CN108934151B - Shell assembly and electronic equipment - Google Patents
Shell assembly and electronic equipment Download PDFInfo
- Publication number
- CN108934151B CN108934151B CN201810780845.5A CN201810780845A CN108934151B CN 108934151 B CN108934151 B CN 108934151B CN 201810780845 A CN201810780845 A CN 201810780845A CN 108934151 B CN108934151 B CN 108934151B
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- Prior art keywords
- middle frame
- glue
- boss
- conducting strip
- bonding
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The embodiment of the application provides a shell assembly and electronic equipment, the shell assembly includes center and metal conducting strip, the center has the internal surface, the metal conducting strip has the face of bonding relative with the internal surface, the face of bonding bonds in the internal surface, wherein, at least one in face of bonding and the internal surface is equipped with protects gluey portion. Through setting up the metal conducting strip, can make the heat that electronic equipment produced by homodisperse through the metal conducting strip to reduce the temperature in the key production area of heat, improve electronic equipment's functioning speed, improve and control experience. The metal conducting strip is combined with the middle frame in a bonding mode, the bonding effect is guaranteed through the arrangement of the glue protection part, and the metal conducting strip is prevented from displacing relative to the middle frame.
Description
Technical Field
The application relates to the technical field of electronic equipment, in particular to a shell assembly and electronic equipment.
Background
When the existing electronic equipment works, various electrical components can generate a large amount of heat to cause the electronic equipment to be blocked, and meanwhile, after a large amount of heat is generated, a user holds the electronic equipment with a hand to be difficult, so that the heat dissipation effect of the electronic equipment is urgently needed to be improved.
Disclosure of Invention
An object of the present application is to provide a housing assembly and an electronic device, so as to improve a heat dissipation effect.
In a first aspect, an embodiment of the present application provides a casing assembly, which includes a middle frame and a metal heat conducting sheet, wherein the middle frame has an inner surface, the metal heat conducting sheet has an adhesion surface opposite to the inner surface, the adhesion surface is adhered to the inner surface, and at least one of the adhesion surface and the inner surface is provided with a glue retaining portion.
In a second aspect, an embodiment of the present application provides an electronic device, including a middle frame, a heating element, and a metal heat conducting sheet, where the middle frame has an inner surface, the heating element is installed in the middle frame, the metal heat conducting sheet has an adhesive surface opposite to the inner surface, and the adhesive surface is adhered to the inner surface, and at least one of the adhesive surface and the inner surface is provided with a glue-retaining portion.
Compared with the prior art, the application provides a casing subassembly and electronic equipment, through setting up the metal conducting strip, can make the heat that electronic equipment produced by homodisperse through the metal conducting strip to reduce the temperature in the key production area of heat, improve electronic equipment's functioning speed, improve and control experience. The metal conducting strip is combined with the middle frame in a bonding mode, the bonding effect is guaranteed through the arrangement of the glue protection part, and the metal conducting strip is prevented from displacing relative to the middle frame.
These and other aspects of the present application will be more readily apparent from the following description of the embodiments.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic diagram of a disassembled structure of a housing assembly provided in a first embodiment of the present application;
fig. 2 is a schematic structural view of a metal heat-conducting sheet according to a first embodiment of the present application;
FIG. 3 is a top view of the inner surface of the middle frame provided by the first embodiment;
FIG. 4 is a schematic view of a glue-retaining portion according to the first embodiment;
FIG. 5 is a schematic view of a glue retaining portion according to a second embodiment;
fig. 6 is a schematic structural diagram of an electronic device according to a third embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
With the rapid development of electronic devices (e.g., mobile terminals), the assembly structure of the electronic device is more compact, and when the main board, the processor, and the battery generate a large amount of heat during operation, if the heat is not dissipated in time, the temperature of the main board, the processor, and the battery may increase sharply, which affects the operating speed and the operation experience of the processor. Therefore, the inventor proposes the housing assembly and the electronic device in the embodiment of the application. Embodiments of the present application will be described in detail below with reference to the accompanying drawings.
