CN109930125B - Magnetron sputtering coating method for diamond-aluminum composite material - Google Patents
Magnetron sputtering coating method for diamond-aluminum composite material Download PDFInfo
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- 239000002131 composite material Substances 0.000 title claims abstract description 92
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 82
- 238000001755 magnetron sputter deposition Methods 0.000 title claims abstract description 64
- 238000000576 coating method Methods 0.000 title claims abstract description 43
- 238000007747 plating Methods 0.000 claims abstract description 80
- 229910052802 copper Inorganic materials 0.000 claims abstract description 53
- 239000010949 copper Substances 0.000 claims abstract description 53
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 52
- 239000011651 chromium Substances 0.000 claims abstract description 39
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims abstract description 38
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 37
- 238000004544 sputter deposition Methods 0.000 claims abstract description 34
- 238000010438 heat treatment Methods 0.000 claims abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 11
- 238000004506 ultrasonic cleaning Methods 0.000 claims abstract description 10
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 6
- 244000137852 Petrea volubilis Species 0.000 claims abstract description 6
- 238000000227 grinding Methods 0.000 claims abstract description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 24
- 238000000137 annealing Methods 0.000 claims description 17
- 229910052786 argon Inorganic materials 0.000 claims description 12
- 239000013077 target material Substances 0.000 claims description 11
- 238000001816 cooling Methods 0.000 claims description 7
- 238000004321 preservation Methods 0.000 claims description 6
- 239000003344 environmental pollutant Substances 0.000 claims description 5
- 239000007789 gas Substances 0.000 claims description 5
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- 238000004140 cleaning Methods 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 82
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- 239000011248 coating agent Substances 0.000 abstract description 23
- 238000000034 method Methods 0.000 abstract description 15
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 7
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- 239000010432 diamond Substances 0.000 description 24
- 229910003460 diamond Inorganic materials 0.000 description 23
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 22
- 239000000126 substance Substances 0.000 description 11
- 239000011159 matrix material Substances 0.000 description 9
- 238000004100 electronic packaging Methods 0.000 description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 6
- 229910052737 gold Inorganic materials 0.000 description 6
- 239000010931 gold Substances 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
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- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 description 2
- WUUZKBJEUBFVMV-UHFFFAOYSA-N copper molybdenum Chemical compound [Cu].[Mo] WUUZKBJEUBFVMV-UHFFFAOYSA-N 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
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- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical group [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 1
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Abstract
The invention relates to a magnetron sputtering coating method of a diamond-aluminum composite material. The magnetron sputtering coating method comprises the following operation steps: 1. grinding the surface of the composite material by using sand paper, and then putting the composite material into absolute ethyl alcohol for ultrasonic cleaning; 2. putting the sample into ultrahigh vacuum magnetron sputtering equipment, sputtering a layer of metal chromium with the thickness of 200-500 nm, and then sputtering a layer of metal copper with the thickness of 1-2 mu m; 3. and carrying out heat treatment after plating to increase the interface bonding strength of the plating layer and the composite material. The magnetron sputtering coating method can ensure strong interface bonding force and small interface thermal resistance between the coating and the composite material substrate, brings convenience to the conventional subsequent nickel plating process, and can effectively prevent performance degradation caused by contact between the composite material and water during nickel plating. After nickel plating, according to the thermal shock test standard of SJ20130-92 'Metal coating adhesion strength test method', no foaming phenomenon and crack generation are caused after thermal shock circulation for 10 times at the temperature of more than 250 ℃.
Description
Technical Field
The invention relates to the field of electronic packaging material engineering application, in particular to a magnetron sputtering coating method of a diamond-aluminum composite material.
