CN102065647A - Method for manufacturing thick-film ceramic composite substrate - Google Patents
Method for manufacturing thick-film ceramic composite substrate Download PDFInfo
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- CN102065647A CN102065647A CN2009102243045A CN200910224304A CN102065647A CN 102065647 A CN102065647 A CN 102065647A CN 2009102243045 A CN2009102243045 A CN 2009102243045A CN 200910224304 A CN200910224304 A CN 200910224304A CN 102065647 A CN102065647 A CN 102065647A
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- base plate
- thick film
- ceramic composite
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Abstract
The invention discloses a method for manufacturing a thick-film ceramic composite substrate. In the method, a vacuum diffusion and fusion procedure is carried out through a sealing cavity to ensure that a ceramic substrate can be tightly jointed with a metal thick film so as to form a ceramic composite substrate with a high-thickness thick film. By adopting the manufacturing procedure, the time and the cost for manufacturing the thick-film ceramic composite substrate can be greatly reduced.
Description
Technical field
The present invention relates to the ceramic composite substrate manufacturing technology, relate in particular to a kind of manufacture method of thick film ceramic composite base plate.
Background technology
Copper plated material is widely used in the various now industrial fields, as, in copper plating solution, plating copper cyanider solution and plating copper pyrophosphate solution, with direct current put on as the copper of anode with as the work companion chien shih cement copper of negative electrode on work package, or use plating solution for electroless copper plating manufactured copper precipitator workpiece, and be that the made work package of base material promptly is called the copper facing ceramic base material with the pottery.At present, the copper facing ceramic base material is widely used in the manufacturing of various electronic units, as, semiconductor subassembly, small-sized communication device, relay, chip carrier and pendant dike leaf assembly etc.
Traditional manufacture be in ceramic surface use acid, processing and accept electroless copper such as sandblast.Other mode then uses the dry film method to use another kind of metal on ceramic base material, as, vapour deposition applies copper facing again, and aforesaid another kind of metal can use Co, Nb, Ta, Ti, Cu-Ni-Cr alloy, Mo or W.The method of traditional manufacturing copper facing ceramic base material is as follows:
1, copper film or copper coin directly are engaged on the ceramic base material, as American Ceramic Society's periodical 61,1978, author A.K.Varchneya and R.J.Petti are described;
2, electric conducting material is stuck with paste, and is applied on the ceramic base material by printing or other method as silver, gold, copper and nickel, directly carries out carrying out coating after the heating of coating or hundreds of degree.
Above-mentioned copper mean particle dia by the electroless copper precipitation is big, so copper particulate and ceramic base material surface imperfection contact area partly is little.Anchoring effect is poor, and the tackness between copper particulate and ceramic base material is low.In addition, the precipitation particulate is big, and recess becomes the space, handles chemicals and is attached to recess and reduces tackness.Adopt conductibility to stick with paste in the latter, and particle size be the particle size of electroless copper from 20 to 30 times, so the contact area between conductive of material particulate and ceramic base material diminishes, the result causes the bad and tackness of anchoring effect to reduce.
In addition, Japan Patent is announced (KOKOKU) 63-4336 in early days and is then proposed a kind of method that does not form copper film before forming copper film in carrying out roughening to handle on the substrate surface on ceramic base material for 3-69191 number.This method is to use to comprise at least a slurries that are selected from person in copper, zinc, cadmium, bismuth and the lead on the ceramic base material surface, forms priming coat.Be coated with the base material precipitation priming coat metal or alloy particle of priming coat in heating in the non-oxidizing atmosphere under the temperature between 350 ℃ and 900 ℃ after, by comprising the solution-treated of palladium and/or platinum ion, with palladium and/or platinum displacement metal or alloy particle surface.Afterwards, form nickel, cobalt or copper metal film on the priming coat treated on the ceramic base material by being electroless plated in.But the Prior Art specification shows that the determined copper film optimum adhesion of example intensity only has 2.75kg/5mm φ, that is, and and 0.56kg/4mm
2Need further improve the adhesion strength of copper film.
