CN114489288A - Mounting structure, earphone subassembly and terminal equipment - Google Patents
Mounting structure, earphone subassembly and terminal equipment Download PDFInfo
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- CN114489288A CN114489288A CN202011167117.0A CN202011167117A CN114489288A CN 114489288 A CN114489288 A CN 114489288A CN 202011167117 A CN202011167117 A CN 202011167117A CN 114489288 A CN114489288 A CN 114489288A
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- mounting structure
- conductive
- earpiece
- heat
- conducting
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Images
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/03—Constructional features of telephone transmitters or receivers, e.g. telephone hand-sets
Abstract
The present disclosure relates to a mounting structure, an earpiece assembly and a terminal device. Wherein the mounting structure comprises a conductive component; the conducting component comprises a conducting part and an extending part, and the conducting part is connected with the extending part; the heat conduction part is connected with the extending part in a pressing mode, the heat conduction part is abutted to a preset element of the terminal device and used for pressing the preset element to a preset position of the terminal device, and the heat conduction part is used for conducting heat of the preset element to the extending part. The mounting structure of this disclosure, effectively dispels the heat for predetermined component through setting up conduction subassembly. The preset element can be a receiver, for example, wherein the conduction part is abutted to the preset element, so that the conduction part can transfer the heat of the preset element to the extension part, and the heat equalization or heat dissipation of the preset element such as the receiver is realized.
Description
Technical Field
The present disclosure relates to the field of terminals, and in particular, to a mounting structure, a receiver assembly, and a terminal device.
Background
With the progress of the technology, the iteration of the smart phone is updated faster and faster. In order to better meet the requirements of users on different application scenes, the power consumption and heat generation of some functional elements inside the mobile phone are increased correspondingly. For example, for promoting speech quality, the volume increase of earphone device in the cell-phone, earphone device during operation heat production also corresponding increase, when influencing user experience, also do not benefit to the complete machine heat dissipation.
For example, a single functional element such as a receiver device has a simple structure, and generally no improvement measure is taken for heat dissipation in the related art, so that the problem that the user experience is not influenced well due to the heat dissipation of the functional element exists in the related art.
Disclosure of Invention
To overcome the problems in the related art, the present disclosure provides a mounting structure, an earpiece assembly, and a terminal device.
According to a first aspect of the embodiments of the present disclosure, a mounting structure is provided, which is applied to a terminal device, the mounting structure including a conductive component;
the conducting component comprises a conducting part and an extending part, and the conducting part is connected with the extending part;
the heat conduction part is connected with the extending part in a pressing mode, the heat conduction part is abutted to a preset element of the terminal device and used for pressing the preset element to a preset position of the terminal device, and the heat conduction part is used for conducting heat of the preset element to the extending part.
Optionally, the mounting structure further comprises a connecting portion; the conducting part is abutted to the preset element through the connecting part.
Optionally, a heat conduction channel is disposed on the connection portion, and the heat conduction channel communicates the preset element and the conduction portion.
Optionally, the connection portion comprises conductive foam.
Optionally, a grounding end is disposed on the extension portion, and the grounding end corresponds to a grounding point on a main board of the terminal device; the predetermined element is connected to the ground point through the ground terminal.
Optionally, the extension comprises a first extension and a second extension;
one end of the first extension part is connected with the conduction part, and the other end of the first extension part is connected with the second extension part; the second extending part corresponds to the main board, and the grounding end is arranged on the second extending part.
Optionally, the mounting structure further comprises a first housing, the conductive component being disposed on the first housing; the conduction assembly is assembled with the mainboard through the first shell and drives the conduction assembly to be pressed on the preset element.
Optionally, the conductive member is made of metal.
According to a second aspect of the embodiments of the present disclosure, an earpiece assembly is provided, which includes an earpiece body and the mounting structure described in any one of the above;
the conducting part of the mounting structure is abutted against the first side of the receiver body and used for pressing the receiver body to a preset position on a second shell of the terminal equipment.
Optionally, a conductive medium layer is disposed on the first side of the earpiece body; the conductive part is abutted against the conductive medium layer.
Optionally, a grounding end is disposed on the extension portion of the mounting structure, and the earphone body is connected to the grounding point of the main board through the grounding end.
Optionally, a sealing portion is disposed between the earpiece body and the second housing.
Optionally, the handset body is provided with a flexible circuit board, and the handset body is electrically connected with a main board of the terminal device through the flexible circuit board.
According to a third aspect of the embodiments of the present disclosure, a terminal device is provided, which includes the earphone assembly described in any one of the above.