Background
With the continuous development of electronic technology, the integration level and power density of electronic devices are higher and higher, which inevitably leads to the significant increase of heat productivity, thereby increasing the probability of component failure. The diamond/aluminum is a novel composite material, the thermal conductivity (500-600W/m.K) of the diamond/aluminum is 2-3 times that of a traditional molybdenum-copper heat dissipation material, the thermal expansion coefficient of the diamond/aluminum is close to that of a chip semiconductor material, the density of the diamond/aluminum is far lower than that of molybdenum-copper, and the diamond/aluminum composite material has an important application prospect in the field of electronic packaging.
In the electronic packaging structure, heat generated by a semiconductor chip is conducted to a heat dissipation base plate through a sheet-shaped diamond-aluminum composite material and then diffused to the external environment, wherein the upper surface and the lower surface of the composite material are in metal connection with the chip and the heat dissipation base plate through soldering so as to reduce thermal resistance. In the electronic packaging process, the most commonly used solder is gold-tin solder, so that the surface of the welding part is usually required to be plated with nickel and gold, wherein the nickel is used as a transition layer, and the outermost gold plating layer is used as a gold plating layerCan ensure that the solder has good wettability and spreadability on the surface. In the diamond-aluminum composite material, the volume fraction of diamond particles is high, and the surface thereof is composed of an aluminum matrix (Al on the surface)2O3Film) and diamond particles (see fig. 1), have poor solderability, and must be surface plated with nickel and gold. Because gold plating on the nickel surface can be realized by adopting a mature gold electroplating process, the most important point for the surface treatment process of the diamond-aluminum composite material is how to deposit a uniform and compact nickel layer with good interface bonding force on the surfaces of diamond and an aluminum matrix.
Electroplating and chemical plating are high-efficiency and low-cost material surface treatment processes, but for diamond-aluminum composite materials, only a chemical nickel plating process can be adopted because diamond is not conductive. However, the chemical nickel plating process has the following problems: firstly, aluminum is very active, on one hand, a compact oxidation film can be quickly formed in air, on the other hand, the aluminum can generate a replacement reaction with various ions in a plating solution, so that a loose contact nickel plating layer is easily formed on the surface of the aluminum material, and the interface bonding strength is poor. ② the diamond has strong chemical inertia, and the nickel ion deposition can be realized only by special sensitization and activation process. The chemical plating process is adopted to simultaneously deposit compact nickel layers with good interface bonding force on the surfaces of aluminum and diamond, so that great technical difficulty exists. ③ in the preparation process of the diamond-aluminum composite material, the diamond/aluminum interface usually generates reactant Al4C3And the diamond-aluminum composite material is deliquesced when meeting water, so that the thermal conductivity of the diamond-aluminum composite material is usually reduced by adopting a chemical nickel plating process.
Magnetron sputtering is another commonly used material surface treatment process. The magnetron sputtering coating is adopted, so that the performance degradation caused by the contact of the diamond-aluminum composite material and water can be prevented. However, this process cannot be used to directly surface plate nickel on diamond-aluminum composite materials because nickel is a non-carbide forming element, and the nickel/diamond interface is only physically bonded, and the interface bonding force is poor. For the diamond-aluminum composite material for electronic packaging heat dissipation, the magnetron sputtering process is adopted for coating, and the following requirements must be met: firstly, the coating film must be capable of realizing good interface combination with both the aluminum matrix and the diamond. Secondly, the thermal resistance of the coating is small (the thermal conductivity of the coating is high and the thickness is thin), and the high thermal conductivity of the diamond-aluminum composite material is not influenced. The coating layer is convenient for the subsequent nickel plating process, can be firmly combined with the nickel plating layer, and has small interface thermal resistance.
Although the technology of performing magnetron sputtering coating on the surface of aluminum alloy or diamond independently is mature, the magnetron sputtering coating process of the diamond-aluminum composite material for heat dissipation of electronic packaging is not reported in documents so far.
Disclosure of Invention
The technical problem is as follows: the invention aims to provide a magnetron sputtering coating method of a diamond-aluminum composite material, which has strong interface bonding force with a substrate and small interface thermal resistance, can provide convenience for subsequent nickel plating, and can solve the problems of poor interface bonding force, decline of thermal conductivity of the composite material when meeting water and the like when the diamond-aluminum composite material is subjected to direct chemical nickel plating. The diamond-aluminum composite material has the volume content of 50-65% of diamond, and aluminum is pure aluminum or aluminum-silicon alloy.
