CN115225746B

CN115225746B - Electronic device

Info

Publication number: CN115225746B
Application number: CN202211148894.XA
Authority: CN
Inventors: 吴江; 王传果
Original assignee: Honor Device Co Ltd
Current assignee: Honor Device Co Ltd
Priority date: 2022-09-21
Filing date: 2022-09-21
Publication date: 2023-02-17
Anticipated expiration: 2042-09-21
Also published as: CN115225746A

Abstract

The application provides an electronic device, which comprises a middle frame, a circuit board, a support and a first loudspeaker unit, wherein the circuit board comprises a mounting surface, and the support comprises an avoidance groove; the avoiding groove is sunken towards the support along the thickness direction of the support, the first loudspeaker unit is positioned on the mounting surface and electrically connected with the circuit board, the circuit board and the support are stacked and arranged in the middle frame, and the first loudspeaker unit is contained in the avoiding groove in the thickness direction of the electronic equipment.

Description

Electronic device

Technical Field

The application relates to the technical field of communication equipment, in particular to electronic equipment.

Background

With the continuous development of science and technology, electronic devices such as mobile phones and the like are widely applied to daily life and work of people, and become necessary daily supplies for people. In the existing electronic equipment, a speaker module and a camera module occupy a large amount of space in the mobile phone, and particularly, the speaker module needs a certain space in thickness and needs to be provided with a through groove to avoid, so that the space of a circuit board is occupied, and the layout and use of devices of the circuit board are influenced; if the circuit board is avoided, the overall thickness of the electronic equipment is increased.

Disclosure of Invention

The application provides an electronic equipment realizes reducing the occupation space of speaker module on the circuit board, and avoids increasing electronic equipment thickness.

The electronic equipment comprises a middle frame, a circuit board, a support and a first loudspeaker unit, wherein the circuit board comprises a mounting surface, and the support comprises an avoidance groove; the avoiding groove is sunken in the support along the thickness direction of the support, the first loudspeaker unit is positioned on the mounting surface and electrically connected with the circuit board, the circuit board and the support are stacked and arranged in the middle frame, and the first loudspeaker unit is contained in the avoiding groove in the thickness direction of the electronic equipment.

In this application embodiment electronic equipment, install first speaker unit in the surface of circuit board, keep away the groove through setting up on the support and provide the space of thickness direction for first speaker unit, can avoid trompil on the circuit board, increase circuit board usable floor area, utilize the decoration space of camera module to accept the support moreover, can avoid increasing electronic equipment's thickness space.

In an embodiment, electronic equipment includes second speaker unit and goes out the sound seam, the center includes the mounting groove, the circuit board is including dodging the hole, it follows to dodge the hole the thickness direction of circuit board runs through the circuit board, the mounting groove along center thickness direction runs through the center, second speaker unit wears to locate dodge the hole, and cover the opening of mounting groove, the mounting groove forms the preceding sound chamber of second speaker unit, go out the sound seam intercommunication the preceding sound chamber of second speaker unit with electronic equipment's outside.

In one embodiment, the volume of the second speaker unit is smaller than the volume of the first speaker unit. In the outdoor scene, because the volume of the second loudspeaker unit is small, the front sound cavity is in a night environment, the second loudspeaker can be used as a high-pitch unit, and the first loudspeaker is used as a low-pitch unit, so that the stereo effect is improved.

In one embodiment, the first speaker unit is a high-pitch unit or a full-frequency unit, and the second speaker unit is a full-frequency unit. In this embodiment, have a plurality of speaker unit, can realize the multi-audio effect, moreover go out the gap of sound when the sound seam can regard as the conversation, because the people's ear can't laminate totally with a sound seam and seal, consequently the sound of going out the sound seam can outdiffusion, becomes lou sound, influences conversation privacy nature, and to this problem, first speaker unit sends the sound wave opposite with a sound seam phase place through the sound-emitting hole to offset the sound leakage of sound seam, promote conversation privacy nature.

In one embodiment, the middle frame is provided with an end part frame and a sound raising hole arranged on the end part frame, the avoiding groove comprises a groove bottom wall, a functional groove is sunken in the groove bottom wall, the first loudspeaker unit covers the functional groove, so that the functional groove forms a front sound cavity of the first loudspeaker, and the sound raising hole is communicated with the front sound cavity of the first loudspeaker unit and the outer part of the middle frame.

In one embodiment, the middle frame comprises a protruding block, a communicating groove is formed in the protruding block, the communicating groove extends along the thickness direction of the middle frame, the communicating groove is communicated with the sound raising hole, the support comprises a sound through hole, and the sound through hole is communicated with the front sound cavity of the first loudspeaker unit and the communicating groove. This embodiment simple structure is convenient for make, and first speaker unit passes through lead to sound hole, intercommunication groove and raise the sound hole and transmit sound to the electronic equipment outside.

In one embodiment, the bracket comprises a bracket body and a boss, the bracket body comprises a first surface and a second surface arranged opposite to the first surface, the boss is arranged on the second surface, and the avoiding groove is arranged on the first surface in a concave manner;

the mounting protrusion is further convexly arranged on the first face, the sound through hole comprises a first sound hole, a second sound hole and a third sound hole which are sequentially communicated, the first sound hole penetrates through the groove side wall of the functional groove along the length direction of the support, the second sound hole is arranged inside the boss and the mounting protrusion and extends along the thickness direction of the support, the third sound hole penetrates through the mounting protrusion, the bump is in butt joint with the mounting protrusion, and the third sound hole is opposite to and communicated with the communicating groove. The support utilizes self thickness and the installation bulge to set up logical sound hole, effectively utilizes partial structure, can save the support area.

In one embodiment, one end of the mounting protrusion extends along the width direction of the bracket to form an extending portion, the extending portion is located at one end of the mounting protrusion far away from the avoidance groove, and the third sound hole extends from the end of the mounting protrusion to the extending portion and extends along the length direction of the extending portion;

the communicating groove is formed by the fact that the upper surface of the protruding block is sunken towards the inner portion of the protruding block, the opening of the communicating groove is located on the surface of the protruding block, the communicating groove extends along the width direction of the middle frame, and the sound raising hole penetrates through one groove side wall of the communicating groove.

In one embodiment, the lug comprises a first inclined surface, the first inclined surface is obliquely arranged opposite to the end frame, and the sound-raising hole penetrates through the groove bottom wall of the communication groove and is communicated with the communication groove;

the mounting protrusion is provided with an extending portion, the extending portion is located the mounting protrusion is far away from one end of the avoiding groove, the extending portion comprises a second inclined surface, the second inclined surface faces away from the mounting protrusion and is compared with the first surface of the support in an inclined mode, the third sound hole penetrates through the second inclined surface, the first inclined surface is in butt joint with the second inclined surface, and the third sound hole is opposite to and communicated with the communicating groove. In this embodiment, the first inclined plane is disposed on the bump, so as to reduce the size of the bump, avoid the area of the notch on the circuit board from being too large, and save the area of the circuit board.

