CN108934150B - Housing assembly and electronic device - Google Patents
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- CN108934150B CN108934150B CN201810778293.4A CN201810778293A CN108934150B CN 108934150 B CN108934150 B CN 108934150B CN 201810778293 A CN201810778293 A CN 201810778293A CN 108934150 B CN108934150 B CN 108934150B
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- 230000000994 depressogenic effect Effects 0.000 claims 2
- 238000009434 installation Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 6
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- 229910045601 alloy Inorganic materials 0.000 description 1
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- 229910052782 aluminium Inorganic materials 0.000 description 1
- SNAAJJQQZSMGQD-UHFFFAOYSA-N aluminum magnesium Chemical compound [Mg].[Al] SNAAJJQQZSMGQD-UHFFFAOYSA-N 0.000 description 1
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- 229910052737 gold Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
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Abstract
本申请实施例提供了一种壳体组件以及电子设备,壳体组件包括中框和金属导热片,金属导热片适于与中框装配连接,金属导热片包括第一导热部和第二导热部。电子设备通过设置金属导热片,并且金属导热片设置第一导热部和第二导热部,通过第一导热部和第二导热部使得电子设备产生的热量被均匀分散,以降低热量重点产生区域的温度,提高电子设备的运行速度,提高操控体验。
The embodiment of the present application provides a housing assembly and an electronic device, wherein the housing assembly includes a middle frame and a metal heat conductive sheet, wherein the metal heat conductive sheet is suitable for assembly and connection with the middle frame, and the metal heat conductive sheet includes a first heat conductive portion and a second heat conductive portion. The electronic device is provided with a metal heat conductive sheet, and the metal heat conductive sheet is provided with a first heat conductive portion and a second heat conductive portion, so that the heat generated by the electronic device is evenly dispersed through the first heat conductive portion and the second heat conductive portion, so as to reduce the temperature of the heat-generating area, increase the operating speed of the electronic device, and improve the control experience.
Description
技术领域technical field
本申请涉及电子设备技术领域,具体涉及一种壳体组件以及电子设备。The present application relates to the technical field of electronic devices, and in particular, to a housing assembly and an electronic device.
背景技术Background technique
现有的电子设备在工作时、各种电器元件会产生大量热量,引起电子设备卡顿,同时大量发热后,用户手持变得困难,因此急需提升电子设备的散热效果。When the existing electronic equipment is working, various electrical components will generate a lot of heat, causing the electronic equipment to freeze. At the same time, after a large amount of heat is generated, it becomes difficult for the user to hold it. Therefore, it is urgent to improve the heat dissipation effect of the electronic equipment.
发明内容SUMMARY OF THE INVENTION
本申请的目的在于提供一种壳体组件以及电子设备,以提高壳体组件以及电子设备的散热效果。The purpose of the present application is to provide a casing assembly and an electronic device, so as to improve the heat dissipation effect of the casing assembly and the electronic device.
第一方面,本申请实施例提供了一种壳体组件,壳体组件包括中框和金属导热片,金属导热片适于与中框装配连接,金属导热片包括第一导热部和第二导热部。In a first aspect, an embodiment of the present application provides a case assembly, the case assembly includes a middle frame and a metal heat-conducting sheet, the metal heat-conducting sheet is suitable for being assembled and connected to the middle frame, and the metal heat-conducting sheet includes a first heat-conducting portion and a second heat-conducting portion. department.
第二方面,本申请实施例提供了一种电子设备,包括中框、第一发热组件、第二发热组件、金属导热片以及后盖,第一发热组件装设于中框,第二发热组件装设于中框,金属导热片装配连接于中框,金属导热片包括第一导热部和第二导热部,第一导热部接触覆盖第一发热组件,第二导热部接触覆盖第二发热组件,后盖位于金属导热片的一侧,并与中框装配连接。In a second aspect, an embodiment of the present application provides an electronic device, including a middle frame, a first heating component, a second heating component, a metal heat-conducting sheet, and a back cover. The first heating component is mounted on the middle frame, and the second heating component is installed on the middle frame. Installed on the middle frame, the metal heat-conducting sheet is assembled and connected to the middle frame, the metal heat-conducting sheet includes a first heat-conducting part and a second heat-conducting part, the first heat-conducting part contacts and covers the first heat-generating component, and the second heat-conducting part contacts and covers the second heat-generating component. , the back cover is located on one side of the metal heat-conducting sheet, and is assembled and connected with the middle frame.