The technical scheme provided by the embodiment of the disclosure can have the following beneficial effects: the mounting structure of this disclosure, effectively dispels the heat for predetermined component through setting up conduction subassembly. The preset element can be a receiver, for example, wherein the conduction part is abutted to the preset element, so that the conduction part can transfer the heat of the preset element to the extension part, and the heat equalization or heat dissipation of the preset element such as the receiver is realized.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.
Fig. 1 is a related art earpiece device.
Fig. 2 is a schematic diagram of a conductive assembly shown in accordance with an exemplary embodiment.
Fig. 3 is a schematic diagram of a connection shown in accordance with an example embodiment.
Fig. 4 is an exploded schematic view of an earpiece assembly shown in accordance with an exemplary embodiment.
Fig. 5 is a cross-sectional view of an earpiece assembly shown in accordance with an exemplary embodiment.
Fig. 6 is a schematic diagram illustrating an earpiece body according to an exemplary embodiment.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the invention, as detailed in the appended claims.
In the related art, a single functional element such as a receiver device has a simple structure, and generally no improvement measure is taken on heat dissipation of the functional element in the related art, so that the problem that user experience is not influenced well due to heat dissipation of the functional element exists in the related art.
For example, as shown in fig. 1, in the related art handset solution, most of the terminal products mostly adopt a handset device 1' of model AAC-NPR0612A or a handset device with a smaller external form factor. Because the earphone device has low power consumption and less heat generation in working, the heat can be emitted through the sound outlet of the earphone. Therefore, the heat dissipation scheme of the receiver is not specially processed in the structural design of the whole machine.
With the progress of the technology, the iterative update of the smart phone is faster and faster, the 5G communication technology is gradually popularized, and in order to better meet the requirements of users on different application scenarios, the performance of functional elements such as a receiver device of products such as mobile phones is also correspondingly improved, so that the overall dimensions of the functional elements such as the receiver device are correspondingly increased, and the power consumption and the heat generation are larger and larger.
For example, to improve the quality of a call, the volume of the handset device inside the mobile phone in the related art is increased, and the heat generated by the handset device during operation is correspondingly increased. The heat production of earphone device can conduct the front shell (display screen side) to the cell-phone, can appear scalding hand or scalding ear scheduling problem when the user uses to influence user experience. Meanwhile, if the heat produced by the earphone device is not radiated by corresponding radiating measures, the radiating of the whole machine is not facilitated.
The earpiece solutions in the related art have at least the following two problems:
on one hand, the overall dimension of the receiver device is gradually increased, but the receiver assembly scheme in the related art usually only considers the requirements of the receiver on sealing, dust prevention and water prevention, and does not improve the structure of the receiver in heat dissipation. The user experience cannot be improved, and the competitiveness of the terminal product is reduced.
On the other hand, with the increase of the volume of the receiver device, the surface conductive material of the receiver device is increased, the radio frequency stability interference of the terminal product is increased, and the reliability of the whole machine is influenced.
In order to solve the above technical problem, an embodiment of the present disclosure provides a mounting structure applied to a terminal device, where the mounting structure includes a conductive component; the conducting component comprises a conducting part and an extending part, and the conducting part is connected with the extending part; the conduction portion is abutted to a preset element of the terminal equipment and used for pressing the preset element at a preset position of the terminal equipment, and the conduction portion is used for conducting heat of the preset element to the extension portion. The mounting structure of this disclosure, effectively dispels the heat for predetermined component through setting up conduction subassembly. The preset element can be a receiver, for example, wherein the conduction part is abutted to the preset element, so that the conduction part can transfer the heat of the preset element to the extension part, and the heat equalization or heat dissipation of the preset element such as the receiver is realized.
In an exemplary embodiment, the present embodiment proposes a mounting structure applied to a terminal device. The terminal device may be, for example, an electronic device such as a mobile phone, a tablet computer, a notebook computer, a vehicle-mounted device, and a wearable device. In this embodiment, the mounting structure includes a conductive member 10, and as shown in fig. 4, the conductive member 10 may be assembled with, for example, the main board 3 of the terminal device. The conductive element 10 may be made of a material having a certain rigidity and good thermal or electrical conductivity, for example, the conductive element 10 is made of metal, and the conductive element 10 may be made of steel sheet in this embodiment.
