CN206799715U - A kind of metallization structure of diamond particles enhancing metal-base composites - Google Patents
A kind of metallization structure of diamond particles enhancing metal-base composites Download PDFInfo
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- CN206799715U CN206799715U CN201720583539.3U CN201720583539U CN206799715U CN 206799715 U CN206799715 U CN 206799715U CN 201720583539 U CN201720583539 U CN 201720583539U CN 206799715 U CN206799715 U CN 206799715U
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Abstract
The utility model proposes a kind of surface metalation structure of diamond particles enhancing metal-base composites, the first metal layer and second metal layer have been sequentially prepared on diamond particles enhancing film on metal matrix composite surface, wherein, being prepared between foregoing diamond particles enhancing film on metal matrix composite surface exposed diamond particle surfaces and the first metal layer has carbide lamella.The diamond particles that second metal layer completely can be stretched out in clad composite material, the roughness of composite material surface can be greatly reduced, improve the machining accuracy of composite.
Description
Technical field
The utility model belongs to diamond composite field, and specially diamond particles strengthen metal-base composites
Surface metalation Rotating fields.
Background technology
Diamond particles enhancing metal-base composites has the advantages of high heat conduction, available for high-power semiconductor laser
Heat sink/backing material, power amplifying device, HIGH-POWERED MICROWAVES device, the encapsulating material of high powered radar device.In semiconductor
Device encapsulation field, the thermal coefficient of expansion (CTE) of diamond particles enhancing metal-base composites are matched with semiconductor chip, solved
, can be directly as the encapsulating material of semiconductor chip in semiconductor die package of having determined the problem of thermal stress, but diamond
Following 2 technical barriers in package application be present in particles reiforced metal-base composition：
1. the interface cohesion problem between surface metalation film and exposed diamond particles：Diamond particles strengthen metal
The wellability of diamond and solder in based composites is very poor, it is difficult to is directly bonded, passed with semiconductor chip or device
The Electroless Plating Ni plating Au modes of system can not form effective metallurgical bonding interface in exposed diamond surface.
2. diamond particles enhancing metal-base composites is difficult to, surface quality is poor：Diamond particles have high
Hardness, in general machining process be difficult to ensure that diamond particles enhancing metal-base composites surface roughness and chi
Very little precision.
Chinese patent 201410407949.3 discloses a kind of method of diamond carbon/carbon-copper composite material surface gold-plating, technique stream
Journey is complicated, is had difficulties in Industry Promotion.
Utility model content
In order to solve the above problems, the utility model proposes a kind of table of diamond particles enhancing metal-base composites
Face metallization structure.
A kind of metallization structure of diamond particles enhancing metal-base composites, it is specially：Diamond particles enhancing gold
The first metal layer and second metal layer have been sequentially prepared on metal-matrix composite material surface, wherein, foregoing diamond particles enhancing
Being prepared between film on metal matrix composite surface exposed diamond particle surfaces and the first metal layer has carbide lamella.Described second
The thickness of metal level is more than the height of the exposed diamond particles of foregoing composite material surface so that second metal layer completely coats
The diamond particles of foregoing composite material surface.Second metal layer surface includes exposed Buddha's warrior attendant relative to foregoing composite
For the surface of stone particle, it can be understood as be a plane, expected roughness is obtained after follow-up polishing, for half
The available more excellent bonding effect of bonding of conductor chip.
The carbide lamella is specially Cr3C7、Cr23C7、Cr3C2、Ni3C, the one or more in TiC, WC.
The first metal layer is specially Ti, Pt, Au, Ni, Ni-P, Ni-Cr-P, W one or more.
The second metal layer is specially the one or more in Cu, Ti, Al, Cr, Ni, Ni-P, Ni-Cr-P, W.
The first metal layer and/or the layer structure that second metal layer is various metals, or the alloy of various metals.
The metal base of diamond particles enhancing metal-base composites be specially Cu, Al, Ag, Mg, Ni, Co, Mo,
The alloy of a kind of metal material or various metals composition including Fe, Mn, Cr, Zr, B, Ti, Ta, Nb, Au, W, Zn.
The preparation refers specifically to electroplate, chemical plating, CVD, PVD, sprays, and sinters, infiltration, built-up welding, soldering, high energy beam cladding
In one or more.
