CN107642767A - L ED heat dissipation substrate surface adhesive-free super-heat-conduction composite coating, L ED heat dissipation substrate and preparation method thereof - Google Patents
L ED heat dissipation substrate surface adhesive-free super-heat-conduction composite coating, L ED heat dissipation substrate and preparation method thereof Download PDFInfo
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- CN107642767A CN107642767A CN201710889868.5A CN201710889868A CN107642767A CN 107642767 A CN107642767 A CN 107642767A CN 201710889868 A CN201710889868 A CN 201710889868A CN 107642767 A CN107642767 A CN 107642767A
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- 239000000758 substrate Substances 0.000 title claims abstract description 49
- 238000000576 coating method Methods 0.000 title claims abstract description 36
- 239000011248 coating agent Substances 0.000 title claims abstract description 35
- 239000002131 composite material Substances 0.000 title claims abstract description 33
- 238000002360 preparation method Methods 0.000 title claims abstract description 25
- 230000017525 heat dissipation Effects 0.000 title abstract 5
- 239000007789 gas Substances 0.000 claims abstract description 48
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 44
- 229910052802 copper Inorganic materials 0.000 claims abstract description 44
- 239000010949 copper Substances 0.000 claims abstract description 44
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims abstract description 36
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 29
- 238000007733 ion plating Methods 0.000 claims abstract description 21
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229910052786 argon Inorganic materials 0.000 claims abstract description 18
- 150000001335 aliphatic alkanes Chemical class 0.000 claims abstract description 17
- 238000001704 evaporation Methods 0.000 claims abstract description 6
- 230000008020 evaporation Effects 0.000 claims abstract description 6
- 239000000463 material Substances 0.000 claims description 43
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 30
- 229910052782 aluminium Inorganic materials 0.000 claims description 30
- 239000003292 glue Substances 0.000 claims description 29
- 239000004411 aluminium Substances 0.000 claims description 27
- 229920000297 Rayon Polymers 0.000 claims description 22
- 239000013077 target material Substances 0.000 claims description 21
- 230000005855 radiation Effects 0.000 claims description 16
- 238000004062 sedimentation Methods 0.000 claims description 16
- 229910000838 Al alloy Inorganic materials 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 13
- 238000000151 deposition Methods 0.000 abstract description 8
- 239000010410 layer Substances 0.000 description 67
- 230000004888 barrier function Effects 0.000 description 14
- 230000001105 regulatory effect Effects 0.000 description 12
- 239000011159 matrix material Substances 0.000 description 7
- 238000004140 cleaning Methods 0.000 description 6
- 230000008021 deposition Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000009413 insulation Methods 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 3
- 239000004568 cement Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000002923 metal particle Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
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Abstract
The invention discloses a L ED heat dissipation substrate surface adhesive-free superconductive heat composite coating, a L ED heat dissipation substrate and a preparation method thereof, wherein the composite coating comprises a diamond-like carbon film layer covered on a substrate layer and a pure copper layer covered on the diamond-like carbon film layer, the L ED heat dissipation substrate comprises a substrate layer and an adhesive-free superconductive heat composite coating covered on the substrate layer, and the preparation method comprises the following steps of (1) taking a carbon target as an evaporation source, taking mixed gas of argon and alkane gas as working gas, and depositing the diamond-like carbon film layer on the surface of the substrate layer by adopting an ion plating process, and (2) taking a copper target as the evaporation source, and taking argon as the working gas, and depositing the pure copper layer on the surface of the diamond-like carbon film layer by adopting the ion plating process.
Description
Technical field
The invention belongs to material manufacture technical field, and in particular to be answered without viscose glue heat superconducting on a kind of LED heat radiating materials surface
Close coating, great power LED heat-radiating substrate and preparation method thereof.
Background technology
LED light source heat dispersion within the long life serve phase is most important.The good gold of usual heat-radiating substrate heat dispersion
Category substrate, play the insulating barrier of bonding and insulating heat-conductive function and high current can be carried and be easy to the line of device assembling and connection
Road floor this three parts composition.Because common aluminium alloy has good a thermal conductivity and machining property, in usual LED industry with
Based on aluminium base.Currently, mainly comprising aluminium alloy plate base material, an insulation in the cross section structure of the radiator aluminium base plate in LED industry
About hundred microns of thickness of heat conduction and bonding effect simultaneously adulterate the insulation adhesive-layer of thermal conductive metal particle and can carry high current and easy
In the rolling layers of copper three parts composition that device assembles and connects.