In one embodiment, the middle frame comprises a middle plate and the end frame connected with the middle plate, the middle plate comprises a first surface and a second surface arranged opposite to the first surface, and the protrusion is convexly arranged on the first surface of the middle plate and connected with the end frame;

the connecting grooves comprise a first connecting groove and a second connecting groove communicated with the first connecting groove, one opening of the first connecting groove is positioned on the surface, back to the middle plate, of the lug, and the other opening of the first connecting groove is positioned on one groove side wall of the second connecting groove; the opening of the second communicating groove is positioned on the second surface of the middle plate.

In one embodiment, the first connecting groove comprises a first groove side wall, the first groove side wall is inclined compared with the opening of the first connecting groove, and part of the sound raising holes penetrate through the first groove side wall;

the second communicating groove is formed by the second surface sinking towards the middle plate, the second communicating groove comprises a groove bottom wall and a sub groove, the sub groove is formed by the groove bottom wall sinking towards the inner part of the middle plate, the sub groove comprises two inclined side walls and a bottom wall connecting the two inclined side walls, the other part of the sound-raising holes penetrate through the bottom wall, and the other opening of the first communicating groove is located on one inclined side wall and faces the sound-raising holes. In this embodiment, set up the intercommunication groove through two faces at the center, promptly, set up special-shaped intercommunication groove, can reduce the volume of lug, and then reduce the area of the breach of seting up for the lug on the circuit board, and then save the area of circuit board.

In one embodiment, an opening of the third sound hole is located on the second inclined plane, the third sound hole includes a hole wall, an extending direction of the hole wall intersects an extending direction of the third sound hole, and an opening of the second sound hole penetrates through the hole wall to communicate with the third sound hole. The cross-sectional area of the third sound hole in the embodiment is larger than that of the second sound hole, the third sound hole is communicated with the communicating groove, the communication with the sound emitting hole is achieved, and the sound emitting sound effect can be improved.

In one embodiment, the electronic device comprises a camera module and a decoration, the decoration comprises an accommodating groove, the circuit board further comprises an installation avoiding hole, the installation avoiding hole penetrates through the circuit board along the thickness direction of the circuit board, and the installation avoiding hole and the first loudspeaker unit are arranged at intervals;

the camera module penetrates through the installation avoiding hole, the decorating part is installed on the middle frame, and the camera module and the lug of the support are contained in the containing groove. In this embodiment, the mount accommodating the first speaker unit is accommodated in the space of the decoration accommodating the camera module, thereby avoiding an increase in thickness of the electronic device.

In one embodiment, the electronic device comprises a screen, the middle frame comprises a middle plate, an end frame connected with the middle frame and a sound outlet groove, the middle plate comprises a first surface and a second surface arranged opposite to the first surface, the sound outlet groove is concavely arranged on the second surface, the sound outlet groove comprises a gap concavely arranged on the inner side surface of the end frame and a connecting area communicated with the mounting groove, the screen is arranged on the second surface and covers the connecting area, and the screen and the gap form the sound outlet gap. The sound outlet slot is arranged on one side of the display screen, so that a user can listen to sound conveniently.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required to be used in the embodiments of the present application will be described below.

Fig. 1 is a schematic structural diagram of an electronic device provided in an embodiment of the present application;

FIG. 2 is a schematic diagram of the electronic device shown in FIG. 1 at another angle;

FIG. 3 is a schematic diagram of an angularly exploded structure of the electronic device of FIG. 2;

FIG. 4 is a schematic diagram of an angularly exploded view of the electronic device of FIG. 1;

FIG. 5 is a schematic diagram of a middle frame of the electronic device shown in FIG. 3;

FIG. 6 is a schematic view of the middle frame of FIG. 4 at another angle;

FIG. 7 is an angled cross-sectional schematic view of the middle frame shown in FIG. 5;

FIG. 8 is a schematic cross-sectional view of one of the angles shown in FIG. 6;

FIG. 9 is a schematic diagram of a circuit board of the electronic device shown in FIG. 3;

FIG. 10 is an assembled view of a portion of the electronic device shown in FIG. 3;

FIG. 11 is a schematic diagram of a stand of the electronic device of FIG. 3;

FIG. 12 is a schematic view of the stent of FIG. 11 at another angle;

FIG. 13 is a schematic plan view of the bracket of FIG. 12;

FIG. 14 is a cross-sectional view of an angled, partial structure of the electronic device shown in FIG. 2;

FIG. 15 is a partial cross-sectional structural view at another angle of the electronic device shown in FIG. 2;

FIG. 16 is a cross-sectional view of the electronic device of FIG. 1;

FIG. 17 is a cross-sectional view of the electronic device of FIG. 1 at another angle;

fig. 18 is an exploded view of an electronic device according to a second embodiment of the present application;

FIG. 19 is a schematic view of the stand of the electronic device of FIG. 18 at another angle;

fig. 20 is an assembly diagram of a partial structure of an electronic device according to a second embodiment of the present application;

FIG. 21 is an assembled cross-sectional schematic view of the electronic device shown in FIG. 17;

fig. 22 is an exploded schematic view of an electronic device according to a third embodiment of the present application;

FIG. 23 is a schematic view of the electronic device of FIG. 22 shown in an angled configuration;

FIG. 24 is a schematic view of the electronic device of FIG. 22 shown in a configuration at another angle of the stand;

fig. 25 is an assembly diagram of a partial structure of an electronic device according to a third embodiment of the present application;

fig. 26 is an assembled angled cross-sectional schematic view of the electronic device shown in fig. 25.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application.

Referring to fig. 1 to fig. 2, fig. 1 is a schematic structural diagram of an electronic device 1000 according to an embodiment of the present disclosure, and fig. 2 is a schematic structural diagram of the electronic device 1000 shown in fig. 1 at another angle.

The electronic device 1000 may be a mobile phone, a tablet computer, a notebook computer, a car machine, an intelligent watch, an intelligent bracelet, a point of sale (POS) terminal, and other electronic products. In the embodiment of the present application, the electronic device 1000 is a mobile phone as an example. For convenience of description, the width direction of the electronic device 1000 is defined as an X-axis direction, the length direction of the electronic device 1000 is defined as a Y-axis direction, the thickness direction of the electronic device 1000 is defined as a Z-axis direction, and the X-axis direction, the Y-axis direction, and the Z-axis direction are perpendicular to each other. It should be noted that the terms "top", "bottom", "upper", "lower", "left" and "right" and other directional terms referred to in this application are described with reference to the orientation shown in fig. 1, and are used to indicate "top" in the positive direction toward the Y axis, "bottom" in the negative direction toward the Y axis, "up" in the positive direction toward the Z axis, "down" in the negative direction toward the Z axis, "right" in the positive direction toward the X axis, and "left" in the negative direction toward the X axis, and do not indicate or imply that the device or component to which the reference is made must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the application.

