CN213661669U

CN213661669U - Electronic device

Info

Publication number: CN213661669U
Application number: CN202021732227.2U
Authority: CN
Inventors: 毛维华; 吕仁; 盛建清; 吴博; 于卫东
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2020-08-17
Filing date: 2020-08-17
Publication date: 2021-07-09
Anticipated expiration: 2030-08-17
Also published as: WO2022037374A1

Abstract

The application provides electronic equipment which comprises a middle frame, a display assembly and a rear cover, wherein the display assembly and the rear cover are respectively connected to two sides of the middle frame; the camera support sets up the first side at main circuit board, two holes of dodging have been seted up on the main circuit board, camera and TOF receiving device are connected on the camera support, and extend the second side of main circuit board from two holes of dodging respectively, block-up connection is located two areas of dodging between the hole on main circuit board, block-up block is located the second side of main circuit board, TOF transmitting device connects the one side of keeping away from main circuit board at block-up and is connected with main circuit board electricity through block-up. The application provides an electronic device, which can improve the reusability of a TOF emitting device and a TOF receiving device.

Description

Electronic device

Technical Field

The application relates to the technical field of structural design, in particular to an electronic device.

Background

With the development of electronic devices such as mobile phones, users have higher and higher requirements on the shooting performance of the front-facing camera. A TOF (Time of Flight) transmitting device and a TOF receiving device can be arranged in the front camera to realize 3D depth camera shooting. In the related art, the TOF transmitting device and the TOF receiving device are of an integrated design, and are integrated in a bracket, and are led out from the same BTB (Board to Board) connector and connected to a main circuit Board in the electronic device. However, this arrangement reduces the reusability of the TOF transmitting device and the TOF receiving device in the product design selection stage and the after-market product maintenance stage, and increases the production cost and the maintenance cost.

SUMMERY OF THE UTILITY MODEL

The application provides an electronic device, which can improve the reusability of a TOF emitting device and a TOF receiving device.

The application provides an electronic device, including: the display assembly, the middle frame and the rear cover are jointly enclosed to form an accommodating space, and a main circuit board, a camera, a TOF (time of flight) emitting device, a TOF receiving device, a heightening block and a camera support are arranged in the accommodating space; the camera support sets up the first side of main circuit board, two dodge the hole have been seted up on the main circuit board, the camera with TOF receiving device connects on the camera support, and from two respectively dodge the hole and extend to the second side of main circuit board, it connects to fill up high piece be located two on the main circuit board dodge the region between the hole, it is located to fill up high piece the second side of main circuit board, TOF transmitting device connects keeping away from of fill up high piece one side of main circuit board and passing through fill up high piece with main circuit board electricity is connected, the camera TOF receiving device with TOF transmitting device's printing opacity side all moves towards the second side of main circuit board.

The embodiment of the application provides an electronic equipment, TOF emitting device and TOF receiving device encapsulate independently each other, make TOF receiving device pass through the BTB connector and connect on main circuit board, and TOF emitting device then connects on main circuit board through bed hedgehopping piece, can improve TOF emitting device and TOF receiving device's reusability, reduction in production cost and cost of maintenance.

In a possible implementation, the camera with TOF receiving device all includes base, lens mount and the camera lens that connects gradually, the lens mount with the radial dimension of camera lens is less than the radial dimension of base, the pedestal connection be in the camera support, the lens mount with the camera lens certainly dodge the hole and stretch out to the second side of main circuit board, the bed hedge piece with keeping away from of camera support the minimum distance between the surface of main circuit board is greater than the base with keeping away from of camera support the maximum distance between the surface of main circuit board.

The block of stepping up and TOF transmitting device arrange in the accommodation space between camera lens, lens mount of camera and TOF receiving device's camera lens, lens mount, compare in the mode that TOF transmitting device and TOF receiving device set up side by side, have multiplexed camera and TOF receiving device in the space of direction of height, can improve the compactness of device overall arrangement in the electronic equipment. And, with TOF transmitting device through filling up the stacking setting on the main circuit board between camera and TOF receiving device of piece, can shorten the distance between TOF transmitting device's transmission axis and TOF receiving device's the receiving axis for TOF transmitting device's transmission visual field and TOF receiving device's the coverage of receiving visual field are higher, make its range finding effect better.

In a possible implementation mode, the internal connection of center frame has the medium plate, display module with main circuit board sets up respectively the both sides of medium plate, display module includes screen and apron, the screen pastes on the medium plate, the apron lid is established on the screen, be provided with on the screen corresponding to the camera, TOF receiving device with TOF emitting device's light trap, be provided with on the medium plate corresponding to the camera, TOF receiving device with TOF emitting device's first through-hole.

Above-mentioned camera, TOF receiving device and TOF transmitting device's mode of setting can be applicable to the overall arrangement of leading camera among the electronic equipment, and at this moment, need set up the through-hole that corresponds so that light sees through on medium plate and the screen. TOF emitting device sets up between camera and TOF receiving device and connects on main circuit board, has utilized the ascending space of thickness direction of electronic equipment, compares in the scheme that TOF emitting device and TOF receiving device shared support set up side by side, can reduce the size of light trap on the screen on electronic equipment's width direction, improves electronic equipment's pleasing to the eye degree.

In a possible embodiment, a first adhesive tape is bonded between the screen and the middle plate, and the first adhesive tape is disposed around the light-transmitting hole and around the first through hole.

The setting of first gum can prevent that the dust from entering into camera, TOF transmitting device and TOF receiving device's camera lens region through the gap between screen and the medium plate, plays dustproof effect.

In a possible implementation mode, one side of the middle plate facing the main circuit board is further connected with a shielding piece, the shielding piece comprises a plate-shaped main body and a protrusion part connected to the plate-shaped main body, the protrusion part extends into the middle plate and corresponds to the TOF emitting device in a first through hole, the side wall of the protrusion part surrounds the TOF emitting device, a second through hole corresponding to the TOF emitting device is arranged on the top wall of the protrusion part, and a third through hole corresponding to the camera and the TOF receiving device is arranged on the plate-shaped main body.

The shielding piece is used for avoiding signal interference generated between the TOF transmitting device and the camera when the distance between the TOF transmitting device and the TOF receiving device is small.

In a possible embodiment, said plate-like body is welded to said intermediate plate; or the plate-shaped main body is adhered to the middle plate through second gum, and the second gum is arranged around the first through hole and around the second through hole.

The shielding piece is connected with the middle plate through welding or bonding mode, and the reliability of connection is high, and can realize sealedly, can prevent that the dust from entering into camera, TOF emitting device and TOF receiving device's camera lens region through the clearance between middle plate and the shielding piece, plays dustproof effect.

In a possible implementation manner, a third back glue and a fourth back glue are respectively connected between the plate-shaped main body and the camera and between the plate-shaped main body and the TOF receiving device, and the third back glue and the fourth back glue are respectively arranged around the third through hole.

The third gum and the fourth gum are arranged to prevent dust from entering the lens area through the gap between the shielding sheet and the camera and the TOF receiving device, and the dustproof effect is achieved.

In a possible implementation, a fifth adhesive tape is connected between the top wall of the protruding portion and the TOF emitting device, and the fifth adhesive tape is arranged around the second through hole.

The fifth gum can prevent dust from entering the lens area through the gap between the shielding sheet and the TOF emitting device, and the dustproof effect is achieved.