Currently, develop with the high-power development trend of LED industry, the military service performance for heat-radiating substrate proposes more
Harsh requirement.About hundred microns of thickness of insulating heat-conductive and bonding effect are played in traditional aluminium base and adulterate the exhausted of thermal conductive metal particle
Edge adhesive-layer because glue brush, apply technique limit without the decline space on thickness；But the thickness is exactly that LED light source heat sheds
Necessary passage.Therefore, exploitation is a kind of alternative or surmounts when front insulation layer acts on, and be greatly reduced thickness of insulating layer, can
It is particularly important suitable for the New LED aluminium base used in great power LED cooling.
The content of the invention
The technical problem to be solved in the present invention is overcome the deficiencies in the prior art, there is provided it is a kind of without insulating cement, heat transfer away from
From LED heat radiation substrate short, that thermal conductivity factor is high, heat-sinking capability is strong, correspondingly provide that a kind of production procedure is short, process costs are low
The preparation method of above-mentioned LED heat radiation substrate.
In order to solve the above technical problems, the present invention uses following technical scheme：
A kind of LED heat radiating materials surface is without viscose glue heat superconducting composite coating, including the heat conductive insulating being covered on substrate layer
Layer and the circuit layer that is covered in thermally conductive insulating layer, it is characterised in that the thermally conductive insulating layer is diamond-like-carbon film layer, institute
It is pure copper layer to state circuit layer.
Preferably, the thickness of the diamond-like-carbon film layer is 15 μm~50 μm, and the thickness of the pure copper layer is 15 μ
M~40 μm.
Preferably, the pure copper layer all standing in diamond-like-carbon film surface or local complexity in diamond-like-carbon film layer
Surface.
The inventive concept total as one, the present invention also provide a kind of LED heat radiation substrate, including substrate layer and covering
Above-mentioned LED heat radiating materials surface on substrate layer is without viscose glue heat superconducting composite coating.
Preferably, the substrate layer is metal-based layer.
Preferably, the metal-based layer is aluminum base layer, and the aluminum base layer material is 1000 systems, 5000 systems and 6000 are that aluminium closes
One kind in gold.
The inventive concept total as one, the present invention also provide a kind of preparation method of above-mentioned LED heat radiation substrate, including
Following steps：
(1) using carbon target material as evaporation source, using the mixed gas of argon gas and alkanes gas as working gas, in vacuum condition
It is lower that one layer of diamond-like-carbon film layer is deposited in base material layer surface using ion plating；
(2) using copper target material as evaporation source, using argon gas as working gas, under vacuum using ion plating in eka-gold
Diamond carbon film layer surface deposits one layer of pure copper layer.
Preferably, in the step (1), operating air pressure is 1.0 × 10-1Pa~9.5 × 10-1Pa, the alkanes gas
Partial pressure≤80%.
Preferably, in the step (1), the power density of carbon target material is 0.005A/cm2~0.5A/cm2, sedimentation time is
60min~300min.
Preferably, in the step (2), operating air pressure is 1.0 × 10-1Pa~9.5 × 10-1Pa, the power of copper target material are close
Degree regulation and control are in 0.1A/cm2~0.5A/cm2, sedimentation time is 20min~120min.
Preferably, before plated film, the basic unit being fixed on machine frame is delivered to the vacuum of ion plating equipment by drive device
In chamber；The machine frame keeps the linear motion that speed is 1mm/min~500mm/min in coating process, controls frock
The distance between base material and each target are 20mm~120mm on frame；The background vacuum of the vacuum chamber no more than 6.0 ×
10-3Pa。
Compared with prior art, the advantage of the invention is that：
The LED heat radiation substrate of the present invention, relatively thin diamond-like is deposited in aluminium base layer surface using physical gas-phase deposite method
Stone carbon film (DLC) layer, to substitute original insulation adhesive-layer, no viscose glue shaping LED heat radiation substrate is realized, is not dropped in insulating properties
While low, the capacity of heat transmission of this layer can be greatly improved and significantly shorten heat-transfer path；And use physical gas-phase deposite method system
Standby pure copper layer substitutes original current-carrying heat conduction rolling layers of copper, and production cost can be also reduced while simplifying production technology.Therefore, originally
Aluminium base has without insulating cement after inventive method processing, production procedure is short, preparation cost is low, heat transfer distances are short, thermal conductivity factor
The characteristic high, heat-sinking capability is strong etc., can meet the requirement of great power LED long life serve phase.
