CN204031696U - A kind of high-intensity heat conduction phase transformation pad - Google Patents
A kind of high-intensity heat conduction phase transformation pad Download PDFInfo
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- CN204031696U CN204031696U CN201420215757.8U CN201420215757U CN204031696U CN 204031696 U CN204031696 U CN 204031696U CN 201420215757 U CN201420215757 U CN 201420215757U CN 204031696 U CN204031696 U CN 204031696U
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- heat
- heat conduction
- phase
- silica gel
- gel sheet
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Abstract
The utility model relates to a kind of Heat Conduction Material, especially relates to the curing heat-conducting silicon rubber of add-on type with phase-change microcapsule and strengthens a kind of high-intensity heat conduction phase transformation pad that grid cloth is combined.Comprise a heat-conducting silica gel sheet body, in the downside of heat-conducting silica gel sheet body, be provided with phase-change microcapsule layer, between phase-change microcapsule layer and heat-conducting silica gel sheet body, be also provided with glass layer of cloth.Its beneficial effect is: its heat conduction can reach 3w/m*k, and possesses the decalescence performance of heat conduction phase-change material, and can not be out of shape after phase transformation, and the thinnest 0.2mm that accomplishes of thickness strengthens its hot strength by grid cloth and can accomplish 8mpa.
Description
Technical field
The utility model relates to a kind of Heat Conduction Material, especially relates to the curing heat-conducting silicon rubber of add-on type with phase-change microcapsule and strengthens a kind of high-intensity heat conduction phase transformation pad that grid cloth is combined.
Background technology
At present, the assembling of electronic chip is densification more and more, and the heat producing during its work is more and more many, causes its operational environment sharply to high temperature direction, to change.Be accompanied by the rising of electronic devices and components temperature, its reliability sharply declines, and therefore timely heat is shifted away and becomes the key factor that affects its function and useful life from electronic chip.And along with the microminiaturized multifunction of electronic product requires Heat Conduction Material to possess performance thin, soft, high heat conduction.
Now widely used macromolecule heat conduction material is heat-conducting silicone grease and heat-conducting pad and heat conduction phase-transition material, heat-conducting silicone grease is generally to realize by add solid conductive heat filler in silicone oil, heat-conducting pad is generally in rubber or gel-like substance, to add solid conductive heat filler to realize, it is more outstanding but do not possess a large amount of abilities that shift heat of short time from chip short time that heat-conducting silicone grease and heat-conducting pad continue heat-conducting effect, and heat conduction phase-change material possesses short time a large amount of abilities that shift heat from chip, but its lasting heat-conducting effect is not good.
Weak point based on above-mentioned current heat-conducting pad, the inventor has designed the utility model " a kind of high-intensity heat conduction phase transformation pad ".
Utility model content
The utility model for above-mentioned the deficiencies in the prior art technical problem to be solved is: the high strength heat conduction phase transformation pad that the advantage of a kind of combination heat-conducting pad and heat conduction phase-change material is provided and strengthens by grid cloth.
The utility model solves the technical scheme that its technical problem adopts:
A high-intensity heat conduction phase transformation pad, comprises a heat-conducting silica gel sheet body, in the downside of heat-conducting silica gel sheet body, is provided with phase-change microcapsule layer, between phase-change microcapsule layer and heat-conducting silica gel sheet body, is also provided with glass layer of cloth.
Described heat-conducting silica gel sheet body cross sectional shape is quadrangle.
Producing principle of the present utility model is: heat-conducting silica gel sheet do not sneak into during moulding phase-change microcapsule again mixture is coated on grid cloth to moulding or grid cloth is pressed be dipped into mixture in reshaping.
Heat conductive silica gel mainly comprises base resin: vinylsiloxane rubber, vinyl rubber, phenyl-vinyl silicon oil, vinyl polysiloxane.Crosslinking agent: containing hydrogen silicone oil, phenyl hydrogen-containing silicon oil.Catalyst (being mainly platinum catalyst), inhibitor, heat filling: comprise various metal oxides and the nitride such as aluminium oxide, zinc oxide.The constituent such as aerosil, various auxiliary agents
Grid cloth can be glass fiber reticular cloth, nylon grid cloth etc.