本申请提供的壳体组件以及电子设备,通过设置金属导热片,并且金属导热片设置第一导热部和第二导热部,通过第一导热部和第二导热部使得电子设备产生的热量被均匀分散,以降低热量重点产生区域的温度,提高电子设备的运行速度,提高操控体验。In the case assembly and the electronic device provided by the present application, a metal heat-conducting sheet is provided, and the metal heat-conducting sheet is provided with a first heat-conducting part and a second heat-conducting part, and the heat generated by the electronic device is uniformly distributed by the first heat-conducting part and the second heat-conducting part. Dispersion to reduce the temperature of heat-producing areas, improve the operating speed of electronic equipment, and improve the control experience.
本申请的这些方面或其他方面在以下实施例的描述中会更加简明易懂。These and other aspects of the present application will be more clearly understood in the description of the following embodiments.
附图说明Description of drawings
为了更清楚地说明本申请实施例中的技术方案,下面将对实施例描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本申请的一些实施例,对于本领域技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to illustrate the technical solutions in the embodiments of the present application more clearly, the following briefly introduces the drawings that are used in the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those skilled in the art, other drawings can also be obtained from these drawings without creative effort.
图1是本申请第一实施例提供的壳体组件的拆分结构示意图;FIG. 1 is a schematic view of the disassembled structure of the housing assembly provided by the first embodiment of the present application;
图2是本申请第一实施例提供的金属导热片的结构示意图FIG. 2 is a schematic structural diagram of the metal thermally conductive sheet provided in the first embodiment of the present application
图3是图2中沿A-A线的局部剖面图;Fig. 3 is a partial cross-sectional view along line A-A in Fig. 2;
图4是本申请第二实施例提供的壳体组件的拆分结构示意图;FIG. 4 is a schematic diagram of the disassembled structure of the housing assembly provided by the second embodiment of the present application;
图5是本申请第二实施例提供的连接部的局部剖面示意图;5 is a partial cross-sectional schematic diagram of a connecting portion provided by a second embodiment of the present application;
图6是本申请第二实施例提供的壳体组件的在组装状态剖面结构示意图;6 is a schematic cross-sectional structural diagram of the housing assembly provided in the second embodiment of the present application in an assembled state;
图7是本申请第三实施例提供的电子设备的局部结构示意图;7 is a schematic diagram of a partial structure of an electronic device provided by a third embodiment of the present application;
图8是图7中的电子设备的局部剖面图。FIG. 8 is a partial cross-sectional view of the electronic device of FIG. 7 .
具体实施方式Detailed ways
下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本申请一部分实施例,而不是全部的实施例。基于本申请中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本申请保护的范围。The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.
随着电子设备(例如移动终端)的快速发展,电子设备的组装结构更为紧凑,而主板、处理器、电池等元件在工作时会产生大量的热量,这些热量如未及时散失,会使主板、处理器以及电池等各自的区域温度急剧升高,影响处理器运行速度以及操控体验。因此,发明人提出了本申请实施例中的壳体组件及电子设备。下面将结合附图具体描述本申请的各实施例。With the rapid development of electronic devices (such as mobile terminals), the assembly structure of electronic devices is more compact, and components such as motherboards, processors, and batteries will generate a lot of heat during operation. If the heat is not dissipated in time, the motherboard will be damaged. The temperature of the respective areas such as , processor and battery rises sharply, which affects the running speed of the processor and the control experience. Therefore, the inventor proposes the housing assembly and the electronic device in the embodiments of the present application. The embodiments of the present application will be described in detail below with reference to the accompanying drawings.
