CN217644140U - Shell and electronic equipment - Google Patents

Abstract

The utility model discloses a casing and electronic equipment, the casing includes the casing body, radiating piece and heat-conducting piece, the casing body has relative first side and second side, first side is used for installing electronic equipment's heat source, the second side is equipped with first mounting groove, first mounting groove is used for corresponding the heat source setting, the radiating piece sets up in the second side, and the heat-conducting piece is located between casing body and the radiating piece, the heat-conducting piece includes the main part and connects in the installation department of main part, the installation department is connected in the second side so that the main part is located first mounting groove, the heat-conducting piece is used for conducting heat to the radiating piece that the heat source produced. Like this, the main part of heat-conducting piece is arranged in first mounting groove, can make the heat-conducting piece more press close to the heat source to and time conduction and diffusion heat, can reduce the influence of heat-conducting piece to the self thickness of shell body again. Therefore, the heat dissipation efficiency can be improved while the miniaturization is met, and the use experience of a user is improved.

Description

Shell and electronic equipment

Technical Field

The utility model relates to an electronic product field especially relates to a casing and electronic equipment.

Background

With the iterative update of electronic devices such as mobile phones, mobile phones have become an indispensable part of people's daily life, and with the increase of the dependence of people on mobile phones, the problem of heat generation of mobile phones caused by the operation of multiple application programs for a long time or at the same time is increasingly obvious, so that the heat dissipation design of electronic devices such as mobile phones is needed.

At present, a heat dissipation module is often added in an electronic device for heat dissipation design of an electronic device such as a mobile phone, for example, a patent with publication number CN206294476U discloses an electronic device, which is mainly characterized in that a metal heat dissipation module is arranged in an accommodating cavity formed by a device area of a PCBA board and a bottom case, so that heat generated by the device is timely transmitted to the metal heat dissipation module, and the metal heat dissipation module is utilized to realize rapid heat dissipation, or the heat is transmitted to the bottom case through the metal heat dissipation module to dissipate heat, thereby improving the heat dissipation performance of the electronic device. However, in this design, heat is intensively conducted to the back of the electronic device (i.e. the side close to the bottom case), and since the human hand usually holds the back of the electronic device, on one hand, the heat dissipation speed is slowed down because the human body has a body surface temperature, so that the heat dissipation performance is not ideal; on the other hand, the perception of the user to the heat of the electronic equipment is enhanced, so that the use experience of the user is poor.

SUMMERY OF THE UTILITY MODEL

The embodiment of the utility model discloses casing and electronic equipment can improve the radiating efficiency when satisfying the miniaturization, promotes user's use and experiences the sense.

In order to achieve the above object, in a first aspect, the present invention discloses a housing applied to an electronic device, the electronic device includes a heat source, the housing includes:

the shell body is provided with a first side and a second side which are opposite, the first side is used for installing the heat source of the electronic equipment, the second side is provided with a first installation groove, and the first installation groove is used for being arranged corresponding to the heat source;

a heat sink disposed on the second side; and

the heat conduction piece, the heat conduction piece be located the shell body with between the radiating piece, the heat conduction piece include the main part and connect in the installation department of main part, the installation department connect in the second side is so that the main part is located first mounting groove, the heat conduction piece is used for the conduction the heat that the heat source produced extremely the radiating piece.

As an optional implementation manner, in an embodiment of the first aspect of the present invention, a through hole penetrating to the first side is disposed on a bottom surface of the first mounting groove, and the main body portion of the heat conducting member at least partially covers an opening of the second side of the through hole.

As an alternative implementation, in an embodiment of the first aspect of the present invention, the heat source comprises a first heat source and a second heat source;

the first mounting groove is a long-strip-shaped groove body, the through hole is a long-strip-shaped hole, the length extending direction of the through hole is consistent with that of the first mounting groove, the part, not provided with the through hole, of the first mounting groove is used for being arranged corresponding to the first heat source, and the through hole is used for being arranged corresponding to the second heat source;

the main body portion extends to the through hole from a portion of the first mounting groove where the through hole is not provided, so as to cover the opening of the through hole.