The technical scheme is as follows: the invention provides a magnetron sputtering coating method of a diamond-aluminum composite material, which comprises the following steps:
1) pre-treating the diamond-aluminum composite material, including grinding and ultrasonic cleaning;
2) mounting a chromium target and a copper target on a magnetron target by adopting ultrahigh vacuum magnetron sputtering equipment, placing the cleaned diamond-aluminum composite material on a heating table top, and adjusting the distance between a composite material substrate and the target material;
3) covering a vacuum cavity cover, vacuumizing, and introducing argon; selecting a direct-current magnetron sputtering mode, performing magnetron sputtering chromium plating on the sample, and then performing magnetron sputtering copper plating;
4) after magnetron sputtering copper plating, cooling the cavity for a period of time, stopping introducing argon, opening a gas release valve, and taking out a sample when the temperature of the table top is cooled to room temperature;
5) annealing treatment: and (4) putting the copper-plated composite material into a tubular furnace for annealing treatment, and taking out after furnace cooling.
Wherein:
the diamond-aluminum composite material in the step 1) is flaky and has a flat surface.
And (2) in the grinding in the step 1), adopting 2000-mesh sand paper to completely remove the pollutants on the surface of the composite material.
In the ultrasonic cleaning in the step 1), absolute ethyl alcohol is used as a cleaning solution, and the ultrasonic cleaning time is 2 min.
The purity of the chromium target and the copper target in the step 2) is 99.99%.
The vacuum degree in the step 3) is extracted, and is less than 5 multiplied by 10-4Pa。
The purity of the argon in the step 3) is 99.99%, the flow rate is 30sccm, and the working pressure is 0.5 Pa.
Performing magnetron sputtering chromium plating in the step 3), wherein the applied bias voltage is-50V, and the power is 50-100W; pre-sputtering for 5 min; and carrying out sputtering chromium plating for 3-15 min, wherein the thickness of the chromium layer is 200-500 nm.
And 3) carrying out magnetron sputtering copper plating in the step 3), wherein the applied bias voltage is-50V, and the power is 50-100W. Pre-sputtering for 5 min; and carrying out sputtering copper plating for 20-40 min, wherein the thickness of the copper layer is 1-2 μm.
In the annealing treatment in the step 5), the temperature rise rate is 5 ℃/min, the annealing temperature is 160-230 ℃, and the heat preservation time is 1-2 h.
Has the advantages that: the invention carries out magnetron sputtering chromium plating and copper plating treatment and subsequent heat treatment on the diamond-aluminum composite material before nickel plating, and is based on the following ideas: cr is a carbide forming element and can form Cr with good adhesive force with diamond3C2The reactant can also form a metal bond with strong bonding force with the matrix aluminum and the coating copper. The heat conductivity of chromium is 94W/m.K, which belongs to carbide forming elements with higher heat conductivity, but has a larger difference with the heat conductivity of aluminum and diamond. The thickness of the chromium coating is 200-500 nm, so that Cr can be prevented3C2The contact with copper causes the failure of the film layer and can reduce the thermal resistance of the chromium coating. ② copper has good compatibility with chromium and nickelAnd (4) binding force. The plating of copper after the chromium plating can realize the good combination of the plating copper and the plating chromium, bring convenience to the conventional chemical nickel plating and nickel electroplating processes and effectively prevent the performance degradation caused by the contact of the diamond-aluminum composite material and water during the subsequent nickel plating. The thickness of the copper of the plating layer is 1-2 mu m, so that the phenomenon that the binding force of the plating layer is reduced due to the diffusion interaction of chromium and nickel elements can be prevented. As the thermal conductivity (401W/m.K) of copper is close to that of the diamond-aluminum composite material, the thermal resistance of the coated copper is extremely low, and the advantage of high thermal conductivity of the diamond-aluminum composite material can be fully exerted. Fourthly, the composite material after chrome plating and copper plating is subjected to heat treatment, so that the internal stress of the plating layer can be reduced, the mutual diffusion of interface atoms is promoted, and the interface bonding force between the plating layer and the composite material is further improved.
