CN103066037A - Thermoelectricity refrigeration heat pipe radiator for electric car insulated gate bipolar translator (IGBT) - Google Patents
Thermoelectricity refrigeration heat pipe radiator for electric car insulated gate bipolar translator (IGBT) Download PDFInfo
- Publication number
- CN103066037A CN103066037A CN201210544224XA CN201210544224A CN103066037A CN 103066037 A CN103066037 A CN 103066037A CN 201210544224X A CN201210544224X A CN 201210544224XA CN 201210544224 A CN201210544224 A CN 201210544224A CN 103066037 A CN103066037 A CN 103066037A
- Authority
- CN
- China
- Prior art keywords
- heat
- igbt
- face
- thermoelectric cooling
- pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
A thermoelectricity refrigeration heat pipe radiator for an electric car insulated gate bipolar translator (IGBT) is characterized by comprising an IGBT module, a graphite heat conducting pad, a thermoelectricity refrigeration device, a heat dissipation substrate, heat pipes and horizontal cooling fins, wherein one end face of the graphite heat conducing pad is in tight contact with a heat dissipation end face of the IGBT module, the other end face of the graphite heat conducting pad is in tight contact with a refrigeration end face of the thermoelectricity refrigeration device, one end face of the heat dissipation substrate is in tight contact with the refrigeration end face of the thermoelectricity refrigeration device, parallel grooves are dug in the other end face of the heat dissipation substrate, single heat pipe is in a U shape, a horizontal evaporation section of the bottom of the U-shaped portion of the heat pipe is embedded in each groove of the heat dissipation substrate, and the horizontal cooling fins are sleeved on a vertical condensation section end A and a vertical condensation section end B at two sides of each heat pipe. Due to the fact that high temperature of an IGBT local node is rapidly flattened by the graphite heat conducting pad and the influence of instantaneous thermal shock of an IGBT power device can be comprehensively relieved and eliminated by using the graphite heat conducting pad, the thermoelectricity refrigeration device to refrigerate and the heat pipes to dissipate heat, instantaneous high temperature of the IGBT is prevented and rapid heat dissipation of the IGBT can be achieved.
Description
Technical field
The present invention relates to electric automobile electronic radiation technical field, be specifically related to a kind of electric automobile IGBT thermoelectric cooling heat-pipe radiator.
Background technology
Motor in electric automobile and control system thereof are one of key technologies of electric automobile, and electric machine controller is its core technology parts.In recent years, the developing direction of modern electrical machine controller is: high power density, high reliability, high efficiency, to realize Miniaturization Design, its main thermal source is the device for high-power power electronic such as insulated gate bipolar transistor (IGBT), because the caloric value concentration degree of IGBT is high, when excess Temperature, even can cause the power device permanent damages, thereby driver can't be worked.Therefore the heat radiation of electric machine controller part becomes a key issue.For the reliability that improves electric vehicle motor controller work, prolong its useful life, just need its cooling system of optimal design.The controller radiator not only produces significant impact to the reliability of motor and electric machine controller, and be the key factor that affects motor power and economy, its function guarantees that exactly power drive system all can normally and reliably work under any loading condiction He under the operational environment under optimal state of temperature.
At present traditional electric vehicle motor controller adopts the heat radiation of air blast cooling form, the heat radiation of water-cooled form or the heat radiation of heat pipe form.The heat radiation of simple air blast cooling form is main rely on fin by blower fan to around transferring heat, the heat of IGBT can not be taken away rapidly, the integral heat sink effect is unsatisfactory; The cold parts of water-cooled form heat radiation are more, system complex and dispersion, difficult arrangement in the electric automobile confined space; Heat pipe heat radiation takes full advantage of the quick hereditary property of heat-conduction principle and refrigerant, the one end is evaporation ends, the other end is condensation end, when heat pipe is heated, the phase-change material of evaporation ends is subjected to thermal evaporation, and steam flows to condensation end and releases heat under pressure differential, be re-condensed into liquid, flow back to evaporation ends, so circulation is more than, and heat can be conducted continuously.
