TW201304655A - The case construction of an electronic device - Google Patents

Abstract

A case construction of an electronic device which is the Notebook PC case includes a flexible rib. The Notebook PC case is electrically connecting with the flexible rib. A motherboard is above the Notebook PC case and there is a thermal module which thermal interface is above the motherboard. The Notebook PC case and the metal heat dissipating fins are electrically connecting with each other. The connection between the metal heat dissipating fins and the flexible rib is reliable and the static electricity can be removed via the system earthing path of the Notebook PC.

Description

Housing structure of electronic device

The present invention relates to a housing structure, and more particularly to an electronic device housing structure.

In recent years, with the pursuit of rapid trends in electronic products, the computing and data processing speed of electronic products has become faster and faster. Due to advances in wafer processing technology, the number of wafers that can be generated in a wafer is increased, the volume of the wafer is relatively reduced, and the volume of a single electronic component can be made smaller. In order to achieve faster processing speed and higher performance, the distribution density of electronic components in a circuit board is relatively increased, and the circuit design is more complicated. The electromagnetic waves generated in the case of high-frequency oscillation of some electronic components such as a central processing unit (CPU) tend to induce charge accumulation on the circuit board, electronic components or a metal part to form an accumulation of static charges. In this extremely fine circuit design, the tolerance of the electronic product system to a small noise is relatively reduced, not to mention the problem caused by electrostatic discharge. If the ESD measures are not well done, static electricity can cause considerable damage on electronic components or electronic product systems.

Conventional electrostatic protection methods have been applied to electronic products. Taking a notebook computer as an example, a conductive foam is adhered to a conductive layer of a notebook computer case. A conductive portion of an electronic component inside the notebook is connected to the conductive foam so that a metal heat sink fin is electrically connected to the conductive layer of the notebook case. The static charge accumulated on the circuit board, electronic components or metal parts inside the computer is transmitted through the conductive foam layer through the conductive layer of the bottom of the computer and then from the system grounding line of the notebook computer. In other words, the electrostatic protection effect can be increased by electrically connecting the conductive portion and the notebook case. In this way, the electrostatic protection method can prevent the static electricity from damaging the electronic component, or the user encounters an electrostatic shock. However, the above-mentioned electrostatic protection method will consume the working time of the operator to manually adhere the conductive foam, and increase the manufacturing cost of the notebook computer by purchasing the conductive foam.

In view of the above problems, the present invention provides an electronic device housing structure, which solves the problem that the operator spends the working time in the prior art, and manually attaches the conductive foam to the conductive layer on the bottom of the shell and the conductive foam to increase the manufacture of the notebook computer. The problem of cost.

An electronic device according to an embodiment of the present invention is applicable to a notebook computer case. The electronic device includes a housing, a heat dissipation module, and a heat source. The housing comprises a body and a spring piece, and the elastic piece is integral with the body and is inseparable. The body has a bearing surface, and the carrying mask has a first conductive layer. The elastic piece has an engaging portion and a contact portion, and the engaging portion is connected to the body, and the contact portion is suspended on the bearing surface and is kept at a distance from the bearing surface. The second conductive layer is electrically connected to the first conductive layer on the contact portion of the elastic piece.

According to the above invention, the electronic device utilizes a structure in which the main body and the elastic piece are inseparable, in other words, an integrally formed structure, so that the manufacturing process of the housing can shorten the work of the employee and save the cost of the foam material. And by the electrical connection between the metal heat sink fin and the housing, the electrostatic protection effect can be increased.

The features, implementations, and utilities of the present invention are described in detail below with reference to the drawings.

Please refer to FIG. 1 to FIG. 3B. FIG. 1 is a schematic structural view of a casing and an internal component according to an embodiment of the present invention, and FIG. 2 is a view of the present invention. FIG. 3A is a schematic view showing the contact surface between the elastic piece and the heat dissipation module of the housing according to an embodiment of the present invention, and FIG. 3B is a schematic view showing the structure of the assembly of the housing and the internal components of the embodiment. A schematic view of a shrapnel structure of a housing according to an embodiment of the present invention.

The housing 10 of the present embodiment is suitable for use in the electronic device 30. The electronic device 30 of the present embodiment is a notebook computer, but is not limited thereto. For example, the electronic device 30 can also be an electronic device 30 having a casing 10 such as a tablet computer or a mobile phone.

An electronic device 30 of the embodiment includes a housing 10, a heat dissipation module 300, and a heat source 410. The casing 10 of the present embodiment is made by a method of plastic injection molding, but is not limited thereto. The housing 10 includes a body 100 and a resilient piece 200. The body 100 has a bearing surface 110. In this embodiment and some embodiments, the body 100 and the elastic piece 200 are formed by a plastic injection molding process, so that the body 100 and the elastic piece 200 are integrally formed, but not limited thereto.

The elastic piece 200 includes an engaging portion 210 and a contact portion 220. In this embodiment and some embodiments, the engaging portion 210 has an opposite first surface 212 and a second surface 214. The first surface 212 and the second surface 214 are respectively connected to the bearing surface 110, so that the connecting portion 220 and The bodies 100 are connected together.