Referring to fig. 3 and 4, fig. 3 is an angle exploded schematic view of the electronic device 1000 shown in fig. 2, and fig. 4 is an angle exploded schematic view of the electronic device 1000 shown in fig. 1. The electronic device 1000 includes a housing 10, a screen 20, a circuit board 30, a bracket 40, a processor (not shown), a camera module, a speaker module (not shown), a power module (not shown), and a decoration 70. The screen 20 is installed at one side of the case 10. The circuit board 30, the bracket 40, the processor, the camera module, the speaker module and the power module are all installed inside the housing 10. The processor may be mounted to the circuit board 30 and electrically connected to the circuit board 30. The processor may be a Central Processing Unit (CPU) of the electronic device 1000. The decoration member 70 is installed at the other side of the case 10 and covers the bracket 40.

The speaker module is located on the top of the electronic device 1000 and serves as a top speaker module of the electronic device 1000. The speaker module includes a second speaker unit 63 and a first speaker unit 62. The second speaker unit 63 may be a high frequency unit, and may be used as an earpiece of the electronic device 1000. The second speaker unit 63 may receive the audio signal sent by the processor through the circuit board 30, and vibrate to generate sound according to the audio signal, and the sound is diffused to the external environment, so as to implement the sound generation of the earpiece of the electronic device 1000. The first speaker unit 62 is electrically connected to the circuit board 30 to make an electrical connection with the processor. The first speaker unit 62 may be a full frequency unit, and may be used as a speaker of the electronic device 1000, or may be a low frequency unit, so as to improve a stereo effect. The first speaker unit 62 may receive the audio signal sent by the processor through the circuit board 30, and vibrate to generate sound according to the audio signal, and the sound is diffused to the external environment, so as to realize the speaker sound generation of the electronic device 1000. In other embodiments, the second speaker unit 63 and the first speaker unit 62 may both be full frequency units, and the speaker module may generate sound through three channels, which is helpful to improve the sound quality of the speaker module. The electronic device 1000 is further provided with a speaker hole 80 and a sound outlet slit 90, and the speaker hole 80 and the sound outlet slit 90 of the embodiment are located at the top of the electronic device. In other embodiments, the second speaker unit 63 may be omitted, and after the omission, the sound emitting manner of the first speaker unit 62 may be through the sound emitting holes 80 and the sound emitting slits 90, or may be through the sound emitting holes 80 or the sound emitting slits 90.

In this embodiment, the housing 10 includes a middle frame 11 and a rear cover 18, and the rear cover 18 is mounted on one side of the middle frame 11. The rear cover 18 may be a battery cover of the electronic device 1000. The rear cover 18 is provided with a mounting hole 181, and the mounting hole 181 is located at the top of the rear cover 18 and penetrates the rear cover 18. That is, the mounting hole 181 penetrates the rear cover 18 in the thickness direction (the illustrated Z-axis direction) of the rear cover 18. The mounting hole 181 is a square hole. In other embodiments, the mounting hole 181 may be a circular hole or other shaped hole. The speaker hole 80 is located at one end of the middle frame 11. In this embodiment, the screen 20 may be a display screen such as an LCD (liquid crystal display) or an OLED (organic light-emitting diode display), and is used for displaying information such as images or characters. The screen 20 is mounted on the other side of the middle frame 11, i.e. the screen 20 is mounted on the side of the middle frame 11 facing away from the rear cover 18. The sound outlet slit 90 is located at the top of the screen 20.

The decoration member 70 is in the shape of a rectangular cover. The garnish 70 is provided with a receiving groove 71 and a mounting edge 72, and the mounting edge 72 is an outer peripheral edge of the garnish 70. The decoration 70 is arranged on the mounting hole 181 of the rear cover 18, the mounting edge 72 is fixedly clamped with the periphery of the mounting hole 181, and the decoration 70 protrudes out of the outer surface of the rear cover 18. The opening of the receiving groove 71 is located at one side of the garnish 70. The receiving groove 71 is recessed from the upper surface of the garnish 70 toward the direction of the lower surface (not shown) (the negative direction of the Z axis is shown). Wherein, the shape of the holding groove 71 is matched with the shape of the bracket 40. The decoration member 70 may further include a camera hole (not shown), and an opening of the camera hole is located on a bottom wall of the receiving groove 71. The imaging hole is recessed from the bottom wall of the housing groove 71 toward the lower surface of the garnish 70, and penetrates the lower surface of the garnish 70. Wherein, the external light can enter the receiving groove 71 of the decoration 70 through the camera hole.

Referring to fig. 4, 5 and 6, fig. 5 is a schematic structural diagram of a middle frame 11 of the electronic device 1000 shown in fig. 3, and fig. 6 is a schematic structural diagram of the middle frame 11 shown in fig. 4 at another angle.

The middle frame 11 includes a middle plate 111 and two end frames 112 and two side frames (not shown), the middle plate 111 includes a first surface 1110 and a second surface 1111 disposed opposite to the first surface 1110. Two end frames 112 and two side frames are connected head to head and are connected with the sides of the middle plate 111, and the two end frames 112 and the two side frames form a receiving groove 113 with the middle plate 111 around the periphery of the middle plate 111. The first surface 1110 is a bottom surface of the receiving groove 113. The middle plate 111 of this embodiment is a rectangular plate, and the two end frames 112 at the end edges of the middle plate 111 can be regarded as the top and bottom shells of the electronic device, which are usually used to provide speaker holes and connector sockets, etc. The side frames at two opposite sides of the middle plate can be regarded as two side shells of the electronic device, and can be provided with a volume key, a switch key and the like and also be held by hands of a user. In this embodiment, the end frame 112 at the top is provided with a speaker hole 80 for matching with the speaker module.

In this embodiment, the middle frame 11 further includes a bump 114, and the bump 114 is disposed on the bottom surface (the first surface 1110) of the receiving groove 113 in a protruding manner and extends toward the opening direction (shown as the negative direction of the Z axis) of the receiving groove 113. Specifically, the protrusion 114 is rectangular, the protrusion 114 is located at the top of the receiving groove 113, and the protrusion 114 is connected to the inner side of the end frame 112. Wherein, the height of the bump 114 is less than the depth of the receiving groove 113. Illustratively, the bumps 114 are square. In other embodiments, the bumps 114 may be rounded or otherwise shaped.

