CN108109975A - A kind of high heat conduction cooling fin of three-dimensional foam metallic framework and preparation method thereof - Google Patents
A kind of high heat conduction cooling fin of three-dimensional foam metallic framework and preparation method thereof Download PDFInfo
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- CN108109975A CN108109975A CN201810004355.6A CN201810004355A CN108109975A CN 108109975 A CN108109975 A CN 108109975A CN 201810004355 A CN201810004355 A CN 201810004355A CN 108109975 A CN108109975 A CN 108109975A
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- foam
- conductive material
- metal
- highly heat
- foam metal
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- 239000006260 foam Substances 0.000 title claims abstract description 72
- 238000001816 cooling Methods 0.000 title claims abstract description 24
- 238000002360 preparation method Methods 0.000 title claims abstract description 17
- 229910052751 metal Inorganic materials 0.000 claims abstract description 47
- 239000002184 metal Substances 0.000 claims abstract description 47
- 239000004020 conductor Substances 0.000 claims abstract description 34
- 238000000034 method Methods 0.000 claims abstract description 25
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 25
- 239000000463 material Substances 0.000 claims description 22
- 229910002804 graphite Inorganic materials 0.000 claims description 16
- 239000010439 graphite Substances 0.000 claims description 16
- 229910052802 copper Inorganic materials 0.000 claims description 14
- 239000010949 copper Substances 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 229910052782 aluminium Inorganic materials 0.000 claims description 12
- 239000000203 mixture Substances 0.000 claims description 10
- 239000004411 aluminium Substances 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 9
- 239000011159 matrix material Substances 0.000 claims description 8
- 239000011148 porous material Substances 0.000 claims description 8
- 229910052709 silver Inorganic materials 0.000 claims description 8
- 229910052582 BN Inorganic materials 0.000 claims description 6
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 6
- 238000002156 mixing Methods 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 5
- 239000002041 carbon nanotube Substances 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- 229910021389 graphene Inorganic materials 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 4
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 3
- 238000003618 dip coating Methods 0.000 claims description 3
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 claims description 2
- 229910000838 Al alloy Inorganic materials 0.000 claims description 2
- 229910017083 AlN Inorganic materials 0.000 claims description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 2
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 2
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 claims description 2
- 239000006229 carbon black Substances 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 2
- 239000011787 zinc oxide Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 abstract description 7
- 238000009792 diffusion process Methods 0.000 abstract description 4
- 239000011229 interlayer Substances 0.000 abstract description 3
- 238000011031 large-scale manufacturing process Methods 0.000 abstract description 2
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- -1 Al are closed Gold Inorganic materials 0.000 description 1
- 208000010086 Hypertelorism Diseases 0.000 description 1
- 206010020771 Hypertelorism of orbit Diseases 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 210000004556 brain Anatomy 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention relates to a kind of high heat conduction cooling fins of three-dimensional foam metallic framework and preparation method thereof, including foam metal layer, highly heat-conductive material, it is to process what flakiness obtained by way of internal and surface to be provided with to the foam metal of highly heat-conductive material using pressurization, thermal resistance of the cooling fin with interlayer is small, the characteristics of heat diffusion capabilities are strong, and preparation process is simple, convenient for large-scale production.
Description
Technical field
The present invention relates to the heat sink material fields of electronic component more particularly to a kind of height of three-dimensional foam metallic framework to lead
Hot cooling fin and preparation method thereof.
Background technology
With the fast development of chip and electronic circuit, electronic circuit is increasingly miniaturized, chip, integrated circuit, LED etc.
The heat that component generates also is improving rapidly.In fact, heat flow density caused by large scale integrated circuit oneself through being more than
60W/cm2, and the trend constantly risen is presented, in practice it has proved that the rate of breakdown of electronic circuit is the raising with operating temperature
And increase, this to heat dissipation to just proposing requirements at the higher level.At present electronics industry obtain large-scale application scheme be use
Heat conducting and heat radiating fin by the heat diffusion of the generation of heater element, avoids heat from concentrating damage component.This kind of heat conducting and heat radiating fin one
As be arranged at heating element and shell（Radiator）Between, the heat that heating element generates is passed into shell（Radiator）
It radiates.When heating element and shell（Radiator）Hypertelorism when, then heat conducting and heat radiating fin is directly adhered to fever
On component, radiated by heat conducting and heat radiating fin to it.
