WO2022208743A1 - Speaker device and electronic device - Google Patents

Speaker device and electronic device Download PDF

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Publication number
WO2022208743A1
WO2022208743A1 PCT/JP2021/013875 JP2021013875W WO2022208743A1 WO 2022208743 A1 WO2022208743 A1 WO 2022208743A1 JP 2021013875 W JP2021013875 W JP 2021013875W WO 2022208743 A1 WO2022208743 A1 WO 2022208743A1
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WO
WIPO (PCT)
Prior art keywords
speaker
case
speaker device
diaphragm
speaker unit
Prior art date
Application number
PCT/JP2021/013875
Other languages
French (fr)
Japanese (ja)
Inventor
裕希 吉田
Original Assignee
ソニーグループ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ソニーグループ株式会社 filed Critical ソニーグループ株式会社
Priority to PCT/JP2021/013875 priority Critical patent/WO2022208743A1/en
Priority to JP2023510035A priority patent/JPWO2022208743A1/ja
Priority to CN202180096161.3A priority patent/CN117044236A/en
Publication of WO2022208743A1 publication Critical patent/WO2022208743A1/en

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Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/02Casings; Cabinets ; Supports therefor; Mountings therein
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00Transducers of moving-coil, moving-strip, or moving-wire type

Definitions

  • the present technology relates to a speaker device and an electronic device equipped with the speaker device.
  • Patent Literature 1 describes a foldable communication terminal equipped with a speaker.
  • this communication terminal two terminal members are connected via a hinge.
  • One of these terminal members is provided with a speaker.
  • a cavity is formed inside the hinge.
  • a speaker is positioned to acoustically couple with the cavity within the hinge. As a result, the speaker resonates with the hollow portion, and the sound quality of the speaker can be improved (paragraphs [0031] [0032] [0034] FIG. 1 of Patent Document 1, etc.).
  • the heat of the speaker affects the sound quality.
  • the cavity that resonates with the speaker is arranged on the side of the speaker. In this case, the planar size of the entire speaker including the cavity is enlarged, which may cause interference with other elements.
  • the purpose of the present technology is to provide a speaker device and an electronic device capable of improving sound quality without increasing the planar size.
  • a speaker device includes a speaker unit, a case portion, and a heat dissipation portion.
  • the speaker unit has a diaphragm.
  • the case part forms a cavity on the opposite side of the speaker unit to the diaphragm, and accommodates the speaker unit so that the diaphragm is exposed.
  • the heat dissipation portion is provided in the cavity and conducts heat of the speaker unit to the case portion side.
  • the speaker unit is housed in the case with the diaphragm exposed. Further, the case part forms a cavity on the side opposite to the diaphragm of the speaker unit. This cavity is provided with a heat radiating portion that transfers heat from the speaker unit to the case portion side. As a result, heat can be dissipated from the speaker unit using the cavity on the side opposite to the diaphragm, and sound quality can be improved without increasing the planar size.
  • the speaker unit includes a voice coil that vibrates integrally with the diaphragm; a magnet that generates a magnetic field that acts on the voice coil; and a yoke that is In this case, the heat radiation portion may thermally connect the yoke and the case portion.
  • the heat radiating part may have at least one spring configured using a heat conducting member.
  • the at least one spring may be a leaf spring.
  • the at least one spring may include a plurality of springs arranged to evenly press the speaker unit against the case.
  • the case portion may further have a radiator plate provided at a position facing the speaker unit with the cavity interposed therebetween.
  • the heat dissipation part may be connected to the heat dissipation plate.
  • the case portion may have a rear opening formed at a position facing the speaker unit with the cavity interposed therebetween.
  • the radiator plate may be arranged so as to cover the rear opening of the case portion.
  • the speaker device may be mounted on an electronic device.
  • the heat sink may have a connecting portion connected to the main body of the electronic device.
  • the connecting portion may be provided outside the case portion.
  • the case part may form another cavity that communicates with the cavity and spreads to the side of the speaker unit.
  • the case portion may have a front case that holds the speaker unit so that the diaphragm is exposed, and a rear case that is connected to the front case and forms the cavity.
  • the front case may have a front opening through which the diaphragm is exposed, and a sealing member provided inside the front case so as to surround the front opening.
  • the heat radiating section may be fixed to the rear case and press the speaker unit against the sealing member.
  • the sealing member may be a waterproof seal.
  • An electronic device includes an output unit and a speaker device.
  • the output unit outputs an audio signal.
  • the speaker device includes a speaker unit that has a diaphragm, and that vibrates the diaphragm according to the audio signal.
  • a cavity is formed on the opposite side of the speaker unit from the diaphragm, and the diaphragm is exposed. and a heat radiating portion provided in the cavity for conducting heat of the speaker unit to the case portion side.
  • the electronic device may further include a display for displaying images.
  • the speaker device may be arranged such that at least a portion of the diaphragm overlaps the display when viewed from a direction perpendicular to the display.
  • FIG. 1 is a schematic diagram showing an appearance of a terminal device equipped with a speaker device according to an embodiment of the present technology
  • FIG. 1 is a schematic diagram for explaining an outline of a speaker device
  • FIG. 2 is a plan view showing a specific configuration example of a speaker device
  • FIG. 4 is an exploded perspective view of the speaker device shown in FIG. 3
  • FIG. 4 is a cross-sectional view of the speaker device shown in FIG. 3
  • FIG. It is a schematic diagram which shows the cross-sectional structural example of the terminal device which mounts the speaker apparatus.
  • FIG. 3 is a schematic diagram showing a speaker device given as a comparative example
  • FIG. 1 is a schematic diagram showing the appearance of a terminal device equipped with a speaker device according to an embodiment of the present technology.
  • a terminal device 100 shown in FIG. 1 is, for example, an electronic terminal that can be carried by a user.
  • the terminal device 100 include portable terminals such as smartphone terminals, tablet terminals, music playback devices, and electronic dictionaries.
  • the terminal device 100 may be configured as a stationary device such as a PC (Personal Computer) or a smart speaker.
  • the terminal device 100 is an example of an electronic device.
  • the terminal device 100 has a display 10 and a speaker device 30 .
  • the terminal device 100 also includes a communication device, a storage device, a controller, a battery, a camera sensor, and the like (not shown).
  • the display 10 is a display device that displays images, and is provided on the front surface of the terminal device 100 .
  • the display 10 displays an image (operation screen, video content, etc.) represented by, for example, an image signal output from the controller.
  • the speaker device 30 is a device that reproduces sound and is mounted inside the main body of the terminal device 100 . In FIG. 1, the speaker device 30 arranged in the terminal device 100 is schematically illustrated using a dotted line.
  • the speaker device 30 converts, for example, an audio signal output from the controller into audio and outputs the audio. This makes it possible to reproduce various audio contents.
  • the controller corresponds to an output unit that outputs an audio signal.
  • FIG. 2 is a schematic diagram for explaining the outline of the speaker device 30.
  • the speaker device 30 has a speaker unit 31 , a speaker case 32 and a heat radiator 33 .
  • the speaker device 30 is a box-shaped device in which a speaker unit 31 and a radiator 33 are housed inside a speaker case 32, forming a speaker box.
  • a closed speaker configured mainly using a closed speaker case 32 will be described.
  • the speaker device 30 may be configured as a speaker having an opening provided in the speaker case 32 .
  • the speaker device 30 is configured such that the diaphragm 34 provided in the speaker unit 31 is exposed from the speaker case 32 .
  • the side of the speaker case 32 where the diaphragm 34 is exposed (the upper side in the drawing) is referred to as the front side of the speaker device 30, and the side opposite to the side of the speaker case 32 where the diaphragm 34 is exposed (the upper side in the drawing). lower side) is referred to as the rear side of the speaker device 30 .
  • FIG. 2 schematically shows a cross-sectional view of the speaker device 30 cut along the front-rear direction.
  • the speaker unit 31 is a unit that converts an electric signal (audio signal) into a sound wave (audio), and has the above-described diaphragm 34 and a unit main body 35 .
  • the diaphragm 34 is a plate-shaped member that vibrates with respect to the unit main body 35 .
  • the vibrating diaphragm 34 causes the air to vibrate and generate sound waves.
  • a plate-like member is used as the diaphragm 34 .
  • the unit main body 35 is a structure configured as a driving mechanism that supports the diaphragm 34 and vibrates the diaphragm 34 .
  • the unit main body 35 is provided with a voice coil connected to the diaphragm 34, a magnetic circuit (magnet and yoke) that forms a magnetic field acting on the voice coil, and the like (see FIG. 5).
  • a voice coil provided in the unit main body 35 is driven according to the audio signal, and the diaphragm 34 vibrates together with the voice coil.
  • the speaker unit 31 vibrates the diaphragm 34 according to the audio signal. This makes it possible to output the contents of the audio signal as audio.
  • the unit body 35 is configured to have a thin structure as a whole.
  • the diaphragm 34 is arranged along one surface perpendicular to the thickness direction of the unit main body 35 .
  • the side on which the diaphragm 34 is arranged is the front side, and the opposite side is the rear side.
  • the planar shape of the diaphragm 34 is set so as to fit inside the planar shape of the unit body 35 .
  • a connection area 36 connected to the speaker case 32 is formed in an area surrounding the diaphragm 34 on the front side of the unit main body 35 .
  • the speaker case 32 is a housing for the speaker device 30 and functions as an enclosure that accommodates the speaker case 32 .
  • the speaker case 32 accommodates the speaker unit 31 so that the diaphragm 34 is exposed.
  • a front opening 37 is provided on the front side of the speaker case 32 .
  • the shape and size of the front opening 37 are set so that the diaphragm 34 and the speaker case 32 do not come into contact with each other and the unit main body 35 does not pass through.
  • the speaker unit 31 is fixed to the inner wall of the speaker case 32 so that the diaphragm 34 does not come into contact with the speaker case 32 and is exposed from the front opening 37 .
  • the connection area 36 formed on the front side of the unit body 35 is connected to the area inside the speaker case 32 surrounding the front opening 37 .
  • the speaker case 32 forms a cavity 1 on the opposite side of the speaker unit 31 from the diaphragm 34 . That is, the speaker case 32 accommodates the speaker unit 31 so that the cavity 1 is formed behind the speaker unit 31 .
  • the cavity is a space (volumetric space) having a certain volume formed by being covered with the speaker case 32 .
  • the speaker case 32 is configured, for example, so that the inner wall of the speaker case 32 does not come into contact with the rear side of the speaker unit 31 . Thereby, a cavity 1 is formed between the rear side of the speaker unit 31 and the inner wall of the speaker case 32 .
  • the cavity 1 formed on the rear side of the speaker unit 31 is hereinafter referred to as a rear cavity 1a.
  • the speaker case 32 corresponds to a case portion.
  • the heat radiating section 33 is a member provided in the rear cavity 1a that transfers the heat of the speaker unit 31 to the speaker case 32 side.
  • the heat dissipation part 33 is arranged in the rear cavity 1a, is thermally connected to the speaker unit 31, for example, and releases the heat to the speaker case 32 side.
  • the heat may be transferred directly to the speaker case 32 or may be transferred to a heat radiating member or the like arranged outside the speaker case 32 .
  • the heat radiating section 33 is configured using a heat conductive member such as metal that easily conducts heat.
  • a heat conductive member such as metal that easily conducts heat.
  • at least one spring 38 configured using a heat-conducting member is provided as the heat radiating portion 33 .
  • the spring 38 is arranged, for example, between the speaker unit 31 and the speaker case 32 in a contracted state so as to exert a repulsive force. As a result, the heat radiating portion 33 (spring 38) is pressed against both the speaker unit 31 and the speaker case 32, making it possible to achieve good thermal contact.
  • the sound output from the speaker unit 31 can be sufficiently resonated by providing the rear cavity 1a.
  • the rear cavity 1a is the cavity 1 provided in the thickness direction of the speaker device 30. As shown in FIG. Therefore, even if the rear cavity 1a is provided, the planar size of the speaker device 30 does not increase.
  • the heat dissipation portion 33 in the rear cavity 1a it is possible to efficiently dissipate the heat of the speaker unit 31 to the speaker case 32 side, and the heat dissipation capability of the speaker device 30 is improved. As a result, for example, it is possible to increase the power that can be input to the speaker unit 31, and it is possible to improve the reproducible sound pressure level.
  • a more specific configuration example of the speaker device 30 will be described below.
  • FIG. 3 is a plan view showing a specific configuration example of the speaker device 30.
  • FIG. 3A is a plan view of the speaker device 30 viewed from the rear side.
  • FIG. 3B is a plan view of the speaker device 30 attached to the terminal device 100 as seen from the rear side.
  • the back side of the drawing is the front side of the speaker device 30 where the diaphragm 34 is exposed.
  • the front-rear direction of the speaker device 30 is referred to as the Z direction.
  • the directions perpendicular to each other on a plane perpendicular to the Z direction are described as the X direction and the Y direction.
  • the X direction corresponds to the lateral direction of the speaker device 30 .
  • the Y direction corresponds to the vertical direction of the speaker device 30 .
  • the left-right direction and the up-down direction of the speaker device 30 correspond to the left-right direction and the up-down direction of the terminal device 100 when mounted on the terminal device 100 .
  • the upper side in the figure is the upper side of the speaker device 30 (terminal device 100).
  • the right and left sides of the speaker device 30 viewed from the front side (the side where the diaphragm 34 is provided) are referred to as the right and left sides of the speaker device 30 (the terminal device 100).
  • the upper side, lower side, left side, right side, front side, rear side, and the like regarding the speaker device 30 do not limit the posture, arrangement, and the like in which the speaker device 30 is used.
  • the speaker device 30 has the speaker unit 31, the speaker case 32, and the radiator 33, as described above.
  • the speaker case 32 has a front case 40 provided on the front side of the speaker device 30 and a rear case 41 provided on the rear side.
  • FIG. 3A mainly shows the rear case 41 of the speaker case 32 .
  • the speaker case 32 is provided with a first area 5a, a second area 5b, and a third area 5c in order from the top. These areas are areas in which a space surrounded by both the rear case 41 and the front case 40 is formed.
  • the first area 5a is a substantially square area in plan view, and is an area in which the speaker unit 31, the rear cavity 1a, the heat radiating section 33, and the like are provided.
  • the second area 5b is an area obtained by expanding the first area 5a downward with the same horizontal width as the first area 5a.
  • the third area 5c is narrower in the lateral direction than the second area 5a, is an area extending downward from the second area 5b, and is arranged on the right side of the figure (left side of the speaker device 30). be.
  • the second area 5b and the third area 5c are areas in which side cavities 1b, which will be described later, are provided (see FIG. 5).
  • the speaker case 32 has a radiator plate 43 .
  • the radiator plate 43 is configured as part of the rear case 41 .
  • the radiator plate 43 fitted in the rear case 41 can be seen in the first area 5a.
  • the heat sink 43 has a heat radiation terminal 44 .
  • the heat dissipation terminal 44 is a terminal connected to the heat dissipation plate 43 .
  • a heat dissipation terminal 44 is formed to protrude to the left side (right side in the figure) of the speaker device 30 .
  • the configuration of the heat sink 43 will be described later in detail.
  • a fixed terminal 45 and an input terminal 46 are provided on the front case 40 .
  • the fixed terminal 45 is a terminal for fixing the speaker device 30, for example.
  • a fixed terminal 45 is formed to protrude to the right side (left side in the drawing) of the speaker device 30 .
  • the input terminal 46 is a terminal for inputting an audio signal to be input to the speaker unit 31 .
  • an input terminal 46 is arranged on the lower side of the third area 5c toward the right side of the drawing.
  • FIG. 4 is an exploded perspective view of the speaker device 30 shown in FIG. 3.
  • FIG. FIG. 4 shows the front case 40, the speaker unit 31, the radiator 33, and the rear case 41 in order from the bottom.
  • the front case 40 is provided with a front opening 37 for exposing the diaphragm 34 of the speaker unit 31 .
  • a substantially square hole is formed as the front opening 37 .
  • the speaker unit 31 is a substantially square thin structure in plan view, and is connected to the inner wall of the front case 40 so that the diaphragm 34 is exposed.
  • the rear surface of the speaker unit 31 (a yoke 57 to be described later) is visible.
  • a heat sink 33 having four springs is connected to this surface.
  • FIG. 4 shows the heat radiation part 33 alone, the heat radiation part 33 is actually fixed in advance to the rear case 41 (heat radiation plate 43) (see FIG. 5).
  • the rear case 41 is connected to the front case 40 by pressing the heat radiation part 33 against the rear side of the speaker unit 31 .
  • the front case 40 and the rear case 41 are configured to fit together.
  • the front case 40 and the rear case 41 may be connected using screws, an adhesive, or the like.
  • FIG. 5 is a cross-sectional view of speaker device 30 shown in FIG.
  • FIG. 5 shows a cross-sectional view of the speaker device 30 taken along line AA' shown in FIG.
  • the right side of the drawing corresponds to the upper side of the speaker device 30 .
  • the upper side in the drawing is the front side of the speaker device 30, and the lower side in the drawing is the rear side of the speaker device 30. As shown in FIG.
  • the speaker unit 31 has a diaphragm 34 , an edge film 47 , a support portion 48 , a coupling portion 49 , a voice coil 50 and a magnetic circuit 51 .
  • the diaphragm 34 is a plate-shaped member.
  • the plane shape of the diaphragm 34 any shape such as a circle, a square, or a rectangle can be used. When the rectangular diaphragm 34 is used, stress concentration can be avoided by rounding the corners.
  • the material of the diaphragm 34 for example, a resin material, a metal material, a ceramic material, or a composite member obtained by combining these materials can be used.
  • the shape and material of the diaphragm 34 are not limited, and the diaphragm 34 may be appropriately configured according to the application of the speaker device 30 and the like.
  • the edge film 47 is a film arranged between the diaphragm 34 and the support portion 48 so as to surround the outer circumference of the diaphragm 34 .
  • the edge film 47 has, for example, a semicircular cross-sectional shape, and connects the diaphragm 34 to the supporting portion 48 so as to vibrate.
  • a resin film or the like is typically used as the edge film 47 .
  • the support portion 48 is an annular member that supports the diaphragm 34 via the edge film 47 .
  • the shape of the opening formed inside the support portion 48 is, for example, substantially the same as the planar shape of the front opening portion 37 , and the shape of the outer circumference of the support portion 48 is the planar shape of the speaker unit 31 .
  • a front surface of the support portion 48 serves as a connection area 36 that is connected to the inner wall of the speaker case 32 (front case 40).
  • the coupling portion 49 is a member that couples the magnetic circuit 51 and the support portion 48 .
  • the coupling portion 49 is, for example, annular, and couples the rear surface of the support portion 48 to a second upper plate 56b and a second magnet 55b of the magnetic circuit 51, which will be described later.
  • the voice coil 50 is a coil that vibrates integrally with the diaphragm 34 and causes the diaphragm 34 to vibrate according to an audio signal.
  • Voice coil 50 may have a bobbin or may be configured as a bobbinless coil.
  • the voice coil 50 is connected to the rear side of the diaphragm 34 and arranged to fit in an annular gap 52 formed between the first magnet 55 a and the second magnet 55 b of the magnetic circuit 51 .
  • the voice coil 50 is also provided with coil terminals (not shown). The coil terminals are connected to input electrodes of the speaker unit 31 .
  • a specific configuration of the voice coil 50 is not limited.
  • the magnetic circuit 51 has a first magnet 55 a , a second magnet 55 b , a first upper plate 56 a , a second upper plate 56 b and a yoke 57 .
  • the first magnet 55a and the second magnet 55b are magnets that generate a magnetic field acting on the voice coil.
  • the first magnet 55 a is a plate-shaped permanent magnet arranged inside the voice coil 50 .
  • the second magnet 55b is an annular permanent magnet arranged to surround the first magnet 55a.
  • a plurality of permanent magnets arranged in a ring may be used as the second magnet 55b.
  • the first magnet 55a and the second magnet 55b are arranged with an annular gap 52 therebetween. A magnetic field generated in this gap 52 acts on the voice coil 50 .
  • the first upper plate 56a is a plate-shaped plate arranged in front of the first magnet 55a
  • the second upper plate 56b is an annular plate arranged in front of the second magnet 55b.
  • the coupling portion 49 described above is connected to the second upper plate 56b.
  • the yoke 57 is a plate-shaped member provided on the side opposite to the diaphragm 34 with the first magnet 55a and the second magnet 55b interposed therebetween, and to which the first magnet 55a and the second magnet 55b are connected.
  • the yoke 57 is made of a metal material and magnetically couples the first magnet 55 a and the second magnet 55 b to form the magnetic circuit 51 .
  • the rear surface of the yoke 57 is the surface of the speaker unit 31 opposite to the diaphragm 34 .
  • the rear surface of the yoke 57 may be referred to as the rear surface 58 of the speaker unit 31 .
  • Speaker case 32 has a front case 40 and a rear case 41 .
  • the front case 40 is a member (speaker case front) forming the front side of the speaker case 32 and holds the speaker unit 31 so that the diaphragm 34 is exposed. As shown in FIGS. 4 and 5, the front case 40 is a substantially flat plate member configured to cover the first area 5a, the second area 5b, and the third area 5c. An outer peripheral portion of the front case 40 protrudes rearward to form a side wall.
  • the front case 40 is configured using, for example, a resin material.
  • the front case 40 has a front opening 37 , a seal member 60 and a fitting groove 61 .
  • the front opening 37 is a hole through which the diaphragm 34 is exposed.
  • a substantially square front opening is formed in the first area 5a (see FIG. 4).
  • the planar size of the front opening 37 is set so that the diaphragm 34 and the edge film 47 surrounding the diaphragm 34 are exposed in plan view.
  • the shape and size of the front opening 37 may be appropriately set according to the configurations of the speaker unit 31 and the diaphragm 34, for example.