Brief description of the drawings
Fig. 1 is the cross-section morphology figure of LED heat radiation substrate prepared by embodiment 5.
Embodiment
Below in conjunction with specific preferred embodiment, the invention will be further described, but not thereby limiting the invention
Protection domain.
The filming equipment that embodiment 1~6 uses is continous way ion plating equipment, and the vacuum chamber of the ion plating equipment includes
At least two working vacuum chambers and the multiple auxiliary vacuum chambers for being connected to the working vacuum chamber both sides, it is described two
High purity solid carbon target material and copper target material are respectively arranged with working vacuum chamber and all kinds of working gas can be passed through, insertion is whole true
Plenum chamber is horizontally disposed machine frame, and drive device is connected with the machine frame.
Embodiment 1：
The preparation method of great power LED heat-radiating substrate of the present invention, by ion plating in substrate surface deposition without viscous
Glue heat superconducting composite coating, specifically includes following steps：
Step 1：It is aluminium base base material to choose 1000 line aluminium alloys, cleaning treatment before being carried out to base material；
Step 2：Cleaned base material before step 1 is positioned on machine frame, delivered to base material by drive device
In the vacuum chamber of ion plating equipment；The machine frame keeps the speed to be in without viscose glue heat superconducting composite coating preparation process
10mm/min linear motion, it is 30mm to control the distance between matrix and each target on machine frame；To whole vacuum chamber
Vacuumized, the background vacuum of working vacuum chamber is not more than 6.0 × 10-3Pa。
Step 3：In LED DLC insulating barriers are deposited with aluminium base plate surface
Argon gas and alkanes (CH will be continually fed into working vacuum chamber4) mixed gas, wherein, alkanes gas point
Press as 80%, and ensure that the operating air pressure of working vacuum chamber is 1.0 × 10-1Pa；
The power density of carbon target material is regulated and controled in 0.45A/cm2In the range of, sedimentation time 270min.
Step 4：Fine copper current-carrying heat-conducting layer is deposited in DLC surface of insulating layer
Argon gas is continually fed into as working gas using in working vacuum chamber, and ensures the operating air pressure of working vacuum chamber
For 1.0 × 10-1Pa；Plasma electrical source is then turned on after base material synchronization radical occlusion device is first enabled in this step, to realize that DLC insulate
The local copper-plating technique of layer surface.
The power density of copper target material is regulated and controled in 0.4A/cm2In the range of, sedimentation time 120min.
Aluminium base surface manufactured in the present embodiment without viscose glue heat superconducting composite coating (DLC insulating barriers+fine copper current-carrying heat conduction
Layer) gross thickness be 88 μm, wherein DLC thickness of insulating layer be 48 μm, fine copper current-carrying heat-conducting layer thickness be 40 μm.
Embodiment 2：
The preparation method of great power LED heat-radiating substrate of the present invention, by ion plating in substrate surface deposition without viscous
Glue heat superconducting composite coating, specifically includes following steps：
Step 1：It is aluminium base base material to choose 1000 line aluminium alloys, cleaning treatment before being carried out to base material；
Step 2：Cleaned base material before step 1 is positioned on machine frame, delivered to base material by drive device
In the vacuum chamber of ion plating equipment；The machine frame keeps the speed to be in without viscose glue heat superconducting composite coating preparation process
80mm/min linear motion, it is 45mm to control the distance between matrix and each target on machine frame；To whole vacuum chamber
Vacuumized, the background vacuum of working vacuum chamber is not more than 6.0 × 10-3Pa。
Step 3：In LED DLC insulating barriers are deposited with aluminium base plate surface
Argon gas and alkanes (C will be continually fed into working vacuum chamber2H6) mixed gas, wherein, alkanes gas point
Press as 20%, and ensure that the operating air pressure of working vacuum chamber is 1.8 × 10-1Pa；
The power density of carbon target material is regulated and controled in 0.35A/cm2In the range of, sedimentation time 220min.