In the another kind of prior art that has disclosed, by being electroless plated in such as forming the copper priming coat of thickness between between 0.5 μ m and 2 μ m on the ceramic base materials such as aluminium oxide.The base material that applies through bottom forms copper oxide in heating in the oxidation environment under the temperature between 300 ℃ and 900 ℃ on ceramic base material.Copper oxide is in heating in reducing environment under the temperature between 200 ℃ and 900 ℃; Copper oxide is reduced into metal copper layer.Form the copper film of thickness between between 0.5 μ m and 2 μ m on the metal copper layer by being electroless plated in, also can form extra copper film on the copper film, obtain desired thickness by being plated on.But in this method, the adhesion strength between metal copper layer and copper film can't substantially improve, because metal copper layer is poor to the used electroplate liquid wetability of electroless-plating.In addition, because need to control reducing environment down in high temperature, formation-metal copper layer is so need expensive and special stove and accessory.
No matter the making of aforementioned or at present known composite ceramic substrate, being all film handles, it all must form a thin film metal layer earlier on ceramic substrate, carry out subsequent treatment again, if desire forms the thick film metal layer on ceramic substrate, not only need to be shaped repeatedly, and can't form uniform thickness, it is consuming time, consumption power, and cost is surprising.Therefore, how to form thick film substrate is then desired most ardently solution for present industry problem.
Summary of the invention
In view of this, main purpose of the present invention is to provide a kind of manufacture method of thick film ceramic composite base plate,, and form one and have high thickness thick film ceramic composite base plate so that ceramic substrate can be through this summary procedure and metal thick film fluid-tight engagement by in an airtight cavity, carrying out vacuum diffusion fusion program.
For achieving the above object, technical scheme of the present invention is achieved in that
A kind of manufacture method of thick film ceramic composite base plate, this manufacture method comprises:
Carry out a metal coating program, to form a coat of metal on the surface of a ceramic substrate;
Carry out an assembly program putting a metallic plate on the surface of the described coat of metal of this ceramic substrate, and form an assembling ceramic substrate;
Carry out vacuum diffusion fusion program, merging the described coat of metal and this metallic plate on the described assembling ceramic substrate, and form a thick film ceramic composite base plate.
Wherein, described metal coating program further comprises a plating step.
Described metal coating program further comprises a sputter step.
Described vacuum diffusion fusion program is carried out in an airtight cavity.
Described airtight cavity comprises that a vacuum system, heats system, a cooling system and a compression system.
Described compression system further comprises graphite anchor clamps.
Wherein, described vacuum diffusion fusion program further comprises:
Carry out one first and heat step;
Carry out a constant temperature step;
Carry out one second and heat step;
Carry out a pressurization fusion steps;
Carry out one first cooling step; With
Carry out one second cooling step, to force to be cooled to room temperature.
Wherein, described first heat step and need carry out 60 minutes.
The described first operation vacuum degree that heats step is 10
-3To 10
-1Torr.
Described constant temperature step need be carried out 30 minutes.
The operation vacuum degree of described constant temperature step is 10
-9To 10
-3Torr.
Described second heats step need carry out 30 minutes.
The described second operation vacuum degree that heats step is 10
-9To 10
-3Torr.
Described pressurization fusion steps need be carried out 180 minutes.
Described pressurization fusion steps operation vacuum degree is 10
-9To 10
-3Torr
Described first cooling step need carry out 60 minutes.
The operation vacuum degree of described first cooling step is 10
-9To 10
-3Torr
Described second cooling step need carry out 120 minutes.
The material of described metallic plate further comprises copper.
Described first operating temperature that heats step is heated to 400 ℃ by room temperature.
The operating temperature of described constant temperature step is maintained at 400 ℃.
Described second heats step heats to 700 ℃～900 ℃ by 400 ℃.
The operating temperature of described pressurization fusion steps is maintained at 700 ℃～900 ℃.
When described pressurization fusion steps is carried out, start this compression system bringing pressure to bear between this metallic plate and this coat of metal, and its operating pressure is by 20kg/cm
2Be pressurized to 700kg/cm gradually
2～800kg/cm
2
When described first cooling step carried out, the operating pressure of graphite anchor clamps was maintained at 700kg/cm
2～800kg/cm
2
When described first cooling step carried out, the operating temperature of this first cooling step was cooled to 400 ℃ gradually.
When described second cooling step carried out, the operating temperature of this second cooling step continued to cool back room temperature by 400 ℃, and the operating pressure of this second cooling step discharges.
The material of described metallic plate further comprises aluminium.
Described first operating temperature that heats step is heated to 300 ℃ by room temperature.