第一实施例first embodiment
参阅图1,本实施例提供一种壳体组件20a,壳体组件20a包括中框100和金属导热片200a,其中中框100包括装设件120和边框110,边框110围成环状,装设件120装配于边框110并位于边框110内,装设件120可通过一体成型、点胶或焊接等方式与边框110连接,装设件120可以用于安装各种电器元件。中框100设置有内表面123,内表面123用于设置各种电学元件。Referring to FIG. 1 , the present embodiment provides a
参阅图2,金属导热片200a由金属片材制成,例如可以由Cu、A l、Au、Fe等金属或其各类型合金制成。金属导热片200a适于与中框100装配连接,金属导热片200a例如可以以可拆卸的连接方式连接于中框100,或者通过点胶固定的方式固定于中框100。Referring to FIG. 2, the metal thermal
金属导热片200a包括第一导热部210和第二导热部220,第一导热部210和第二导热部220可分别对应不同的发热元件进行导热。在一些实施方式中,第一导热部210和第二导热部220可以一体成型于同一金属片材上。在其他的一些实施方式中,第一导热部210和第二导热部220可以分别由独立的由金属片材形成,在装配时,使第一导热部210和第二导热部220接触并可相互传导热量即可。本实施例中,金属导热片200a的尺寸略小于中框100的边框110所围成的平面面积,其可覆盖设置于中框100的主板、电源等主要的发热元件。The metal heat-conducting
在本实施例中,第一导热部210对应于中框100的设置主板的区域,并被配置为与主板区域相同的构型,用于传导主板或主板上设置的电学元件(例如处理器、存储器等)产生的热量。第二导热部220对应于中框100的设置电池的区域,并被配置为与电池构型相同的构型,用于传导电池工作过程中产生的热量。第一导热部210和第二导热部220一体连接。In this embodiment, the first heat-conducting
参阅图2和图3,金属导热片200a具有第一表面201和第二表面202,第一表面201和第二表面202位于金属导热片200a的相背离的两侧。第一导热部210设置有装配通孔211,装配通孔211贯穿第一表面201以及第二表面202。装配通孔211可以用于供指纹模组、摄像模组等部件伸出。在一些实施方式中,根据各元件的设置需求,装配通孔211可以只设置一个或多个。在其他的一些实施方式中,也可以不设置装配通孔211。本实施例中,装配通孔211的数量为一个,并用于供指纹模组从装配通孔211伸出。2 and 3 , the metal thermally
装配时,金属导热片200a的第一表面201与中框100的内表面123通过胶液粘接,在一些实施方式中,胶液可以全部或部分的采用导电胶进行连接,以使中框100与金属导热片200a之间电性连接,以使产生于金属导热片200a的电荷能转移至中框100。在一些实施方式中,金属导热片200a也可以连接接地弹片与中框100接地。During assembly, the
本实施例提供的壳体组件20a可以应用于电子设备中,其工作原理是:金属导热片200a的第一导热部210可以与电子设备的第一发热元件贴合并传导第一发热元件产生的热量,第二导热部220可以与电子设备的第二发热元件贴合并传导第二发热元件产生的热量。当设置于中框100的内表面123的电学元件产生热量时,热量被及时的传到至金属导热片200a并在金属导热片200a上扩散至整机,加大散热面积,实现快速散热。The
可以理解的是,发热元件是指工作时产生热量的电学元件,例如主板、处理器、电池等。It can be understood that a heating element refers to an electrical element that generates heat during operation, such as a motherboard, a processor, a battery, and the like.
