200928683 九、發明說明： 【發明所屬之技術領域】 本發明係有關一種散熱系統，尤指一種結合電磁屏蔽元件之 散熱系統及應用其之電子裝置。 【先前技術】 科技與製程的進步豐富了許多電子裝置的功能，同時也使得 ❹ 這些裝置變得越來越輕巧，讓使用者可以方便地隨身攜帶。舉例 而言，行動電話、個人數位助理（PDA)或衛星導航裝置（Gps) 等可攜式裝置，在曰常生活或工作中扮演越來越重要的角色。也 由於技術的進步帶來可攜式裝置功能的提升，相較於以往較簡單 的電子電路、勃體及系統的設計，目前大多可攜式裝置皆且備了 精密的電路設計、龐大數量的電子元件、複雜的韌體及系統規劃， 也因此造成可攜式系統的用電量大而集中，對於運作過程中會產 Φ 生熱能的電子元件（如扮演不同角色的各種1C晶片）而言，散熱 問題成為系統設計過程中不可忽視的一件事。 另一方面，不同電子元件之間或不同的電子裝置之間尚須考慮電 磁干擾（electromagnetic interference, EMI)的問題。隨著使用低電 壓訊號的電子設備的工作頻率越來越高，電磁相容 (electromagnetic compatibility, EMC)的研究以及應用也越來越重 要。習知的方式係運用金屬屏蔽的原理，針對會造成其他元件電 磁干擾的元件做屏蔽或提升受保護元件的電磁耐受性 5 200928683 (electromagnetic susceptibility) ’通常於電子元件外包覆一接地金 屬屏蔽元件（或稱EMCshidd)’使電子裝置本身以及内部各元件 具有電磁相容的能力。請參考第！目，第！圖為一般電子裝置中 應用金屬屏蔽元件使電子元件符合電磁相容的例子。晶片2〇透過 複數個接腳21安裝於電路板1〇上，於晶片2〇外圍則透過金屬屏 蔽片30覆蓋於晶片20上’同時透過接地部31電性連接於電路板 1〇上之接地端，使晶片20可防止受外界電磁場干擾。然而對於目 ❹前已知的技術來說’這麟地金屬碰元件的包覆通常造成電子 元件的散熱更加不易。 【發明内容】 本發明係揭露-種用於-電子裝置之散熱系統，其包含有一 電路板、-電子元件以及-電磁屏蔽元件。該電子元件係設置於 該電路板上。該電磁屏蔽元件係覆蓋於該電子元件上，且具有一 ❹接地部以及-第-區域，該接地部係接地，該第一區域係連接於 該雷早元株卜。 ' 本發明另揭露-種具有上述散齡統之電子裝置。該電子裝置包 含有-殼體以及-散齡統’概齡統係設於贿體内。、該散 熱系統包含有-電路板、-電子元件以及—電轉蔽元件。該電 子轉係設置於該電路板上。該電磁屏航件係於該電子元 件上，且具有-接地部以及—第—區域，該接地部係接地， 一區域係連接於該電子元件上。 弟 6 200928683 【實施方式】 為了能纽排除電子元件於運作時產生的錄舰，使電子 .=^1倾細，咖_财_屏蔽元件來 達到散熱的功能。下列說明中以可攜式電子裝置中的系統晶片作 說明’然而本發明應用的範圍不僅止於可攜式電子裝置或其中的 晶片，對於任何紐熱需求以及必須符合電磁姆規範的電子元 件、裝置或設備，利用其電磁屏蔽元件以達到散熱效果的特徵， ❹ 皆屬本發明的範圍。 π參考第2圖以及第3圖，第2圖為本發明散絲統1〇〇第 -實施例之示意圖，第3圖則為散熱系統1〇〇之俯視示意圖，其 中第2圖為第3圖中ΑΑ，線段之截面示意圖。散熱系統刚應用 於可攜式電子裝置中’其包含有一電路板11〇、一積體電路晶片 (Megrated Circuit Chip; IC chip) 12〇、一金屬屏蔽片 13〇 以及一 珍導熱物質140。積體電路晶片12〇透過複數個接腳⑵電性連接於 電路板110上’於積體電路晶片120外圍則透過金屬屏蔽片⑽ 覆蓋於積體電路晶片12〇上，同時透過接地部131電性連接於電 路板U〇上之接地端’使積體電路晶片120具有f：磁相容的能力。 積體電路晶片120於正常運作時會於其周圍產生電磁場且會排出 熱能’因此接地的金屬屏蔽片13G可屏蔽積體電路晶片⑽產生 之電磁場免於對可攜式電子裝置中其他電子元件或其他電子裝置 造成電磁干擾，同時防止積體電路晶片12〇受外界電磁場干擾。 金屬屏蔽片130具有一第一區域{以及一第二區域11，其中第一區 200928683 域i係為一凹陷平面，且其係透過導熱物質140 (分別緊密接觸積 體電路晶片120之上表面以及金屬屏蔽片13〇之第一區域貼附 於麵電路晶片120之上表面，且為了能夠有效消散積體電路晶 片120所產生的熱能，第一區域j通常設計為與其接觸之積體電路 晶片120上表面面積及形狀相當或實質上相同，如此一來，積體 電路晶片120於運作過程中產生的熱能透過導熱物質14〇導向至 金屬屏蔽片130之第-區域工以及第二區域n排出。於此實施例 © _，導熱物質係可為散熱膏，但不以此為限，任何可置於積體電 路晶片m與金屬屏蔽片130之第一區域工間用以導熱之物質皆 可達到本發明之目的。此外，金屬屏蔽片13〇之第二區域n (相 異且相^於第-區域I之其他區域）另具有一或多個散熱槽m， 當積體電路晶片12〇於運作過程中產生的熱能傳遞至第二區域π 時，散熱槽132的設置可增加第二區细與外部空間接觸的面積， 加速散熱速度，其巾於本發_實_巾，餘槽132係呈波浪 籲狀起伏，且於第3圖之俯視示意圖中為複數個長度相當的平行分 佈’然本發明揭露之金屬屏蔽片130上的散熱槽132在增加散熱 面積的目的Τ ’亦可具有其他任何形狀或分佈，不應受到實施例 所限制。 請參考第4圖。第4圖為本發明所揭露之散熱系統第二實施 例之示意圖。與第-實施例不同的是，金屬屏蔽片2财與積體 電路晶片120接觸的區域為一凸起平面，且透過接地部说盘電 路板m上之接地端電性連接以達到接地的作用，此外第一實施 200928683 例中金屬屏蔽片削具有的散熱槽叫系為增加散敎效率所咬 置，然亦可如第二實施例之金屬屏蔽片230，不需另外對金^蔽 P30加工出散熱槽，亦可達到同時對積體電路晶片散熱以 及電磁屏蔽的效果。 請參考第5圖’本發明所揭露金屬屏蔽片BO中與積體電路 晶片120接觸的區域亦可直接為金屬屏蔽片33〇上之平面於第$ ❹ ®之第三實施例中金屬屏蔽片330透過接地部別與電路板ιι〇 上之接地端電性連接以達到接地的作用，於中間區域透過導熱物 質140貼附於積體電路晶片12〇上表面以傳遞熱能，此外金屬屏 蔽片330上亦具有一或多個散熱槽332以增加散熱面積。 請參考第6圖。第6圖為本發明所揭露之電子裝置2〇〇之示 意圖。電子裝置200包含有-殼體15〇及一散熱系統卿設於殼 鲁體150内。散熱系統1〇〇 &含有一電路板11〇、一積體電路晶片 120、金屬屏蔽片430以及-導熱物質14〇。殼體15〇具有至少 金屬邛151 ’且金屬屏蔽片430係透過第二區域丨〗連接於殼體 150之金屬部151 ’而第一區域㈣透過導熱物質14〇貼附於積體 電路晶片12G上表面，以將積體電路晶片⑽產生的熱能傳遞出 去。於本實施例中，熱能亦可藉由第二區域n與殼體15〇之金屬 4 151的接觸而傳遞，更可提升對積體電路晶片12〇的散熱效果。 另外，對於金屬屏蔽片430來說，其必須具有接地的連接方 9 200928683 能對所覆蓋之電子元件具有電磁屏蔽的效果，而這樣的接地連接 ·； 除了前述實施例中藉由電性連接到電路板上的接地端外，亦可透 過直接接觸於殼體150之金屬部151來達成。 於本發明實施例中，電子裝置200較佳係可以是行動電話、 個人數位助理（personaldigital assistant ; PDA)、全球定位系統 (global positioning system ; GPS )裝置、超行動電腦（此瓜咖娜 ❹ Personalcomputer ; UMPC)、及筆記型電腦等可攜式電子裝置，但 並不以此為限，其亦可為任何具有積體電路晶片的電子裝置。 本發明於電子裝置透過現有電子元件上作為電磁屏蔽效 果之金屬屏蔽元件與電子元件連接，以達到對電子元件散熱的目 的。