The invention relates to the technical field of preparation of electronic packaging materials, in particular to an application method of a high-heat-conductivity composite thermal interface material.
Background
The integration level of modern electronic components is continuously improved, the heat flux density of the electronic components is increased, and the heat dissipation performance of the electronic components becomes a key factor for determining the service life of electronic equipment. The chip heating problem faced by the microelectronics industry is very serious, and the heat flux density of part of high-performance chips is up to 300W/cm 2 Even higher. Good contact and high thermal conductivity between the heat sink and the chip are required to effectively dissipate heat. When two solid surfaces are bonded, the two surfaces appear to be in full contact, but even if the two interface contact pressure reaches 10MPa, the actual contact area is only 1% -2% of the nominal contact area, since any appears smoothThe surface has micro-scale ravines and valleys. The micro-gap is filled with air, which is a poor conductor of heat, having a thermal conductivity of about 0.026W/m-K, about four orders of magnitude lower than that of metal. Thus impeding heat transfer between the two surfaces.
The thermal interface materials on the market today are largely divided into the following categories: the thermal conductive pad, the phase change material, the thermal grease, the thermal gel, the thermal conductive adhesive tape and the solder. Wherein the conventional polymer-based thermal interface material is present at a ratio of approximately 90% in all products. The polymer-based thermal interface material is characterized in that a high-molecular organic material is used as a substrate, a material with high heat conductivity coefficient is used as a filler, and the organic material is soft and has good compliance, and the high heat conductivity of the filler is combined, so that the gap between the heating device and the radiating fin is ensured to be filled.
However, the thermal conductivity of the polymer is low, and even if a high thermal conductivity filler is used, the thermal conductivity cannot be improved to a large extent. The thermal conductivity of the thermal interface materials based on organic matters which are commercially available in the market at present is mostly 2-8W/m.K.
CN114023654a discloses a silver/graphene composite heat conduction interface material and a preparation method thereof, comprising the following steps: A. carrying out surface pretreatment on the copper base material; B. depositing graphene at a position where the copper substrate is subjected to surface pretreatment; C. immersing the copper substrate deposited with the graphene in silver salt solution for displacement reaction, so that copper atoms on the outer layer of the copper substrate are displaced into silver, and obtaining a composite initial product of silver and the graphene; D. and C, carrying out surface cleaning on the composite initial product of the silver and the graphene prepared in the step C. The preparation method of the silver/graphene composite heat-conducting interface material has the advantages of simple preparation process and mild reaction, the heat-conducting property of the prepared silver/graphene composite heat-conducting interface material is obviously improved, and the problems that the conventional heat-conducting interface material is poor in heat-conducting property and cannot dissipate heat in time in the use process are solved. However, the use of carbon nanotubes is limited because of their high cost.
CN109553908A discloses a heat-conducting interface material for heat dissipation of electronic equipment, which uses graphene and conventional filler as heat-conducting filler in a matched manner, uses acrylic resin and other auxiliary agents as a matrix, and prepares a graphene composite heat-conducting adhesive material which is used as a heat-conducting interface material. The graphene and the conventional filler in the heat-conducting interface material are uniformly dispersed, so that the characteristics of high heat conductivity of the graphene and capability of realizing mass filling of the conventional filler are fully exerted, and the prepared heat-conducting adhesive has the performance remarkably superior to that of the conventional heat-conducting adhesive, and can remarkably improve the heat dissipation and cooling effects of electronic devices. The graphene composite heat-conducting adhesive has a simple preparation process, can be produced in a large-scale industrialized manner, and can be used as a novel high-efficiency heat-conducting interface material to be applied to heat dissipation of electronic equipment alone or in combination with a substrate.
CN112745636a discloses a polymer-based metal aerogel composite thermal interface material and a preparation method thereof, the polymer-based metal aerogel composite thermal interface material is characterized in that: the composite high-molecular polymer comprises a skeleton formed by metal aerogel and a composite high-molecular polymer filled in and coating the skeleton, wherein the composite high-molecular polymer comprises a polymer and a heat-conducting filler; the material of the metal aerogel comprises metal nanowires. The polymer-based metal aerogel composite thermal interface material has excellent thermal conductivity, and a skeleton structure constructed based on the metal aerogel can exert excellent thermal conductivity, so that the interface thermal resistance of the thermal interface composite material is reduced; because the size effect of the nano material can be in metallurgical interconnection with the surfaces of the radiator and the heating device at low temperature, the heat conductivity of the heat conducting glue is further improved.