1. According to the invention, the diamond-aluminum composite material is sputtered with a layer of chromium with the thickness of 200-500 nm, then with a layer of copper with the thickness of 1-2 mu m, and finally is subjected to heat treatment, so that the interface bonding force between the coating and the composite material substrate is strong, the interface thermal resistance is small, and the advantage of high heat conductivity of the diamond-aluminum composite material can be fully exerted.
2. The method for carrying out magnetron sputtering coating on the diamond-aluminum composite material brings convenience to the conventional chemical nickel plating and nickel electroplating processes, and can effectively prevent the performance degradation caused by the contact of the diamond-aluminum composite material and water during nickel plating.
3. The invention carries out magnetron sputtering coating on the diamond-aluminum composite material, and then carries out chemical nickel plating, and the appearance of the composite material is shown in figure 5. After the nickel-plated composite material is subjected to heat preservation at 250-300 ℃ for 20-30 min, the composite material is placed into room temperature water for quenching, and circulation is performed, and after 10 times of thermal shock, the coating has no foaming phenomenon and cracks (see figure 6), so that the interface bonding force among the composite material, the magnetron sputtering coating and the nickel-plated coating is strong, and the composite material can adapt to severe working environments such as brazing or high-low temperature circulation.
Drawings
FIG. 1 is an SEM surface topography of a diamond-aluminum composite of the present invention, showing diamond particles distributed on an aluminum matrix.
FIGS. 2a and 2b show SEM images of the surface of the diamond-aluminum composite material after magnetron sputtering copper plating, and the diamond and the aluminum matrix are completely covered by copper.
FIGS. 3a and 3b are SEM images of fractures after electroless nickel plating of the diamond-aluminum composite of the present invention, and it can be seen that the thickness of the copper layer is about 2 μm and the thickness of the nickel layer is about 12.5 μm.
FIG. 4a is an SEM morphology of fractures after electroless nickel plating of the diamond-aluminum composite material of the present invention. FIG. 4b is a line scanning spectrum of Al, Cu, Ni elements at the fracture, and it can be seen that the thickness of the copper plating is about 2 μm.
FIGS. 5a and 5b are SEM images of the surface of the diamond-aluminum composite material after chemical nickel plating, and it can be seen that the substrate is covered by nickel, the nickel plating layer is uniform and compact, and the nickel cells are fine, which shows that the magnetron sputtering plating copper completely covers the substrate and provides a high-quality substrate for nickel plating.
FIGS. 6a and 6b show the optical surface morphology of the diamond-aluminum composite material after being chemically plated with nickel and thermally shocked (300 ℃) for 10 times, and it can be seen that the nickel plating layer has no bubbling phenomenon and cracks, which indicates that the composite material, the magnetron sputtering plating layer and the nickel plating layer have strong interfacial bonding force.
Detailed Description
The implementation relates to a magnetron sputtering coating method of a diamond-aluminum composite material. The diamond-aluminum composite material has the volume content of 50-65 vol% of diamond, and aluminum is pure aluminum or aluminum-silicon alloy.
Example 1:
the specific operation steps of the magnetron sputtering coating of the diamond-aluminum composite material (the volume fraction of diamond is 65 vol%; the matrix is Al-7 wt% Si alloy) are as follows:
1) and (3) completely removing pollutants on the surface of the composite material by using 2000-mesh sand paper, and then putting the composite material into absolute ethyl alcohol for ultrasonic cleaning for 2 min.
2) The chromium target and the copper target are arranged on a magnetron target in ultrahigh vacuum magnetron sputtering equipment, the purity of the chromium target and the purity of the copper target are both 99.99 percent, the diameter of the target material is 80mm, and the thickness of the target material is 3 mm.