第二实施例Second Embodiment
参阅图4、图5和图6,本实施例提供一种壳体组件20b,壳体组件20b与第一实施例中的壳体组件20a的区别在于金属导热片200b的结构不同,同时壳体组件20b还包括固定件500、前壳300以及后盖400。相同部分参阅第一实施例即可。Referring to FIGS. 4 , 5 and 6 , the present embodiment provides a
具体的,金属导热片200b包括导热本体203以及连接于导热本体203的连接部230,第一导热部210和第二导热部220设于导热本体203,连接部230朝向导热本体203的靠近第一表面201的一侧伸出,连接部230用于与中框100连接固定。Specifically, the metal heat-conducting
本实施例中,连接部230包括多个压脚,多个压脚连接于导热本体203,压脚上设置有第一固定孔244,第一固定孔244贯穿压脚设置并用于固定压脚。压脚与导热本体203的连接位置可以是导热本体203的边缘,也可以连接于导热本体203的内部区域。参阅图5,压脚包括第一压脚250和第二压脚240,第一压脚250相对导热本体203弯折,且第一压脚250的延伸方向与导热本体203的第一平面之间形成第一夹角α,第一夹角α例如可以为90-150°。第二压脚240相对第一压脚250弯折并连接于第一压脚250。In this embodiment, the connecting
第二压脚240具有接地面243,接地面243用于与装设件120的内表面123接触连接。其中接地面243位于第二压脚240的朝向中框100的内表面123的一侧。在一些实施方式中,接地面243可以与第一表面201平行设置,连接时,第二压脚240完全与内表面123贴合。The
本实施例中,第二压脚240包括第一端241和第二端242,其中,第一端241与第一压脚250连接,第二端242相对于第一端241朝向导热本体203翘起,第一固定孔244位于第一端241以及第二端242之间,在一些实施方式中,第一固定孔244的轴线垂直于第一表面201设置。这样设置的好处在于,当第二压脚240通过固定件500与装设件120的内表面123贴合后,第二压脚240由于相对第一压脚250弯折的部分受到较大的弹性形变力,当固定件500出现松脱情形时,第二压脚240会有朝向第二表面202方向恢复形变的趋势,使得第二压脚240能始终与固定件500接触,保证第二压脚240的固定效果。In this embodiment, the
在一些实施方式中,金属导热片200b可以通过第二压脚240与中框100实现电连接,以使产生于金属导热片200b的电荷能转移至中框100,实现中框100的接地。此时,由于第二压脚240与固定件500之间能够保持持续的接触,可以保证接地效果。避免由于固定件500松脱后,第二压脚240与内表面123以及固定件500间均脱离接触导致接地失效。In some embodiments, the metal thermally
第二压脚240的延伸方向与第一压脚250的延伸方向之间形成第二夹角β,β例如可以为15-90°。可以理解的是,在其他的一些实施方式中,第一固定孔244的轴线方向也可以设置成与接地面243垂直的形式。A second angle β is formed between the extending direction of the
固定件500主要用于将连接部230与装设件120连接,固定件500例如可以采用螺钉、螺杆或者销钉等形式,在一些实施方式中,当连接部230通过固定件500实现接地时,固定件500例如可以采用金属材料制成,在一些实施方式中,固定件500也可以采用塑料或其他材料制成。本实施例中,固定件500为螺钉。The fixing
参阅图6,中框100设置有安装部121,安装部121用于与连接部230配合连接。本实施例中,安装部121形成于中框100的下沉部122,下沉部122由装设件120的内表面123向下凹陷形成,下沉部122的数量可以根据连接部230的数量对应设置,同时,下沉部122的设置位置与连接部230的位置对应。装配时,压脚均伸入下沉部122内通过固定件500与中框100连接,这样的设置方式可以将固定件500隐藏于下沉部122内,使中框100的内表面123更为平整。具体的,第一压脚250和第二压脚240均伸入下沉部122,下沉部122的深度以第二压脚240的接地面243能与之刚好贴合为宜,这样可以使得金属导热片200b的第一表面201可以与内表面123贴合得更为紧密。可以理解的是,下沉部122的深度再设置得深一些或浅一些也是可行的。Referring to FIG. 6 , the
