CN113037894B - Electronic equipment - Google Patents

Abstract

This application mainly relates to an electronic device. The electronic device includes a display module, a rear cover, a middle frame and a microphone assembly. The display module and the rear cover are respectively connected to the middle frame. The microphone assembly is arranged between the display module and the rear Between the covers, at least one side edge of the display module is bent toward the middle frame, and the back cover cooperates with the middle frame to form a gap, which serves as a sound pickup hole for the microphone assembly. Compared with the related technology that directly sets the sound pickup hole of the microphone on the mobile phone shell, this application indirectly forms a gap through the cooperation between the rear cover and the middle frame, and the gap is used as the sound pickup hole of the microphone, which can increase the sound pickup. The concealment of the hole can increase the overall consistency of the appearance of the electronic device.

Description

an electronic device

technical field

The present application relates to the technical field of electronic equipment, in particular to an electronic equipment.

Background technique

With the continuous popularization of electronic devices, electronic devices have become an indispensable social and entertainment tool in people's daily life, and people's requirements for electronic devices are also getting higher and higher. And existing electronic equipment (such as mobile phone) generally needs to offer a hole on its casing, as the sound pickup hole of microphone in the mobile phone. Due to the large size of the above-mentioned holes, the hole diameter is generally 1.2mm, which destroys the overall consistency of the appearance of the mobile phone.

Contents of the invention

An embodiment of the present application provides an electronic device, wherein the electronic device includes a display module, a rear cover, a middle frame, and a microphone assembly, the display module and the rear cover are respectively connected to the middle frame, and the microphone assembly is arranged on the display module Between the back cover and the back cover, at least one side edge of the display module is bent toward the middle frame, and the back cover cooperates with the middle frame to form a notch, which serves as a sound pickup hole for the microphone component.

The beneficial effects of the application are: compared with the related art where the sound pickup hole of the microphone is directly provided on the mobile phone shell, the application indirectly forms a gap through the cooperation between the rear cover and the middle frame, and the gap is used as a pickup hole for the microphone. The sound hole can increase the concealment of the sound pickup hole, thereby increasing the overall consistency of the appearance of the electronic device.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings that need to be used in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those skilled in the art, other drawings can also be obtained based on these drawings without creative effort.

FIG. 1 is a schematic structural diagram of an embodiment of an electronic device provided by the present application;

Fig. 2 is a schematic diagram of an exploded structure of the electronic device in Fig. 1;

Fig. 3 is a partial structural schematic diagram of the electronic device in Fig. 1;

Fig. 4 is a schematic diagram of the side structure of the electronic device in Fig. 1;

Fig. 5 is a schematic side view of another embodiment of the electronic device in Fig. 1;

Fig. 6 is a partially enlarged structural schematic diagram of part C in Fig. 1;

Fig. 7 is a partial enlarged structural schematic diagram of part D in Fig. 2;

Fig. 8 is a schematic cross-sectional structure diagram of the electronic device in Fig. 3 along the VIII-VIII direction;

Fig. 9 is a schematic cross-sectional structure diagram of the middle frame in Fig. 8;

Fig. 10 is a schematic cross-sectional structure diagram of the first bracket in Fig. 8;

Fig. 11 is a schematic diagram of an exploded structure of the electronic device in Fig. 3;

Fig. 12 is a schematic cross-sectional structure diagram of another embodiment of the electronic device in Fig. 8;

FIG. 13 is a schematic top view of the electronic device in FIG. 1;

Fig. 14 is a schematic cross-sectional structure diagram of the driving circuit assembly in Fig. 8;

Fig. 15 is a schematic cross-sectional structure diagram of another embodiment of the stent in Fig. 14;

FIG. 16 is a schematic diagram of a partially enlarged structure of part E in FIG. 8 .

Detailed ways

The application will be described in further detail below in conjunction with the accompanying drawings and embodiments. In particular, the following examples are only used to illustrate the present application, but not to limit the scope of the present application. Likewise, the following embodiments are only some of the embodiments of the present application but not all of them, and all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present application.

Reference herein to an "embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application. The occurrences of this phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is understood explicitly and implicitly by those skilled in the art that the embodiments described herein can be combined with other embodiments.

Referring to FIGS. 1 to 3 together, FIG. 1 is a schematic structural diagram of an embodiment of an electronic device provided by the present application, FIG. 2 is a schematic diagram of an exploded structure of the electronic device in FIG. 1 , and FIG. 3 is a schematic diagram of a partial structure of the electronic device in FIG. 1 .

In the embodiment of the present application, the electronic device 10 may be a portable device such as a mobile phone, a tablet computer, a notebook computer, and a wearable device. The embodiment of the present application is described by taking the electronic device 10 as a mobile phone as an example. Wherein, the electronic device 10 includes a display module 11 , a rear cover 12 , a middle frame 13 , a first bracket 14 and a microphone assembly 15 , as shown in FIG. 2 . The display module 11 and the rear cover 12 are respectively connected to the middle frame 13 so that the three are assembled to form a basic structure in which the display module 11 and the rear cover 12 hold the middle frame 13 together, as shown in FIG. 1 . For example, the display module 11 and the rear cover 12 are respectively covered on two opposite sides of the middle frame 13 by one of assembly methods such as clamping, gluing and welding, and a combination thereof. The first bracket 14 is arranged between the display module 11 and the rear cover 12, and is spliced with the middle frame 13; the first bracket 14 can be close to the rear cover 12 to play the role of supporting the rear cover 12, so as to avoid The rear cover 12 is deformed or broken under the action of external force. Furthermore, the microphone assembly 15 and other structural components such as battery, motherboard, camera module, fingerprint module, etc. are also arranged between the display module 11 and the rear cover 12, so that the electronic device 10 can realize corresponding functions.

In the embodiment of the present application, the rear cover 12 cooperates with the middle frame 13 to form a notch 16 , as shown in FIG. 3 , the notch 16 serves as a sound pickup hole of the microphone assembly 15 . Wherein, the notch 16 may be a tiny slit, and the specific structure will be described in detail later. Compared with the related art that directly opens the sound pickup hole of the microphone on the mobile phone shell, the embodiment of the present application indirectly forms a notch 16 through the cooperation between the rear cover 12 and the middle frame 13, so that the notch 16 is used as the microphone assembly 15. The sound pickup hole can increase the concealment of the sound pickup hole, thereby increasing the overall consistency of the appearance of the electronic device 10 . Further, the middle frame 13 is provided with a first sound transmission channel, and the first sound transmission channel is connected to the gap 16; the first bracket 14 is provided with a second sound transmission channel, and the second sound transmission channel is connected to the first sound transmission channel; the microphone The component 15 is arranged at the end of the second sound transmission channel away from the first sound transmission channel, so that the microphone component 15 can communicate with the external environment, and the specific structure will be described in detail later. In other words, the middle frame 13 and the first bracket 14 of the embodiment of the present application can not only support the rear cover 12 , but also cooperate with each other to form a sound transmission channel through which the microphone assembly 15 communicates with the external environment.