The current commercial thermal interface material cannot meet the requirements of high-integration heat conduction and ultrathin softness of the device. Therefore, development of an application method of a high-heat-conductivity composite thermal interface material is urgent.
Disclosure of Invention
In view of the problems existing in the prior art, the invention provides an application method of a copper-indium high-heat-conductivity composite thermal interface material, which is characterized in that the high-heat-conductivity composite thermal interface material is arranged between a heat generating element and a radiating fin and is tightly pressed, and an indium layer at two sides of the substrate is heated to a certain temperature by utilizing instant direct current to pass through the substrate, so that firm connection and efficient heat dissipation between the heat generating element and the radiating fin are realized.
To achieve the purpose, the invention adopts the following technical scheme:
the invention provides an application method of a high-heat-conductivity composite thermal interface material, which is characterized in that the high-heat-conductivity composite thermal interface material is arranged between a heat generating element and a radiating fin and is compressed, a direct-current power supply is connected with a substrate in the high-heat-conductivity composite thermal interface material, so that indium layers on two sides of the substrate are heated to 130-160 ℃ within 0.2 seconds, and firm connection and efficient heat dissipation between the heat generating element and the radiating fin are realized.
The present invention is limited to the time for which the dc power supply is energized within 0.2 seconds, and may be, for example, 0.2 seconds, 0.19 seconds, 0.1 seconds, or 0.01 seconds, but is not limited to the recited values, and other values not recited in the range of values are equally applicable.
The application method of the high-heat-conductivity composite thermal interface material adopts instant direct current to pass through the substrate, and utilizes the good electric conductivity and heat conductivity of the substrate to heat the low-melting-point metal indium layers on the two sides of the substrate to soften or melt; the soft or melted indium layers on the two sides are filled into the gaps between the heat generating element and the substrate and between the substrate and the radiating fin, and are rapidly solidified, so that the heat generating element and the radiating fin are firmly connected and efficiently radiate heat, and the thermal conductivity of the high-thermal-conductivity composite thermal interface material can reach more than 80W/m.K. The invention limits the time for the direct current power supply to be powered on to less than 0.2 seconds, because when the direct current power supply is powered on for too long, the total heat is increased due to heat conduction, so that the temperature of a heat generating element (such as a chip) is too high, and the service life and the performance of the heat generating element are affected. The current of the direct current power supply is not strictly limited in the invention, so long as the indium layer can reach a preset temperature in a preset time.
In the present invention, the heating to 130 to 160℃may be 130℃132℃135℃138℃140℃150℃155℃160℃or the like, but the present invention is not limited to the values listed, and other values not listed in the range are applicable.
Preferably, the high-heat-conductivity composite thermal interface material is arranged between the heat generating element and the radiating fin and is pressed, the substrate in the high-heat-conductivity composite thermal interface material is connected with a direct current power supply, so that the indium layers on two sides of the substrate are heated to 140-156 ℃ within 0.1 second, and firm connection and efficient heat dissipation between the heat generating element and the radiating fin are realized.
The present invention is limited to the time for which the dc power supply is energized to be within 0.1 seconds, for example, 0.1 seconds, 0.09 seconds, or 0.01 seconds, but the present invention is not limited to the recited values, and other values not recited in the range of values are equally applicable.
In the present invention, the heating to 140 to 156℃may be, for example, 140℃142℃145℃150℃155℃156℃or the like, but the heating is not limited to the values listed, and other values not listed in the range are applicable.
Preferably, the high-heat-conductivity composite thermal interface material comprises a substrate and indium layers arranged on the upper surface and the lower surface of the substrate, wherein the substrate comprises a copper substrate or a silver substrate.
The high-heat-conductivity composite thermal interface material preferably comprises a substrate and indium layers arranged on the upper surface and the lower surface of the substrate, wherein the melting point and the hardness of indium are low, and the gap of a contact surface can be reduced due to good compliance when the high-heat-conductivity composite thermal interface material is used as a contact material; secondly, the heat conductivity of indium is above 80W/mK, and the heat conductivity of copper or silver is above 300W/mK; the high heat conduction composite thermal interface material combines the excellent characteristics of indium, copper and silver, can realize the heat conductivity of more than 80W/m.K, and has very low interface thermal resistance (less than 10 K.mm 2 /W). Compared with the materials which are used in the market and take liquid metal as the substrate, the high-heat-conductivity composite thermal interface material disclosed by the invention has the advantage that the problem of short circuit of a circuit board caused by liquid metal side leakage does not occur.
