CN216960577U

CN216960577U - Heat radiation structure of electronic equipment

Info

Publication number: CN216960577U
Application number: CN202122386971.2U
Authority: CN
Inventors: 邵星
Original assignee: Guangzhou Shiyuan Electronics Thecnology Co Ltd; Guangzhou Shikun Electronic Technology Co Ltd
Current assignee: Guangzhou Shiyuan Electronics Thecnology Co Ltd; Guangzhou Shikun Electronic Technology Co Ltd
Priority date: 2021-09-29
Filing date: 2021-09-29
Publication date: 2022-07-12
Anticipated expiration: 2031-09-29

Abstract

The utility model provides a heat radiation structure of electronic equipment, which comprises: the heat dissipation device comprises a component to be dissipated, an upper heat dissipation sheet, a lower heat dissipation sheet and a limit nail; the upper radiating fin is arranged above the component to be radiated, and the lower radiating fin is arranged below the component to be radiated; the spacing nail includes upper limit portion and lower limit portion. The utility model has the beneficial effects that: last fin extrudees downwards through the last spacing portion of stop pin to the fin extrudees upwards through lower spacing portion, thereby makes go up the fin and the fin presss from both sides tightly down treat radiator unit, only need increase stop pin and just can realize going up the fixed of fin and lower fin, thereby need not the structure of bigger fixed fin, just can realize going up fin and lower fin and treating radiator unit's laminating, relevant personnel only need place fin and last fin down in the position of settlement, then insert the stop pin can, improved electronic equipment's production efficiency.

Description

Heat radiation structure of electronic equipment

Technical Field

The present invention relates to the field of electronic devices, and in particular, to a heat dissipation structure of an electronic device.

Background

Some components of the electronic equipment which need to dissipate heat continuously, and if the heat is not dissipated timely, the electronic equipment can not only operate unstably in a high-temperature environment, but also some parts can be burnt directly. Therefore, the electronic device has a corresponding heat dissipation structure to dissipate heat.

In the prior art, for the beautiful and portable design of electronic equipment, more and more electronic equipment tends to the small design, and therefore a component to be cooled needs a larger cooling area.

SUMMERY OF THE UTILITY MODEL

The purpose of the disclosure is: the heat dissipation structure of the electronic equipment is simple in structure, convenient to assemble and capable of improving the production efficiency of the electronic equipment.

The utility model provides a heat dissipation structure of electronic equipment, which comprises: the heat dissipation device comprises a component to be dissipated, an upper heat dissipation sheet, a lower heat dissipation sheet and a limit nail; the upper radiating fin is arranged above the component to be radiated, and the lower radiating fin is arranged below the component to be radiated; the limiting nail comprises an upper limiting part and a lower limiting part, and the limiting nail is used for penetrating through the upper radiating fin and the lower radiating fin and enabling the upper radiating fin and the lower radiating fin to clamp the component to be radiated through the upper limiting part and the lower limiting part.

The utility model has the beneficial effects that: last fin extrudees downwards through the last spacing portion of stop pin to the fin extrudees upwards through lower spacing portion, thereby makes go up the fin and the fin presss from both sides tightly down treat radiator unit, only need to increase the stop pin and just can realize going up the fixed of fin and lower fin, because only the design has increased the stop pin, and the space that the stop pin occupied is fairly limited, thereby need not the structure of bigger fixed fin, just can realize going up fin and lower fin and treating radiator unit's laminating, relevant personnel only need down fin and last fin place in the position of setting for, then insert the stop pin can, improved electronic equipment's production efficiency.

Drawings

Fig. 1 is a schematic structural diagram of a heat dissipation structure of an electronic device according to an embodiment of the present invention.

In fig. 1:

1. an upper heat sink; 2. a first thermally conductive layer; 3. a chip; 4. a circuit board; 5. a second thermally conductive layer; 6. a lower heat sink; 7. a limit pin; 11. a fin; 71. an upper limit portion; 72. a lower limit portion 73 and a spring.

The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used for explaining the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the attached drawings), and if the specific posture is changed, the directional indicator is also changed accordingly, and the connection may be a direct connection or an indirect connection.

The term "and/or" herein is merely an association describing an associated object, meaning that three relationships may exist, e.g., a and B, may mean: a exists alone, A and B exist simultaneously, and B exists alone.

In addition, the descriptions related to "first", "second", etc. in the present invention are only for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.

Referring to fig. 1, the present invention provides a heat dissipation structure of an electronic device, including: the heat dissipation structure comprises a component to be cooled, an upper cooling fin 1, a lower cooling fin 6 and a limit nail 7; the upper radiating fin 1 is arranged above the component to be radiated, and the lower radiating fin 6 is arranged below the component to be radiated; the limit pin 7 includes an upper limit portion 71 and a lower limit portion 72, and the limit pin 7 is used for penetrating through the upper heat sink 1 and the lower heat sink 6, and the upper heat sink 1 and the lower heat sink 6 clamp the component to be heat-dissipated through the upper limit portion 71 and the lower limit portion 72.

