CN214101759U - Loudspeaker module and electronic equipment - Google Patents
Loudspeaker module and electronic equipment Download PDFInfo
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- CN214101759U CN214101759U CN202120424948.5U CN202120424948U CN214101759U CN 214101759 U CN214101759 U CN 214101759U CN 202120424948 U CN202120424948 U CN 202120424948U CN 214101759 U CN214101759 U CN 214101759U
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- heat
- heat absorbing
- speaker module
- absorbing member
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Abstract
The application relates to the technical field of speakers, and discloses a speaker module and electronic equipment, the speaker module includes: the loudspeaker comprises a shell, a loudspeaker body, a heat absorbing piece and a heat conducting piece, wherein the loudspeaker body, the heat absorbing piece and the heat conducting piece are positioned in the shell; one end of the heat conducting member is connected to the heat absorbing member, and the other end of the heat conducting member is disposed at the through hole. The heat that the heat absorbing member absorbed the speaker body and produced, outside the heat conduction piece passed out the speaker module with the heat transfer of heat absorbing member, helped speaker module temperature to cool off rapidly, and then avoided experiencing because of the too high customer that leads to of electronic equipment's local high temperature and feel poor.
Description
Technical Field
The utility model relates to a speaker technical field, concretely relates to speaker module and electronic equipment.
Background
The speaker module is an important acoustic component in portable electronic equipment, is used for completing the conversion between an electric signal and a sound signal, and is an energy conversion device.
When music or video is played to the speaker module of cell-phone, speaker module temperature risees very prominently for lid temperature risees very prominently behind the cell-phone of speaker module installation department, leads to user's experience sense relatively poor.
SUMMERY OF THE UTILITY MODEL
In view of the above-mentioned drawbacks and deficiencies of the prior art, it is desirable to provide a speaker module and an electronic device.
In a first aspect, the present invention provides a speaker module, including: a shell, a loudspeaker body, a heat absorbing piece and a heat conducting piece, wherein the loudspeaker body, the heat absorbing piece and the heat conducting piece are positioned in the shell, the shell is provided with a through hole, the loudspeaker body comprises a magnet piece,
the heat absorbing piece is in magnetic adsorption connection with the magnet piece;
one end of the heat conducting member is connected to the heat absorbing member, and the other end of the heat conducting member is disposed at the through hole.
In one embodiment, the heat absorbing member covers at least the speaker body.
In one embodiment, the orthographic projection of the speaker body on the heat absorbing member is entirely located on the heat absorbing member.
In one embodiment, an end portion of the heat conducting member is located entirely on the heat absorbing member in an orthographic projection of the heat absorbing member.
In one embodiment, the heat absorbing member is a graphite sheet, a heat absorbing film or a vapor chamber.
In one embodiment, the other end of the heat conducting member is snap-fitted to the through hole.
In one embodiment, the thermal conduction member is a flexible circuit board.
In a second aspect, the present invention provides an electronic device comprising the speaker module described in the first aspect.
In one embodiment, the speaker module further comprises a rear cover which presses against the speaker module, and the heat absorbing member is arranged close to the rear cover.
In one embodiment, the loudspeaker module further comprises a middle frame for mounting the loudspeaker module, and the through hole faces the middle frame.
Compared with the prior art, the beneficial effects of the utility model are that:
according to the scheme, the heat absorbing piece absorbs the heat generated by the loudspeaker body, and the heat conducting piece transmits the heat of the heat absorbing piece out of the loudspeaker module, so that the loudspeaker module is favorably cooled rapidly, and further poor customer experience caused by overhigh local temperature of the electronic equipment is avoided; the heat absorbing piece covers the loudspeaker body, so that the contact surface between the loudspeaker body and the heat absorbing piece is sufficiently large, and the heat conduction efficiency between the loudspeaker body and the heat absorbing piece is improved; the heat conducting piece is clamped and matched with the through hole, so that the heat conducting piece is partially exposed out of the loudspeaker module, and the heat conducting piece can be stably fixed in the loudspeaker module.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:
fig. 1 is a schematic structural diagram of a speaker module according to an embodiment of the present application;
fig. 2 is an exploded view of a speaker module according to an embodiment of the present application;
FIG. 3 is a cross-sectional view of FIG. 1;
fig. 4 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
In fig. 1-3: 200-a loudspeaker module, 21-a loudspeaker body, 22-a heat absorbing piece, 23-a heat conducting piece, 24-a shell, 241-an upper shell piece, 2411-a first gap, 242-an upper cover plate, 243-a lower shell piece, 2431-a through hole, 2432-a second gap and 25-a mounting seat;
in FIG. 4, 100-center, 11-speaker module mounting groove, 12-battery mounting groove, 13-motherboard mounting groove, 300-battery, 400-rear cover.