The display module 11 may be a screen such as LCD (Liquid Crystal Display), or a screen such as OLED (Organic Light-Emitting Diode), or a screen such as Mini-LED or Micro-LED. The embodiment of the present application is described by taking the display module 11 as an OLED screen as an example. Generally, the display module 11 includes a transparent cover 111 , a display panel 112 and a driving circuit assembly 113 , as shown in FIG. 2 . The display panel 112 can be attached to the transparent cover 111 by means of glue such as OCA (Optically Clear Adhesive), PSA (Pressure Sensitive Adhesive, pressure sensitive adhesive). Wherein, the material of the transparent cover plate 111 can be glass, polyimide (Polyimide, PI) or colorless polyimide (Colorless Polyimide, CPI), which is mainly used to protect the display panel 112 and can be used as an electronic The outer surface of the device 10 is convenient for the user to perform touch operations such as clicking and sliding. The display panel 112 is mainly used for displaying images, and can be used as an interactive interface to instruct the user to perform the touch operation on the transparent cover 111 . The drive circuit assembly 113 is generally disposed on the side of the display panel 112 away from the transparent cover 111 and is electrically connected to the display panel 112. The specific structure will be described in detail later, so that the display panel 112 can display images.

The rear cover 12 is also the battery cover of the electronic device 10 , and its material can be glass, metal, hard plastic, etc., and can also be made of other electrochromic materials. The rear cover 12 has a certain structural strength and is mainly used to protect the electronic device 10 together with the transparent cover 111 . Correspondingly, the material of the middle frame 13 may also be glass, metal and hard plastic. The middle frame 13 also has a certain structural strength, and is mainly used to support and fix the microphone assembly 15 and other structural components such as batteries, main boards, fingerprint modules and camera modules. Furthermore, since the rear cover 12 and the middle frame 13 are generally directly exposed to the external environment, the material of the rear cover 12 and the middle frame 13 may preferably have certain properties such as wear resistance, corrosion resistance, and scratch resistance, or the rear cover 12 and the outer surface of the middle frame 13 (that is, the outer surface of the electronic device 10 ) is coated with a layer of functional material for wear resistance, corrosion resistance and scratch resistance. In some embodiments, the rear cover 12 and the middle frame 13 can be two separate structural parts, as shown in FIG. to assemble. In some other embodiments, the rear cover 12 and the middle frame 13 may also be integrally formed structural parts, for example, made by processes such as hot bending, stamping and injection molding.

Generally, the electronic device 10 may have a box-like appearance structure as a whole, that is, the display module 11 , the rear cover 12 and the middle frame 13 may all have a rectangular structure. Wherein, the display module 11 has four side edges, the back cover 12 also has four side edges, and the middle frame 13 also has four side edges correspondingly; between the two side edges of the display module 11, the back cover Arc transitions are generally adopted between the two side edges of 12 and between the two side edges of the middle frame 13 to increase the aesthetic appearance and gripping feel of the electronic device 10 . Further, at least one of the four side edges of the display module 11 can be bent toward the middle frame 13, so that the picture displayed by the display module 11 can extend from the front of the display module 11 to the its side. Correspondingly, at least one of the four side edges of the rear cover 12 may be bent toward the middle frame 13 , so as to increase the aesthetic appearance and grip of the rear cover 12 . Wherein, the radius of curvature of the display module 11 bent toward the middle frame 13 may be greater than or equal to the radius of curvature of the rear cover 12 bent toward the middle frame 13, so as to increase the size of the screen displayed on the side of the display module 11, thereby improving the electronic device 10. display effect.

It should be noted that the side edge mentioned in the embodiment of the present application is a simple statement, which does not take into account the width of the side edge, nor does it take into account the functions of the display module 11, the rear cover 12 and the middle frame 13 in the electronic device 10. Dimensions in the thickness direction.

In some embodiments, the four side edges of the display module 11 and the four side edges of the rear cover 12 can all be curved toward the middle frame 13, as shown in FIG. 1 and FIG. The edges can all be curved structures. Such setting can not only reduce or even hide the width of the black border of the display module 11, so that the electronic device 10 can provide users with a larger display field of view, but also enable the display module 11 to create a visual effect of surround display, In this way, the electronic device 10 can bring users a visual experience different from flat screens such as notch screens, water drop screens, hole-digging screens, lifting cameras, and sliding cameras, thereby increasing the competitiveness of the electronic device 10 . In some other implementation manners, the display module 11 and the rear cover 12 may also have a single-sided curved, double-sided curved or tri-sided curved structure. In the embodiment of the present application, the electronic device 10 is described by taking a structure in which the display module 11 and the rear cover 12 are both tetrahedral curved as an example. Wherein, the electronic equipment 10 shown in Figure 1 and Figure 2 only describes a part (for example, a quarter) of the display module 11, the rear cover 12 and the middle frame 13, and the structures of other parts are the same as those shown in the illustration or similar and will not be repeated here. The specific structure of the quarter part of the electronic device 10 will be described in detail below.

1 to 3, the transparent cover 111 includes a first straight portion 1111 and a first curved portion 1112, the first curved portion 1112 is connected to the first straight portion 1111, and the two transition smoothly; the first curved portion 1112 extends toward the direction close to the middle frame 13, so that the edge area of the transparent cover 111 is curved, so that the side surface of the display module 11 is curved. Wherein, the transparent cover 111 may be integrally formed.

In some embodiments, the display panel 112 is attached to the first straight portion 1111 so that the front of the display module 11 can display images; When receiving short messages, WeChat messages, QQ messages and other information, flash to remind the user, and also flash with the rhythm of the music when the electronic device 10 plays music to create a music atmosphere. In some other embodiments, the display panel 112 may include a main display part 1121 and a sub-display part 1122, the sub-display part 1122 is connected to the main display part 1121, and the two are smoothly transitioned; the main display part 1121 is pasted on the first flat portion 1111 and the sub-display portion 1122 are attached to the first curved portion 1112, so that the edge area of the display panel 112 is curved, so that the front and side of the display module 11 can display images, and then the electronic device 10 can be The user is provided with a larger display field of view. In the embodiment of the present application, after the display panel 112 is pasted on the transparent cover 111, the minimum bending radius of the auxiliary display part 1122 relative to the main display part 1121 can be 6 mm, that is, the minimum curvature radius of the display module 11 can be 6mm. Taking mobile phones as an example, the thickness of the whole machine is generally less than 10mm. The radius of curvature of this value enables the side of the mobile phone to display more images, thereby enabling the mobile phone to provide users with a larger display field of view.

The rear cover 12 includes a second straight portion 121 and a second curved portion 122 , the second curved portion 122 surrounds the second straight portion 121 , and the two smoothly transition; the second curved portion 122 bends towards the direction close to the middle frame 13 , so that the edge area of the rear cover 12 is curved. Wherein, the rear cover 12 may be integrally formed.

Further, the first bending portion 1112 and the second bending portion 122 can be respectively connected to two opposite sides of the middle frame 13 by one of assembly methods such as clamping, gluing, and welding, and a combination thereof. In some other embodiments, the first straight portion 1111 and the second straight portion 121 can also be slightly bent, for example, both of them are bent toward the middle frame 13, so that the thickness of the electronic device 10 gradually decreases from the middle area to the surrounding area. Small.