The operating temperature of described constant temperature step is maintained at 300 ℃.
Described second operating temperature that heats step heats to 500 ℃～650 ℃ by 300 ℃.
The operating temperature of described pressurization fusion steps is maintained at 500 ℃～650 ℃.
When described pressurization fusion steps is carried out, start described compression system bringing pressure to bear between this metallic plate and this coat of metal, and its operating pressure is by 20kg/cm
2Be pressurized to 400kg/cm gradually
2～500kg/cm
2
When described first cooling step carried out, the operating pressure of these graphite anchor clamps was maintained at 400kg/cm
2～500kg/cm
2
When described first cooling step carried out, the operating temperature of this first cooling step was cooled to 300 ℃ gradually.
When described second cooling step carried out, the operating temperature of this second cooling step continued to cool back room temperature by 300 ℃, and the operating pressure of this second cooling step discharges.
The film thickness of described thick film ceramic composite base plate is more than or equal to 0.03mm.
The manufacture method of thick film ceramic composite base plate provided by the present invention has the following advantages:
The manufacture method of thick film ceramic composite base plate of the present invention, by an internally provided with vacuum system, heat system, the airtight cavity of cooling system carries out vacuum diffusion fusion program, and pass through the graphite anchor clamps with metal material (copper, aluminium and coating pottery) seize on both sides by the arms up and down to coincide fixing, then the equipment cavity is vacuumized, and heat up when uniform temperature and vacuum degree, press in graphite anchor clamps top, so that these metal material (copper, or aluminium, or coating pottery) carries out vacuum diffusion fusion program, be cooled to normal temperature at last, promptly finish thick film ceramic composite base plate of the present invention, adopt processing procedure of the present invention can greatly reduce time and the cost of making the thick film ceramic composite base plate.
Description of drawings
Fig. 1 is the formation schematic diagram of thick film ceramic composite base plate of the present invention;
Fig. 2 is the manufacture method schematic flow sheet of thick film ceramic composite base plate of the present invention;
Fig. 3 is the vacuum diffusion fusion process schematic diagram of the manufacture method of thick film ceramic composite base plate of the present invention.
[primary clustering symbol description]
100: ceramic substrate
110: the coat of metal
120: metallic plate
130: the assembling ceramic substrate
140: the graphite anchor clamps
150: airtight cavity
210: the metal coating program
220: assembly program
230: vacuum diffusion fusion program
Heat step at 310: the first
320: the constant temperature step
Heat step at 330: the second
340: the pressurization fusion steps
350: the first cooling steps
360: the second cooling steps
Embodiment
Below in conjunction with accompanying drawing and embodiments of the invention method of the present invention is described in further detail.
The present invention describes a kind of manufacture method of thick film ceramic composite base plate at this, in order to understand the present invention up hill and dale, will propose detailed structure and assembly thereof in following description.Apparently, execution of the present invention is not defined in the specific details that skill person had the knack of of ceramic composite substrate.On the other hand, well-known structure and assembly thereof are not described in the details, with the restriction of avoiding causing the present invention unnecessary.Preferred embodiment meeting of the present invention is described in detail as follows, yet except these were described in detail, the present invention can also implement in other embodiments widely, and scope of the present invention do not limited, its with after claim be as the criterion.
The preferable enforcement example one of according to the present invention, as Fig. 1 and shown in Figure 2, the invention provides a kind of manufacture method of thick film ceramic composite base plate, its method is as follows: at first provide a ceramic substrate 100 to carry out a metal coating program 210, this metal coating program 210 further comprises a plating step or a sputter step, and forming a coat of metal 110 on the surface of ceramic substrate 100, the material of this coat of metal 110 further comprises copper or aluminium.Afterwards, carry out an assembly program 220, and form an assembling ceramic substrate 130 so that metallic plate 120 is placed on the surface of the coat of metal 110 of ceramic substrate 100.Then, to assemble ceramic substrate 130 places on one of compression system graphite anchor clamps 140, carry out vacuum diffusion fusion program 230, so that the metallic plate 120 on the assembling ceramic substrate 130 can merge mutually with the coat of metal 110, and form a thick film ceramic composite base plate, wherein, the film thickness of above-mentioned ceramic composite substrate is approximately more than or equal to 0.03mm.