In terms of material, most preferably graphite and metal, electronics industry use graphite flake and metal to heat transfer property on a large scale
Paper tinsel radiates, but both materials be used alone all there is it is many problem of：1. since the mechanical property of graphite flake is as resisted
Tensile strength and elongation at break are generally poor, and it is easy to appear fracture and interlaminar separation phenomenons in the electronic device for graphite flake application
Heat dissipation effect is caused to substantially reduce.2. its coefficient of thermal expansion of metal material is higher, this can cause the mismatch of interface crystal lattice,
The probability of component failure is substantially increased, reduces the service life of device；Secondly, the compact density of metal material generally compared with
Greatly, cause that the electronic equipment weight being assembled into is larger, this does not meet the demand for development of portable electronic product；Furthermore metal is led
Electrical property is very good, may make electronic component that short circuit occur.
The advantages of various heat sink materials, can be integrated using composite material, and avoid them each to greatest extent
From the shortcomings that, electronics industry also begins to widely apply this heat sink compound.But current major part in the market is compound to be dissipated
Backing is all that the simple of several Heat Conduction Materials is stacked processing, have between layers by way of resin or two-sided glue sticking compared with
High thermal resistance.
The content of the invention
In order to overcome the above-mentioned deficiencies of the prior art, the present invention provides a kind of high heat conduction heat dissipation of three-dimensional foam metallic framework
Piece and preparation method thereof, the present invention have the characteristics that simple for process, easy to use, and the Heat conduction diffusion sheet is with excellent thermal conductivity
Energy and heat sinking function can rapidly spread heat from heater, can be in mobile phone, tablet computer, display screen, notebook electricity
It is applied in the electronic equipments such as brain.
The technical scheme is that：
A kind of high heat conduction cooling fin of three-dimensional foam metallic framework, including foam metal layer, highly heat-conductive material, it is characterized in that with bubble
As matrix, highly heat-conductive material can be attached to the surface of foam metal matrix or be filled in foam gold foam metal
The inside or part of category are attached to the surface of foam metal matrix, are partially filled in the inside of foam metal；
A kind of integral thickness of the high heat conduction cooling fin of three-dimensional foam metallic framework is 0.008mm~60mm;
The foam metal its with 3 D stereo pore structure, thickness is 0.005mm~50mm, average pore diameter 0.05mm
~8mm；
The highly heat-conductive material is the mixture of any one-component powder in graphite, expanded graphite or both, either
In above two one-component powder or both mixture add in silicon nitride, aluminium nitride, boron nitride, zinc oxide, beryllium oxide, silver,
One or more mixtures formed in copper, aluminium, carbon black, carbon nanotubes, graphene；
The highly heat-conductive material average grain diameter is 0.1~1000 μm, and thermal conductivity factor is 10W/m K~1000W/ m K；
The foam metal is the monometallic material that is formed by any type metal in Cu, Ni, Al, Ag, Fe or above-mentioned
Arbitrary two class or two classes multiple layer metal or alloy formed above in metal species；
The foam metal is that the monometallic material that is formed by any type metal in Cu, Al, Ag or Cu alloys, Al are closed
Gold, Ag alloy materials or the multilayer materials being surface modified using previous materials as matrix, thickness 0.02mm
~3mm, bore dia are 0.15mm~2mm；
The preparation method of the high heat conduction cooling fin of a kind of three-dimensional foam metallic framework, it is characterised in that use following methods
In any one preparation：
Method one：
Step 1：By way of dry method or wet method, highly heat-conductive material is uniformly dispersed, is mixed；
Step 2：The highly heat-conductive material precompressed for disperseing, mixing is in blocks；
Step 3：The sheet of highly heat-conductive material of precompressed is positioned over foam metal both side surface, then passes through forcing press or roll squeezer pressure
Flakiness, the pressure applied in pressure process are 10MPa~500MPa, pressurization number 1~5 time；
Method two:
Step 1：By way of dry method or wet method, highly heat-conductive material to be filled is uniformly dispersed, is mixed；
Step 2：By the highly heat-conductive material for disperseing, mixing brush, be filled in by way of dip-coating foam metal inside and
Surface；
Step 3：The foam metal for being filled with highly heat-conductive material is pressed into thin slice by forcing press or roll squeezer, is applied in pressure process
The pressure added is 10MPa~500MPa, pressurization number 1~5 time.