As an optional implementation manner, in an embodiment of the first aspect of the present invention, the casing further includes a supporting member, the supporting member corresponds to the through hole, and the supporting member is connected to the first side and at least a part of the main body portion to support the main body portion.

As an alternative, in an embodiment of the first aspect of the present invention, the first side is provided with a positioning recess, the positioning recess is disposed around the periphery of the through hole, and the supporting member is connected to and located in the positioning recess.

As an optional implementation manner, in an embodiment of the first aspect of the present invention, the second side is provided with a second mounting groove, the second mounting groove is annularly disposed on the periphery of the first mounting groove, the second mounting groove is communicated with the first mounting groove, the depth of the second mounting groove is smaller than that of the first mounting groove, and the mounting portion is connected to and located in the second mounting groove.

As an optional implementation manner, in an embodiment of the first aspect of the present invention, the thickness of the mounting portion is less than or equal to the depth of the second mounting groove, so that one side of the mounting portion facing the heat dissipation member is lower than or even with the surface of the second side.

As an optional implementation manner, in an embodiment of the first aspect of the present invention, the mounting portion is annularly disposed on an outer periphery of the main body portion, and the mounting portion is disposed on a side of the main body portion close to the heat dissipation member, and a size of the mounting portion is smaller than a size of the main body portion from the first side to a direction of the second side.

In a second aspect, the present invention discloses an electronic device, including a heat source and a housing as described in the first aspect above, the heat source set in the housing body at the first side.

As an optional implementation manner, in an embodiment of the second aspect of the present invention, the electronic device further includes a display screen and a rear cover, the second side of the casing body has a first accommodating space, the display screen is connected to the second side and covers an opening of the first accommodating space, the heat dissipating member is located in the first accommodating space, the rear cover is connected to the first side of the casing body and forms a second accommodating space between the first side, and the heat source is located in the second accommodating space.

Compared with the prior art, the beneficial effects of the utility model reside in that:

an embodiment of the utility model provides a pair of casing and electronic equipment, which comprises a housing body, radiating piece and heat-conducting piece, one side through deviating from the heat source at the casing sets up first mounting groove and radiating piece, first mounting groove corresponds to the heat source setting, and set up the heat-conducting piece between radiating piece and casing body, the installation department that utilizes the heat-conducting piece is connected in the casing body, make the main part can be located first mounting groove, thereby on the one hand because the setting of this first mounting groove, the heat source can be pressed close to more to the heat-conducting piece, with heat to the radiating piece that effective conduction heat source produced, and then realize in time conducting the heat that produces the heat source to the radiating piece and spread fast through the heat-conducting piece. On the other hand, because the main part of heat-conducting piece is arranged in the first mounting groove, the influence of the heat-conducting piece on the thickness of the shell body can be reduced, and the shell body can keep a light and thin design. It is visible, adopt the utility model discloses a casing and electronic equipment can improve the radiating efficiency when satisfying miniaturization, frivolous design, also is favorable to promoting user's use simultaneously and experiences the sense.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the embodiments will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of an electronic device disclosed in the background of the present application;

FIG. 2 is a front view of a housing provided by an embodiment of the present application;

FIG. 3 is an exploded view of a perspective of a housing provided by an embodiment of the present application;

fig. 4 is an exploded view of another perspective of the housing provided in the embodiments of the present application;

fig. 5 is a schematic view of a second side of a housing body of a housing provided by an embodiment of the present application;

FIG. 6 is a schematic view of a first side of a housing body of a housing provided by an embodiment of the present application;

fig. 7 is a cross-sectional view of an electronic device provided in an assembled state according to an embodiment of the present application;

fig. 8 is a cross-sectional view of an electronic device in an exploded state according to an embodiment of the present application.

An icon: 100. a housing; 10. a housing body; 11. a first side; 111. a positioning recess; 12. a second side; 121. a first mounting groove; 1210. a through hole; 122. a second mounting groove; 20. a heat sink; 30. a heat conductive member; 31. a main body portion; 32. an installation part; 40. a support member; 101. a heat source; 102. a display screen; 103. a rear cover; 200. an electronic device; 300. PCBA board; 300a, a device; 400. a bottom case; 500. a metal heat dissipation module.