In a possible implementation manner, a positioning column is arranged on the camera support, a first positioning hole is arranged on the middle plate, a second positioning hole is arranged on the main circuit board, and the positioning column is in fit connection with the first positioning hole and the second positioning hole.

The camera support realizes the prepositioning with the medium plate through the positioning column, can guarantee the assembly precision of camera support and medium plate.

In a possible implementation manner, a card and a buckle are further arranged in the accommodating space, the buckle is welded on one side of the main circuit board, which is away from the middle plate, a clamping groove is formed in the inner side wall of the middle frame, the card abuts against one side of the camera support, which is away from the main circuit board, and two ends of the card are respectively clamped in the clamping groove and the buckle.

The cooperation of draw-in groove, buckle and card can tentatively fix the subassembly of making a video recording on the center subassembly, is favorable to fixing once more of follow-up screw, and card simple structure, and the assembly degree of difficulty is low.

In a possible implementation manner, a main board support is further arranged in the accommodating space, the main board support is arranged on one side, deviating from the main circuit board, of the camera support, a first mounting hole is formed in the middle board, a second mounting hole is formed in the main circuit board, a third mounting hole is formed in the camera support, a fourth mounting hole is formed in the main board support, and the first mounting hole, the second mounting hole, the third mounting hole and the fourth mounting hole are connected in a matched mode through screws.

The main board support and the middle frame assembly are fixedly connected through the screws, so that the assembly is convenient, and the main board support can play a role in supporting and protecting the main circuit board.

In one possible embodiment, the raised block is a land grid array package LGA module.

The LGA module is grid array encapsulation module, and TOF emission device connects at the top of LGA module, and the bottom distribution of LGA module has the pad, and the LGA module can be through the pad welding on main circuit board, connects TOF emission device and main circuit board electricity through the LGA module, need not to set up the BTB connector, and the structure is simpler, is favorable to improving the compactness that the interior device of electronic equipment arranged.

The embodiment of the application provides an electronic device, wherein a TOF emitting device and a TOF receiving device are packaged independently, so that the TOF receiving device is connected to a main circuit board through a BTB connector, and the TOF emitting device is connected to the main circuit board through a heightening block, so that the reusability of the TOF emitting device and the TOF receiving device can be improved, and the production cost and the maintenance cost are reduced; the bed hedgehopping piece can increase the height of TOF emitting device in electronic equipment's thickness direction, can avoid TOF emitting device's angle of vision to receive the interference to, connect TOF emitting device on main circuit board through the bed hedgehopping piece, multiplexed the space in the electronic equipment thickness direction, can improve the compactness of device overall arrangement in the electronic equipment, be favorable to electronic equipment's miniaturized design.

Drawings

Fig. 1 is a schematic overall structure diagram of an electronic device according to an embodiment of the present application;

fig. 2 is a schematic partial cross-sectional view of an electronic device according to an embodiment of the present application;

FIG. 3 is an enlarged view at B in FIG. 2;

fig. 4 is an exploded view of an electronic device provided in an embodiment of the present application;

FIG. 5 is an exploded view of a display module according to an embodiment of the present disclosure;

fig. 6 is a schematic overall structure diagram of a display module according to an embodiment of the present application;

FIG. 7 is an exploded view of a middle frame assembly according to an embodiment of the present disclosure;

FIG. 8 is a schematic diagram illustrating an overall structure of a middle frame assembly according to an embodiment of the present application;

fig. 9 is a schematic structural diagram of a shielding plate according to an embodiment of the present application;

FIG. 10 is a partial structural view of another angle of the middle plate and the middle plate according to an embodiment of the present disclosure;

fig. 11 is an exploded view of a circuit board assembly according to an embodiment of the present application;

fig. 12 is a schematic diagram illustrating an overall structure of a circuit board assembly according to an embodiment of the present application;

FIG. 13 is an enlarged view at C of FIG. 12;

fig. 14 is an exploded schematic structural diagram of a camera module according to an embodiment of the present disclosure;

fig. 15 is a schematic overall structure diagram of a camera module according to an embodiment of the present application;

fig. 16 is a schematic structural diagram of a display assembly, a middle frame assembly, a circuit board assembly, and a camera assembly according to an embodiment of the present disclosure;

fig. 17 is a schematic partial cross-sectional structure diagram of an electronic device according to an embodiment of the present application;

FIG. 18 is a schematic view of a card according to an embodiment of the present application;

FIG. 19 is an assembled view of a motherboard bracket according to an embodiment of the present application;

FIG. 20 is an enlarged view at D of FIG. 19;

fig. 21 is a schematic structural diagram of a motherboard bracket according to an embodiment of the present application;

fig. 22 is a schematic structural diagram of an electronic device to which the embodiment of the present application is applied.

Description of reference numerals:

100-an electronic device; 11-a display assembly; 111-a cover plate; 112-screen; 1121-light holes; 12-a middle frame assembly; 121-middle frame; 1211-card slot; 122-middle plate; 1221. 1222, 1223-a first through hole; 1224-first locating hole; 1225-a first mounting hole; 123-a shielding sheet; 1230-a plate-like body; 1231-boss; 1231 a-sidewall; 1231 b-top wall; 1232-a second via; 1233. 1234-third via; 13-a camera assembly; 131-a camera; 1311-a base; 1312-lens mount; 1313-lens; 132-TOF receiving device; 133-camera mount; 1331. 1332-an accommodating chamber; 1333-locating posts; 1334-third mounting holes; 14-a circuit board assembly; 141-main circuit board; 1411. 1412-avoidance hole; 1413-a second mounting hole; 1414-a second positioning hole; 142-a block of padding; 143-TOF transmitting device; 144-a buckle; 15-main board support; 151-fourth mounting hole; 152-a first recess; 153-a second recess; 154-a third recess; 16-card; 161-a body section; 162-a connecting segment; 163-a first clamping section; 164-a second clamping section; 171-first gum; 172-second gum; 173-third gum; 174-fourth gum; 175-fifth gum; 176-a screw; 101-a processor; 102-an external memory interface; 1021-internal memory; 103-USB interface; 104-a charge management module; 1041-power management module; 1042-a battery; 105-a mobile communication module; 106-a wireless communication module; 107-an audio module; 1071-speaker; 1072-receiver; 1073-microphone; 1074-a headset interface; 108-a sensor module; 1081-a pressure sensor; 1082-a gyroscope sensor; 1083-touch sensor; 1084-acceleration sensor; 1085-a distance sensor; 1086-proximity light sensor; 1087-fingerprint sensor; 1088 — ambient light sensor; 1090-pressing a key; 1091-a motor; 1092-an indicator; 1093-a camera module; 1094-a display screen; 1095-SIM card interface.

Detailed Description

The embodiment of the application provides an electronic device, which includes but is not limited to a mobile or fixed terminal device with a camera, such as a mobile phone, a tablet computer, a notebook computer, an ultra-mobile personal computer (UMPC), a handheld computer, an interphone, a netbook, a POS machine, a Personal Digital Assistant (PDA), a wearable device, a virtual reality device, a bluetooth sound device, and a vehicle-mounted device.

In the embodiments of the present application, a mobile phone is taken as an example of the electronic device, and the structure of the electronic device is specifically described.

In the drawings of the embodiments of the present application, the X axis may be defined as the width direction of the electronic apparatus 100, the Y axis may be defined as the length direction of the electronic apparatus 100, and the Z axis may be defined as the thickness direction of the electronic apparatus 100. More specifically, the positive direction of the X axis may be defined as a direction from right to left on the display surface when the user uses the electronic device 100, the positive direction of the Y axis may be defined as a direction from bottom to top on the display surface when the user uses the electronic device 100, and the positive direction of the Z axis may be defined as a direction from the back of the electronic device 100 to the display surface.

