CN101483217A - LED high heat conduction ceramic copper coating heat radiation circuit board - Google Patents
LED high heat conduction ceramic copper coating heat radiation circuit board Download PDFInfo
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- CN101483217A CN101483217A CNA2009100678184A CN200910067818A CN101483217A CN 101483217 A CN101483217 A CN 101483217A CN A2009100678184 A CNA2009100678184 A CN A2009100678184A CN 200910067818 A CN200910067818 A CN 200910067818A CN 101483217 A CN101483217 A CN 101483217A
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Abstract
The invention discloses a Light-Emitting Diode (LED) high heat conduction ceramic bonding copper heat dissipation circuit board characterized in that a copper foil is compounded on both sides of a ceramic chip, a copper-aluminum spinelle eutectic interface is between the copper foil and the ceramic substrate; a circuit formed by two faces of copper foils of the ceramic substrate are interconnected and guided through a sintered via hole. The invention employs the process principle that the low temperature thermal oxidized copper foil and the ceramic can form the eutectic interface. At 1060 DEG C-1080 DEG C, the copper and an oxide film form a trace amount of copper-cuprous oxide eutectic liquid phase. The eutectic liquid phase and aluminum, magnesium, zirconium and oxygen elements in the ceramic form the copper-aluminum spinelle eutectic interface and the copper foil and the ceramic substrate form a firm compound structure. The invention has excellent performance of high heat conduction, strong conduction ability, high adhesive force and low interconnection via hole resistance, and obviously improves the operation life and reliability by applying to the LED chip package.
Description
Affiliated technical field
The invention belongs to electronic device, be specifically related to the high heat-conducting ceramic heat-radiating substrate of a kind of LED pottery circuit sheetmetal formation.
Background technology
In the prior art, high-power LED chip is when encapsulation, and the adhesive strength of the thermal conductivity of substrate, coefficient of linear expansion, conductor fig has great influence to quality, life-span, the reliability of product.Aluminium base commonly used at present, pcb plate etc. can not satisfy the requirement of high-quality LED, be exactly the ceramic circuit board that adopts film and thick-film technique to make in addition, because it mainly is that the typography of usefulness is at ceramic surface printing one deck silver palladium alloy slurry, low-temperature sintering is below 500 ℃ then, thereby causes that its adhesion is poor, weldability is poor, conductivity and thermal conductivity be also bad.
Summary of the invention
The present invention's purpose is to overcome the above-mentioned deficiency of prior art, a kind of LED ceramic copper-clad cooling circuit board is provided, has chip and problems such as the baseplate material thermal expansion coefficient difference is big, soldering reliability is poor, heat conductivility difference when solving the encapsulation of led chip use metal substrate.
For realizing above-mentioned purpose, the present invention takes following technical scheme: a kind of LED ceramic copper-clad of the present invention cooling circuit board, two sides at potsherd is compounded with Copper Foil, have copper aluminate eutectic interface between Copper Foil and the ceramic substrate, the via hole that the link tester oversintering that ceramic substrate two sides Copper Foil constitutes forms carries out interconnected conducting.
Manufacture craft of the present invention is:
(1) Copper Foil is heated with hot blast, make its surface form the oxide-film of even compact;
(2) Copper Foil being had one of oxide-film faces down and is placed on the ceramic substrate;
(3) sintering, sintering peak temperature are 1060 ℃-1080 ℃;
(4) circuit etching figure;
(5) laser processing ceramics via hole;
(6) make interconnected via hole with the copper thick film ink.
Wherein said copper thickness is the 10-100 micron.
Described ceramic substrate can be the ceramic substrate of known various materials, the alumina ceramic chip of preferred 〉=96% (alumina content).
Metallization copper layer that major technology characteristics of the present invention are potsherd surfaces and pottery formation copper aluminate eutectic bond interface and metallization via hole that can be interconnected.Copper aluminate eutectic interface between Copper Foil and the ceramic substrate is to be superimposed together by Copper Foil and potsherd, and the high temperature sintering bonding forms.