Preferably, the substrate comprises any one of a foil, a mesh or a foam sheet.
The substrate preferably comprises any one of foil, net or foam sheet, and the heat conductivity of the high-heat-conductivity composite thermal interface material can be effectively adjusted by adjusting the type of the substrate, so that the heat dissipation efficiency is improved.
The mesh number of the mesh is preferably 100 to 500 mesh, and may be, for example, 100 mesh, 120 mesh, 150 mesh, 200 mesh, 300 mesh, 400 mesh, 450 mesh, or 500 mesh, but is not limited to the recited values, and other non-recited values within the range are equally applicable.
The porosity of the foam sheet is preferably 50 to 95%, and may be, for example, 50%, 55%, 60%, 65%, 70%, 80%, 90%, 95%, or the like, but is not limited to the values recited, and other values not recited in the range are equally applicable.
The thickness of the substrate is preferably 50 to 200. Mu.m, and may be, for example, 50 μm, 60 μm, 80 μm, 100 μm, 150 μm, 170 μm, 190 μm or 200 μm, etc., but is not limited to the recited values, and other values not recited in the range of the values are equally applicable.
The thickness of the indium layer is preferably 5 to 100 μm, and may be, for example, 5 μm, 10 μm, 20 μm, 30 μm, 50 μm, 70 μm, 80 μm, 90 μm, 100 μm, or the like, but is not limited to the recited values, and other non-recited values within the range of the values are equally applicable.
According to the invention, the indium layer is attached to the surface of the high-heat-conductivity composite thermal interface material, so that the surface of the material is soft, the bonding degree with a heat generating element is higher, and the high-heat-conductivity composite thermal interface material has the advantage of compliance. The hardness of the pure metal heat conduction material is high, so that the adhesion degree of the material and the surface of the heat generating element is not high, and the heat transfer effect and the heat transfer efficiency of the heat conduction material are affected.
Preferably, the purity of the substrate and the purity of the indium layer of the high thermal conductivity composite thermal interface material are not less than 99.99%, such as 99.99%, 99.991%, 99.992%, 99.994%, 99.995%, 99.999%, or 99.9999%, but not limited to the recited values, and other non-recited values within the range of values are equally applicable.
Preferably, the purity of the substrate and the purity of the indium layer of the high thermal conductivity composite thermal interface material are not less than 99.9999%, such as 99.9999%, 99.99991%, 99.99992%, 99.99994%, 99.99995%, 99.99997%, or 99.99999%, etc., but are not limited to the recited values, and other non-recited values within the range of values are equally applicable
Compared with the prior art, the invention has at least the following beneficial effects:
(1) The application method of the high-heat-conductivity composite thermal interface material provided by the invention is simple to operate, realizes firm connection of the heat generating element and the radiating fin, enables the heat generating element to effectively radiate heat, and is suitable for large-scale production and application;
(2) The high-heat-conductivity composite thermal interface material used in the application method of the high-heat-conductivity composite thermal interface material solves the problem of liquid metal leakage from the source, and combines the excellent characteristics of indium, copper and silver to improve the heat conductivity of the high-heat-conductivity composite thermal interface material to more than 80W/m.K.
Drawings
Fig. 1 is a schematic diagram of a high thermal conductivity composite thermal interface material according to embodiment 1 of the present invention.
In the figure: 1-a substrate; 2-indium layer.
Detailed Description
The technical scheme of the invention is further described below by the specific embodiments with reference to the accompanying drawings.
The present invention will be described in further detail below. The following examples are merely illustrative of the present invention and are not intended to represent or limit the scope of the invention as defined in the claims.
Example 1
The embodiment provides a high-heat-conductivity composite thermal interface material, and a schematic diagram of the high-heat-conductivity composite thermal interface material is shown in fig. 1.
The high-heat-conductivity composite thermal interface material comprises a copper substrate 1 and indium layers 2 arranged on the upper surface and the lower surface of the copper substrate 1. The copper substrate 1 is a sheet copper foil with a thickness of 200 μm. The thickness of the indium layer 2 is 100 μm.
The embodiment also provides an application method of the high-heat-conductivity composite thermal interface material, which comprises the following steps:
the high-heat-conductivity composite thermal interface material is arranged between the heat generating element and the radiating fin and is tightly pressed, a copper substrate in the high-heat-conductivity composite thermal interface material is connected with a direct current power supply, and the indium layers on two sides of the copper substrate reach 130 ℃ after being electrified for 0.01 second, so that firm connection and efficient heat dissipation between the heat generating element and the radiating fin are realized.