3) And placing the cleaned diamond-aluminum composite material on a heating table top, and adjusting the distance between the composite material substrate and the target material.
4) Covering a vacuum cavity cover, opening the magnetron sputtering equipment, and vacuumizing the vacuum cavity to less than 5 x 10-4Pa。
5) Argon with the purity of 99.99 percent is introduced into the vacuum cavity, the flow rate is 30sccm, and the vacuum degree in the cavity is kept at 0.5 Pa.
6) Rotating the sample to be right above the chromium target, selecting a direct current magnetron sputtering mode, applying a bias voltage of-50V, and sputtering power of 100W. Pre-sputtering for 5 min; after pre-sputtering, the baffle is removed, and then sputtering chromium plating is carried out for 3min, wherein the thickness of the chromium plating layer is 200 nm.
7) The sample is rotated to be right above the copper target, a direct current magnetron sputtering mode is selected, a bias voltage of-50V is applied, and the sputtering power is 70W. Pre-sputtering for 5 min; after pre-sputtering, the baffle is removed, and then sputtering copper plating is carried out for 20min, wherein the thickness of the copper plating layer is 1 mu m.
8) After magnetron sputtering copper plating, the cavity is cooled for a period of time, and argon gas is stopped to be introduced. And opening the air release valve, taking out the sample when the temperature of the table top is cooled to room temperature, and enabling the surface coating of the sample to be uniform without plating leakage.
9) Annealing treatment: and putting the sample plated with the copper into a tubular furnace for annealing treatment, wherein the heating rate is 5 ℃/min, the annealing temperature is 160 ℃, the heat preservation time is 2h, and taking out the sample after furnace cooling.
Example 2:
the specific operation steps of the magnetron sputtering coating of the diamond-aluminum composite material (the volume fraction of diamond is 60 vol%; the matrix is pure aluminum) are as follows:
1) and (3) completely removing pollutants on the surface of the composite material by using 2000-mesh sand paper, and then putting the composite material into absolute ethyl alcohol for ultrasonic cleaning for 2 min.
2) The chromium target and the copper target are arranged on a magnetron target in ultrahigh vacuum magnetron sputtering equipment, the purity of the chromium target and the purity of the copper target are both 99.99 percent, the diameter of the target material is 80mm, and the thickness of the target material is 3 mm.
3) And placing the cleaned diamond-aluminum composite material on a heating table top, and adjusting the distance between the composite material substrate and the target material.
4) Covering a vacuum cavity cover, opening the magnetron sputtering equipment, and vacuumizing the vacuum cavity to less than 5 x 10-4Pa。
5) Argon with the purity of 99.99 percent is introduced into the vacuum cavity, the flow rate is 30sccm, and the vacuum degree in the cavity is kept at 0.5 Pa.
6) Rotating the sample to be right above the chromium target, selecting a direct current magnetron sputtering mode, applying a bias voltage of-50V, and sputtering power of 70W. Pre-sputtering for 5 min; after pre-sputtering, the baffle is removed, and then sputtering chromium plating is carried out for 7min, wherein the thickness of the chromium plating layer is 300 nm.
7) The sample is rotated to be right above the copper target, a direct current magnetron sputtering mode is selected, a bias voltage of-50V is applied, and the sputtering power is 50W. Pre-sputtering for 5 min; after pre-sputtering, the baffle is removed, and then sputtering copper plating is carried out for 40min, wherein the thickness of the copper plating layer is 1.4 mu m.
8) After magnetron sputtering copper plating, the cavity is cooled for a period of time, and argon gas is stopped to be introduced. And opening the air release valve, taking out the sample when the temperature of the table top is cooled to room temperature, and enabling the surface coating of the sample to be uniform without plating leakage.