Fig. 1 is a schematic overall structure diagram of an electronic device according to an embodiment of the present disclosure. Referring to fig. 1, the electronic apparatus 100 includes a display module 11, a middle frame 121, and a camera module 13, the display module 11 and a rear cover (not shown in the figure) are respectively connected to both sides of the middle frame 121, the display module 11, the middle frame 121, and the rear cover together enclose an accommodation space, and a main circuit board, a battery, the camera module 13, and other electronic devices are disposed in the accommodation space. When the user uses the electronic device 100, the display component 11 faces the user's field of view, and displays different pictures for the user, and the rear cover faces away from the user's field of view.

At least one camera may be disposed within the electronic device 100 to implement a photographing function. In the embodiment of the present application, the TOF receiving device 132 and the TOF transmitting device 143 may be disposed in the electronic apparatus 100. The TOF transmitting device 143 is configured to transmit a detection optical signal, and the TOF receiving device 132 is configured to receive an induced optical signal, where the induced optical signal is an optical signal formed by reflecting the detection optical signal by the object to be measured, and the induced optical signal carries depth-of-field information of the object to be measured. By calculating the time difference or phase difference between the emission of the detection light signal by the TOF emitting device 143 and the reception of the sensing light signal by the TOF receiving device 132, the distance between the object to be measured and the TOF emitting device 143 and the TOF receiving device 132 can be calculated. The TOF transmitting device 143 and the TOF receiving device 132 are used in cooperation, and can be applied to environments such as distance measurement, face recognition, head portrait unlocking, gesture recognition, object modeling, 3D games, smart homes, and the like.

The electronic device 100 may further include a camera 131, the camera 131 may be an RGB camera, an infrared camera, a black and white camera, or the like, and the camera 131, the TOF receiving device 132, and the TOF transmitting device 143 are used in combination, so that a better shooting effect may be achieved.

The camera 131, the TOF receiving device 132, and the TOF transmitting device 143 may be as shown in fig. 1, as a front camera of the electronic apparatus 100, with the light transmitting side facing the side of the electronic apparatus 100 having the display assembly 11. In another possible implementation, they may also be used as a rear camera of the electronic device 100, with the light-transmitting side facing the side of the electronic device 100 with the rear cover. Here, the light-transmitting side of the camera 131 and the TOF receiving device 132 refers to a light-entering side, i.e., a side toward which the lens faces, and the light-transmitting side of the TOF transmitting device 143 refers to a light-exiting side, i.e., a side toward which the light source of the TOF transmitting device 143 transmits the light signal.

The camera 131, the TOF receiving device 132, and the TOF transmitting device 143 are arranged adjacently to save space and achieve a miniaturized design of the electronic apparatus 100. The positions of the camera 131, the TOF receiving device 132, and the TOF transmitting device 143 are not particularly limited in the present embodiment, and may be located at the upper left corner of the electronic apparatus 100, for example.

In the related art, the TOF transmitting device and the TOF receiving device are integrally designed, and are integrated in a bracket, and lead out from the same BTB connector and are connected to a main circuit board in the electronic equipment. The TOF transmitting device and the TOF receiving device are integrated, and the arrangement mode can reduce reusability of the TOF transmitting device and the TOF receiving device in a product design type selection stage and a product after-sale maintenance stage, and increase production cost and maintenance cost.

Based on the above description, the embodiments of the present application provide an electronic device, where the TOF transmitting device and the TOF receiving device are packaged independently of each other, so that the TOF receiving device is connected to the main circuit board through the BTB connector, and the TOF transmitting device is connected to the main circuit board through the block, which can improve the reusability of the TOF transmitting device and the TOF receiving device, and reduce the production cost and the maintenance cost.

Fig. 2 is a schematic partial cross-sectional view of an electronic device according to an embodiment of the present disclosure, where the cutting position corresponds to a-a in fig. 1, and fig. 3 is an enlarged view of B in fig. 2. Referring to fig. 2 to 3, in the embodiment of the present application, a main circuit board 141, a camera holder 133, and a block 142 are disposed in the accommodating space of the electronic device 100. Two holes of dodging have been seted up to main circuit board 141, camera support 133 is connected in the first side of main circuit board 141, camera 131 and TOF receiving device 132 are connected on camera support 133, stretch into two respectively and dodge downthehole and stretch out to the second side of main circuit board 141, block 142 that steps up connects on main circuit board 141 is located two areas of dodging between the hole, and block 142 that steps up connects in main circuit board 141's second side, TOF transmitting device 143 is connected keeping away from at block 142 that steps up one side of main circuit board 141, camera 131, TOF receiving device 132 and TOF transmitting device 143 the printing opacity side all towards the second side of main circuit board 141. Note that the first side and the second side of the main circuit board 141 correspond to the lower side and the upper side of the main circuit board 141 in fig. 2, respectively.

In the embodiment of the present application, the camera 131 and the TOF receiving device 132 can be electrically connected to the main circuit board 141 through the BTB connector, and the TOF transmitting device 143 is electrically connected to the main circuit board 141 through the block 142, so that the TOF receiving device 132 and the TOF transmitting device 143 are separated, the reusability of the TOF transmitting device and the TOF receiving device can be improved, and the production cost and the maintenance cost are reduced.

On the one hand, the block 142 may increase the height of the TOF emitting device 143 in the thickness direction of the electronic apparatus 100, and may prevent the angle of view of the TOF emitting device 143 from being interfered. On the other hand, the TOF emitting device 143 is electrically connected to the main circuit board 141 through the block 142, a BTB connector is not required to be provided, the structure is simpler, and the volume occupied by the TOF emitting device 143 can be reduced, thereby facilitating improvement of the compactness of device arrangement in the electronic device 100.

Illustratively, the raised block 142 may be a land grid array packaged LGA module, the LGA module is a land grid array packaged module, the TOF emitting device 143 is connected on top of the LGA module, and pads are distributed on the bottom of the LGA module, and the LGA module may be soldered on the main circuit board 141 through the pads.

The camera 131 and the TOF receiving device 132 each comprise a base 1311, a lens mount 1312 and a lens 1313 connected in sequence, the size of the lens mount 1312 and the lens 1313 is smaller than that of the base 1311, the base 1311 is connected in the camera bracket 133, the lens mount 1312 and the lens 1313 extend out of the relief hole to the second side of the main circuit board 141, the minimum distance L1 between the heightening block 142 and the surface of the camera bracket 133 far away from the main circuit board 141 is larger than the maximum distance L2 between the base 1311 and the surface of the camera bracket 133 far away from the main circuit board 141

The radial dimensions of the lens mount 1312 and the lens 1313 are smaller than the radial dimensions of the base 1311, i.e. the distance between the edges of the lens mount 1312 and the lens 1313 and the axis of the camera 131 is smaller than the distance between the edges of the base 1311 and the camera 131. Therefore, the space between the camera 131 and the lens 1313 of the TOF receiving device 132, and the space between the camera 131 and the lens mount 1312 of the TOF receiving device 132 have a larger accommodating space than the space between the respective bases 1311. The TOF transmitting device 143 is stacked on the main circuit board 141 between the camera 131 and the TOF receiving device 132 through the block 142, and therefore, the block 142 and the TOF transmitting device are arranged in the larger accommodating space, and compared with a manner in which the TOF transmitting device 143 and the TOF receiving device 132 are arranged side by side, the space in the height direction of the camera 131 and the TOF receiving device 132 is multiplexed, and compactness of the layout of the devices in the electronic apparatus 100 can be improved.