Detailed Description
The present application will be described in further detail with reference to the following drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and are not limiting of the invention. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.
Fig. 1 to 3 show schematic structural diagrams of a speaker module provided in the present application.
The speaker module 200 is suitable for an electronic device, for example, the electronic device may be a mobile phone, a tablet computer, a notebook computer, an intelligent wearable device, or the like.
The speaker module 200 includes: a housing 24, a speaker body 21, a heat absorbing member 22, and a heat conductive member 23. The speaker body 21, the heat absorbing member 22, and the heat conducting member 23 are disposed in the housing 24; the housing 24 is provided with a through hole 2431, and the speaker body 21 includes a magnet member. The heat absorbing member 22 is in magnetic attachment with the magnet member; one end of the heat conductive member 23 is connected to the heat absorbing member 22, and the other end of the heat conductive member 23 is disposed at the through hole 2431.
The speaker body 21 is used to perform conversion between an electric signal and a sound signal, and is an energy conversion device. When the speaker module 200 is operated, the speaker body 21 is a heat source, and generates a large amount of heat. The heat absorbing member 22 is magnetically attached to the magnet member of the speaker body 21, direct or indirect heat conduction occurs between the speaker body 21 and the heat absorbing member 22, and heat of the speaker body 21 is conducted to the heat absorbing member 22. One end of the heat conductive member 23 is connected to the heat absorbing member 22, the heat conductive member 23 is thermally conductive with the heat absorbing member 22, and heat of the heat absorbing member 22 is conducted to the heat conductive member 23. Meanwhile, the other end of the heat conducting member 23 is disposed in the through hole 2431, so that the heat of the heat conducting member 23 can be conducted out of the speaker module 200, the speaker module 200 is helped to cool rapidly, and the poor experience of the customer caused by the overhigh local temperature of the electronic device is avoided.
In this embodiment, the heat absorbing member 22 covers at least the speaker body 21.
The speaker body 21 is substantially cubic. The heat absorbing member 22 is a graphite sheet, which is a heat conductive and heat dissipating material capable of uniformly conducting heat in two directions. The length of the heat absorbing member 22 is larger than the length of the speaker body 21, and the width of the heat absorbing member 22 is substantially equal to the width of the speaker body 21. The orthographic projection of the speaker body 21 on the heat absorbing member 22 is entirely within the heat absorbing member 22 such that the heat absorbing member 22 completely covers the speaker body 21. The arrangement mode of the loudspeaker body 21 and the heat absorbing piece 22 fully ensures that the contact surface between the loudspeaker body 21 and the heat absorbing piece 22 is large enough, and is favorable for improving the heat conduction efficiency between the loudspeaker body 21 and the heat absorbing piece 22. Meanwhile, the heat absorbing member 22 is magnetically attached to the magnet member of the speaker body 21, so that the absorbing member 22 is stably attached to the speaker body 21.
Furthermore, an end of the heat conducting member 23 is also connected to the heat absorbing member 22, and an end of the heat conducting member 23 is located entirely on the heat absorbing member 22 in an orthographic projection of the heat absorbing member 22, such that the heat absorbing member 22 also completely covers the end of the heat conducting member 23. The arrangement of the heat absorbing member 22 and the one end portion of the heat conducting member 23 fully ensures that the contact area between the heat absorbing member 22 and the one end portion of the heat conducting member 23 is large enough, which is beneficial to improving the heat conduction efficiency between the heat absorbing member 22 and the heat conducting member 23. Meanwhile, one end of the heat conductive member 23 is connected to the heat absorbing member 22 by the gel, so that one end of the heat conductive member 23 is stably connected to the heat absorbing member 22.