As shown in fig. 2, the conductive assembly 10 includes a conductive portion 11 and an extension portion 12, and the conductive portion 11 is connected to the extension portion 12. The conducting part 11 abuts against a predetermined element of the terminal device. The conductive portion 11 serves as an electric and thermal conductive medium, and its shape and size are adapted to the predetermined components of the terminal device, such as the heat generating functional components of the receiver, the speaker, and the sensing device. The conduction part 11 is used for pressing the preset element at the preset position of the terminal equipment, and the conduction part 11 is in close contact with one side surface of the preset element while the preset element is installed, so that the conduction part 11 can conduct heat of the preset element to the extension part 12.
In this embodiment, the extension portion 12 may be assembled with a housing or other structure of the terminal device, so as to further conduct heat to the housing or other structure of the terminal device, thereby achieving heat dissipation more effectively. Thus, the conductive member 10 in the present embodiment has a good heat absorbing or soaking function.
In an exemplary embodiment, as shown in fig. 3, the mounting structure further includes a connecting portion 20. As shown in fig. 4, the conductive portion 11 is abutted with a predetermined element through the connecting portion 20, wherein the predetermined element is the earpiece body 2. The connecting portion 20 is adapted to the shape of the conducting portion 11 or the predetermined element, and the connecting portion 20 may be a structure having a buffering function, such as a buffer pad or foam.
In an exemplary embodiment, in order to ensure that the heat conducting portion 11 still has a good heat dissipation effect after abutting against the predetermined component through the connecting portion 20, in this embodiment, still referring to fig. 3 and 4, a heat conducting channel 201 is disposed on the connecting portion 20, and the heat conducting channel 201 communicates the predetermined component with the heat conducting portion 11, so that the heat conducting channel 201 can transfer the heat on the surface of the predetermined component to the heat conducting portion 11.
In one exemplary embodiment, still referring to fig. 3, the connection portion 20 comprises conductive foam. Wherein, the conductive foam can be made of hard quick-rebound material with the compression ratio of 50 percent and the working height of 0.2 mm. The conductive foam may be bonded to the conductive portion, for example, a double-sided adhesive tape is disposed on a side surface of the conductive foam close to the conductive portion, and the conductive foam is bonded to the conductive portion through the double-sided adhesive tape.
In this embodiment, the heat conducting channel 201 may be, for example, a through hole structure disposed on the conductive foam, and the through hole structure penetrates through the conductive foam. The heat on the surface of the preset element can be transferred to the conduction component with the heat absorption or soaking function through the heat conduction channel.
In this embodiment, electrically conductive bubble is cotton not only can realize the effect of bonding conduction portion, can also make conduction portion and predetermine the effective sealing connection of component, realizes dustproof and waterproof effect. In addition, the conductive foam also has the conductive property and can be used as a conductive medium.
In an exemplary embodiment, based on the problem of interference of the preset element to the radio frequency, the present embodiment further implements a grounding function on the design of the conductive assembly, thereby implementing grounding of the preset element and avoiding interference of the preset element to the radio frequency device of the terminal equipment.
Still referring to fig. 2, in the present embodiment, a ground terminal 123 is provided on the extension portion 12. As shown in fig. 4, the ground terminal 123 corresponds to the ground point 31 on the main board 3 of the terminal device. Wherein the grounding point 31 on the main board 3 can be provided as a stud. When the conducting assembly 10 is assembled with the main board 3 of the terminal device, the grounding terminal 123 can be connected to the grounding point 31 on the main board, so as to realize grounding of the conducting part 11, and further realize connection of the predetermined component to the grounding point through the grounding terminal.
In one exemplary embodiment, still referring to fig. 2, extension 12 includes a first extension 121 and a second extension 122. One end of the first extension portion 121 is connected to the conducting portion 11, and the other end of the first extension portion 121 is connected to the second extension portion 122. It can be understood that the conductive portion 11, the first extending portion 121 and the second extending portion 122 may be a separate structure or an integrally formed structure.
In this embodiment, the second extending portion 122 corresponds to the main board 3, for example, as shown in fig. 4, the extending direction and shape of the second extending portion 122 correspond to the extending direction and shape of a partial structure of the main board 3. The end of the second extension portion 122 is provided with a ground terminal 123, and the ground terminal 123 is used for connecting with the ground point 31 of the main board 3.
In an exemplary embodiment, as shown in fig. 5, the mounting structure further includes a first housing 30, the first housing 30 being adapted to be assembled with a main board of the terminal device. In one example, the first housing may be sized and shaped to accommodate a motherboard, and the first housing may be capable of covering the motherboard. In another example, the first housing may serve as a rear housing of the terminal device.