First embodiment
Referring to fig. 1, the present embodiment provides a housing assembly 20a, including a middle frame 100 and a metal heat conducting sheet 200, wherein the middle frame 100 includes an installation component 120 and a frame 110, the frame 110 surrounds a ring, the installation component 120 is assembled on the frame 110 and located inside the frame 110, the installation component 120 may be connected to the frame 110 by way of integral molding, dispensing or welding, and the installation component 120 may be used to install various electrical components. The middle frame 100 is provided with an inner surface 123, and the inner surface 123 is used for disposing various electrical components.
Referring to fig. 1 and 2, the metal heat-conducting sheet 200 is made of a metal sheet, and may be made of metal such as Cu, Al, Au, Fe, or various types of alloys thereof. The metal heat-conducting strip 200 is suitable for being assembled and connected with the middle frame 100, and the metal heat-conducting strip 200 may be connected to the middle frame 100 in a detachable connection manner or fixed to the middle frame 100 by a glue-dropping fixing manner, for example.
The metal heat conduction sheet 200 includes a first heat conduction portion 210 and a second heat conduction portion 220, and the first heat conduction portion 210 and the second heat conduction portion 220 may conduct heat corresponding to different heating elements, respectively. In some embodiments, the first heat conduction portion 210 and the second heat conduction portion 220 may be integrally formed on the same metal sheet. In other embodiments, the first heat conduction portion 210 and the second heat conduction portion 220 may be formed of metal sheets independently, and the first heat conduction portion 210 and the second heat conduction portion 220 may be in contact with each other to conduct heat therebetween when assembled. In this embodiment, the size of the metal heat conducting strip 200 is slightly smaller than the size of the area surrounded by the frame 110 of the middle frame 100, and the metal heat conducting strip can cover the main heating elements such as the main board and the power supply of the middle frame 100.
In the present embodiment, the first heat conduction part 210 corresponds to an area of the middle frame 100 where the main board is disposed, and is configured in the same configuration as the main board area, for conducting heat generated by the main board or an electrical component (e.g., a processor, a memory, etc.) disposed on the main board. The second heat conduction portion 220 corresponds to a region of the middle frame 100 where the battery is disposed, and is configured in the same configuration as the battery configuration for conducting heat generated during the operation of the battery. The first heat conduction portion 210 and the second heat conduction portion 220 are integrally connected.
The metal heat conduction sheet 200 further includes a pressing portion 260, and the pressing portion 260 protrudes toward the middle frame 100 relative to the first heat conduction portion 210 and the second heat conduction portion 220. When the metal heat conduction sheet 200 is in contact with and attached to the electrical components disposed on the inner surface 123, the pressing portion 260 may extend from the gap between the electrical components to be attached to the inner surface 123.
In this embodiment, referring to fig. 2, the pressing portion 260 may be provided with a fixing hole, and the pressing portion 260 is fixed to the inner surface 123 of the mounting member 120 by a fixing member, so that on one hand, the pressing portion 260 can be attached to the inner surface 123 more tightly, and on the other hand, the metal heat conducting strip 200 can be pressed against the electrical component to prevent the electrical component from loosening, and the heat generated by the electrical component can be better conducted to the metal heat conducting strip 200 and further conducted to the electronic device and dissipated. It is understood that in some embodiments, the pressing portion 260 may not be fixed by the fixing member, but only fit with the inner surface 123.
In this embodiment, the pressing portion 260 is disposed between the first heat conducting portion 210 and the second heat conducting portion 220, in this area, the number of electrical components disposed on the inner surface 123 of the middle frame 100 is small, and meanwhile, this partial area is close to the middle position of the metal heat conducting strip 200, and a better fixing effect can be achieved by disposing the pressing portion 260 to abut against and fix the inner surface 123.
The metal heat conduction sheet 200 has an adhesion surface 201 and a mounting surface 202, the adhesion surface 201 and the mounting surface 202 are located on two sides of the metal heat conduction sheet 200 facing away from each other, wherein the adhesion surface 201 is opposite to the inner surface 123 and is adhered to the inner surface 123, and the mounting surface 202 can be used for being attached or connected with a rear cover. The first heat conduction portion 210 is provided with a fitting through hole 211, and the fitting through hole 211 penetrates the adhesion surface 201 and the fitting surface 202. The assembly through hole 211 can be used for the parts such as supplying fingerprint module, the module of making a video recording to stretch out. In some embodiments, only one or more through holes 211 may be provided according to the arrangement requirements of the respective components. In other embodiments, the fitting through-hole 211 may not be provided. In this embodiment, the number of the assembling through holes 211 is one, and the fingerprint module is used to extend out from the assembling through holes 211.