But the final cause that causes the electric machine controller damage is the thermal stress that the local nodes excess Temperature of IGBT module forms.How the rapid diffusion of heat that produces on the node local on the IGBT module being come, is one of subject matter of electric machine controller fansink designs.At present automotive grade IGBT encapsulation is less, area of dissipation is less, and electric machine controller is given birth to heat when moving under high-power operating mode larger, be difficult to spread rapidly at the amount of heat that moment is gathered IGBT module node and come, even use the good copper product of thermal conductive property as IGBT radiating end plane materiel matter, its conductive coefficient also is difficult to the local nodes temperature of IGBT is flattened rapidly between 380W/mK～400W/mK, still has the too high problem of junction temperature.
On the other hand, the handling characteristics of automobile is regular start and stop and acceleration.Electric automobile is when starting or giving it the gun, the hear rate of electric machine controller IGBT can sharply increase, in the IGBT module, form heat localization, temperature rises rapidly, cause stronger thermal shock, conventional air-cooled, water-filled radiator, even heat-pipe radiator all is difficult to the amount of heat that IGBT moment produces is left rapidly, can cause the IGBT temperature to surpass rapidly margin of safety, so that electric machine controller is difficult to maintain in the suitable temperature range, be easy to cause the electric machine controller cause thermal damage, so that cut can occur the electric automobile in travelling, easily cause the electric automobile driving accident, affected the safety traffic of electric automobile.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, a kind of electric automobile IGBT thermoelectric cooling heat-pipe radiator is provided.
The present invention adopts following technical scheme:
Electric automobile IGBT thermoelectric cooling heat-pipe radiator is characterized in that: be comprised of IGBT module, graphite heat conducting pad, thermoelectric cooling device, heat-radiating substrate, heat pipe, horizontal fin; The heat radiation end face close contact of one end face of graphite heat conducting pad and IGBT module, the refrigeration end face close contact of the other end of graphite heat conducting pad and thermoelectric cooling device; One end face of heat-radiating substrate and thermoelectric cooling device heat the end face close contact, be carved with parallel groove on the other end of heat-radiating substrate; Single heat pipe is U-shaped, and the horizontal evaporation section of heat pipe U-shaped bottom embeds in the groove of heat-radiating substrate; Vertical condensation segment A end and vertical condensation segment B end at many heat pipe two ends are inserted in horizontal fin.
Described horizontal fin is arranged to two groups, is inserted in the vertical condensation segment A end of heat pipe and forms A group fin, is inserted in the vertical condensation segment B end of heat pipe and forms B group fin.
Described A group fin and B group fin be wrong row in height, and wrong row's spacing is half of inter fin space.
Described A group fin and B group fin number are 10～50.
The parallel groove number of digging on the described heat-radiating substrate end face is identical with the heat pipe radical of embedding, is 2～10.
Described thermoelectric cooling device and power supply, adjustable resistance, switch consist of the loop.
The arranged outside fan of described horizontal fin.
Compare with existing application, electric automobile IGBT disclosed in this invention has following remarkable advantage with the thermoelectric cooling heat-pipe radiator:
(1) because the thermal conductive property of graphite heat conducting pad is anisotropy, and the thermal conductivity of itself is quite big, 15W/mK on the thickness direction, and 700W/mK～1750W/mK on the face direction is 2～4 times of copper.With graphite heat conducting pad and IGBT module close contact, utilize the rapid diffusion of the hot heat of high temperature with the IGBT local nodes of ultra-high conducting on the graphite heat conducting pad face direction to come among the present invention, can significantly reduce the moment high temperature of IGBT local nodes.Simultaneously, the moment heat that its high thermal conductivity forms in the time of also electric automobile can being started or accelerate spreads rapidly and comes, and slows down and exempt the impact that IGBT power device transient heat impacts.
(2) because the refrigeration end surface temperature of thermoelectric cooling device significantly is lower than the temperature of IGBT, the present invention should freeze end face and graphite heat conducting pad close contact, the larger temperature difference by this two contacts end face obtains very high rate of heat transfer, so that electric automobile starts or the moment heat that forms when accelerating diffuses to rapidly the refrigeration end face of thermoelectric cooling device by the graphite heat conducting pad, by thermoelectric cooling device heat is passed to again the end face that heats of thermoelectric cooling device, take away by efficient heat-pipe radiator again, can significantly reduce under all operating modes of electric automobile, particularly start or the temperature of IGBT when accelerating.