  • the seal member 60 is a seal that connects the front case 40 and the speaker unit 31 .
  • the seal member 60 is provided inside the front case 40 so as to surround the front opening 37 .
  • the seal member 60 is typically an adhesive seal having adhesive surfaces on both sides.
  • the speaker unit 31 is arranged such that the front surface (connection region 36 ) of the support portion 48 is adhered to the sealing member 60 . Thereby, the speaker unit 31 is adhesively fixed to the front case 40 .
  • a waterproof seal is used as the seal member 60 .
  • a waterproof seal By using a waterproof seal, it is possible to avoid intrusion of water from the front opening 37 .
  • a waterproof adhesive seal made of a rubber material or a resin material is appropriately used. Note that the seal member 60 does not necessarily have to be configured as a waterproof seal, and the present technology can be applied even when a waterproof inner adhesive tape or the like is used.
  • the mating groove 61 is a groove into which the mating end 64 of the rear case 41 is fitted.
  • the fitting groove 61 is formed in the end surface of the side wall of the front case 40 protruding rearward.
  • the rear case 41 is a member (speaker case rear) forming the rear side of the speaker case 32, and is connected to the front case 40 to form the rear cavity 1a.
  • the rear case 41 is configured such that a certain volumetric space is formed behind the speaker unit 31 . This volume space becomes the rear cavity 1a. Since the rear cavity 1a is a space arranged on the rear side of the speaker unit 31, the planar size of the speaker device 30 does not increase even if the rear cavity 1a is provided. Further, by providing the rear cavity 1a, the sound of the speaker unit 31 is resonated, and the sound quality can be improved. As a result, it is possible to realize the speaker device 30 having a very compact planar size and high sound quality.
  • the rear case 41 is configured to cover the first area 5a, the second area 5b, and the third area 5c.
  • a rear cavity 1a is formed in the first area 5a.
  • Another cavity extending to the lower side of the speaker unit 31 (left side in the figure) is formed in the second area 5b.
  • the third area 5c is provided with a lid-like member that closes the cavity formed on the front case 40 side.
  • An outer peripheral portion of the rear case 41 forms a side wall together with the front case 40 .
  • the rear case 41 has a resin housing 62 , a rear opening 63 , a mating end 64 and a heat sink 43 .
  • the resin housing 62 and the heat sink 43 are typically integrally molded by insert molding or the like.
  • the resin housing 62 is a member forming a portion of the rear case 41 other than the heat sink 43, and is made of a resin material.
  • the resin housing 62 is provided with a rear opening 63 and a mating end 64 .
  • the rear opening 63 is formed at a position facing the speaker unit 31 across the rear cavity 1a. In the examples shown in FIGS. 3 to 5, a rear opening 63 having approximately the same size as the speaker unit 31 is formed in the central portion of the first area 5a.
  • a region surrounding the rear opening 63 of the resin housing 42 (rear case 41) is a region that is joined to the radiator plate 43 by insert molding.
  • the radiator plate 43 is a plate-like radiator member that releases heat transmitted through the radiator 33 .
  • the radiator plate 43 is provided at a position facing the speaker unit 31 across the rear cavity 1a. It should be noted that a configuration is also possible in which the heat sink 43 is attached after the resin housing 62 is molded.
  • the radiator plate 43 is arranged so as to cover the rear opening 63 of the speaker case 32 (the resin housing 62 of the rear case 41). That is, the radiator plate 43 functions as a lid that closes the rear opening 63 . Therefore, the rear cavity 1a becomes a voluminous space formed between the radiator plate 43 and the speaker unit 31. As shown in FIG. Thus, the radiator plate 43 is configured as part of the speaker case 32 (rear case 41).
  • the radiator plate 43 has a substantially flat plate shape and has a mounting portion 66 and a coupling end 67 .
  • the mounting portion 66 is a projection provided for mounting the heat radiating portion 33 .
  • the mounting portion 66 is configured by deforming the heat sink 43 so as to protrude forward (inward) from the heat sink 43 .
  • Two protrusions are formed as the mounting portions 66 on the heat sink 43 .
  • the mounting portion 66 when viewed from the rear side (outside) of the heat sink 43, the mounting portion 66 has a concave shape.
  • the joint end 67 is formed by bending the outer peripheral end of the heat sink 43 forward.
  • the coupling end 67 is coupled to the area surrounding the rear opening 63 of the resin housing 62 . This makes it possible to improve the engagement between the resin housing 62 and the heat sink 43 .
  • the heat sink 43 has heat sink terminals 44 .
  • the heat dissipation terminal 44 is a terminal connected to the main body of the terminal device 100 on which the speaker device 30 is mounted. As shown in FIG. 3A, the heat dissipation terminal 44 is formed with holes for screwing.
  • the heat dissipation terminal 44 is integrally formed with the heat dissipation plate 43 , for example, so as to pass through the inside of the rear case 41 , penetrate the side wall, and protrude from the side surface of the rear case 41 .
  • the heat dissipation terminal 44 is provided outside the rear case 41 (speaker case 32).
  • the heat dissipation terminal 44 corresponds to a connecting portion connected to the main body of the electronic device.
  • FIG. 3B shows how the heat dissipation terminal 44 is connected to the main body of the terminal device 100 .
  • the heat dissipation terminal 44 may be provided inside the speaker case 32 or on the outer wall thereof.
  • a through hole for screwing may be formed in a portion covering the rear opening 63 of the heat dissipation plate 43 .
  • heat radiation terminals 44 and the like may be formed along the side wall of speaker case 32 .
  • the speaker case 32 is formed with another cavity 1 that communicates with the rear cavity 1a.
  • the side wall of the rear case 41 protrudes into the second area 5b below the first area 5a (on the left side in the figure) where the rear cavity 1a is formed, thereby forming the cavity 1.
  • a cavity 1 is formed by a groove-shaped area formed inside the front case 40.
  • these cavities 1 are lateral cavities 1b extending from the rear cavities 1a not in the front-back direction (thickness direction) but in the plane direction perpendicular to the front-back direction (sides of the speaker unit 31). becomes.
  • the speaker case 32 forms a side cavity 1b that communicates with the rear cavity 1a and spreads to the side of the speaker unit 31.
  • the side cavity 1b By providing the side cavity 1b, it is possible to increase the volume of the cavity portion of the speaker device 30 configured as a speaker box. As a result, it is possible to sufficiently improve the reproduction capability of bass and the like.
  • the size and arrangement of the side cavity 1b are not limited. In this embodiment.
  • the side cavity 1b corresponds to another cavity.
  • the radiator 33 thermally connects the yoke 57 of the speaker unit 31 and the speaker case 32 .
  • the heat dissipation part 33 is connected to a heat dissipation plate 43 provided on the rear case 41 .
  • the heat dissipation portion 33 is configured to contact the rear surface 58 of the yoke 57 and the front (inner) surface of the heat dissipation plate 43 .
  • the heat transmitted through the heat radiating portion 33 is transmitted to the heat radiating plate 43, and the heat of the speaker unit 31 can be efficiently released.
  • the heat radiating portion 33 has a plurality of leaf spring portions 70 and a base portion 71 .
  • the leaf spring portion 70 is a leaf spring formed by bending a plate-shaped heat-conducting member.
  • the base portion 71 is a member that supports the plurality of leaf spring portions 70 .
  • the plate spring portion 70 and the base portion 71 are typically integrally formed by bending one member.
  • a high thermal conductivity member having spring properties such as phosphor bronze or Corson alloy is used.
  • the heat radiating portion 33 may be made of a stainless-based or iron-based alloy or the like.
  • the leaf spring portion 70 is constructed by bending a long plate extending in one direction from the base portion 71 in the opposite direction at a bending portion 72 provided near the middle thereof. Also, the root portion connecting the long plate to the base portion 71 is bent in the same direction as the bent portion 72 at an angle smaller than that of the bent portion 72 . As a result, the long plate becomes a plate spring that is bent at two points, the root portion and the bent portion 72 . A curved portion 73 that contacts the back surface 58 of the yoke 57 is formed at the tip of the leaf spring portion 70 .
  • the natural length of the leaf spring portion 70 (the distance from the base portion 71 to the curved portion 73 as viewed from the base portion 71) is the size of the rear cavity 1a in the front-rear direction, that is, from the rear surface 58 of the yoke 57 to the front (inner) surface of the heat sink 43. is set longer than the distance of
  • the base portion 71 is a longitudinal member extending in one direction, to which a plurality of plate spring portions 70 are connected respectively.
  • four plate spring portions 70 are connected to the base portion 71 in line symmetry with respect to the longitudinal direction.
  • two pairs of leaf spring portions 70 are arranged along the longitudinal direction of the base portion 71 .
  • the pair of leaf spring portions 70 is formed by bending a pair of long plates extending in mutually opposite directions perpendicular to the longitudinal direction of the base portion 71 .
  • the base of each plate spring portion 70 is bent so that each curved portion 73 is arranged at a constant interval.
  • the base portion 71 also has a mounting hole 74 into which the mounting portion 66 of the heat sink 43 is inserted.
  • two mounting holes 74 are formed in accordance with the positions where the pairs of leaf spring portions 70 are connected.
  • Mounting portions 66 are provided on the radiator plate 43 so as to be insertable into these mounting holes 74 .
  • the heat radiating portion 33 is fixed to the heat radiating plate 43 by inserting the mounting hole 74 into the mounting portion 66 of the heat radiating plate 43 .
  • a method for fixing the heat radiating portion 33 for example, welding, crimping, or the like is used.
  • the heat dissipation portion 33 and the heat dissipation plate 43 can be brought into good thermal contact with each other, and the heat dissipation efficiency can be sufficiently improved.
  • screwing or the like may be used as a method for fixing the heat radiating portion 33 .
  • the heat radiating portion 33 fixed to the heat radiating plate 43 contacts the rear surface 58 of the yoke 57, and the leaf spring portion 70 is contracted to the size of the rear cavity 1a. Therefore, the restoring force of the plate spring portion 70 acts on the rear surface 58 of the yoke 57 in the direction of pushing it forward. As a result, the speaker unit 31 is pressed against the seal member 60 provided on the inner wall of the front case 40 . In this manner, the heat dissipation portion 33 is fixed to the rear case 41 (heat dissipation plate 43 ) and presses the speaker unit 31 against the sealing member 60 .
  • the heat radiation portion 33 is provided with a plurality of leaf spring portions 70 arranged line-symmetrically.
  • the position of the mounting portion 66 of the heat sink 43 is such that, for example, the midpoint between the two mounting holes 74 of the heat sink 33 (that is, the center point of the four leaf spring portions 70) is the central axis of the voice coil of the speaker unit 31. is set to match This makes it possible to evenly press the speaker unit 31 against the front case 40 (sealing member 60).
  • the plurality of plate spring portions 70 are arranged so as to evenly press the speaker unit 31 against the speaker case 32 (front case 40).
  • the flow of heat generated in the speaker unit 31 will be described with reference to FIGS. 5 and 3B.
  • 5 and 3B schematically illustrate heat flow using black arrows.
  • the voice coil 50 is the main heat source.
  • the heat generated by the voice coil 50 propagates through the gap 52 to the first magnet 55a and the second magnet 55b. Heat from each magnet propagates to the yoke 57 .
  • a leaf spring portion 70 of the heat dissipation portion 33 is connected to the back surface of the yoke 57 .
  • the heat of the yoke 57 propagates from the tip (curved portion 73 ) of the leaf spring portion 70 to the leaf spring portion 70 and then to the base portion 71 .
  • the base portion 71 is connected to the heat sink 43 , and the heat of the base portion 71 propagates to the heat sink 43 .
  • the back surface 58 side of the yoke 57 is hollow (rear cavity 1), by providing the heat dissipation portion 33, the heat of the speaker unit 31 is absorbed from the back surface 58 side of the yoke 57. It is possible.
  • the heat propagated to the heat sink 43 propagates from the heat dissipation terminal 44 to the main body of the terminal device 100 as shown in FIG. 3B.
  • the heat of the speaker unit 31 can be released to the housing of the terminal device 100 having a relatively large heat capacity.
  • the substantial heat capacity and heat dissipation area of the speaker unit 31 are greatly increased.
  • the cooling efficiency of the speaker unit 31 is sufficiently improved, and it becomes possible to cope with large-current audio signals.
  • the sound pressure level and dynamic range can be increased, and the sound quality of the speaker device 30 can be sufficiently improved.
  • FIG. 6 is a schematic diagram showing a cross-sectional configuration example of the terminal device 100 in which the speaker device 30 is mounted.
  • the speaker device 30 is mounted on the terminal device 100 so that the vertical direction and the horizontal direction of the speaker device 30 correspond to the vertical direction and the horizontal direction of the terminal device 100 .
  • FIG. 6 schematically shows a cross-sectional view of the terminal device 100 cut along the XZ plane.
  • the right side in the drawing is the upper side of the terminal device 100 (speaker device 30).
  • the upper side in the figure is the front side of the terminal device 100 (speaker device 30).
  • the terminal device 100 has a display 10 , a main housing 11 , a front glass 12 and a rear cover 13 .
  • the main housing 11 is a frame member of the terminal device 100 that supports the speaker device 30 and the display 10 .
  • the main body housing 11 includes a plate-shaped inner frame 14 extending along the vertical direction of the terminal device 100 and an upper end frame 15 provided on the upper side of the terminal device 100 and connected to the inner frame 14 . is schematically illustrated.
  • the inner frame 14 is provided with a frame opening 16 having substantially the same shape as the front opening 37 of the speaker device 30 .
  • the speaker device 30 is connected to the rear side of the inner frame 14 via the seal member 17 so that the frame opening 16 and the front opening 37 overlap in plan view.
  • the seal member 17 is an annular adhesive seal configured to cover the entire circumference of the frame opening 16 .
  • a waterproof seal for example, is used as the seal member 17 .
  • the display 10 is arranged on the front surface of the inner frame 14 .
  • a front glass 12 is arranged on the front surface of the display 10 .
  • the front glass 12 functions as a touch surface on which a user performs touch operations and the like.
  • the rear cover 13 is a plate-like member arranged to cover the rear side of the terminal device 100 .
  • the rear cover 13 may be in contact with, for example, the rear surface of the speaker device 30 (radiator plate 43).
  • another element or member may be provided between the rear cover 13 and the speaker device 30 .
  • the back cover 13 for example, a cover (back glass) made of a glass member is used.
  • the back cover 13 may be configured using a resin member or a metal member.
  • the display 10 is configured such that the upper (right side in the drawing) edge of the display 10 does not reach the inner frame 14 on the upper end frame 15 side.
  • An opening window 20 is formed between the upper end (right side in the drawing) of the front glass 12 and the upper end frame 15 .
  • a space communicating with the frame opening 16 is formed from the upper edge of the display 10 to the opening window 20 .
  • the sound 3 (white arrow in the figure) output from the speaker device 30 passes through the front opening 37 of the speaker device 30 and the frame opening 16 of the internal frame 14 to the display 10. is output from the opening window 20 through the space formed above. This makes it possible to output the sound of the speaker device 30 to the outside of the terminal device 100 .
  • the area where the opening window 20 and the like are provided may be configured using a cutout (notch) or the like formed on the upper side of the display 10, for example.
  • the speaker device 30 is arranged so that at least a portion of the diaphragm 34 overlaps the display 10 when viewed from the direction (Z direction) perpendicular to the display 10 . Accordingly, since the speaker device 30 is arranged on the back side of the display 10, it is possible to easily realize the terminal device 100 or the like with a thin bezel.
  • the thickness of the speaker device 30 is larger than the thickness of the speaker unit 31 alone.
  • the heat radiating portion 33 such as a plate spring provided in the rear cavity 1a has a sufficiently small volume and does not occupy the rear cavity 1a. Therefore, even if the thickness of the rear cavity 1a is set thin, it is possible to secure a sufficient volumetric space. In this way, by using the present technology, it is possible to provide the speaker device 30 that has a thickness that allows it to be arranged on the back surface of the display 10, has a sufficiently compact planar size, and has good sound quality.
  • the speaker unit 31 is accommodated in the speaker case 32 with the diaphragm 34 exposed. Further, the speaker case 32 forms a rear cavity 1a on the side opposite to the diaphragm 34 of the speaker unit 31 .
  • a radiator 33 for transmitting heat from the speaker unit 31 to the speaker case 32 is provided in the rear cavity 1a.
  • FIG. 7 is a schematic diagram showing a speaker device given as a comparative example.
  • FIG. 7A is a plan view of the speaker device 150 viewed from the rear side.
  • 7B is a cross-sectional view of the speaker device 150 taken along line BB' shown in FIG. 7A.
  • the speaker case 152 is configured such that the rear side of the speaker unit 151 (back surface of the yoke) is exposed.
  • a graphite sheet 153 for heat dissipation is attached to the rear side of the speaker unit 151 .
  • the rear cavity 1a is formed on the side of the speaker unit 31 opposite to the diaphragm 34 . Further, the heat of the speaker unit 31 is transmitted to the speaker case 32 side by the heat radiation portion 33 provided in the rear cavity 1a. As a result, the heat dissipation capability is improved, so the input power that can be input to the voice coil 50 is improved. As a result, the sound pressure level, dynamic range, etc. of the speaker device 30 can be sufficiently improved.
  • the speaker device 30 does not need to expose the rear side of the speaker unit 31 (the back surface 58 of the yoke 57), it is possible to secure a volume in the thickness direction. As a result, it is possible to realize a device that has a high reproduction capability for low tones and the like and that has a compact planar size. In addition, it is possible to improve the degree of freedom in device layout.
  • a spring member such as a leaf spring is used as the heat radiating portion 33 .
  • the space occupied by the heat radiating portion 33 is very small, and it is possible to minimize the effect (volume effect) on the sound quality due to the reduction in the volume of the rear cavity 1a.
  • the vibration of the speaker unit 31 can be reduced and the sound quality can be improved.
  • pressure from the back improves the adhesion of the waterproof double-sided tape, making it possible to reduce waterproof defects and improve waterproof performance.
  • the yoke 57 is an independent metal within the closed container.
  • the metal heat dissipation portion 33 is connected to such a yoke 57 .
  • a thin speaker unit having a flat diaphragm has been described.
  • the shape of the diaphragm and the shape of the speaker unit are not limited.
  • a dome-shaped, cone-shaped, or horn-shaped diaphragm may be used.
  • the planar shape of the diaphragm may be set to any shape such as round, elliptical, or rectangular.
  • the speaker unit does not necessarily have to be thin, and for example, a speaker unit that matches the type of speaker may be used.
  • a leaf spring is mainly used as the heat radiation portion.
  • a coil spring or the like may be provided instead of the leaf spring.
  • the number of springs used as the heat radiation part is not limited, and for example, the heat radiation part may be configured using a single spring.
  • the configuration of the heat radiating section is not limited, and any thermally conductive member may be used.
  • a metal wire, a conductive sheet, or the like may be used to connect the speaker unit and the case via the rear cavity.
  • a conductive sponge or the like may be used as the heat radiating portion.
  • the heat sink is configured as part of the speaker case (rear case)
  • the heat sink may be provided as an independent member, for example.
  • a configuration is also possible in which the heat radiating section is connected to a heat radiating plate arranged outside the rear case through a hole opened in the rear case.
  • a speaker unit having a diaphragm; a case portion that forms a cavity on the opposite side of the speaker unit to the diaphragm and houses the speaker unit so that the diaphragm is exposed;
  • a speaker device comprising: a heat radiating section provided in the cavity for transferring heat of the speaker unit to the case section side.
  • the speaker unit includes a voice coil that vibrates integrally with the diaphragm; a magnet that generates a magnetic field that acts on the voice coil; and a yoke that is The speaker device, wherein the radiator thermally connects the yoke and the case.
  • the case further includes a radiator plate provided at a position facing the speaker unit with the cavity interposed therebetween; The speaker device, wherein the radiator is connected to the radiator plate.
  • the speaker device according to (6), The case portion has a rear opening formed at a position facing the speaker unit with the cavity interposed therebetween, The speaker device, wherein the radiator plate is arranged to cover the rear opening of the case.
  • the speaker device according to (6) or (7), The speaker device is mounted on an electronic device, The speaker device, wherein the radiator plate has a connecting portion connected to the main body of the electronic device.
  • the speaker device according to (8), The speaker device, wherein the connecting portion is provided outside the case portion.
  • the case part forms another cavity communicating with the cavity and extending laterally of the speaker unit.
  • the speaker device according to any one of (1) to (10), A speaker device, wherein the case portion includes a front case that holds the speaker unit so that the diaphragm is exposed, and a rear case that is connected to the front case and forms the cavity.
  • the speaker device according to (11), The front case has a front opening that exposes the diaphragm, and a seal member provided inside the front case so as to surround the front opening, The speaker device, wherein the heat radiating section is fixed to the rear case and presses the speaker unit against the seal member.
  • the speaker device is a waterproof seal.
  • an output unit that outputs an audio signal
  • a speaker unit that has a diaphragm and vibrates the diaphragm according to the audio signal
  • a case portion that forms a cavity on the opposite side of the speaker unit to the diaphragm and houses the speaker unit so that the diaphragm is exposed
  • a speaker device comprising: a heat radiating section provided in the cavity for conducting heat of the speaker unit to the case section
  • An electronic device comprising (15) The electronic device according to (14), further comprising: Equipped with a display for displaying an image,
  • the speaker device is an electronic device arranged so that at least part of the diaphragm overlaps with the display when viewed from a direction perpendicular to the display.