Detailed Description

As described in the background of the present application, in the prior art, as shown in fig. 1, the electronic device often increases the heat dissipation member between the device and the bottom case to achieve the effect of improving the heat dissipation performance, but actually, the heat is conducted to the back of the electronic device (i.e. the side close to the bottom case) in a concentrated manner, and there still exists a problem that the heat dissipation performance is not good and the user experience is poor. For example, as shown in fig. 1, a metal heat dissipation module 500 is disposed in a receiving cavity formed by a device area of the PCBA board 300 and the bottom case 400, so that heat generated by the device 300a is transmitted to the metal heat dissipation module 500 in time, thereby improving heat dissipation performance of the electronic device. However, no matter the metal heat dissipation module 500 is used to quickly dissipate heat, or the heat is transferred to the bottom case 400 through the metal heat dissipation module 500 to dissipate the heat, in the design manner as shown in fig. 1, the heat is concentrated on the back of the electronic device (i.e. the side close to the bottom case 400), since the human hand is usually held on the back of the electronic device, on one hand, the heat of the electronic device cannot be effectively dissipated in the air because the human body has a body surface temperature, and cannot be transferred to the human hand, so that the heat dissipation speed is reduced, and the heat dissipation performance is not ideal, on the other hand, the human hand directly contacts the heat concentrated area of the electronic device, so that the perception of the user on the heat of the electronic device is enhanced, the user feels clearer on the heat generated by the electronic device, and the user experience is not good.

In order to solve the technical problem that this application background art mentioned, the utility model provides a casing and electronic equipment, specifically one side (towards one side of display screen) that deviates from the heat source through setting up the shell body has first mounting groove and radiating piece, set up the heat-conducting piece between radiating piece and shell body, and locate first mounting groove with the main part of heat-conducting piece, thus, on the one hand, can make the heat-conducting piece more press close to the heat source, make the heat conduct to the radiating piece through the heat-conducting piece fast, in order to realize quick heat dissipation, because of the radiating piece is located one side of shell body towards the display screen simultaneously, to thermal perception degree when can reducing user and electronic equipment contact, in order to improve user's use experience and feel. On the other hand, the main body of the heat conducting piece can be accommodated in the first mounting groove, so that the thickness of the shell is reduced, and the shell and the electronic equipment are kept in a light and thin design. Therefore, the problems that the small electronic equipment is low in heat dissipation efficiency and poor in user experience are solved.

The manner in which the present application addresses the technical problems addressed by the background art will be further described with reference to the embodiments and the accompanying drawings.

Referring to fig. 2 to 4, in a first aspect, the present invention discloses a housing 100, where the housing 100 can be applied to an electronic device to be used as a housing of the electronic device. The electronic device includes a heat source so that heat of the power supply can be conductively dissipated using the case 100. Specifically, the case 100 includes a case body 10, a heat sink 20, and a heat conduction member 30, the case body 10 having a first side 11 and a second side 12 opposite to each other, the first side 11 being for mounting a heat source of the electronic device, the second side 12 being provided with a first mounting groove 121, the first mounting groove 121 being for being disposed corresponding to the heat source. The heat sink 20 is disposed on the second side 12, the heat conduction member 30 is disposed between the case body 10 and the heat sink 20, the heat conduction member 30 includes a main body portion 31 and a mounting portion 32 connected to the main body portion 31, the mounting portion 32 is connected to the second side 12 so that the main body portion 31 is disposed in the first mounting groove 121, and the heat conduction member 30 is configured to conduct heat generated by a heat source to the heat sink 20.

The utility model provides a casing 100, one side through deviating from the heat source at shell body 10 sets up first mounting groove 121 and radiating piece 20, first mounting groove 121 is corresponding to the heat source setting, and set up heat-conducting piece 30 between radiating piece 20 and shell body 10, utilize the installation department 32 of heat-conducting piece 30 to connect in shell body 10, make main part 31 can be located first mounting groove 121, thereby on the one hand because the setting of this first mounting groove 121, heat-conducting piece 30 can more press close to the heat source, with heat to radiating piece 20 that effective conduction heat source produced, and then realize in time conducting to radiating piece 20 and quick diffusion through heat-conducting piece 30 with the heat that the heat source produced. On the other hand, since the main body portion 31 of the heat-conducting member 30 is located in the first mounting groove 121, the influence of the heat-conducting member 30 on the thickness of the case body 10 itself can be reduced, so that the case body 10 can be kept in a slim design. It is thus clear that adopt the utility model discloses a casing 100 can improve the radiating efficiency when satisfying miniaturization, frivolous design, also is favorable to promoting user's use simultaneously and experiences the sense.

