CN110004442A - A kind of superconduction composite plate and its manufacturing method - Google Patents
A kind of superconduction composite plate and its manufacturing method Download PDFInfo
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- CN110004442A CN110004442A CN201811607083.5A CN201811607083A CN110004442A CN 110004442 A CN110004442 A CN 110004442A CN 201811607083 A CN201811607083 A CN 201811607083A CN 110004442 A CN110004442 A CN 110004442A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/04—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/61—Types of temperature control
- H01M10/613—Cooling or keeping cold
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/65—Means for temperature control structurally associated with the cells
- H01M10/655—Solid structures for heat exchange or heat conduction
- H01M10/6554—Rods or plates
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of superconduction composite plate and its manufacturing methods, including substrate, graphite ene coatings and ceramic electroplated layer, substrate is wherein coated with graphite ene coatings on one side, the another side of substrate is electroplate with ceramic electroplated layer, for existing composite board, thermally conductive, heat dissipation problem is improved, heat transfer and the thermal diffusion of composite plate can be greatly increased, to improve the service life and stability of institute's application product.
Description
Technical field
The present invention relates to technical field of composite materials, specially a kind of superconduction composite plate and its manufacturing method.
Background technique
With the fast development of electronics industry, especially in the increasingly raising of electronic product battery performance, output power
Also just increasing, the heat of generation is also just more and more, therefore proposes increasingly higher demands to the performance of Heat Conduction Material,
Although existing substrate thermal coefficient has reached 200-350W/m-K, Speed of diffusion is too slow, is still unable to satisfy electronics production
Product high-performance, prolonged work.
Traditional metallic heat radiating plate mostly uses the techniques such as explosion method or extruding, rolling to be processed, and difficulty of processing is larger,
Yield rate is low, and existing composite plate fitting has used the double-sided adhesive of PET base material, has played thermal resistance, composite plate is caused to radiate
Performance decline, affects heat transfer, the heat dissipation performance of the nano-carbon layer of coating is limited, affects thermal diffusion.
Publication number CN 108312667 discloses composite metal plate and its production technology, including substrate, adhesive layer and wear-resisting
Inhibition layer, substrate use aluminium alloy base plate, and adhesive layer uses Tao Shi BETAFORCETM structural adhesive layer, and wear-resisting inhibition layer is not using
Become rusty steel plate, and adhesive layer is connected between substrate and wear-resisting inhibition layer, the thickness of wear-resisting inhibition layer and the thickness of composite metal plate entirety
The ratio of degree is connected between substrate and wear-resisting inhibition layer between 10% to 25% using adhesive layer, although relatively exploding, squeezing
Pressure, rolling, Diffusion Welding, the processing technologys such as rolling casting bonding method are simple, but the composite plate radiating efficiency of bonding way manufacture is bright
Aobvious to reduce, thermal coefficient is even more bad.
Summary of the invention
The purpose of the present invention is to provide a kind of superconduction composite plate and its manufacturing methods, have thermally conductive efficient advantage, can
To greatly increase heat transfer and the thermal diffusion of composite plate, to improve the service life and stability of institute's application product.
To achieve the above object, the invention provides the following technical scheme: a kind of superconduction composite plate, including substrate, ceramic electrical
Coating and graphite ene coatings, substrate are wherein coated with graphite ene coatings on one side, and the another side of substrate is electroplate with ceramic plating
Layer,
Preferably, substrate uses fine copper material, and thickness≤2mm offers the net that diameter is 0.5mm on the two sides of substrate
Hole, mesh spacing are 1mm, depth 0.2-0.5mm.
Preferably, graphite ene coatings use graphene superconductor, and through pyrolytic coating on substrate, coating layer thickness is
0.01~0.1mm.
Preferably, thickness is electroplated using electroplating powder made of ceramic fibre mixed aluminium oxides and boron nitride in ceramic electroplated layer
Degree is 0.05~0.1mm.
A kind of superconduction composite plate and its manufacturing method comprising the steps of:
S1. thickness≤2mm fine copper plate is processed in CNC machining center, the two sides of fine copper plate is made respectively to process 0.5mm
Mesh, mesh spacing be 1mm, depth 0.2-0.5mm, the fine copper plate processed is polished smooth, surface roughness is wanted
Ask≤0.2mm, planarity requirements≤0.05mm；
S2. graphene superconductor is passed through into high temperature melt into liquid, is uniformly applied to the one side shape of warmed-up substrate
It is cooling at graphite ene coatings；
S3. powder is made in ceramic fibre mixed aluminium oxides and boron nitride, by high-temperature atomizing, be electroplated in the another of substrate
Face forms ceramic electroplated layer.