Abstract

A speaker device according to an embodiment of the present technology is provided with a speaker unit, a case part, and a heat-dissipating part. The speaker unit has a vibration plate. The case part forms a cavity on the opposite side of the speaker unit from the vibration plate, and houses the speaker unit such that the vibration plate is exposed. The heat-dissipating part is provided to the cavity and transfers heat from the speaker unit to the case part side.

Description

スピーカ装置及び電子機器speaker device and electronic equipment
 本技術は、スピーカ装置及びスピーカ装置を搭載した電子機器に関する。 The present technology relates to a speaker device and an electronic device equipped with the speaker device.
 従来、スピーカを搭載した様々な電子機器が開発されている。例えば特許文献1には、スピーカを搭載した折りたたみ可能な通信端末について記載されている。この通信端末では、ヒンジを介して2つの端末部材が接続される。このうち片方の端末部材には、スピーカが設けられる。またヒンジの内部には空洞部が形成される。スピーカは、ヒンジ内の空洞部と音響的に結合するように配置される。これにより、スピーカと空洞部とが共鳴し、スピーカの音質を向上することが可能となっている(特許文献1の明細書段落[0031][0032][0034]図1等)。  Conventionally, various electronic devices equipped with speakers have been developed. For example, Patent Literature 1 describes a foldable communication terminal equipped with a speaker. In this communication terminal, two terminal members are connected via a hinge. One of these terminal members is provided with a speaker. A cavity is formed inside the hinge. A speaker is positioned to acoustically couple with the cavity within the hinge. As a result, the speaker resonates with the hollow portion, and the sound quality of the speaker can be improved (paragraphs [0031] [0032] [0034] FIG. 1 of Patent Document 1, etc.).
特開2007-527131号公報Japanese Patent Application Laid-Open No. 2007-527131
 このように、スピーカが接続する空洞を設けることで、スピーカの音質を向上させることが可能となる。一方でスピーカの熱が音質に影響を与えることも考えられる。例えばスピーカの裏面を露出させて放熱を図るような構成では、スピーカと共鳴する空洞はスピーカの側方に配置される。この場合、空洞を含むスピーカ全体の平面サイズが拡大し、他の素子と干渉するといった可能性が生じる。 In this way, by providing a cavity to which the speaker is connected, it is possible to improve the sound quality of the speaker. On the other hand, it is also conceivable that the heat of the speaker affects the sound quality. For example, in a configuration in which the rear surface of the speaker is exposed to dissipate heat, the cavity that resonates with the speaker is arranged on the side of the speaker. In this case, the planar size of the entire speaker including the cavity is enlarged, which may cause interference with other elements.
 以上のような事情に鑑み、本技術の目的は、平面サイズを広げることなく音質を向上することが可能なスピーカ装置及び電子機器を提供することにある。 In view of the circumstances as described above, the purpose of the present technology is to provide a speaker device and an electronic device capable of improving sound quality without increasing the planar size.
 上記目的を達成するため、本技術の一形態に係るスピーカ装置は、スピーカユニットと、ケース部と、放熱部とを具備する。
 前記スピーカユニットは、振動板を有する。
 前記ケース部は、前記スピーカユニットの前記振動板とは反対側に空洞を形成し、前記振動板が露出するように前記スピーカユニットを収容する。
 前記放熱部は、前記空洞に設けられ前記スピーカユニットの熱を前記ケース部側に伝える。
To achieve the above object, a speaker device according to one aspect of the present technology includes a speaker unit, a case portion, and a heat dissipation portion.
The speaker unit has a diaphragm.
The case part forms a cavity on the opposite side of the speaker unit to the diaphragm, and accommodates the speaker unit so that the diaphragm is exposed.
The heat dissipation portion is provided in the cavity and conducts heat of the speaker unit to the case portion side.
 このスピーカ装置では、スピーカユニットが振動板を露出させた状態でケース部に収容される。またケース部は、スピーカユニットの振動板とは反対側に空洞を形成する。この空洞にはスピーカユニットの熱をケース部側に伝える放熱部が設けられる。これにより、振動板とは反対側の空洞を利用してスピーカユニットの放熱が可能となり、平面サイズを広げることなく音質を向上することが可能となる。 In this speaker device, the speaker unit is housed in the case with the diaphragm exposed. Further, the case part forms a cavity on the side opposite to the diaphragm of the speaker unit. This cavity is provided with a heat radiating portion that transfers heat from the speaker unit to the case portion side. As a result, heat can be dissipated from the speaker unit using the cavity on the side opposite to the diaphragm, and sound quality can be improved without increasing the planar size.
 前記スピーカユニットは、前記振動板と一体的に振動するボイスコイルと、前記ボイスコイルに作用する磁界を発生させるマグネットと、前記マグネットを挟んで前記振動板とは反対側に設けられ前記マグネットが接続されるヨークとを有してもよい。この場合、前記放熱部は、前記ヨークと前記ケース部とを熱的に接続してもよい。 The speaker unit includes a voice coil that vibrates integrally with the diaphragm; a magnet that generates a magnetic field that acts on the voice coil; and a yoke that is In this case, the heat radiation portion may thermally connect the yoke and the case portion.
 前記放熱部は、熱伝導部材を用いて構成された少なくとも1つのバネを有してもよい。 The heat radiating part may have at least one spring configured using a heat conducting member.
 前記少なくとも1つのバネは、板バネであってもよい。 The at least one spring may be a leaf spring.
 前記少なくとも1つのバネは、前記スピーカユニットを前記ケース部に均等に押し付けるように配置された複数のバネを含んでもよい。 The at least one spring may include a plurality of springs arranged to evenly press the speaker unit against the case.
 前記ケース部は、さらに、前記空洞を挟んで前記スピーカユニットと対向する位置に設けられた放熱板を有してもよい。この場合、前記放熱部は、前記放熱板に接続されてもよい。 The case portion may further have a radiator plate provided at a position facing the speaker unit with the cavity interposed therebetween. In this case, the heat dissipation part may be connected to the heat dissipation plate.
 前記ケース部は、前記空洞を挟んで前記スピーカユニットと対向する位置に形成された後側開口部を有してもよい。この場合、前記放熱板は、前記ケース部の前記後側開口部を覆うように配置されてもよい。 The case portion may have a rear opening formed at a position facing the speaker unit with the cavity interposed therebetween. In this case, the radiator plate may be arranged so as to cover the rear opening of the case portion.
 前記スピーカ装置は、電子機器に搭載されてもよい。この場合、前記放熱板は、前記電子機器の本体に接続される接続部を有してもよい。 The speaker device may be mounted on an electronic device. In this case, the heat sink may have a connecting portion connected to the main body of the electronic device.
 前記接続部は、前記ケース部の外側に設けられてもよい。 The connecting portion may be provided outside the case portion.
 前記ケース部は、前記空洞に連通し前記スピーカユニットの側方にひろがる他の空洞を形成してもよい。 The case part may form another cavity that communicates with the cavity and spreads to the side of the speaker unit.
 前記ケース部は、前記振動板が露出するように前記スピーカユニットを保持するフロントケースと、前記フロントケースに接続され前記空洞を形成するリアケースとを有してもよい。 The case portion may have a front case that holds the speaker unit so that the diaphragm is exposed, and a rear case that is connected to the front case and forms the cavity.
 前記フロントケースは、前記振動板を露出させる前側開口部と、前記フロントケースの内側に前記前側開口部を囲うように設けられたシール部材とを有してもよい。この場合、前記放熱部は、前記リアケースに固定され、前記スピーカユニットを前記シール部材に押し付けてもよい。 The front case may have a front opening through which the diaphragm is exposed, and a sealing member provided inside the front case so as to surround the front opening. In this case, the heat radiating section may be fixed to the rear case and press the speaker unit against the sealing member.
 前記シール部材は、防水シールであってもよい。 The sealing member may be a waterproof seal.
 本技術の一形態に係る電子機器は、出力部と、スピーカ装置とを具備する。
 前記出力部は、音声信号を出力する。
 前記スピーカ装置は、振動板を有し、前記音声信号に応じて前記振動板を振動させるスピーカユニットと、前記スピーカユニットの前記振動板とは反対側に空洞を形成し、前記振動板が露出するように前記スピーカユニットを収容するケース部と、前記空洞に設けられ前記スピーカユニットの熱を前記ケース部側に伝導する放熱部とを有する。
An electronic device according to one embodiment of the present technology includes an output unit and a speaker device.
The output unit outputs an audio signal.
The speaker device includes a speaker unit that has a diaphragm, and that vibrates the diaphragm according to the audio signal. A cavity is formed on the opposite side of the speaker unit from the diaphragm, and the diaphragm is exposed. and a heat radiating portion provided in the cavity for conducting heat of the speaker unit to the case portion side.
 前記電子機器は、さらに、画像を表示するディスプレイを具備してもよい。この場合、前記スピーカ装置は、前記ディスプレイと直交する方向から見て、前記振動板の少なくとも一部が前記ディスプレイと重なるように配置されてもよい。 The electronic device may further include a display for displaying images. In this case, the speaker device may be arranged such that at least a portion of the diaphragm overlaps the display when viewed from a direction perpendicular to the display.
本技術の一実施形態に係るスピーカ装置を搭載した端末装置の外観を示す模式図である。1 is a schematic diagram showing an appearance of a terminal device equipped with a speaker device according to an embodiment of the present technology; FIG. スピーカ装置の概要を説明するための模式図である。1 is a schematic diagram for explaining an outline of a speaker device; FIG. スピーカ装置の具体的な構成例を示す平面図である。2 is a plan view showing a specific configuration example of a speaker device; FIG. 図3に示すスピーカ装置の分解斜視図である。4 is an exploded perspective view of the speaker device shown in FIG. 3; FIG. 図3に示すスピーカ装置の断面図である。4 is a cross-sectional view of the speaker device shown in FIG. 3; FIG. スピーカ装置を搭載した端末装置の断面構成例を示す模式図である。It is a schematic diagram which shows the cross-sectional structural example of the terminal device which mounts the speaker apparatus. 比較例として挙げるスピーカ装置を示す模式図である。FIG. 3 is a schematic diagram showing a speaker device given as a comparative example;
 以下、本技術に係る実施形態を、図面を参照しながら説明する。 Hereinafter, embodiments according to the present technology will be described with reference to the drawings.
 図1は、本技術の一実施形態に係るスピーカ装置を搭載した端末装置の外観を示す模式図である。図1に示す端末装置100は、例えばユーザが携帯することが可能な電子端末である。端末装置100としては、スマートフォン端末、タブレット端末、音楽再生装置、電子辞書等の携帯端末が挙げられる。この他、端末装置100は、PC(Personal Computer)や、スマートスピーカ等の据え置き型のデバイスとして構成されてもよい。
 本実施形態では、端末装置100は、電子機器の一例である。
FIG. 1 is a schematic diagram showing the appearance of a terminal device equipped with a speaker device according to an embodiment of the present technology. A terminal device 100 shown in FIG. 1 is, for example, an electronic terminal that can be carried by a user. Examples of the terminal device 100 include portable terminals such as smartphone terminals, tablet terminals, music playback devices, and electronic dictionaries. In addition, the terminal device 100 may be configured as a stationary device such as a PC (Personal Computer) or a smart speaker.
In this embodiment, the terminal device 100 is an example of an electronic device.
 端末装置100は、ディスプレイ10と、スピーカ装置30とを有する。また端末装置100には、図示しない通信装置、記憶装置、コントローラ、バッテリー、カメラセンサ等が搭載される。
 ディスプレイ10は、画像を表示する表示装置であり、端末装置100の前面に設けられる。ディスプレイ10は、例えばコントローラから出力された画像信号が表す画像(操作画面や映像コンテンツ等)を表示する。
 スピーカ装置30は、音声を再生する装置であり、端末装置100の本体内部に搭載される。図1では、端末装置100内に配置されたスピーカ装置30が点線を用いて模式的に図示されている。スピーカ装置30は、例えばコントローラから出力された音声信号を音声に変換して出力する。これにより、様々な音声コンテンツを再生することが可能となる。
 本実施形態では、コントローラは、音声信号を出力する出力部に相当する。
The terminal device 100 has a display 10 and a speaker device 30 . The terminal device 100 also includes a communication device, a storage device, a controller, a battery, a camera sensor, and the like (not shown).
The display 10 is a display device that displays images, and is provided on the front surface of the terminal device 100 . The display 10 displays an image (operation screen, video content, etc.) represented by, for example, an image signal output from the controller.
The speaker device 30 is a device that reproduces sound and is mounted inside the main body of the terminal device 100 . In FIG. 1, the speaker device 30 arranged in the terminal device 100 is schematically illustrated using a dotted line. The speaker device 30 converts, for example, an audio signal output from the controller into audio and outputs the audio. This makes it possible to reproduce various audio contents.
In this embodiment, the controller corresponds to an output unit that outputs an audio signal.
 図2は、スピーカ装置30の概要を説明するための模式図である。スピーカ装置30は、スピーカユニット31と、スピーカケース32と、放熱部33とを有する。スピーカ装置30は、スピーカユニット31及び放熱部33をスピーカケース32の内部に収容した箱型の装置であり、スピーカボックスを形成する。
 本実施形態では、主に密閉型のスピーカケース32を用いて構成された密閉型スピーカについて説明する。なおスピーカ装置30は、スピーカケース32に開口部を設けたスピーカとして構成されてもよい。
FIG. 2 is a schematic diagram for explaining the outline of the speaker device 30. As shown in FIG. The speaker device 30 has a speaker unit 31 , a speaker case 32 and a heat radiator 33 . The speaker device 30 is a box-shaped device in which a speaker unit 31 and a radiator 33 are housed inside a speaker case 32, forming a speaker box.
In the present embodiment, a closed speaker configured mainly using a closed speaker case 32 will be described. Note that the speaker device 30 may be configured as a speaker having an opening provided in the speaker case 32 .
 スピーカ装置30は、スピーカユニット31に設けられる振動板34が、スピーカケース32から露出するように構成される。以下では、スピーカケース32の振動板34が露出した側(図中の上側)を、スピーカ装置30の前側と記載し、スピーカケース32の振動板34が露出した側とは反対側(図中の下側)を、スピーカ装置30の後側と記載する。図2には、スピーカ装置30を前後方向に沿って切断した断面図が模式的に図示されている。 The speaker device 30 is configured such that the diaphragm 34 provided in the speaker unit 31 is exposed from the speaker case 32 . Hereinafter, the side of the speaker case 32 where the diaphragm 34 is exposed (the upper side in the drawing) is referred to as the front side of the speaker device 30, and the side opposite to the side of the speaker case 32 where the diaphragm 34 is exposed (the upper side in the drawing). lower side) is referred to as the rear side of the speaker device 30 . FIG. 2 schematically shows a cross-sectional view of the speaker device 30 cut along the front-rear direction.
 スピーカユニット31は、電気信号(音声信号)を音波(音声)に変換するユニットであり、上記した振動板34と、ユニット本体35とを有する。
 振動板34は、ユニット本体35に対して振動する板状の部材である。スピーカユニット31では、振動板34が振動することで空気が振動して音波が発生する。本実施形態では、振動板34として、平板状の部材が用いられる。
 ユニット本体35は、振動板34を支持し、振動板34を振動させる駆動機構として構成された構造体である。ユニット本体35には、振動板34に接続されるボイスコイルや、ボイスコイルに作用する磁界を形成する磁気回路(マグネット及びヨーク)等が設けられる(図5参照)。
 例えばユニット本体35に設けられたボイスコイルが音声信号に応じて駆動され、ボイスコイルとともに振動板34が振動する。このように、スピーカユニット31は、音声信号に応じて振動板34を振動させる。これにより、音声信号の内容を音声として出力することが可能となる。
The speaker unit 31 is a unit that converts an electric signal (audio signal) into a sound wave (audio), and has the above-described diaphragm 34 and a unit main body 35 .
The diaphragm 34 is a plate-shaped member that vibrates with respect to the unit main body 35 . In the speaker unit 31, the vibrating diaphragm 34 causes the air to vibrate and generate sound waves. In this embodiment, a plate-like member is used as the diaphragm 34 .
The unit main body 35 is a structure configured as a driving mechanism that supports the diaphragm 34 and vibrates the diaphragm 34 . The unit main body 35 is provided with a voice coil connected to the diaphragm 34, a magnetic circuit (magnet and yoke) that forms a magnetic field acting on the voice coil, and the like (see FIG. 5).
For example, a voice coil provided in the unit main body 35 is driven according to the audio signal, and the diaphragm 34 vibrates together with the voice coil. Thus, the speaker unit 31 vibrates the diaphragm 34 according to the audio signal. This makes it possible to output the contents of the audio signal as audio.
 図2に示すように、本実施形態では、ユニット本体35は、全体として薄型の構造となるように構成される。振動板34は、ユニット本体35の厚さ方向に直交する一方の面に沿って配置される。スピーカユニット31では、振動板34が配置される側が前側となり、その反対側が後側となる。
 また、ユニット本体35の厚さ方向に沿って見た場合、振動板34の平面形状は、ユニット本体35の平面形状の内側に収まるように設定される。また、ユニット本体35の前側において、振動板34を囲む領域には、スピーカケース32に接続される接続領域36が形成される。
As shown in FIG. 2, in this embodiment, the unit body 35 is configured to have a thin structure as a whole. The diaphragm 34 is arranged along one surface perpendicular to the thickness direction of the unit main body 35 . In the speaker unit 31, the side on which the diaphragm 34 is arranged is the front side, and the opposite side is the rear side.
Further, when viewed along the thickness direction of the unit body 35 , the planar shape of the diaphragm 34 is set so as to fit inside the planar shape of the unit body 35 . A connection area 36 connected to the speaker case 32 is formed in an area surrounding the diaphragm 34 on the front side of the unit main body 35 .
 スピーカケース32は、スピーカ装置30の筐体であり、スピーカケース32を収容するエンクロージャとして機能する。スピーカケース32は、振動板34が露出するようにスピーカユニット31を収容する。
 本実施形態では、スピーカケース32の前側に、前側開口部37が設けられる。前側開口部37の形状及びサイズは、振動板34とスピーカケース32とが接触しないようにかつユニット本体35が貫通しないように設定される。この場合、図2に示すように、スピーカユニット31は、振動板34がスピーカケース32と接触せずに前側開口部37から露出するようにスピーカケース32の内壁に固定される。具体的には、ユニット本体35の前側に形成される接続領域36が、前側開口部37を囲むスピーカケース32の内側の領域に接続される。
The speaker case 32 is a housing for the speaker device 30 and functions as an enclosure that accommodates the speaker case 32 . The speaker case 32 accommodates the speaker unit 31 so that the diaphragm 34 is exposed.