The present invention takes technique scheme, have following beneficial effect: the present invention uses the technological principle that can form the eutectic interface through the Copper Foil of low thermal oxidation with pottery, in the time of 1060 ℃-1080 ℃, copper and oxide-film form the copper-cuprous oxide eutectic liquid phase of trace, elements such as the aluminium in this layer liquid phase and the pottery, magnesium, zirconium, oxygen form copper aluminate eutectic bond interface, and Copper Foil and ceramic substrate form firm composite construction.
Excellent properties such as the present invention has that high heat conduction, conductive capability are strong, high adhesion force, interconnected via resistance are low are applied in the led chip encapsulation and can obviously improve working life and reliability.Adopt the LED high-heat-conductivity ceramic circuit board that this process exploitation forms because be high temperature sintering, reach as high as 1080 ℃, so metallic conductor is all used copper, then at copper plating nickel on surface and gold, so the adhesion of sort circuit plate is guaranteed, nickel and gold can provide good weldability and conductivity.
Embodiment
Below in conjunction with specific embodiment the present invention is described in detail.
A kind of LED ceramic copper-clad of the present invention cooling circuit board is to be compounded with Copper Foil on the two sides of potsherd, has copper aluminate eutectic interface between Copper Foil and the ceramic substrate, and the via hole that the link tester oversintering that ceramic substrate two sides Copper Foil constitutes forms carries out interconnected conducting.Embodiment 1 is as follows for its manufacture craft:
(1) 20 microns Copper Foil with 200 ℃ of air hot blasts heating 10 minutes, make copper foil surface form the oxide-film of even compact, cool off standby then;
(2) Copper Foil is had one of oxide-film and face down and be placed on the ceramic substrate, ceramic substrate will pass through ultrasonic waves for cleaning in advance, oven dry;
(3) sintering, with nitrogen protection net belt type sintering furnace, 300 ℃ of the initial heating-up temperatures of bringing-up section, peak temperature is up to 1080 ℃, and sintering period 45-70 minute, oxygen content was 30～200ppm in the stove;
(4) circuit etching figure carries out conductor line processing by PCB technology;
(5) laser processing ceramics via hole, laser profile and via hole processing small holes;
(6) make interconnected via hole with the copper thick film ink.
Embodiment 2 is as follows for its manufacture craft:
(1) 80 microns Copper Foil with 350 ℃ of air hot blasts heating 6 minutes, make copper foil surface form the oxide-film of even compact, cool off standby then.
(2) Copper Foil is had one of oxide-film and face down and be placed on the ceramic substrate, ceramic substrate will pass through ultrasonic waves for cleaning in advance, oven dry;
(3) sintering, with nitrogen protection net belt type sintering furnace, 300 ℃ of the initial heating-up temperatures of bringing-up section, peak temperature is up to 1080 ℃, and sintering period 45-70 minute, oxygen content was 30～200ppm in the stove;
(4) circuit etching figure carries out conductor line processing by PCB technology;
(5) laser processing ceramics via hole, laser profile and via hole processing small holes;
(6) make interconnected via hole with the copper thick film ink.
The performance of the high-power LED ceramic heat-dissipating substrate that embodiment 1～2 makes is as follows:
| Performance index | Embodiment 1 | Embodiment 2 |
| Outward appearance | Smooth | Smooth |
| Copper thickness (micron) | 20 | 80 |
| Conduction current-carrying performance | Excellent | Excellent |
| Vertical tension intensity (Kg/100mm 2) | 500 | 500 |
| Cold-resistant thermal cycle (50 ℃-150 ℃) | 100 times good | 100 times good |
| Anti-weldering ability | More than 30 times | More than 30 times |
| But etching and processing performance | Very | Very |
| Conductive coefficient | 28 | 28 |
| Withstand voltage impact | 3 | 3 |
Claims (3)
1, a kind of LED high heat conduction ceramic copper coating heat radiation circuit board, it is characterized in that: the two sides at potsherd is compounded with Copper Foil, has copper aluminate eutectic interface between Copper Foil and the ceramic substrate; The via hole that the link tester oversintering that ceramic substrate two sides Copper Foil constitutes forms carries out interconnected conducting.