於金屬屏蔽元件與電子元件間具有導熱物質以提高導熱效 率，於金屬屏蔽元件非與電子元件接觸之其它表面具有一或多個 散熱槽增加散熱面積。 〇 以上所述僅為本發明之較佳實施例，凡依本發明申請專利範 圍所做之均等變化與修飾，皆應屬本發明之涵蓋範圍。 【圖式簡單說明】 第1圖為先前技術的電子裝置中應用金屬屏蔽元件使電子元件符 合電磁相容之示意圖。 第2圖為本發明散熱系統第一實施例之示意圖。 200928683 第3圖為第2圖散熱系統之俯視示意圖。 第4圖為本發明第二實施例之示意圖。 第5圖為本發明第三實施例之示意圖。 第6圖為本發明實施例的電子裝置之示意圖。 【主要元件符號說明】 10、110 電路板 20、 120 積體電路晶片 21、121 接腳 30、 130、 金屬屏蔽片 230 、330、430 31 > 131 > 接地部 100 散熱系統 231 、 331 132 散熱槽 140 導熱物質 150 殼體 151 金屬部 11200928683 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipation system, and more particularly to a heat dissipation system incorporating an electromagnetic shielding element and an electronic device using the same. [Prior Art] Advances in technology and processes have enriched the functions of many electronic devices, and at the same time made these devices more and more lightweight, making it easy for users to carry around. For example, portable devices such as mobile phones, personal digital assistants (PDAs) or satellite navigation devices (Gps) play an increasingly important role in everyday life or work. Due to the advancement of technology, the function of the portable device has been improved. Compared with the simple electronic circuit, the design of the body and the system, most of the portable devices are equipped with precise circuit design and a large number of devices. Electronic components, complex firmware, and system planning also result in a large and concentrated power consumption of the portable system. For electronic components that generate Φ heat during operation (such as various 1C chips that play different roles) The heat dissipation problem has become a thing that cannot be ignored in the system design process. On the other hand, the problem of electromagnetic interference (EMI) must be considered between different electronic components or between different electronic devices. As the frequency of operation of electronic devices using low voltage signals is increasing, the research and application of electromagnetic compatibility (EMC) is becoming more and more important. The conventional method uses the principle of metal shielding to shield or enhance the electromagnetic resistance of the components that cause electromagnetic interference of other components. 5 200928683 (electromagnetic susceptibility) 'Generally, a grounded metal shield is coated on the electronic component. The component (or EMCshidd) 'has the ability of the electronic device itself and the internal components to be electromagnetically compatible. Please refer to the first! Head, first! The figure shows an example in which a metal shield member is used in a general electronic device to make the electronic component conform to electromagnetic compatibility. The chip 2 is mounted on the circuit board 1 through a plurality of pins 21, and is covered on the chip 20 through the metal shield 30 on the periphery of the chip 2' while being electrically connected to the ground on the circuit board 1 through the ground portion 31. At the end, the wafer 20 is protected from external electromagnetic fields. However, for the previously known techniques of the prior art, the cladding of the metal component of the lining generally causes the heat dissipation of the electronic component to be more difficult. SUMMARY OF THE INVENTION The present invention is directed to a heat dissipation system for an