In this embodiment, the component to be cooled is generally a chip 3, and since the chip 3 is a highly integrated circuit board that handles operations and tasks of the entire electronic device, a large amount of heat can be emitted under efficient operation. In addition, the component to be radiated can also be an electronic element which can emit a large amount of heat, such as a display card, a hard disk, an optical drive, a high-power triode, a rheostat and the like. The upper heat radiating fin 1 and the lower heat radiating fin 6 are both made of heat conducting metal with good heat conductivity, the heat conducting metal can transfer heat out of a component to be heat-dissipated, the limit pin 7 is provided with an upper limit part 71 and a lower limit part 72, the specific structures of the upper limit part 71 and the lower limit part 72 are not limited, the principle is that the upper heat radiating fin 1 is pressed downwards through the upper limit part 71, and the lower heat radiating fin 6 is pressed upwards through the lower limit part 72, so that the component to be heat-dissipated is clamped by the upper heat radiating fin 1 and the lower heat radiating fin 6, the upper heat radiating fin 1 and the lower heat radiating fin 6 can be fixed only through the limit pin 7, only the limit pin 7 is added, the space occupied by the limit pin 7 is quite limited, the upper heat radiating fin 1 and the lower heat radiating fin 6 can be attached to the component to be heat-dissipated without a larger structure for fixing the heat radiating fins, related personnel only need to place the lower heat radiating fin 6 and the upper heat radiating fin 1 at a set position, then insert the stop pin 7 can, improved electronic equipment's production efficiency.

In one embodiment, the component to be dissipated includes a chip 3 and a circuit board 4; the chip 3 is fixedly arranged above the circuit board 4, and the upper radiating fin 1 is arranged above the chip 3; the lower heat sink 6 is disposed below the circuit board 4.

In this embodiment, the component to be cooled includes the chip 3 and the circuit board 4, and since the chip 3 is the highly integrated circuit board 4, it undertakes the processing of the operation and task of the whole electronic device. Therefore, the heat productivity is very huge, and for the electronic equipment, good heat dissipation is ensured to ensure the use smoothness of the electronic equipment. Thus, the upper heat sink 1 is disposed above the chip 3; the lower radiating fin 6 is arranged below the circuit board 4, so that the heat dissipation can be realized above and below the chip 3, and the chip 3 can be better radiated without increasing excessive structures, namely, without increasing the heat dissipation space of the electronic equipment.

In one embodiment, the heat dissipation structure of the electronic device further includes a first heat conduction layer 2, and the first heat conduction layer 2 is disposed between the chip 3 and the upper heat sink 1 and clamped by the upper limit portion 71 and the lower limit portion 72.

In this embodiment, the heat transfer from the chip 3 to the upper heat sink 1 can be achieved through the first heat conduction layer 2. Specifically, since the chip 3 is directly attached to the upper heat sink 1, and the surfaces of the chip and the upper heat sink are uneven, the upper heat sink 1 and the chip 3 cannot be closely attached to each other, resulting in poor heat dissipation. Therefore, the first heat conduction layer 2 is arranged between the chip 3 and the upper heat dissipation sheet 1, so that the upper heat dissipation sheet 1 is tightly attached to the first heat conduction layer 2, the first heat conduction layer 2 is tightly attached to the chip 3, and the heat conduction effect is better.

In one embodiment, the heat sink further includes a second heat conduction layer 5, and the second heat conduction layer 5 is disposed between the circuit board 4 and the lower heat sink 6 and clamped by the upper limit portion 71 and the lower limit portion 72.

In this embodiment, the heat transfer from the chip 3 to the lower heat sink 6 can be achieved by the second heat conducting layer 5. Specifically, since the circuit board 4 is directly attached to the lower heat sink 6, and the surfaces of the circuit board 4 and the lower heat sink 6 are uneven, the lower heat sink 6 cannot be closely attached to the circuit board 4, resulting in poor heat dissipation. Therefore, the second heat conduction layer 5 is arranged between the circuit board 4 and the lower heat dissipation sheet 6, so that the lower heat dissipation sheet 6 is tightly attached to the second heat conduction layer 5, and the second heat conduction layer 5 is tightly attached to the circuit board 4, so that the heat conduction effect is better.

In one embodiment, the upper heat sink 1 includes a flat plate and one or more fins 11, and the fin 11 is disposed on a surface of the flat plate away from the lower heat sink 6 and is fixedly connected to the flat plate.

In this embodiment, the flat plate includes one or more fins 11, wherein the fins 11 are preferably disposed perpendicular to the flat plate to increase the heat dissipation surface area of the heat sink, and a plurality of fins 11 may be disposed to improve the heat dissipation effect of the heat sink.

In one embodiment, the lower limit portion 72 is a nail tip with a barb structure, the upper limit portion 71 is a nail head and a spring 73, and the upper heat sink 1 and the lower heat sink 6 clamp the component to be heat dissipated through the cooperation of the nail head and the spring 73 and the limit effect of the barb on the nail tip.