Referring to fig. 1, 3 and 4, in assembly, the bonding surface 201 of the metal heat-conducting strip 200 is bonded to the inner surface 123 of the middle frame 100 by glue, and in some embodiments, the glue may be wholly or partially connected by conductive glue, so as to electrically connect the middle frame 100 and the metal heat-conducting strip 200, and enable charges generated in the metal heat-conducting strip 200 to be transferred to the middle frame 100. In some embodiments, the metal heat conduction sheet 200 may also connect the grounding spring to the middle frame 100.
In the process of bonding the metal heat-conducting sheet 200 and the inner surface 123 of the middle frame 100, since the glue solution is pre-coated on the inner surface 123 or the bonding surface 201, when bonding, the metal heat-conducting sheet 200 and the middle frame 100 are pressed close to each other, and the glue solution may be extruded out from the gap between the inner surface 123 and the bonding surface 201, which results in poor bonding effect. And the problem of uneven glue distribution can be caused.
Therefore, in this embodiment, the inner surface 123 is provided with the glue-retaining portion 140a, the glue-retaining portion 140a includes a flow-limiting protrusion 141, the flow-limiting protrusion 141 is disposed on the inner surface 123, the flow-limiting protrusion 141 protrudes from the inner surface 123, and a height of the protrusion may be, for example, 0.1 to 1mm, and the flow-limiting protrusion 141 is used to prevent glue from overflowing from a gap between the inner surface 123 and the bonding surface 201 during bonding of the metal heat conduction sheet 200 and the inner surface 123 of the middle frame 100.
The structure of the current-limiting protrusion 141 may be variously configured, and the extending direction thereof may be arbitrarily configured. In this embodiment, the flow limiting protrusion 141 includes a first protrusion 142 and a second protrusion 143, and a length extending direction of the first protrusion 142 is perpendicular to a length extending direction of the second protrusion 143. Specifically, the lengthwise extension direction of the first bosses 142 is parallel to the widthwise direction of the middle frame 100, and the lengthwise extension line of the second bosses 143 is parallel to the lengthwise direction of the middle frame 100.
Due to the arrangement mode, the probability that the glue solution is blocked by the current-limiting bosses 141 is remarkably increased, and in the process that the metal heat conducting sheet 200 is attached to the middle frame 100, the metal heat conducting sheet 200 is clamped in the length direction or the width direction by hands or a mechanical arm, so that tangential pressure generated when the metal heat conducting sheet 200 and the middle frame 100 are extruded mutually faces to the length direction or the width direction of the metal heat conducting sheet 200, and the current-limiting bosses 141 are arranged in the length direction or the width direction of the metal heat conducting sheet 200/the middle frame 100, so that the glue solution can be well blocked.
The cross section of the current limiting protrusion 141 may be, for example, an arc, a rectangle, or another polygon, in this embodiment, further, the current limiting protrusion 141 has a bottom surface 1424 and a top surface 1421 opposite to the bottom surface 1424, meanwhile, the current limiting protrusion 141 also has a first side surface 1422 and a second side surface 1423, the first side surface 1422 and the second side surface 1423 are opposite to each other, the first side surface 1422 is connected to the bottom surface 1424 and the top surface 1421, the second side surface 1423 is connected to the bottom surface 1424 and the top surface 1421, and the projected area of the top surface 1421 on the inner surface 123 is larger than the projected area of the bottom surface 1424. I.e., the top surface 1421 exceeds the bottom surface 1424, so that when the extruded glue flows, it hits the flow restriction protrusion 141, which may flow along the first side surface 1422 or the second side surface 1423 and cross the flow restriction protrusion 141, and the area of the top surface 1421 is larger than that of the bottom surface 1424, which can significantly reduce the occurrence of this. Meanwhile, the larger area of the top surface 1421 is more favorable for assembling with the metal heat conduction sheet 200.