In a word, the present invention combines graphite heat conducting pad, thermoelectric cooling device with hot pipe technique, utilize the graphite heat conducting pad to flatten rapidly IGBT local nodes high temperature, utilize graphite heat conducting pad, thermoelectric cooling and heat pipe heat radiation comprehensive reducing to relax and exempt the impact that IGBT power device transient heat impacts, rapidly the IGBT temperature is dropped to proper level in short time, avoid the TRANSIENT HIGH TEMPERATURE of IGBT, to reach the purpose that IGBT is dispelled the heat rapidly, improved the reliability of electric machine controller work, prolong its useful life, improved vehicle performance.
Description of drawings
Fig. 1 is the front view that the embodiment of the invention 1 electric automobile IGBT uses the thermoelectric cooling heat-pipe radiator.
Fig. 2 is the vertical view that the embodiment of the invention 1 electric automobile IGBT uses the thermoelectric cooling heat-pipe radiator.
Fig. 3 is the vertical view that the embodiment of the invention 1 electric automobile IGBT uses the radiator base plate of thermoelectric cooling heat-pipe radiator.
Fig. 4 is the heat pipe front view that the embodiment of the invention 1 electric automobile IGBT uses the thermoelectric cooling heat-pipe radiator.
Fig. 5 is the front view that the embodiment of the invention 2 electric automobile IGBT use the thermoelectric cooling heat-pipe radiator.
Fig. 6 is the vertical view that the embodiment of the invention 2 electric automobile IGBT use the thermoelectric cooling heat-pipe radiator.
Among the figure, 1, the IGBT module; 2, graphite heat conducting pad; 3, thermoelectric cooling device; 3-1, refrigeration end face; 3-2, heat end face; 4, heat-radiating substrate; 4-1, groove; 5, heat pipe; 5-1, horizontal evaporation section; 5-2, vertical condensation segment A end; 5-3, vertical condensation segment B end; 6, horizontal fin; 6-1, A organize fin; 6-2, B organize fin; 7, fan; 8, adjustable resistance; 9, power supply; 10, switch.
Embodiment
Electric automobile IGBT thermoelectric cooling heat-pipe radiator mainly is comprised of IGBT module 1, graphite heat conducting pad 2, thermoelectric cooling device 3, heat-radiating substrate 4, heat pipe 5, horizontal fin 6.
The heat radiation end face close contact of one end face of graphite heat conducting pad 2 and IGBT module 1, the refrigeration end face 3-1 close contact of the other end of graphite heat conducting pad 2 and thermoelectric cooling device 3.Graphite heat conducting pad 2 adopts the graphite film of high-termal conductivity, high flexibility, and thermal conductive property is anisotropy, and the thermal conductivity of itself is quite big, 15W/mK on the thickness direction, and 700W/mK～1750W/mK on the face direction is 2～4 times of copper.
One end face of heat-radiating substrate 4 and thermoelectric cooling device 3 heat end face 3-2 close contact, be carved with parallel groove 4-1 on the other end.Single heat pipe 5 is U-shaped, and the horizontal evaporation section 5-1 of the U-shaped bottom of heat pipe 5 embeds among the groove 4-1 of heat-radiating substrate 4.Parallel groove 4-1 number is identical with heat pipe 5 radicals of embedding, is 2～10, and the present embodiment gets 8.Heat pipe 5 can use capillary type heat pipe 5, also can adopt gravity assisted heat pipe 5.In the present embodiment, because IGBT module 1 places the bottom of whole radiator, can adopt gravity assisted heat pipe 5 to reduce cost.
Vertical condensation segment A end 5-2 and vertical condensation segment A end 5-3 at many heat pipes 5 two ends are inserted in horizontal fin 6.Horizontal fin 6 is arranged to two groups in the present embodiment, is inserted in heat pipe 5 vertical condensation segment A end 5-2 and forms A group fin 6-1, is inserted in heat pipe 5 vertical condensation segment B end 5-3 and forms B group fin 6-2; A group fin 6-1 and B group fin 6-2 number get 10～50, and the present embodiment is got 15; And A group fin 6-1 and B group fin 6-2 be wrong row in height, and wrong row's spacing is half of inter fin space.Two groups of fin in the horizontal can be interlaced, also certain interval can be arranged, and the present embodiment adopts wrong row, and its advantage is to make two groups of fin to form flow perturbation, strengthens heat radiation, improves the heat radiation power of whole radiator.