Compared with prior art, beneficial effects of the present invention are as follows:
1, the adsorption capacity that electro-plated pottery composite material had both been improved by the mesh that 1 two sides of substrate is gathered, makes Ceramic Composite
Material is effectively combined with substrate, is improved thermal conductivity, and improve the adhesive force of spraying graphite alkene superconductor, is made graphene superconduction
Material is effectively combined with substrate, greatly improves rate of heat dissipation, and the heat dissipation of fine copper used by substrate will be dissipated more than general aluminium alloy
Thermal effect is more preferable；
2, the present invention does research of technique on substrate, and by one-side electroplating ceramics, and mixed aluminium oxides and boron nitride allow institute
The ceramic layer heating conduction of plating greatly improves；
3. the present invention applies superconductor by the other one side spraying graphite alkene in substrate, can be than conventional thermal conductive composite plate
3-10 times of Speed of diffusion is improved, the thickness of coating is different, and heating conduction is also different, and it is thermally conductive to meet various electronic products
The needs of material.
4, the present invention keeps the manufacturing process of thermally conductive composite plate relatively simple by high temperature spraying plating and electroplating technique, and at
Product rate is higher.
Detailed description of the invention
Fig. 1 is the cross-sectional view of the structure of front view of the present invention；
Fig. 2 is the schematic diagram of substrate of the present invention.
In figure: 1 substrate, 2 ceramic electroplated layers, 3 graphite ene coatings.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
A kind of superconduction composite plate referring to FIG. 1-2, including substrate 1, ceramic electroplated layer 2 and graphite ene coatings 3, substrate 1
Using fine copper material, thickness≤2mm requires selection actual (real) thickness according to electronics applications, offers on the two sides of substrate 1
Diameter is the mesh of 0.5mm, and mesh spacing is 1mm, depth 0.2-0.5mm, has both been improved by the mesh that basic 1 two sides is gathered
The adsorption capacity of electro-plated pottery composite material combines ceramic composite and substrate 1 effectively, improves thermal conductivity, and improve
The adhesive force of spraying graphite alkene superconductor combines graphene superconductor and substrate 1 effectively, greatly improves rate of heat dissipation, stone
Black ene coatings 2 use graphene superconductor, and on substrate 1 by pyrolytic coating, coating layer thickness is 0.01~0.1mm.Graphite
Alkene superconductor has a radiating efficiency of superelevation, the far super silver-colored, copper of heat dissipation effect, due to its superconductivity, in applying electronic product,
Especially there is significant effect to the heat dissipation of semi-conductor electronic device, ceramic electroplated layer 3 uses ceramic fibre mixed aluminium oxides
With electroplating powder made of boron nitride, thickness of coating is 0.05~0.1mm, since ceramics, aluminium oxide and boron nitride are with distinctive
Insulating heat-conductive is chiefly used in the radiating surface of electronic device, makes outer surface of substrate by ceramic fibre mixed aluminium oxides and boron nitride
Heat dissipation performance significantly improves, so that the thermal diffusion of electronic product be made to be obviously improved.
A kind of manufacturing method of superconduction composite plate comprising the steps of:
S1. thickness≤2mm fine copper plate is processed in CNC machining center, the two sides of fine copper plate is made respectively to process 0.5mm
Mesh, mesh spacing be 1mm, depth 0.2-0.5mm, the fine copper plate processed is polished smooth, surface roughness is wanted
Ask≤0.2mm, planarity requirements≤0.05mm, the production of completing substrate；
S2. graphene superconductor is passed through into high temperature melt into liquid, is uniformly applied to the one side shape of warmed-up substrate 1
It is cooling at graphite ene coatings；
S3. powder is made in ceramic fibre mixed aluminium oxides and boron nitride, by high-temperature atomizing, be electroplated in the another of substrate 1
Ceramic electroplated layer is formed on one side.
In summary: doing research of technique on substrate, single side ceramic platingv, mixed aluminium oxides and boron nitride allow plated ceramics
Layer heating conduction improves, and the spraying of graphene allows the heat dissipation advantage of graphene to be not fully exerted, greatly improves electronic product
Heat dissipation performance, for currently common composite plate it is thermally conductive/heat dissipation problem carry out emphasis tackling key problem improve, pass through improve after production
Product, can greatly increase heat transfer and the thermal diffusion of composite plate, to improve the service life and performance stabilization of institute's application product
Property.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (5)
1. a kind of superconduction composite plate and its manufacturing method, including substrate (1), graphite ene coatings (2) and ceramic electroplated layer (3), institute
Wherein being coated on one side graphite ene coatings (2) for substrate (1) is stated, the another side of the substrate (1) is electroplate with ceramic electroplated layer
(3)。
2. a kind of superconduction composite plate according to claim 1 and its manufacturing method, it is characterised in that: the substrate (1) is adopted
With fine copper material, thickness≤2mm offers the mesh that diameter is 0.5mm on the two sides of the substrate (1), and mesh spacing is
1mm, depth 0.2-0.5mm.