Meanwhile, by the design mode, the surface area of the first side surface 1422 or the second side surface 1423 can be increased, the flow path of the glue along the first side surface 1422 or the second side surface 1423 is prolonged, and overflow is reduced. Further, the first side surface 1422 and/or the second side surface 1423 may be set to be a curved surface, so as to further extend the path of the glue flowing along the first side surface 1422 or the second side surface 1423, and reduce overflow.
It is understood that, in other embodiments, the current limiting bosses 141 may also be disposed on the bonding surface 201 of the metal heat conduction sheet 200. In other embodiments, the current limiting protrusion 141 may also be partially disposed on the bonding surface 201 of the metal heat conducting sheet 200 and partially disposed on the inner surface 123 of the middle frame 100.
The housing assembly 20a provided in this embodiment can be applied to the electronic device 10, and can achieve the purpose of improving the heat dissipation effect. The working principle is as follows: the first heat conduction portion 210 of the metal heat conduction sheet 200 may be attached to a first heat generating element of the electronic device 10 and conduct heat generated by the first heat generating element, and the second heat conduction portion 220 may be attached to a second heat generating element of the electronic device 10 and conduct heat generated by the second heat generating element. When the electrical components disposed on the inner surface 123 of the middle frame 100 generate heat, the heat is timely transferred to the metal heat-conducting strip 200 and is diffused to the whole machine on the metal heat-conducting strip 200, so that the heat dissipation area is increased, and rapid heat dissipation is realized.
Second embodiment
The present embodiment provides a housing assembly 20b, referring to fig. 5, which is different from the housing assembly 20a of the first embodiment in that the structure of the glue-retaining portion 140b is different from the structure of the glue-retaining portion 140 a. Specifically, in the present embodiment, the glue retaining portion 140b includes a glue overflow groove 144, and the glue overflow groove 144 is disposed on the inner surface 123. The glue overflow groove 144 may be formed by recessing the inner surface 123 of the middle frame 100, and the cross section of the glue overflow groove 144 may be rectangular, arc, dovetail, semi-circular, etc.
In this embodiment, the glue overflow groove 144 includes a first glue overflow groove 145 and a second glue overflow groove 146, and an extending direction of the first glue overflow groove 145 is perpendicular to an extending direction of the second glue overflow groove 146. Specifically, the extending direction of the first glue overflow groove 145 is parallel to the width direction of the middle frame 100, and the extending direction of the second glue overflow groove 146 is parallel to the length direction of the middle frame 100. It is understood that the extending direction of the first glue overflow groove 145 and the extending direction of the second glue overflow groove 146 can be interchanged.
Due to the arrangement mode, the probability that the glue overflowing prevention groove 144 blocks glue solution overflowing can be remarkably increased, in the process that the metal heat conducting sheet 200 is attached to the middle frame 100, the metal heat conducting sheet 200 is clamped in the length direction or the width direction by hands or a mechanical arm, so that tangential pressure generated when the metal heat conducting sheet 200 and the middle frame 100 are extruded mutually faces to the length direction or the width direction of the metal heat conducting sheet 200, the glue overflowing groove 144 is arranged in the length direction or the width direction of the metal heat conducting sheet 200/the middle frame 100, glue solution in the glue overflowing groove 144 is more, larger surface tension can be generated, the extruded and flowing glue solution can be adsorbed, the flowing speed of the glue solution is reduced, and the glue solution cannot be extruded out of a gap between the middle frame 100 and the metal heat conducting sheet 200.
It is understood that the glue overflow groove 144 may also be disposed on the bonding surface 201 of the metal heat conducting sheet 200, or a portion of the glue overflow groove 144 is disposed on the inner surface 123 of the middle frame 100, and a portion of the glue overflow groove 144 is disposed on the bonding surface 201 of the metal heat conducting sheet 200.
In other embodiments, the first glue overflow groove 145 is formed on the inner surface 123, the second glue overflow groove 146 is formed on the bonding surface, and the first glue overflow groove 145 and the second glue overflow groove 146 are staggered. The first glue overflow groove 145 and the second glue overflow groove 146 are respectively arranged on the inner surface 123 and the bonding surface 201, so that the inner surface 123 and the bonding surface 201 have larger surface tension, flowing glue can be better adsorbed, and the glue is more uniformly distributed.