It can be understood that the above mentioned heat sources of the electronic device may include, but are not limited to, devices with relatively large heat generation, such as a power supply of the electronic device, a chip on a circuit board, and an electronic component, that is, with the case 100 of the present application, the heat conducting member 30 and the heat dissipating member 20 disposed on the case 100 can be utilized to dissipate heat of the devices with relatively large heat generation in the electronic device in time, so as to prevent heat from being accumulated inside the case of the electronic device, thereby achieving the purpose of effective heat dissipation.

Optionally, the heat sink 20 and the second side 12 may be connected by any one of adhesion, interference fit, or locking connection, so that the heat sink 20 and the case body 10 are stably connected, and the reliability of the case 100 is improved.

In one example, heat sink 20 is attached to second side 12 by adhesive. Preferably, the heat dissipation member 20 and the second mounting groove 122 are connected by any one of an adhesive, a back adhesive, or a double-sided adhesive, so that the heat dissipation member 20 is adhered to the second side 12. In this way, the heat sink 20 is connected to the second side 12 in a simple and convenient manner, and is easy to operate and implement.

In another example, the heat sink 20 is connected to the second side 12 in a locking manner. Preferably, the heat sink 20 and the second side 12 are provided with threaded holes, and a fastener passes through the threaded holes and is respectively in threaded connection with the heat sink 20 and the second side 12, so that the heat sink 20 is locked and connected with the second side 12. In this way, the heat sink 20 is stably and reliably connected to the second side 12, and the heat sink 20 is detachable from the second side 12, which facilitates the maintenance and replacement of the structure of the housing 100.

Alternatively, the heat sink 20 may include, but is not limited to, any one of a graphite sheet, a metal heat conductive plate (e.g., an aluminum plate or a copper foil), a VC (vacuum Chamber Vapor Chamber) Vapor Chamber, a heat conductive silicone grease, or a heat conductive gel to achieve rapid heat dissipation from a heat source of an electronic device.

In some embodiments, the heat conducting member 30 may be a heat pipe or a plate-shaped or tubular structure filled with a heat conducting material, for example, the heat conducting material may be one or more of graphene, an alloy or a metal (e.g., an aluminum alloy, stainless steel or copper foil), a heat conducting silicone or a heat conducting silicone grease. With the above-mentioned heat conducting member 30, the heat conducting effect is good, and the heat of the heat source can be quickly conducted to the heat dissipating member 20 through the case body 10 via the heat conducting member 30, and can be quickly diffused through the heat dissipating member 20, so as to dissipate the heat of the electronic device.

Preferably, the thermal conductivity of the heat conducting element 30 is greater than or equal to the thermal conductivity of the heat dissipating element 20, and the volume of the heat conducting element 30 is less than or equal to the volume of the heat dissipating element 20, so that local heat of the electronic device can be quickly conducted to the heat dissipating element 20 through the heat conducting element 30, and the heat can be quickly diffused on the heat dissipating element 20 with a large area, so that the overall heat of the electronic device is balanced, the purpose of reducing the temperature of the electronic device is achieved, the heat dissipation of the electronic device is achieved, and the heat dissipation efficiency of the electronic device is improved.