It should be noted that the integrally formed structure described in the embodiments of the present application means that the structure of the product is an organic whole, which cannot be simply split or divided. For example: the embodiment of the present application can use hot bending or heat absorption technology to bend the tempered glass in the form of a flat plate into the above-mentioned curved transparent cover plate 111 according to predetermined process parameters, as shown in Figures 1 and 2, and the bent part is in line with the There is a natural arc transition between the straight parts. Wherein, the above-mentioned process parameters can be reasonably designed according to factors such as the type of raw materials, the bending angle, and the radius of curvature, and are not limited here. Furthermore, a flat OLED screen can be attached to the transparent cover plate 111 to form the above-mentioned curved display panel 112 . Therefore, the line between the first straight portion 1111 and the first curved portion 1112 in FIG. 1 and FIG. The lines between 122 are only to show the boundaries between the various parts mentioned above. In other words, for the transparent cover 111 , the display panel 112 and the rear cover 12 in the actual product, the above-mentioned lines do not really exist, that is, there is a smooth transition between the above-mentioned parts.

Further, the rear cover 12 of the embodiment of the present application is provided with a cutout 123, and the cutout 123 can be specifically opened on the edge of the second curved portion 122, as shown in FIG. A notch 16 is formed in cooperation with each other, as shown in FIG. 3 , the notch 16 is used as a sound pickup hole of the microphone assembly 15 . Wherein, the width of the cutout 123 (that is, the size of the gap between the rear cover 12 and the middle frame 13) can be 0.1-0.3 mm; preferably, the width can be 0.15-0.2 mm, and the length of the cutout 123 can be 3 mm. −4 mm, that is, the cutout 123 may have a rectangular structure on the appearance of the rear cover 12 . Furthermore, the depth of the cutout 123 is based on the penetration through the rear cover 12 , so that the notch 16 formed by the cooperation between the rear cover 12 and the middle frame 13 at the cutout 123 can be used as a sound pickup hole for the microphone assembly 15 . With this arrangement, for the user, the notch 16 can appear as a long and narrow gap on the appearance of the electronic device 10 . Since the tiny gap is small, it is difficult to be noticed by the user, which can increase the concealment of the sound pickup hole, thereby increasing the overall consistency of the appearance of the electronic device 10 . In some other embodiments, the incision 123 may also be in a zigzag shape, including a series of micro-incisions, and the micro-incisions may be one or more of regular shapes such as semicircle, rectangle, square, and triangle. Further, the rear cover 12 and the middle frame 13 can also be provided with functional parts (not shown in Figs. It can also take into account the waterproof and dustproof requirements of the electronic device 10 at the gap 16 .

It should be noted that the cutout 123 described in the embodiment of the present application can also be set on the middle frame 13, or can be set on the rear cover 12 and the middle frame 13 at the same time, and the middle frame 13 and the rear cover 12 can also be made at the cutout 123. Cooperate to form the notch 16 . Take the notch 123 opened in the middle frame 13 as an example for a brief description: the width of the notch 123 (that is, the gap between the middle frame 13 and the rear cover 12) can be 0.1-0.3 mm; preferably, the width can be 0.15-0.2mm, and the length of the cutout 123 can be 3-4mm, that is, the cutout 123 can be arranged in a rectangular shape on the appearance of the middle frame 13 . Further, the depth of the cutout 123 is based on the penetration through the middle frame 13 , so that the notch 16 formed by the cooperation between the rear cover 12 and the middle frame 13 at the cutout 123 can be used as a sound pickup hole for the microphone assembly 15 . With this arrangement, for the user, the notch 16 can appear as a long and narrow gap on the appearance of the electronic device 10 . Since the tiny gap is small, it is difficult to be noticed by the user, which can increase the concealment of the sound pickup hole, thereby increasing the overall consistency of the appearance of the electronic device 10 .

The middle frame 13 includes a frame 131 and a middle plate 132 , and the middle plate 132 is connected to the frame 131 . Wherein, the material of the frame 131 can be metal, and the material of the middle plate 132 can be hard plastic, and the two can be made into the middle frame 13 by injection molding, that is, the middle frame 13 can be integrally formed as a structural part, which can The structure of the middle frame 13 is simplified, and the manufacturing cost of the middle frame 13 is reduced. At this time, the frame 131 can be exposed to the external environment, and has an appearance surface, which can play a decorative role; while the middle plate 132 is mainly located inside the electronic device 10, and can support and fix the first bracket 14 and the microphone assembly 15. The role of other structural parts. In the embodiment of the present application, the notch 16 may be formed by cooperation of the frame 131 and the second bending portion 122 . Further, the above-mentioned first sound transmission channel is mainly opened in the middle plate 132 .

In some embodiments, the display module 11 and the rear cover 12 can not only have a four-sided curved structure in appearance, but also have a symmetrical structure with respect to the middle frame 13 (especially the frame 131 ), as shown in the figure 4, so that the electronic device 10 can create a sense of symmetry for the user. At this time, the maximum outline of the electronic device 10 is located at the frame 131 of the middle frame 13 , as indicated by the dotted line indicated by arrow A in FIG. 4 . In some other embodiments, the display module 11 can further bend and extend toward the middle frame 13 on the basis of the above-mentioned symmetrical structure, that is, in the thickness direction of the electronic device 10, the bending depth H1 of the display module 11 greater than the bending depth H2 of the rear cover 12 (specifically, the bending depth of the first bending portion 1112 may be greater than the bending depth of the second bending portion 122), as shown in FIG. 5 , to increase the side display area of the display module 11, thereby This enables the electronic device 10 to provide users with a larger display field of view. At this time, the maximum outline of the electronic device 10 is located at the first curved portion 1112 of the display module 11 , as shown by the dotted line indicated by arrow B in FIG. 5 .

It should be noted that the maximum contour line mentioned in the embodiment of the present application may refer to the contour line corresponding to the maximum projected area when the electronic device 10 is projected along its thickness direction.

Referring to FIG. 6 and FIG. 7 together, FIG. 6 is a schematic diagram of a partially enlarged structure of part C in FIG. 1 , and FIG. 7 is a schematic diagram of a partially enlarged structure of part D in FIG. 2 .

Based on the above detailed description, since the display module 11 and the rear cover 12 can both be curved toward the middle frame 13, when the display module 11, the rear cover 12 and the middle frame 13 are connected, the display module 11 An arc-shaped space is formed between the rear cover plate 12 and the rear cover plate 12 . Therefore, the side of the middle plate 132 close to the display module 11 may be a curved surface with the same or similar curvature radius as that of the display module 11 (specifically, the sub-display portion 1122 ), and the side of the middle plate 132 close to the rear cover 12 may be a curved surface close to the rear cover 12 . The cover plate 12 (specifically, the second curved portion 122) has a curved surface with the same or similar radius of curvature, as shown in FIGS. 6 and 7 , so that the middle plate 132 can better support the display module 11 and the rear cover through the curved surface structure. board 12 , thereby increasing the structural strength of the electronic device 10 as a whole, thereby increasing the reliability of the electronic device 10 . In some other embodiments, for example, when the radius of curvature of the display module 11 and the rear cover 12 is relatively large (that is, the degree of curvature is small), the sides of the middle plate 132 that are close to the display module 11 and the rear cover 12 are respectively It can also be a straight plane to simplify the structure of the middle plate 132 and reduce the processing difficulty of the middle frame 13 .

