CN108934150B - Shell assembly and electronic equipment - Google Patents
Shell assembly and electronic equipment Download PDFInfo
- Publication number
- CN108934150B CN108934150B CN201810778293.4A CN201810778293A CN108934150B CN 108934150 B CN108934150 B CN 108934150B CN 201810778293 A CN201810778293 A CN 201810778293A CN 108934150 B CN108934150 B CN 108934150B
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- Prior art keywords
- heat
- heat conducting
- middle frame
- housing assembly
- press
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Telephone Set Structure (AREA)
Abstract
The embodiment of the application provides a casing subassembly and electronic equipment, casing subassembly includes center and metal conducting strip, and the metal conducting strip is suitable for and center assembly connection, and the metal conducting strip includes first heat-conducting portion and second heat-conducting portion. Electronic equipment is through setting up the metal conducting strip to the metal conducting strip sets up first heat-conduction portion and second heat-conduction portion, makes the heat that electronic equipment produced by homodisperse through first heat-conduction portion and second heat-conduction portion, with the temperature that reduces the key production area of heat, improves electronic equipment's functioning speed, and the improvement is controlled and is experienced.
Description
Technical Field
The application relates to the technical field of electronic equipment, in particular to a shell assembly and electronic equipment.
Background
When the existing electronic equipment works, various electrical components can generate a large amount of heat to cause the electronic equipment to be blocked, and meanwhile, after a large amount of heat is generated, a user holds the electronic equipment with a hand to be difficult, so that the heat dissipation effect of the electronic equipment is urgently needed to be improved.
Disclosure of Invention
An object of the present application is to provide a housing assembly and an electronic device, so as to improve the heat dissipation effect of the housing assembly and the electronic device.
In a first aspect, an embodiment of the present application provides a housing assembly, which includes a middle frame and a metal heat conduction sheet, wherein the metal heat conduction sheet is suitable for being assembled and connected with the middle frame, and the metal heat conduction sheet includes a first heat conduction portion and a second heat conduction portion.
In a second aspect, an embodiment of the present application provides an electronic device, including a middle frame, a first heat-generating component, a second heat-generating component, a metal heat conducting strip and a rear cover, where the first heat-generating component is installed in the middle frame, the second heat-generating component is installed in the middle frame, the metal heat conducting strip is assembled and connected to the middle frame, the metal heat conducting strip includes a first heat conducting portion and a second heat conducting portion, the first heat conducting portion contacts and covers the first heat-generating component, the second heat conducting portion contacts and covers the second heat-generating component, and the rear cover is located on one side of the metal heat conducting strip and is assembled and connected to the middle frame.
The application provides a casing subassembly and electronic equipment is through setting up the metal conducting strip to the metal conducting strip sets up first heat-conduction portion and second heat-conduction portion, makes the heat that electronic equipment produced by homodisperse through first heat-conduction portion and second heat-conduction portion, in order to reduce the temperature in the key production area of heat, improves electronic equipment's functioning speed, and the improvement is controlled and is experienced.
These and other aspects of the present application will be more readily apparent from the following description of the embodiments.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic diagram of a disassembled structure of a housing assembly provided in a first embodiment of the present application;
fig. 2 is a schematic structural view of a metal heat-conducting sheet according to a first embodiment of the present application
FIG. 3 is a partial cross-sectional view taken along line A-A of FIG. 2;
FIG. 4 is a schematic illustration of a disassembled structure of a housing assembly provided in a second embodiment of the present application;
FIG. 5 is a schematic, partially cross-sectional view of a joint provided in accordance with a second embodiment of the present application;
FIG. 6 is a sectional view of a housing assembly according to a second embodiment of the present application;
fig. 7 is a schematic partial structural diagram of an electronic device according to a third embodiment of the present application;
fig. 8 is a partial cross-sectional view of the electronic device of fig. 7.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
With the rapid development of electronic devices (e.g., mobile terminals), the assembly structure of the electronic device is more compact, and when the main board, the processor, and the battery generate a large amount of heat during operation, if the heat is not dissipated in time, the temperature of the main board, the processor, and the battery may increase sharply, which affects the operating speed and the operation experience of the processor. Therefore, the inventor proposes the housing assembly and the electronic device in the embodiment of the application. Embodiments of the present application will be described in detail below with reference to the accompanying drawings.