In this embodiment, a front opening 37 is provided on the front side of the speaker case 32 . The shape and size of the front opening 37 are set so that the diaphragm 34 and the speaker case 32 do not come into contact with each other and the unit main body 35 does not pass through. In this case, as shown in FIG. 2, the speaker unit 31 is fixed to the inner wall of the speaker case 32 so that the diaphragm 34 does not come into contact with the speaker case 32 and is exposed from the front opening 37 . Specifically, the connection area 36 formed on the front side of the unit body 35 is connected to the area inside the speaker case 32 surrounding the front opening 37 .
 スピーカケース32は、スピーカユニット31の振動板34とは反対側に空洞1を形成する。すなわち、スピーカケース32は、スピーカユニット31の後側に空洞1ができるようにスピーカユニット31を収容する。
 ここで空洞とは、スピーカケース32により覆われることで形成される一定の容積を持った空間(容積空間)である。スピーカケース32は、例えばスピーカユニット31の後側に、スピーカケース32の内壁が接触しないように構成される。これにより、スピーカユニット31の後側とスピーカケース32の内壁との間には、空洞1が形成される。
 以下では、スピーカユニット31の後側に形成される空洞1を、後方空洞1aと記載する。
 本実施形態では、スピーカケース32は、ケース部に相当する。
The speaker case 32 forms a cavity 1 on the opposite side of the speaker unit 31 from the diaphragm 34 . That is, the speaker case 32 accommodates the speaker unit 31 so that the cavity 1 is formed behind the speaker unit 31 .
Here, the cavity is a space (volumetric space) having a certain volume formed by being covered with the speaker case 32 . The speaker case 32 is configured, for example, so that the inner wall of the speaker case 32 does not come into contact with the rear side of the speaker unit 31 . Thereby, a cavity 1 is formed between the rear side of the speaker unit 31 and the inner wall of the speaker case 32 .
The cavity 1 formed on the rear side of the speaker unit 31 is hereinafter referred to as a rear cavity 1a.
In this embodiment, the speaker case 32 corresponds to a case portion.
 放熱部33は、後方空洞1aに設けられスピーカユニット31の熱をスピーカケース32側に伝える部材である。放熱部33は、後方空洞1a内に配置され、例えばスピーカユニット31に熱的に接続して、その熱をスピーカケース32側に逃がす。例えばスピーカケース32に直接熱を伝えてもよいし、スピーカケース32の外側に配置された放熱部材等に熱を伝えてもよい。 The heat radiating section 33 is a member provided in the rear cavity 1a that transfers the heat of the speaker unit 31 to the speaker case 32 side. The heat dissipation part 33 is arranged in the rear cavity 1a, is thermally connected to the speaker unit 31, for example, and releases the heat to the speaker case 32 side. For example, the heat may be transferred directly to the speaker case 32 or may be transferred to a heat radiating member or the like arranged outside the speaker case 32 .
 放熱部33は、熱を伝えやすい金属等の熱伝導部材を用いて構成される。具体的には、放熱部33として、熱伝導部材を用いて構成された少なくとも1つのバネ38が設けられる。バネ38は、例えばスピーカユニット31とスピーカケース32との間に、反発力が働くように縮んだ状態で配置される。これにより、放熱部33(バネ38)は、スピーカユニット31及びスピーカケース32の両方に押し付けられ、良好な熱接触を実現することが可能となる。 The heat radiating section 33 is configured using a heat conductive member such as metal that easily conducts heat. Specifically, at least one spring 38 configured using a heat-conducting member is provided as the heat radiating portion 33 . The spring 38 is arranged, for example, between the speaker unit 31 and the speaker case 32 in a contracted state so as to exert a repulsive force. As a result, the heat radiating portion 33 (spring 38) is pressed against both the speaker unit 31 and the speaker case 32, making it possible to achieve good thermal contact.
 このように、スピーカ装置30では、後方空洞1aを設けることで、スピーカユニット31から出力される音声を十分に共鳴させることが可能となる。これにより、スピーカ装置30の音質、特に低音の再生能力を十分に向上することが可能となる。
 また後方空洞1aは、スピーカ装置30の厚さ方向に設けられる空洞1である。このため、後方空洞1aを設けても、スピーカ装置30の平面サイズが増大することはない。
 さらに、後方空洞1aに放熱部33を設けることで、スピーカユニット31の熱をスピーカケース32側に効率的に放熱することが可能となり、スピーカ装置30の放熱能力が向上する。これにより、例えばスピーカユニット31に入力可能な電力を増やすことが可能となり、再生可能な音圧レベルを向上することが可能となる。
 以下では、スピーカ装置30のより具体的な構成例について説明する。
In this manner, in the speaker device 30, the sound output from the speaker unit 31 can be sufficiently resonated by providing the rear cavity 1a. As a result, it is possible to sufficiently improve the sound quality of the speaker device 30, especially the ability to reproduce bass sounds.
Further, the rear cavity 1a is the cavity 1 provided in the thickness direction of the speaker device 30. As shown in FIG. Therefore, even if the rear cavity 1a is provided, the planar size of the speaker device 30 does not increase.
Furthermore, by providing the heat dissipation portion 33 in the rear cavity 1a, it is possible to efficiently dissipate the heat of the speaker unit 31 to the speaker case 32 side, and the heat dissipation capability of the speaker device 30 is improved. As a result, for example, it is possible to increase the power that can be input to the speaker unit 31, and it is possible to improve the reproducible sound pressure level.
A more specific configuration example of the speaker device 30 will be described below.
 図3は、スピーカ装置30の具体的な構成例を示す平面図である。
 図3Aは、スピーカ装置30を後側から見た平面図である。図3Bは、端末装置100に装着されたスピーカ装置30を後側から見た平面図である。図3A及び図3Bでは、図面の裏側が振動板34が露出したスピーカ装置30の前側となる。
 以下では、スピーカ装置30の前後方向をZ方向と記載する。また、Z方向と直交する平面おいて互いに直交する方向をX方向及びY方向と記載する。
FIG. 3 is a plan view showing a specific configuration example of the speaker device 30. As shown in FIG.
FIG. 3A is a plan view of the speaker device 30 viewed from the rear side. FIG. 3B is a plan view of the speaker device 30 attached to the terminal device 100 as seen from the rear side. 3A and 3B, the back side of the drawing is the front side of the speaker device 30 where the diaphragm 34 is exposed.
Hereinafter, the front-rear direction of the speaker device 30 is referred to as the Z direction. Also, the directions perpendicular to each other on a plane perpendicular to the Z direction are described as the X direction and the Y direction.
 X方向(図中の左右方向)は、スピーカ装置30の左右方向に対応する。またY方向(図中の上下方向)はスピーカ装置30の上下方向に対応する。なおスピーカ装置30の左右方向及び上下方向は、端末装置100に搭載した場合の端末装置100の左右方向及び上下方向に対応している。例えば図中の上側がスピーカ装置30(端末装置100)の上側となる。また、スピーカ装置30の前側(振動板34が設けられる側)から見た右側及び左側をスピーカ装置30の(端末装置100)右側及び左側と記載する。
 なお、スピーカ装置30に関する上側、下側、左側、右側、前側、後側等の記載は、スピーカ装置30が使用される姿勢や配置等を限定するものではない。
The X direction (horizontal direction in the drawing) corresponds to the lateral direction of the speaker device 30 . The Y direction (vertical direction in the drawing) corresponds to the vertical direction of the speaker device 30 . The left-right direction and the up-down direction of the speaker device 30 correspond to the left-right direction and the up-down direction of the terminal device 100 when mounted on the terminal device 100 . For example, the upper side in the figure is the upper side of the speaker device 30 (terminal device 100). Also, the right and left sides of the speaker device 30 viewed from the front side (the side where the diaphragm 34 is provided) are referred to as the right and left sides of the speaker device 30 (the terminal device 100).
Note that the upper side, lower side, left side, right side, front side, rear side, and the like regarding the speaker device 30 do not limit the posture, arrangement, and the like in which the speaker device 30 is used.
 スピーカ装置30は、上記したように、スピーカユニット31と、スピーカケース32と、放熱部33とを有する。このうち、スピーカケース32は、スピーカ装置30の前側に設けられるフロントケース40と、後側に設けられるリアケース41とを有する。
 図3Aには、主にスピーカケース32のうちリアケース41が図示されている。
The speaker device 30 has the speaker unit 31, the speaker case 32, and the radiator 33, as described above. Among them, the speaker case 32 has a front case 40 provided on the front side of the speaker device 30 and a rear case 41 provided on the rear side.
FIG. 3A mainly shows the rear case 41 of the speaker case 32 .
 図3Aに示すようにスピーカケース32には、上側から順番に、第1のエリア5aと、第2のエリア5bと、第3のエリア5cとが設けられる。これらのエリアは、リアケース41及びフロントケース40の両方に囲まれた空間が形成されるエリアである。
 第1のエリア5aは、平面視で略正方形状のエリアであり、スピーカユニット31、後方空洞1a、及び放熱部33等が設けられるエリアである。
As shown in FIG. 3A, the speaker case 32 is provided with a first area 5a, a second area 5b, and a third area 5c in order from the top. These areas are areas in which a space surrounded by both the rear case 41 and the front case 40 is formed.
The first area 5a is a substantially square area in plan view, and is an area in which the speaker unit 31, the rear cavity 1a, the heat radiating section 33, and the like are provided.
 第2のエリア5bは、第1のエリア5aと同程度の左右の幅で第1のエリア5aを下側に拡張したエリアである。第3のエリア5cは、第2のエリア5aよりも左右の幅が狭く、第2のエリア5bを下側に拡張したエリアであり、図中右側(スピーカ装置30の左側)によせて配置される。
 第2のエリア5b及び第3のエリア5cは、後述する側方空洞1bが設けられるエリアである(図5参照)。
The second area 5b is an area obtained by expanding the first area 5a downward with the same horizontal width as the first area 5a. The third area 5c is narrower in the lateral direction than the second area 5a, is an area extending downward from the second area 5b, and is arranged on the right side of the figure (left side of the speaker device 30). be.
The second area 5b and the third area 5c are areas in which side cavities 1b, which will be described later, are provided (see FIG. 5).
 本実施形態では、スピーカケース32は、放熱板43を有する。ここでは、放熱板43は、リアケース41の一部として構成される。図3Aには、第1のエリア5aにおいて、リアケース41にはめ込まれた放熱板43が見えている。
 また、放熱板43は、放熱端子44を有する。放熱端子44は、放熱板43と接続された端子である。図3Aでは、スピーカ装置30の左側(図中の右側)に突出して放熱端子44が形成される。放熱板43の構成については、後に詳しく説明する。
In this embodiment, the speaker case 32 has a radiator plate 43 . Here, the radiator plate 43 is configured as part of the rear case 41 . In FIG. 3A, the radiator plate 43 fitted in the rear case 41 can be seen in the first area 5a.
Moreover, the heat sink 43 has a heat radiation terminal 44 . The heat dissipation terminal 44 is a terminal connected to the heat dissipation plate 43 . In FIG. 3A, a heat dissipation terminal 44 is formed to protrude to the left side (right side in the figure) of the speaker device 30 . The configuration of the heat sink 43 will be described later in detail.
 フロントケース40には、固定端子45と、入力端子46とが設けられる。
 固定端子45は、例えばスピーカ装置30を固定するための端子である。図3Aでは、スピーカ装置30の右側(図中の左側)に突出して固定端子45が形成される。
 入力端子46は、スピーカユニット31に入力される音声信号を入力するための端子である。図3Aでは、第3のエリア5cの下側に図中右側によせて入力端子46が配置される。
A fixed terminal 45 and an input terminal 46 are provided on the front case 40 .
The fixed terminal 45 is a terminal for fixing the speaker device 30, for example. In FIG. 3A, a fixed terminal 45 is formed to protrude to the right side (left side in the drawing) of the speaker device 30 .
The input terminal 46 is a terminal for inputting an audio signal to be input to the speaker unit 31 . In FIG. 3A, an input terminal 46 is arranged on the lower side of the third area 5c toward the right side of the drawing.
 図4は、図3に示すスピーカ装置30の分解斜視図である。
 図4には、下から順番にフロントケース40、スピーカユニット31、放熱部33、及びリアケース41が図示されている。
 フロントケース40には、スピーカユニット31の振動板34を露出するための前側開口部37が設けられる。ここでは、前側開口部37として、略正方形状の穴が形成されている。
4 is an exploded perspective view of the speaker device 30 shown in FIG. 3. FIG.
FIG. 4 shows the front case 40, the speaker unit 31, the radiator 33, and the rear case 41 in order from the bottom.
The front case 40 is provided with a front opening 37 for exposing the diaphragm 34 of the speaker unit 31 . Here, a substantially square hole is formed as the front opening 37 .
 スピーカユニット31は、平面視で略正方形状の薄型の構造体であり、フロントケース40の内壁に振動板34が露出するように接続される。図4では、スピーカユニット31の後側の面(後述するヨーク57)が見えている。この面に、4つのバネを備える放熱部33が接続する。なお図4には、放熱部33が単体で図示されているが、実際には、放熱部33は予めリアケース41(放熱板43)に固定されている(図5参照)。 The speaker unit 31 is a substantially square thin structure in plan view, and is connected to the inner wall of the front case 40 so that the diaphragm 34 is exposed. In FIG. 4, the rear surface of the speaker unit 31 (a yoke 57 to be described later) is visible. A heat sink 33 having four springs is connected to this surface. Although FIG. 4 shows the heat radiation part 33 alone, the heat radiation part 33 is actually fixed in advance to the rear case 41 (heat radiation plate 43) (see FIG. 5).
 リアケース41は、放熱部33をスピーカユニット31の後側に押し付けるようにして、フロントケース40と接続する。例えばフロントケース40及びリアケース41は互いに篏合するように構成される。この他、フロントケース40及びリアケース41の接続には、ねじ止めや接着剤等が用いられてもよい。 The rear case 41 is connected to the front case 40 by pressing the heat radiation part 33 against the rear side of the speaker unit 31 . For example, the front case 40 and the rear case 41 are configured to fit together. In addition, the front case 40 and the rear case 41 may be connected using screws, an adhesive, or the like.
 図5は、図3に示すスピーカ装置30の断面図である。
 図5には、図3に示すA-A'線に沿ってスピーカ装置30を切断した断面図が図示されている。図5では、図中の右側がスピーカ装置30の上側に対応する。また図中の上側が、スピーカ装置30の前側となり、図中の下側がスピーカ装置30の後側となる。
FIG. 5 is a cross-sectional view of speaker device 30 shown in FIG.
FIG. 5 shows a cross-sectional view of the speaker device 30 taken along line AA' shown in FIG. In FIG. 5 , the right side of the drawing corresponds to the upper side of the speaker device 30 . The upper side in the drawing is the front side of the speaker device 30, and the lower side in the drawing is the rear side of the speaker device 30. As shown in FIG.
 まず、スピーカユニット31について説明する。スピーカユニット31は、振動板34と、エッジ膜47と、支持部48と、結合部49と、ボイスコイル50と、磁気回路51とを有する。 First, the speaker unit 31 will be explained. The speaker unit 31 has a diaphragm 34 , an edge film 47 , a support portion 48 , a coupling portion 49 , a voice coil 50 and a magnetic circuit 51 .
 振動板34は、平板形状の部材である。振動板34の平面形状としては、例えば円形や、正方形、長方形等の任意の形状を用いることが可能である。なお矩形状の振動板34を用いる場合には、角を丸くすることで応力の集中を避けることができる。振動板34の材料としては、例えば樹脂材料、金属材料、セラミック材料、及びこれらの材料を組み合わせた複合部材等を用いることが可能である。
 この他、振動板34の形状や材質は限定されず、スピーカ装置30の用途等に応じた振動板34が適宜構成されてよい。
The diaphragm 34 is a plate-shaped member. As for the plane shape of the diaphragm 34, any shape such as a circle, a square, or a rectangle can be used. When the rectangular diaphragm 34 is used, stress concentration can be avoided by rounding the corners. As the material of the diaphragm 34, for example, a resin material, a metal material, a ceramic material, or a composite member obtained by combining these materials can be used.
In addition, the shape and material of the diaphragm 34 are not limited, and the diaphragm 34 may be appropriately configured according to the application of the speaker device 30 and the like.
 エッジ膜47は、振動板34の外周を囲うように振動板34と支持部48との間に配置された膜である。エッジ膜47は、例えば半円形の断面形状を備え、振動板34を振動可能なように支持部48に接続する。エッジ膜47としては、典型的には、樹脂フィルム等が用いられる。
 支持部48は、エッジ膜47を介して振動板34を支持する環状の部材である。支持部48の内側に形成される開口部の形状は、例えば前側開口部37の平面形状と略同じ形に設定され、支持部48の外周の形状は、スピーカユニット31の平面形状となる。また支持部48の前側の面は、スピーカケース32(フロントケース40)の内壁に接続される接続領域36となる。
 結合部49は、磁気回路51と支持部48とを結合する部材である。結合部49は、例えば環状に構成され、支持部48の後側の面と、後述する磁気回路51の第2の上部プレート56bや第2のマグネット55bとを結合する。
The edge film 47 is a film arranged between the diaphragm 34 and the support portion 48 so as to surround the outer circumference of the diaphragm 34 . The edge film 47 has, for example, a semicircular cross-sectional shape, and connects the diaphragm 34 to the supporting portion 48 so as to vibrate. A resin film or the like is typically used as the edge film 47 .
The support portion 48 is an annular member that supports the diaphragm 34 via the edge film 47 . The shape of the opening formed inside the support portion 48 is, for example, substantially the same as the planar shape of the front opening portion 37 , and the shape of the outer circumference of the support portion 48 is the planar shape of the speaker unit 31 . A front surface of the support portion 48 serves as a connection area 36 that is connected to the inner wall of the speaker case 32 (front case 40).
The coupling portion 49 is a member that couples the magnetic circuit 51 and the support portion 48 . The coupling portion 49 is, for example, annular, and couples the rear surface of the support portion 48 to a second upper plate 56b and a second magnet 55b of the magnetic circuit 51, which will be described later.
 ボイスコイル50は、振動板34と一体的に振動し、音声信号に応じて振動板34を振動させるコイルである。ボイスコイル50は、ボビンを有していてもよいし、ボビンレスコイルとして構成されてもよい。ボイスコイル50は、振動板34の後側に接続され、磁気回路51の第1のマグネット55a及び第2のマグネット55bとの間に形成される環状のギャップ52にはまるように配置される。
 またボイスコイル50には図示しないコイル端子が設けられている。コイル端子は、スピーカユニット31の入力電極に接続される。
 ボイスコイル50の具体的な構成は限定されない。
The voice coil 50 is a coil that vibrates integrally with the diaphragm 34 and causes the diaphragm 34 to vibrate according to an audio signal. Voice coil 50 may have a bobbin or may be configured as a bobbinless coil. The voice coil 50 is connected to the rear side of the diaphragm 34 and arranged to fit in an annular gap 52 formed between the first magnet 55 a and the second magnet 55 b of the magnetic circuit 51 .
The voice coil 50 is also provided with coil terminals (not shown). The coil terminals are connected to input electrodes of the speaker unit 31 .
A specific configuration of the voice coil 50 is not limited.
 磁気回路51は、第1のマグネット55aと、第2のマグネット55bと、第1の上部プレート56a、第2の上部プレート56bと、ヨーク57とを有する。
