WO2022037374A1

WO2022037374A1 - Electronic device

Info

Publication number: WO2022037374A1
Application number: PCT/CN2021/108821
Authority: WO
Inventors: 毛维华; 吕仁; 盛建清; 吴博; 于卫东
Original assignee: 华为技术有限公司
Priority date: 2020-08-17
Filing date: 2021-07-28
Publication date: 2022-02-24
Also published as: CN213661669U

Abstract

The present application provides an electronic device, comprising a middle frame, and a display assembly and a rear cover which are respectively connected to two sides of the middle frame, wherein the display assembly, the middle frame and the rear cover together enclose an accommodating space, and a main circuit board, a camera, a TOF transmission device, a TOF reception device, a riser block and a camera holder are provided in the accommodating space; the camera holder is provided on a first side of the main circuit board; the main circuit board is provided with two avoidance holes; the camera and the TOF reception device are connected to the camera holder and respectively extend from the two avoidance holes to a second side of the main circuit board; the riser block is connected to an area, located between the two avoidance holes, on the main circuit board; the riser block is located on the second side of the main circuit board; and the TOF transmission device is connected to one side, away from the main circuit board, of the riser block and is electrically connected to the main circuit board by means of the riser block. The present application provides an electronic device, which can improve the reusability of a TOF transmission device and a TOF reception device.

Description

Electronic equipment

This application claims the priority of the Chinese patent application with the application number 202021732227.2 and the application name "Electronic Equipment" filed with the China Patent Office on August 17, 2020, the entire contents of which are incorporated into this application by reference.

technical field

The present application relates to the technical field of structural design, and in particular, to an electronic device.

Background technique

With the development of electronic devices such as mobile phones, users have higher and higher requirements on the shooting performance of the front camera. A TOF (Time of Flight, Time of Flight) transmitting device and a TOF receiving device can be set in the front camera to realize 3D depth imaging. In the related art, the TOF transmitting device and the TOF receiving device adopt an integrated design, the two are integrated in a bracket, and the wires are drawn from the same BTB (Board to Board, board-to-board) connector and connected to the main circuit in the electronic device. board. However, this setting method will reduce the reusability of the TOF transmitting device and the TOF receiving device in the product design selection stage and the product after-sales maintenance stage, and increase the production cost and maintenance cost.

SUMMARY OF THE INVENTION

The embodiments of the present application provide a foldable electronic device, which can protect the bending area of a flexible screen.

The present application provides an electronic device, which can improve the multiplexability of a TOF transmitting device and a TOF receiving device.

The present application provides an electronic device, comprising: a middle frame, a display assembly and a back cover respectively connected on both sides of the middle frame, and the display assembly, the middle frame and the back cover are jointly formed to form an accommodating space, The accommodating space is provided with a main circuit board, a camera, a TOF transmitting device, a TOF receiving device, a booster block and a camera bracket; the camera bracket is arranged on the first side of the main circuit board, and the main circuit board There are two avoidance holes, the camera and the TOF receiving device are connected to the camera bracket, and respectively extend from the two avoidance holes to the second side of the main circuit board. connected to the main circuit board in the area between the two avoidance holes, the spacer block is located on the second side of the main circuit board, and the TOF emitting device is connected to the space away from the spacer block One side of the main circuit board is electrically connected to the main circuit board through the spacer, and the light-transmitting sides of the camera, the TOF receiving device and the TOF transmitting device all face the main circuit board the second side.

An embodiment of the present application provides an electronic device, in which a TOF transmitting device and a TOF receiving device are packaged independently of each other, so that the TOF receiving device is connected to a main circuit board through a BTB connector, and the TOF transmitting device is connected to the main circuit board through a pad On the other hand, the reusability of the TOF transmitting device and the TOF receiving device can be improved, and the production cost and maintenance cost can be reduced.

In a possible implementation manner, both the camera head and the TOF receiving device include a base, a lens base and a lens that are connected in sequence, and the radial dimensions of the lens base and the lens are smaller than the diameter of the base The base is connected in the camera bracket, the lens holder and the lens extend from the avoidance hole to the second side of the main circuit board, and the spacer is connected to the camera. The minimum distance between the surfaces of the bracket away from the main circuit board is greater than the maximum distance between the base and the surface of the camera bracket away from the main circuit board.