Further, the two surfaces at the junction of the frame 131 and the middle plate 132 may also be recessed toward each other to form a first groove 133 and a second groove 134 . Wherein, the first groove 133 is close to the display module 11, and the second groove 134 is close to the rear cover 12, as shown in FIG. 6; and the distance between the first groove 133 and the second groove 134 is smaller than The width of the appearance surface in the thickness direction of the electronic device 10, as shown in FIG. The curved surface of 132 extends to the second groove 134 , as shown in FIG. 6 , so that the display module 11 and the rear cover 12 can be partially hidden in the middle frame 13 . That is to say, the middle frame 13 can protect the side edges of the display module 11 and the rear cover 12 to a certain extent, thereby increasing the reliability of the electronic device 10 .

In the embodiment of the present application, the width of the appearance surface of the frame 131 in the thickness direction of the electronic device 10 may be less than or equal to 1.8 mm; preferably, the width is greater than or equal to 1.4 mm and less than or equal to 1.6 mm, so that the display module 11 and the rear cover 12 can extend toward each other more along the middle plate 132 , so that the electronic device 10 can provide users with a larger display field of view. Correspondingly, the appearance surface of the frame 131 may be a straight plane or an arc-shaped convex surface, so that the electronic device 10 can obtain better appearance aesthetics and grip feeling. Furthermore, the middle frame 13 becomes thinner from the inside to the outside of the electronic device 10 in the overall structure, as shown in FIG. 6 and FIG. The reliability of the middle frame 13.

The specific structures of the first bracket 14 and the microphone assembly 15 and their cooperation with the rear cover 12 and the middle frame 13 will be described in detail below.

Referring to Figures 8 to 11 together, Figure 8 is a schematic cross-sectional view of the electronic device in Figure 3 along the VIII-VIII direction, Figure 9 is a schematic cross-sectional structure of the middle frame in Figure 8, and Figure 10 is a schematic view of the first bracket in Figure 8 A schematic diagram of a cross-sectional structure, FIG. 11 is a schematic diagram of an exploded structure of the electronic device in FIG. 3 .

In the embodiment of the present application, the first bracket 14 is arranged between the second straight portion 121 and the middle plate 132; the first bracket 14 can be spliced with the middle plate 132, as shown in FIG. The frame 13 supports the rear cover 12 together, thereby increasing the structural strength of the electronic device 10 . Further, the middle plate 132 is provided with a first sound transmission channel, as shown in Figure 9; the first bracket 14 is provided with a second sound transmission channel, as shown in Figure 10; the second sound transmission channel is connected to the first sound transmission channel To form the sound transmission channel of the microphone assembly 15, as shown in FIG. 8 . Wherein, the microphone assembly 15 is arranged between the middle plate 132 and the first bracket 14, the first sound transmission channel communicates with the gap 16, and the second sound transmission channel extends to the microphone assembly 15, as shown in FIG. 8 , so that the middle frame 13 Cooperate with the first bracket 14 to form the sound transmission channel of the microphone assembly 15 .

For example: the first surface 1321 of the middle plate 132 close to the second curved portion 122 defines a sound inlet 1322 , as shown in FIG. 9 and FIG. 11 ; the sound inlet 1322 communicates with the notch 16 , as shown in FIG. 8 . Further, the first end surface 1323 of the middle plate 132 spliced with the first bracket 14 is provided with a first hole 1324, and the first hole 1324 extends to the sound inlet 1322, as shown in FIG. 9; so that the middle plate 132 can be inserted into the The sound port 1322 and the first hole 1324 form a first sound transmission channel. In other words, the first sound transmission channel may be the through sound inlet 1322 and the first hole 1324 in FIG. 9 . A sound outlet 142 is defined on the second surface 141 of the second straight portion 121 of the first bracket 14 away from the rear cover 12 , as shown in FIG. 10 ; the sound outlet 142 communicates with the microphone assembly 15 , as shown in FIG. 8 . Further, the second end surface 143 of the first bracket 14 spliced with the middle plate 132 is provided with a second hole 144, as shown in Figure 10 and Figure 11, the second hole 144 extends to the sound outlet 142, as shown in Figure 10; The second sound transmission channel is formed in such a way that the first bracket 14 can pass through the opening 142 and the second hole 144 . In other words, the second sound transmission channel may be the through sound outlet 142 and the second hole 144 in FIG. 10 .

Based on the above detailed description, the second hole 144 communicates with the first hole 1324, so that the second sound transmission channel can communicate with the first sound transmission channel, so that the middle frame 13 cooperates with the first bracket 14 to form the transmission channel of the microphone assembly 15. sound channel, as shown in Figure 8. Further, a first sealing ring 145 is provided between the second end surface 143 and the first end surface 1323, as shown in FIG. 8 and FIG. pickup effect. Wherein, the first sealing ring 145 may be a sealing member such as foam or a silicone sleeve, or may be a sealing structure formed by curing such as glue or dispensing. Further, the first end surface 1323 and the second end surface 143 may not be perpendicular to the plane where the second straight portion 1121 is located, so as to increase the contact area between the first end surface 1323 and the second end surface 143, as shown in FIG. The sealing area of a sealing ring 145 increases the sealing between the first end surface 1323 and the second end surface 143 , thereby increasing the sound pickup effect of the microphone assembly 15 . Wherein, the first end surface 1323 and/or the second end surface 143 can also be provided with a sinking groove for placing the first sealing ring 145 (the second end surface 143 is provided with a sinking groove in Fig. 8 and Fig. 10 , but not marked), so that both The compactness of the structure can be increased, and the dislocation of the first sealing ring 145 can be avoided when the electronic device 10 is dropped or the like, thereby increasing the sealing reliability of the first sealing ring 145 .

Generally, the space inside the electronic device 10 is limited, but it needs to accommodate a large number of structural parts; Thickness also tends to be smaller. For the embodiment of the present application, the splicing of the first bracket 14 and the middle frame 13 not only supports the rear cover 12, but also communicates with the first hole 1324 through the second hole 144, so that the second sound transmission channel can communicate with the first The sound transmission channel, so that the middle frame 13 cooperates with the first bracket 14 to form the sound transmission channel of the microphone assembly 15 ; In the case that the middle frame 13 (especially the middle plate 132 ) and/or the first bracket 14 are thin, the stacking requirements of multiple structural members may make the second hole 144 and the first hole 1324 in the thickness direction of the electronic device 10 A certain dislocation occurs on the top, which will affect the communication performance between the second sound transmission channel and the first sound transmission channel, thereby affecting the sound pickup effect of the microphone assembly 15 . Therefore, in the embodiment of the present application, the end of the first hole 1324 close to the first bracket 14 is in the shape of a stepped hole, as shown in FIG. 9; and/or, the end of the second hole 144 close to the middle plate 132 is in the shape of a stepped hole. As shown in Figure 10, to increase the communication area of the first hole 1324 and the second hole 144, as shown in Figure 8, thereby increasing the communication performance between the second sound transmission channel and the first sound transmission channel, and then increasing the microphone assembly 15 pickup effects.