Step 4：Fine copper current-carrying heat-conducting layer is deposited in DLC surface of insulating layer
Argon gas is continually fed into as working gas using in working vacuum chamber, and ensures the operating air pressure of working vacuum chamber
For 1.8 × 10-1Pa；
The power density of copper target material is regulated and controled in 0.5A/cm2In the range of, sedimentation time 80min.
Aluminium base surface manufactured in the present embodiment without viscose glue heat superconducting composite coating (DLC insulating barriers+fine copper current-carrying heat conduction
Layer) gross thickness be 69 μm, wherein DLC thickness of insulating layer be 31 μm, fine copper current-carrying heat-conducting layer thickness be 38 μm.
Embodiment 3：
The preparation method of great power LED heat-radiating substrate of the present invention, by ion plating in substrate surface deposition without viscous
Glue heat superconducting composite coating, specifically includes following steps：
Step 1：It is aluminium base base material to choose 5000 line aluminium alloys, cleaning treatment before being carried out to base material；
Step 2：Cleaned base material before step 1 is positioned on machine frame, delivered to base material by drive device
In the vacuum chamber of ion plating equipment；The machine frame keeps the speed to be in without viscose glue heat superconducting composite coating preparation process
200mm/min linear motion, it is 55mm to control the distance between matrix and each target on machine frame；To whole vacuum chamber
Vacuumized, the background vacuum of working vacuum chamber is not more than 6.0 × 10-3Pa。
Step 3：In LED DLC insulating barriers are deposited with aluminium base plate surface
Argon gas and alkanes (C will be continually fed into working vacuum chamber3H8) mixed gas, wherein, alkanes gas point
Press as 35%, and ensure that the operating air pressure of working vacuum chamber is 9.0 × 10-1Pa；
The power density of carbon target material is regulated and controled in 0.15A/cm2In the range of, sedimentation time 220min.
Step 4：Fine copper current-carrying heat-conducting layer is deposited in DLC surface of insulating layer
Argon gas is continually fed into as working gas using in working vacuum chamber, and ensures the operating air pressure of working vacuum chamber
For 9.0 × 10-1Pa；Plasma electrical source is then turned on after base material synchronization radical occlusion device is first enabled in this step, to realize that DLC insulate
The local copper-plating technique of layer surface.
The power density of copper target material is regulated and controled in 0.1A/cm2In the range of, sedimentation time 110min.
Aluminium base surface manufactured in the present embodiment without viscose glue heat superconducting composite coating (DLC insulating barriers+fine copper current-carrying heat conduction
Layer) gross thickness be 52 μm, wherein DLC thickness of insulating layer be 28 μm, fine copper current-carrying heat-conducting layer thickness be 24 μm.
Embodiment 4：
The preparation method of great power LED heat-radiating substrate of the present invention, by ion plating in substrate surface deposition without viscous
Glue heat superconducting composite coating, specifically includes following steps：
Step 1：It is aluminium base base material to choose 5000 line aluminium alloys, cleaning treatment before being carried out to base material；
Step 2：Cleaned base material before step 1 is positioned on machine frame, delivered to base material by drive device
In the vacuum chamber of ion plating equipment；The machine frame keeps the speed to be in without viscose glue heat superconducting composite coating preparation process
200mm/min linear motion, it is 65mm to control the distance between matrix and each target on machine frame；To whole vacuum chamber
Vacuumized, the background vacuum of working vacuum chamber is not more than 6.0 × 10-3Pa。
Step 3：In LED DLC insulating barriers are deposited with aluminium base plate surface
Argon gas and alkanes (C will be continually fed into working vacuum chamber3H8) mixed gas, wherein, alkanes gas point
Press as 40%, and ensure that the operating air pressure of working vacuum chamber is 3.0 × 10-1Pa；
The power density of carbon target material is regulated and controled in 0.35A/cm2In the range of, sedimentation time 150min.
Step 4：Fine copper current-carrying heat-conducting layer is deposited in DLC surface of insulating layer
Argon gas is continually fed into as working gas using in working vacuum chamber, and ensures the operating air pressure of working vacuum chamber
For 3.0 × 10-1Pa；
The power density of copper target material is regulated and controled in 0.15A/cm2In the range of, sedimentation time 60min.
Aluminium base surface manufactured in the present embodiment without viscose glue heat superconducting composite coating (DLC insulating barriers+fine copper current-carrying heat conduction
Layer) gross thickness be 43 μm, wherein DLC thickness of insulating layer be 22 μm, fine copper current-carrying heat-conducting layer thickness be 21 μm.