2, a kind of LED high heat conduction ceramic copper coating heat radiation circuit board according to claim 1 is characterized in that its manufacture craft is:
(1) Copper Foil is heated with hot blast, make its surface form the oxide-film of even compact;
(2) Copper Foil being had one of oxide-film faces down and is placed on the ceramic substrate;
(3) sintering, sintering peak temperature are 1060 ℃-1080 ℃;
(4) circuit etching figure;
(5) laser processing ceramics via hole;
(6) make interconnected via hole with the copper thick film ink.
3, a kind of LED high heat conduction ceramic copper coating heat radiation circuit board according to claim 1, it is characterized in that: described copper thickness is 10～100 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2009100678184A CN101483217A (en) | 2009-02-04 | 2009-02-04 | LED high heat conduction ceramic copper coating heat radiation circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2009100678184A CN101483217A (en) | 2009-02-04 | 2009-02-04 | LED high heat conduction ceramic copper coating heat radiation circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101483217A true CN101483217A (en) | 2009-07-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2009100678184A Pending CN101483217A (en) | 2009-02-04 | 2009-02-04 | LED high heat conduction ceramic copper coating heat radiation circuit board |
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Cited By (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101813261A (en) * | 2010-02-03 | 2010-08-25 | 陈威翰 | LED bulb |
| CN101699936B (en) * | 2009-11-02 | 2011-03-30 | 广东达进电子科技有限公司 | Production method of bright-copper-face high-heat-conductivity ceramic circuit board capable of locating |
| CN101699935B (en) * | 2009-11-02 | 2011-03-30 | 广东达进电子科技有限公司 | Method for producing locatable high heat conduction ceramic circuit board |
| WO2011060714A1 (en) | 2009-11-18 | 2011-05-26 | 珠海晟源同泰电子有限公司 | Led light emitting module and manufacturing method thereof |
| CN102148315A (en) * | 2010-12-31 | 2011-08-10 | 深圳市安培盛科技有限公司 | LED (Light Emitting Diode) ceramic substrate with low cost and high reliability |
| CN102185039A (en) * | 2011-01-10 | 2011-09-14 | 西安明泰半导体科技有限公司 | Method for improving safety insulation voltage endurance of light-emitting diode (LED) integrating face light source |
| CN102206098A (en) * | 2010-03-30 | 2011-10-05 | 比亚迪股份有限公司 | Ceramic copper-clad substrate and preparation method thereof |
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| CN102452843A (en) * | 2010-10-30 | 2012-05-16 | 比亚迪股份有限公司 | Aluminum oxide ceramics copper-clad plate and preparation method thereof |
| CN102569625A (en) * | 2012-01-05 | 2012-07-11 | 中国计量学院 | Copper line-clad aluminum silicon carbide ceramic substrate applicable to radiation of high-power LED |
| CN102646779A (en) * | 2012-04-20 | 2012-08-22 | 华南师范大学 | Ceramic-based power type light-emitting diode and packaging method thereof |
| CN102931321A (en) * | 2012-11-16 | 2013-02-13 | 上海申和热磁电子有限公司 | Manufacturing method for thin-copper DBC substrate |
| CN103117256A (en) * | 2011-11-17 | 2013-05-22 | 上海申和热磁电子有限公司 | Ceramic bonding copper substrate and manufacture method thereof |
| CN103337580A (en) * | 2013-06-19 | 2013-10-02 | 苏州信亚科技有限公司 | LED light with ceramic heat dissipation baseplate |
| CN103515509A (en) * | 2012-06-26 | 2014-01-15 | 比亚迪股份有限公司 | Method for preparing large-power LED base and large-power LED base thereof |
| CN103515521A (en) * | 2013-09-16 | 2014-01-15 | 惠州雷士光电科技有限公司 | Copper-covered ALSiC composite radiating substrate and manufacturing method thereof |
| CN103562632A (en) * | 2011-04-04 | 2014-02-05 | 陶瓷技术有限责任公司 | LED lamp comprising an LED as the luminaire and a glass or plastic lampshade |