In other embodiments, the first glue overflow groove 145 is formed on the inner surface 123, the second glue overflow groove 146 is formed on the bonding surface, and the extending direction of the first glue overflow groove 145 intersects with the extending direction of the second glue overflow groove 146. Specifically, the extending direction of the first glue overflow groove 145 and the extending direction of the second glue overflow groove 146 intersect and are perpendicular to each other. The arrangement mode can enhance the bonding force between the metal heat conducting strip 200 and the middle frame 100, the glue overflowing grooves 144 are mutually staggered, glue extruded from the first glue overflowing groove 145 can further enter the second glue overflowing groove 146, and overflow is reduced. Meanwhile, the intersecting first glue-overflowing grooves 145 and second glue-overflowing grooves 146 can generate an effect similar to "reinforced concrete" to firmly bond the metal heat-conducting strip 200 and the middle frame 100 together.
The housing assembly 20b provided in the present embodiment can be applied to the electronic device 10, which can achieve the purpose of improving the heat dissipation effect. The working principle is as follows: the first heat conduction portion 210 of the metal heat conduction sheet 200 may be attached to a first heat generating element of the electronic device 10 and conduct heat generated by the first heat generating element, and the second heat conduction portion 220 may be attached to a second heat generating element of the electronic device 10 and conduct heat generated by the second heat generating element. When the electrical components disposed on the inner surface 123 of the middle frame 100 generate heat, the heat is timely transferred to the metal heat-conducting strip 200 and is diffused to the whole machine on the metal heat-conducting strip 200, so that the heat dissipation area is increased, and rapid heat dissipation is realized.
Third embodiment
Referring to fig. 6, the present embodiment provides an electronic device 10, which includes a middle frame 100, a heat generating component (not shown), a camera module 30, a fingerprint module 400, a metal heat conducting strip 200, a front case (not shown), and a rear cover 40. The structure and connection manner of the middle frame 100 and the metal heat conducting sheet 200 can refer to the first embodiment.
The heat generating component refers to an electrical component that generates heat during operation, such as a motherboard, a processor, a memory, a battery, etc., and is disposed on the inner surface 123 of the middle frame 100.
The rear cover 40 is made of a glass material, is located on one side of the metal heat conduction sheet 200, and is attached to the middle frame 100, and specifically, is located on the second surface side of the metal heat conduction sheet 200, and is bonded to the middle frame 100. In other embodiments, the rear cover 40 may also be made of metal, ceramic, plastic, etc., and it may also be assembled with the middle frame 100 by welding, clamping, etc.
Preceding shell is suitable for with center 100 assembly to and the one side that backs on with metal conducting strip 200 of installing piece 120, preceding shell and center 100 lock joint, preceding shell is used for setting up subassembly such as display screen.
The electronic device 10 provided by this embodiment, owing to set up the metal conducting strip 200, can make the heat that electronic device 10 produced by homodisperse through metal conducting strip 200 to reduce the temperature in the key production area of heat, improve the functioning speed of electronic device 10, improve and control experience. The metal heat-conducting strip 200 is combined with the middle frame 100 in a bonding mode, and the bonding effect is ensured by arranging the glue protection part 140, so that the metal heat-conducting strip 200 is prevented from displacing relative to the middle frame 100.
Specifically, the electronic apparatus 10 may be a mobile phone or a smart phone (e.g., an iPhone-based phone), a Portable game device (e.g., Nintendo DS, PlayStation Portable, game Advance, iPhone), a laptop computer, a PDA, a Portable internet device, a music player, and a data storage device, other handheld devices, and a head-mounted device (HMD) such as a watch, a headset, a pendant, a headset, etc., and the electronic apparatus 10 may also be other wearable devices (e.g., a head-mounted device (HMD) such as electronic glasses, electronic clothes, an electronic bracelet, an electronic necklace, an electronic tattoo, an electronic device, or a smart watch).