After this programme, caused beneficial effect：
1) carbide lamella is formed between exposed diamond and the first metal layer, can makes to be formed therebetween reliably
Metallurgical bonding interface, the thermal resistance of surface interface layer is reduced, improve heat transfer efficiency.
2) diamond particles that second metal layer completely can be stretched out in clad composite material, can be greatly reduced composite table
The roughness in face.If further appropriate machining second metal layer, can obtain higher dimensional accuracy and surface roughness.
3) the surface metalation Rotating fields of the utility model design, material are easily obtained, and technology of preparing is ripe, and cost is low
It is honest and clean.
Brief description of the drawings
Fig. 1 is embodiment one of the present utility model to embodiment three.
Fig. 2 is example IV of the present utility model.
Drawing reference numeral explanation：1- diamond particles strengthen the metallic matrix of metal-base composites, and 2- diamond particles increase
The diamond particles of strong metal based composites, 3- carbide lamellas, 4- the first metal layers, 5- second metal layers.
Embodiment
The technical solution of the utility model is clearly and completely described below in conjunction with accompanying drawing, it is clear that described
Embodiment is the utility model part of the embodiment, rather than whole embodiments.Based on the embodiment in the utility model, sheet
The every other embodiment that field those of ordinary skill is obtained under the premise of creative work is not made, belongs to this practicality
Novel protected scope.
As Fig. 1 provides a kind of metallization structure of diamond particles enhancing metal-base composites, diamond particles increasing
Strong metal based composites are made up of metal base 1 and diamond particles 2, and the first metal has been sequentially prepared on composite material surface
Layer 4 and second metal layer 5, wherein, the exposed diamond particles 2 of foregoing diamond particles enhancing film on metal matrix composite surface
Being prepared between surface and the first metal layer 4 has carbide lamella 3, and the thickness of the second metal layer 5 is more than foregoing composite table
The height of the exposed diamond particles in face so that second metal layer completely coats the diamond particles of foregoing composite material surface.
Several specific embodiments given below illustrate to said structure.
Embodiment one：
Diamond particles enhancing metal-base composites is specially diamond aluminum composite, and its metallic matrix 1 is aluminium.Gold
Hard rock aluminium composite material surface specially covers successively covered with the first metal layer 4 and second metal layer 5, the first metal layer successively
Ti, Pt, Au three-layer metal layer structure, second metal layer 5 be specially Al layers, wherein, diamond aluminum composite material surface
There are carbide lamella 3, specially TiC layer on exposed diamond particles 2 between the first metal layer 4, second metal layer Al is through throwing
The diamond aluminum composite that surface roughness is 0.22 μm is can obtain after light.
Embodiment two：
Diamond particles enhancing metal-base composites is specially diamond carbon/carbon-copper composite material, and its metallic matrix 1 is copper.
Diamond carbon/carbon-copper composite material outer surface covers the first metal layer 4 and second metal layer 5 successively, and the first metal layer is specially Ni-Cr-
P alloy-layers, second metal layer are specially Cu layers, wherein, the Buddha's warrior attendant of the first metal layer 4 and diamond carbon/carbon-copper composite material surface exposure
There is carbide lamella 3 between stone 2, carbide lamella is specially the mixture of carbonization nickel and chromium carbide, after polishing second metal layer Cu layers
The diamond carbon/carbon-copper composite material that surface roughness is 0.08 μm can be obtained.
Embodiment three：
The metallic matrix 1 of diamond particles enhancing metal-base composites is argent, diamond silver composite material appearance
Face covers the first metal layer 4 and second metal layer 5 successively, and the first metal layer 4 is specially W layers, and second metal layer is BAg60 and Cu
Double-decker, wherein, cover one between the diamond particles 2 and the first metal layer 4 of diamond silver composite material surface exposure
Layer WC layers, the diamond silver composite material that surface roughness is 0.11 μm is obtained after polishing Cu layers.
Example IV：
Such as Fig. 2, diamond particles enhancing metal-base composites is specially diamond copper, diamond carbon/carbon-copper composite material appearance
Face covers the first metal layer 4 and second metal layer 5 successively, and the first metal layer and second metal layer are Ni-Cr-P alloy-layers, its
In, there are carbide lamella 3, carbide lamella between the diamond particles 2 and the first metal layer 4 of diamond carbon/carbon-copper composite material surface exposure
The mixture of specially a variety of Cr-C compounds, surface roughness can be obtained after being polished to second metal layer surface as 0.15
μm diamond carbon/carbon-copper composite material.