In some embodiments, the mounting portion 32 is disposed around the outer periphery of the main body portion 31, and the mounting portion 32 is disposed on a side of the main body portion 31 close to the heat sink 20, and a size of the mounting portion 32 is smaller than a size of the main body portion 31 in a direction from the first side 11 to the second side 12. Like this, when the installation department 32 is connected in second side 12, can set up main part 31 in the first mounting groove 121 of casing body 10 completely or mostly to reduce the thickness of casing 100, thereby be favorable to electronic equipment's miniaturized design, simultaneously because installation department 32 encircles the periphery of main part 31, install heat-conducting member 30 in casing body 10 through installation department 32, can avoid using the connected mode that main part 31 and casing body 10 gum, thereby can practice thrift the thickness that casing 100 was used for pasting the gum, with the thickness that further reduces casing 100. In addition, the mounting portion 32 is disposed around the periphery of the main body portion 31 and faces a side close to the heat sink 20, which also increases the contact area between the heat conducting member 30 and the heat sink 20, thereby improving the heat conduction efficiency of the heat conducting member 30 and facilitating the improvement of the heat dissipation efficiency.

Alternatively, the thickness of the main body 31 may be 0.2mm to 0.5mm, such as 0.30mm, 0.35mm, 0.38mm, or 0.4mm, and the thickness of the mounting portion 32 may be 0.01mm to 0.05mm, such as 0.02mm, 0.03mm, or 0.04mm, in a direction from the first side 11 to the second side 12, so that the thickness of the heat-conducting member 30 can be made small enough to facilitate the heat-conducting member 30 to be disposed in the internal structure of the case body 10, and thus the thickness of the case 100 can be reduced, which facilitates miniaturization of the electronic device.

Further, as can be seen from the foregoing, the first mounting groove 121 is provided corresponding to a heat source, and based on this, the size of the mounting portion 32 is smaller than the size of the main body portion 31 in a direction from the center of the main body portion 31 toward the edge of the main body portion 31. Thus, while the heat conduction effect of the body 31 to the heat source is ensured, the volume of the mounting portion 32 distant from the heat source can be reduced to save the material of the mounting portion 32, thereby reducing the cost of the heat conductive member 30.

Alternatively, the mounting portion 32 may be a skirt annularly disposed on the periphery of the main body portion 31, and based on this, in a direction from the center of the main body portion 31 to the edge of the main body portion 31, the width ratio of the main body portion 31 to the mounting portion 32 is 1. Thus, the material of the mounting portion 32 can be reduced to reduce the cost of the heat conductive member 30 while achieving the connection of the heat conductive member 30 with the case body 10.

Referring to fig. 5 and 6, in some embodiments, the second side 12 of the housing body 10 is provided with a second mounting groove 122, the second mounting groove 122 is annularly disposed on the periphery of the first mounting groove 121, the second mounting groove 122 is communicated with the first mounting groove 121, the depth of the second mounting groove 122 is smaller than the depth of the first mounting groove 121 in the direction from the first side 11 to the second side 12, and the mounting portion 32 is connected to and located in the second mounting groove 122.

The addition of the second mounting groove 122 can facilitate the mounting and positioning of the heat-conducting member 30 and the housing 10, so that the main body 31 can be mounted in the first mounting groove 121, and can also facilitate the mounting of the mounting portion 32 in the second mounting groove 122 of the housing 10, so as to further reduce the overall thickness of the housing 100, thereby facilitating the miniaturization design of the electronic device.

Optionally, the thickness of the mounting portion 32 is less than or equal to the depth of the second mounting groove 122, so that the side of the mounting portion 32 facing the heat sink 20 is lower than or even with the surface of the second side 12.

In this way, the heat conducting member 30 can be located in the first mounting groove 121 and the second mounting groove 122, so as to avoid the situation that the heat dissipating member 20 is raised due to the protrusion of the heat conducting member 30 from the surface of the second side 12, which leads to the reduction of the contact area between the heat dissipating member 20 and the shell body 10 and the heat conducting member 30 that need to conduct heat, on the one hand, the contact area between the heat dissipating member 20 and the shell body 10 and the contact area between the heat conducting member 30 can be increased, which leads to the improvement of heat dissipation efficiency, on the other hand, the heat conducting member 30 and the installation of the heat dissipating member 20 and the shell body 10 can be facilitated, so as to avoid the situation that the overall thickness of the assembled casing 100 is increased due to structural interference, which leads to the reduction of the thickness of the casing 100, which leads to the miniaturization of the electronic device.