9) Annealing treatment: and putting the sample plated with the copper into a tubular furnace for annealing treatment, wherein the heating rate is 5 ℃/min, the annealing temperature is 200 ℃, the heat preservation time is 1.5h, and taking out the sample after furnace cooling.
Example 3
The specific operation steps of the magnetron sputtering coating of the diamond-aluminum composite material (the volume fraction of diamond is 50 vol%; the matrix is Al-9 wt% Si alloy) are as follows:
1) and (3) completely removing pollutants on the surface of the composite material by using 2000-mesh sand paper, and then putting the composite material into absolute ethyl alcohol for ultrasonic cleaning for 2 min.
2) The chromium target and the copper target are arranged on a magnetron target in ultrahigh vacuum magnetron sputtering equipment, the purity of the chromium target and the purity of the copper target are both 99.99 percent, the diameter of the target material is 80mm, and the thickness of the target material is 3 mm.
3) And placing the cleaned diamond-aluminum composite material on a heating table top, and adjusting the distance between the composite material substrate and the target material.
4) Covering the vacuum chamber cover, and opening the magnetron sputtering deviceVacuum pumping the vacuum chamber to less than 5 × 10-4Pa。
5) Argon with the purity of 99.99 percent is introduced into the vacuum cavity, the flow rate is 30sccm, and the vacuum degree in the cavity is kept at 0.5 Pa.
6) Rotating the sample to be right above the chromium target, selecting a direct current magnetron sputtering mode, applying a bias voltage of-50V, and sputtering power of 50W. Pre-sputtering for 5 min; after pre-sputtering, the baffle is removed, and then sputtering chromium plating is carried out for 15min, wherein the thickness of the chromium plating layer is 500 nm.
7) The sample is rotated to be right above the copper target, a direct current magnetron sputtering mode is selected, a bias voltage of-50V is applied, and the sputtering power is 100W. Pre-sputtering for 5 min; after pre-sputtering, the baffle is removed, and then sputtering copper plating is carried out for 30min, wherein the thickness of the copper plating layer is 2 mu m.
8) After magnetron sputtering copper plating, the cavity is cooled for a period of time, and argon gas is stopped to be introduced. And opening the air release valve, taking out the sample when the temperature of the table top is cooled to room temperature, and enabling the surface coating of the sample to be uniform without plating leakage.
9) Annealing treatment: and putting the sample plated with the copper into a tubular furnace for annealing treatment, wherein the heating rate is 5 ℃/min, the annealing temperature is 230 ℃, the heat preservation time is 1h, and taking out the sample after furnace cooling.
Claims (10)
1. A magnetron sputtering coating method of a diamond-aluminum composite material is characterized by comprising the following specific steps:
1) pre-treating the diamond-aluminum composite material, including grinding and ultrasonic cleaning;
2) mounting a chromium target and a copper target on a magnetron target by adopting ultrahigh vacuum magnetron sputtering equipment, placing the cleaned diamond-aluminum composite material on a heating table top, and adjusting the distance between a composite material substrate and the target material;
3) covering a vacuum cavity cover, vacuumizing, and introducing argon; selecting a direct-current magnetron sputtering mode, performing magnetron sputtering chromium plating on the sample, and then performing magnetron sputtering copper plating;
4) after magnetron sputtering copper plating, cooling the cavity for a period of time, stopping introducing argon, opening a gas release valve, and taking out a sample when the temperature of the table top is cooled to room temperature;
5) annealing treatment: and (4) putting the copper-plated composite material into a tubular furnace for annealing treatment, and taking out after furnace cooling.
2. The magnetron sputtering coating method of the diamond-aluminum composite material according to claim 1, characterized in that: the diamond-aluminum composite material in the step 1) is flaky and has a flat surface.
3. The magnetron sputtering coating method of the diamond-aluminum composite material according to claim 1, characterized in that: and (2) in the grinding in the step 1), adopting 2000-mesh sand paper to completely remove the pollutants on the surface of the composite material.