Moreover, the TOF transmitting device 143 is stacked on the main circuit board 141 between the camera 131 and the TOF receiving device 132 through the block 142, the distance between the transmitting axis of the TOF transmitting device 143 and the receiving axis of the TOF receiving device 132 can be shortened, the coverage of the transmitting field of view of the TOF transmitting device 143 and the receiving field of view of the TOF receiving device 132 is made higher, and the ranging effect is made better.

In a possible implementation, the arrangement of the camera 131, the TOF receiving device 132 and the TOF transmitting device 143 may be applied to the layout of the rear camera in the electronic device 100. At this time, the second side of the main circuit board 141 is disposed toward the rear cover of the electronic device 100, and an opening is disposed on the rear cover, and a transparent lens is connected to the opening, so that external light can enter the camera 131 and the TOF receiving device 132, and light emitted by the TOF emitting device 143 can smoothly pass through the opening.

In another possible implementation, with continued reference to fig. 2-3, the arrangement of the camera 131, the TOF receiving device 132 and the TOF transmitting device 143 may be applied to the layout of the front camera in the electronic device 100. At this time, the second side of the main circuit board 141 is disposed toward the display module 11 of the electronic device 100, the display module 11 includes a screen 112 and a cover plate 111 covering the screen 112, and the screen 112 is opened with light-transmitting holes corresponding to the camera 131, the TOF receiving device 132, and the TOF emitting device 143, so as to allow light to pass through.

A middle plate 122 is further disposed in the accommodating space of the electronic device 100, the middle plate 122 is connected to the inside of the middle frame 121 for supporting the display assembly 11 and connecting other devices inside the electronic device 100, and the middle frame 121 is exposed to the outside as a side frame of the electronic device 100. The middle frame 121 and the middle plate 122 may be a single piece and may be made of metal, ceramic, glass, or the like.

The screen 112 may be adhered to the middle plate 122, the cover plate 111 may be connected to the screen 112 by an optical adhesive layer, and the peripheral edge of the cover plate 111 may be adhered and fixed to the middle frame 121. The screen 112 may be an Organic Light Emitting Diode (OLED) display module, and the screen 112 is a laminated structure including a polarizer, a display panel, a touch layer, a substrate, and an optical adhesive layer connecting two adjacent layers. The cover plate 111 is exposed outside the electronic device 100 and may function to protect the screen 112, the cover plate 111 may be transparent glass or plastic, and the screen 112 and the cover plate 111 may be flat or curved.

The main circuit board 141 may be fixedly connected to the middle frame 121 or the middle plate 122, and the main circuit board 141 and the middle plate 122 are disposed opposite to each other and located on a side of the middle plate 122 away from the display module 11. The middle plate 122 may be provided with first through holes corresponding to the camera 131, the TOF receiving device 132 and the TOF transmitting device 143, and the camera 131 and the TOF receiving device 132 penetrate through the avoiding hole in the main circuit board 141 and the first through hole in the middle plate 122 and extend into the light transmitting hole in the screen 112, so that the camera 131 and the TOF receiving device 132 are disposed close to the cover plate 111 and have a larger field angle.

The camera 131, the TOF transmitting device 143 and the TOF receiving device 132 can be arranged along the width direction of the electronic device 100, the TOF transmitting device 143 is arranged between the camera 131 and the TOF receiving device 132 and is connected to the main circuit board, the space in the thickness direction of the electronic device 100 is utilized, and compared with a scheme that the TOF transmitting device 143 and the TOF receiving device 132 share a support and are arranged side by side, the size of the light transmission hole in the screen 112 in the width direction of the electronic device 100 can be reduced, and the attractiveness of the electronic device 100 is improved.

The middle plate 122 is further connected with a shielding plate 123 on a side facing the main circuit board 141, and the shielding plate 123 is a metal sheet, such as a stainless steel sheet or an aluminum alloy sheet. The shielding sheet 123 is arranged between the middle plate 122 and the camera 131, the TOF transmitting device 143 and the TOF receiving device 132, a second through hole is arranged at a position corresponding to the TOF transmitting device 143 on the shielding sheet 123, a third through hole is arranged at a position corresponding to the camera 131 and the TOF receiving device 132, and the second through hole and the third through hole on the shielding sheet 123 correspond to the first through hole on the middle plate 122 respectively so as to facilitate light transmission.

The shielding sheet 123 includes a plate-shaped main body 1230 and a protrusion 1231 protruding from the plate-shaped main body 1230, and the protrusion 1234 is located in the middle of the plate-shaped main body 1230 and extends into a first through hole of the middle plate 122 corresponding to the TOF emitting device 143. Third through holes provided corresponding to the camera 131 and the TOF receiving device 132 are provided on the plate-shaped main body 1230 on both sides of the projection 1231, respectively. The protrusion 1231 includes a side wall 1231a and a top wall 1232b, where the side wall 1231a surrounds the TOF emitting device 143 to play a shielding role, so as to avoid signal interference between the TOF emitting device 143 and the camera 131 and the TOF receiving device 132 when the distance between the TOF emitting device 143 and the camera 131 is small. A second through hole, which is provided corresponding to the TOF emitting device 143, is located on the top wall 1232 b.

A first adhesive tape 171 is arranged between the screen 112 and the middle plate 122, the first adhesive tape 171 is positioned around the light transmission hole on the screen 112 and around the first through hole on the middle plate 122, a sealed space can be formed, dust is prevented from entering lens areas of the camera 131, the TOF transmitting device 143 and the TOF receiving device 132 through a gap between the screen 112 and the middle plate 122, and a dustproof effect is achieved.

The plate-shaped main body 1230 of the shielding plate 123 can be adhered to the middle plate 122 through the second adhesive 172, the second adhesive 172 is located around the first through hole on the middle plate 122 and around the third through hole of the shielding plate 123, a sealed space can be formed, dust is prevented from entering the lens areas of the camera 131, the TOF transmitting device 143 and the TOF receiving device 132 through the gap between the middle plate 122 and the shielding plate 123, and a dustproof effect is achieved. In another possible embodiment, the plate-shaped body 1230 of the shield plate 123 may be fixedly coupled to the middle plate 122 by welding.

One side of the shielding sheet 123, which is far away from the middle plate 122, is further connected with a third back adhesive 173, a fourth back adhesive 174 and a fifth back adhesive 175, which are respectively connected between the shielding sheet 123 and the camera 131, the TOF receiving device 132 and the TOF emitting device 143, so as to form a sealed space, prevent dust from entering a lens area through gaps between the shielding sheet 122 and the camera 131, the TOF emitting device 143 and the TOF receiving device 132, and achieve a dustproof effect. The third adhesive 173 and the fourth adhesive 174 are connected to the plate-shaped main body 1230 and located around the third through hole, and the fifth adhesive 175 is connected to the top wall 1231b of the protrusion 1231 and located around the second through hole. It can be seen that the shielding sheet 123 may also provide an adhesive surface besides playing a role of shielding, so that the camera 131, the TOF emitting device 143, and the TOF receiving device 132 are respectively connected with the middle plate 122 in a sealing manner through a back adhesive.