With reference to figure 3, above-mentioned vacuum diffusion fusion program 230 is carried out in an airtight cavity 150, and this airtight cavity 150 comprises that further a vacuum system, heats system, a cooling system and a compression system.Above-mentioned vacuum diffusion fusion program 230 further comprises: at first carry out one first and heat step 310, wherein, first heats step 310 need carry out about 60 minutes, and its operation vacuum degree is about 10
-3To 10
-1Torr; Carry out a constant temperature step 320 then, wherein, constant temperature step 320 need be carried out about 30 minutes, and its operation vacuum degree is about 10
-9To 10
-3Torr; Then, carry out one second and heat step 330, wherein, second heats step 330 need carry out about 30 minutes, and its operation vacuum degree is about 10
-9To 10
-3Torr; Secondly, carry out a pressurization fusion steps 340, wherein, pressurization fusion steps 340 need be carried out about 180 minutes, and its operation vacuum degree is about 10
-9To 10
-3Torr; Thereafter, carry out one first cooling step 350, wherein, first cooling step 350 need carry out about 60 minutes, and its operation vacuum degree is about 10
-9To 10
-3Torr; At last, carry out one second cooling step 360, to force being cooled to promptly 20 ℃ of room temperatures, wherein, second cooling step 360 need carry out about 120 minutes.
When the metal material of the assembling ceramic substrate 130 on placing graphite anchor clamps 140 is copper, the first above-mentioned operating temperature that heats step 310 is heated to 400 ℃ by room temperature, and the operating temperature of constant temperature step 320 is maintained at 400 ℃, and above-mentioned second heats step 330 and heat once more to 700 ℃～900 ℃ by 400 ℃.In addition, the operating temperature of above-mentioned pressurization fusion steps 340 is maintained at 700 ℃～900 ℃, and the graphite anchor clamps 140 that start compression system when carrying out this pressurization fusion steps 340 are to bring pressure to bear between the metallic plate 120 and the coat of metal 110, and the operating pressure of graphite anchor clamps 140 is by 20kg/cm
2Be pressurized to 700kg/cm gradually
2～800kg/cm
2Moreover when proceeding to first cooling step 350, the operating pressure of graphite anchor clamps 140 is kept 700kg/cm
2～800kg/cm
2, and operating temperature is cooled to 400 ℃ gradually.At last, the operating temperature of second cooling step 360 continues to cool back room temperature by 400 ℃, and the operating pressure of second cooling step 360 discharges.
When the metal material of the assembling ceramic substrate 130 on placing graphite anchor clamps 140 is aluminium, the first above-mentioned operating temperature that heats step 310 is heated to 300 ℃ by room temperature, and the operating temperature of constant temperature step 320 is maintained at 300 ℃, and above-mentioned second heats step 330 and heat once more to 500 ℃～650 ℃ by 300 ℃.In addition, the operating temperature of above-mentioned pressurization fusion steps 340 is maintained at 500 ℃～650 ℃, and the graphite anchor clamps 140 that start compression system when carrying out this pressurization fusion steps 340 are to bring pressure to bear between the metallic plate 120 and the coat of metal 110, and the operating pressure of graphite anchor clamps 140 is by 20kg/cm
2Be pressurized to 400kgcm gradually
2～500kg/cm
2Moreover when proceeding to first cooling step 350, the operating pressure of graphite anchor clamps 140 is kept 400kg/cm
2～500kg/cm
2, and operating temperature is cooled to 300 ℃ gradually.At last, the operating temperature of second cooling step 360 continues to cool back room temperature by 300 ℃, and the operating pressure of second cooling step 360 discharges.
Apparently, according to the description among the top embodiment, the present invention has many corrections and difference.Therefore need be understood in the scope of its additional claim item, except above-mentioned detailed description, the present invention can also implement widely in other embodiments.
The above is preferred embodiment of the present invention only, is not to be used to limit protection scope of the present invention.
Claims (37)
1. the manufacture method of a thick film ceramic composite base plate is characterized in that, this manufacture method comprises:
Carry out a metal coating program, to form a coat of metal on the surface of a ceramic substrate;
Carry out an assembly program putting a metallic plate on the surface of the described coat of metal of this ceramic substrate, and form an assembling ceramic substrate;
Carry out vacuum diffusion fusion program, merging the described coat of metal and this metallic plate on the described assembling ceramic substrate, and form a thick film ceramic composite base plate.