Based on the above detailed description, the sound inlet 1322 of the middle frame 13 and the first hole 1324 are generally at right angles in structure, as shown in FIG. Roughly at right angles, as shown in Figure 10. That is to say, the first sound transmission channel and the second sound transmission channel are generally at right angles in structure, so that the sound transmission channel formed by splicing the middle frame 13 and the first bracket 14 is generally Z-shaped in structure. Therefore, in order to meet the technical feasibility, in the embodiment of the present application, the middle frame 13 and the first bracket 14 can be manufactured separately first, and then the two can be spliced for use. For example: the middle plate 132 made of hard plastic and the frame 131 made of metal are processed into the middle frame 13 with an integrated structure by injection molding, and the middle plate 132 can form the sound inlet 1322 and the First hole 1324. Among them, the frame 131 made of metal can increase the aesthetic appearance of the middle frame 13 and the properties of wear resistance, corrosion resistance and scratch resistance, and the middle plate 132 made of hard plastic can increase the overall strength of the middle frame 13 . Similarly, the first bracket 14 is processed by injection molding, and the first bracket 14 can form the sound outlet 142 and the second hole 144 by setting a core. In other embodiments, the sound inlet 1322 of the middle frame 13 and the sound outlet 142 of the middle plate 14 may also be formed by CNC (Computerized Numerical Control, CNC) machining. Further, in order to facilitate the setting of the core and its demoulding requirements, and to avoid the phenomenon of hole blocking caused by the position of the mold, the first hole 1324 can be a through hole penetrating through the middle plate 132, as shown in Figures 8 and 9; and the first A sealing backing plate 135 is provided on the side of the hole 1324 away from the first end surface 1323 . As shown in FIG. 8 , the sealing backing plate 135 is attached to the middle plate 132 to seal the end of the first hole 1324 away from the first end surface 1323 . Wherein, the sealing backing plate 135 can be made of PET (Polyethylene Terephthalate, polyethylene terephthalate), and can be bonded to the middle plate 132 by glue, foam or other colloids. Correspondingly, the surface of the middle plate 132 on which the sealing backing plate 135 is pasted can be inclined to increase the area where the sealing backing plate 135 is attached, and a sunken groove for placing the sealing backing plate 135 can also be opened on the slope (Fig. 8 and Fig. 8 ). 9) to increase the structural compactness. Further, the minimum distance between the maximum depth position of the second hole 144 and the hole wall of the sound outlet 142 (shown as N in FIG. 10 ) may be less than or equal to 0.1mm, so as to reduce the volume of the second hole 144, That is to reduce the volume of the sound transmission channel, thereby increasing the sound transmission effect of the sound transmission channel (because the excessive sound transmission channel will affect the high-frequency cut-off frequency of the sound); and taking into account the demoulding of the core in the first bracket 14 demand, so as to avoid hole blocking phenomenon caused by mold row position, thereby increasing the reliability of the first bracket 14.

Further, the material of the first bracket 14 may be the same as or similar to that of the middle plate 132 . In the embodiment of the present application, the first bracket 14 and the middle plate 132 are made of hard plastic as an example for illustration. Compared with soft rubber materials, the first bracket 14 and the middle plate 132 of the embodiment of the present application are made of hard plastic, which has better structural strength on the one hand, and can improve the splicing of the first bracket 14 and the middle plate 132. and the problem of deformation of the sound transmission channel caused by external force extrusion during use; on the other hand, it can also improve the problem that the first bracket 14 and the middle plate 132 are easy to form burrs in the sound transmission channel during the injection molding process, thereby increasing the sound transmission. The sound transmission effect of the acoustic channel, thereby increasing the call quality of the electronic device 10 .

Continue referring to FIG. 8 to FIG. 11 , the microphone assembly 15 includes a first circuit board 151 and a microphone 152 . The first circuit board 151 is used to electrically connect the microphone 152 and the main board of the electronic device 10, so that the microphone 152 picks up sound under the control of the main board, and converts the picked up sound into an electrical signal and transmits it to the main board. Wherein, the first circuit board 151 can be a flexible circuit board, and the flexible circuit board can adapt to the complex spatial pattern inside the electronic device 10 , thereby simplifying various wirings inside the electronic device 10 . The first circuit board 151 is disposed on a side of the first bracket 14 close to the middle board 132 , and defines a sound transmission hole 1511 , as shown in FIG. 11 . The microphone 152 is arranged on the side of the first circuit board 151 close to the middle board 132, and communicates with the sound outlet 142 through the sound transmission hole 1511, as shown in FIG. 13, the sound transmission channel formed by splicing the middle frame 13 and the first bracket 14 (mainly the first hole 1324 and the second hole 144) communicates with the external environment, so that the microphone 152 can pick up sound. In the embodiment of the present application, the microphone 152 can first be attached to the first circuit board 151 by Surface Mounting Technology (SMT), and then the second sealing ring 153 can be used to realize the connection between the first circuit board 151 and the first bracket 14. , as shown in FIG. 8 , so as to meet the sealing requirements between the first circuit board 151 and the first bracket 14 . Wherein, the second sealing ring 153 may be a sealing member such as foam cotton or a silicone sleeve, or may be a sealing structure formed by curing such as glue or dispensing. Correspondingly, the second surface 141 may also be provided with a sunken groove (not marked in FIG. 8 and FIG. 10 ) for placing the second sealing ring 153 , so as to increase the compactness of the structure.

In the embodiment of the present application, an avoidance groove 1512 may be provided at the end of the first circuit board 151 close to the middle frame 13 (specifically, the frame 131 ), as shown in FIG. 11 ; The portion protruding toward the middle plate 132 of the first support 14 (specifically, the second surface 141 ) can be arranged around the avoidance groove 1512, as shown in FIGS. 8 and 11 , thereby increasing the structural compactness of the electronic device 10 .

Generally, for functional parts such as a microphone, its function is mainly to pick up the user's voice and convert the sound signal into an electronic signal during the user's interaction process such as making a phone call, sending a voice message, and video (including voice) chat. Signal. Furthermore, as users have higher and higher requirements for call quality in the above-mentioned interaction process, two microphones are generally installed in the electronic device 10, one of which is mainly used to pick up the user's voice (which can be called the main microphone), and the other It is mainly used to pick up ambient sound (it can be called a secondary microphone). The electronic device 10 can perform denoising processing according to the user's voice picked up by the main microphone and the ambient sound picked up by the auxiliary microphone, so as to increase the resolution (reduction) of the user's voice by the electronic device 10, thereby increasing the call quality of the electronic device 10 and improving User experience. Therefore, the microphone 152 described in the embodiment of the present application can be either the main microphone of the electronic device 10 or the secondary microphone of the electronic device 10 .