electronic device that includes a circuit board, an electronic component, and an electromagnetic shielding component. The electronic component is disposed on the circuit board. The electromagnetic shielding component covers the electronic component and has a grounding portion and a - region, the grounding portion is grounded, and the first region is connected to the Raysun element. The invention further discloses an electronic device having the above-mentioned age. The electronic device includes a - casing and a system of ages in the body of the bribe. The heat sink system includes a circuit board, an electronic component, and an electrical relay component. The electronic transfer system is disposed on the circuit board. The electromagnetic screen device is attached to the electronic component and has a grounding portion and a first region, the grounding portion is grounded, and a region is connected to the electronic component. Brother 6 200928683 [Embodiment] In order to eliminate the recorded ship generated during the operation of the electronic component, the electronic device can be used to achieve heat dissipation. In the following description, the system wafer in the portable electronic device is described. However, the scope of application of the present invention is not limited to the portable electronic device or the wafer therein, and for any new heat demand and electronic components that must comply with the electromagnetic specifications, It is within the scope of the invention for a device or device to utilize its electromagnetic shielding elements to achieve a heat dissipating effect. π refers to FIG. 2 and FIG. 3, FIG. 2 is a schematic view of the first embodiment of the present invention, and FIG. 3 is a schematic plan view of the heat dissipation system 1 ,, wherein FIG. 2 is the third view. In the figure, a schematic cross-section of the line segment. The heat dissipating system has just been applied to a portable electronic device, which includes a circuit board 11A, a Megrated Circuit Chip (IC chip) 12A, a metal shielding plate 13A, and a heat conductive material 140. The integrated circuit chip 12 is electrically connected to the circuit board 110 through a plurality of pins (2). The outer surface of the integrated circuit chip 120 is overlaid on the integrated circuit chip 12 through the metal shield (10), and is electrically transmitted through the ground portion 131. The ground terminal 'on the circuit board U' is electrically connected to the integrated circuit board' to make the integrated circuit wafer 120 have the capability of f: magnetic compatibility. The integrated circuit wafer 120 generates an electromagnetic field around it during normal operation and discharges thermal energy. Therefore, the grounded metal shield 13G can shield the electromagnetic field generated by the integrated circuit chip (10) from other electronic components in the portable electronic device or Other electronic devices cause electromagnetic interference while preventing the integrated circuit chip 12 from being disturbed by external electromagnetic fields. The metal shielding sheet 130 has a first region {and a second region 11, wherein the first region 200928683 region i is a concave plane, and is transmitted through the heat conductive material 140 (closely contacting the upper