Embodiment 5：
The preparation method of great power LED heat-radiating substrate of the present invention, by ion plating in substrate surface deposition without viscous
Glue heat superconducting composite coating, specifically includes following steps：
Step 1：It is aluminium base base material to choose 6000 line aluminium alloys, cleaning treatment before being carried out to base material；
Step 2：Cleaned base material before step 1 is positioned on machine frame, delivered to base material by drive device
In the vacuum chamber of ion plating equipment；The machine frame keeps the speed to be in without viscose glue heat superconducting composite coating preparation process
400mm/min linear motion, it is 120mm to control the distance between matrix and each target on machine frame；To whole vacuum chamber
Room is vacuumized, and the background vacuum of working vacuum chamber is not more than 6.0 × 10-3Pa。
Step 3：In LED DLC insulating barriers are deposited with aluminium base plate surface
Argon gas and alkanes (C will be continually fed into working vacuum chamber2H6) mixed gas, wherein, alkanes gas point
Press as 50%, and ensure that the operating air pressure of working vacuum chamber is 4.0 × 10-1Pa；
The power density of carbon target material is regulated and controled in 0.33A/cm2In the range of, sedimentation time 90min.
Step 4：Fine copper current-carrying heat-conducting layer is deposited in DLC surface of insulating layer
Argon gas is continually fed into as working gas using in working vacuum chamber, and ensures the operating air pressure of working vacuum chamber
For 4.0 × 10-1Pa；Plasma electrical source is then turned on after base material synchronization radical occlusion device is first enabled in this step, to realize that DLC insulate
The local copper-plating technique of layer surface.
The power density of copper target material is regulated and controled in 0.25A/cm2In the range of, sedimentation time 40min.
Aluminium base surface manufactured in the present embodiment without viscose glue heat superconducting composite coating (DLC insulating barriers+fine copper current-carrying heat conduction
Layer) gross thickness be 31 μm, wherein DLC thickness of insulating layer be 16 μm, fine copper current-carrying heat-conducting layer thickness be 15 μm.
The Cross Section Morphology without viscose glue heat superconducting composite coating on aluminium base surface manufactured in the present embodiment as shown in figure 1, from
It can be seen that in the figure, the composite coating is made up of DLC insulating barriers and fine copper current-carrying heat-conducting layer two parts, and composite coating gross thickness is
31μm；Composite coating Cross Section Morphology is overall fine and close, the defects of not seeing hole, while coating is well combined with matrix.
Embodiment 6：
The preparation method of great power LED heat-radiating substrate of the present invention, by ion plating in substrate surface deposition without viscous
Glue heat superconducting composite coating, specifically includes following steps：
Step 1：It is aluminium base base material to choose 6000 line aluminium alloys, cleaning treatment before being carried out to base material；
Step 2：Cleaned base material before step 1 is positioned on machine frame, delivered to base material by drive device
In the vacuum chamber of ion plating equipment；The machine frame keeps the speed to be in without viscose glue heat superconducting composite coating preparation process
480mm/min linear motion, it is 95mm to control the distance between matrix and each target on machine frame；To whole vacuum chamber
Vacuumized, the background vacuum of working vacuum chamber is not more than 6.0 × 10-3Pa。
Step 3：In LED DLC insulating barriers are deposited with aluminium base surface
Argon gas and alkanes (CH will be continually fed into working vacuum chamber4) mixed gas, wherein, alkanes gas point
Press as 60%, and ensure that the operating air pressure of working vacuum chamber is 4.8 × 10-1Pa；
The power density of carbon target material is regulated and controled in 0.28A/cm2In the range of, sedimentation time 110min.
Step 4：Fine copper current-carrying heat-conducting layer is deposited in DLC surface of insulating layer
Argon gas is continually fed into as working gas using in working vacuum chamber, and ensures the operating air pressure of working vacuum chamber
For 4.8 × 10-1Pa；
The power density of copper target material is regulated and controled in 0.16A/cm2In the range of, sedimentation time 55min.
Aluminium base surface manufactured in the present embodiment without viscose glue heat superconducting composite coating (DLC insulating barriers+fine copper current-carrying heat conduction
Layer) gross thickness be 35 μm, wherein DLC thickness of insulating layer be 17 μm, fine copper current-carrying heat-conducting layer thickness be 18 μm.
