CN206040630U - Compound heat conduction graphite membrane material - Google Patents
Compound heat conduction graphite membrane material Download PDFInfo
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- CN206040630U CN206040630U CN201620822173.6U CN201620822173U CN206040630U CN 206040630 U CN206040630 U CN 206040630U CN 201620822173 U CN201620822173 U CN 201620822173U CN 206040630 U CN206040630 U CN 206040630U
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- graphite
- membrane material
- copper foil
- graphite film
- hole
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Abstract
The utility model relates to a heat conduction radiation technical field relates to a compound heat conduction graphite membrane material especially, including copper foil and attached graphite membrane at copper foil surface, the epimembranal mask of graphite has a plurality of through holes, the through hole intussuseption is filled with the graphite alkene or the carbon nanotube of perpendicular growth. The utility model provides a compound heat conduction graphite membrane material, the epimembranal mask of graphite have a plurality of through holes, and the through hole intussuseption is filled with the graphite alkene or the carbon nanotube of perpendicular growth, and the heat can spread rapidly between the graphite rete, graphite alkene through the perpendicular growth of packing in the through hole or carbon nanotube with the heat in transmission between the layer, through copper foil heat conduction, realize quick radiating effect at last.
Description
Technical field
This utility model is related to heat conduction and heat radiation material technical field, particularly a kind of compound conductive graphite membrane material
Material.
Background technology
As the fast development of electron trade, electronic product integrated level are improved constantly, power is continuously increased, and volume constantly contracts
Little, the heat that chip is produced also is increased considerably, and heat density steeply rises, and the temperature of electronic equipment increases rapidly, due to radiating
It is bad caused by electronic equipment failure it is also more and more, how effectively to solve electronic device heat dissipation problem have become it is whole
Key technology urgently to be resolved hurrily in individual electronic industry development.Graphite film because of heat conductivity and the good specific heat capacity of its superelevation, into
For the preferable heat conduction and heat radiation material of present electronic product.
But, the horizontal thermal conductivity factor of existing high heat conduction graphite film is up to 1800-1900W/mK, but leading of being vertically oriented
Hot coefficient is only 5W/mK, therefore, the application of conduction graphite film is less suitable for space, the less small space of heat dissipation capacity, such as intelligence
The heat Quick uniform of hot-spot is mainly dispersed in plane by energy mobile phone, realizes the effect of radiating.But the method is not
The diffusion of heat can be realized, therefore the heat dispersion of raising graphite film vertical direction is current problem demanding prompt solution.
Utility model content
The technical problems to be solved in the utility model is:In order to solve the heat dispersion of existing graphite film vertical direction
Problem, this utility model provide a kind of compound conductive graphite membrane material, and graphite film surface has some through holes, through hole
It is interior filled with orthotropic Graphene or CNT, graphite film interlayer heat can spread rapidly, by filling out in through hole
Heat is transmitted by the orthotropic Graphene or CNT for filling in interlayer, finally by Copper Foil heat conduction, realizes quick heat radiating
Effect.
This utility model solves the technical scheme adopted by its technical problem:A kind of compound conductive graphite membrane material,
Including Copper Foil and the graphite film for being attached to copper foil surface, the graphite film surface has some through holes, fills out in the through hole
Filled with orthotropic Graphene or CNT.
The graphite film for preparing is obtained into through hole by punching press, then Copper Foil is attached in the side of conduction graphite film,
With Copper Foil as substrate, with CVD vertical-growth, Graphene or CNT in the hole of graphite film.
Specifically, the graphite film thickness is 0.01-0.1mm.
Specifically, some through holes are evenly distributed on graphite film surface.
Preferably, the graphite film surface is also pasted with layer protective layer.Protective layer can be PET film layer or other can
It is attached to the film on graphite film surface.
Preferably, the Copper Foil lower surface is sequentially provided with adhesive tape and mould release membrance.Wherein adhesive tape is bond plies, release
Film is PET mould release membrances.
The beneficial effects of the utility model are:A kind of compound conductive graphite membrane material that this utility model is provided, graphite
Film surface has in some through holes, through hole filled with orthotropic Graphene or CNT, graphite film interlayer heat
Can spread rapidly, heat be transmitted in interlayer by the orthotropic Graphene or CNT filled in through hole, most
Afterwards by Copper Foil heat conduction, the effect of quick heat radiating is realized, the heat conductivility of vertical direction is effectively increased, LED etc. is can be applicable to
The high field of cooling requirements.
Description of the drawings
With reference to the accompanying drawings and examples this utility model is further illustrated.
Fig. 1 is a kind of exploded view of compound conductive graphite membrane material of the present utility model;
In figure:1. Copper Foil, 2. graphite film, 21. through holes, 3. protective layer, 4. adhesive tape, 5. mould release membrance.
Specific embodiment
This utility model is described in further detail presently in connection with accompanying drawing.These accompanying drawings are simplified schematic diagram,
Basic structure of the present utility model is only illustrated in a schematic way, therefore which only shows the composition relevant with this utility model.
Embodiment 1
A kind of compound conductive graphite membrane material, including Copper Foil 1 and the graphite film 2 for being attached to 1 surface of Copper Foil, graphite film 2
Surface has some through holes 21, is filled with orthotropic Graphene in through hole 21, and 2 thickness of graphite film is 0.01mm, is passed through
The aperture of perforation 21 is 0.1mm.