surface of the integrated circuit wafer 120 and The first region of the metal shield sheet 13 is attached to the upper surface of the surface circuit wafer 120, and in order to effectively dissipate the heat energy generated by the integrated circuit wafer 120, the first region j is generally designed to be in contact with the integrated circuit wafer 120. The upper surface area and shape are equal or substantially the same, so that the thermal energy generated during the operation of the integrated circuit wafer 120 is guided through the heat conductive material 14 to the first region of the metal shield 130 and the second region n is discharged. In this embodiment, the heat conductive material may be a heat dissipating paste, but not limited thereto, any material that can be placed in the first region of the integrated circuit wafer m and the metal shielding sheet 130 for heat conduction can be achieved. In addition, the second region n of the metal shielding sheet 13 (different and other regions of the first region I) further has one or more heat dissipation grooves m, when the integrated circuit wafer 12 When the heat energy generated during the operation is transmitted to the second region π, the arrangement of the heat dissipation groove 132 can increase the area of the second region which is in contact with the external space, and accelerate the heat dissipation speed, and the towel is in the hair _ _ _ towel, the remaining groove 132 The undulations are undulating, and in the top view of FIG. 3, there are a plurality of parallel distributions of comparable lengths. However, the heat dissipation grooves 132 of the metal shielding sheet 130 disclosed in the present invention may have the purpose of increasing the heat dissipation area. Any other shape or distribution should not be limited by the embodiment. Please refer to Fig. 4. Fig. 4 is a schematic view showing a second embodiment of the heat dissipation system disclosed in the present invention, which is different from the first embodiment in the metal shielding sheet. The area in contact with the integrated circuit chip 120 is a convex plane, and the grounding end of the disk circuit board m is electrically connected to the ground through the grounding portion to achieve the grounding function. In addition, the metal shielding sheet is cut in the first embodiment of 200928683. The heat sink is called to increase the heat dissipation efficiency. However, the metal shield 230 of the second embodiment can be used to process the heat sink without separately processing the heat sink P30. The heat dissipation of the circuit chip and the effect of electromagnetic shielding. Please refer to FIG. 5 'The area of the metal shielding sheet BO disclosed in the present invention that is in contact with the integrated circuit wafer 120 can also be directly on the surface of the metal shielding sheet 33 on the first ❹ ® In the third embodiment, the metal shielding sheet 330 is electrically connected to the grounding end of the circuit board through the grounding portion to achieve the grounding function, and is adhered to the upper surface of the integrated circuit wafer 12 through the heat conductive material 140 in the intermediate portion. In order to transfer heat energy, the metal shielding sheet 330 also has one or more heat dissipating