The present invention on the small foam metal sheet material of porosity height, light weight, thermal capacitance is superimposed or fills highly heat-conductive material, and
It is combined together the two by way of pressurization and is prepared into a kind of high heat conduction cooling fin of three-dimensional foam metallic framework.Due to bubble
The porous structure of foam metal causes the spine for being covered with protrusion in its plane, and foam gold is attached to making highly heat-conductive material
In the embodiment of metal surface, the spine of foam metal protrusion of surface can be penetrated within highly heat-conductive material surface, make to be pressed into layer
The highly heat-conductive material of shape links together with foam metal layer, enhances inter-layer bonding force, simultaneously as highly heat-conductive material and bubble
It is contacted directly between foam metal layer, the thermal resistance very little of so-called interlayer, heat diffusion capabilities are stronger.
Highly heat-conductive material is some or all of in a further embodiment is filled in inside foam metal, through being overpressurized into
After sheet material, the combination power between highly heat-conductive material and foam metal layer is stronger, simultaneously because the skeleton of foam metal enters height
Heat Conduction Material plays the role of structural support behind inside, can greatly enhance the mechanical performance of heat conducting and heat radiating fin, makes its tool
There are higher tensile strength and elongation at break.It, can be with further, since foam metal has the high characteristic of thermal conductivity factor of metal
Heat conduction network is formed inside highly heat-conductive material, enhances its heat conduction and heat radiation ability.
The present invention also have the advantages that simple for process, old it is low, convenient for large-scale production, can in large quantities needs lead
It is applied in the occasion of heat heat dissipation.
Description of the drawings
A kind of schematic diagram of the high heat conduction cooling fin of three-dimensional foam metallic framework in Fig. 1 embodiments one and two；
A kind of schematic diagram of the high heat conduction cooling fin of three-dimensional foam metallic framework in Fig. 2 embodiments three；
A kind of schematic diagram of the high heat conduction cooling fin of three-dimensional foam metallic framework in Fig. 3 example IVs；
A kind of one flow chart of preparation method of the high heat conduction cooling fin of three-dimensional foam metallic framework of Fig. 4 present invention；
A kind of two flow chart of preparation method of the high heat conduction cooling fin of three-dimensional foam metallic framework of Fig. 5 present invention.
Specific embodiment
The height that a kind of three-dimensional foam metallic framework is further illustrated the present invention with reference to specific embodiment is led
Hot cooling fin and preparation method thereof.
Embodiment one：
By expanded graphite precompressed that average grain diameter is 30 μm into sheet material, the both side surface of foam copper, the bubble of selection are then placed into
Foam copper thickness is 3mm, average pore diameter 0.15mm, and the expanded graphite sheet of pre-molding is positioned over to the both sides table of foam copper
Face is pressed into thin slice using pressure roller.Preparation method flow is as shown in figure 4, the pressure that the pressure process in step S43 applies is
50MPa, pressurization number are 5 times, and a kind of integral thickness of the high heat conduction cooling fin of obtained three-dimensional foam metallic framework is 2mm,
As shown in Figure 1, in figure 11 be Expandable graphite sheet, 12 be foam copper.
Embodiment two：
The expanded graphite that average grain diameter is 100 μm and the boron nitride that average grain diameter is 10 μm is uniform by way of dry mixed
Mixing by precompressed into sheet material, is then placed into the both side surface of foam corronil, and the foam corronil thickness of selection is
The sheet material of pre-molding is positioned over the both side surface of foam copper, is pressed using pressure roller by 0.5mm, average pore diameter 0.6mm
Flakiness, as shown in figure 4, the pressure that the pressure process in step S43 applies is 500MPa, pressurization number is preparation method flow
1 time, a kind of integral thickness of the high heat conduction cooling fin of obtained three-dimensional foam metallic framework is 0.08mm, as shown in Figure 1, in figure
11 be expanded graphite and the sheet material of boron nitride mixture, and 12 be foam corronil.