 第1のマグネット55a及び第2のマグネット55bは、ボイスコイルに作用する磁界を発生させるマグネットである。第1のマグネット55aは、ボイスコイル50の内側に配置された板状の永久磁石である。第2のマグネット55bは、第1のマグネット55aを囲むように配置された環状の永久磁石である。なお第2のマグネット55bとして、環状に配置された複数の永久磁石が用いられてもよい。
 第1のマグネット55a及び第2のマグネット55bは環状のギャップ52を隔てて配置される。このギャップ52に発生した磁界が、ボイスコイル50に作用する。
The magnetic circuit 51 has a first magnet 55 a , a second magnet 55 b , a first upper plate 56 a , a second upper plate 56 b and a yoke 57 .
The first magnet 55a and the second magnet 55b are magnets that generate a magnetic field acting on the voice coil. The first magnet 55 a is a plate-shaped permanent magnet arranged inside the voice coil 50 . The second magnet 55b is an annular permanent magnet arranged to surround the first magnet 55a. A plurality of permanent magnets arranged in a ring may be used as the second magnet 55b.
The first magnet 55a and the second magnet 55b are arranged with an annular gap 52 therebetween. A magnetic field generated in this gap 52 acts on the voice coil 50 .
 第1の上部プレート56aは、第1のマグネット55aの前側に配置された板状のプレートであり、第2の上部プレート56bは、第2のマグネット55bの前側に配置された環状のプレートである。このうち第2の上部プレート56bには、例えば上記した結合部49が接続される。
 ヨーク57は、第1のマグネット55a及び第2のマグネット55bを挟んで振動板34とは反対側に設けられ第1のマグネット55a及び第2のマグネット55bが接続される板状の部材である。ヨーク57は金属材料で構成され、第1のマグネット55a及び第2のマグネット55bを磁気的に結合して磁気回路51を形成する。ヨーク57の後側の面が、スピーカユニット31において、振動板34とは反対側の面となる。以下では、ヨーク57の後側の面を、スピーカユニット31の背面58と記載する場合がある。
The first upper plate 56a is a plate-shaped plate arranged in front of the first magnet 55a, and the second upper plate 56b is an annular plate arranged in front of the second magnet 55b. . For example, the coupling portion 49 described above is connected to the second upper plate 56b.
The yoke 57 is a plate-shaped member provided on the side opposite to the diaphragm 34 with the first magnet 55a and the second magnet 55b interposed therebetween, and to which the first magnet 55a and the second magnet 55b are connected. The yoke 57 is made of a metal material and magnetically couples the first magnet 55 a and the second magnet 55 b to form the magnetic circuit 51 . The rear surface of the yoke 57 is the surface of the speaker unit 31 opposite to the diaphragm 34 . Hereinafter, the rear surface of the yoke 57 may be referred to as the rear surface 58 of the speaker unit 31 .
 次に、スピーカケース32について説明する。スピーカケース32は、フロントケース40と、リアケース41とを有する。 Next, the speaker case 32 will be explained. Speaker case 32 has a front case 40 and a rear case 41 .
 フロントケース40は、スピーカケース32の前側を構成する部材(スピーカケースフロント)であり、振動板34が露出するようにスピーカユニット31を保持する。
 図4及び図5に示すように、フロントケース40は、第1のエリア5a、第2のエリア5b、及び第3のエリア5cを覆うように構成された略平板状の部材である。またフロントケース40の外周部分は、後側に突出して側壁を構成する。
 フロントケース40は、例えば樹脂材料を用いて構成される。
The front case 40 is a member (speaker case front) forming the front side of the speaker case 32 and holds the speaker unit 31 so that the diaphragm 34 is exposed.
As shown in FIGS. 4 and 5, the front case 40 is a substantially flat plate member configured to cover the first area 5a, the second area 5b, and the third area 5c. An outer peripheral portion of the front case 40 protrudes rearward to form a side wall.
The front case 40 is configured using, for example, a resin material.
 フロントケース40は、前側開口部37と、シール部材60と、篏合溝61とを有する。
 前側開口部37は、振動板34を露出させる穴である。ここでは、第1のエリア5aに略正方形状の前側開口部が形成される(図4参照)。前側開口部37の平面サイズは、振動板34と振動板34を囲むエッジ膜47とが平面視で露出するように設定される。なお前側開口部37の形状及びサイズは、例えばスピーカユニット31や振動板34の構成に応じて適宜設定されてよい。
The front case 40 has a front opening 37 , a seal member 60 and a fitting groove 61 .
The front opening 37 is a hole through which the diaphragm 34 is exposed. Here, a substantially square front opening is formed in the first area 5a (see FIG. 4). The planar size of the front opening 37 is set so that the diaphragm 34 and the edge film 47 surrounding the diaphragm 34 are exposed in plan view. The shape and size of the front opening 37 may be appropriately set according to the configurations of the speaker unit 31 and the diaphragm 34, for example.
 シール部材60は、フロントケース40とスピーカユニット31と接続するシールである。シール部材60は、フロントケース40の内側に前側開口部37を囲うように設けられる。シール部材60は、典型的には両面が粘着面となる粘着シールである。図5に示すように、スピーカユニット31は、支持部48の前側の面(接続領域36)がシール部材60に接着するように配置される。これにより、スピーカユニット31がフロントケース40に接着固定される。 The seal member 60 is a seal that connects the front case 40 and the speaker unit 31 . The seal member 60 is provided inside the front case 40 so as to surround the front opening 37 . The seal member 60 is typically an adhesive seal having adhesive surfaces on both sides. As shown in FIG. 5 , the speaker unit 31 is arranged such that the front surface (connection region 36 ) of the support portion 48 is adhered to the sealing member 60 . Thereby, the speaker unit 31 is adhesively fixed to the front case 40 .
 また本実施形態では、シール部材60として、防水シールが用いられる。防水シールを用いることで、前側開口部37からの水の侵入を回避することが可能となる。防水シールとしては、ゴム材料や樹脂材料当を用いて構成された防水性の粘着シールが適宜用いられる。
 なお、シール部材60は必ずしも防水シールとして構成される必要はなく、防水性の内粘着テープ等が用いられる場合であっても、本技術は適用可能である。
Further, in this embodiment, a waterproof seal is used as the seal member 60 . By using a waterproof seal, it is possible to avoid intrusion of water from the front opening 37 . As the waterproof seal, a waterproof adhesive seal made of a rubber material or a resin material is appropriately used.
Note that the seal member 60 does not necessarily have to be configured as a waterproof seal, and the present technology can be applied even when a waterproof inner adhesive tape or the like is used.
 篏合溝61は、リアケース41の篏合端64が嵌め込まれる溝である。篏合溝61は、フロントケース40の後側に突出した側壁の端面に形成される。 The mating groove 61 is a groove into which the mating end 64 of the rear case 41 is fitted. The fitting groove 61 is formed in the end surface of the side wall of the front case 40 protruding rearward.
 リアケース41は、スピーカケース32の後側を構成する部材(スピーカケースリア)であり、フロントケース40に接続され後方空洞1aを形成する。例えば、リアケース41は、スピーカユニット31の後側に一定の容積空間が形成されるように構成される。この容積空間が後方空洞1aとなる。後方空洞1aは、スピーカユニット31の後側に配置される空間であるため、後方空洞1aを設けても、スピーカ装置30の平面サイズは拡大しない。また後方空洞1aを設けることで、スピーカユニット31の音が共鳴され、音質の向上を図ることが可能となる。これにより、平面サイズが非常にコンパクトでありながら、音質のよいスピーカ装置30を実現することが可能となる。 The rear case 41 is a member (speaker case rear) forming the rear side of the speaker case 32, and is connected to the front case 40 to form the rear cavity 1a. For example, the rear case 41 is configured such that a certain volumetric space is formed behind the speaker unit 31 . This volume space becomes the rear cavity 1a. Since the rear cavity 1a is a space arranged on the rear side of the speaker unit 31, the planar size of the speaker device 30 does not increase even if the rear cavity 1a is provided. Further, by providing the rear cavity 1a, the sound of the speaker unit 31 is resonated, and the sound quality can be improved. As a result, it is possible to realize the speaker device 30 having a very compact planar size and high sound quality.
 図4及び図5に示すように、リアケース41は、第1のエリア5a、第2のエリア5b、及び第3のエリア5cを覆うように構成される。このうち、第1のエリア5aには、後方空洞1aが形成される。第2のエリア5bには、スピーカユニット31の下側(図中の左側)に拡張された他の空洞が形成される。第3のエリア5cには、フロントケース40側に形成される空洞を閉じる蓋状の部材が設けられる。またリアケース41の外周部分は、フロントケース40とともに側壁を構成する。 As shown in FIGS. 4 and 5, the rear case 41 is configured to cover the first area 5a, the second area 5b, and the third area 5c. A rear cavity 1a is formed in the first area 5a. Another cavity extending to the lower side of the speaker unit 31 (left side in the figure) is formed in the second area 5b. The third area 5c is provided with a lid-like member that closes the cavity formed on the front case 40 side. An outer peripheral portion of the rear case 41 forms a side wall together with the front case 40 .
 リアケース41は、樹脂筐体62と、後側開口部63と、篏合端64と、放熱板43とを有する。樹脂筐体62と放熱板43とは、典型的には、インサート成型等により一体的に成型される。
 樹脂筐体62は、リアケース41において放熱板43を除く部分を構成する部材であり、樹脂材料を用いて構成される。樹脂筐体62には、後側開口部63と、篏合端64とが設けられる。
 後側開口部63は、後方空洞1aを挟んでスピーカユニット31と対向する位置に形成される。図3~図5に示す例では、第1のエリア5aの中央部分にスピーカユニット31と略同程度の大きさの後側開口部63が形成される。また樹脂筐体42(リアケース41)のの後側開口部63を囲う領域は、インサート成型により放熱板43と結合する領域となる。
The rear case 41 has a resin housing 62 , a rear opening 63 , a mating end 64 and a heat sink 43 . The resin housing 62 and the heat sink 43 are typically integrally molded by insert molding or the like.
The resin housing 62 is a member forming a portion of the rear case 41 other than the heat sink 43, and is made of a resin material. The resin housing 62 is provided with a rear opening 63 and a mating end 64 .
The rear opening 63 is formed at a position facing the speaker unit 31 across the rear cavity 1a. In the examples shown in FIGS. 3 to 5, a rear opening 63 having approximately the same size as the speaker unit 31 is formed in the central portion of the first area 5a. A region surrounding the rear opening 63 of the resin housing 42 (rear case 41) is a region that is joined to the radiator plate 43 by insert molding.
 放熱板43は、放熱部33を伝わる熱を逃がす板状の放熱部材である。放熱板43は、後方空洞1aを挟んでスピーカユニット31と対向する位置に設けられる。なお、樹脂筐体62の成型後に放熱板43を取り付けるといった構成も可能である。 The radiator plate 43 is a plate-like radiator member that releases heat transmitted through the radiator 33 . The radiator plate 43 is provided at a position facing the speaker unit 31 across the rear cavity 1a. It should be noted that a configuration is also possible in which the heat sink 43 is attached after the resin housing 62 is molded.
 本実施形態では、放熱板43は、スピーカケース32(リアケース41の樹脂筐体62)の後側開口部63を覆うように配置される。すなわち、放熱板43は、後側開口部63をふさぐ蓋として機能する。従って、後方空洞1aは、放熱板43とスピーカユニット31との間に形成された容積空間となる。このように、放熱板43は、スピーカケース32(リアケース41)の一部として構成される。 In this embodiment, the radiator plate 43 is arranged so as to cover the rear opening 63 of the speaker case 32 (the resin housing 62 of the rear case 41). That is, the radiator plate 43 functions as a lid that closes the rear opening 63 . Therefore, the rear cavity 1a becomes a voluminous space formed between the radiator plate 43 and the speaker unit 31. As shown in FIG. Thus, the radiator plate 43 is configured as part of the speaker case 32 (rear case 41).
 図5に示すように、放熱板43は、略平板形状であり、取付部66と、結合端67とを有する。
 取付部66は、放熱部33を取り付けるために設けられた突起である。図3及び図5に示すように、取付部66は、放熱板43の前側(内側)に突出するように放熱板43を変形させて構成される。放熱板43には、取付部66として2つの突起が形成される。なお、放熱板43の後側(外側)から見ると、取付部66は凹状のくぼみとなる。
 結合端67は、放熱板43の外周端を前側に屈曲して形成される。結合端67は、樹脂筐体62の後側開口部63を囲う領域に結合する。これにより、樹脂筐体62と放熱板43との食いつきをよくすることが可能となっている。
As shown in FIG. 5 , the radiator plate 43 has a substantially flat plate shape and has a mounting portion 66 and a coupling end 67 .
The mounting portion 66 is a projection provided for mounting the heat radiating portion 33 . As shown in FIGS. 3 and 5 , the mounting portion 66 is configured by deforming the heat sink 43 so as to protrude forward (inward) from the heat sink 43 . Two protrusions are formed as the mounting portions 66 on the heat sink 43 . In addition, when viewed from the rear side (outside) of the heat sink 43, the mounting portion 66 has a concave shape.
The joint end 67 is formed by bending the outer peripheral end of the heat sink 43 forward. The coupling end 67 is coupled to the area surrounding the rear opening 63 of the resin housing 62 . This makes it possible to improve the engagement between the resin housing 62 and the heat sink 43 .
 また図3Aを参照して説明したように、放熱板43は、放熱端子44を有する。
 放熱端子44は、スピーカ装置30が搭載される端末装置100の本体に接続される端子である。図3Aに示すように、放熱端子44には、ねじ止め用の穴が形成される。放熱端子44は、放熱板43と一体的に形成され、例えばリアケース41の内側を通り、側壁を貫通して、リアケース41の側面から突出するように構成される。このように、放熱端子44は、リアケース41(スピーカケース32)の外側に設けられる。
 本実施形態では、放熱端子44は、電子機器の本体に接続される接続部に相当する。
Further, as described with reference to FIG. 3A, the heat sink 43 has heat sink terminals 44 .
The heat dissipation terminal 44 is a terminal connected to the main body of the terminal device 100 on which the speaker device 30 is mounted. As shown in FIG. 3A, the heat dissipation terminal 44 is formed with holes for screwing. The heat dissipation terminal 44 is integrally formed with the heat dissipation plate 43 , for example, so as to pass through the inside of the rear case 41 , penetrate the side wall, and protrude from the side surface of the rear case 41 . Thus, the heat dissipation terminal 44 is provided outside the rear case 41 (speaker case 32).
In this embodiment, the heat dissipation terminal 44 corresponds to a connecting portion connected to the main body of the electronic device.
 図3Bには、端末装置100の本体に放熱端子44が接続される様子が図示されている。放熱端子44をスピーカケース32の外側に設けることで、端末装置100との接続を容易に実現することが可能となる。
 なお放熱端子44は、スピーカケース32の内部や外壁等に設けられてもよい。例えば放熱端子として、放熱板43の後側開口部63を覆う部分にねじ止め用の貫通孔等が形成されてもよい。またスピーカケース32の側壁に沿った放熱端子44等が形成されてもよい。
FIG. 3B shows how the heat dissipation terminal 44 is connected to the main body of the terminal device 100 . By providing the heat dissipation terminal 44 outside the speaker case 32, it is possible to easily realize the connection with the terminal device 100. FIG.
Note that the heat dissipation terminal 44 may be provided inside the speaker case 32 or on the outer wall thereof. For example, as a heat dissipation terminal, a through hole for screwing may be formed in a portion covering the rear opening 63 of the heat dissipation plate 43 . Further, heat radiation terminals 44 and the like may be formed along the side wall of speaker case 32 .
 図5に示すように、スピーカケース32には、後方空洞1aと連通する他の空洞1が形成される。ここでは、後方空洞1aが形成される第1のエリア5aの下側(図中左側)の第2のエリア5bに、リアケース41の側壁が突出することで空洞1が形成される。さらに、第2のエリア5bの下側(図中左側)の第3のエリア5cでは、フロントケース40の内側に構成された溝状の領域により空洞1が形成される。
 これらの空洞1は、スピーカユニット31から見て、前後方向(厚さ方向)ではなく、前後方向に直交する面方向(スピーカユニット31の側方)に、後方空洞1aを拡張した側方空洞1bとなる。
As shown in FIG. 5, the speaker case 32 is formed with another cavity 1 that communicates with the rear cavity 1a. Here, the side wall of the rear case 41 protrudes into the second area 5b below the first area 5a (on the left side in the figure) where the rear cavity 1a is formed, thereby forming the cavity 1. As shown in FIG. Furthermore, in the third area 5c below the second area 5b (on the left side in the drawing), a cavity 1 is formed by a groove-shaped area formed inside the front case 40. As shown in FIG.
When viewed from the speaker unit 31, these cavities 1 are lateral cavities 1b extending from the rear cavities 1a not in the front-back direction (thickness direction) but in the plane direction perpendicular to the front-back direction (sides of the speaker unit 31). becomes.
 このように、スピーカケース32は、後方空洞1aに連通しスピーカユニット31の側方にひろがる側方空洞1bを形成する。側方空洞1bを設けることで、スピーカボックスとして構成されるスピーカ装置30の空洞部分の容積を大きくすることが可能となる。これにより、低音等の再生能力を十分に向上することが可能となる。なお、側方空洞1bのサイズや配置等は限定されず、例えばスピーカユニット31の上側、下側、右側、左側といった任意の方向に後方空洞1aを拡張する側方空洞1bが設けられてよい。
 本実施形態では。側方空洞1bは、他の空洞に相当する。
In this manner, the speaker case 32 forms a side cavity 1b that communicates with the rear cavity 1a and spreads to the side of the speaker unit 31. As shown in FIG. By providing the side cavity 1b, it is possible to increase the volume of the cavity portion of the speaker device 30 configured as a speaker box. As a result, it is possible to sufficiently improve the reproduction capability of bass and the like. The size and arrangement of the side cavity 1b are not limited.
In this embodiment. The side cavity 1b corresponds to another cavity.
 次に、放熱部33について説明する。
 放熱部33は、スピーカユニット31のヨーク57とスピーカケース32とを熱的に接続する。これにより、例えばボイスコイル50で発生しヨーク57に伝わった熱を、スピーカケース32側に逃がすことが可能となる。
 本実施形態では、放熱部33は、リアケース41に設けられた放熱板43に接続される。図5に示すように、放熱部33は、ヨーク57の背面58及び放熱板43の前側(内側)の表面に接触するように構成される。これにより、放熱部33を伝わる熱は放熱板43に伝わり、スピーカユニット31の熱を効率的に逃がすことが可能となる。
Next, the heat radiating portion 33 will be described.
The radiator 33 thermally connects the yoke 57 of the speaker unit 31 and the speaker case 32 . As a result, for example, heat generated in the voice coil 50 and transferred to the yoke 57 can be released to the speaker case 32 side.
In this embodiment, the heat dissipation part 33 is connected to a heat dissipation plate 43 provided on the rear case 41 . As shown in FIG. 5 , the heat dissipation portion 33 is configured to contact the rear surface 58 of the yoke 57 and the front (inner) surface of the heat dissipation plate 43 . As a result, the heat transmitted through the heat radiating portion 33 is transmitted to the heat radiating plate 43, and the heat of the speaker unit 31 can be efficiently released.
 放熱部33は、複数の板バネ部70と、基体部71とを有する。
 板バネ部70は、板状の熱伝導部材を屈曲させた板バネである。基体部71は、複数の板バネ部70を支持する部材である。板バネ部70及び基体部71は、典型的に一つの部材を折り曲げることで一体的に構成される。板バネ部70及び基体部71としては、例えばリン青銅やコルソン系合金等のバネ性を備えた高熱伝導部材が用いられる。この他、ステンレス系や鉄系の合金や等により放熱部33が構成されてもよい。
The heat radiating portion 33 has a plurality of leaf spring portions 70 and a base portion 71 .