Referring to fig. 5 and 6, the middle frame 11 further has a communicating groove 115, a mounting groove 117, and a sound outlet groove 118. The sound outlet groove 118 and the mounting groove 117 are both positioned at the top of the middle frame 11. The mounting groove 117 penetrates the first surface and the second surface of the middle plate 111 in the thickness direction of the middle frame 11. Sound output slot 118 includes a slit 1181 and a connection area 1182, where slit 1181 extends along end frame 112 (in the X-axis direction), is specifically recessed from the inner side surface of end frame 112, and penetrates through the upper surface of end frame 112, that is, the surface facing the same direction as first surface 1110. The sound emitting groove 118 is partially recessed in the second surface 1111 of the middle plate 111 (recessed in the direction from the second surface of the middle plate 111 toward the first surface (negative direction of the Z axis in the drawing)), and the connection region 1182 is located on the side of the mounting groove 117 and communicates with the mounting groove 117.

Referring to fig. 6, 7 and 8 together, fig. 7 is a cross-sectional view of an angle of the middle frame 11 shown in fig. 5; fig. 8 is an angular cross-sectional view of the middle frame 11 shown in fig. 6. The communication groove 115 penetrates the protrusion 114 and the second surface 1111 of the middle plate 111 and communicates with the sound emission hole 80. One opening of the communication groove 115 is located on the upper surface (not labeled) of the bump 114, and the other opening is located on the second surface 1111. Specifically, the communication groove 115 includes a first communication groove 115a and a second communication groove 115b, and an opening of the first communication groove 115a is located on the upper surface of the projection 114 and communicates with the receiving groove 113. The first connecting groove 115a includes a first groove sidewall 1150, the first groove sidewall 1150 is connected to the end frame 112, the first groove sidewall 1150 is inclined with respect to the opening of the first connecting groove 115a, and a part of the sound emitting holes 80 penetrates the first groove sidewall 1150 to communicate with the first connecting groove 115 a.

The opening of the second communicating groove 115b is located on the second surface 1111, and the second communicating groove 115b is arranged at an interval from the mounting groove 117 in the X-axis direction and is arranged at an interval from the sound emitting groove 118 in the Y-axis direction. The second communication groove 115b includes a groove bottom wall 1152 and a sub-groove 1153, the second communication groove 115b is formed by the second surface 1111 recessed into the middle plate 111, and an opening of the second communication groove 115b faces away from the accommodation groove 113 at the second surface of the middle plate. Channel bottom wall 1152 is parallel to second surface 1111. The sub-groove 1153 is formed by recessing the groove bottom wall 1152 toward the inside of the middle plate 111 (specifically, recessing toward the protrusion 114), and the sub-groove 1153 is communicated with a part of the sound emitting holes 80. Actually, the first communicating groove 115a is within the projection range of the second communicating groove 115 b.

Specifically, the sub-groove 1153 includes two inclined sidewalls 1154 and a bottom wall 1155 connected to the inclined sidewalls 1154, and the speaker holes 80 communicate with the sub-groove 1153 through the bottom wall 1155. The first communicating groove 115a communicates with the sub-groove 1153 through one of the inclined side walls 1154, i.e., the other opening of the first communicating groove 115a is located on the inclined side wall 1154 and faces the bottom wall 1155. Where sub-slot 1153 is an angled slot that is recessed from middle plate 111 toward protrusion 114, bottom wall 1155 may be part of end rim 112 or may be part of the protrusion. It can be understood that the first communication groove 115a penetrates through a portion of the groove sidewall of the second communication groove 115 b. The area of the second communicating groove 115b is large, so that the first communicating groove 115a can be conveniently machined, the size of the first communicating groove 115a can be reduced, the size of the bump can be reduced, the size of a notch in the circuit board 30 can be reduced, and the actual use area of the circuit board can be increased.

Referring to fig. 9 and 10, fig. 9 is a schematic structural diagram of the circuit board 30 in the electronic device 1000 shown in fig. 3, wherein a speaker module is included. Fig. 10 is an assembly diagram of a partial structure of the electronic device 1000 shown in fig. 3.

The circuit board 30 may be a main board (main board) of the electronic device 1000. The circuit board 30 includes a mounting surface 31, and a first mounting region 311 and a second mounting region 312 adjacent to the first mounting region 311 are provided on the mounting surface 31. The circuit board 30 further has an avoiding hole 32, a plurality of mounting avoiding holes 33, and a notch 34. The relief hole 32, the plurality of mounting relief holes 33 (two or more) and the notch 34 penetrate the circuit board 30 along the thickness direction (Z-axis direction) of the circuit board 30, that is, penetrate the mounting surface 31 and the surface opposite to the mounting surface 31.

Wherein, the avoiding holes 32, the installation avoiding holes 33 and the gaps 34 are arranged at intervals; the relief hole 32 and the notch 34 are located on the top of the circuit board 30 and penetrate through the top surface (not shown) of the circuit board 30. The notch 34 is located on one side of the relief hole 32. The plurality of mounting relief holes 33 are located in the first mounting region 311 of the circuit board 30, and the notches 34 and the relief holes 32 are located above the first mounting region 311. It should be noted that, a portion of the circuit board 30 located between the avoiding hole 32 and the installation avoiding hole 33 is generally used for routing lines such as radio frequency signal lines and control lines, and a distance between the avoiding hole 32 and the installation avoiding hole 33 can facilitate arrangement of the lines such as radio frequency signal lines and control lines, thereby ensuring the reliability of the circuit board 30 in use.

Referring to fig. 10, the circuit board 30, the camera module (not shown) and the speaker module are all mounted in the receiving cavity 113 of the middle frame 11. Specifically, the circuit board 30 is mounted on the bottom wall (not shown) of the receiving groove 113. The notch 34 of the circuit board 30 is free from the protrusion 114 of the middle frame 11. The camera module is mounted on the bottom wall of the accommodating groove 113 and passes through the plurality of mounting avoiding holes 33 of the circuit board 30. The camera module is electrically connected to the circuit board 30 to electrically connect to the processor. The camera module can receive the information acquisition signal sent by the processor through the circuit board 30, and acquire the light outside the electronic device 1000 to form corresponding image data.

The second speaker unit 63 of the speaker module is located at the top of the electronic device 1000, and the second speaker unit 63 is mounted in the mounting groove 117. Specifically, the second speaker unit 63 is disposed through the installation avoiding hole 33 of the circuit board 30 and electrically connected to the circuit board 30, so as to be electrically connected to the processor. The second speaker unit 63 may be a high frequency unit, and may be used as an earpiece of the electronic device 1000. The second speaker unit 63 may receive the audio signal sent by the processor through the circuit board 30, and vibrate to generate sound according to the audio signal, and the sound is diffused to the external environment, so as to implement the sound generation of the earpiece of the electronic device 1000.