Fig. 4 is an exploded view of an electronic device according to an embodiment of the present application. Referring to fig. 4, in a specific embodiment, the electronic device 100 includes a cover plate 111, a screen 112, a middle frame 121, a middle plate 122, a shielding plate 123, a TOF transmitting device 143, a block 142, a main circuit board 141, a latch 144, a camera 131, a TOF receiving device 132, a camera holder 133, a card 16, a main board holder 15, and the like.

The structure of the electronic device 100 provided in the embodiments of the present application will be described in detail below with reference to specific drawings and embodiments, and according to the assembly sequence of the electronic device 100.

Fig. 5 is an exploded schematic view of a display module according to an embodiment of the present disclosure, and fig. 6 is an overall schematic view of the display module according to the embodiment of the present disclosure. Referring to fig. 5 and 6, the display assembly 11 includes a screen 112 and a cover plate 111, and the display assembly 11 may be obtained by attaching the screen 112 to one side surface of the cover plate 111. Specifically, the bonding between the screen 112 and the cover plate 111 can be realized by optical glue, and the transparent optical glue does not affect the display effect of the screen 112.

A light hole 1121 is provided on the screen 112, and the light hole 1121 is provided at the upper left corner of the screen 112 corresponding to the position of the camera module 13. The light hole 1121 is used to allow external light to enter the camera 131 and the TOF receiving device 132, and allow light emitted by the TOF emitting device 143 to be emitted to the outside of the electronic device 100, so that a photographing function can be implemented. The light transmission hole 1121 may be provided in plural numbers, provided corresponding to the camera 131, the TOF receiving device 132, and the TOF transmitting device 143, respectively. Alternatively, the light transmission holes 1121 may be provided in one, and the shape of the light transmission holes 1121 may be a racetrack shape, i.e., a waist shape, corresponding to the camera 131, the TOF receiving device 132, and the TOF transmitting device 143. The one light hole 1121 is more advantageous for the production process of the screen 112 than a plurality of light holes, and the appearance of the display module 11 is more beautiful.

Fig. 7 is an exploded structural schematic view of a middle frame assembly according to an embodiment of the present application, fig. 8 is an overall structural schematic view of the middle frame assembly according to the embodiment of the present application, and fig. 9 is a structural schematic view of a shielding plate according to the embodiment of the present application. Referring to fig. 7 to 9, the middle frame assembly 12 includes a middle frame 121, a middle plate 122 and a shield plate 123, and the middle frame 121 and the middle plate 122 are a single piece. The middle frame assembly 12 can be obtained by attaching a first adhesive 171 to a side of the middle plate 122 facing the screen 112, attaching the shielding plate 123 to a side of the middle plate 122 away from the screen 112 through a second adhesive 172, and attaching a third adhesive 173, a fourth adhesive 174, and a fifth adhesive 175 to a side of the shielding plate 123 away from the middle plate 122.

First through

holes

1221, 1222, 1223 are opened on the middle plate 122, and are respectively disposed corresponding to the camera 131, the TOF receiving device 132 and the TOF transmitting device 143, the first through hole 1223 is located between the first through

holes

1221 and 1222, the first through

holes

1221 and 1222 are circular through holes, and the first through hole 1223 is a rectangular through hole.

The shielding plate 123 includes a plate-shaped main body 1230 and a protrusion 1231, an outer contour of the plate-shaped main body 1230 may be track-shaped, and the protrusion 1231 is connected to a middle portion of the plate-shaped main body 1230. The size of the protrusion 1231 is matched to the size of the TOF emitting device 143 as a whole, so that the side wall 1231a of the protrusion 1231 can cover the periphery of the TOF emitting device 143, and the top wall 1231b of the protrusion 1231 is connected to the top of the TOF emitting device 143.

The plate-shaped main body 1230 is provided with third through

holes

1233 and 1234 respectively located at two sides of the protrusion 1231, and the third through holes are circular holes and respectively correspond to the camera 131 and the TOF receiving device 132. The top wall 1231b of the protrusion 1231 is provided with a second through hole 1232, and the second through hole 1232 is a rectangular hole and has a size matching the lens size of the TOF emitting device 143 so as not to obstruct the angle of view of the TOF emitting device 143.

The first back adhesive 171 covers around the first through

holes

1221, 1222, 1223 of the middle plate 122 to hermetically connect the middle plate 122 and the screen 112. The shape of the outer contour of the first back adhesive 171 is not particularly limited, and may be, for example, a rectangular shape. The second back glue 172 covers around the first through

holes

1221, 1222, 1223 of the middle plate 122 and around the third through

holes

1233 and 1234 of the shield plate 123 to hermetically connect the middle plate 122 and the shield plate 123. The shape of the outer contour of the second back adhesive 172 is identical to the shape of the outer contour of the shield plate 123, and is racetrack-shaped. The second adhesive 172 may cover the entire area of the plate-shaped body 1230 to improve the sealing effect. The third gum 173 covers the third through hole 1233 and has a circular ring shape as a whole, and the fourth gum 174 covers the third through hole 1234 and has a circular ring shape as a whole. The fifth adhesive 175 is adhered to the top wall 1231b of the protrusion 1231 and covers the periphery of the second through hole 1232, and has a rectangular outer contour.

Fig. 10 is a schematic structural diagram of another angle between the middle plate and the middle plate according to an embodiment of the present application. Referring to fig. 10, the middle plate 122 is further provided with a first positioning hole 1224 and a first mounting hole 1225, a columnar structure is convexly provided on a side surface of the middle plate 122 facing the main circuit board 141, the first positioning hole 1224 and the first mounting hole 1225 are blind holes provided on the columnar structure, and the first mounting hole 1225 may be a screw hole. The first positioning holes 1224, which are at least two in number, are disposed near the first through

holes

1221 and 1222, respectively, for positioning connection of the camera bracket 133. The number of the first mounting holes 1225 is at least two, and the first mounting

holes

1221 and 1222 are disposed near the first through holes, respectively, for fixedly connecting the camera bracket 133 and the main board bracket 15.

Fig. 11 is an exploded view of a circuit board assembly according to an embodiment of the present application, fig. 12 is an overall view of the circuit board assembly according to the embodiment of the present application, and fig. 13 is an enlarged view of a point C in fig. 12. Referring to fig. 11-13, the circuit board assembly 14 includes a main circuit board 141, a block 142, a TOF emitting device 143, and a clip 144. The circuit board assembly 14 can be obtained by attaching the block 142 to the side of the main circuit board 141 facing the middle plate 122, attaching the TOF transmitting device 143 to the block 142, and attaching the clip 144 to the side of the main circuit board 141 facing away from the middle plate 122.

The main circuit board 141 is provided with

avoidance holes

1411 and 1412, the

avoidance holes

1411 and 1412 can be rectangular holes, and are formed in the upper left corner of the main circuit board 141 and used for avoiding the camera 131 and the TOF receiving device 132 respectively. The block 142 is located between the avoiding holes 1411 and 1422 and can be connected with the main circuit board 141 by welding, the block 142 is used for increasing the height of the TOF receiving device relative to the main circuit board 141, and meanwhile, the TOF receiving device 132 can be electrically connected with the main circuit board 141 through the block 142. The avoiding

holes

1411 and 1412 may be openings formed in the main circuit board 141 or may be holes formed at the edge of the main circuit board 141.