First embodiment
Referring to fig. 1, the present embodiment provides a housing assembly 20a, the housing assembly 20a includes a middle frame 100 and a metal heat conducting sheet 200a, wherein the middle frame 100 includes an installation component 120 and a frame 110, the frame 110 surrounds a ring, the installation component 120 is assembled on the frame 110 and located inside the frame 110, the installation component 120 may be connected to the frame 110 by way of integral molding, dispensing or welding, and the installation component 120 may be used to install various electrical components. The middle frame 100 is provided with an inner surface 123, and the inner surface 123 is used for disposing various electrical components.
Referring to fig. 2, the metal heat conduction sheet 200a is made of a metal sheet, such as Cu, A l, Au, Fe, or alloys thereof. The metal heat-conducting strip 200a is suitable for being assembled and connected with the middle frame 100, and the metal heat-conducting strip 200a can be connected with the middle frame 100 in a detachable connection manner or fixed on the middle frame 100 in a dispensing and fixing manner, for example.
The metal heat conduction sheet 200a includes a first heat conduction portion 210 and a second heat conduction portion 220, and the first heat conduction portion 210 and the second heat conduction portion 220 may conduct heat corresponding to different heating elements, respectively. In some embodiments, the first heat conduction portion 210 and the second heat conduction portion 220 may be integrally formed on the same metal sheet. In other embodiments, the first heat conduction portion 210 and the second heat conduction portion 220 may be formed of metal sheets independently, and the first heat conduction portion 210 and the second heat conduction portion 220 may be in contact with each other to conduct heat therebetween when assembled. In this embodiment, the size of the metal heat conducting strip 200a is slightly smaller than the plane area defined by the frame 110 of the middle frame 100, and the metal heat conducting strip can cover main heating elements such as a main board and a power supply disposed on the middle frame 100.
In the present embodiment, the first heat conduction part 210 corresponds to an area of the middle frame 100 where the main board is disposed, and is configured in the same configuration as the main board area, for conducting heat generated by the main board or an electrical component (e.g., a processor, a memory, etc.) disposed on the main board. The second heat conduction portion 220 corresponds to a region of the middle frame 100 where the battery is disposed, and is configured in the same configuration as the battery configuration for conducting heat generated during the operation of the battery. The first heat conduction portion 210 and the second heat conduction portion 220 are integrally connected.
Referring to fig. 2 and 3, the metal heat-conducting strip 200a has a first surface 201 and a second surface 202, and the first surface 201 and the second surface 202 are located on two sides of the metal heat-conducting strip 200a facing away from each other. The first heat conduction part 210 is provided with a fitting through hole 211, and the fitting through hole 211 penetrates the first surface 201 and the second surface 202. The assembly through hole 211 can be used for the parts such as supplying fingerprint module, the module of making a video recording to stretch out. In some embodiments, only one or more through holes 211 may be provided according to the arrangement requirements of the respective components. In other embodiments, the fitting through-hole 211 may not be provided. In this embodiment, the number of the assembling through holes 211 is one, and the fingerprint module is used to extend out from the assembling through holes 211.
When assembling, the first surface 201 of the metal heat-conducting strip 200a is bonded to the inner surface 123 of the middle frame 100 by glue, and in some embodiments, the glue may be wholly or partially connected by conductive glue, so as to electrically connect the middle frame 100 and the metal heat-conducting strip 200a, so that charges generated in the metal heat-conducting strip 200a can be transferred to the middle frame 100. In some embodiments, the metal heat-conducting plate 200a may also connect the grounding spring to the middle frame 100.
The housing assembly 20a provided in this embodiment can be applied to an electronic device, and the operating principle thereof is as follows: the first heat conduction part 210 of the metal heat conduction sheet 200a may be attached to a first heat generating element of the electronic device and conduct heat generated by the first heat generating element, and the second heat conduction part 220 may be attached to a second heat generating element of the electronic device and conduct heat generated by the second heat generating element. When the electrical components disposed on the inner surface 123 of the middle frame 100 generate heat, the heat is timely transferred to the metal heat-conducting strip 200a and is diffused to the whole machine on the metal heat-conducting strip 200a, so as to increase the heat dissipation area and realize rapid heat dissipation.
It is understood that the heat generating element refers to an electrical element that generates heat when operated, such as a motherboard, a processor, a battery, and the like.