Example 2
The embodiment provides a high-heat-conductivity composite thermal interface material, which comprises a copper substrate and indium layers arranged on the upper surface and the lower surface of the copper substrate. The copper substrate is foam sheet copper, the porosity is 50%, and the thickness is 200 μm. The thickness of the indium layer was 100 μm.
The embodiment also provides an application method of the high-heat-conductivity composite thermal interface material, which comprises the following steps:
and assembling, fixing and compacting the thermal interface material, the heat sink and the heat generating element, switching on a direct current power supply for 0.2 second to enable indium layers on two sides of the copper substrate to reach 155 ℃ so as to realize firm connection and efficient heat dissipation between the heat generating element and the heat radiating fin.
Example 3
The embodiment provides a high-heat-conductivity composite thermal interface material, which comprises a copper substrate and indium layers arranged on the upper surface and the lower surface of the copper substrate. The copper substrate is a flaky copper net, the mesh number is 500 meshes, and the thickness is 200 mu m. The thickness of the indium layer was 100 μm.
The embodiment also provides an application method of the high-heat-conductivity composite thermal interface material, which comprises the following steps:
the high-heat-conductivity composite thermal interface material is arranged between the heat generating element and the radiating fin and is tightly pressed, a copper substrate in the high-heat-conductivity composite thermal interface material is connected with a direct current power supply, and the indium layers on two sides of the copper substrate reach 156 ℃ (melting) after being electrified for 0.1 second, so that firm connection and efficient heat dissipation between the heat generating element and the radiating fin are realized.
Example 4
The embodiment provides a high-heat-conductivity composite thermal interface material, which comprises a copper substrate and indium layers arranged on the upper surface and the lower surface of the copper substrate. The copper substrate is a sheet copper foil with a thickness of 50 μm. The thickness of the indium layer was 50 μm.
The embodiment also provides an application method of the high-heat-conductivity composite thermal interface material, which comprises the following steps:
the high-heat-conductivity composite thermal interface material is arranged between the heat generating element and the radiating fin and is tightly pressed, a copper substrate in the high-heat-conductivity composite thermal interface material is connected with a direct current power supply, and the current is applied for 0.05 seconds to enable indium layers on two sides of the copper substrate to reach 140 ℃, so that firm connection and efficient heat dissipation between the heat generating element and the radiating fin are realized.
Example 5
The embodiment provides a high-heat-conductivity composite thermal interface material, which comprises a copper substrate and indium layers arranged on the upper surface and the lower surface of the copper substrate. The copper substrate is a flaky copper net, the mesh number is 100 meshes, and the thickness is 80 mu m. The thickness of the indium layer was 10 μm.
The embodiment also provides an application method of the high-heat-conductivity composite thermal interface material, which comprises the following steps:
the high-heat-conductivity composite thermal interface material is arranged between the heat generating element and the radiating fin and is tightly pressed, a copper substrate in the high-heat-conductivity composite thermal interface material is connected with a direct current power supply, and the indium layers on two sides of the copper substrate reach 159 ℃ (melting) after being electrified for 0.01 second, so that firm connection and efficient heat dissipation between the heat generating element and the radiating fin are realized.
Example 6
The embodiment provides a high-heat-conductivity composite thermal interface material, which comprises a copper substrate and indium layers arranged on the upper surface and the lower surface of the copper substrate. The copper substrate is foam sheet copper, the porosity is 95%, and the thickness is 50 μm. The thickness of the indium layer was 100 μm.
The embodiment also provides an application method of the high-heat-conductivity composite thermal interface material, which comprises the following steps:
the high-heat-conductivity composite thermal interface material is arranged between the heat generating element and the radiating fin and is tightly pressed, a copper substrate in the high-heat-conductivity composite thermal interface material is connected with a direct current power supply, and the current is applied for 0.05 seconds to enable indium layers on two sides of the copper substrate to reach 150 ℃, so that firm connection and efficient heat dissipation between the heat generating element and the radiating fin are realized.
Example 7
The embodiment provides a high-heat-conductivity composite thermal interface material, which comprises a silver substrate and indium layers arranged on the upper surface and the lower surface of the silver substrate. The silver substrate is foam silver, the porosity is 60%, and the thickness is 50 μm. The thickness of the indium layer was 30 μm.