Operation principle of the present invention is as follows: when electric automobile started, electric machine controller was started working, switch 10 closures in while thermoelectric cooling loop, and thermoelectric cooling device 3 startup work, while fan 7 also starts starts working.The power device of IGBT module 1 produces thermal losses, and the heat that generates at local nodes is rapidly by 2 horizontal proliferations of graphite heat conducting pad, and heat reaches rapidly the refrigeration end face 3-1 of thermoelectric cooling device 3 by graphite heat conducting pad 2 under the larger temperature difference.Thermoelectric cooling device 3 will freeze heat delivery that end face 3-1 absorbs to heating end face 3-2 according to paltie effect.
The heat that heats end face 3-2 passes to working media in the heat pipe 5 through the horizontal evaporation section 5-1 of heat-radiating substrate 4, heat pipe 5 again, by working media with heat delivery to vertical condensation segment A end 5-2 with vertically on the condensation segment B end 5-3, thermal release is gone out under the driving of blower fan by A group fin 6-1 and B group fin 6-2 again.
In the present embodiment, horizontal fin 6 is arranged to one group, its objective is that processing is simple, the minimizing of making an uproar of windage and wind.All the other structures are identical with embodiment 1 with operation principle.
Claims (7)
1. electric automobile IGBT thermoelectric cooling heat-pipe radiator is characterized in that: be comprised of IGBT module (1), graphite heat conducting pad (2), thermoelectric cooling device (3), heat-radiating substrate (4), heat pipe (5), horizontal fin (6); The heat radiation end face close contact of one end face of graphite heat conducting pad (2) and IGBT module (1), refrigeration end face (3-1) close contact of the other end of graphite heat conducting pad (2) and thermoelectric cooling device (3); One end face of heat-radiating substrate (4) and thermoelectric cooling device (3) heat end face (3-2) close contact, be carved with parallel groove (4-1) on the other end of heat-radiating substrate (4); Single heat pipe (5) is U-shaped, and the horizontal evaporation section (5-1) of heat pipe (5) U-shaped bottom embeds in the groove (4-1) of heat-radiating substrate (4); Vertical condensation segment A end (5-2) and vertical condensation segment B end (5-3) at many heat pipes (5) two ends are inserted in horizontal fin (6).
2. electric automobile IGBT thermoelectric cooling heat-pipe radiator according to claim 1, it is characterized in that described horizontal fin (6) is arranged to two groups, be inserted in the vertical condensation segment A end of heat pipe (5) (5-2) and form A group fin (6-1), be inserted in the vertical condensation segment B of heat pipe (5) and hold (5-3) to form B group fin (6-2).
3. electric automobile IGBT thermoelectric cooling heat-pipe radiator according to claim 2 is characterized in that described A group fin (6-1) and B organize in height wrong row of fin (6-2), and wrong row's spacing is half of inter fin space.
4. electric automobile IGBT thermoelectric cooling heat-pipe radiator according to claim 2 is characterized in that described A group fin (6-1) and B group fin (6-2) number are 10～50.
5. electric automobile IGBT thermoelectric cooling heat-pipe radiator according to claim 1 is characterized in that parallel groove (4-1) number of digging on described heat-radiating substrate (4) end face is identical with heat pipe (5) radical of embedding, is 2～10.
6. electric automobile IGBT thermoelectric cooling heat-pipe radiator according to claim 1 is characterized in that described thermoelectric cooling device (3) and power supply (9), adjustable resistance (8), switch (10) consist of the loop.