In order to optimize the bonding effect of semiconductor chip, one layer or more metal layers 6 are prepared in second metal layer 5,
For preventing aoxidizing and increasing the wellability of solder for surface before follow-up plated film, specially include Ni, Pt, Co, Mn,
One or more layers structure including Ti, Mo, W, Au, Cr, Y, or contain the one or more alloy of aforementioned metal.
Claims (7)
- A kind of 1. metallization structure of diamond particles enhancing metal-base composites, it is characterised in that：Diamond particles strengthen The first metal layer and second metal layer have been sequentially prepared on film on metal matrix composite surface, wherein, foregoing diamond particles increase Being prepared between the diamond particle surfaces and the first metal layer of strong metal based composites surface exposure has a carbide lamella, and described the The thickness of two metal levels is more than the height of the exposed diamond particles of foregoing composite material surface so that second metal layer complete packet Cover the diamond particles of foregoing composite material surface.
- 2. the metallization structure of diamond particles enhancing metal-base composites according to claim 1, it is characterised in that： The carbide lamella is specially Cr3C7、Cr23C7、Cr3C2、Ni3C, the one or more in TiC, WC.
- 3. the metallization structure of diamond particles enhancing metal-base composites according to claim 1, it is characterised in that： The first metal layer is specially Ti, Pt, Au, Ni, Ni-P, Ni-Cr-P, W one or more.
- 4. the metallization structure of diamond particles enhancing metal-base composites according to claim 1, it is characterised in that： The second metal layer is specially the one or more in Cu, Ti, Al, Cr, Ni, Ni-P, Ni-Cr-P, W.
- 5. the metallization structure of the diamond particles enhancing metal-base composites according to claim 3 or 4, its feature It is：The first metal layer and/or the layer structure that second metal layer is various metals, or the alloy of various metals.
- 6. the metallization structure of diamond particles enhancing metal-base composites according to claim 1, it is characterised in that： The metal base of diamond particles enhancing metal-base composites be specially Cu, Al, Ag, Mg, Ni, Co, Mo, Fe, Mn, The alloy of a kind of metal material or various metals composition including Cr, Zr, B, Ti, Ta, Nb, Au, W, Zn.
- 7. the metallization structure of diamond particles enhancing metal-base composites according to claim 1, it is characterised in that： One layer or more metal layers are prepared in second metal layer, for preventing oxidation and the increase solder on surface before follow-up plated film Wellability.
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| CN201720583539.3U CN206799715U (en) | 2017-05-24 | 2017-05-24 | A kind of metallization structure of diamond particles enhancing metal-base composites |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106995896A (en) * | 2017-05-24 | 2017-08-01 | 西安炬光科技股份有限公司 | The method for metallising and structure of a kind of diamond particles enhancing metal-base composites |
| CN109576598A (en) * | 2018-11-27 | 2019-04-05 | 汪杨志 | Drill bit alloy with Thermal conductivity |
| CN112111669A (en) * | 2020-09-18 | 2020-12-22 | 成都本征新材料技术有限公司 | High-thermal-conductivity diamond/copper material and application thereof |
| CN114540765A (en) * | 2020-11-25 | 2022-05-27 | 有研工程技术研究院有限公司 | Diamond/copper composite material heat sink coated with metal titanium-copper layer and preparation method thereof |
-
2017
- 2017-05-24 CN CN201720583539.3U patent/CN206799715U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106995896A (en) * | 2017-05-24 | 2017-08-01 | 西安炬光科技股份有限公司 | The method for metallising and structure of a kind of diamond particles enhancing metal-base composites |
| CN106995896B (en) * | 2017-05-24 | 2019-05-10 | 西安炬光科技股份有限公司 | A kind of method for metallising and structure of diamond particles enhancing metal-base composites |
| CN109576598A (en) * | 2018-11-27 | 2019-04-05 | 汪杨志 | Drill bit alloy with Thermal conductivity |
| CN112111669A (en) * | 2020-09-18 | 2020-12-22 | 成都本征新材料技术有限公司 | High-thermal-conductivity diamond/copper material and application thereof |
| CN114540765A (en) * | 2020-11-25 | 2022-05-27 | 有研工程技术研究院有限公司 | Diamond/copper composite material heat sink coated with metal titanium-copper layer and preparation method thereof |
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