| CN107535048A (en) * | 2015-04-27 | 2018-01-02 | 京瓷株式会社 | Circuit substrate and the electronic installation for possessing the circuit substrate |
| CN107645827A (en) * | 2017-09-20 | 2018-01-30 | 苏州三冷暖工程有限公司 | A kind of high radiating progressive metal-layer structure of level |
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-
2009
- 2009-02-04 CN CNA2009100678184A patent/CN101483217A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101699936B (en) * | 2009-11-02 | 2011-03-30 | 广东达进电子科技有限公司 | Production method of bright-copper-face high-heat-conductivity ceramic circuit board capable of locating |
| CN101699935B (en) * | 2009-11-02 | 2011-03-30 | 广东达进电子科技有限公司 | Method for producing locatable high heat conduction ceramic circuit board |
| WO2011060714A1 (en) | 2009-11-18 | 2011-05-26 | 珠海晟源同泰电子有限公司 | Led light emitting module and manufacturing method thereof |
| CN101813261A (en) * | 2010-02-03 | 2010-08-25 | 陈威翰 | LED bulb |
| CN102206098B (en) * | 2010-03-30 | 2013-04-10 | 比亚迪股份有限公司 | Ceramic copper-clad substrate and preparation method thereof |
| CN102206098A (en) * | 2010-03-30 | 2011-10-05 | 比亚迪股份有限公司 | Ceramic copper-clad substrate and preparation method thereof |
| CN102237481B (en) * | 2010-05-07 | 2013-01-16 | 佛山市国星光电股份有限公司 | Surface mounted type power light-emitting diode (LED) bracket manufacturing method and product manufactured thereby |
| CN102237481A (en) * | 2010-05-07 | 2011-11-09 | 佛山市国星光电股份有限公司 | Surface mounted type power light-emitting diode (LED) bracket manufacturing method and product manufactured thereby |
| CN102452843B (en) * | 2010-10-30 | 2013-08-21 | 比亚迪股份有限公司 | Aluminum oxide ceramics copper-clad plate and preparation method thereof |
| CN102452843A (en) * | 2010-10-30 | 2012-05-16 | 比亚迪股份有限公司 | Aluminum oxide ceramics copper-clad plate and preparation method thereof |
| CN102148315A (en) * | 2010-12-31 | 2011-08-10 | 深圳市安培盛科技有限公司 | LED (Light Emitting Diode) ceramic substrate with low cost and high reliability |
| CN102185039A (en) * | 2011-01-10 | 2011-09-14 | 西安明泰半导体科技有限公司 | Method for improving safety insulation voltage endurance of light-emitting diode (LED) integrating face light source |
| CN102185039B (en) * | 2011-01-10 | 2013-04-24 | 常熟工大工业科技有限公司 | Method for improving safety insulation voltage endurance of light-emitting diode (LED) integrating face light source |
| CN103562632A (en) * | 2011-04-04 | 2014-02-05 | 陶瓷技术有限责任公司 | LED lamp comprising an LED as the luminaire and a glass or plastic lampshade |
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| CN102569625A (en) * | 2012-01-05 | 2012-07-11 | 中国计量学院 | Copper line-clad aluminum silicon carbide ceramic substrate applicable to radiation of high-power LED |
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| CN103515521A (en) * | 2013-09-16 | 2014-01-15 | 惠州雷士光电科技有限公司 | Copper-covered ALSiC composite radiating substrate and manufacturing method thereof |
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| CN107535048A (en) * | 2015-04-27 | 2018-01-02 | 京瓷株式会社 | Circuit substrate and the electronic installation for possessing the circuit substrate |
| CN107535048B (en) * | 2015-04-27 | 2019-10-18 | 京瓷株式会社 | Circuit substrate and the electronic device for having the circuit substrate |
| CN107645827A (en) * | 2017-09-20 | 2018-01-30 | 苏州三冷暖工程有限公司 | A kind of high radiating progressive metal-layer structure of level |
| CN107645827B (en) * | 2017-09-20 | 2019-12-10 | 苏州三一冷暖工程有限公司 | High heat dissipation level progressive metal layer structure |
| CN113725190A (en) * | 2021-07-27 | 2021-11-30 | 南瑞联研半导体有限责任公司 | Copper-clad ceramic lining plate structure of power device and packaging method thereof |
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Open date: 20090715 |