The embodiment also provides an application method of the high-heat-conductivity composite thermal interface material, which comprises the following steps:
the high-heat-conductivity composite thermal interface material is arranged between the heat generating element and the radiating fin and is tightly pressed, a silver substrate in the high-heat-conductivity composite thermal interface material is connected with a direct current power supply, and the indium layers on two sides of the silver substrate reach 160 ℃ (melting) after being electrified for 0.15 seconds, so that firm connection and efficient heat dissipation between the heat generating element and the radiating fin are realized.
Example 8
The embodiment provides a high-heat-conductivity composite thermal interface material, which comprises a silver substrate and indium layers arranged on the upper surface and the lower surface of the silver substrate. The silver substrate is a flaky silver foil with the thickness of 200 mu m. The thickness of the indium layer 2 is 100 μm.
The embodiment also provides an application method of the high-heat-conductivity composite thermal interface material, which comprises the following steps:
the high-heat-conductivity composite thermal interface material is arranged between the heat generating element and the radiating fin and is tightly pressed, a silver substrate in the high-heat-conductivity composite thermal interface material is connected with a direct current power supply, and the indium layers on two sides of the silver substrate reach 160 ℃ (melting) after being electrified for 0.2 seconds, so that firm connection and efficient heat dissipation between the heat generating element and the radiating fin are realized.
Example 9
The embodiment provides a high-heat-conductivity composite thermal interface material, which comprises a silver substrate and indium layers arranged on the upper surface and the lower surface of the silver substrate. The silver substrate is a flaky silver net, the mesh number is 300 meshes, and the thickness is 50 mu m. The thickness of the indium layer was 5 μm.
The embodiment also provides an application method of the high-heat-conductivity composite thermal interface material, which comprises the following steps:
the high-heat-conductivity composite thermal interface material is arranged between the heat generating element and the radiating fin and is tightly pressed, a silver substrate in the high-heat-conductivity composite thermal interface material is connected with a direct current power supply, and the indium layers on two sides of the silver substrate reach 135 ℃ after being electrified for 0.18 seconds, so that firm connection and efficient heat dissipation between the heat generating element and the radiating fin are realized.
Example 10
The embodiment provides a high-heat-conductivity composite thermal interface material, which comprises a silver substrate and indium layers arranged on the upper surface and the lower surface of the silver substrate. The silver substrate is foam silver, the porosity is 50%, and the thickness is 50 μm. The thickness of the indium layer was 30 μm.
The embodiment also provides an application method of the high-heat-conductivity composite thermal interface material, which comprises the following steps:
the high-heat-conductivity composite thermal interface material is arranged between the heat generating element and the radiating fin and is pressed, the silver substrate in the high-heat-conductivity composite thermal interface material is connected with a direct current power supply, and the indium layer is electrified for 0.18 seconds to reach 140 ℃, so that firm connection and efficient heat dissipation between the heat generating element and the radiating fin are realized.
Comparative example 1
This comparative example provides a high thermal conductivity composite thermal interface material that is the same as example 1.
The comparative example also provides a method of using the high thermal conductivity composite thermal interface material described above, which is the same as example 1 except that the time for energizing the dc power supply is replaced with 1 second for 0.001 seconds.
The thermal conductivity of the high thermal conductivity composite thermal interface materials in the above examples and comparative examples was measured using a steady state method or a flash method, and the results are shown in table 1.
TABLE 1
| Thermal conductivity (W/m.K) | |
| Example 1 | 230 |
| Example 2 | 130 |
| Example 3 | 170 |
| Example 4 | 180 |
| Example 5 | 120 |
| Example 6 | 80 |
| Example 7 | 160 |
| Example 8 | 250 |
| Example 9 | 190 |
| Example 10 | 140 |
| Comparative example 1 | 230 |
As can be seen from table 1:
(1) The comprehensive examples 1-10 show that the thermal conductivity of the high-thermal-conductivity composite thermal interface material in the application method provided by the invention can reach more than 80W/m.K; the application method is simple to operate, the heat generating element and the radiating fin are firmly connected, and the heat generating element can effectively radiate heat;
(2) As can be seen from the combination of example 1 and comparative example 1, the dc power supply in example 1 was powered for 0.01 seconds, and after 10 seconds, compared to the dc power supply in comparative example 1, the temperatures of the high thermal conductivity composite thermal interface material and the heat generating element were obtained by computer simulation as shown in table 2:
TABLE 2
As can be seen from table 2, in example 1, the dc power supply was energized for a shorter period of time, and after 10 seconds, the temperatures of the high thermal conductivity composite thermal interface material and the heat generating element were both much lower than comparative example 1; therefore, the invention realizes the efficient heat dissipation between the heat generating element and the heat radiating fin by limiting the energizing time of the direct current power supply to be within 0.2 seconds.