In this embodiment, when the heat dissipation structure is assembled, a nail tip may be sequentially inserted through the upper heat sink 1, the circuit board 4, and the lower heat sink 6 by striking a nail head, wherein corresponding through holes are formed in the upper heat sink 1, the circuit board 4, and the lower heat sink 6, and the nail tip may be inserted through the through holes and fastened to the lower heat sink 6, and is abutted against the nail head and the circuit board 4 by the spring 73, so that the upper heat sink 1 and the lower heat sink 6 clamp the component to be dissipated. However, in order to save the area of the upper heat sink 1 and the lower heat sink 6 and reduce the cost, the area of the upper heat sink 1 and the lower heat sink 6 should not be too large, and may be slightly larger than the main heat generating component of the component to be heat-dissipated, for example, slightly larger than the area of the chip 3, so that the fixing is generally performed through the circuit board 4 when the fixing is performed by the spacing pin 7. The diameter of the spring 73 is larger than that of the through hole, so that the spring 73 is difficult to penetrate through the through hole, and the position of the limit pin 7 is limited. In addition, the limiting nail 7 can be made of plastic materials, so that the barb on the nail tip is deformed to penetrate through the through hole and abuts against the lower radiating fin 6 after penetrating through the through hole on the lower radiating fin 6, and the upper radiating fin 1 and the lower radiating fin 6 are fixed.

In one embodiment, the first heat conduction layer 2 is a soft silicone heat conduction pad. In addition, the second heat conduction layer 5 may also be a soft silica gel heat conduction pad.

In the embodiment, the soft silica gel heat-conducting insulating pad has good heat-conducting capacity and high-grade voltage-resistant insulation, the heat-conducting coefficient is 1.75W/mK, the voltage breakdown resistance value is more than 4000 volts, the soft silica gel heat-conducting insulating pad is a substitute product for heat-conducting silicone grease, the soft silica gel heat-conducting insulating pad has certain flexibility and can be well attached between a power device and a heat-radiating aluminum sheet or a machine shell, so that the best heat-conducting and heat-radiating purposes are achieved, the requirements of the current electronic industry on heat-conducting materials are met, and the soft silica gel heat-conducting insulating pad is an optimal product for a binary heat-radiating system for replacing heat-conducting silicone grease heat-conducting paste and mica sheets. Therefore, the soft silica gel heat conducting pad can perfectly realize the close fit between the upper radiating fin 1 and the chip 3. Namely, the heat conduction is realized through the soft silica gel heat conduction pad.

The utility model has the beneficial effects that: the upper radiating fin 1 is downwards extruded through the upper limiting part 71 of the limiting nail 7, and the lower radiating fin 6 is upwards extruded through the lower limiting part 72, so that the upper radiating fin 1 and the lower radiating fin 6 clamp the component to be cooled, the fixation of the upper radiating fin 1 and the lower radiating fin 6 can be realized only by adding the limiting nail 7, only the limiting nail 7 is added, the space occupied by the limiting nail 7 is quite limited, the fitting of the upper radiating fin 1 and the lower radiating fin 6 with the component to be cooled can be realized without a larger structure for fixing the radiating fins, relevant personnel only need to place the lower radiating fin 6 and the upper radiating fin 1 at set positions, and then the limiting nail 7 is inserted, and the production efficiency of the electronic equipment is improved.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.

Claims

1. A heat dissipation structure of an electronic device, wherein the heat dissipation structure comprises: the heat dissipation device comprises a component to be dissipated, an upper heat dissipation sheet, a lower heat dissipation sheet, a limiting nail and a first heat conduction layer;

the component to be radiated comprises a chip and a circuit board;

the chip is fixedly arranged above the circuit board, and the upper radiating fin is arranged above the chip;

the lower radiating fin is arranged below the circuit board;

the upper radiating fin is arranged above the component to be radiated, and the lower radiating fin is arranged below the component to be radiated;

the limiting nail comprises an upper limiting part and a lower limiting part, the limiting nail is used for penetrating through the upper radiating fin and the lower radiating fin, the limiting nail does not penetrate through the circuit board, and the upper radiating fin and the lower radiating fin clamp the component to be radiated through the upper limiting part and the lower limiting part, wherein the lower limiting part is a nail tip with a barb structure;

the first heat conduction layer is arranged between the chip and the upper radiating fin and clamped by the upper limiting part and the lower limiting part;

the first heat conduction layer is a soft silica gel heat conduction pad, and the limiting nail is made of a plastic material.

2. The heat dissipating structure for an electronic device according to claim 1, further comprising a second heat conductive layer provided between the circuit board and the lower heat sink and clamped by the upper and lower retainers.

3. The heat dissipating structure of an electronic device as claimed in claim 1, wherein the upper heat sink includes a plate and one or more fins, and the fins are disposed on a surface of the plate away from the lower heat sink and are fixedly connected to the plate.

4. The heat dissipating structure of an electronic device according to claim 1, wherein the upper limiting portion is a pin head and a spring, and the upper heat sink and the lower heat sink clamp the component to be dissipated by the limiting effect of the spring abutting against the pin head and the upper heat sink and the barbs on the pin tip.

5. The heat dissipation structure of claim 2, wherein the second thermal conductive layer is a soft silicone thermal pad.