7. electric automobile IGBT thermoelectric cooling heat-pipe radiator according to claim 1 is characterized in that the arranged outside fan (7) of described horizontal fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210544224XA CN103066037A (en) | 2012-12-02 | 2012-12-02 | Thermoelectricity refrigeration heat pipe radiator for electric car insulated gate bipolar translator (IGBT) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210544224XA CN103066037A (en) | 2012-12-02 | 2012-12-02 | Thermoelectricity refrigeration heat pipe radiator for electric car insulated gate bipolar translator (IGBT) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103066037A true CN103066037A (en) | 2013-04-24 |
Family
ID=48108599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210544224XA Pending CN103066037A (en) | 2012-12-02 | 2012-12-02 | Thermoelectricity refrigeration heat pipe radiator for electric car insulated gate bipolar translator (IGBT) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103066037A (en) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104329852A (en) * | 2014-08-29 | 2015-02-04 | 青岛海尔股份有限公司 | Semiconductor refrigeration refrigerator and manufacturing method thereof |
| CN104329855A (en) * | 2014-08-29 | 2015-02-04 | 青岛海尔股份有限公司 | Semiconductor refrigeration refrigerator and manufacturing method thereof |
| CN105450173A (en) * | 2015-12-17 | 2016-03-30 | 常州大学 | Heat pipe type concentrating photovoltaic cooling heat-collecting apparatus |
| CN105762124A (en) * | 2016-03-04 | 2016-07-13 | 北京新能源汽车股份有限公司 | Heat dissipation device for heating equipment, and electric automobile with heat dissipation device |
| CN105932828A (en) * | 2016-07-10 | 2016-09-07 | 襄阳华博士新能源科技有限公司 | Motor with heat conduction pipe |
| CN106028762A (en) * | 2016-07-19 | 2016-10-12 | 南京工程学院 | Double-cooling comprehensive system for electric car control system |
| WO2017128812A1 (en) * | 2016-01-30 | 2017-08-03 | 边疆 | Integrated heat radiator and heat dissipation method |
| CN107246755A (en) * | 2017-06-23 | 2017-10-13 | 珠海格力电器股份有限公司 | Semiconductor refrigeration box |
| CN108762443A (en) * | 2018-05-24 | 2018-11-06 | 郑州云海信息技术有限公司 | A kind of T-type radiator applied to computer |
| CN110139540A (en) * | 2019-06-04 | 2019-08-16 | 苏州科勒迪电子有限公司 | Heat superconducting pipe radiator and New energy automobile motor control device with it |
| CN114294856A (en) * | 2021-12-13 | 2022-04-08 | 迈克医疗电子有限公司 | Method, device, medium, equipment and instrument for improving Peltier refrigeration efficiency |
| CN115164303A (en) * | 2022-07-06 | 2022-10-11 | 武汉理工大学 | Method for reducing energy consumption of air conditioner based on thermoelectric refrigeration technology |
| CN117316903A (en) * | 2023-11-28 | 2023-12-29 | 合众新能源汽车股份有限公司 | Thermoelectric semiconductor heat radiation structure for cabin domain controller and vehicle |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101917835A (en) * | 2010-08-23 | 2010-12-15 | 上海中科深江电动车辆有限公司 | Large-power module cooling structure of electric vehicle controller |
| CN102128518A (en) * | 2010-11-25 | 2011-07-20 | 华为技术有限公司 | TEC (Thermoelectric Cooling Module) refrigerating device and electrical device using same |
| US20120293962A1 (en) * | 2011-02-23 | 2012-11-22 | University Of Maryland,College Park | Trench-assisted thermoelectric isothermalization of power switching chips |
| CN202940230U (en) * | 2012-12-02 | 2013-05-15 | 合肥工业大学 | Thermoelectric-refrigeration heat pipe radiator for electric automobile IGBT |
-
2012
- 2012-12-02 CN CN201210544224XA patent/CN103066037A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101917835A (en) * | 2010-08-23 | 2010-12-15 | 上海中科深江电动车辆有限公司 | Large-power module cooling structure of electric vehicle controller |
| CN102128518A (en) * | 2010-11-25 | 2011-07-20 | 华为技术有限公司 | TEC (Thermoelectric Cooling Module) refrigerating device and electrical device using same |
| US20120293962A1 (en) * | 2011-02-23 | 2012-11-22 | University Of Maryland,College Park | Trench-assisted thermoelectric isothermalization of power switching chips |
| CN202940230U (en) * | 2012-12-02 | 2013-05-15 | 合肥工业大学 | Thermoelectric-refrigeration heat pipe radiator for electric automobile IGBT |
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104329855B (en) * | 2014-08-29 | 2017-04-05 | 青岛海尔股份有限公司 | Semiconductor freezer and its manufacture method |
| CN104329855A (en) * | 2014-08-29 | 2015-02-04 | 青岛海尔股份有限公司 | Semiconductor refrigeration refrigerator and manufacturing method thereof |