The contact portion 220 is extended from the connecting portion 210 toward one end away from the body 100. The contact portion 220 is suspended on the bearing surface 110 and at a distance from the bearing surface 110. The elastic piece 200 can maintain good elasticity via the distance that the contact portion 220 is held by the bearing surface 110. When the elastic piece 200 has good elasticity, the elastic strip piece 200 of the present embodiment can be elastically fatigued. In contrast, conductive foams used in the prior art are more susceptible to elastic fatigue.

The contact portion 220 has a third surface 222 and a fourth surface 224 opposite to each other. The first surface 212 is connected to the third surface 222, and the second surface 214 is connected to the fourth surface 224 such that the connecting portion 210 and the contact portion 220 are joined together. The third face 222 faces the load bearing surface 110. In the present embodiment, the first surface 212 and the bearing surface 110 have an acute angle θ ₁ , and the second surface 214 and the bearing surface 110 have an obtuse angle θ ₂ . The first face 212 and the third face 222 have an obtuse angle θ ₃ . However, the above angles of θ ₁ , θ ₂ and θ ₃ are not intended to limit the invention. In some embodiments, the first surface 212 and the bearing surface 110 have an obtuse angle θ ₁ , and the second surface 214 and the bearing surface 110 have an obtuse angle θ ₂ . The first face 212 and the third face 222 have an acute angle θ ₃ . In addition, in some embodiments, the first surface 212 and the bearing surface 110 have an obtuse angle θ ₁ , and the second surface 214 and the bearing surface 110 have an acute angle θ ₂ . The first face 212 and the third face 222 have an acute angle θ ₃ .

In this embodiment, the first conductive layer 120 is disposed on the bearing surface 110. In this embodiment, the first conductive layer 120 of the metal material is coated on the bearing surface 110 by sputtering. The second conductive layer 230 is located on the second surface 214 and the fourth surface 224, and the second conductive layer 230 of the metal material is coated on the second surface 214 and the fourth surface 224. The second conductive layer 230 on the second surface 214 is electrically connected to the second conductive layer 230 on the fourth surface 224 and the first conductive layer 120 are electrically connected.

The heat dissipation module 300 of the present embodiment includes a metal heat sink fin 302, a fan 304, a heat pipe 306, and a heat conductive sheet 308. In this embodiment and some embodiments, the heat pipe 306 is a heat pipe ( Heat pipe). A heat source 410 is located on a motherboard 400, and the motherboard 400 is located on the carrier surface 110. The heat source 410 can be a central processing unit (CPU) or a graphics processing unit (GPU), but is not limited thereto. The thermally conductive sheet 308 is in thermal contact with the heat source 410. One end of the heat pipe 306 is connected to the heat conducting sheet 308, and the other end of the heat pipe 306 is connected to the metal heat sink fin 302. The metal fins 302 are located at one of the air outlets of the fan 304. When the heat dissipation module 300 is operated, the heat energy generated by the heat source 410 is transmitted to the heat pipe 306 through the heat conduction plate 308. Thereafter, the heat conducted to the heat pipe 306 is transferred to the metal heat sink fins 302, and finally the fan 304 facing the metal heat sink fins 302 by the air outlets discharges the heat energy from the metal heat sink fins 302.

The heat dissipation module 300 is in contact with the fourth surface 224 of the elastic piece 200. In this embodiment and some embodiments, the heat dissipation module 300 is in contact with the fourth surface 224 of the elastic piece 200 via the metal heat dissipation fins 302 . However, the portion of the heat dissipation module 300 that is in contact with the fourth surface 224 is not intended to limit the present invention. In some embodiments, the heat dissipation module 300 can also be in contact with the fourth surface 224 via the heat pipe 306 or the fan 304. When the heat dissipation module 300 is in contact with the fourth surface 224 via the fan 304, The fan 304 must be electrically connected to the metal heat sink fins 302.

In the present embodiment, the metal heat sink fins 302 are in contact with the fourth face 224 of the spring piece 200. The metal heat sink fins 302 are electrically connected to the second conductive layer 230 of the fourth surface 224 , and the second conductive layer 230 is electrically connected to the first conductive layer 120 via the second conductive layer 230 of the second surface 214 . Thus, accumulated static charge on internal components of electronic device 30, such as a circuit board, central processing unit, south bridge wafer, north bridge wafer, or metal components within an electronic product, can pass from heat source 410 through first conductive layer 120 of housing 10. It is then derived from the ground line of the electronic device 30.