Alternatively, when the side of the mounting portion 32 facing the heat sink 20 is lower than the surface of the second side 12, the height difference between the surface of the second side 12 and the side of the mounting portion 32 facing the heat sink 20 in the direction from the first side 11 to the second side 12 may be 0.02mm to 0.05mm, for example, 0.02mm, 0.03mm, or 0.04mm, so that the dimensional tolerance between the heat conducting member 30 and the case body 10 can be satisfied, the assembly of the heat conducting member 30 and the case body 10 is facilitated, the heat sink 20 is prevented from being lifted due to the protrusion of the heat conducting member 30 from the surface of the second side 12, the heat dissipation efficiency is further ensured, and the miniaturization of the electronic device is facilitated.

Alternatively, the mounting portion 32 and the second mounting groove 122 may be connected by any one of adhesion and interference fit. For example, the mounting portion 32 and the second mounting groove 122 are connected by adhesion. Preferably, the mounting portion 32 is connected to the second mounting groove 122 by any one of an adhesive, a back adhesive, or a double-sided adhesive, so that the mounting portion 32 is adhered to the second mounting groove 122. Thus, the connection mode of the mounting portion 32 and the second mounting groove 122 is simple and convenient, and is easy to operate and implement.

In some embodiments, the bottom surface of the first mounting groove 121 is provided with a through hole 1210 penetrating to the first side 11, and the main body 31 of the heat-conducting member 30 at least partially covers the opening of the through hole 1210 at the second side 12. The design of increasing the through hole 1210 at the tank bottom surface of the first mounting groove 121 can reduce the local thickness of the housing 100 and form a receiving space, so that the housing body 10 can receive or avoid other structures and components while the heat conducting member 30 is disposed, thereby facilitating the reduction of the thickness of the electronic device and satisfying the miniaturization design of the electronic device.

Alternatively, the heat source may include a first heat source and a second heat source, the first mounting groove 121 is an elongated groove, the through hole 1210 is an elongated hole, and a length extending direction of the through hole 1210 is identical to a length extending direction of the first mounting groove 121, a portion of the first mounting groove 121 where the through hole 1210 is not disposed is configured to correspond to the first heat source, and the through hole 1210 is configured to correspond to the second heat source. The body portion 31 extends from a portion of the first mounting groove 121 where the through hole 1210 is not provided to the through hole 1210 to cover the opening of the through hole 1210.

In this way, the portion of the first mounting groove 121 where the through hole 1210 is not disposed and the through hole 1210 are disposed corresponding to the first heat source and the second heat source, respectively, so that the main body 31 can conduct heat of the first heat source and the second heat source at the same time, thereby achieving heat conduction and heat dissipation of a plurality of local heat, and improving heat dissipation efficiency. Meanwhile, the design of the additional through hole 1210 can avoid a second heat source, so as to avoid the phenomenon that the heat conducting piece 30 and the heat dissipating piece 20 are raised due to the interference between the shell body 10 and the second heat source, thereby being beneficial to realizing that one side of the heat conducting piece 30 facing the heat dissipating piece 20 is lower than or level with the surface of the second side 12, and further being beneficial to increasing the heat dissipation area, improving the heat dissipation efficiency, reducing the thickness of the electronic equipment, and being beneficial to meeting the miniaturization design of the electronic equipment.

That is, when the electronic device has a plurality of heat sources, the design of the through hole 1210 is provided by the first mounting groove 121 and the partial groove bottom surface of the first mounting groove 121, so that the heat conducting element 30 and the heat dissipating element 20 can be used to conduct and dissipate heat from a plurality of heat sources, thereby achieving centralized heat conducting and dissipating effects.

For example, the first heat source may be one or more of a CPU (Central Processing Unit) chip, a GPU (Graphics Processing Unit) chip, a GPS (Global Positioning System) chip, a bluetooth module, a radio frequency module, and a GPS of the electronic device, and the second heat source may be a battery of the electronic device, a PCB (Printed Circuit Board) motherboard, or an electronic component (such as a resistor, a capacitor, and the like) on the PCB motherboard.

In some embodiments, the housing 100 further includes a supporting member 40, the supporting member 40 is disposed corresponding to the through hole 1210, and the supporting member 40 is connected to the first side 11 and at least a portion of the main body 31 to support the main body 31.