Second embodiment
Referring to fig. 4, 5 and 6, the present embodiment provides a housing assembly 20b, the housing assembly 20b is different from the housing assembly 20a of the first embodiment in the structure of the metal heat-conducting sheet 200b, and the housing assembly 20b further includes a fixing member 500, a front case 300 and a rear cover 400. The same parts are referred to the first embodiment.
Specifically, the metal heat conduction sheet 200b includes a heat conduction body 203 and a connection portion 230 connected to the heat conduction body 203, the first heat conduction portion 210 and the second heat conduction portion 220 are disposed on the heat conduction body 203, the connection portion 230 extends toward a side of the heat conduction body 203 close to the first surface 201, and the connection portion 230 is used for being connected and fixed with the middle frame 100.
In this embodiment, the connecting portion 230 includes a plurality of press feet connected to the heat conductive body 203, the press feet are provided with first fixing holes 244, the first fixing holes 244 are disposed through the press feet and used for fixing the press feet, the connecting position of the press feet and the heat conductive body 203 may be the edge of the heat conductive body 203 or may be connected to the inner region of the heat conductive body 203. referring to fig. 5, the press feet include a first press foot 250 and a second press foot 240, the first press foot 250 is bent with respect to the heat conductive body 203, a first included angle α is formed between the extending direction of the first press foot 250 and the first plane of the heat conductive body 203, the first included angle α may be 90-150 degrees, for example, the second press foot 240 is bent with respect to the first press foot 250 and connected to the first press foot 250.
The second presser foot 240 has a ground plane 243, and the ground plane 243 is used for contacting and connecting with the inner surface 123 of the mounting member 120. Wherein the ground plane 243 is located on a side of the second presser foot 240 facing the inner surface 123 of the middle frame 100. In some embodiments, the ground plane 243 may be disposed parallel to the first surface 201, and when connected, the second presser foot 240 completely abuts the inner surface 123.
In this embodiment, the second presser foot 240 includes a first end 241 and a second end 242, wherein the first end 241 is connected to the first presser foot 250, the second end 242 is tilted toward the heat conducting body 203 relative to the first end 241, the first fixing hole 244 is located between the first end 241 and the second end 242, and in some embodiments, an axis of the first fixing hole 244 is disposed perpendicular to the first surface 201. The advantage of this arrangement is that after the second presser foot 240 is attached to the inner surface 123 of the mounting member 120 through the fixing member 500, the second presser foot 240 is subjected to a large elastic deformation force due to the bent portion relative to the first presser foot 250, and when the fixing member 500 is loosened, the second presser foot 240 tends to recover the deformation toward the second surface 202, so that the second presser foot 240 can always contact with the fixing member 500, and the fixing effect of the second presser foot 240 is ensured.
In some embodiments, the metal heat conductive sheet 200b may be electrically connected to the middle frame 100 through the second presser foot 240, so that the electric charge generated in the metal heat conductive sheet 200b can be transferred to the middle frame 100, and the middle frame 100 is grounded. At this time, since the second presser foot 240 can maintain continuous contact with the fixing member 500, the ground effect can be ensured. The grounding failure caused by the contact between the second presser foot 240 and the inner surface 123 and the fixing member 500 after the fixing member 500 is loosened can be avoided.
The second included angle β formed between the extending direction of the second presser foot 240 and the extending direction of the first presser foot 250 may be 15-90 degrees, for example.
The fixing member 500 is mainly used for connecting the connecting portion 230 with the mounting member 120, and the fixing member 500 may be in the form of a screw, a screw rod, or a pin, for example, in some embodiments, when the connecting portion 230 is grounded through the fixing member 500, the fixing member 500 may be made of a metal material, for example, and in some embodiments, the fixing member 500 may also be made of a plastic material or other materials. In this embodiment, the fixing member 500 is a screw.
Referring to fig. 6, the middle frame 100 is provided with a mounting portion 121, and the mounting portion 121 is used for being connected with the connecting portion 230 in a matching manner. In this embodiment, the mounting portion 121 is formed on the sinking portion 122 of the middle frame 100, the sinking portion 122 is formed by the inner surface 123 of the mounting member 120 sinking downward, the number of the sinking portions 122 can be set according to the number of the connecting portions 230, and meanwhile, the setting position of the sinking portion 122 corresponds to the position of the connecting portion 230. During assembly, the presser feet extend into the sunken part 122 and are connected with the middle frame 100 through the fixing piece 500, and the fixing piece 500 can be hidden in the sunken part 122 in such a way, so that the inner surface 123 of the middle frame 100 is more flat. Specifically, the first presser foot 250 and the second presser foot 240 both extend into the depressed portion 122, and the depth of the depressed portion 122 is suitable for the grounding surface 243 of the second presser foot 240 to be just attached to the depressed portion, so that the first surface 201 of the metal heat conduction sheet 200b can be attached to the inner surface 123 more closely. It is understood that it is also possible to provide the depression 122 with a greater or lesser depth.