Embodiment three：
The graphite that average grain diameter is 0.1 μm and the carbon nanotubes that average grain diameter is 40 μm are uniformly mixed by way of wet-mixing
It closes, the graphite mixed and the mixture of carbon nanotubes is filled in the surface and inside of foamed aluminium by way of dip-coating, but
Be it is internal do not fill up, selected foamed aluminium thickness is 3mm, average pore diameter 2mm, and foam aluminium surface has copper deposits,
The foamed aluminium of populated foregoing highly heat-conductive material is pressed into thin slice using press, preparation method flow is as shown in figure 5, step
The pressure that pressure process in S53 applies is 200MPa, and pressurization number is 2 times, a kind of obtained three-dimensional foam metallic framework
The integral thickness of high heat conduction cooling fin is 1mm, as shown in Fig. 2, in figure 21 for graphite and carbon nanotube mixture sheet material, 22 are
There is the foamed aluminium of copper deposits on surface.
In the present embodiment, thin slice can also will be pressed into using press after the solid highly heat-conductive material of foamed aluminium,
A kind of high heat conduction cooling fin of three-dimensional foam metallic framework can also equally be obtained.
Example IV：
Boron nitride, the graphene that average grain diameter is 0.01 μm, the copper powder that average grain diameter is 10 μm that average grain diameter is 0.5 μm are led to
The mode for crossing dry mixed uniformly mixes, and the foregoing highly heat-conductive material mixed is filled in Foam silver by way of brushing
Inside, selected Foam silver thickness is 0.02mm, average pore diameter 0.2mm, by the bubble of populated foregoing highly heat-conductive material
Foam silver is pressed into thin slice using press, and preparation method flow is as shown in figure 5, the pressure that the pressure process in step S53 applies
For 400MPa, pressurization number is 5 times, and a kind of integral thickness of the high heat conduction cooling fin of obtained three-dimensional foam metallic framework is
0.008mm, as shown in figure 3,31 being and boron nitride, graphene, the sheet material of copper powder mixture that 32 have copper coating for surface in figure
Foamed aluminium.
Claims (3)
1. a kind of high heat conduction cooling fin of three-dimensional foam metallic framework, including foam metal layer, highly heat-conductive material, it is characterized in that with
As matrix, highly heat-conductive material can be attached to the surface of foam metal matrix or be filled in foam foam metal
The inside or part of metal are attached to the surface of foam metal matrix, are partially filled in the inside of foam metal；
A kind of integral thickness of the high heat conduction cooling fin of three-dimensional foam metallic framework is 0.008mm~60mm;
The foam metal its with 3 D stereo pore structure, thickness is 0.005mm~50mm, average pore diameter 0.05mm
~8mm；
The highly heat-conductive material is the mixture of any one-component powder in graphite, expanded graphite or both, either
In above two one-component powder or both mixture add in silicon nitride, aluminium nitride, boron nitride, zinc oxide, beryllium oxide, silver,
One or more mixtures formed in copper, aluminium, carbon black, carbon nanotubes, graphene；
The highly heat-conductive material average grain diameter is 0.1~1000 μm, and thermal conductivity factor is 10W/m K~1000W/ m K；
The foam metal is the monometallic material that is formed by any type metal in Cu, Ni, Al, Ag, Fe or above-mentioned
Arbitrary two class or two classes multiple layer metal or alloy formed above in metal species.
A kind of 2. high heat conduction cooling fin of three-dimensional foam metallic framework according to claim 1, it is characterised in that the bubble
Foam metal is the monometallic material or Cu alloys, Al alloys, Ag alloy materials formed by any type metal in Cu, Al, Ag
Expect or using the multilayer materials that previous materials are surface modified as matrix, thickness is 0.02mm~3mm, Kong Zhi
Footpath is 0.15mm~2mm.