It should be noted that the heat absorbing member 22 can be a graphite sheet, and the heat absorbing member 22 can also be a heat absorbing film, and the graphite sheet or the heat absorbing film has the characteristic of small thickness, so that the overall thickness of the speaker module can be reduced, and further, the compact structure and the high space utilization rate of the electronic device can be ensured; the heat absorbing member 22 may also be a vapor chamber, such as a VC heat pipe.
In this embodiment, the other end of the thermal conductor 23 is snap-fitted into the through hole 2431.
The speaker module 200 includes: a housing 24, a speaker body 21, a heat absorbing member 22, a heat conductive member 23, and a mounting seat 25. The speaker body 21, the heat absorbing member 22, the heat conductive member 23, and the mounting seat 25 are disposed in the housing 24. The housing 24 includes an upper case member 241, an upper cover plate 242, and a lower case member 243. The upper casing 241 is provided with a first gap 2411, and the first gap 2411 is matched with the upper cover 242, so that the upper cover 242 is clamped in the first gap 2411. The upper cover plate 242 is engaged with the upper casing 241, so that the speaker module 200 can be conveniently overhauled or maintained through the first opening 2411. The lower casing member 243 is provided with a through hole 2431 and a second cutout 2432. The mounting seat 25 is used for fixing the loudspeaker body 21, and the second opening 2432 is matched with the mounting seat 25, so that the mounting seat 25 is clamped in the second opening 2432. The snap fit of the lower housing member 243 with the mounting base 25 helps facilitate assembly of the speaker body 21.
The upper casing 241 and the lower casing 243 are combined to form an accommodating cavity, the speaker body 21 is mounted on the mounting seat 25, and the heat absorbing member 22 is connected to the speaker body 21, wherein the heat absorbing member 22 covers the speaker body 21. One end of the heat conductive member 23 is connected to the heat absorbing member 22, and the heat absorbing member 22 also covers one end of the heat conductive member 23; the other end of the heat conduction member 23 is rectangular, and the other end of the heat conduction member 23 is matched with the through hole 2431 in shape, so that the other end of the heat conduction member 23 is clamped in the through hole 2431. Another tip of heat-conducting piece 23 and through-hole 2431's joint cooperation realizes that heat-conducting piece 23 further is stably fixed in speaker module 200 in, avoids rocking of heat-conducting piece 23.
In the present embodiment, the heat absorbing member 22 is a flexible circuit board (FPC) for electrical connection with the speaker body 21. Meanwhile, the flexible printed circuit board is a flexible printed circuit board which is made of polyimide or polyester film as a base material and has high reliability and excellent performance, can be freely bent and folded, and meets the design requirement of miniaturization of a loudspeaker module; in addition, the flexible circuit board has excellent heat conductivity, is close to the loudspeaker module, and guides heat out of the loudspeaker module by using the shortest path, so that the cooling efficiency of the loudspeaker module is improved.
Furthermore, the present invention provides an electronic device comprising the speaker module 200 described above.
Fig. 4 shows a schematic structural diagram of a mobile phone, which includes a speaker module 200, a battery 300, a main board (not shown), a display screen (not shown), a rear cover 400, a middle frame 100, and the like. The middle frame 100 may be made of an aluminum alloy material, and the middle frame 100 has a first surface and a second surface that are opposite to each other, where the first surface is a surface facing a user when the mobile phone is used, and the second surface is a surface facing away from the user when the mobile phone is used.
A display screen mounting groove is formed on the first surface of the middle frame 100 by sinking from the first surface to the second surface of the middle frame 100, and the display screen is mounted in the display screen mounting groove; the second surface of the middle frame 100 is sequentially recessed from the second surface of the middle frame 100 to the first surface to form a speaker module mounting groove 11, a battery mounting groove 12 and a mainboard mounting groove 13, the speaker module 200 is mounted in the speaker module mounting groove 11, the battery 300 is mounted in the battery mounting groove 12, and the mainboard is mounted in the mainboard mounting groove 13.
The rear cover 400 is in close fit with the middle frame 100, the rear cover 400 closes the speaker module mounting groove 11, the battery mounting groove 12 and the motherboard mounting groove 13 of the middle frame 100, and the rear cover 400 abuts against the battery 300, the speaker module 200 and the motherboard.
In the present embodiment, the through hole 2431 of the speaker module 200 faces the middle frame 100.