The first speaker unit 62 is mounted on the second mounting region 312 of the circuit board 30, i.e., the mounting surface 31, and is electrically connected to the circuit board 30 to achieve electrical connection with the processor. Along the X-axis direction, the first speaker unit 62 is disposed at an interval from the camera module. The first speaker unit 62 in this embodiment is directly disposed on the mounting surface 31 of the circuit board 30, and a clearance hole penetrating through the circuit board is not required to be disposed on the circuit board 30, so that the space of the circuit board 30 can be saved. The first speaker unit 62 may be a full frequency unit, and may be used as a speaker of the electronic device 1000; but of course also as a bass unit. The first speaker unit 62 may receive the audio signal sent by the processor through the circuit board 30, and vibrate to generate sound according to the audio signal, and the sound is diffused to the external environment, so as to realize the speaker sound generation of the electronic device 1000. At this time, the first speaker unit 62 and the second speaker unit 63 can generate sound in cooperation, so that power consumption of the speaker module can be reduced, which is helpful for prolonging the endurance time of the electronic device 1000.

In addition, the electronic apparatus 1000 may further include another speaker module (not shown), which is located at the bottom of the electronic apparatus 1000 and is used as a bottom speaker module of the electronic apparatus 1000. At this time, the electronic device 1000 may simultaneously employ the top speaker module and the bottom speaker module to generate sound, so as to realize the "dual-horn" sound generating mode of the electronic device 1000, which is helpful to improve the sound generating quality of the electronic device 1000.

Referring to fig. 11 and 12, fig. 11 is a schematic structural diagram of a bracket 40 in the electronic device 1000 shown in fig. 3, fig. 12 is a schematic structural diagram of the bracket 40 shown in fig. 11 at another angle, and fig. 13 is a schematic plan structural diagram of the bracket 40 shown in fig. 12.

In this embodiment, the bracket 40 includes a bracket body 41, a boss 42, an assembling groove 43, an avoiding groove 45, a mounting protrusion 46, and a sound hole 47, and the boss 42 and the mounting protrusion 46 are fixedly connected to the bracket body 41. The holder body 41 is adapted to the shape of the receiving groove 113 (shown in fig. 4) of the middle frame 11. The holder body 41 includes a first face 411 and a second face 412 disposed opposite to the first face 411.

The boss 42 is fixedly connected to the second face 412 of the bracket body 41. The boss 42 protrudes from the second surface 412 of the holder body 41 in a direction away from the second surface 412 (the positive direction of the Z axis is illustrated). The mounting slot 43 penetrates the bosses 42 on the first face 411 and the second face 412, that is, the mounting slot 43 is a through slot, and two openings of the through slot are respectively located on the side of the first face 411 and the boss 42 facing away from the second face 412. The shape of the fitting groove 43 is adapted to the shape of the camera module.

The avoiding groove 45 is concavely arranged on the first surface 411, and the avoiding groove 45 is concaved from the first surface 411 to the second surface 412 along the Z-axis direction; the escape groove 45 is provided at an interval from the fitting groove 43 along the X-axis direction. The shape of the escape slot 45 is adapted to the shape of the first speaker unit 62 for accommodating the first speaker unit 62. The groove bottom wall 450 of the avoiding groove 45 parallel to the first face 411 is concavely provided with a functional groove 451, the first speaker unit covers the functional groove 451, and the functional groove 451 is used as a front sound cavity of the first speaker unit 62.

The mounting protrusion 46 is protruded on the first surface 411 of the bracket body 41, and in the Y direction, the mounting protrusion 46 is arranged adjacent to the avoiding groove 45; the mounting projection 46 partially coincides with the boss 42 in the Z-axis direction. An angle θ between the length extending direction of the mounting projection 46 and the Y-axis direction is 0 degree or more and less than 90 degrees.

Referring to fig. 14 and 15 together, fig. 14 is a partial structural sectional view of the electronic device 1000 shown in fig. 2 at one angle, and fig. 15 is a partial structural sectional view of the electronic device 1000 shown in fig. 2 at another angle.

The sound hole 47 includes a first sound hole 471, a second sound hole 472, and a third sound hole 473, and the first sound hole 471, the second sound hole 472, and the third sound hole 473 are connected in sequence along the extending direction of the sound hole 47. A first sound hole 471 is formed in a side groove wall (not shown) of the functional groove 451 adjacent to the mounting protrusion 46, and the extending direction of the first sound hole 471 is parallel to the Y-axis direction. The second acoustic port 472 extends along the Z-axis inside the boss 42 to the inside of the mounting boss 46, and then extends along the extending direction of the mounting boss 46 inside the mounting boss 46; it is understood that the second sound hole 472 is a stepped hole passing through the boss 42 and the mounting projection 46, and the entirety thereof is extended in the Z-axis direction. The second sound hole 472 only needs to communicate the first sound hole 471 and the third sound hole 473, and the path thereof is not limited. The third sound hole 473 penetrates the outer surface of the mounting projection 46 in the Z-axis direction and is located at an end of the mounting projection 46 away from the avoiding groove 45; the third sound hole 473 extends in parallel to the Z-axis direction. In other embodiments, the sound holes 47 may have other structures, and the structure of the sound holes 47 is not particularly limited in this application. The first sound hole 471, the second sound hole 472, and the third sound hole 473 may be circular holes, square holes, or through-groove structures, and the shapes thereof are not limited.

In one embodiment, the front sound cavity of the first speaker unit 62, that is, the functional groove 451, may have an hourglass shape, that is, portions of the side walls of the groove in the Z-axis direction may be relatively close to each other, and a cross-section of a portion of the functional groove 451 in the Z-axis direction between the opening and the bottom wall of the groove may be smaller than an area of the opening and an area of the bottom wall of the groove, which may be understood as that a portion of the inside of the functional groove 451 is narrowed. Alternatively, the cross-sectional area of the second sound hole 472 in the sound outputting direction is smaller than the area of the opening connecting the first sound hole 471 and the third sound hole 473, which means that the area of the second sound hole 472 in the sound outputting direction is narrowed. In this way, the high frequency performance of the first speaker unit 62 can be improved. It is to be understood that the sound emission passage of the first speaker unit 62 is not limited to the narrow region provided at the second sound hole position, and the first sound hole 471 and the third sound hole 473 may be provided with the narrow region.

The bracket 40 is mounted to the receiving groove 113 of the middle frame 11. Specifically, the bracket 40 is mounted on a surface of the circuit board 30 facing away from the middle frame 11 (i.e., the mounting surface 31 of the circuit board 30). The bracket 40 may be mounted to the circuit board 30 by fasteners such as screws. Wherein the stand 40 covers the second speaker unit 63. The camera module is inserted into the assembly groove 43, and the first speaker unit 62 is installed in the avoiding groove 45 and covers the first sound hole 471. In addition, the second face 412 of the bracket body 41 may be flush with the surface of the middle frame 11 to facilitate subsequent assembly of the rear cover 18 with the middle frame 11.