| CN104329852A (en) * | 2014-08-29 | 2015-02-04 | 青岛海尔股份有限公司 | Semiconductor refrigeration refrigerator and manufacturing method thereof |
| CN104329852B (en) * | 2014-08-29 | 2017-02-15 | 青岛海尔股份有限公司 | Semiconductor refrigeration refrigerator and manufacturing method thereof |
| CN105450173A (en) * | 2015-12-17 | 2016-03-30 | 常州大学 | Heat pipe type concentrating photovoltaic cooling heat-collecting apparatus |
| WO2017128812A1 (en) * | 2016-01-30 | 2017-08-03 | 边疆 | Integrated heat radiator and heat dissipation method |
| CN105762124A (en) * | 2016-03-04 | 2016-07-13 | 北京新能源汽车股份有限公司 | Heat dissipation device for heating equipment, and electric automobile with heat dissipation device |
| CN105932828A (en) * | 2016-07-10 | 2016-09-07 | 襄阳华博士新能源科技有限公司 | Motor with heat conduction pipe |
| CN106028762A (en) * | 2016-07-19 | 2016-10-12 | 南京工程学院 | Double-cooling comprehensive system for electric car control system |
| CN106028762B (en) * | 2016-07-19 | 2018-03-27 | 南京工程学院 | A kind of double cooling integrated systems for electric vehicle control system |
| CN107246755A (en) * | 2017-06-23 | 2017-10-13 | 珠海格力电器股份有限公司 | Semiconductor refrigeration box |
| CN108762443A (en) * | 2018-05-24 | 2018-11-06 | 郑州云海信息技术有限公司 | A kind of T-type radiator applied to computer |
| CN108762443B (en) * | 2018-05-24 | 2020-08-04 | 苏州浪潮智能科技有限公司 | T-shaped heat dissipation device applied to computer |
| CN110139540A (en) * | 2019-06-04 | 2019-08-16 | 苏州科勒迪电子有限公司 | Heat superconducting pipe radiator and New energy automobile motor control device with it |
| CN114294856A (en) * | 2021-12-13 | 2022-04-08 | 迈克医疗电子有限公司 | Method, device, medium, equipment and instrument for improving Peltier refrigeration efficiency |
| CN114294856B (en) * | 2021-12-13 | 2023-08-25 | 迈克医疗电子有限公司 | Method, device, medium, equipment and instrument for improving Peltier refrigeration efficiency |
| CN115164303A (en) * | 2022-07-06 | 2022-10-11 | 武汉理工大学 | Method for reducing energy consumption of air conditioner based on thermoelectric refrigeration technology |
| CN117316903A (en) * | 2023-11-28 | 2023-12-29 | 合众新能源汽车股份有限公司 | Thermoelectric semiconductor heat radiation structure for cabin domain controller and vehicle |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103066037A (en) | Thermoelectricity refrigeration heat pipe radiator for electric car insulated gate bipolar translator (IGBT) | |
| US11217841B2 (en) | System and method for thermally managing battery | |
| KR101428383B1 (en) | Device for cooling battery module of vehicle | |
| CN106711110B (en) | A kind of air-cooled water cooling mixing heat radiation module for high-power series IGBT | |
| CN105180504A (en) | Semiconductor refrigeration device for circulating cooling system | |
| CN202940230U (en) | Thermoelectric-refrigeration heat pipe radiator for electric automobile IGBT | |
| CN108390123A (en) | A kind of power battery pack heat management system and automobile | |
| CN207651636U (en) | A kind of automobile power cell packet heat management system and automobile | |
| KR101373564B1 (en) | A Heat Exchanger using Thermoelectric Modules and A Method for Controlling the Thermoelectric Modules | |
| CN105204597A (en) | CPU radiator | |
| CN102446878A (en) | Semiconductor refrigerating device | |
| CN102331832A (en) | Forced air-cooled heat pipe radiating system for servo driver | |
| CN102446877A (en) | Semiconductor cooling device | |
| KR20100060756A (en) | A thermoelectric cooling device for liqiid type | |
| CN106549522B (en) | motor winding frame structure | |
| JP2015116910A (en) | Heat exchange system | |
| CN113677159B (en) | Water-cooling and air-cooling compatible heat dissipation device | |
| CN201166825Y (en) | Water-cooled notebook computer radiator | |
| CN111366018B (en) | Semiconductor refrigeration heat dissipation assembly and semiconductor refrigeration equipment | |
| CN204923552U (en) | A semiconductor refrigerator for circulative cooling system | |
| CN202262193U (en) | Forced air-cooled heat pipe heat radiating system used for servo driver | |
| CN217685509U (en) | Radiator and air condensing units | |
| CN111336716A (en) | Lower box of refrigeration vehicle | |
| KR20210033596A (en) | Cooling structure of vehicle drive inverter and control system of the same | |
| TW201622314A (en) | Power heat dissipation device and heat dissipation control method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130424 |