下沉部122内设置有第二固定孔124,第二固定孔124与第一固定孔244位置对应且相互配合,第二固定孔124可供固定件500穿过并将第二中框100以及压脚连接。在一些实施方式中,第二固定孔124可以设置成盲孔的形式,即不贯穿装设件120。本实施例中,第二固定孔124为通孔并贯穿装设件120。The sinking
在其他的一些实施方式中,中框100可以不设置下沉部122,此时可以将压脚直接通过固定件500固定于中框100的内表面123。In other embodiments, the
在一些实施方式中,中框100的内表面123会用于设置各类型的电学元件,且各电学元件之间会产生一定的间隙,此时,金属导热片200b不能完全与电学元件或者内表面123进行贴合。为了使金属导热片200b可以与内表面123实现更紧密的贴合,实现更好的导热效果,本实施例中,导热本体203还包括压抵部260,压抵部260相对第一导热部210和第二导热部220朝向中框100凸出。当金属导热片200b与内表面123设置的电学元件接触贴合时,压抵部260可以从电学元件之间的空隙伸入与内表面123贴合。In some embodiments, the
本实施例中,请继续参阅图6,压抵部260内也可以通过固定件500将压抵部260固定于装设件120的内表面123,一方面可以使压抵部260与内表面123贴合更为紧密,另一方面也可以使金属导热片200b与电学元件间压紧,防止电学元件出现松动,并且更好的将电学元件产生的热量传导至金属导热片200b并进而传导至电子设备的壳体散失。可以理解的是,在一些实施方式中,压抵部260也可以不通过固定件500固定,而仅与内表面123贴合。In this embodiment, please continue to refer to FIG. 6 , the
本实施例中,压抵部260设置于第一导热部210和第二导热部220之间的位置,在此区域内,中框100的内表面123设置的电学元件较少,同时此部分区域靠近金属导热片200b的中部位置,通过设置压抵部260与内表面123相抵并固定可以起到更好的固定效果。In this embodiment, the
前壳300为壳体组件20b的一部分,应用于电子设备时,通常位于电子设备的正前方。以手机为例,前壳300指手机的用于设置显示屏的部分壳体。本实施例中,前壳300与中框100装配连接。具体的,前壳300装配于中框100的与金属导热片200b相背的一侧。参阅图6,前壳300包括前壳边框310和连接件320,前壳边框310为与边框110大致结构相同的结构。前壳边框310与边框110相互扣合。The
在一些实施方式中,连接件320可以由金属材料制成,例如为镁铝合金,此时固定件500可以穿过第二固定孔124与连接件320连接实现电连通,这样可以将金属导热片200b、中框100以及前壳300之间电连接,以使电荷能在金属导热片200b、中框100以及前壳300之间转移。本实施例中,连接件320设置有第三固定孔321,第三固定孔321的设置位置与第二固定孔124对应,且第三固定孔321与第一固定孔244以及第二固定孔124相互配合,可供固定件500伸入,压脚可通过固定件500与连接件320实现电连接。In some embodiments, the connecting
后盖400用于与金属导热片200b贴合并与中框100装配,后盖400为板状,可以由金属、陶瓷、玻璃等各种材料制成,装配时设置于金属导热片200b的一侧并将金属导热片200b压抵在中框100上。The
本实施例中提供的壳体组件20b可以应用于如图7所示的电子设备10中,其可以将设置于中框100的电器元件产生的热量均匀的传导分布于电子设备10,达到加快散热的目的。The
第三实施例Third Embodiment
参阅图7和图8,本实施例提供一种电子设备10,该电子设备10包括中框100、第一发热组件610、第二发热组件620、金属导热片200、摄像模组30、指纹模组700以及后盖400。其中,中框100用于容纳安装第一发热组件610、第二发热组件620,后盖400装配于中框100。指纹模组700和摄像模组30均装配于中框100,其中指纹模组700可与装配通孔211配合。Referring to FIGS. 7 and 8 , the present embodiment provides an
本实施例中,中框100的具体结构与第一实施例相同,金属导热片200的结构与第二实施例相同,相同部分请具体可参阅第一实施例或第二实施例。In this embodiment, the specific structure of the