The main circuit board 141 is further provided with a second mounting hole 1413 and a second positioning hole 1414, and the second mounting hole 1413 and the second positioning hole 1414 are through holes formed in the main circuit board 141. The number of the second mounting holes 1413 is at least two, and the second mounting holes 1413 are respectively arranged near the two avoiding

holes

1411 and 1412 and are arranged corresponding to the first mounting holes 1225 on the middle plate 122, so as to realize the fixed connection of the main circuit board 141, the middle plate 122, the camera support 133 and the main board support 15. The number of the second positioning holes 1414 is at least two, and the second positioning holes 1414 are respectively arranged near the two

avoidance holes

1411 and 1412, and respectively arranged near the two second mounting holes 1413, and are arranged corresponding to the first positioning holes 1224 on the middle plate 122, so as to realize the positioning connection of the main circuit board 141, the middle plate 122 and the camera support 133.

The clip 144 can be soldered to the main circuit board 141 for mating with the card 16 to secure the camera bracket 133 to the main circuit board 141 and the center frame 121. The latch 144 is connected to a side of the main circuit board 141 away from the middle plate 122, on a side of the two avoidance holes 1411 and 1422 facing the positive direction of the Y axis, and is disposed at a position close to a midpoint of the two avoidance holes 1411 and 1422 in the X axis direction.

Fig. 14 is an exploded schematic structural diagram of a camera module according to an embodiment of the present application, and fig. 15 is an overall structural diagram of the camera module according to the embodiment of the present application. Referring to fig. 14 and 15, the camera assembly 13 includes a camera 131, a TOF receiving device 132, and a camera holder 133. The camera 131 and the TOF receiving device 132 are respectively mounted in the camera holder 133, and the image pickup assembly 13 is obtained.

The camera bracket 133 is a rectangular frame, the rectangular frame is provided with

accommodating cavities

1331 and 1332, openings of the

accommodating cavities

1331 and 1332 are arranged toward the middle plate 122, and the accommodating cavities are used for accommodating the camera 131 and the TOF receiving device 132 respectively. The camera 131 and the TOF receiving device 132 have the same structure, and each of the camera 131 and the TOF receiving device 132 includes a base 1311 at the bottom, a lens holder 1312 connected to the base 1311, and a lens 1313 connected to the lens holder 1312, where the base 1311 is cube, the lens holder 1312 and the lens 1313 are cylindrical, the base 1311 is installed at the bottom in an accommodating cavity of the camera bracket 133, and may be fixed by adhesive, for example, the upper portion of the base 1311 extends out of the accommodating cavity and may be accommodated in an avoiding hole of the main circuit board 141, and the lens holder 1312 and the lens 1313 extend out to a side of the main circuit board 141 facing the middle plate 122.

The camera bracket 133 further includes a positioning column 1333 and a third mounting hole 1334, the positioning column 1333 and the third mounting hole 1334 are both column-shaped structures connected to the outer side of the rectangular frame, the positioning column 1333 extends towards the side close to the main circuit board 141, and the third mounting hole 1334 is a through hole opened in the column-shaped structure. The number of the positioning posts 1333 is at least two, and the positioning posts correspond to the first positioning holes 1224 on the middle plate 122 and the second positioning holes 1414 on the main circuit board 141. The number of the third mounting holes 1334 is at least two and is provided to correspond to the first mounting holes 1225 of the middle plate 122 and the second mounting holes 1413 of the main circuit board 141.

Fig. 16 is a schematic structural diagram of a display module, a middle frame module, a circuit board module, and a camera module according to an embodiment of the present disclosure. Referring to fig. 16, after the display module 11, the middle frame module 12, the circuit board assembly 14 and the camera module 13 are assembled, the display module 11 may be connected to the middle frame module 12, the circuit board assembly 14 may be connected to the middle frame module 12, the camera module 13 may be connected to the middle frame module 12 and the circuit board assembly 14, and further fixed by the card 16.

Specifically, the screen 112 is attached to the middle plate 122 by dispensing or applying adhesive, and the light-transmitting hole 1121 on the screen 112 and the periphery of the first through hole on the middle plate 122 are sealed by the first adhesive 171; the circuit board assembly 14 is attached to the middle frame assembly 12 by screws not shown in the figure, and the TOF emitting device 143 is stuck to the shielding plate 123 by a fifth back adhesive 175; the positioning post 1333 of the camera bracket 133 extends into the first positioning hole 1224 of the middle plate 122 and the second positioning hole 1414 of the main circuit board 141, and is fixed by the card 16, and the camera 131 and the TOF receiving device 132 are respectively adhered to the shielding plate 123 by the third back adhesive 173 and the fourth back adhesive 174, so as to connect the camera assembly 13 with the middle frame assembly 12 and the circuit board assembly 14.

Fig. 17 is a schematic partial cross-sectional structure view of an electronic device according to an embodiment of the present application, and fig. 18 is a schematic structural view of a card according to an embodiment of the present application. Referring to fig. 17 and 18, card 16 includes a body section 161, a first clamping section 163, a second clamping section 164, and two connecting sections 162, wherein one connecting section 162 is connected between body section 161 and first clamping section 163, and the other connecting section 162 is connected between body section 161 and second clamping section 163.

A clamping groove 1211 is formed in an inner side wall of the middle frame 121, a buckle 144 is fixed on one side of the main circuit board 141 away from the middle plate 122, the main body section 161 of the card 16 abuts against the bottom of the camera bracket 133, and the first clamping section 163 and the second clamping section 164 of the card 16 are respectively clamped in the clamping groove 1211 and the buckle 144, so that the camera assembly 13, the middle frame assembly 12 and the circuit board assembly 14 are further fixed.

Fig. 19 is an assembly diagram of a motherboard bracket according to an embodiment of the present application, fig. 20 is an enlarged view of a portion D in fig. 19, and fig. 21 is a structural diagram of the motherboard bracket according to the embodiment of the present application. Referring to fig. 19 to 21, after the assembly of the display module 11, the middle frame module 12, the circuit board module 14, the camera module 13 and the card 16 in the above process is completed, the main board bracket 15 may be fixed to the middle frame module 12 by screws 176.

The motherboard bracket 15 is provided with a fourth mounting hole 151, the fourth mounting hole 151 is a through hole, the number of the fourth mounting holes is at least two, the positions of the fourth mounting holes correspond to the first mounting hole 1225 on the middle plate 122, the second mounting hole 1414 on the main circuit board 141 and the third mounting hole 1334 on the camera bracket 133, and the screws 176 are connected with the fourth mounting hole 151, the third mounting hole 1334, the second mounting hole 1414 and the first mounting hole 1225, so that the motherboard bracket 15 is fixed on the middle plate 122.

The main board support 15 is disposed on a side of the main circuit board 141 facing away from the middle plate 122, and is disposed opposite to the main circuit board 141 to support the main circuit board 141. The main circuit board 141 is further provided with a first recess 152 corresponding to the camera bracket 133, a second recess 153 corresponding to the card 16, and a third recess 154 corresponding to the clip 144 for accommodating the camera bracket 133, the card 16, and the clip 144.

It should be understood that other components such as a battery and the like which need to be connected to the main circuit board 141 are also provided in the electronic device 100, and after the circuit board assembly 14 is pre-attached to the middle frame assembly 12 by screws, the camera assembly 13 may be sequentially connected, the BTB connector extending from the camera assembly 113 may be fastened to the main circuit board 14, and the components such as the battery and the like may be connected to the main circuit board 141. Finally, the main board support 15 is fixed to the middle frame assembly 12 by screws 176, and the main board support 15 is provided with a plurality of screws at other positions besides the fourth mounting holes 151 shown in the figure, and all the screws are locked at this time, so as to ensure the reliable connection of the middle frame assembly 12, the circuit board assembly 14 and the main board support 15.