The speaker module 200 is installed in the speaker module 200 mounting groove of the middle frame 100, the bottom of the lower casing 243 and the speaker module 200 mounting groove is abutted, the through hole 2431 of the lower casing 243 faces the 2431 middle frame 100, so that the heat inside the speaker module 200 is transferred to the middle frame 100 at the first time, the heat transfer between the speaker module 200 and the middle frame 100 is accelerated, the speaker module 200 is helped to be cooled rapidly, and the local temperature of the mobile phone is prevented from being too high.
In this embodiment, the heat absorbing member 22 is disposed adjacent to the back cover 400.
The speaker module 200 is mounted in the speaker module mounting groove 11 of the middle frame 100, and the rear cover 400 is pressed against the speaker module 200, so that the rear cover is pressed against the upper case 241 of the speaker module 200. In the speaker module 200, the upper casing member 241, the heat absorbing member 22, the speaker body 21, the mounting seat 25, and the lower casing member 243 are sequentially disposed from top to bottom, and the heat absorbing member 22 is close to the upper casing member 241. The proximity of the heat absorbing member 22 to the back cover 400 facilitates a portion of the heat absorbing member 22 to be transferred to the back cover 400, further facilitating cooling of the speaker module 200.
The above description is only a preferred embodiment of the application and is illustrative of the principles of the technology employed. It will be appreciated by those skilled in the art that the scope of the disclosure herein is not limited to the particular combination of features described above, but also encompasses other arrangements formed by any combination of the above features or their equivalents without departing from the spirit of the disclosure. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.
Claims (10)
1. A speaker module, comprising: a shell, a loudspeaker body, a heat absorbing piece and a heat conducting piece, wherein the loudspeaker body, the heat absorbing piece and the heat conducting piece are positioned in the shell, the shell is provided with a through hole, the loudspeaker body comprises a magnet piece,
the heat absorbing piece is in magnetic adsorption connection with the magnet piece;
one end of the heat conducting member is connected to the heat absorbing member, and the other end of the heat conducting member is disposed at the through hole.
2. A speaker module as claimed in claim 1, wherein the heat absorbing member covers at least the speaker body.
3. A speaker module according to claim 2, wherein the orthographic projection of the speaker body on the heat absorbing member is entirely on the heat absorbing member.
4. A speaker module as claimed in claim 2, wherein an end of the heat-conducting member is entirely located on the heat absorbing member in an orthographic projection of the heat absorbing member.
5. A loudspeaker module according to claim 1, wherein the heat absorbing member is a graphite sheet, a heat absorbing film or a vapor chamber.
6. The speaker module as recited in claim 1, wherein the other end of the thermal conductor is snap-fit into the through hole.
7. The speaker module as recited in claim 1, wherein the thermal conductor is a flexible circuit board.
8. An electronic device, characterized in that it comprises a loudspeaker module according to any one of claims 1 to 7.
9. The electronic device of claim 8, further comprising a back cover that presses against the speaker module, wherein the heat sink is disposed proximate to the back cover.
10. The electronic device of claim 8, further comprising a center frame to which the speaker module is mounted, the through hole facing the center frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120424948.5U CN214101759U (en) | 2021-02-26 | 2021-02-26 | Loudspeaker module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120424948.5U CN214101759U (en) | 2021-02-26 | 2021-02-26 | Loudspeaker module and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214101759U true CN214101759U (en) | 2021-08-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120424948.5U Active CN214101759U (en) | 2021-02-26 | 2021-02-26 | Loudspeaker module and electronic equipment |
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| Country | Link |
|---|---|
| CN (1) | CN214101759U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114390380A (en) * | 2021-12-29 | 2022-04-22 | 歌尔股份有限公司 | Speaker module and electronic equipment |
| CN115225746A (en) * | 2022-09-21 | 2022-10-21 | 荣耀终端有限公司 | Electronic device |
-
2021
- 2021-02-26 CN CN202120424948.5U patent/CN214101759U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114390380A (en) * | 2021-12-29 | 2022-04-22 | 歌尔股份有限公司 | Speaker module and electronic equipment |
| CN115225746A (en) * | 2022-09-21 | 2022-10-21 | 荣耀终端有限公司 | Electronic device |
| CN115225746B (en) * | 2022-09-21 | 2023-02-17 | 荣耀终端有限公司 | Electronic device |
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