The electronic device 10 may also be any of a number of electronic devices including, but not limited to, cellular phones, smart phones, other wireless communication devices, personal digital assistants, audio players, other media players, music recorders, video recorders, cameras, other media recorders, radios, medical devices, vehicle transportation equipment, calculators, programmable remote controllers, pagers, laptop computers, desktop computers, printers, netbook computers, Personal Digital Assistants (PDAs), Portable Multimedia Players (PMPs), moving Picture experts group (MPEG-1 or MPEG-2) Audio layer 3(MP3) players, portable medical devices, and digital cameras, and combinations thereof.
In some cases, the electronic device 10 may perform a variety of functions (e.g., playing music, displaying video, storing pictures, and receiving and sending telephone calls). If desired, the electronic device 10 may be a portable device such as a cellular telephone, media player, other handheld device, wrist watch device, pendant device, earpiece device, or other compact portable device.
The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims (6)
1. A housing assembly, comprising:
a middle frame having an inner surface; and
a metal heat-conducting sheet having an adhesive surface opposite to the inner surface, the adhesive surface being adhered to the inner surface;
at least one of the bonding surface and the inner surface is provided with a glue protection part, the glue protection part comprises a flow limiting boss, the flow limiting boss is arranged on the inner surface or the bonding surface, the flow limiting boss is provided with a bottom surface and a top surface opposite to the bottom surface, and the projection area of the top surface on the inner surface is larger than the projection area of the bottom surface on the inner surface.
2. The housing assembly of claim 1, wherein the glue retention portion includes a flow restriction boss disposed on the inner surface and the bonding surface.
3. The housing assembly of claim 2, wherein the flow restricting boss comprises a first boss and a second boss, a length extension direction of the first boss being perpendicular to a length extension direction of the second boss.
4. The housing assembly of claim 3, wherein a length extension direction of the first boss is parallel to a width direction of the middle frame, and a length extension direction of the second boss is parallel to a length direction of the middle frame.
5. The housing assembly of claim 3, wherein the flow restriction boss further comprises a first side surface and a second side surface, the first side surface and the second side surface being disposed opposite each other, the first side surface being connected to the bottom surface and the top surface, the second side surface being connected to the bottom surface and the top surface, at least one of the first side surface and the second side surface being curved.
6. An electronic device, comprising:
a middle frame having an inner surface;
the heating component is arranged on the middle frame; and
the metal heat conducting sheet is provided with an adhesive surface opposite to the inner surface, the adhesive surface is adhered to the inner surface, at least one of the adhesive surface and the inner surface is provided with a glue protection part, the glue protection part comprises a flow limiting boss, the flow limiting boss is arranged on the inner surface or the adhesive surface, the flow limiting boss is provided with a bottom surface and a top surface opposite to the bottom surface, and the projection area of the top surface on the inner surface is larger than the projection area of the bottom surface on the inner surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810780845.5A CN108934151B (en) | 2018-07-16 | 2018-07-16 | Shell assembly and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810780845.5A CN108934151B (en) | 2018-07-16 | 2018-07-16 | Shell assembly and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108934151A CN108934151A (en) | 2018-12-04 |
| CN108934151B true CN108934151B (en) | 2020-02-14 |
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| CN201810780845.5A Active CN108934151B (en) | 2018-07-16 | 2018-07-16 | Shell assembly and electronic equipment |
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| CN113311688B (en) * | 2020-02-26 | 2022-08-12 | Oppo广东移动通信有限公司 | Middle frame and preparation method thereof, watch body and wearable device |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006156979A (en) * | 2004-10-27 | 2006-06-15 | Brother Ind Ltd | Electronic part loading substrate, heat transfer member for electronic part loading substrate, and liquid injection head |
| CN101105565B (en) * | 2006-07-14 | 2010-08-25 | 鸿富锦精密工业（深圳）有限公司 | Lens module |
| CN202344994U (en) * | 2011-11-02 | 2012-07-25 | 宸鸿科技(厦门)有限公司 | Fitting structure and electronic device with same |
| CN104749858A (en) * | 2015-03-12 | 2015-07-01 | 南昌欧菲光电技术有限公司 | Bracket for camera die set and camera die set |
| CN105992504B (en) * | 2015-03-19 | 2020-04-10 | 奇鋐科技股份有限公司 | Method for manufacturing heat sink |
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