As we all know, in order to ensure the call quality of the electronic device 10, the sealing of the above-mentioned sound transmission channel is very important. Based on the above detailed description, the first sound transmission channel of the first bracket 14 and the first sound transmission channel of the middle frame 13 can be sealed by the first sealing ring 145, and the first circuit board 151 of the microphone assembly 15 and the first The sound outlets 142 of the bracket 14 can be sealed by the second sealing ring 153 . The following description will mainly focus on the sealing between the sound inlet 1322 of the middle frame 13 and the notch 16 .

A seal 17 is provided between the middle plate 132 and the rear cover 12, as shown in FIG. 8, to achieve a sealed connection between the two, so as to reduce the intrusion of water vapor in the external environment into the electronic equipment through the gap between the above-mentioned structural members. 10, thereby increasing the reliability of the electronic device 10. Wherein, the sealing member 17 may be foam, a silicone sleeve, etc., or may be a sealing structure formed by curing glue or dispensing. Further, the seal 17 is provided with a sound transmission gap 171, for example, the sound transmission gap 171 is U-shaped, as shown in Figure 11, and the opening direction of the sound transmission gap 171 faces the gap 16, as shown in Figure 8, so that the seal 17 can not only meet the above-mentioned sealing requirements, but also realize the communication between the gap 16 and the sound inlet 1322, and avoid sound leakage of the sound transmission channel.

Further, during the assembly process of the rear cover 12 and the middle frame 13, foam, glue or dispensing, etc. One of them and a combination thereof, so as to increase the waterproof and dustproof performance of the electronic device 10, thereby increasing the reliability of the electronic device 10.

Referring to FIG. 12 , FIG. 12 is a schematic cross-sectional structure diagram of another embodiment of the electronic device in FIG. 8 . It should be noted that the electronic device shown in FIG. 12 mainly includes some structures related to the rear cover 12 , the middle frame 13 and the microphone assembly 15 ; the display module 11 and its related structures are not shown.

In this embodiment, the microphone assembly 15 is disposed on the side of the middle plate 132 close to the rear cover 12 , and the middle plate 132 defines a first sound transmission channel. As shown in FIG. 8 , the first sound transmission channel extends to the microphone assembly 15 .

A sound inlet 1322 is defined on the first surface 1321 of the middle plate 132 close to the second curved portion 122 , and the sound inlet 1322 communicates with the notch 16 , as shown in FIG. 12 . In this embodiment, the sound inlet 1322 can expand from the middle plate 132 to the frame 131, for example, the sound inlet 1322 expands from the first surface 1321 to the second groove 134 (that is, the junction of the frame 131 and the middle plate 132, Please combine FIG. 6 and FIG. 7 ) to increase the communication area between the sound inlet 1322 and the notch 16 , thereby increasing the sound pickup effect of the microphone assembly 15 . Further, a sound outlet 142 is defined on the top surface 1325 of the middle plate 132 close to the rear cover 12 , as shown in FIG. 12 ; so that the sound outlet 142 communicates with the microphone assembly 15 . Wherein, the top surface 1325 of the middle plate 132 is lower than its first surface 1321, so that a space for placing the microphone assembly 15 can be formed between the rear cover 12 and the middle plate 132, so as to increase the structural compactness of the electronic device 10 properties, as shown in Figure 12. Further, the bottom surface 1326 of the middle plate 132 away from the rear cover 12 defines a sound guide groove 1327 , as shown in FIG. 12 . Wherein, one end of the sound guiding groove 1327 extends to the sound inlet 1322 ; the other end of the sound guiding groove 1327 extends to the sound outlet 142 , so that the middle plate 132 can form a first sound transmission channel. Further, the bottom surface 1326 can also be provided with a sealing backing plate 135 , and the sealing backing plate 135 covers the sound guide groove 1327 to seal the sound transmission channel formed by the middle plate 132 , thereby increasing the sound pickup effect of the microphone assembly 15 . Wherein, the bottom surface 1326 can also be provided with a sunken groove (not marked in FIG. 12 ) for placing the sealing backing plate 135, so as to increase the compactness of the structure.

Further, other structures of this embodiment are the same as or similar to those of the foregoing embodiments, and will not be repeated here.

Based on the above detailed description, although the curved surface structure formed by the display module 11 and the rear cover 12 being bent toward the middle frame 13 can enable the electronic device 10 to provide users with a larger display field of view and better appearance aesthetics and grip; However, when the length, width, and thickness of the electronic device 10 are constant, the above-mentioned curved surface structure will not only compress the thickness of the middle frame 13 (especially the frame 131), but also make the frame 131 at least partially thinner, as shown in Figures 1 to 7 As shown, the size of the internal space of the electronic device 10 will also be compressed to a certain extent, the pattern of the internal space of the electronic device 10 will be changed, and the internal space of the electronic device 10 will become more crowded, so that the internal space of the electronic device 10 will become more crowded, so that the battery, main board, camera module, The setting of structural parts such as fingerprint module will affect it. For the above-mentioned flat full screen, the driving circuit is generally directly mounted on the edge of the screen. Since the side edge of the display module 11 in this application is a curved surface structure (specifically, the first curved portion 1112 and the sub-display portion 1122), if the driving circuit is attached to a flat area away from the side edge (specifically, the first flat part 1111 and the main display part 1121), may occupy the space of other structural parts, which will inevitably affect the arrangement of the above structural parts, or even cause structural interference. For example, for a mobile phone, in order to ensure or increase its battery life, the capacity of its battery is generally as large as possible, which also means that the battery needs to occupy a large amount of space inside the mobile phone. Therefore, if the driving circuit assembly 113 is pasted on the main display portion 1121 , it may occupy the space of the battery, thereby affecting the capacity of the battery. For this reason, the embodiment of the present application redesigns the body structure of the electronic device 10 (especially the display module 11) and adjusts the layout of the drive circuit assembly 113 therein, such as redesigning the structure of the drive circuit assembly 113 so that the The driving circuit assembly 113 on the main display portion 1121 is disposed on the sub-display portion 1122 to avoid the influence of the curved surface structure of the display module 11 on the arrangement of the above-mentioned structural components, so as to meet the installation requirements of the above-mentioned structural components. Further, the side of the middle frame 13 (specifically, the middle plate 132 ) close to the display module 11 can also have a receiving groove 136, and the driving circuit assembly 113 can be accommodated in the receiving groove 136, so that the middle frame 13 can support the display module 11 , on the other hand, it can also increase the structural compactness of the electronic device 10 . Of course, if the internal structural parts and spatial layout of the electronic device 10 are improved in other ways, so that the drive circuit attached to the main display portion 1121 will not cause adverse effects (such as a sharp drop in battery capacity), it may not be necessary. The driving circuit is pasted on the sub-display portion 1122 .

The specific structure of the driving circuit assembly 113 and its relationship with other structures in the display module 11 will be described in detail below.

Referring to FIG. 8 , FIG. 13 and FIG. 14 together, FIG. 13 is a schematic top view structural diagram of the electronic device in FIG. 1 , and FIG. 14 is a schematic cross-sectional structural schematic diagram of the driving circuit assembly in FIG. 8 . It should be noted that the schematic cross-sectional structure shown in FIG. 8 may refer to the region where the driving circuit assembly in FIG. 13 is located. Wherein, for a mobile phone, this area may correspond to the bottom of the mobile phone, that is, the sound pickup hole and the driving circuit assembly are arranged at the same end of the mobile phone.