According to the assembling sequence of the electronic device 100, it can be obtained that the TOF transmitting device 143 and the TOF receiving device 132 are not integrated together but are independently installed, and in the product design and model selection stage, the TOF transmitting device 143 and the TOF receiving device 132 are decoupled and do not need to be used in a matched manner, different models can be selected respectively, and the applicability is wider.

In the after-sale maintenance stage of the product, when one of the TOF transmitting device 143, the TOF receiving device 132 and the camera 131 has a failure, the screws 176 may be firstly removed, the main board bracket 15 is removed, then the card 16 is removed, the camera assembly 13 is removed, and the TOF receiving device 132 or the camera 131 having the failure is maintained or replaced, or the circuit board assembly 14 is continuously removed to maintain or replace the TOF transmitting device 143 having the failure. In the after-sales maintenance stage, only the failed device can be maintained or replaced, so that the problem that the TOF transmitting device 143 and the TOF receiving device 132 need to be replaced simultaneously when being integrally arranged is avoided, and the maintenance cost can be reduced.

Fig. 22 is a schematic structural diagram of an electronic device to which the embodiment of the present application is applicable, and referring to fig. 22, the electronic device may include: the mobile terminal includes a processor 101, an external memory interface 102, an internal memory 1021, a Universal Serial Bus (USB) interface 103, a charging management module 104, an antenna 1, an antenna 2, a mobile communication module 105, a wireless communication module 106, an audio module 107, a sensor module 108, keys 1090, a motor 1091, an indicator 1092, a camera module 1093, a display 1094, and a Subscriber Identity Module (SIM) card interface 1095. It is to be understood that the illustrated structure of the present embodiment does not constitute a specific limitation to the electronic device. In other embodiments of the present application, an electronic device may include more or fewer components than shown, or some components may be combined, some components may be split, or a different arrangement of components may be used. The illustrated components may be implemented in hardware, software, or a combination of software and hardware.

Among other things, the functions of the processor 101 include: run an operating system, process various data, run applications, and control a plurality of hardware coupled to the processor 101 to perform corresponding functions. In hardware, the processor 101 may be formed of one or more chips. Processor 101 may include one or more processing units, such as: an Application Processor (AP), a Graphics Processing Unit (GPU), an Image Signal Processor (ISP), a Digital Signal Processor (DSP), a baseband processor, a Display Processing Unit (DPU), and/or a neural-Network Processing Unit (NPU), etc.

Internal memory 1021 may be used to store one or more computer programs, which include instructions. The processor 101 may execute the above-mentioned instructions stored in the internal memory 1021, so as to make the electronic device execute various functional applications, data processing, and the like. The external memory interface 102 may be used to connect an external memory card, such as a Micro SD card, and the external memory card communicates with the processor 101 through the external memory interface 102 to implement a data storage function, such as saving data files of music, photos, videos, and the like in the external memory card.

In some embodiments, the processor 101 may include one or more interfaces, which may include an integrated circuit (I2C) interface, a general-purpose input/output (GPIO) interface, a Subscriber Identity Module (SIM) interface, and/or a Universal Serial Bus (USB) interface, among others. The USB interface 103 is an interface conforming to the USB standard specification, and may specifically be a Mini USB interface, a Micro USB interface, a USB Type C interface, or the like. The USB interface 103 may be used to connect a charger to charge an electronic device, and be used to transmit data between the electronic device and a peripheral device, or be used to connect an earphone to play audio through the earphone.

The charging management module 104 is configured to receive charging input from a charger. The charger may be a wireless charger or a wired charger. In some wired charging embodiments, the charging management module 104 may receive charging input from a wired charger via the USB interface 103. In some wireless charging embodiments, the charging management module 104 may receive a wireless charging input through a wireless charging coil of the electronic device. The charging management module 104 may also supply power to the electronic device through the power management module 1041 while charging the battery 1042. The power management module 1041 is used for connecting the battery 1042, the charging management module 104 and the processor 101. The power management module 1041 receives the input of the battery 1042 and/or the charging management module 104, and supplies power to the processor 101, the internal memory 1021, the display screen 1094, the camera module 1093, the wireless communication module 106, and the like. The power management module 1041 may also be used to monitor parameters such as battery capacity, battery cycle number, battery state of health (leakage, impedance), and the like.

The wireless communication function of the electronic device may be implemented by the antenna 1, the antenna 2, the mobile communication module 105, the wireless communication module 106, and the like. The antennas 1 and 2 are used for transmitting and receiving electromagnetic wave signals. Each antenna in an electronic device may be used to cover a single or multiple communication bands, and the antennas may be implemented in a variety of forms, such as using a metal bezel, using a flexible main circuit board, and so forth.

The electronic device may implement display functions via the GPU, the display screen 1094, and the application processor, etc. The GPU is a microprocessor for image processing, connected to the display screen 1094 and the application processor, and is used for performing mathematical and geometric calculations and performing graphics rendering. In some embodiments, the electronic device may include 1 or N display screens 1094, N being a positive integer greater than 1. The display screen 1094 includes the screen 112 of the display assembly 11 described in the above embodiments. In addition, the electronic device may implement a camera function through the ISP, camera module 1093, video codec, GPU, one or more display screens 1094, application processor, and the like. The camera module 1093 includes the camera 131, the TOF receiving device 132, and the TOF transmitting device 143 described in the above embodiments.

The electronic device may implement audio functions such as music playing, sound recording, and the like through the audio module 107, the speaker 1071, the receiver 1072, the microphone 1073, the headphone interface 1074, and the application processor. The audio module 107 is configured to convert digital audio information into an analog audio signal for output, and also configured to convert an analog audio input into a digital audio signal, and the audio module 107 is further configured to encode and decode the audio signal. The speaker 1071 is used to convert an audio electric signal into a sound signal, and the electronic device can listen to music through the speaker 1071 or listen to a hands-free call. The receiver 1072 is used to convert an audio electric signal into a sound signal, and when the electronic device answers a call or voice information, it is possible to answer a voice by placing the receiver 1072 close to the human ear. The microphone 1073 is used to convert a voice signal into an electric signal, and when a call is made or a voice message is transmitted, a user can input the voice signal into the microphone 1073 by making a voice near the microphone 1073 through the mouth of the user. The headphone interface 1074 is used to connect a wired headphone, and the headphone interface 1074 may be a USB interface 103, an open mobile electronic device platform (OMTP) standard interface of 3.5mm, or a Cellular Telecommunications Industry Association (CTIA) standard interface.

The sensor module 108 may include a pressure sensor 1081, a gyroscope sensor 1082, a touch sensor 1083, an acceleration sensor 1084, a distance sensor 1085, a proximity light sensor 1086, a fingerprint sensor 1087, an ambient light sensor 1088, and so forth.

The pressure sensor 1081 is configured to sense a pressure signal, and convert the pressure signal into an electrical signal, the pressure sensor 1081 may be disposed on the display screen 1094, and when a touch operation is applied to the display screen 1094, the electronic device detects the intensity of the touch operation and calculates a touched position according to the pressure sensor 1081. Touch sensor 1083, also referred to as a touch panel or touch sensitive surface, can be disposed on display screen 1094, and comprises touch sensor 1083 and display screen 1094, also referred to as a touch screen. The touch sensor 1083 is configured to detect a touch operation applied thereto or thereabout and to communicate the detected touch operation to the application processor for determining a touch event type.