In this embodiment, referring to fig. 4 and 5, the conducting element 10 is disposed on the first casing 30, when the first casing 30 is assembled with the motherboard, a pressure is provided for the conducting element 10, the conducting portion 11 of the conducting element 10 is pressed on the surface of the predetermined element under the action of the pressure, and the second extending portion 121 of the conducting element 10 is assembled with the motherboard 3.
In this embodiment, the size and shape of the first housing 30 are adapted to the main board 3. First casing 30 can set up to the casing of plastic form, and conduction subassembly 10 adopts the mould plastics technology embedded on first casing 30 in, and the structure after the processing needs to satisfy: the conductive portion 11 can be exposed to contact with the surface of the predetermined element, and the ground terminal 123 can be exposed to connect with the ground point 31 of the main board 3.
The first shell and the mainboard can be assembled through screws, and in the screw assembling process, the assembled extrusion force can drive the conduction part of the conduction assembly to abut against the surface of the preset element.
In an exemplary embodiment, the present disclosure is directed to an earpiece assembly including an earpiece body 2 and the mounting structure 1 of the above-described embodiments.
As shown in fig. 4 and 5, in the present embodiment, the mounting structure 1 can press the handset body 2 onto the second housing 4 of the terminal device. The second housing 4 may be, for example, a front housing of the terminal device (for mounting an electrical component such as a display screen and a motherboard).
In this embodiment, the mounting structure 1 includes a conductive member 10 and a connecting portion 20. The conductive assembly 10 includes a conductive portion 11 and an extension portion 12. The conducting part 11 is abutted against the first side of the handset body 2, and is used for pressing the handset body 2 to a preset position on the second shell 4 of the terminal device. The preset position of the second housing 4 may be provided with a card slot adapted to the earpiece body 2.
In an exemplary embodiment, as shown in fig. 4, a first side of the earpiece body 2 is provided with a conductive medium layer 21; the conductive portion 11 is in contact with the conductive medium layer 21. The conductive medium layer 21 may be a medium layer with electrical and thermal conductivity, for example, the conductive medium layer 21 is configured as a thin sheet of metal material. In this embodiment, the conductive medium layer 21 may be configured as a steel sheet or a copper foil. Heat generated by operation of the earpiece body 2 may be conducted to the conductive portion 11 through the conductive medium layer 21.
In the present embodiment, the conductive portion 11 is press-fitted to the conductive medium layer 21 by interference with the connecting portion 20. Wherein, the connection portion 20 can be a conductive foam which can play a role of buffering and conducting electricity, the connection portion 20 is provided with a heat conduction channel 201, and the heat of the conductive medium layer 21 is transferred to the conduction portion 11 with heat absorption and heat soaking functions through the heat conduction channel. Therefore, the embodiment utilizes the heat conduction channel 201 and the conduction part 11, and can effectively transfer heat generated by the receiver during operation under the condition that other structural auxiliary materials are not added, thereby avoiding adverse effects caused by heating of the receiver and improving the experience.
In the present embodiment, the shapes of the conductive portion 11 and the connection portion 20 are adapted to the shape of the conductive medium layer 21.
In an exemplary embodiment, as shown in fig. 2, 4 and 5, the conductive element 10 further includes an extension portion 12, which includes a first extension portion 121 and a second extension portion 122. The earpiece body 2 is connected to the conductive part 11 by means of its conductive medium layer 21, and a connection part 20 is provided between the conductive medium layer 21 and the conductive part 11. When the earpiece body 2 is operated, the generated heat can be uniformly heated through the heat conduction channel 201, the conduction part 11, the first extension part 121 and the second extension part 122 in sequence, and at the same time, the heat can be further conducted to the first casing 30 due to the assembly of the extension part 12 and the first casing 30. The function of effectively radiating the receiver is realized.
In this embodiment, the earpiece assembly 2 is sequentially connected to the connection portion 20 and the conduction portion 11 through the conduction medium layer 21, and finally connected to the grounding point 31 of the main board 3 through the grounding end 123 of the extension portion 12, so as to achieve the grounding function of the earpiece, reduce the interference of the earpiece body to the radio frequency of the terminal device, and improve the reliability of the whole device.
Therefore, the earphone assembly in the embodiment can realize effective heat dissipation, can realize grounding and reduce radio frequency interference, and effectively improves the reliability of the whole machine.
In an exemplary embodiment, as shown in fig. 4 and 6, a sealing portion 22 is disposed between the earpiece body 2 and the second shell 4 to achieve a sealed assembly between the earpiece body 2 and the second shell 4. The sealing portion 22 may be, for example, a sealing foam, and the earpiece body 2 and the second housing 4 are in interference press fit with each other through the sealing foam.