The electronic device 30 disclosed in the above embodiment is formed by integrally forming the body 100 and the elastic piece 200 and electrically connecting the first conductive layer and the second conductive layer to each other to achieve the electrical connection structure of the housing 10. The contact faces of the metal heat sink fins 302 and the fourth surface 224 of the elastic piece 200 are flat planes, and can be completely contacted when electrically connected to each other. Conventional techniques use conductive foam, which may occur due to uneven contact surfaces and tip discharge. The general experience of electric shock when using a notebook computer occurs in a heat dissipation vent near the metal heat sink fin 302. Since a large amount of static electricity may accumulate on the metal heat sink fins 302, if the metal heat sink fins 302 are not electrically connected to the system ground of the electronic device 30, the user's electric shock may easily occur. The metal heat dissipation fins 302 of the present embodiment are electrically connected to the casing 10 to reduce the probability of electrostatic shock. Since the elastic piece 200 is connected to the body 100 in an integrally formed manner, the combination of the elastic piece 200 and the body 100 can save time and budget of the process, and can also increase the grounding area and the reliability of the electronic device 30, so that the electronic device The electrostatic protection measures of 30 are more perfect.

While the present invention has been described above in terms of the preferred embodiments thereof, it is not intended to limit the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. The patent protection scope of the invention is subject to the definition of the scope of the patent application attached to the specification.

10. . . case

100. . . Ontology

110. . . Bearing surface

120. . . First conductive layer

200. . . shrapnel

210. . . Connection

212. . . First side

214. . . Second side

220. . . Contact

222. . . Third side

224. . . Fourth side

230. . . Second conductive layer

30. . . Electronic device

300. . . Thermal module

302. . . Metal fin

304. . . fan

306. . . Heat pipe

308. . . Thermal sheet

400. . . motherboard

410. . . Heat source

Figure 1 is a schematic view showing the structure of a casing and internal components according to an embodiment of the present invention.

Figure 2 is a block diagram showing the assembly of the housing and internal components in accordance with an embodiment of the present invention.

FIG. 3A is a schematic view showing the contact surface of the elastic piece and the heat dissipation module of the housing according to an embodiment of the invention.

FIG. 3B is a schematic view showing the structure of the elastic piece of the casing according to an embodiment of the present invention.

10. . . case

100. . . Ontology

110. . . Bearing surface

120. . . First conductive layer

200. . . shrapnel

230. . . Second conductive layer

30. . . Electronic device

300. . . Thermal module

302. . . Metal fin

304. . . fan

306. . . Heat pipe

308. . . Thermal sheet

400. . . motherboard

410. . . Heat source

Claims (10)

A housing comprising: a body having a bearing surface, the bearing mask having a first conductive layer; and a resilient piece disposed on the bearing surface, the elastic piece being integral with the body structure. The elastic piece has an engaging portion and a contact portion, the engaging portion is in contact with the body, and the contact portion is suspended on the bearing surface and at a distance from the bearing surface, the contact portion has a second conductive layer thereon The first conductive layer is electrically connected. The housing of claim 1, wherein the engaging portion of the elastic piece has an opposite first surface and a second surface, and the first surface and the second surface are respectively connected to the bearing surface, and the The first surface has an acute angle with the bearing surface, and the second surface and the bearing surface have an obtuse angle. The housing of claim 1, wherein the contact portion of the elastic piece has an opposite third surface and a fourth surface, the third surface faces the bearing surface, and the engaging portion of the elastic piece has opposite sides. a first surface and a second surface, the first surface is connected to the third surface and has an obtuse angle, the second surface is connected to the fourth surface, and the second conductive layer is located at the second surface and the second surface Four sides. The housing of claim 3, wherein the second conductive layer of the second side of the elastic piece is electrically connected to the second conductive layer of the fourth surface. An electronic device comprising: a housing comprising: a body having a bearing surface, the bearing mask having a first conductive layer; and a resilient piece disposed on the bearing surface, the elastic piece and the elastic piece The body is an integral, inseparable structure. The elastic piece has an engaging portion and a contact portion, the engaging portion is in contact with the body, the contact portion has a second conductive layer electrically connected to the first conductive layer, and the contact portion is suspended on the bearing surface and The heat dissipation module is disposed on the elastic piece, and the heat dissipation module includes a conductive portion, and the conductive portion electrically contacts the second conductive layer. The electronic device of claim 5, wherein the engaging portion of the elastic piece has an opposite first surface and a second surface, and the first surface and the second surface are respectively connected to the bearing surface, and the The first surface and the bearing surface have an acute angle, and the second surface and the bearing surface have an obtuse angle The electronic device of claim 6, wherein the engaging portion of the elastic piece has an opposite first surface and a second surface, the first surface being connected to the third surface and having an obtuse angle, the second The face is connected to the fourth face, and the second conductive layer is located on the second face and the fourth face at the same time. The electronic device of claim 5, wherein the contact portion of the elastic piece has an opposite third surface and a fourth surface, the third surface faces the bearing surface, and the second conductive layer is located at the fourth surface. The electronic device of claim 5, wherein the electronic device further comprises a heat source, the heat source is located on the housing, and the heat dissipation module is in thermal contact with the heat source. The electronic device of claim 5, wherein the conductive portion is a metal heat sink fin. The heat dissipation module further includes: a fan having an air outlet, the air outlet facing the metal heat dissipation fin; a heat pipe, the heat pipe is connected to the heat dissipation fin; and a heat conduction piece, the heat conduction piece Connected to the heat pipe, the heat conducting sheet is in thermal contact with a heat source.