The leaf spring portion 70 is a leaf spring formed by bending a plate-shaped heat-conducting member. The base portion 71 is a member that supports the plurality of leaf spring portions 70 . The plate spring portion 70 and the base portion 71 are typically integrally formed by bending one member. As the leaf spring portion 70 and the base portion 71, for example, a high thermal conductivity member having spring properties such as phosphor bronze or Corson alloy is used. In addition, the heat radiating portion 33 may be made of a stainless-based or iron-based alloy or the like.
 板バネ部70は、基体部71から一方向に延びる長尺板を、その中間付近に設けられた屈曲部72で反対方向に折り曲げて構成される。また長尺板を基体部71に接続する根元部分も、屈曲部72と同様の方向に屈曲部72よりも小さい角度で折り曲げられる。これにより、長尺板は、根元部分と屈曲部72との2か所で曲げられた板バネとなる。また、板バネ部70の先端にはヨーク57の背面58と接触する湾曲部73が形成される。
 板バネ部70の自然長(基体部71から見た湾曲部73までの距離)は、後方空洞1aの前後方向のサイズ、すなわちヨーク57の背面58から放熱板43の前側(内側)の面までの距離よりも長く設定される。
The leaf spring portion 70 is constructed by bending a long plate extending in one direction from the base portion 71 in the opposite direction at a bending portion 72 provided near the middle thereof. Also, the root portion connecting the long plate to the base portion 71 is bent in the same direction as the bent portion 72 at an angle smaller than that of the bent portion 72 . As a result, the long plate becomes a plate spring that is bent at two points, the root portion and the bent portion 72 . A curved portion 73 that contacts the back surface 58 of the yoke 57 is formed at the tip of the leaf spring portion 70 .
The natural length of the leaf spring portion 70 (the distance from the base portion 71 to the curved portion 73 as viewed from the base portion 71) is the size of the rear cavity 1a in the front-rear direction, that is, from the rear surface 58 of the yoke 57 to the front (inner) surface of the heat sink 43. is set longer than the distance of
 図4に示すように、基体部71は、一方向に延びる長手部材であり、複数の板バネ部70がそれぞれ接続される。具体的には、基体部71には、4つの板バネ部70が長手方向に対して線対称に接続される。例えば、基体部71の長手方向に沿って板バネ部70のペアが2か所に配置される。板バネ部70のペアは、基体部71の長手方向と直交して互いに反対方向に延びる長尺板のペアを屈曲させて構成される。また各板バネ部70の根元は、各々の湾曲部73が一定の間隔をあけて配置されるように折り曲げられる。
 また基体部71は、放熱板43の取付部66が挿入される取付孔74を有する。図4に示す例では、各板バネ部70のペアが接続する位置に合わせて2つの取付孔74が形成される。放熱板43には、これらの取付孔74に挿入可能なように取付部66が設けられる。
As shown in FIG. 4, the base portion 71 is a longitudinal member extending in one direction, to which a plurality of plate spring portions 70 are connected respectively. Specifically, four plate spring portions 70 are connected to the base portion 71 in line symmetry with respect to the longitudinal direction. For example, two pairs of leaf spring portions 70 are arranged along the longitudinal direction of the base portion 71 . The pair of leaf spring portions 70 is formed by bending a pair of long plates extending in mutually opposite directions perpendicular to the longitudinal direction of the base portion 71 . Further, the base of each plate spring portion 70 is bent so that each curved portion 73 is arranged at a constant interval.
The base portion 71 also has a mounting hole 74 into which the mounting portion 66 of the heat sink 43 is inserted. In the example shown in FIG. 4, two mounting holes 74 are formed in accordance with the positions where the pairs of leaf spring portions 70 are connected. Mounting portions 66 are provided on the radiator plate 43 so as to be insertable into these mounting holes 74 .
 放熱部33は、放熱板43の取付部66に取付孔74を挿入して放熱板43に固定される。放熱部33を固定する方法としては、例えば溶接やカシメ止め等が用いられる。これにより、放熱部33と放熱板43とを良好に熱接触させることが可能となり、放熱効率を十分に向上することが可能となる。この他、放熱部33を固定する方法としてねじ止め等が用いられてもよい。 The heat radiating portion 33 is fixed to the heat radiating plate 43 by inserting the mounting hole 74 into the mounting portion 66 of the heat radiating plate 43 . As a method for fixing the heat radiating portion 33, for example, welding, crimping, or the like is used. As a result, the heat dissipation portion 33 and the heat dissipation plate 43 can be brought into good thermal contact with each other, and the heat dissipation efficiency can be sufficiently improved. In addition, screwing or the like may be used as a method for fixing the heat radiating portion 33 .
 放熱板43に固定された放熱部33は、リアケース41をフロントケース40に嵌め込む際に、ヨーク57の背面58に接触し、板バネ部70は後方空洞1aのサイズまで縮められる。従ってヨーク57の背面58には、前側に押す方向に板バネ部70の復元力が作用する。この結果、スピーカユニット31は、フロントケース40の内壁に設けられたシール部材60に押し付けられる。
 このように、放熱部33は、リアケース41(放熱板43)に固定され、スピーカユニット31をシール部材60に押し付ける。
When the rear case 41 is fitted into the front case 40, the heat radiating portion 33 fixed to the heat radiating plate 43 contacts the rear surface 58 of the yoke 57, and the leaf spring portion 70 is contracted to the size of the rear cavity 1a. Therefore, the restoring force of the plate spring portion 70 acts on the rear surface 58 of the yoke 57 in the direction of pushing it forward. As a result, the speaker unit 31 is pressed against the seal member 60 provided on the inner wall of the front case 40 .
In this manner, the heat dissipation portion 33 is fixed to the rear case 41 (heat dissipation plate 43 ) and presses the speaker unit 31 against the sealing member 60 .
 これにより、例えばスピーカユニット31とフロントケース40との接続を強化することが可能となる。また板バネ部70がスピーカケース32を押し付けることで、振動板34の振動に合わせてスピーカケース32に発生する不要な振動等を大幅に抑制することが可能となる。これにより、スピーカ装置30の音質を向上することが可能となる。
 また、不必要な振動によるエネルギーの消費がなくなるため、エネルギー効率のよいスピーカ装置30を実現することが可能となる。
 さらに、シール部材60が防水シールとして構成された防水スピーカでは、背面58からの加圧で防水シールの密着性が向上し、防水不良を削減することが可能となる。
This makes it possible to strengthen the connection between the speaker unit 31 and the front case 40, for example. Further, by pressing the speaker case 32 with the leaf spring portion 70, it is possible to greatly suppress unnecessary vibrations or the like generated in the speaker case 32 in accordance with the vibration of the diaphragm 34. FIG. Thereby, the sound quality of the speaker device 30 can be improved.
In addition, since energy consumption due to unnecessary vibration is eliminated, it is possible to realize the speaker device 30 with good energy efficiency.
Furthermore, in a waterproof speaker in which the sealing member 60 is configured as a waterproof seal, pressure from the rear surface 58 improves the adhesion of the waterproof seal, making it possible to reduce waterproof failures.
 また上記したように、放熱部33には、線対称に配置された複数の板バネ部70が設けられる。また、放熱板43の取付部66の位置は、例えば放熱部33の2つの取付孔74の中間点(すなわち、4つの板バネ部70の中心点)が、スピーカユニット31のボイスコイルの中心軸と一致するように設定される。これにより、スピーカユニット31をフロントケース40(シール部材60)に均等に押し付けることが可能となる。
 このように、複数の板バネ部70は、スピーカユニット31をスピーカケース32(フロントケース40)に均等に押し付けるように配置される。
Further, as described above, the heat radiation portion 33 is provided with a plurality of leaf spring portions 70 arranged line-symmetrically. The position of the mounting portion 66 of the heat sink 43 is such that, for example, the midpoint between the two mounting holes 74 of the heat sink 33 (that is, the center point of the four leaf spring portions 70) is the central axis of the voice coil of the speaker unit 31. is set to match This makes it possible to evenly press the speaker unit 31 against the front case 40 (sealing member 60).
In this manner, the plurality of plate spring portions 70 are arranged so as to evenly press the speaker unit 31 against the speaker case 32 (front case 40).
 これにより、例えばスピーカユニット31からシール部材60に加わる力に偏りが生じるといった事態を回避することが可能となる。この結果、スピーカユニット31とフロントケース40との接続をスピーカユニット31の全周にわたって均等に強化することが可能となる。
 特に、防水スピーカでは、防水シールの密着性を偏りなく向上させることが可能であり、高い防水性能を発揮することが可能となる。
This makes it possible to avoid a situation in which the force applied from the speaker unit 31 to the sealing member 60 is biased. As a result, the connection between the speaker unit 31 and the front case 40 can be uniformly strengthened over the entire circumference of the speaker unit 31 .
In particular, in a waterproof speaker, it is possible to uniformly improve the adhesion of the waterproof seal, and it is possible to exhibit high waterproof performance.
 ここで、図5及び図3Bを参照してスピーカユニット31で発生した熱の流れについて説明する。図5及び図3Bには、熱の流れが黒色の矢印を用いて模式的に図示されている。
 スピーカユニット31では、例えばボイスコイル50が主な発熱源となる。ボイスコイル50で発生した熱は、ギャップ52を介して第1のマグネット55aや第2のマグネット55bに伝搬する。各マグネットの熱は、ヨーク57に伝搬する。
Here, the flow of heat generated in the speaker unit 31 will be described with reference to FIGS. 5 and 3B. 5 and 3B schematically illustrate heat flow using black arrows.
In the speaker unit 31, for example, the voice coil 50 is the main heat source. The heat generated by the voice coil 50 propagates through the gap 52 to the first magnet 55a and the second magnet 55b. Heat from each magnet propagates to the yoke 57 .
 ヨーク57の背面には、放熱部33の板バネ部70が接続される。ヨーク57の熱は、板バネ部70の先端(湾曲部73)から板バネ部70に伝搬し、基体部71に伝搬する。基体部71は放熱板43に接続されており、基体部71の熱は、放熱板43に伝搬する。このように、本実施形態では、ヨーク57の背面58側が空洞(後方空洞1)であるにも関わらず、放熱部33を設けることで、ヨーク57の背面58側からスピーカユニット31の熱を吸い上げることが可能となっている。 A leaf spring portion 70 of the heat dissipation portion 33 is connected to the back surface of the yoke 57 . The heat of the yoke 57 propagates from the tip (curved portion 73 ) of the leaf spring portion 70 to the leaf spring portion 70 and then to the base portion 71 . The base portion 71 is connected to the heat sink 43 , and the heat of the base portion 71 propagates to the heat sink 43 . As described above, in the present embodiment, although the back surface 58 side of the yoke 57 is hollow (rear cavity 1), by providing the heat dissipation portion 33, the heat of the speaker unit 31 is absorbed from the back surface 58 side of the yoke 57. It is possible.
 放熱板43に伝搬した熱は、図3Bに示すように、放熱端子44から端末装置100の本体に伝搬する。これにより、比較的大きな熱容量を持った端末装置100の筐体等に、スピーカユニット31の熱を逃がすことが可能となる。
 このように、放熱部33及び放熱板43を設けることで、スピーカユニット31の実質的な熱容量や放熱面積が大幅に増大する。この結果スピーカユニット31の冷却効率が十分に向上し、大電流の音声信号に対応することが可能となる。この結果、音圧レベルやダイナミックレンジを大きくとることが可能となり、スピーカ装置30の音質を十分に向上することが可能となる。
The heat propagated to the heat sink 43 propagates from the heat dissipation terminal 44 to the main body of the terminal device 100 as shown in FIG. 3B. As a result, the heat of the speaker unit 31 can be released to the housing of the terminal device 100 having a relatively large heat capacity.
By providing the heat dissipation portion 33 and the heat dissipation plate 43 in this manner, the substantial heat capacity and heat dissipation area of the speaker unit 31 are greatly increased. As a result, the cooling efficiency of the speaker unit 31 is sufficiently improved, and it becomes possible to cope with large-current audio signals. As a result, the sound pressure level and dynamic range can be increased, and the sound quality of the speaker device 30 can be sufficiently improved.
 図6は、スピーカ装置30を搭載した端末装置100の断面構成例を示す模式図である。ここでは、スピーカ装置30の上下方向及び左右方向が、端末装置100の上下方向及び左右方向となるように、スピーカ装置30が端末装置100に搭載される。
 図6には、XZ面で切断した端末装置100の断面図が模式的に図示されている。図中の右側が端末装置100(スピーカ装置30)の上側となる。図中の上側が端末装置100(スピーカ装置30)の前側となる。
FIG. 6 is a schematic diagram showing a cross-sectional configuration example of the terminal device 100 in which the speaker device 30 is mounted. Here, the speaker device 30 is mounted on the terminal device 100 so that the vertical direction and the horizontal direction of the speaker device 30 correspond to the vertical direction and the horizontal direction of the terminal device 100 .
FIG. 6 schematically shows a cross-sectional view of the terminal device 100 cut along the XZ plane. The right side in the drawing is the upper side of the terminal device 100 (speaker device 30). The upper side in the figure is the front side of the terminal device 100 (speaker device 30).
 端末装置100は、ディスプレイ10と、本体筐体11と、前面ガラス12と、背面カバー13とを有する。
 本体筐体11は、スピーカ装置30やディスプレイ10を支持する端末装置100のフレーム部材である。図6に示す例では、本体筐体11は端末装置100の上下方向に沿って延在する板状の内部フレーム14と、端末装置100の上側に設けられ内部フレーム14と接続する上端フレーム15とが模式的に図示されている。
The terminal device 100 has a display 10 , a main housing 11 , a front glass 12 and a rear cover 13 .
The main housing 11 is a frame member of the terminal device 100 that supports the speaker device 30 and the display 10 . In the example shown in FIG. 6, the main body housing 11 includes a plate-shaped inner frame 14 extending along the vertical direction of the terminal device 100 and an upper end frame 15 provided on the upper side of the terminal device 100 and connected to the inner frame 14 . is schematically illustrated.
 内部フレーム14には、スピーカ装置30の前側開口部37と略同形状のフレーム開口部16が設けられる。スピーカ装置30は、フレーム開口部16と前側開口部37とが平面視で重なるように、内部フレーム14の後側にシール部材17を介して接続される。シール部材17は、フレーム開口部16の全周を覆うように構成された環状の粘着シールである。シール部材17としては、例えば防水シールが用いられる。 The inner frame 14 is provided with a frame opening 16 having substantially the same shape as the front opening 37 of the speaker device 30 . The speaker device 30 is connected to the rear side of the inner frame 14 via the seal member 17 so that the frame opening 16 and the front opening 37 overlap in plan view. The seal member 17 is an annular adhesive seal configured to cover the entire circumference of the frame opening 16 . A waterproof seal, for example, is used as the seal member 17 .
 ディスプレイ10は、内部フレーム14の前側の面に配置される。また前面ガラス12はディスプレイ10の前側の面に配置される。
 前面ガラス12は、ユーザがタッチ操作等を行うタッチ面として機能する。
 背面カバー13は、端末装置100の後側を覆うように配置される平板状の部材である。
 背面カバー13は、例えばスピーカ装置30(放熱板43)の後側の面に接してもよい。あるいは、背面カバー13とスピーカ装置30との間に他の素子や部材が設けられてもよい。背面カバー13としては、例えばガラス部材を用いて構成されたカバー(背面ガラス)が用いられる。この他、樹脂部材や金属部材を用いて背面カバー13が構成されてもよい。
The display 10 is arranged on the front surface of the inner frame 14 . A front glass 12 is arranged on the front surface of the display 10 .
The front glass 12 functions as a touch surface on which a user performs touch operations and the like.
The rear cover 13 is a plate-like member arranged to cover the rear side of the terminal device 100 .
The rear cover 13 may be in contact with, for example, the rear surface of the speaker device 30 (radiator plate 43). Alternatively, another element or member may be provided between the rear cover 13 and the speaker device 30 . As the back cover 13, for example, a cover (back glass) made of a glass member is used. In addition, the back cover 13 may be configured using a resin member or a metal member.
 図6に示す断面では、ディスプレイ10は、ディスプレイ10の上側(図中の右側)の端部が、上端フレーム15側の内部フレーム14まで到達しないように構成される。また前面ガラス12の上側(図中の右側)の端部と上端フレーム15との間には開口窓20が形成される。この結果、ディスプレイ10の上側の端部から開口窓20にかけて、フレーム開口部16に連通する空間
が形成される。
In the cross section shown in FIG. 6, the display 10 is configured such that the upper (right side in the drawing) edge of the display 10 does not reach the inner frame 14 on the upper end frame 15 side. An opening window 20 is formed between the upper end (right side in the drawing) of the front glass 12 and the upper end frame 15 . As a result, a space communicating with the frame opening 16 is formed from the upper edge of the display 10 to the opening window 20 .
 例えば、スピーカ装置30(振動板34)から出力した音声3(図中の白抜きの矢印)は、スピーカ装置30の前側開口部37と内部フレーム14のフレーム開口部16とを通過してディスプレイ10の上側に形成された空間を通り、開口窓20から出力される。これにより、スピーカ装置30の音声を、端末装置100の外側に出力することが可能となる。
 なお、開口窓20等が設けられる領域は、例えばディスプレイ10の上側に形成される切り欠き(ノッチ)等を利用して構成されてもよい。
For example, the sound 3 (white arrow in the figure) output from the speaker device 30 (diaphragm 34) passes through the front opening 37 of the speaker device 30 and the frame opening 16 of the internal frame 14 to the display 10. is output from the opening window 20 through the space formed above. This makes it possible to output the sound of the speaker device 30 to the outside of the terminal device 100 .
Note that the area where the opening window 20 and the like are provided may be configured using a cutout (notch) or the like formed on the upper side of the display 10, for example.
 このように、端末装置100では、スピーカ装置30は、ディスプレイ10と直交する方向(Z方向)から見て、振動板34の少なくとも一部がディスプレイ10と重なるように配置される。これにより、ディスプレイ10の裏側にスピーカ装置30が配置されるため、ベゼルの薄い端末装置100等を容易に実現することが可能となる。 Thus, in the terminal device 100 , the speaker device 30 is arranged so that at least a portion of the diaphragm 34 overlaps the display 10 when viewed from the direction (Z direction) perpendicular to the display 10 . Accordingly, since the speaker device 30 is arranged on the back side of the display 10, it is possible to easily realize the terminal device 100 or the like with a thin bezel.
 上記したように、スピーカ装置30には、後方空洞1aが設けられるため、スピーカ装置30の厚さは、スピーカユニット31単体の厚さに比べて大きくなる。一方で、後方空洞1aに設けられる板バネ等の放熱部33は、容積が十分に小さく、後方空洞1aを占有するということはない。このため、後方空洞1aの厚さが薄く設定される場合であっても、十分な容積空間を確保することが可能となる。
 このように、本技術を用いることで、ディスプレイ10の背面に配置可能な厚さでありながら、平面サイズが十分にコンパクトで、音質の良いスピーカ装置30を提供することが可能となる。