3. a kind of superconduction composite plate according to claim 1 and its manufacturing method, it is characterised in that: the graphite ene coatings
(2) graphene superconductor is used, through pyrolytic coating on substrate (1), coating layer thickness is 0.01~0.1mm.
4. a kind of superconduction composite plate according to claim 1 and its manufacturing method, it is characterised in that: the ceramics electroplated layer
(3) using powder is electroplated made of ceramic fibre mixed aluminium oxides and boron nitride, plating thickness is 0.05~0.1mm.
5. a kind of superconduction composite plate according to claim 1 and its manufacturing method, it is characterised in that: comprise the steps of:
S1. thickness≤2mm fine copper plate is processed in CNC machining center, the two sides of fine copper plate is made respectively to process the net of 0.5mm
Hole, mesh spacing are 1mm, depth 0.2-0.5mm, and the fine copper plate processed is polished smooth, surface roughness requirements≤
0.2mm, planarity requirements≤0.05mm；
S2. graphene superconductor is passed through into high temperature melt into liquid, the one side for being uniformly applied to warmed-up substrate forms stone
Black ene coatings (2) are cooling；
S3. powder is made in ceramic fibre mixed aluminium oxides and boron nitride, by high-temperature atomizing, be electroplated in the another of substrate (1)
Face forms ceramic electroplated layer (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811607083.5A CN110004442A (en) | 2018-12-27 | 2018-12-27 | A kind of superconduction composite plate and its manufacturing method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811607083.5A CN110004442A (en) | 2018-12-27 | 2018-12-27 | A kind of superconduction composite plate and its manufacturing method |
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| Publication Number | Publication Date |
|---|---|
| CN110004442A true CN110004442A (en) | 2019-07-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201811607083.5A Pending CN110004442A (en) | 2018-12-27 | 2018-12-27 | A kind of superconduction composite plate and its manufacturing method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110602936A (en) * | 2019-10-15 | 2019-12-20 | 汕头大学 | Heat-conducting electromagnetic shielding substrate and preparation process thereof |
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| CN1536656A (en) * | 2003-04-04 | 2004-10-13 | 刘俊富 | Die casting or casting formed radiating end structure |
| CN102055266A (en) * | 2010-12-29 | 2011-05-11 | 哈尔滨电机厂有限责任公司 | High thermal conductivity insulation structure of stator bar of excess epoxy mould pressing insulation system |
| CN104813751A (en) * | 2012-09-25 | 2015-07-29 | 莫门蒂夫性能材料股份有限公司 | Thermal management assembly comprising bulk graphene material |
| CN206040630U (en) * | 2016-07-29 | 2017-03-22 | 碳元科技股份有限公司 | Compound heat conduction graphite membrane material |
| CN207284015U (en) * | 2017-09-01 | 2018-04-27 | 牛特 | A kind of radiator structure and radiator |
| CN109130380A (en) * | 2018-09-26 | 2019-01-04 | 深圳莱必德科技股份有限公司 | A kind of superconduction composite plate and its manufacturing method |
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2018
- 2018-12-27 CN CN201811607083.5A patent/CN110004442A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1536656A (en) * | 2003-04-04 | 2004-10-13 | 刘俊富 | Die casting or casting formed radiating end structure |
| CN102055266A (en) * | 2010-12-29 | 2011-05-11 | 哈尔滨电机厂有限责任公司 | High thermal conductivity insulation structure of stator bar of excess epoxy mould pressing insulation system |
| CN104813751A (en) * | 2012-09-25 | 2015-07-29 | 莫门蒂夫性能材料股份有限公司 | Thermal management assembly comprising bulk graphene material |
| CN206040630U (en) * | 2016-07-29 | 2017-03-22 | 碳元科技股份有限公司 | Compound heat conduction graphite membrane material |
| CN207284015U (en) * | 2017-09-01 | 2018-04-27 | 牛特 | A kind of radiator structure and radiator |
| CN109130380A (en) * | 2018-09-26 | 2019-01-04 | 深圳莱必德科技股份有限公司 | A kind of superconduction composite plate and its manufacturing method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110602936A (en) * | 2019-10-15 | 2019-12-20 | 汕头大学 | Heat-conducting electromagnetic shielding substrate and preparation process thereof |
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Application publication date: 20190712 |