In this way, by providing the supporting member 40 at the position of the first side 11 corresponding to the through hole 1210, the main body 31 has a structural support at the position of the through hole 1210, so that the connection between the heat conducting member 30 and the shell body 10 is more stable and reliable, which is beneficial to improving the structural stability of the shell 100.

Alternatively, as can be seen from the foregoing, the through hole 1210 is a long strip hole, and based on this, the supporting member 40 may be a long strip-shaped structure to at least partially cover the opening of the through hole 1210 at the first side 11, so as to connect to at least part of the main body portion 31 to provide structural support for the main body portion 31.

Further, the first side 11 is provided with a positioning recess 111, the positioning recess 111 is disposed around the periphery of the through hole 1210, and the support member 40 is connected to and located in the positioning recess 111.

Like this, support piece 40 is connected in shell body 10 through location concave part 111, on the one hand can be injectd the hookup location of deciding support piece 40 and shell body 10, in order to improve support piece 40's position accuracy, avoid the equipment deviation, be favorable to realizing support piece 40's structure supporting role, on the other hand, location concave part 111 is sunken to be located shell body 10's first side 11, be located support piece 40 in location concave part 111, be favorable to reducing support piece 40 occupation space relative shell body 10, in order to realize the structure of casing 100 and second heat source dodge when casing 100 supports main part 31, thereby be favorable to satisfying electronic equipment's miniaturized design.

Alternatively, the connection manner of the supporting member 40 and the positioning recess 111 may be any one of adhesion, interference fit or locking connection.

In one example, the support member 40 is connected to the positioning recess 111 by bonding. Preferably, the supporting member 40 and the positioning concave portion 111 are connected by any one of an adhesive, a back adhesive, or a double-sided adhesive, so that the supporting member 40 is adhered to the positioning concave portion 111. In this way, the connection mode of the supporting member 40 and the positioning concave part 111 is simple and convenient, and is easy to operate and implement.

In another example, the support 40 is connected to the positioning recess 111 in a locking manner. Preferably, the supporting member 40 and the positioning concave portion 111 are provided with threaded holes, and a fastener passes through the threaded holes and is respectively in threaded connection with the supporting member 40 and the positioning concave portion 111, so that the supporting member 40 and the positioning concave portion 111 are in locking connection. In this way, the support member 40 is stably and reliably connected with the positioning recess 111, and the support member 40 is detachable from the positioning recess 111, which facilitates the maintenance and replacement of the structure of the housing 100.

Optionally, the supporting member 40 may be made of any one of PET (Polyethylene terephthalate), PVC (Polyvinyl chloride), or PC (Polycarbonate), so that the supporting member 40 has sufficient strength and toughness, so that the supporting member 40 can still support the main body 31 with a relatively thin thickness, thereby reducing the thickness of the supporting member 40 and reserving more space for accommodating the heat source on the first side 11.

Preferably, the thickness of the support 40 in the direction from the first side 11 to the second side 12 is 0.03mm-0.1mm, and may for example be 0.04mm, 0.05mm or 0.08mm. So that the supporting member 40 can provide a supporting force to the body portion 31 while having a sufficiently small thickness.

Referring to fig. 7 and 8, in a second aspect, the present invention discloses an electronic device 200, which includes a heat source 101 and a housing 100 as described in the first aspect, wherein the heat source 101 is disposed on the first side 11 of the housing body 10. The electronic device 200 may include, but is not limited to, a mobile phone, a tablet computer, a notebook computer, a smart watch, a monitor, a car recorder, and the like. It can be understood that, since the electronic device 200 includes the housing 100 of the first aspect, the electronic device 200 has the beneficial effects of the housing 100 of the first aspect, and thus, the detailed description thereof is omitted.

In some embodiments, the electronic device 200 further includes a display screen 102 and a rear cover 103, the second side 12 of the casing body 10 has a first accommodating space, the display screen 102 is connected to the second side 12 and covers an opening of the first accommodating space, the heat dissipation member 20 and the heat conduction member 30 are located in the first accommodating space, the rear cover 103 is connected to the first side 11 of the casing body 10 and forms a second accommodating space with the first side 11, and the heat source 101 is located in the second accommodating space.