The sinking portion 122 is provided therein with a second fixing hole 124, the second fixing hole 124 corresponds to and is matched with the first fixing hole 244, and the second fixing hole 124 is used for the fixing member 500 to pass through and connect the second middle frame 100 and the presser foot. In some embodiments, the second fixing hole 124 may be provided in the form of a blind hole, i.e., not penetrating the mount 120. In this embodiment, the second fixing hole 124 is a through hole and penetrates through the mounting member 120.
In other embodiments, the middle frame 100 may not have the sinking portion 122, and the presser foot may be directly fixed to the inner surface 123 of the middle frame 100 through the fixing member 500.
In some embodiments, the inner surface 123 of the middle frame 100 may be used to dispose various types of electrical components, and a certain gap may be formed between the electrical components, and at this time, the metal heat conduction sheet 200b may not be completely attached to the electrical components or the inner surface 123. In order to make the metal heat conducting strip 200b and the inner surface 123 closely adhere to each other and achieve a better heat conducting effect, in this embodiment, the heat conducting body 203 further includes a pressing portion 260, and the pressing portion 260 protrudes toward the middle frame 100 relative to the first heat conducting portion 210 and the second heat conducting portion 220. When the metal heat conduction sheet 200b is in contact with and attached to the electrical components disposed on the inner surface 123, the pressing portion 260 may extend from the gap between the electrical components to be attached to the inner surface 123.
In this embodiment, referring to fig. 6, the pressing portion 260 may also be fixed to the inner surface 123 of the mounting member 120 by the fixing member 500, so that the pressing portion 260 can be attached to the inner surface 123 more tightly, and the metal heat-conducting sheet 200b can be pressed against the electrical component to prevent the electrical component from loosening, and the heat generated by the electrical component can be better conducted to the metal heat-conducting sheet 200b and further conducted to the housing of the electronic device for dissipation. It is understood that in some embodiments, the pressing portion 260 may not be fixed by the fixing member 500, but only fit to the inner surface 123.
In this embodiment, the pressing portion 260 is disposed between the first heat conducting portion 210 and the second heat conducting portion 220, in this area, the number of electrical components disposed on the inner surface 123 of the middle frame 100 is small, and meanwhile, this partial area is close to the middle position of the metal heat conducting strip 200b, and a better fixing effect can be achieved by disposing the pressing portion 260 to abut against and fix the inner surface 123.
The front housing 300 is a part of the housing assembly 20b and is generally positioned directly in front of the electronic device when applied to the electronic device. Taking a mobile phone as an example, the front case 300 refers to a part of a case of the mobile phone for installing a display screen. In this embodiment, the front case 300 is assembled with the middle frame 100. Specifically, the front case 300 is mounted on the side of the middle frame 100 opposite to the metal heat conductive sheet 200 b. Referring to fig. 6, the front case 300 includes a front case bezel 310 and a connection member 320, and the front case bezel 310 has a structure substantially the same as that of the bezel 110. The front case rim 310 and the rim 110 are fastened to each other.
In some embodiments, the connection member 320 may be made of a metal material, such as magnesium aluminum alloy, and the fixing member 500 may be connected to the connection member 320 through the second fixing hole 124 to electrically communicate with each other, so that the metal heat conduction sheet 200b, the middle frame 100, and the front case 300 are electrically connected to each other, and electric charges may be transferred among the metal heat conduction sheet 200b, the middle frame 100, and the front case 300. In this embodiment, the connecting member 320 is provided with a third fixing hole 321, the position of the third fixing hole 321 corresponds to the second fixing hole 124, and the third fixing hole 321 is matched with the first fixing hole 244 and the second fixing hole 124, so that the fixing member 500 can extend into the third fixing hole 321, and the presser foot can be electrically connected to the connecting member 320 through the fixing member 500.
The rear cover 400 is used to attach to the metal heat-conducting sheet 200b and to be assembled with the middle frame 100, and the rear cover 400 is plate-shaped, may be made of various materials such as metal, ceramic, and glass, and is disposed on one side of the metal heat-conducting sheet 200b when being assembled, and presses the metal heat-conducting sheet 200b against the middle frame 100.