In the embodiment of the present application, the drive circuit assembly 113 is attached to the side of the sub-display portion 1122 of the display module 11 away from the transparent cover 111, as shown in FIG. side edges, so as to prevent the curved surface structure of the display module 11 from affecting the arrangement of other structural components in the electronic device 10 such as batteries, motherboards, camera modules, and fingerprint modules.

The driving circuit assembly 113 includes a second bracket 1131 , a driving chip 1132 and a second circuit board 1133 . Wherein, the second bracket 1131 is mainly used to optimize the curved surface structure of the sub-display part 1122 into a planar structure that is convenient for arranging the driving chip 1132 , so that the driving circuit assembly 113 can be attached to the sub-display part 1122 . The driver chip 1132 is electrically connected to the display panel 112 and is mainly used to control the display screen of the display panel 112 and the interaction with the user. The second circuit board 1133 is mainly used for electrically connecting the driver chip 1132 and the mainboard of the electronic device 10 , so that the driver chip 1132 receives control instructions from the mainboard or feeds back interactive instructions to the mainboard. Wherein, the second circuit board 1133 can be a flexible circuit board, and the flexible circuit board can adapt to the complex spatial pattern inside the electronic device 10 , thereby simplifying various wirings inside the electronic device 10 . In the embodiment of the present application, the driving chip 1132 can be pre-attached on the flexible circuit board by surface mount technology, so as to simplify the structure of the driving circuit assembly 113 .

The second bracket 1131 includes a third surface 1134 and a fourth surface 1135 disposed opposite to each other, as shown in FIG. 14 . The third surface 1134 is curved, for example, the radius of curvature of the first surface is the same as that of the auxiliary display portion 1122 , as shown in FIG. 8 and FIG. 14 , so that the second bracket 1131 can be attached to the auxiliary display portion 1122 . The fourth surface 1135 is planar, as shown in FIG. 14 , so that the driver chip 1132 can be directly attached to the fourth surface 1135 without bending, so that the driver chip 1132 can be indirectly attached to the secondary display portion 1122, thereby avoiding Because the driver chip 1132 is arranged on the main display part 1121, it affects the setting of other structural parts in the electronic device 10, and also avoids the quality problem that the driver chip 1132 is directly arranged on the sub-display part 1122 (because the driver chip 1132 is relatively fragile in structure, it is not easy to extrusion, bending). Wherein, generally, the driver chip 1132 will not be placed directly close to the edge of the secondary display portion 1122 away from the main display portion 1121, but will be provided with a safe distance, as shown in L in FIG. 14 , for example, the safe distance L is 1.5 mm. In order to avoid structural interference between the driving chip 1132 and structural components such as the middle frame 13 , thereby increasing the safety of the driving chip 1132 . Furthermore, the third surface 1134 and the fourth surface 1135 can be coated with OCA, PSA and other colloids, so that the second bracket 1131 is attached to the auxiliary display module 1122, and the driver chip 1132 and the second circuit board 1133 are attached to the second Bracket 1131.

It should be noted that the material, size, shape, thickness and other parameters of the second bracket 1131 can be reasonably designed according to the attachment requirements between the driving chip 1132 and the auxiliary display part 1122 and other factors, which are not limited here.

Referring to FIG. 15 , FIG. 15 is a cross-sectional schematic view of another embodiment of the stent in FIG. 14 .

Based on the above detailed description, after the driver chip 1132 and the second circuit board 1133 are pasted on the fourth surface 1135, there is at least one level difference corresponding to the thickness of the driver chip 1132 between the second circuit board 1133 and the fourth surface 1135, such as Figure 14 shows. Since the structural strength of the flexible circuit board is generally poor, this step difference may easily cause the flexible circuit board to break. For this, the second bracket 1131 may further include a fifth surface 1136 away from the sub-display part 1122 . And relative to the third surface 1134 , the fifth surface 1136 protrudes from the fourth surface 1135 , as shown in FIG. 15 , so that a level difference is formed between the fifth surface 1136 and the fourth surface 1135 . In other words, the other side of the second bracket 1131 away from the third surface 1134 is a stepped surface. Wherein, the level difference between the fifth surface 1136 and the fourth surface 1135 can be equal to the thickness of the driving chip 1132, so that the driving chip 1132 can be accommodated in the second bracket 1131 due to the level difference, as shown in FIG. 15 , so that the driving chip The surface of 1132 away from the fourth surface 1135 can be flush with the fifth surface 1136 , so that the second circuit board 1133 can be at least partially laid on the fifth surface 1136 , as shown in FIG. 15 .

Further, other structures of this embodiment are the same as or similar to those of the foregoing embodiments, and will not be repeated here.

Referring to FIG. 8 and FIG. 16 together, FIG. 16 is a partially enlarged structural diagram of part E in FIG. 8 .

For an OLED screen, the basic structure of the display panel 112 generally includes a base 1123 , an organic electroluminescent layer 1124 and an optical film layer 1125 stacked on the base 1123 , as shown in FIG. 16 . Wherein, the base body 1123 is away from the transparent cover 111 (that is, close to the second bracket 1131 ), and is mainly used to support the entire display panel 112 . The substrate 1123 can be a thermoplastic polyurethane film, such as a polyolefin thermoplastic film, an oriented polystyrene thermoplastic film, a polyethylene terephthalate thermoplastic film, etc., so that the display panel 112 has a certain deformation ability, thereby facilitating the display panel 112 Attached to the curved transparent cover 111 . The organic electroluminescent layer 1124 generally includes an electrically connected luminescence control layer and a pixel unit (not shown in FIG. 16 ), and its luminescence control layer is electrically connected to the driving chip 1132, as shown in FIG. 16 , and is mainly used to make the display panel 112 is capable of displaying images under the control of the driving circuit component 113 . The optical film layer 1125 generally includes a polarizer and a 1/4 wavelength phase film (not shown in FIG. 16 ), that is, the optical film layer 1125 can be a circular polarizer, which is mainly used to eliminate reflected light, thereby increasing the contrast of the display panel 112 . In the embodiment of the present application, the optical film layer 1125 is close to the transparent cover plate 111 (that is, away from the second bracket 1131), that is, the side of the display panel 112 close to the optical film layer 1125 can be pasted on the The transparent cover 111 enables the display panel 112 to be pasted on the transparent cover 111 to form a main display portion 1121 and a secondary display portion 1122 . Further, the display panel 112 may further include a touch layer 1126 , a buffer layer 1127 and a shielding layer 1128 . Wherein, the touch layer 1126 can be one of resistive, capacitive, acoustic, infrared, pressure sensitive, vibration sensitive and other types and combinations thereof, and can generally be arranged between the organic electroluminescent layer 1124 and the optical touch layer 1124. Between the film layers 1125 is mainly used to receive touch operations performed by the user on the display module 11 . The buffer layer 1127 can be foam, and generally can be arranged on the side of the substrate 1123 away from the organic electroluminescent layer 1124, mainly used to support and protect the substrate 1123, and relieve the hardness, strength and deformation ability of the substrate 1123 and the shielding layer 1128. Differences in mechanics. The shielding layer 1128 can be copper foil, and generally can be arranged on the side of the buffer layer 1127 away from the base 1123, mainly for heat dissipation and shielding electromagnetic interference. Further, the above-mentioned functional layers of the display panel 112 can be glued together by OCA, PSA and other colloids (not marked in FIG. 16 ).