The beneficial effect of a kind of high-intensity heat conduction phase transformation pad of the utility model is:
Its heat conduction can reach 3w/m*k, and possesses the decalescence performance of heat conduction phase-change material, and can not be out of shape after phase transformation, and the thinnest 0.2mm that accomplishes of thickness strengthens its hot strength by grid cloth and can accomplish 8mpa.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the utility model is further illustrated.
Fig. 1 is overall structure front view of the present utility model;
Fig. 2 is overall structure upward view of the present utility model.
Description of reference numerals:
1, heat-conducting silica gel sheet body 2, glass layer of cloth
3, phase-change microcapsule layer
Embodiment
See figures.1.and.2, the utility model is to implement like this:
In Fig. 1 and Fig. 2, a kind of high-intensity heat conduction phase transformation pad, comprises a heat-conducting silica gel sheet body 1, in the downside of heat-conducting silica gel sheet body 1, is provided with phase-change microcapsule layer 2, between phase-change microcapsule layer 2 and heat-conducting silica gel sheet body 1, is also provided with glass layer of cloth 3.
Described heat-conducting silica gel sheet body 1 cross sectional shape is quadrangle.
Producing principle of the present utility model is: heat-conducting silica gel sheet do not sneak into during moulding phase-change microcapsule again mixture is coated on grid cloth to moulding or grid cloth is pressed be dipped into mixture in reshaping.
The above, it is only the preferred embodiment of a kind of high-intensity heat conduction phase transformation pad of the utility model, not technical scope of the present utility model is imposed any restrictions, every foundation technical spirit of the present utility model, to embodiment does above any trickle modification, equivalent variations and modification, all still belongs in the scope of the utility model technology.
Claims (2)
1. a high-intensity heat conduction phase transformation pad, it is characterized in that: comprise a heat-conducting silica gel sheet body (1), downside in heat-conducting silica gel sheet body (1) is provided with phase-change microcapsule layer (2), between phase-change microcapsule layer (2) and heat-conducting silica gel sheet body (1), is also provided with glass layer of cloth (3).
2. a kind of high-intensity heat conduction phase transformation pad according to claim 1, is characterized in that described heat-conducting silica gel sheet body (1) cross sectional shape is quadrangle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420215757.8U CN204031696U (en) | 2014-04-29 | 2014-04-29 | A kind of high-intensity heat conduction phase transformation pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420215757.8U CN204031696U (en) | 2014-04-29 | 2014-04-29 | A kind of high-intensity heat conduction phase transformation pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204031696U true CN204031696U (en) | 2014-12-17 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420215757.8U Expired - Fee Related CN204031696U (en) | 2014-04-29 | 2014-04-29 | A kind of high-intensity heat conduction phase transformation pad |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204031696U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107426939A (en) * | 2016-05-23 | 2017-12-01 | 比亚迪股份有限公司 | A kind of mobile phone thermal component and method |
| CN107964244A (en) * | 2017-12-18 | 2018-04-27 | 深圳德邦界面材料有限公司 | A kind of preparation method of fiberglass reinforced type heat-conducting pad |
| CN111410939A (en) * | 2020-04-09 | 2020-07-14 | 清华大学深圳国际研究生院 | Heat-conducting phase-change energy storage sheet and preparation method thereof |
| CN113635639A (en) * | 2021-08-13 | 2021-11-12 | 东莞市兆科电子材料科技有限公司 | Multilayer structure heat conduction gasket and preparation method thereof |
-
2014
- 2014-04-29 CN CN201420215757.8U patent/CN204031696U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107426939A (en) * | 2016-05-23 | 2017-12-01 | 比亚迪股份有限公司 | A kind of mobile phone thermal component and method |
| CN107964244A (en) * | 2017-12-18 | 2018-04-27 | 深圳德邦界面材料有限公司 | A kind of preparation method of fiberglass reinforced type heat-conducting pad |
| CN111410939A (en) * | 2020-04-09 | 2020-07-14 | 清华大学深圳国际研究生院 | Heat-conducting phase-change energy storage sheet and preparation method thereof |
| CN111410939B (en) * | 2020-04-09 | 2021-10-22 | 清华大学深圳国际研究生院 | Heat-conducting phase-change energy storage sheet and preparation method thereof |
| CN113635639A (en) * | 2021-08-13 | 2021-11-12 | 东莞市兆科电子材料科技有限公司 | Multilayer structure heat conduction gasket and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141217 Termination date: 20180429 |