Referring to fig. 15, fig. 16 and fig. 17, fig. 16 is a schematic cross-sectional structure view of the electronic device 1000 shown in fig. 1 at an angle, and fig. 17 is a schematic cross-sectional structure view of the electronic device 1000 shown in fig. 1 at another angle.

The decoration member 70 is mounted on a surface of the bracket 40 facing away from the center frame 11, and covers the bracket 40 and the camera module. Wherein, the bracket 40, the camera module and the decoration 70 are all arranged through the mounting hole 181 of the rear cover 18. Specifically, the receiving groove 71 of the garnish 70 receives the boss 42 of the bracket 40. Further, the camera hole of the decoration 70 is disposed opposite to the camera module. The module of making a video recording can gather the outside light of electronic equipment 1000 through the hole of making a video recording to form corresponding image data, in order to realize making a video recording.

The screen is mounted on the other side of the middle frame 11, and seals the mounting groove 117 and the second communicating groove 115b of the communicating groove 115, the mounting groove 117 forms the front sound cavity 63a of the second speaker unit 63, the second speaker unit 63 in this embodiment has a smaller volume than the first speaker unit 62, the volume of the front sound cavity 63a of the second speaker unit 63 is correspondingly reduced, and the second speaker unit 63 can be used as a high-pitch unit in a play-out scene. The screen 20 and the slit 1181 of the sound outlet groove 118 form a sound outlet slit 90, and the sound outlet slit 90 is communicated with the front sound cavity 63a of the second speaker unit 63 through a connecting area 1182 of the sound outlet groove 118. The sound generated by the second speaker unit 63 during operation can be transmitted from the front sound cavity 63a to the outside of the electronic device 1000 through the partial sound outlet groove 118 and the sound outlet slit 90, that is, the sound generated by the second speaker unit 63 during operation can be transmitted to the outside of the electronic device 1000 through the mounting groove 117 and the sound outlet groove 118 of the middle frame 11 in sequence, so as to realize the sound generation of the second speaker unit 63. The sound-emitting slot is formed by surrounding a sound-emitting groove of the middle frame and the screen 20, and the sound-emitting slot can also be formed by surrounding a cutting groove of the screen 20 and the middle frame.

The third sound hole 473 of the sound hole 47 is opposite to and communicates with the communication groove 115 of the projection 114, and the sound hole 47 communicates with the sound emission hole 80 through the communication groove 115. The functional groove 451 in the escape groove 45 of the bracket 40 forms the front sound chamber 62a of the first speaker unit 62 and is sealed by the rear cover 18 or the garnish. Wherein the first sound hole 471 of the sound passing hole 47 is communicated with the front sound chamber 62a of the first speaker unit 62. The sound generated by the first speaker unit 62 during operation can be transmitted from the front sound cavity 62a to the outside of the electronic device 1000 through the sound hole 47, that is, can be transmitted to the outside of the electronic device 1000 through the sound hole 47 of the bracket 40, the communication groove 115 of the middle frame 11 and the sound emitting hole 80 in sequence, so as to realize the sound generation of the first speaker unit 62. It can be understood that the sound through hole 47, the communication groove 115, and the speaker hole 80 communicate with the speaker passage of the first speaker unit 62.

Go out the gap of sound when sound seam 90 can regard as the conversation, because the people's ear can't laminate totally sealedly with a sound seam, consequently go out the sound of sound seam and can outwards spread, become lou sound, influence conversation privacy nature, to this problem, the preceding sound chamber 62a accessible top raise sound hole 80 of first speaker unit 62 sends out the sound wave opposite with a sound seam 90 looks of going out to offset the lou sound of a sound seam, promote conversation privacy nature.

The electronic device 1000 further includes a first adhesive layer, a second adhesive layer, and a third adhesive layer and a fourth adhesive layer. The first adhesive layer is adhered between the first speaker unit 62 and the stand 40. Specifically, the first speaker unit 62 is bonded to an upper surface (not shown) of the first adhesive layer, and a lower surface (not shown) of the first adhesive layer is bonded to a bottom wall of the escape groove 45 of the bracket 40. The first adhesive layer is provided with a through hole (not shown), and the through hole penetrates through the first adhesive layer along the thickness direction of the first adhesive layer, so as to ensure that the first adhesive layer does not obstruct the sound production of the first speaker unit 62. The second adhesive layer connects the projection 114 of the middle frame and the mounting projection 46 to seal the communication groove 115 and the third sound hole 473.

In other embodiments, the first speaker unit 62 may not be mounted to the circuit board 30, but may be mounted to the bracket 40 through the first adhesive layer. At this time, the first speaker unit 62 is disposed at an interval from the circuit board 30 along the Z-axis direction, and the electronic device of the electronic apparatus 1000 may be mounted on the circuit board 30 and located between the first speaker unit 62 and the circuit board 30, so as to improve the space utilization rate inside the electronic apparatus 1000 and improve the integration level of the electronic apparatus 1000.

The third adhesive layer 100c is bonded between the screen 20 and the middle plate 111 of the middle frame 11 around the mounting groove 117 and the sound exit groove 118, and the fourth adhesive layer (not shown) is bonded between the second speaker unit 63 and the mounting groove 117 of the middle plate 111 and ensures that sound emission of the second speaker unit 63 is not obstructed.

Referring to fig. 18 and fig. 19, fig. 18 is an exploded structural schematic view of an electronic device 1000 according to a second embodiment of the present application, and fig. 19 is a structural schematic view of a bracket of the electronic device 1000 shown in fig. 18 at another angle.

The electronic apparatus 1000 of this embodiment is different from the electronic apparatus 1000 of the above embodiment in that the communication groove 115 of the middle frame 11 is a concave groove recessed in the surface of the protrusion 114, and does not penetrate through the middle plate 111, the sound emission hole 80 penetrates through the groove side walls of the end frame 112 and the communication groove 115, and the end frame 112 is actually the groove side wall of the communication groove 115. It is understood that the communication groove 115 has a groove bottom wall, and the groove side wall in the Y direction is not an inclined surface, and may be a plane perpendicular or substantially perpendicular to the middle plate 111.

The mounting projection 46 of the bracket 40 further includes an extension portion 461, and the extension portion 461 is formed by extending an end of the mounting projection 46 away from the avoiding groove 45 in the X-axis direction. The third sound hole 473 of the sound hole 47 is opened on the extending portion 461, the opening of the sound hole 47 is located on the upper surface of the mounting protrusion 46 (facing the same direction as the first surface 411), and the hole wall of the third sound hole 473 is vertical or approximately vertical to the plane of the bracket body 41. It is understood that the length of the third sound hole 473 in the X direction is greater than the length of the third sound hole 473 described in the first embodiment. The extension portion 461 and the third sound hole 473 both satisfy the length of the projection 114 and the length of the communication groove 115. The communication groove 115 and the third sound hole 473 of the present embodiment have larger areas, and are more favorable for sound release.