具体的,本实施例中,第一发热组件610和第二发热组件620均装配连接于中框100的内表面123,第一发热组件610和第二发热组件620分别为主板和电池,应当理解,在其他的一些实施方式中,第一发热组件610和第二发热组件620也可以是处理器、存储器等。Specifically, in this embodiment, the
其中,第一导热部210覆盖第一发热组件610,第二导热部220覆盖第二发热组件620,此处的覆盖是指第一导热部210或第二导热部220贴合于第一发热组件610或第二发热组件620,以使产生于第一发热组件610的热量能快速的传导至第一导热部210,产生于第二发热组件620的热量能快速的传导至第二导热部220。The first heat-conducting
后盖400为板状,由玻璃材质制成,其位于金属导热片200的一侧并与中框100贴合,具体的其位于金属导热片200的第二表面202一侧,并与中框100粘结。在其他的一些实施方式中,后盖400也可以有金属、陶瓷、塑料等材质制成,其也可以通过焊接、卡接等方式与中框100装配成型。The
本实施例提供的电子设备,由于设置了金属导热片200,当第一发热组件610和/或第二发热组件620产生热量时,第一导热部210和第二导热部220可以将热量传导至金属导热片200,并经过金属导热片200将热量传导至整机,扩大散热面积,避免热量在局部区域集中,造成电子设备的局部区域温度急剧升高,影响操控。同时,由于金属导热片200为金属材质,其设置于后盖400与中框100之间,可以增强后盖400的强度,防止后盖400在碰撞、跌落等情形下破损。In the electronic device provided in this embodiment, since the metal heat-conducting
示例性的,电子设备10可以为移动或便携式并执行无线通信的各种类型的计算机系统设备中的任何一种(图1中只示例性的示出了一种形态)。具体的,电子设备10可以为移动电话或智能电话(例如,基于iPhone TM,基于Android TM的电话),便携式游戏设备(例如Nintendo DS TM,PlayStation Portable TM,Gameboy Advance TM,iPhone TM)、膝上型电脑、PDA、便携式互联网设备、音乐播放器以及数据存储设备,其他手持设备以及诸如手表、耳机、吊坠、耳机等,电子设备10还可以为其他的可穿戴设备(例如,诸如电子眼镜、电子衣服、电子手镯、电子项链、电子纹身、电子设备或智能手表的头戴式设备(HMD))。Exemplarily, the
电子设备10还可以是多个电子设备中的任何一个,多个电子设备包括但不限于蜂窝电话、智能电话、其他无线通信设备、个人数字助理、音频播放器、其他媒体播放器、音乐记录器、录像机、照相机、其他媒体记录器、收音机、医疗设备、车辆运输仪器、计算器、可编程遥控器、寻呼机、膝上型计算机、台式计算机、打印机、上网本电脑、个人数字助理(PDA)、便携式多媒体播放器(PMP)、运动图像专家组(MPEG-1或MPEG-2)音频层3(MP3)播放器,便携式医疗设备以及数码相机及其组合。
在一些情况下,电子设备10可以执行多种功能(例如,播放音乐,显示视频,存储图片以及接收和发送电话呼叫)。如果需要,电子设备10可以是诸如蜂窝电话、媒体播放器、其他手持设备、腕表设备、吊坠设备、听筒设备或其他紧凑型便携式设备的便携式设备。In some cases,
以上所述仅为本申请的优选实施例而已,并不用于限制本申请,对于本领域的技术人员来说,本申请可以有各种更改和变化。凡在本申请的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本申请的保护范围之内。The above descriptions are only preferred embodiments of the present application, and are not intended to limit the present application. For those skilled in the art, the present application may have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of this application shall be included within the protection scope of this application.
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