In an exemplary embodiment, as shown in fig. 4 and fig. 6, the handset body 2 is provided with a flexible circuit board (FPC)23, and the handset body 2 is electrically connected to the main board 4 of the terminal device through the flexible circuit board 23, so as to facilitate communication between the handset body 2 and the CPU of the terminal device.
In an exemplary embodiment, the present disclosure provides a terminal device, which includes a main board and the earpiece assembly of any of the above embodiments, where the earpiece assembly is electrically connected to the main board through a flexible circuit board. The terminal device may be, for example, an electronic device with communication and storage functions, such as a mobile phone, a tablet computer, a vehicle-mounted device, a wearable device, and the like.
The earphone assembly in the embodiment has the advantages of simple structure and low cost, and can simultaneously have the functions of heat dissipation and grounding, so that the temperature of the front shell can be effectively reduced, the radio frequency and electrostatic interference of the earphone assembly can be reduced, the reliability of the whole machine can be improved, and the competitiveness of a product can be improved.
Other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the invention and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.
It will be understood that the invention is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the invention is limited only by the appended claims.
Claims (14)
1. A mounting structure for a terminal device, the mounting structure comprising a conductive member;
the conducting component comprises a conducting part and an extending part, and the conducting part is connected with the extending part;
the heat conduction part is connected with the extending part in a pressing mode, the heat conduction part is abutted to a preset element of the terminal device and used for pressing the preset element to a preset position of the terminal device, and the heat conduction part is used for conducting heat of the preset element to the extending part.
2. The mounting structure according to claim 1, further comprising a connecting portion; the conducting part is abutted to the preset element through the connecting part.
3. The mounting structure according to claim 2, wherein a heat conduction channel is provided on the connecting portion, the heat conduction channel communicating the predetermined element and the conduction portion.
4. The mounting structure according to claim 3, wherein the connection portion comprises conductive foam.
5. The mounting structure according to claim 1, wherein a ground terminal is provided on the extension portion, the ground terminal corresponding to a ground point on a main board of a terminal device; the preset element is connected with the grounding point through the grounding end.
6. The mounting structure according to claim 5, wherein the extension includes a first extension and a second extension;
one end of the first extension part is connected with the conduction part, and the other end of the first extension part is connected with the second extension part; the second extending part corresponds to the main board, and the grounding end is arranged on the second extending part.
7. The mounting structure of claim 1, further comprising a first housing, the conductive component being disposed on the first housing; the conduction assembly is assembled with the mainboard through the first shell and drives the conduction assembly to be pressed on the preset element.
8. The mounting structure according to claim 1, wherein the conductive member is provided in a metal material.
9. An earpiece assembly, comprising an earpiece body and the mounting structure of any of claims 1 to 8;
the conducting part of the mounting structure is abutted against the first side of the receiver body and used for pressing the receiver body to a preset position on a second shell of the terminal equipment.
10. The earpiece assembly of claim 9, wherein the first side of the earpiece body is provided with a conductive media layer; the conductive part is abutted against the conductive medium layer.
11. The earpiece assembly of claim 9, wherein the extension portion of the mounting structure has a ground terminal disposed thereon, and the earpiece body is connected to a ground point of the main board via the ground terminal.
12. The earpiece assembly of claim 9, wherein a seal is disposed between the earpiece body and the second shell.
13. The earpiece assembly of claim 9, wherein the earpiece body is provided with a flexible circuit board, the earpiece body being electrically connected with a main board of a terminal device through the flexible circuit board.
14. A terminal device, characterized in that it comprises an earpiece assembly according to any of claims 9 to 13.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011167117.0A CN114489288A (en) | 2020-10-27 | 2020-10-27 | Mounting structure, earphone subassembly and terminal equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011167117.0A CN114489288A (en) | 2020-10-27 | 2020-10-27 | Mounting structure, earphone subassembly and terminal equipment |
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| CN114489288A true CN114489288A (en) | 2022-05-13 |
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| CN205961560U (en) * | 2016-07-15 | 2017-02-15 | 上海与德通讯技术有限公司 | Terminal device |
| CN206629268U (en) * | 2017-03-29 | 2017-11-10 | 江西联创宏声电子股份有限公司 | Loudspeaker module and the electronic installation using the loudspeaker module |
| CN108934150A (en) * | 2018-07-16 | 2018-12-04 | Oppo广东移动通信有限公司 | Housing unit and electronic equipment |
| CN111432615A (en) * | 2020-05-19 | 2020-07-17 | 广东小天才科技有限公司 | Heat radiation structure and electronic equipment |
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