As described above, since the speaker device 30 is provided with the rear cavity 1a, the thickness of the speaker device 30 is larger than the thickness of the speaker unit 31 alone. On the other hand, the heat radiating portion 33 such as a plate spring provided in the rear cavity 1a has a sufficiently small volume and does not occupy the rear cavity 1a. Therefore, even if the thickness of the rear cavity 1a is set thin, it is possible to secure a sufficient volumetric space.
In this way, by using the present technology, it is possible to provide the speaker device 30 that has a thickness that allows it to be arranged on the back surface of the display 10, has a sufficiently compact planar size, and has good sound quality.
 以上、本実施形態に係るスピーカ装置30では、スピーカユニット31が振動板34を露出させた状態でスピーカケース32に収容される。またスピーカケース32は、スピーカユニット31の振動板34とは反対側に後方空洞1aを形成する。この後方空洞1aにはスピーカユニット31の熱をスピーカケース32側に伝える放熱部33が設けられる。これにより、振動板34とは反対側の後方空洞1aを利用してスピーカユニット31の放熱が可能となり、平面サイズを広げることなく音質を向上することが可能となる。 As described above, in the speaker device 30 according to the present embodiment, the speaker unit 31 is accommodated in the speaker case 32 with the diaphragm 34 exposed. Further, the speaker case 32 forms a rear cavity 1a on the side opposite to the diaphragm 34 of the speaker unit 31 . A radiator 33 for transmitting heat from the speaker unit 31 to the speaker case 32 is provided in the rear cavity 1a. As a result, heat can be dissipated from the speaker unit 31 using the rear cavity 1a on the side opposite to the diaphragm 34, and sound quality can be improved without increasing the planar size.
 図7は、比較例として挙げるスピーカ装置を示す模式図である。
 図7Aは、スピーカ装置150を後側から見た平面図である。また図7Bは、スピーカ装置150を図7Aに示すB-B'線で切断した断面図である。
 スピーカ装置150では、スピーカユニット151の後側(ヨークの背面)が露出するように、スピーカケース152が構成される。スピーカユニット151の後側には、放熱用のグラファイトシート153が張り付けられる。
FIG. 7 is a schematic diagram showing a speaker device given as a comparative example.
FIG. 7A is a plan view of the speaker device 150 viewed from the rear side. 7B is a cross-sectional view of the speaker device 150 taken along line BB' shown in FIG. 7A.
In the speaker device 150, the speaker case 152 is configured such that the rear side of the speaker unit 151 (back surface of the yoke) is exposed. A graphite sheet 153 for heat dissipation is attached to the rear side of the speaker unit 151 .
 このように、スピーカユニット151の後側を露出する構成では、厚み方向(前後方向)でボックス容積を稼ぐことができない。このため、図7Bに示すように、スピーカユニット151の側方(縦方向や横方向)に空洞1を広げて容積を確保する必要がある。この結果、スピーカ装置150の平面サイズが拡大し、装置レイアウトの自由度を低下させるといったことがあり得る。また、接着剤等を用いてスピーカユニット151の周囲を密閉する必要があり、製造工程が複雑になる可能性がある。さらに、放熱のためだけにグラファイトシート153が必要となり、装置コストが増大する可能性がある。
 また、スピーカユニット151の振動板154が設けられる側に金属板等を配置し、空気を介して放熱を図るといった方法も考えられる。しかしながら、この方法は、空気を媒介とするため、スピーカユニット151の熱を直接逃がす方法と比べて、冷却効率が低いと考えられる。
In this manner, with the configuration in which the rear side of the speaker unit 151 is exposed, it is not possible to increase the volume of the box in the thickness direction (front-rear direction). Therefore, as shown in FIG. 7B, it is necessary to widen the cavity 1 laterally (in the vertical direction and the horizontal direction) of the speaker unit 151 to secure the volume. As a result, the planar size of the speaker device 150 is increased, which may reduce the degree of freedom in device layout. In addition, it is necessary to seal the speaker unit 151 with an adhesive or the like, which may complicate the manufacturing process. Furthermore, the graphite sheet 153 is required only for heat dissipation, which may increase the device cost.
Also, a method of arranging a metal plate or the like on the side of the speaker unit 151 on which the diaphragm 154 is provided to dissipate heat through the air is also conceivable. However, since this method uses air as a medium, it is considered that the cooling efficiency is low compared to the method of releasing the heat of the speaker unit 151 directly.
 本実施形態に係るスピーカ装置30では、スピーカユニット31の振動板34とは反対側に後方空洞1aが形成される。また後方空洞1aに設けられた放熱部33により、スピーカユニット31の熱は、スピーカケース32側に伝えられる。これにより、放熱能力が向上するため、ボイスコイル50に入力できる入力電力が向上する。この結果、スピーカ装置30の音圧レベルやダイナミックレンジ等を十分に向上することが可能となる。 In the speaker device 30 according to this embodiment, the rear cavity 1a is formed on the side of the speaker unit 31 opposite to the diaphragm 34 . Further, the heat of the speaker unit 31 is transmitted to the speaker case 32 side by the heat radiation portion 33 provided in the rear cavity 1a. As a result, the heat dissipation capability is improved, so the input power that can be input to the voice coil 50 is improved. As a result, the sound pressure level, dynamic range, etc. of the speaker device 30 can be sufficiently improved.
 また、スピーカ装置30は、スピーカユニット31の後側(ヨーク57の背面58)を露出させる必要がないため、厚さ方向に容積を確保することが可能となる。これにより、低音等の再生能力が高く、平面サイズがコンパクトな装置を実現することが可能となる。また装置レイアウトの自由度を向上することが可能となる。 In addition, since the speaker device 30 does not need to expose the rear side of the speaker unit 31 (the back surface 58 of the yoke 57), it is possible to secure a volume in the thickness direction. As a result, it is possible to realize a device that has a high reproduction capability for low tones and the like and that has a compact planar size. In addition, it is possible to improve the degree of freedom in device layout.
 また放熱部33としては、板バネ等のバネ部材が用いられる。この場合、放熱部33が占有する空間は非常に小さく、後方空洞1aの容積の減少に伴う音質への影響(容積影響)等を最小限にとどめることが可能である。
 またスピーカユニット31をバネで押さえることで、スピーカユニット31の振動が低減し、音質を向上することが可能となる。また防水スピーカの場合には、背面からの加圧で防水両面テープの密着性が向上し、防水不良を削減することや、防水性能を向上することが可能となる。
A spring member such as a leaf spring is used as the heat radiating portion 33 . In this case, the space occupied by the heat radiating portion 33 is very small, and it is possible to minimize the effect (volume effect) on the sound quality due to the reduction in the volume of the rear cavity 1a.
By pressing the speaker unit 31 with a spring, the vibration of the speaker unit 31 can be reduced and the sound quality can be improved. Moreover, in the case of a waterproof speaker, pressure from the back improves the adhesion of the waterproof double-sided tape, making it possible to reduce waterproof defects and improve waterproof performance.
 また図5等に示すように、ヨーク57は密閉容器内で独立した金属である。本実施形態では、このようなヨーク57に対して金属製の放熱部33が接続される。これにより、静電気等が発生した場合でも、高い電位をGNDに逃がすことが可能となり、ESD(Electrostatic Discharge)性能を向上することが可能となる。 Also, as shown in FIG. 5 and the like, the yoke 57 is an independent metal within the closed container. In this embodiment, the metal heat dissipation portion 33 is connected to such a yoke 57 . As a result, even when static electricity or the like is generated, a high potential can be released to GND, and ESD (Electrostatic Discharge) performance can be improved.
 <その他の実施形態>
 本技術は、以上説明した実施形態に限定されず、他の種々の実施形態を実現することができる。
<Other embodiments>
The present technology is not limited to the embodiments described above, and various other embodiments can be implemented.
 上記では、平板型の振動板を備える薄型のスピーカユニットについて説明した。振動板の形状やスピーカユニットの形状は限定されない。
 例えばドーム型、コーン型、ホーン型等の振動板が用いられてもよい。また振動板の平面形状は、丸型、楕円型、矩形型といった任意の形状に設定されてよい。またスピーカユニットは必ずしも薄型である必要はなく、例えばスピーカの形式に合わせたスピーカユニットが用いられてよい。
In the above description, a thin speaker unit having a flat diaphragm has been described. The shape of the diaphragm and the shape of the speaker unit are not limited.
For example, a dome-shaped, cone-shaped, or horn-shaped diaphragm may be used. Further, the planar shape of the diaphragm may be set to any shape such as round, elliptical, or rectangular. Also, the speaker unit does not necessarily have to be thin, and for example, a speaker unit that matches the type of speaker may be used.
 また上記では、放熱部として、主に板バネを用いる例について説明した。例えば板バネに代えてコイルバネ等が設けられてもよい。また放熱部として用いられるバネの数は限定されず、例えば単一のバネを用いて放熱部が構成されてもよい。
 この他、放熱部の構成は限定されず、任意の熱伝導性部材が用いられてよい。例えば、後方空洞を介してスピーカユニットとケースとをつなぐ金属ワイヤや導電性シート等が用いられてもよい。また導電性スポンジ等が放熱部として用いられてもよい。
Moreover, in the above description, an example in which a leaf spring is mainly used as the heat radiation portion has been described. For example, a coil spring or the like may be provided instead of the leaf spring. Further, the number of springs used as the heat radiation part is not limited, and for example, the heat radiation part may be configured using a single spring.
In addition, the configuration of the heat radiating section is not limited, and any thermally conductive member may be used. For example, a metal wire, a conductive sheet, or the like may be used to connect the speaker unit and the case via the rear cavity. Also, a conductive sponge or the like may be used as the heat radiating portion.
 また放熱板は、スピーカケース(リアケース)の一部として構成されたが、例えば独立した部材として放熱板が設けられてもよい。この場合、例えば後側が開口していないリアケースを構成、リアケースの内側に放熱板を配置するといったことの可能である。あるいは、リアケースに開けた穴を通して、リアケースの外側に配置された放熱板に放熱部を接続させるといった構成も可能である。 Also, although the heat sink is configured as part of the speaker case (rear case), the heat sink may be provided as an independent member, for example. In this case, for example, it is possible to construct a rear case that is not open on the rear side and arrange a heat sink inside the rear case. Alternatively, a configuration is also possible in which the heat radiating section is connected to a heat radiating plate arranged outside the rear case through a hole opened in the rear case.
 以上説明した本技術に係る特徴部分のうち、少なくとも2つの特徴部分を組み合わせることも可能である。すなわち各実施形態で説明した種々の特徴部分は、各実施形態の区別なく、任意に組み合わされてもよい。また上記で記載した種々の効果は、あくまで例示であって限定されるものではなく、また他の効果が発揮されてもよい。 It is also possible to combine at least two characteristic portions among the characteristic portions according to the present technology described above. That is, various characteristic portions described in each embodiment may be combined arbitrarily without distinguishing between each embodiment. Moreover, the various effects described above are only examples and are not limited, and other effects may be exhibited.
 本開示において、「同じ」「等しい」「直交」等は、「実質的に同じ」「実質的に等しい」「実質的に直交」等を含む概念とする。例えば「完全に同じ」「完全に等しい」「完全に直交」等を基準とした所定の範囲(例えば±10%の範囲)に含まれる状態も含まれる。 In the present disclosure, "same", "equal", "orthogonal", etc. are concepts including "substantially the same", "substantially equal", "substantially orthogonal", and the like. For example, states included in a predetermined range (for example, a range of ±10%) based on "exactly the same", "exactly equal", "perfectly orthogonal", etc. are also included.
 なお、本技術は以下のような構成も採ることができる。
(1)振動板を有するスピーカユニットと、
 前記スピーカユニットの前記振動板とは反対側に空洞を形成し、前記振動板が露出するように前記スピーカユニットを収容するケース部と、
 前記空洞に設けられ前記スピーカユニットの熱を前記ケース部側に伝える放熱部と
 を具備するスピーカ装置。
(2)(1)に記載のスピーカ装置であって、
 前記スピーカユニットは、前記振動板と一体的に振動するボイスコイルと、前記ボイスコイルに作用する磁界を発生させるマグネットと、前記マグネットを挟んで前記振動板とは反対側に設けられ前記マグネットが接続されるヨークとを有し、
 前記放熱部は、前記ヨークと前記ケース部とを熱的に接続する
 スピーカ装置。
(3)(1)又は(2)に記載のスピーカ装置であって、
 前記放熱部は、熱伝導部材を用いて構成された少なくとも1つのバネを有する
 スピーカ装置。
(4)(3)に記載のスピーカ装置であって、
 前記少なくとも1つのバネは、板バネである
 スピーカ装置。
(5)(3)又は(4)に記載のスピーカ装置であって、
 前記少なくとも1つのバネは、前記スピーカユニットを前記ケース部に均等に押し付けるように配置された複数のバネを含む
 スピーカ装置。
(6)(1)から(5)のうちいずれか1つに記載のスピーカ装置であって、
 前記ケース部は、さらに、前記空洞を挟んで前記スピーカユニットと対向する位置に設けられた放熱板を有し、
 前記放熱部は、前記放熱板に接続される
 スピーカ装置。
(7)(6)に記載のスピーカ装置であって、
 前記ケース部は、前記空洞を挟んで前記スピーカユニットと対向する位置に形成された後側開口部を有し、
 前記放熱板は、前記ケース部の前記後側開口部を覆うように配置される
 スピーカ装置。
(8)(6)又は(7)に記載のスピーカ装置であって、
 前記スピーカ装置は、電子機器に搭載され、
 前記放熱板は、前記電子機器の本体に接続される接続部を有する
 スピーカ装置。
(9)(8)に記載のスピーカ装置であって、
 前記接続部は、前記ケース部の外側に設けられる
 スピーカ装置。
(10)(1)から(9)のうちいずれか1つに記載のスピーカ装置であって、
 前記ケース部は、前記空洞に連通し前記スピーカユニットの側方にひろがる他の空洞を形成する
 スピーカ装置。
(11)(1)から(10)のうちいずれか1つに記載のスピーカ装置であって、
 前記ケース部は、前記振動板が露出するように前記スピーカユニットを保持するフロントケースと、前記フロントケースに接続され前記空洞を形成するリアケースとを有する
 スピーカ装置。
(12)(11)に記載のスピーカ装置であって、
 前記フロントケースは、前記振動板を露出させる前側開口部と、前記フロントケースの内側に前記前側開口部を囲うように設けられたシール部材とを有し、
 前記放熱部は、前記リアケースに固定され、前記スピーカユニットを前記シール部材に押し付ける
 スピーカ装置。
(13)(12)に記載のスピーカ装置であって、
 前記シール部材は、防水シールである
 スピーカ装置。
(14)音声信号を出力する出力部と
  振動板を有し、前記音声信号に応じて前記振動板を振動させるスピーカユニットと、
  前記スピーカユニットの前記振動板とは反対側に空洞を形成し、前記振動板が露出するように前記スピーカユニットを収容するケース部と、
  前記空洞に設けられ前記スピーカユニットの熱を前記ケース部側に伝導する放熱部と
 を有するスピーカ装置と、
 を具備する電子機器。
(15)(14)に記載の電子機器であって、さらに、
 画像を表示するディスプレイを具備し、
 前記スピーカ装置は、前記ディスプレイと直交する方向から見て、前記振動板の少なくとも一部が前記ディスプレイと重なるように配置される
 電子機器。
Note that the present technology can also adopt the following configuration.
(1) a speaker unit having a diaphragm;
a case portion that forms a cavity on the opposite side of the speaker unit to the diaphragm and houses the speaker unit so that the diaphragm is exposed;
A speaker device, comprising: a heat radiating section provided in the cavity for transferring heat of the speaker unit to the case section side.
(2) The speaker device according to (1),
The speaker unit includes a voice coil that vibrates integrally with the diaphragm; a magnet that generates a magnetic field that acts on the voice coil; and a yoke that is
The speaker device, wherein the radiator thermally connects the yoke and the case.
(3) The speaker device according to (1) or (2),
The speaker device, wherein the heat radiating section has at least one spring configured using a heat conducting member.
(4) The speaker device according to (3),
The speaker device, wherein the at least one spring is a leaf spring.
(5) The speaker device according to (3) or (4),
The speaker device, wherein the at least one spring includes a plurality of springs arranged to evenly press the speaker unit against the case.
(6) The speaker device according to any one of (1) to (5),
the case further includes a radiator plate provided at a position facing the speaker unit with the cavity interposed therebetween;
The speaker device, wherein the radiator is connected to the radiator plate.
(7) The speaker device according to (6),
The case portion has a rear opening formed at a position facing the speaker unit with the cavity interposed therebetween,
The speaker device, wherein the radiator plate is arranged to cover the rear opening of the case.
(8) The speaker device according to (6) or (7),
The speaker device is mounted on an electronic device,
The speaker device, wherein the radiator plate has a connecting portion connected to the main body of the electronic device.
(9) The speaker device according to (8),
The speaker device, wherein the connecting portion is provided outside the case portion.
(10) The speaker device according to any one of (1) to (9),
The case part forms another cavity communicating with the cavity and extending laterally of the speaker unit.
(11) The speaker device according to any one of (1) to (10),
A speaker device, wherein the case portion includes a front case that holds the speaker unit so that the diaphragm is exposed, and a rear case that is connected to the front case and forms the cavity.
(12) The speaker device according to (11),
The front case has a front opening that exposes the diaphragm, and a seal member provided inside the front case so as to surround the front opening,
The speaker device, wherein the heat radiating section is fixed to the rear case and presses the speaker unit against the seal member.
(13) The speaker device according to (12),
The speaker device, wherein the seal member is a waterproof seal.
(14) an output unit that outputs an audio signal; and a speaker unit that has a diaphragm and vibrates the diaphragm according to the audio signal;
a case portion that forms a cavity on the opposite side of the speaker unit to the diaphragm and houses the speaker unit so that the diaphragm is exposed;
a speaker device comprising: a heat radiating section provided in the cavity for conducting heat of the speaker unit to the case section;
An electronic device comprising
(15) The electronic device according to (14), further comprising:
Equipped with a display for displaying an image,
The speaker device is an electronic device arranged so that at least part of the diaphragm overlaps with the display when viewed from a direction perpendicular to the display.
 1…空洞
 1a…後方空洞
 1b…側方空洞
 3…音声
 10…ディスプレイ
 30…スピーカ装置
 31…スピーカユニット
 32…スピーカケース
 33…放熱部
 34…振動板
 37…前側開口部
 40…フロントケース
 41…リアケース
 43…放熱板
 44…放熱端子
 60…シール部材
 63…後側開口部
 70…板バネ部
 100…端末装置
REFERENCE SIGNS LIST 1 cavity 1a rear cavity 1b side cavity 3 sound 10 display 30 speaker device 31 speaker unit 32 speaker case 33 radiator 34 diaphragm 37 front opening 40 front case 41 rear DESCRIPTION OF SYMBOLS Case 43... Heat sink 44... Heat sink terminal 60... Sealing member 63... Rear opening 70... Plate spring part 100... Terminal device