In summary, the application method of the high-heat-conductivity composite thermal interface material provided by the invention is simple to operate, realizes firm connection between the heat generating element and the radiating fin, effectively radiates heat of the heat generating element, and is suitable for industrial mass production and use; the high-heat-conductivity composite thermal interface material provided by the invention solves the problem of leakage of liquid metal from the source, and combines the excellent characteristics of indium, copper and silver to improve the heat conductivity of the high-heat-conductivity composite thermal interface material to more than 80W/m.K.
The applicant declares that the above is only a specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and it should be apparent to those skilled in the art that any changes or substitutions that are easily conceivable within the technical scope of the present invention disclosed by the present invention fall within the scope of the present invention and the disclosure.
Claims (9)
1. The application method of the high-heat-conductivity composite thermal interface material is characterized in that the high-heat-conductivity composite thermal interface material is arranged between a heat generating element and a radiating fin and is compressed, a direct-current power supply is connected with a substrate in the high-heat-conductivity composite thermal interface material, so that indium layers on two sides of the substrate are heated to 130-160 ℃ within 0.2 seconds, and firm connection and efficient heat dissipation between the heat generating element and the radiating fin are realized;
the high-heat-conductivity composite thermal interface material comprises a substrate and indium layers arranged on the upper surface and the lower surface of the substrate, wherein the substrate comprises a copper substrate or a silver substrate.
2. The application method according to claim 1, wherein the high heat conduction composite thermal interface material is arranged between the heat generating element and the heat sink and is compressed, the substrate in the high heat conduction composite thermal interface material is connected with a direct current power supply, and the indium layers on two sides of the substrate are heated to 140-156 ℃ within 0.1 second, so that firm connection and efficient heat dissipation between the heat generating element and the heat sink are realized.
3. The method of claim 1, wherein the substrate comprises any one of a foil, a mesh, or a foam sheet.
4. A method of use according to claim 3, wherein the mesh number of the net is 100-500 mesh.
5. A method of use according to claim 3, wherein the foam sheet has a porosity of 50 to 95%.
6. The method of claim 1, wherein the substrate has a thickness of 50 to 200 μm.
7. The method of claim 1, wherein the indium layer has a thickness of 5 to 100 μm.
8. The method of claim 1, wherein the substrate and indium layer of the high thermal conductivity composite thermal interface material are both not less than 99.99% pure.
9. The method of claim 8, wherein the substrate and indium layer of the high thermal conductivity composite thermal interface material are both not less than 99.9999% pure.
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| CN102504769A (en) * | 2011-09-30 | 2012-06-20 | 东南大学 | Elastic compound metal heat interface material and preparation method thereof |
| CN103131396B (en) * | 2011-12-02 | 2016-01-27 | 中国科学院理化技术研究所 | A kind of heat interfacial material and manufacture method thereof |
| US10373891B2 (en) * | 2013-06-14 | 2019-08-06 | Laird Technologies, Inc. | Methods for establishing thermal joints between heat spreaders or lids and heat sources |
| CN104218010B (en) * | 2014-09-10 | 2017-09-08 | 北京态金科技有限公司 | A kind of metal heat interface material |
| CN105990279B (en) * | 2015-02-09 | 2018-07-24 | 中国科学院理化技术研究所 | A kind of preparation facilities and method of metal heat interface material |
| CN106702243A (en) * | 2016-12-07 | 2017-05-24 | 北京态金科技有限公司 | Low-melting-point metal and preparation method and application thereof |
| CN106969668B (en) * | 2017-05-15 | 2019-03-22 | 清华大学 | A kind of safeguard structure of flexible variable |
| CN107634041A (en) * | 2017-09-26 | 2018-01-26 | 鲁东大学 | A kind of hot interface of low interface thermal contact resistance and preparation method thereof |
| CN107454813B (en) * | 2017-09-30 | 2023-05-23 | 中国工程物理研究院应用电子学研究所 | Temperature control cooling device and temperature control method for thermoelectric refrigeration composite phase change cold accumulation |
| CN113755138A (en) * | 2021-09-02 | 2021-12-07 | 宁波施捷电子有限公司 | Thermal interface material and electronic device comprising same |
| CN114032072B (en) * | 2021-11-05 | 2024-03-29 | 云南科威液态金属谷研发有限公司 | Copper/low-melting-point alloy composite thermal interface material and preparation method and application thereof |
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2022
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