3. a kind of preparation method of the high heat conduction cooling fin of three-dimensional foam metallic framework according to claim 1, feature
In any one preparation in following methods are used：Method one：
Step 1：By way of dry method or wet method, highly heat-conductive material is uniformly dispersed, is mixed；
Step 2：The highly heat-conductive material precompressed for disperseing, mixing is in blocks；
Step 3：The sheet of highly heat-conductive material of precompressed is positioned over foam metal both side surface, then passes through forcing press or roll squeezer pressure
Flakiness, the pressure applied in pressure process are 10MPa~500MPa, pressurization number 1~5 time；
Method two:
Step 1：By way of dry method or wet method, highly heat-conductive material to be filled is uniformly dispersed, is mixed；
Step 2：By the highly heat-conductive material for disperseing, mixing brush, be filled in by way of dip-coating foam metal inside and
Surface；
Step 3：The foam metal for being filled with highly heat-conductive material is pressed into thin slice by forcing press or roll squeezer, is applied in pressure process
The pressure added is 10MPa~500MPa, pressurization number 1~5 time.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810004355.6A CN108109975A (en) | 2018-01-03 | 2018-01-03 | A kind of high heat conduction cooling fin of three-dimensional foam metallic framework and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810004355.6A CN108109975A (en) | 2018-01-03 | 2018-01-03 | A kind of high heat conduction cooling fin of three-dimensional foam metallic framework and preparation method thereof |
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| CN108109975A true CN108109975A (en) | 2018-06-01 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110139408A (en) * | 2019-05-30 | 2019-08-16 | 上海交通大学 | A kind of plate electric heater |
| CN110676535A (en) * | 2018-07-02 | 2020-01-10 | 重庆金康新能源汽车有限公司 | Heat conduction insulating part, manufacturing method thereof and battery module |
| CN112940510A (en) * | 2021-03-11 | 2021-06-11 | 广东思泉新材料股份有限公司 | Compact heat-conducting silica gel composite material with three-dimensional framework structure based on foam metal and preparation method thereof |
| CN114507510A (en) * | 2022-01-30 | 2022-05-17 | 内蒙古工业大学 | Foamy copper-graphene-expanded graphite-graphite composite heat dissipation material and preparation method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20070079891A (en) * | 2006-02-03 | 2007-08-08 | 김경일 | Radiator sheet |
| CN101906549A (en) * | 2010-08-17 | 2010-12-08 | 南京航空航天大学 | Porous foam metal based embedded type solid self-lubricating composite material and preparation method thereof |
| CN102917574A (en) * | 2012-10-24 | 2013-02-06 | 华为技术有限公司 | Heat-conducting pad, method for manufacturing heat-conducting pad, radiating device and electronic device |
| KR20140025668A (en) * | 2012-08-22 | 2014-03-05 | 전자부품연구원 | Metal foam-graphite heat radiation sheet and method the same |
| US20160169598A1 (en) * | 2014-12-12 | 2016-06-16 | Teledyne Scientific & Imaging, Llc. | Thermal Interface Material System |
| EP3174375A1 (en) * | 2015-09-07 | 2017-05-31 | Hak Sik Joo | Complex sheet for absorbing/extinguishing and shielding electromagnetic waves and highly dissipating heat from electronic device and manufacturing method therefor |
-
2018
- 2018-01-03 CN CN201810004355.6A patent/CN108109975A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20070079891A (en) * | 2006-02-03 | 2007-08-08 | 김경일 | Radiator sheet |
| CN101906549A (en) * | 2010-08-17 | 2010-12-08 | 南京航空航天大学 | Porous foam metal based embedded type solid self-lubricating composite material and preparation method thereof |
| KR20140025668A (en) * | 2012-08-22 | 2014-03-05 | 전자부품연구원 | Metal foam-graphite heat radiation sheet and method the same |
| CN102917574A (en) * | 2012-10-24 | 2013-02-06 | 华为技术有限公司 | Heat-conducting pad, method for manufacturing heat-conducting pad, radiating device and electronic device |
| US20160169598A1 (en) * | 2014-12-12 | 2016-06-16 | Teledyne Scientific & Imaging, Llc. | Thermal Interface Material System |
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