Referring to fig. 20 and 21, fig. 20 is a partially assembled structural diagram of an electronic device 1000 according to a second embodiment of the present application. Fig. 21 is an assembled cross-sectional schematic view of the electronic device 1000 shown in fig. 17.

The circuit board 30 and the speaker module are mounted in the receiving groove 113 of the middle frame 11. The circuit board 30 is mounted on the bottom wall (not shown) of the receiving groove 113. The notch 34 of the circuit board 30 is free from the protrusion 114 of the middle frame 11. The first speaker unit 62 is disposed on the mounting surface 31 of the circuit board 30, and the bracket is mounted on the receiving groove 113, specifically, the bracket 40 is mounted on the surface of the circuit board 30 away from the middle frame 11. The second speaker unit 63 is mounted to the mounting groove 117 and the bracket 40 covers the second speaker unit 63. The first speaker unit 62 is installed in the avoiding groove 45 and covers the first sound hole 471. The decoration member 70 is mounted on a surface of the bracket 40 facing away from the center frame 11, and covers the bracket 40. The fitting groove 117 forms a front sound chamber 63a of the second speaker unit 63. The sound outlet slit 90 is communicated with the front sound cavity 63a of the second speaker unit 63 through the sound outlet groove 118. The third sound hole 473 of the sound hole 47 is opposed to and communicates with the communication groove 115 of the projection 114, the hole wall of the third sound hole 473 is aligned in the Z direction with the groove side wall of the communication groove 115, and the sound hole 47 communicates with the sound emission hole 80 through the communication groove 115. The communicating groove 115 of the present embodiment has a simple structure. The sound through hole 47, the communication groove 115, and the sound emitting hole 80 communicate with the sound emitting passage of the first speaker unit 62.

Referring to fig. 22 and 23, fig. 22 is an exploded schematic view of an electronic device 1000 according to a third embodiment of the present application, and fig. 23 is a schematic view of a bracket of the electronic device 1000 shown in fig. 22 at an angle; fig. 24 is a schematic structural view of the electronic device 1000 shown in fig. 22 at another angle of the stand.

The electronic device 1000 of this embodiment is different from the electronic device 1000 of the previous embodiment in that the protrusion 114 of the middle frame 11 includes a first inclined surface 1141, the first inclined surface 1141 faces away from the end frame and is connected to the first surface 1110 of the middle plate 111 to form an included angle, and the included angle is greater than 90 degrees and smaller than 180 degrees. The communicating groove 115 is concavely formed on the first inclined surface 1141 and is communicated with the speaker hole 80. The mounting projection 46 of the holder 40 includes a body 461 and an extension 462, the extension 462 includes a second slope 463, and the third sound hole 473 is provided on the second slope 463. The body 461 is inclined at the same angle as the mounting projection 46 of the first embodiment.

Specifically, the communication groove 115 is formed by the first inclined surface 1141 being recessed toward the end frame 112, and the first inclined surface 1141 being recessed toward the Y direction. The bottom wall of the communicating groove 115 is an inner side surface of the end frame 112 facing the accommodating groove 113, and the sound emitting hole 80 penetrates through the bottom wall of the communicating groove 115 to communicate with the communicating groove 115.

In this embodiment, the extension 462 is located at an end of the mounting protrusion 46 away from the avoiding groove 45, the extension 462 is substantially a prism, a length direction thereof is parallel to the X-axis direction, and a part of the extension 461 is connected with the mounting protrusion 46. The extension portion 462 includes a second inclined surface 463, an abutting surface 464, and a connecting surface 465. The abutting surface 464 connects the second inclined surface 463 and the connecting surface 465. The second inclined surface 463 is located at an end of the holder body 41 and connected to the end surface (connecting the first surface 411 and the second surface 412), and the second inclined surface 463 faces away from the first surface 411. The connection face 465 faces the first face 411 for mounting with the circuit board 30. The connecting surface 465 is used for abutting against the groove bottom wall of the accommodating groove 113.

A third sound hole 473 of the sound hole 47 is formed in the second inclined surface 463, one opening of the third sound hole is located on the second inclined surface 463, and the other opening is communicated with the second sound hole 472; actually, the two opening areas of the third sound hole 473 are different, the opening area communicating with the second sound hole 472 is smaller, and the opening area interfacing with the speaker hole 80 is larger, which is more beneficial to playing sound. A portion of the second sound hole 472 extends along the length direction of the body 461 and communicates with the third sound hole 473; the other part of the second sound hole 472 extends into the boss 42 along the Z-axis and extends in the direction of the escape groove 45, and communicates with the first sound hole 471. In practice, the second sound hole 472 is a stepped hole passing through the boss 42 and the mounting projection 46, and the entirety thereof extends in the Z-axis direction.

Referring to fig. 25 and 26, fig. 25 is a schematic assembly diagram of a partial structure of an electronic device 1000 according to a third embodiment of the present application; fig. 26 is an assembled, angled, cross-sectional schematic view of the electronic device 1000 shown in fig. 25.

The circuit board 30 and the speaker module are mounted in the receiving groove 113 of the middle frame 11. The circuit board 30 is mounted on the bottom wall (not shown) of the receiving cavity 113. The notch 34 of the circuit board 30 is free from the projection 114 of the middle frame 11, and the communication groove 115 is located above the circuit board. The first speaker unit 62 is disposed on the mounting surface 31 of the circuit board 30, and the bracket 40 is mounted on the receiving groove 113, specifically, the bracket 40 is mounted on the surface of the circuit board 30 facing away from the middle frame 11. The second inclined surface 463 of the mounting protrusion 46 of the bracket 40 is parallel to and opposite to the first inclined surface 1141 of the protrusion 114 of the middle frame 11, and the third sound hole 473 of the sound hole 47 is communicated with the sound emitting hole 80 through the communication groove 115. The abutting surface 464 of the extension 462 abuts against the middle plate 111, and the connecting surface 465 abuts against the end of the circuit board 30 having the notch. The second speaker unit 63 is mounted to the mounting groove 117, and the bracket 40 covers the first speaker unit 62 and the second speaker unit 63. The first speaker unit 62 is installed in the avoiding groove 45 and covers the first sound hole 471. The decoration member 70 is mounted on a surface of the bracket 40 facing away from the center frame 11, and covers the bracket 40.