The gyro sensor 1082 may be used to determine the motion pose of the electronic device, and in some embodiments, the angular velocity of the electronic device about three axes (i.e., x, y, and z axes) may be determined by the gyro sensor 1082 for capturing anti-shake, navigation, body-sensing game scenes, and the like. The acceleration sensor 1084 can detect the magnitude of acceleration of the electronic device in various directions (typically three axes). When the electronic equipment is static, the gravity sensing device can detect the size and the direction of gravity, can also be used for identifying the posture of the electronic equipment, and is applied to horizontal and vertical screen switching, pedometers and other applications. The distance sensor 1085 is used to measure distance to achieve fast focus. The proximity light sensor 1086 may use a photodiode to detect infrared reflected light from a nearby object, and the electronic device may use the proximity light sensor 1086 to detect that a user holds the electronic device close to the ear for communication, so as to automatically turn off the screen to achieve the purpose of power saving, and the proximity light sensor 1086 may also be used in a holster mode, a pocket mode automatically unlocking and locking the screen, and other scenes. The ambient light sensor 1089 is configured to sense an ambient light level, and the electronic device may adaptively adjust the brightness of the display 1094 according to the sensed ambient light level. The ambient light sensor 1088 may also be used to automatically adjust the white balance when taking a picture. The fingerprint sensor 1087 is used for collecting fingerprints, and the electronic device can utilize characteristics of the collected fingerprints to unlock the fingerprints, access the application lock, photograph the fingerprints, answer an incoming call with the fingerprints, and the like.

The keys 1090 include a power-on key, a volume key, and the like. The keys 1090 may be mechanical keys or touch keys. The electronic device may receive a key input, and generate a key signal input related to user settings and function control of the electronic device. The SIM card interface 1095 is used to connect a SIM card. The SIM card can be attached to and detached from the electronic device by being inserted into the SIM card interface 1095 or being pulled out of the SIM card interface 1095. The electronic equipment can support 1 or N SIM card interfaces, and N is a positive integer greater than 1. The SIM card interface 1095 may support a Nano SIM card, a Micro SIM card, a SIM card, etc. The electronic equipment realizes functions of conversation, data communication and the like through the interaction of the SIM card and the network.

In the embodiments of the present application, it should be noted that, unless otherwise specifically stated or limited, the terms "mounted," "connected," and "connected" are to be understood in a broad sense, and may be, for example, fixedly connected, indirectly connected through an intermediate medium, connected through the inside of two elements, or in an interaction relationship between two elements. The specific meanings of the above terms in the embodiments of the present application can be understood by those of ordinary skill in the art according to specific situations. The terms "first," "second," "third," and the like in the description and in the claims of the embodiments of the application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.

Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the embodiments of the present application, and are not limited thereto; although the embodiments of the present application have been described in detail with reference to the foregoing embodiments, those skilled in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.

Claims

1. An electronic device, comprising: the display assembly, the middle frame and the rear cover are jointly enclosed to form an accommodating space, and a main circuit board, a camera, a TOF (time of flight) emitting device, a TOF receiving device, a heightening block and a camera support are arranged in the accommodating space;

the camera support sets up the first side of main circuit board, two dodge the hole have been seted up on the main circuit board, the camera with TOF receiving device connects on the camera support, and from two respectively dodge the hole and extend to the second side of main circuit board, it connects to fill up high piece be located two on the main circuit board dodge the region between the hole, it is located to fill up high piece the second side of main circuit board, TOF transmitting device connects keeping away from of fill up high piece one side of main circuit board and passing through fill up high piece with main circuit board electricity is connected, the camera TOF receiving device with TOF transmitting device's printing opacity side all moves towards the second side of main circuit board.

2. The electronic device according to claim 1, wherein the camera and the TOF receiving device each include a base, a lens mount, and a lens, which are connected in sequence, the radial dimension of the lens mount and the lens is smaller than that of the base, the base is connected in the camera support, the lens mount and the lens extend out of the avoiding hole to the second side of the main circuit board, and a minimum distance between the block for heightening and a surface of the camera support far away from the main circuit board is greater than a maximum distance between the base and the surface of the camera support far away from the main circuit board.

3. The electronic device of claim 1, wherein a middle plate is connected to an inside of the middle frame, the display component and the main circuit board are respectively disposed on two sides of the middle plate, the display component includes a screen and a cover plate, the screen is attached to the middle plate, the cover plate covers the screen, a light hole corresponding to the camera, the TOF receiving device and the TOF transmitting device is disposed on the screen, and a first through hole corresponding to the camera, the TOF receiving device and the TOF transmitting device is disposed on the middle plate.

4. The electronic device of claim 3, wherein a first adhesive is bonded between the screen and the middle plate, and the first adhesive is disposed around the light-transmitting hole and around the first through hole.

5. The electronic device of claim 4, wherein a shielding plate is further connected to a side of the middle plate facing the main circuit board, the shielding plate includes a plate-shaped main body and a protrusion connected to the plate-shaped main body, the protrusion extends into a first through hole of the middle plate corresponding to the TOF emitting device, a sidewall of the protrusion encloses the TOF emitting device, a top wall of the protrusion is provided with a second through hole corresponding to the TOF emitting device, and the plate-shaped main body is provided with a third through hole corresponding to the camera and the TOF receiving device.

6. The electronic apparatus according to claim 5, wherein the plate-like body is welded to the middle plate; alternatively, the first and second electrodes may be,

the plate-shaped main body is bonded on the middle plate through second gum, and the second gum is arranged around the first through hole and around the second through hole.

7. The electronic device according to claim 5, wherein a third adhesive tape and a fourth adhesive tape are respectively connected between the plate-shaped main body and the camera and between the plate-shaped main body and the TOF receiving device, and the third adhesive tape and the fourth adhesive tape are respectively disposed around the third through hole.

8. The electronic device of claim 5, wherein a fifth adhesive is connected between the top wall of the protrusion and the TOF emitting device, and the fifth adhesive is disposed around the second through hole.

9. The electronic device according to any one of claims 3 to 8, wherein a positioning post is disposed on the camera support, a first positioning hole is disposed on the middle plate, a second positioning hole is disposed on the main circuit board, and the positioning post is connected to the first positioning hole and the second positioning hole in a matching manner.

10. The electronic device according to any one of claims 3 to 8, wherein a card and a buckle are further arranged in the accommodating space, the buckle is welded on one side of the main circuit board, which faces away from the middle board, a clamping groove is arranged on an inner side wall of the middle frame, the card abuts against one side of the camera support, which faces away from the main circuit board, and two ends of the card are respectively clamped in the clamping groove and the buckle.

11. The electronic device according to any one of claims 3 to 8, wherein a main board bracket is further disposed in the accommodating space, the main board bracket is disposed on a side of the camera bracket facing away from the main circuit board, a first mounting hole is disposed on the middle board, a second mounting hole is disposed on the main circuit board, a third mounting hole is disposed on the camera bracket, a fourth mounting hole is disposed on the main board bracket, and the first mounting hole, the second mounting hole, the third mounting hole and the fourth mounting hole are connected by screw fitting.

12. The electronic device of any of claims 3-8, wherein the elevated block is a Land Grid Array (LGA) module.