In this way, the casing 100 is positioned between the display panel 102 and the rear cover 103, that is, the casing 100 can be provided as a front case of the electronic apparatus 200, and the heat source 101 is positioned between the casing 100 and the rear cover 103 so that heat generated by the heat source 101 can be transmitted in a direction toward the display panel 102 via the casing 100, thereby preventing heat from being transmitted to the rear cover 103 (i.e., a position grasped by a human hand), and improving a user's feeling of use. Meanwhile, the arrangement of the first accommodating space and the second accommodating space is favorable for increasing the accommodating space of the electronic device 200 to accommodate structures and components such as the heat source 101, the heat conducting element 30, the heat dissipating element 20, and the like, thereby being favorable for reducing the thickness of the electronic device 200 and being favorable for miniaturization of the electronic device 200.

Reference herein to first, second, third, fourth, and various numerical designations is made for ease of description and is not intended to limit the scope of the present application.

It should be understood that, in the various embodiments of the present application, the sequence numbers of the above-mentioned processes do not imply any order of execution, and the order of execution of the processes should be determined by their functions and inherent logic, and should not constitute any limitation to the implementation process of the embodiments of the present application.

The above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.

Claims (10)

1. A casing applied to an electronic apparatus including a heat source, the casing comprising:

the shell body is provided with a first side and a second side which are opposite, the first side is used for installing the heat source of the electronic equipment, the second side is provided with a first installation groove, and the first installation groove is used for being arranged corresponding to the heat source;

a heat sink disposed on the second side; and

the heat conduction piece, the heat conduction piece be located the shell body with between the radiating piece, the heat conduction piece include the main part and connect in the installation department of main part, the installation department connect in the second side is so that the main part is located first mounting groove, the heat conduction piece is used for the conduction the heat that the heat source produced extremely the radiating piece.

2. The housing according to claim 1, wherein a bottom surface of the first mounting groove is provided with a through hole penetrating to the first side, and the main body portion of the heat-conducting member at least partially covers an opening of the through hole at the second side.

3. The housing of claim 2, wherein the heat source comprises a first heat source and a second heat source;

the first mounting groove is a long-strip-shaped groove body, the through hole is a long-strip-shaped hole, the length extending direction of the through hole is consistent with that of the first mounting groove, the part, not provided with the through hole, of the first mounting groove is used for being arranged corresponding to the first heat source, and the through hole is used for being arranged corresponding to the second heat source;

the main body portion extends to the through hole from a portion of the first mounting groove where the through hole is not provided, so as to cover the opening of the through hole.

4. The housing of claim 2, further comprising a support member disposed corresponding to the through hole, and connected to the first side and a portion of the body portion corresponding to the through hole to support the body portion.

5. The housing of claim 4, wherein the first side is provided with a positioning recess surrounding the periphery of the through hole, and the support member is connected to and located in the positioning recess.

6. The housing of claim 2, wherein the second side defines a second mounting groove disposed around the periphery of the first mounting groove, the second mounting groove being in communication with the first mounting groove, the second mounting groove having a depth less than the first mounting groove, the mounting portion being connected to and disposed in the second mounting groove.

7. The housing of claim 6, wherein the thickness of the mounting portion is less than or equal to the depth of the second mounting slot such that a side of the mounting portion facing the heat sink is lower than or even with a surface of the second side.

8. The casing of any one of claims 1 to 7, wherein the mounting portion is disposed around the periphery of the main body portion, and the mounting portion is disposed on a side of the main body portion close to the heat sink, and a dimension of the mounting portion is smaller than a dimension of the main body portion in a direction from the first side to the second side.

9. An electronic device comprising a heat source and the housing of any one of claims 1-8, the heat source being disposed on the first side of the housing body.

10. The electronic device according to claim 9, further comprising a display screen and a rear cover, wherein the second side of the housing body has a first receiving space, the display screen is connected to the second side and covers an opening of the first receiving space, the heat dissipating member and the heat conducting member are located in the first receiving space, the rear cover is connected to the first side of the housing body and forms a second receiving space with the first side, and the heat source is located in the second receiving space.

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