It should be noted that the periphery of the sound transmitting portion, including the periphery of the groove and the hole, of any of the above embodiments is hermetically connected by the sealing adhesive, so as to ensure the sealing performance and prevent sound leakage. The rear cavity of the first speaker unit 62 of any of the above embodiments is formed for the circuit board, the rear cover 18, and the sealed portion of the center frame 11. The rear cavity of the second speaker is formed by the rear cover 18 and the sealing part of the middle frame 11, and the description is omitted.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application; the embodiments and features of the embodiments of the present application may be combined with each other without conflict. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. An electronic device is characterized by comprising a camera module, a middle frame, a circuit board, a bracket and a first loudspeaker unit, wherein the circuit board comprises a mounting surface, and the bracket comprises an avoidance groove; the avoiding groove is formed in the support in the thickness direction, the first loudspeaker unit is located on the mounting surface and electrically connected with the circuit board, the circuit board and the support are stacked and mounted in the middle frame, the mounting surface faces away from the middle frame, the support is fixed on the mounting surface, the camera module is mounted in the middle frame and electrically connected with the circuit board, the camera module penetrates through the support and is located in the middle frame in the thickness direction of the electronic equipment, and the first loudspeaker unit is contained in the avoiding groove.

2. The electronic device of claim 1, wherein the electronic device includes a second speaker unit and a sound slit, the middle frame includes a mounting groove, the circuit board includes an avoiding hole, the avoiding hole runs through the circuit board in a thickness direction of the circuit board, the mounting groove runs through the middle frame in a thickness direction of the middle frame, the second speaker unit is disposed through the avoiding hole and covers an opening of the mounting groove, the mounting groove forms a front sound cavity of the second speaker unit, and the sound slit communicates the front sound cavity of the second speaker unit with an outside of the electronic device.

3. The electronic device of claim 2, wherein a volume of the second speaker unit is smaller than a volume of the first speaker unit.

4. The electronic device of claim 3, wherein the first speaker unit is a treble unit or a full range unit and the second speaker unit is a full range unit.

5. The electronic device according to any one of claims 1 to 4, wherein the middle frame is provided with an end frame and a sound emission hole provided in the end frame, the avoiding groove comprises a groove bottom wall, a functional groove is recessed in the groove bottom wall, the first speaker unit covers the functional groove, so that the functional groove forms a front sound cavity of the first speaker, and the sound emission hole communicates the front sound cavity of the first speaker unit and an outer portion of the middle frame.

6. The electronic device according to claim 5, wherein the middle frame includes a projection, a communication groove is provided in the projection, the communication groove extends in a thickness direction of the middle frame, the communication groove communicates with the sound emission hole, and the holder includes a sound emission hole that communicates the front sound chamber of the first speaker unit and the communication groove.

7. The electronic device of claim 6, wherein the bracket comprises a bracket body and a boss, the bracket body comprises a first surface and a second surface opposite to the first surface, the boss is located on the second surface, and the avoiding groove is recessed in the first surface;

the mounting protrusion is further convexly arranged on the first face, the sound through hole comprises a first sound hole, a second sound hole and a third sound hole which are sequentially communicated, the first sound hole penetrates through the groove side wall of the functional groove along the length direction of the support, the second sound hole is arranged inside the boss and the mounting protrusion and extends along the thickness direction of the support, the third sound hole penetrates through the mounting protrusion, the bump is in butt joint with the mounting protrusion, and the third sound hole is opposite to and communicated with the communicating groove.

8. The electronic device of claim 7, wherein one end of the mounting protrusion extends along a width direction of the bracket to form an extension portion, the extension portion is located at an end of the mounting protrusion away from the avoiding slot, and the third sound hole extends from an end of the mounting protrusion to the extension portion and extends along a length direction of the extension portion;

the communicating groove is formed by the upper surface of the convex block sinking towards the inner part of the convex block, the opening of the communicating groove is located on the surface of the convex block, the communicating groove extends along the width direction of the middle frame, and the sound raising hole penetrates through one groove side wall of the communicating groove.

9. The electronic device according to claim 7, wherein the protrusion includes a first inclined surface, the first inclined surface is disposed obliquely away from the end frame, and the sound emission hole penetrates through a groove bottom wall of the communication groove and is communicated with the communication groove;

the mounting protrusion is provided with an extending portion, the extending portion is located the mounting protrusion is far away from one end of the avoiding groove, the extending portion comprises a second inclined surface, the second inclined surface faces away from the mounting protrusion and is compared with the first surface of the support in an inclined mode, the third sound hole penetrates through the second inclined surface, the first inclined surface is in butt joint with the second inclined surface, and the third sound hole is opposite to and communicated with the communicating groove.

10. The electronic device of claim 7, wherein the middle frame comprises a middle plate and the end rim connected to the middle plate, the middle plate comprises a first surface and a second surface opposite to the first surface, and the protrusion is protruded from the first surface of the middle plate and connected to the end rim;

11. The electronic device according to claim 10, wherein the first connecting groove includes a first groove side wall which is inclined with respect to an opening of the first connecting groove, and a part of the sound emitting holes penetrate the first groove side wall;

the second communicating groove is formed by the second surface sinking towards the middle plate, the second communicating groove comprises a groove bottom wall and a sub groove, the sub groove is formed by the groove bottom wall sinking towards the inner part of the middle plate, the sub groove comprises two inclined side walls and a bottom wall connecting the two inclined side walls, the other part of the sound-raising holes penetrate through the bottom wall, and the other opening of the first communicating groove is located on one inclined side wall and faces the sound-raising holes.

12. The electronic device of claim 9, wherein an opening of the third sound hole is located on the second inclined surface, the third sound hole includes a hole wall, an extending direction of the hole wall intersects an extending direction of the third sound hole, and an opening of the second sound hole penetrates through the hole wall and communicates with the third sound hole.

13. The electronic equipment according to claim 7, wherein the electronic equipment comprises a camera module and a decoration, the decoration comprises an accommodating groove, the circuit board further comprises a mounting avoiding hole, the mounting avoiding hole penetrates through the circuit board along the thickness direction of the circuit board, and the mounting avoiding hole and the first speaker unit are arranged at intervals;

the camera module penetrates through the installation avoiding hole, the decorating part is installed on the middle frame, and the camera module and the boss of the support are contained in the containing groove.

14. The electronic device of claim 2, wherein the electronic device comprises a screen, the middle frame comprises a middle plate, an end frame connected with the middle frame, and a sound outlet groove, the middle plate comprises a first surface and a second surface arranged opposite to the first surface, the sound outlet groove is concavely arranged on the second surface, the sound outlet groove comprises a gap concavely arranged on the inner side surface of the end frame and a connecting area communicated with the mounting groove, the screen is mounted on the second surface and covers the connecting area, and the screen and the gap form the sound outlet gap.