2. the manufacture method of thick film ceramic composite base plate according to claim 1 is characterized in that, described metal coating program further comprises a plating step.
3. the manufacture method of thick film ceramic composite base plate according to claim 1 is characterized in that, described metal coating program further comprises a sputter step.
4. the manufacture method of thick film ceramic composite base plate according to claim 1 is characterized in that, described vacuum diffusion fusion program is carried out in an airtight cavity.
5. the manufacture method of thick film ceramic composite base plate according to claim 4 is characterized in that, described airtight cavity comprises that a vacuum system, heats system, a cooling system and a compression system.
6. the manufacture method of thick film ceramic composite base plate according to claim 5 is characterized in that, described compression system further comprises graphite anchor clamps.
7. the manufacture method of thick film ceramic composite base plate according to claim 1 is characterized in that, described vacuum diffusion fusion program further comprises:
Carry out one first and heat step;
Carry out a constant temperature step;
Carry out one second and heat step;
Carry out a pressurization fusion steps;
Carry out one first cooling step; With
Carry out one second cooling step, to force to be cooled to room temperature.
8. the manufacture method of thick film ceramic composite base plate according to claim 7 is characterized in that, described first heats step need carry out 60 minutes.
9. the manufacture method of thick film ceramic composite base plate according to claim 7 is characterized in that, the described first operation vacuum degree that heats step is 10
-3To 10
-1Torr.
10. the manufacture method of thick film ceramic composite base plate according to claim 7 is characterized in that, described constant temperature step need be carried out 30 minutes.
11. the manufacture method of thick film ceramic composite base plate according to claim 7 is characterized in that, the operation vacuum degree of described constant temperature step is 10
-9To 10
-3Torr.
12. the manufacture method of thick film ceramic composite base plate according to claim 7 is characterized in that, described second heats step need carry out 30 minutes.
13. the manufacture method of thick film ceramic composite base plate according to claim 7 is characterized in that, the described second operation vacuum degree that heats step is 10
-9To 10
-3Torr.
14. the manufacture method of thick film ceramic composite base plate according to claim 7 is characterized in that, described pressurization fusion steps need be carried out 180 minutes.
15. the manufacture method of thick film ceramic composite base plate according to claim 7 is characterized in that, described pressurization fusion steps operation vacuum degree is 10
-9To 10
-3Torr.
16. the manufacture method of thick film ceramic composite base plate according to claim 7 is characterized in that, described first cooling step need carry out 60 minutes.
17. the manufacture method of thick film ceramic composite base plate according to claim 7 is characterized in that, the operation vacuum degree of described first cooling step is 10
-9To 10
-3Torr.
18. the manufacture method of thick film ceramic composite base plate according to claim 7 is characterized in that, described second cooling step need carry out 120 minutes.
19. the manufacture method of thick film ceramic composite base plate according to claim 7 is characterized in that, the material of described metallic plate further comprises copper.
20. the manufacture method of thick film ceramic composite base plate according to claim 19 is characterized in that, described first operating temperature that heats step is heated to 400 ℃ by room temperature.
21. the manufacture method of thick film ceramic composite base plate according to claim 19 is characterized in that, the operating temperature of described constant temperature step is maintained at 400 ℃.
22. the manufacture method of thick film ceramic composite base plate according to claim 19 is characterized in that, described second heats step heats to 700 ℃～900 ℃ by 400 ℃.
23. the manufacture method of thick film ceramic composite base plate according to claim 19 is characterized in that, the operating temperature of described pressurization fusion steps is maintained at 700 ℃～900 ℃.
24. the manufacture method of thick film ceramic composite base plate according to claim 19 is characterized in that, when described pressurization fusion steps is carried out, start this compression system bringing pressure to bear between this metallic plate and this coat of metal, and its operating pressure is by 20kg/cm
2Be pressurized to 700kg/cm gradually
2～800kg/cm
2
25. the manufacture method of thick film ceramic composite base plate according to claim 19 is characterized in that, when described first cooling step carried out, the operating pressure of graphite anchor clamps was maintained at 700kg/cm
2～800kg/cm
2
26. the manufacture method of thick film ceramic composite base plate according to claim 19 is characterized in that, when described first cooling step carried out, the operating temperature of this first cooling step was cooled to 400 ℃ gradually.