grooves 332 to increase the heat dissipating area. Please refer to FIG. 6. FIG. 6 is a schematic diagram of the electronic device 2 disclosed in the present invention. A housing 15 is included and a heat dissipation system is disposed in the housing 150. The heat dissipation system 1 & includes a circuit board 11A, an integrated circuit wafer 120, a metal shield 430, and a heat conductive material 14A. The housing 15A has at least a metal crucible 151' and the metal shield sheet 430 is connected to the metal portion 151' of the housing 150 through the second region, and the first region (4) is attached to the integrated circuit wafer 12G through the heat conductive material 14A. The upper surface transfers heat energy generated by the integrated circuit chip (10). In this embodiment, the thermal energy can also be transmitted by the contact of the second region n with the metal 4 151 of the housing 15 , and the heat dissipation effect on the integrated circuit wafer 12 can be improved. In addition, for the metal shield 430, it must have a grounded connection side 9 200928683 to have an electromagnetic shielding effect on the covered electronic components, and such a ground connection is provided; in addition to the foregoing embodiment, by electrically connecting to The grounding end of the circuit board can also be achieved by direct contact with the metal portion 151 of the housing 150. In the embodiment of the present invention, the electronic device 200 is preferably a mobile phone, a personal digital assistant (PDA), a global positioning system (GPS) device, and an ultra mobile computer (this guakana ❹ Personalcomputer) UMPC), and portable electronic devices such as notebook computers, but not limited thereto, can also be any electronic device having integrated circuit chips. The invention connects the electronic shielding element to the electronic component through the existing electronic component as an electromagnetic shielding effect to achieve the purpose of dissipating heat from the electronic component. There is a heat conductive material between the metal shielding component and the electronic component to improve the heat conduction efficiency, and the metal shielding component has one or more heat dissipation grooves on other surfaces not in contact with the electronic component to increase the heat dissipation area. The above is only the preferred embodiment of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing the application of a metal shield member in an electronic device of the prior art to make the electronic component conform to electromagnetic compatibility. 2 is a schematic view of a first embodiment of a heat dissipation system of the present invention. 200928683 Figure 3 is a top plan view of the heat dissipation system of Figure 2. Figure 4 is a schematic view of a second embodiment of the present invention. Figure 5 is a schematic view of a third embodiment of the present invention. FIG. 6 is a schematic diagram of an electronic device according to an embodiment of the present invention. [Major component symbol description] 10, 110 circuit board 20, 120 integrated circuit chip 21, 121 pins 30, 130, metal shield 230, 330, 430 31 > 131 > Ground portion 100 heat dissipation system 231, 331 132 Heat sink 140 heat conductive material 150 housing 151 metal portion 11