Claims (15)

  1.  振動板を有するスピーカユニットと、
     前記スピーカユニットの前記振動板とは反対側に空洞を形成し、前記振動板が露出するように前記スピーカユニットを収容するケース部と、
     前記空洞に設けられ前記スピーカユニットの熱を前記ケース部側に伝える放熱部と
     を具備するスピーカ装置。
    a speaker unit having a diaphragm;
    a case portion that forms a cavity on the opposite side of the speaker unit to the diaphragm and houses the speaker unit so that the diaphragm is exposed;
    A speaker device, comprising: a heat radiating section provided in the cavity for transferring heat of the speaker unit to the case section side.
  2.  請求項1に記載のスピーカ装置であって、
     前記スピーカユニットは、前記振動板と一体的に振動するボイスコイルと、前記ボイスコイルに作用する磁界を発生させるマグネットと、前記マグネットを挟んで前記振動板とは反対側に設けられ前記マグネットが接続されるヨークとを有し、
     前記放熱部は、前記ヨークと前記ケース部とを熱的に接続する
     スピーカ装置。
    The speaker device according to claim 1,
    The speaker unit includes a voice coil that vibrates integrally with the diaphragm; a magnet that generates a magnetic field that acts on the voice coil; and a yoke that is
    The speaker device, wherein the radiator thermally connects the yoke and the case.
  3.  請求項1に記載のスピーカ装置であって、
     前記放熱部は、熱伝導部材を用いて構成された少なくとも1つのバネを有する
     スピーカ装置。
    The speaker device according to claim 1,
    The speaker device, wherein the heat radiating section has at least one spring configured using a heat conducting member.
  4.  請求項2に記載のスピーカ装置であって、
     前記少なくとも1つのバネは、板バネである
     スピーカ装置。
    The speaker device according to claim 2,
    The speaker device, wherein the at least one spring is a leaf spring.
  5.  請求項2に記載のスピーカ装置であって、
     前記少なくとも1つのバネは、前記スピーカユニットを前記ケース部に均等に押し付けるように配置された複数のバネを含む
     スピーカ装置。
    The speaker device according to claim 2,
    The speaker device, wherein the at least one spring includes a plurality of springs arranged to evenly press the speaker unit against the case.
  6.  請求項1に記載のスピーカ装置であって、
     前記ケース部は、さらに、前記空洞を挟んで前記スピーカユニットと対向する位置に設けられた放熱板を有し、
     前記放熱部は、前記放熱板に接続される
     スピーカ装置。
    The speaker device according to claim 1,
    the case further includes a radiator plate provided at a position facing the speaker unit with the cavity interposed therebetween;
    The speaker device, wherein the radiator is connected to the radiator plate.
  7.  請求項6に記載のスピーカ装置であって、
     前記ケース部は、前記空洞を挟んで前記スピーカユニットと対向する位置に形成された後側開口部を有し、
     前記放熱板は、前記ケース部の前記後側開口部を覆うように配置される
     スピーカ装置。
    The speaker device according to claim 6,
    The case portion has a rear opening formed at a position facing the speaker unit with the cavity interposed therebetween,
    The speaker device, wherein the radiator plate is arranged to cover the rear opening of the case.
  8.  請求項6に記載のスピーカ装置であって、
     前記スピーカ装置は、電子機器に搭載され、
     前記放熱板は、前記電子機器の本体に接続される接続部を有する
     スピーカ装置。
    The speaker device according to claim 6,
    The speaker device is mounted on an electronic device,
    The speaker device, wherein the radiator plate has a connecting portion connected to the main body of the electronic device.
  9.  請求項8に記載のスピーカ装置であって、
     前記接続部は、前記ケース部の外側に設けられる
     スピーカ装置。
    The speaker device according to claim 8,
    The speaker device, wherein the connecting portion is provided outside the case portion.
  10.  請求項1に記載のスピーカ装置であって、
     前記ケース部は、前記空洞に連通し前記スピーカユニットの側方にひろがる他の空洞を形成する
     スピーカ装置。
    The speaker device according to claim 1,
    The case part forms another cavity communicating with the cavity and extending laterally of the speaker unit.
  11.  請求項1に記載のスピーカ装置であって、
     前記ケース部は、前記振動板が露出するように前記スピーカユニットを保持するフロントケースと、前記フロントケースに接続され前記空洞を形成するリアケースとを有する
     スピーカ装置。
    The speaker device according to claim 1,
    A speaker device, wherein the case portion includes a front case that holds the speaker unit so that the diaphragm is exposed, and a rear case that is connected to the front case and forms the cavity.
  12.  請求項11に記載のスピーカ装置であって、
     前記フロントケースは、前記振動板を露出させる前側開口部と、前記フロントケースの内側に前記前側開口部を囲うように設けられたシール部材とを有し、
     前記放熱部は、前記リアケースに固定され、前記スピーカユニットを前記シール部材に押し付ける
     スピーカ装置。
    The speaker device according to claim 11,
    The front case has a front opening that exposes the diaphragm, and a seal member provided inside the front case so as to surround the front opening,
    The speaker device, wherein the heat radiating section is fixed to the rear case and presses the speaker unit against the seal member.
  13.  請求項12に記載のスピーカ装置であって、
     前記シール部材は、防水シールである
     スピーカ装置。
    13. The speaker device according to claim 12,
    The speaker device, wherein the seal member is a waterproof seal.
  14.  音声信号を出力する出力部と
      振動板を有し、前記音声信号に応じて前記振動板を振動させるスピーカユニットと、
      前記スピーカユニットの前記振動板とは反対側に空洞を形成し、前記振動板が露出するように前記スピーカユニットを収容するケース部と、
      前記空洞に設けられ前記スピーカユニットの熱を前記ケース部側に伝導する放熱部と
     を有するスピーカ装置と
     を具備する電子機器。
    an output unit that outputs an audio signal; and a speaker unit that has a diaphragm and vibrates the diaphragm according to the audio signal;
    a case portion that forms a cavity on the opposite side of the speaker unit to the diaphragm and houses the speaker unit so that the diaphragm is exposed;
    An electronic device comprising: a speaker device comprising: a radiator provided in the cavity for conducting heat of the speaker unit to the case side.
  15.  請求項14に記載の電子機器であって、さらに、
     画像を表示するディスプレイを具備し、
     前記スピーカ装置は、前記ディスプレイと直交する方向から見て、前記振動板の少なくとも一部が前記ディスプレイと重なるように配置される
     電子機器。
    15. The electronic device of claim 14, further comprising:
    Equipped with a display for displaying an image,
    The speaker device is an electronic device arranged so that at least part of the diaphragm overlaps with the display when viewed from a direction perpendicular to the display.
PCT/JP2021/013875 2021-03-31 2021-03-31 Speaker device and electronic device WO2022208743A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
PCT/JP2021/013875 WO2022208743A1 (en) 2021-03-31 2021-03-31 Speaker device and electronic device
JP2023510035A JPWO2022208743A1 (en) 2021-03-31 2021-03-31
CN202180096161.3A CN117044236A (en) 2021-03-31 2021-03-31 Speaker device and electronic apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/013875 WO2022208743A1 (en) 2021-03-31 2021-03-31 Speaker device and electronic device

Publications (1)

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Country Link
JP (1) JPWO2022208743A1 (en)
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09247780A (en) * 1996-03-06 1997-09-19 Matsushita Electric Ind Co Ltd Speaker unit
JP2011139254A (en) * 2009-12-28 2011-07-14 Panasonic Corp Diaphragm for speaker, speaker using the same, and portable terminal unit
JP2013085253A (en) * 2011-10-05 2013-05-09 Apple Inc Speaker magnet thermal management
CN110996234A (en) * 2019-12-20 2020-04-10 歌尔股份有限公司 Speaker module and electronic equipment

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09247780A (en) * 1996-03-06 1997-09-19 Matsushita Electric Ind Co Ltd Speaker unit
JP2011139254A (en) * 2009-12-28 2011-07-14 Panasonic Corp Diaphragm for speaker, speaker using the same, and portable terminal unit
JP2013085253A (en) * 2011-10-05 2013-05-09 Apple Inc Speaker magnet thermal management
CN110996234A (en) * 2019-12-20 2020-04-10 歌尔股份有限公司 Speaker module and electronic equipment

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CN117044236A (en) 2023-11-10

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