The housing assembly 20b provided in this embodiment can be applied to the electronic device 10 shown in fig. 7, and can uniformly conduct and distribute heat generated by the electrical components disposed in the middle frame 100 to the electronic device 10, so as to achieve the purpose of accelerating heat dissipation.
Third embodiment
Referring to fig. 7 and 8, the present embodiment provides an electronic device 10, where the electronic device 10 includes a middle frame 100, a first heat generating element 610, a second heat generating element 620, a metal heat conducting strip 200, a camera module 30, a fingerprint module 700, and a back cover 400. The middle frame 100 is used for accommodating and mounting the first and second heat generating components 610 and 620, and the rear cover 400 is assembled to the middle frame 100. Fingerprint module 700 and the module 30 of making a video recording all assemble in center 100, wherein fingerprint module 700 can cooperate with assembly through-hole 211.
In this embodiment, the specific structure of the middle frame 100 is the same as that of the first embodiment, and the structure of the metal heat-conducting strip 200 is the same as that of the second embodiment, and the same parts may be referred to the first embodiment or the second embodiment.
Specifically, in this embodiment, the first heat generating component 610 and the second heat generating component 620 are both assembled and connected to the inner surface 123 of the middle frame 100, and the first heat generating component 610 and the second heat generating component 620 are a motherboard and a battery, respectively, it should be understood that in some other embodiments, the first heat generating component 610 and the second heat generating component 620 may also be a processor, a memory, and the like.
The first heat conduction portion 210 covers the first heat generating component 610, and the second heat conduction portion 220 covers the second heat generating component 620, where the covering means that the first heat conduction portion 210 or the second heat conduction portion 220 is attached to the first heat generating component 610 or the second heat generating component 620, so that heat generated from the first heat generating component 610 can be rapidly conducted to the first heat conduction portion 210, and heat generated from the second heat generating component 620 can be rapidly conducted to the second heat conduction portion 220.
The rear cover 400 is made of a glass material, is located on one side of the metal heat conduction sheet 200, and is attached to the middle frame 100, and specifically, is located on one side of the second surface 202 of the metal heat conduction sheet 200, and is bonded to the middle frame 100. In other embodiments, the rear cover 400 may also be made of metal, ceramic, plastic, etc., and it may also be assembled with the middle frame 100 by welding, clamping, etc.
According to the electronic device provided by the embodiment, due to the arrangement of the metal heat conducting sheet 200, when the first heating component 610 and/or the second heating component 620 generate heat, the first heat conducting part 210 and the second heat conducting part 220 can conduct the heat to the metal heat conducting sheet 200, and conduct the heat to the whole device through the metal heat conducting sheet 200, so that the heat dissipation area is enlarged, and the situation that the heat is concentrated in a local area to cause the temperature of the local area of the electronic device to rise sharply to influence the operation and control is avoided. Meanwhile, since the metal heat conduction sheet 200 is made of a metal material and is disposed between the rear cover 400 and the middle frame 100, the strength of the rear cover 400 can be enhanced, and the rear cover 400 is prevented from being damaged in the situations of collision, falling, and the like.
By way of example, the electronic device 10 may be any of a variety of types of computer system devices (only one modality shown in FIG. 1 by way of example) that are mobile or portable and that perform wireless communications. In particular, the electronic device 10 may be a mobile phone or smart phone (e.g., an iPhone (TM) based, Android (TM) based phone), a Portable gaming device (e.g., a Nintendo DS (TM), a PlayStation Portable (TM), a Game Advance (TM), an iPhone (TM)), a laptop, a PDA, a Portable Internet device, a music player and data storage device, other handheld devices and head-mounted devices such as watches, earphones, pendant, earphones, and the like, and the electronic device 10 may also be other wearable devices (e.g., a head-mounted device (HMD) such as electronic glasses, electronic clothing, electronic bracelets, electronic necklaces, electronic tattoos, electronic devices, or smart watches).
The electronic device 10 may also be any of a number of electronic devices including, but not limited to, cellular telephones, smart phones, other wireless communication devices, personal digital assistants, audio players, other media players, music recorders, video recorders, cameras, other media recorders, radios, medical devices, vehicle transportation equipment, calculators, programmable remote controllers, pagers, laptop computers, desktop computers, printers, netbook computers, Personal Digital Assistants (PDAs), Portable Multimedia Players (PMPs), moving Picture experts group (MPEG-1 or MPEG-2) Audio layer 3(MP3) players, portable medical devices, and digital cameras, and combinations thereof.