LED heat radiation substrate prepared by the present invention has without insulating cement, production procedure is short, preparation cost is low, heat transfer distances
The characteristic short, thermal conductivity factor is high, heat-sinking capability is strong etc., can meet the requirement of great power LED long life serve phase.
It is described above, only it is several embodiments of the application, any type of limitation is not done to the application, although this Shen
Please with preferred embodiment disclose as above, but and be not used to limit the application, any person skilled in the art, do not taking off
In the range of technical scheme, make a little variation using the technology contents of the disclosure above or modification is equal to
Case study on implementation is imitated, is belonged in the range of technical scheme.
Claims (10)
1. a kind of LED heat radiating materials surface is without viscose glue heat superconducting composite coating, including the thermally conductive insulating layer being covered on substrate layer
And it is covered in the circuit layer in thermally conductive insulating layer, it is characterised in that the thermally conductive insulating layer is diamond-like-carbon film layer, described
Circuit layer is pure copper layer.
2. LED heat radiating materials surface according to claim 1 is without viscose glue heat superconducting composite coating, it is characterised in that described
The thickness of the diamond-like-carbon film layer is 15 μm~50 μm, and the thickness of the pure copper layer is 15 μm~40 μm.
3. LED heat radiating materials surface according to claim 2 is without viscose glue heat superconducting composite coating, it is characterised in that described
Pure copper layer all standing is in diamond-like-carbon film surface or local complexity in diamond-like-carbon film surface.
4. a kind of LED heat radiation substrate, including substrate layer and be covered on substrate layer as described in any one of claims 1 to 3
LED heat radiating materials surface without viscose glue heat superconducting composite coating.
5. LED heat radiation substrate according to claim 4, it is characterised in that the substrate layer is metal-based layer.
6. LED heat radiation substrate according to claim 5, it is characterised in that the metal-based layer is aluminum base layer, the aluminium base
Layer material is one kind in 1000 systems, 5000 systems and 6000 line aluminium alloys.
7. a kind of preparation method of LED heat radiation substrate as described in claim 4 or 5, comprises the following steps：
(1) using carbon target material as evaporation source, using the mixed gas of argon gas and alkanes gas as working gas, adopt under vacuum
With ion plating one layer of diamond-like-carbon film layer is deposited in base material layer surface；
(2) using copper target material as evaporation source, using argon gas as working gas, under vacuum using ion plating in DLC
Carbon film layer surface deposits one layer of pure copper layer.
8. the preparation method of LED heat radiation substrate according to claim 7, it is characterised in that in the step (1), work
Air pressure is 1.0 × 10-1Pa~9.5 × 10-1Pa, alkanes partial pressure≤80%.
9. the preparation method of LED heat radiation substrate according to claim 8, it is characterised in that in the step (1), carbon target
The power density of material is 0.005A/cm2~0.5A/cm2, sedimentation time is 60min~300min.
10. the preparation method of the LED heat radiation substrate according to any one of claim 7~9, it is characterised in that the step
(2) in, operating air pressure is 1.0 × 10-1Pa~9.5 × 10-1Pa, the power density of copper target material regulate and control in 0.1A/cm2~0.5A/
cm2, sedimentation time is 20min~120min.
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| CN201710889868.5A CN107642767A (en) | 2017-09-27 | 2017-09-27 | L ED heat dissipation substrate surface adhesive-free super-heat-conduction composite coating, L ED heat dissipation substrate and preparation method thereof |
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| CN201710889868.5A CN107642767A (en) | 2017-09-27 | 2017-09-27 | L ED heat dissipation substrate surface adhesive-free super-heat-conduction composite coating, L ED heat dissipation substrate and preparation method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108767102A (en) * | 2018-03-26 | 2018-11-06 | 华灿光电（浙江）有限公司 | A kind of light-emitting diode chip for backlight unit and preparation method thereof |
| CN109611702A (en) * | 2019-01-16 | 2019-04-12 | 上海大学 | A kind of underwater illuminating device |
| CN114567967A (en) * | 2020-11-27 | 2022-05-31 | 核工业西南物理研究院 | Preparation method of high-thermal-conductivity insulating heat-conducting layer |
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Application publication date: 20180130 |