Embodiment 2
A kind of compound conductive graphite membrane material, including Copper Foil 1 and the graphite film 2 for being attached to 1 surface of Copper Foil, graphite film 2
Surface is evenly distributed with some through holes 21, and it is 0. to be filled with orthotropic 2 thickness of CNT graphite film in through hole 21
1mm, the aperture of through hole 21 is 1mm.
Embodiment 3
A kind of compound conductive graphite membrane material, including Copper Foil 1 and the graphite film 2 for being attached to 1 surface of Copper Foil, graphite film 2
Surface is evenly distributed with some through holes 21, is filled with orthotropic CNT in through hole 21, and 2 thickness of graphite film is
0.07mm, the aperture of through hole 21 is 0.2mm, and 2 surface of graphite film is also pasted with layer protective layer 3.
Embodiment 4
A kind of compound conductive graphite membrane material, including Copper Foil 1 and the graphite film 2 for being attached to 1 surface of Copper Foil, graphite film 2
Surface is evenly distributed with some through holes 21, is filled with orthotropic CNT in through hole 21, and 2 thickness of graphite film is
0.05mm, the aperture of through hole 21 is 0.8mm, and 1 lower surface of Copper Foil is sequentially provided with adhesive tape 4 and mould release membrance 5.
Embodiment 5
As shown in figure 1, a kind of compound conductive graphite membrane material, including Copper Foil 1 and the graphite film for being attached to 1 surface of Copper Foil
2,2 surface of graphite film is evenly distributed with some through holes 21, is filled with orthotropic CNT, graphite film in through hole 21
2 thickness are 0.08mm, and the aperture of through hole 21 is 0.5mm, and 2 surface of graphite film is also pasted with layer protective layer 3,1 following table of Copper Foil
Face is sequentially provided with adhesive tape 4 and mould release membrance 5.
With it is above-mentioned according to desirable embodiment of the present utility model as enlightenment, by above-mentioned description, related work people
Member can carry out various change and modification completely in the range of without departing from this utility model technological thought.This reality
The content being not limited to new technical scope in description, it is necessary to determine its technology according to right
Property scope.
Claims (6)
1. a kind of compound conductive graphite membrane material, including Copper Foil and the graphite film for being attached to copper foil surface, it is characterised in that:Institute
State graphite film surface to have in some through holes, the through hole filled with orthotropic Graphene or CNT.
2. a kind of compound conductive graphite membrane material according to claim 1, it is characterised in that:The graphite film thickness
For 0.01-0.1mm.
3. a kind of compound conductive graphite membrane material according to claim 1, it is characterised in that:Some through holes are equal
It is even to be distributed in graphite film surface.
4. a kind of compound conductive graphite membrane material according to claim 1, it is characterised in that:The hole of the through hole
Footpath is 0.1-1mm.
5. a kind of compound conductive graphite membrane material according to any one of claim 1-4, it is characterised in that:The graphite
Film surface is also pasted with layer protective layer.
6. a kind of compound conductive graphite membrane material according to any one of claim 1-4, it is characterised in that:The Copper Foil
Lower surface is sequentially provided with adhesive tape and mould release membrance.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201620822173.6U CN206040630U (en) | 2016-07-29 | 2016-07-29 | Compound heat conduction graphite membrane material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201620822173.6U CN206040630U (en) | 2016-07-29 | 2016-07-29 | Compound heat conduction graphite membrane material |
Publications (1)
Publication Number | Publication Date |
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CN206040630U true CN206040630U (en) | 2017-03-22 |
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CN201620822173.6U Active CN206040630U (en) | 2016-07-29 | 2016-07-29 | Compound heat conduction graphite membrane material |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108135115A (en) * | 2018-01-19 | 2018-06-08 | 武汉华星光电半导体显示技术有限公司 | A kind of thermally conductive sheet |
CN110004442A (en) * | 2018-12-27 | 2019-07-12 | 岑对凤 | A kind of superconduction composite plate and its manufacturing method |
WO2020041732A1 (en) * | 2018-08-24 | 2020-02-27 | Google Llc | Thermal materials for increasing a rate of heat pipe cooling |
US10872840B2 (en) | 2018-01-19 | 2020-12-22 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Thermal conductive sheet |
CN112770592A (en) * | 2020-11-18 | 2021-05-07 | 信骅(上海)器材有限公司 | Method for improving heat transfer performance of radiating fin in vertical direction and radiating fin |
-
2016
- 2016-07-29 CN CN201620822173.6U patent/CN206040630U/en active Active
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108135115A (en) * | 2018-01-19 | 2018-06-08 | 武汉华星光电半导体显示技术有限公司 | A kind of thermally conductive sheet |
US10872840B2 (en) | 2018-01-19 | 2020-12-22 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Thermal conductive sheet |
WO2020041732A1 (en) * | 2018-08-24 | 2020-02-27 | Google Llc | Thermal materials for increasing a rate of heat pipe cooling |
CN110004442A (en) * | 2018-12-27 | 2019-07-12 | 岑对凤 | A kind of superconduction composite plate and its manufacturing method |
CN112770592A (en) * | 2020-11-18 | 2021-05-07 | 信骅(上海)器材有限公司 | Method for improving heat transfer performance of radiating fin in vertical direction and radiating fin |
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GR01 | Patent grant |