27. the manufacture method of thick film ceramic composite base plate according to claim 19, it is characterized in that, when described second cooling step carried out, the operating temperature of this second cooling step continued to cool back room temperature by 400 ℃, and the operating pressure of this second cooling step discharges.
28. the manufacture method of thick film ceramic composite base plate according to claim 7 is characterized in that, the material of described metallic plate further comprises aluminium.
29. the manufacture method of thick film ceramic composite base plate according to claim 28 is characterized in that, described first operating temperature that heats step is heated to 300 ℃ by room temperature.
30. the manufacture method of thick film ceramic composite base plate according to claim 28 is characterized in that, the operating temperature of described constant temperature step is maintained at 300 ℃.
31. the manufacture method of thick film ceramic composite base plate according to claim 28 is characterized in that, described second operating temperature that heats step heats to 500 ℃～650 ℃ by 300 ℃.
32. the manufacture method of thick film ceramic composite base plate according to claim 28 is characterized in that, the operating temperature of described pressurization fusion steps is maintained at 500 ℃～650 ℃.
33. the manufacture method of thick film ceramic composite base plate according to claim 28 is characterized in that, when described pressurization fusion steps is carried out, start described compression system bringing pressure to bear between this metallic plate and this coat of metal, and its operating pressure is by 20kg/cm
2Be pressurized to 400kg/cm gradually
2～500kg/cm
2
34. the manufacture method of thick film ceramic composite base plate according to claim 28 is characterized in that, when described first cooling step carried out, the operating pressure of these graphite anchor clamps was maintained at 400kg/cm
2～500kg/cm
2
35. the manufacture method of thick film ceramic composite base plate according to claim 28 is characterized in that, when described first cooling step carried out, the operating temperature of this first cooling step was cooled to 300 ℃ gradually.
36. the manufacture method of thick film ceramic composite base plate according to claim 28, it is characterized in that, when described second cooling step carried out, the operating temperature of this second cooling step continued to cool back room temperature by 300 ℃, and the operating pressure of this second cooling step discharges.
37. the manufacture method of thick film ceramic composite base plate according to claim 1 is characterized in that, the film thickness of described thick film ceramic composite base plate is more than or equal to 0.03mm.
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|---|---|---|---|
| CN2009102243045A CN102065647A (en) | 2009-11-17 | 2009-11-17 | Method for manufacturing thick-film ceramic composite substrate |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102555033A (en) * | 2011-12-21 | 2012-07-11 | 中国电子科技集团公司第五十五研究所 | Flow filling lamination forming method of multilayer ceramic cavity body |
| CN102699986A (en) * | 2012-04-25 | 2012-10-03 | 中国电子科技集团公司第五十五研究所 | Molding method of complicated two-side cavity structure with multilayer ceramics |
| CN102922828A (en) * | 2012-10-24 | 2013-02-13 | 浙江工贸职业技术学院 | Composite board of copper-foil-bonded ceramic substrate and preparation method of composite board |
| CN103474401A (en) * | 2012-06-06 | 2013-12-25 | 欣兴电子股份有限公司 | Support plate structure and chip packaging structure and manufacturing method thereof |
-
2009
- 2009-11-17 CN CN2009102243045A patent/CN102065647A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102555033A (en) * | 2011-12-21 | 2012-07-11 | 中国电子科技集团公司第五十五研究所 | Flow filling lamination forming method of multilayer ceramic cavity body |
| CN102699986A (en) * | 2012-04-25 | 2012-10-03 | 中国电子科技集团公司第五十五研究所 | Molding method of complicated two-side cavity structure with multilayer ceramics |
| CN102699986B (en) * | 2012-04-25 | 2014-06-11 | 中国电子科技集团公司第五十五研究所 | Molding method of complicated two-side cavity structure with multilayer ceramics |
| CN103474401A (en) * | 2012-06-06 | 2013-12-25 | 欣兴电子股份有限公司 | Support plate structure and chip packaging structure and manufacturing method thereof |
| CN102922828A (en) * | 2012-10-24 | 2013-02-13 | 浙江工贸职业技术学院 | Composite board of copper-foil-bonded ceramic substrate and preparation method of composite board |
| CN102922828B (en) * | 2012-10-24 | 2015-04-22 | 浙江工贸职业技术学院 | Composite board of copper-foil-bonded ceramic substrate and preparation method of composite board |
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Application publication date: 20110518 |