4. The magnetron sputtering coating method of the diamond-aluminum composite material according to claim 1, characterized in that: in the ultrasonic cleaning in the step 1), absolute ethyl alcohol is used as a cleaning solution, and the ultrasonic cleaning time is 2 min.
5. The magnetron sputtering coating method of the diamond-aluminum composite material according to claim 1, characterized in that: the purity of the chromium target and the copper target in the step 2) is 99.99%.
6. The magnetron sputtering coating method of the diamond-aluminum composite material according to claim 1, characterized in that: the vacuum degree in the step 3) is extracted, and is less than 5 multiplied by 10-4Pa。
7. The magnetron sputtering coating method for the diamond-aluminum composite material according to claim 1, characterized in that: the purity of the argon in the step 3) is 99.99%, the flow rate is 30sccm, and the working pressure is 0.5 Pa.
8. The magnetron sputtering coating method of the diamond-aluminum composite material according to claim 1, characterized in that: performing magnetron sputtering chromium plating in the step 3), wherein the applied bias voltage is-50V, and the power is 50-100W; pre-sputtering for 5 min; and carrying out sputtering chromium plating for 3-15 min, wherein the thickness of the chromium layer is 200-500 nm.
9. The magnetron sputtering coating method of the diamond-aluminum composite material according to claim 1, characterized in that: carrying out magnetron sputtering copper plating in the step 3), wherein the applied bias voltage is-50V, and the power is 50-100W; pre-sputtering for 5 min; and carrying out sputtering copper plating for 20-40 min, wherein the thickness of the copper layer is 1-2 μm.
10. The magnetron sputtering coating method of the diamond-aluminum composite material according to claim 1, characterized in that: in the annealing treatment in the step 5), the temperature rise rate is 5 ℃/min, the annealing temperature is 160-230 ℃, and the heat preservation time is 1-2 h.
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| CN201910291811.4A CN109930125B (en) | 2019-04-12 | 2019-04-12 | Magnetron sputtering coating method for diamond-aluminum composite material |
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| CN113278931A (en) * | 2020-02-20 | 2021-08-20 | 核工业理化工程研究院 | Method for thickening magnetron sputtering coating on surface of composite material |
| CN111500892B (en) * | 2020-06-18 | 2021-08-31 | 哈尔滨锦威科技有限公司 | Preparation method of large-size flaky diamond/copper composite material with ultrahigh thermal conductivity |
| CN111992708B (en) * | 2020-08-30 | 2021-10-22 | 中南大学 | Method for preparing high-performance diamond/copper composite material |
| CN112647053A (en) * | 2020-12-17 | 2021-04-13 | 镇江晶鼎光电科技有限公司 | Method for improving binding force between different metal films through magnetron sputtering coating machine |
| CN116496760B (en) * | 2022-01-19 | 2024-08-06 | 中南大学 | Superhard material abrasive particles with multi-principal element medium/high entropy alloy coating layer and preparation method thereof |
| CN115322687B (en) * | 2022-09-23 | 2023-06-09 | 哈尔滨工业大学 | High-heat-conductivity phosphate-based inorganic insulating adhesive and bonding method thereof |
| CN116695078B (en) * | 2023-06-09 | 2024-02-23 | 深圳市博源碳晶科技有限公司 | Heat-conducting diamond composite material substrate and preparation method and application thereof |
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| CN106903832A (en) * | 2016-01-25 | 2017-06-30 | 宁波长阳科技股份有限公司 | A kind of mould roller and its manufacture method for brightness enhancement film shaping |
| CN105886849A (en) * | 2016-06-22 | 2016-08-24 | 哈尔滨工业大学 | Preparation method of W-plated diamond/aluminum composite |
| CN106854750A (en) * | 2016-12-06 | 2017-06-16 | 北京安泰钢研超硬材料制品有限责任公司 | A kind of diamond carbon/carbon-copper composite material and preparation method |
| CN108588690A (en) * | 2018-04-25 | 2018-09-28 | 东南大学 | A kind of chemical nickel plating method of diamond-aluminium composite material |
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