In some cases, electronic device 10 may perform a variety of functions (e.g., playing music, displaying videos, storing pictures, and receiving and sending telephone calls). If desired, the electronic device 10 may be a portable device such as a cellular telephone, media player, other handheld device, wristwatch device, pendant device, earpiece device, or other compact portable device.
The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims (9)
1. A housing assembly, comprising:
a middle frame;
the metal heat conducting sheet is suitable for being assembled and connected with the middle frame and comprises a first heat conducting part and a second heat conducting part, the metal heat conducting sheet comprises a heat conducting body and a connecting part connected with the heat conducting body, the first heat conducting part and the second heat conducting part are arranged on the heat conducting body, the middle frame is provided with an installation part, the connecting part comprises a plurality of press feet, the press feet are connected with the heat conducting body and comprise a first press foot and a second press foot, the first press foot is bent relative to the heat conducting body, the second press foot is bent relative to the first press foot and is connected with the first press foot, and an included angle between the extending direction of the second press foot and the extending direction of the first press foot is larger than 15 degrees and smaller than 90 degrees; and
and the second presser foot is fastened to the mounting part through the fixing piece.
2. The housing assembly of claim 1 wherein said mounting portion includes a depressed portion formed in said center frame, said presser foot extending into said depressed portion and being connected to said center frame.
3. The housing assembly of claim 2 further comprising a front housing mounted to said center frame, said pressure foot being electrically connected to said front housing.
4. The housing assembly of claim 3 wherein said presser foot is provided with a first securing hole and said countersink is provided with a second securing hole, said first and second securing holes corresponding, said fastener passing through said first and second securing holes and electrically connecting to said front shell.
5. The housing assembly of claim 2, wherein the thermally conductive body further includes a pressing portion that protrudes toward the center frame relative to the first and second thermally conductive portions.
6. The housing assembly of claim 5, wherein the press portion is located between the first and second heat conductive portions.
7. The housing assembly of claim 1 wherein the connecting portion is bonded to the mounting portion by conductive glue.
8. The housing assembly of claim 1, wherein the first heat conducting portion is provided with a fitting through-hole.
9. An electronic device, comprising:
the housing assembly of any one of claims 1-8;
the first heating assembly is arranged on the middle frame;
the second heating component is arranged on the middle frame;
the metal heat conducting sheet is assembled and connected to the middle frame, the first heat conducting part is in contact with and covers the first heating assembly, and the second heat conducting part is in contact with and covers the second heating assembly; and
and the rear cover is positioned on one side of the metal heat-conducting fin and is assembled and connected with the middle frame.
Priority Applications (1)
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CN201810778293.4A CN108934150B (en) | 2018-07-16 | 2018-07-16 | Shell assembly and electronic equipment |
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CN201810778293.4A CN108934150B (en) | 2018-07-16 | 2018-07-16 | Shell assembly and electronic equipment |
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CN108934150A CN108934150A (en) | 2018-12-04 |
CN108934150B true CN108934150B (en) | 2020-06-23 |
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Families Citing this family (2)
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KR20200117567A (en) * | 2019-04-04 | 2020-10-14 | 삼성전자주식회사 | Electronic device with heat-radiant structure |
CN114489288A (en) * | 2020-10-27 | 2022-05-13 | 北京小米移动软件有限公司 | Mounting structure, earphone subassembly and terminal equipment |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH09148770A (en) * | 1995-11-21 | 1997-06-06 | Sanyo Electric Co Ltd | Heat radiator of electronic part in electronic device |
CN206181699U (en) * | 2016-11-14 | 2017-05-17 | 北京珠穆朗玛移动通信有限公司 | It constructs and mobile terminal to lead hot junction |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN103052299B (en) * | 2011-10-12 | 2016-04-27 | 富瑞精密组件(昆山)有限公司 | Heat radiation module and fixing means thereof |
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2018
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09148770A (en) * | 1995-11-21 | 1997-06-06 | Sanyo Electric Co Ltd | Heat radiator of electronic part in electronic device |
CN206181699U (en) * | 2016-11-14 | 2017-05-17 | 北京珠穆朗玛移动通信有限公司 | It constructs and mobile terminal to lead hot junction |
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