In order to facilitate the electrical connection between the organic electroluminescent layer 1124 and the driving chip 1132, the organic electroluminescent layer 1124 is curved at the edge of the secondary display portion 1122 away from the main display portion 1121, as shown in FIG. 8 and FIG. The organic electroluminescent layer 1124 can further extend to the driving chip 1132 along the fourth surface 1135 . Preferably, the organic electroluminescent layer 1124 extends along the fourth surface 1135 at least between the driver chip 1132 and the second bracket 1131 , so that the driver chip 1132 can be directly attached to the organic electroluminescent layer 1124 .

Generally, the organic electroluminescent layer 1124 can be prepared by depositing organic and inorganic substances on the substrate 1123 by evaporation process, and its thickness can be only 0.03mm, and its structure is relatively fragile. For this reason, the substrate 1123 is not only disposed between the shielding layer 1128 and the organic electroluminescent layer 1124 to support the entire display panel 112, but also can be further attached to the aforementioned curved portion of the organic electroluminescent layer 1124 to support the organic electroluminescent layer. A part of 1124 functions as an independent support, as shown in FIG. 16 , thereby increasing the reliability of the display panel 112 . Further, the base body 1131 can also extend along the organic electroluminescent layer 1124 to the area where the second bracket 1131 is located, so that the projection of the base body 1131 on the fourth surface 1135 at least partly falls on the second bracket 1131 (commonly known as "edge") , as shown by M in Figure 16. Wherein, the overlapping width M of the base body 1131 can be greater than or equal to 0.5 mm and less than or equal to 1.5 mm, so that the base body 1131 can not only support a part of the organic electroluminescent layer 1124, but also avoid structural interference with the driving chip 1132. put one's oar in.

The above descriptions are only part of the embodiments of the application, and are not intended to limit the scope of protection of the application. All equivalent devices or equivalent process transformations made by using the description and drawings of the application, or directly or indirectly used in other related All technical fields are equally included in the patent protection scope of the present application.

Claims (16)

1. An electronic device is characterized in that the electronic device comprises a display module, a rear cover plate, a middle frame, a first support and a microphone assembly, wherein the display module and the rear cover plate are respectively connected with the middle frame, the rear cover plate comprises a second straight portion and a second bending portion connected with the second straight portion, the second bending portion bends towards the middle frame, the middle frame comprises a frame and a middle plate connected with the frame, the frame and the second bending portion are matched to form a notch, the notch is used as a sound pickup hole of the microphone assembly, the first support is arranged between the second straight portion and the middle plate and is spliced with the middle plate, and the microphone assembly is arranged between the middle plate and the first support;

wherein, the medium plate is close to the first surface of second flexion has seted up into the sound mouth, go into the sound mouth UNICOM in the breach, the medium plate with first terminal surface of first support concatenation has seted up first hole, first hole is for running through the through-hole of medium plate, just one side that first hole kept away from first terminal surface is provided with sealed backing plate, sealed backing plate subsides are located the medium plate, first hole further extends to go into the sound mouth, so that the medium plate forms first sound transmission channel, first support division be equipped with UNICOM in the second sound transmission channel of first sound transmission channel, the second sound transmission channel extends to the microphone subassembly.

2. The electronic device according to claim 1, wherein the second bending portion and/or the bezel has a notch, so that the rear cover plate and the middle bezel are matched to form the notch at the notch.

3. The electronic device according to claim 1, wherein the display module comprises a transparent cover plate and a display panel, the display panel is attached to the transparent cover plate, the transparent cover plate comprises a first straight portion and a first curved portion, and the first curved portion is connected to the first straight portion.

4. The electronic device of claim 3, wherein the electronic device is a rectangular structure, four side edges of the display module are all bent towards the middle frame, and four side edges of the rear cover plate are all bent towards the middle frame.

5. The electronic device of claim 3, wherein a radius of curvature of the display module curved toward the middle frame is greater than or equal to a radius of curvature of the back cover curved toward the middle frame.

6. The electronic device according to claim 3, wherein the display panel is attached to the first flat portion.

7. The electronic device according to claim 3, wherein the display panel includes a main display portion and a sub display portion, the sub display portion is connected to the main display portion, the main display portion is attached to the first flat portion, and the sub display portion is attached to the first curved portion.

8. The electronic device of claim 1, wherein a sound outlet is formed in a second surface of the first bracket away from the second straight portion, the sound outlet is communicated with the microphone assembly, a second hole is formed in a second end surface of the first bracket, which is spliced with the middle plate, the second hole extends to the sound outlet, so that the second sound transmission channel can be formed by the bracket, and the second hole is communicated with the first hole, so that the second sound transmission channel can be communicated with the first sound transmission channel.

9. The electronic device of claim 8, wherein an end of the first hole near the first bracket is stepped; and/or one end of the second hole close to the middle plate is in a stepped hole shape.

10. The electronic device of claim 8, wherein the first end surface and the second end surface are not perpendicular to a plane of the second straight portion.

11. The electronic device of claim 8, wherein the microphone assembly comprises a first circuit board and a microphone, the first circuit board is configured to electrically connect the microphone and a motherboard of the electronic device, the first circuit board is disposed on a side of the first bracket close to the middle plate and has a sound transmission through hole, and the microphone is disposed on a side of the first circuit board close to the middle plate and is connected to the sound outlet through the sound transmission through hole.

12. The electronic device of claim 7, wherein the display module further comprises a driving circuit assembly electrically connected to the display panel and attached to a surface of the sub-display portion away from the transparent cover.

13. The electronic device of claim 12, wherein the driving circuit assembly comprises a second bracket, a driving chip, and a second circuit board, the second bracket comprises a third surface and a fourth surface that are opposite to each other, the third surface is curved so that the second bracket can be attached to the sub-display portion, the fourth surface is planar, the driving chip is attached to the fourth surface and electrically connected to the display panel, and the second circuit board is configured to electrically connect the driving chip to a main board of the electronic device.

14. The electronic device according to claim 13, wherein a radius of curvature of the third surface is the same as a radius of curvature of the sub display portion.

15. The electronic device of claim 13, wherein the second bracket further comprises a fifth surface far from the secondary display portion, and the fifth surface protrudes from the fourth surface relative to the third surface so that a step is formed between the fifth surface and the fourth surface, and the second circuit board is at least partially laid on the fifth surface.

16. The electronic device according to claim 13, wherein the display panel includes a substrate and an organic electroluminescent layer disposed on the substrate, the substrate is close to the second bracket, and the organic electroluminescent layer is curved at an edge of the sub-display portion away from the main display portion, so that the organic electroluminescent layer can further extend along the fourth surface to the driving chip, and the organic electroluminescent layer is electrically connected to the driving chip.

Images