The booster block and the TOF transmitting device are arranged in the accommodation space between the lens and lens holder of the camera and the lens and lens holder of the TOF receiving device. Compared with the way of arranging the TOF transmitting device and the TOF receiving device side by side, the complex By using the space in the height direction of the camera and the TOF receiving device, the compactness of the device layout in the electronic device can be improved. Moreover, stacking the TOF transmitting device on the main circuit board between the camera and the TOF receiving device can shorten the distance between the transmitting axis of the TOF transmitting device and the receiving axis of the TOF receiving device, making the TOF transmitting device The coverage rate of the transmitting field of view and the receiving field of view of the TOF receiving device is higher, which makes the ranging effect better.

In a possible implementation manner, a middle plate is connected inside the middle frame, the display assembly and the main circuit board are respectively arranged on both sides of the middle plate, and the display assembly includes a screen and a cover plate , the screen is pasted on the middle plate, the cover plate is covered on the screen, and the screen is provided with light transmission corresponding to the camera, the TOF receiving device and the TOF transmitting device The middle plate is provided with a first through hole corresponding to the camera, the TOF receiving device and the TOF transmitting device.

The above arrangement of the camera, the TOF receiving device and the TOF transmitting device can be applied to the layout of the front camera in the electronic device. In this case, corresponding through holes need to be provided on the middle plate and the screen to allow light to pass through. The TOF transmitting device is arranged between the camera and the TOF receiving device and is connected to the main circuit board, which utilizes the space in the thickness direction of the electronic equipment. The size of the light-transmitting hole on the screen in the width direction of the electronic device improves the aesthetics of the electronic device.

In a possible implementation manner, a first adhesive is bonded between the screen and the middle plate, and the first adhesive is arranged around the light-transmitting hole and on the side of the first through hole. around.

The setting of the first adhesive can prevent dust from entering the lens area of the camera, TOF transmitting device and TOF receiving device through the gap between the screen and the middle plate, and has a dust-proof effect.

In a possible implementation manner, a shielding sheet is further connected to the side of the middle board facing the main circuit board, and the shielding sheet includes a plate-shaped body and a protrusion connected to the plate-shaped body , the protruding part extends into the first through hole of the middle plate corresponding to the TOF emitting device, the side wall of the protruding part surrounds the TOF emitting device, and the top wall of the protruding part surrounds the TOF emitting device. A second through hole corresponding to the TOF emitting device is provided thereon, and a third through hole corresponding to the camera and the TOF receiving device is provided on the plate-shaped body.

The shielding sheet is used to avoid signal interference between the TOF transmitting device and the camera and the TOF receiving device when the distance is small.

In a possible implementation manner, the plate-shaped body is welded on the middle plate; or, the plate-shaped body is adhered to the middle plate by a second back glue, and the second back glue is set around the first through hole and around the second through hole.

The shielding sheet is connected with the middle plate by welding or bonding, the connection reliability is high, and it can be sealed, which can prevent dust from entering the camera, TOF transmitting device and TOF receiving device through the gap between the middle plate and the shielding plate. The lens area has a dust-proof effect.

In a possible implementation manner, a third adhesive and a fourth adhesive are respectively connected between the plate-shaped body, the camera, and the TOF receiving device, and the third adhesive and the fourth adhesive are respectively connected. Adhesives are respectively arranged around the third through holes.

The setting of the third adhesive and the fourth adhesive prevents dust from entering the lens area through the gap between the shielding sheet, the camera and the TOF receiving device, and has a dust-proof effect.

In a possible implementation manner, a fifth adhesive is connected between the top wall of the protruding portion and the TOF emitting device, and the fifth adhesive is arranged around the second through hole.

The setting of the fifth adhesive can prevent dust from entering the lens area through the gap between the shielding sheet and the TOF emitting device, and has a dust-proof effect.

In a possible implementation manner, the camera bracket is provided with a positioning column, the middle plate is provided with a first positioning hole, and the main circuit board is provided with a second positioning hole. The first positioning hole and the second positioning hole are matched and connected.

The camera bracket is pre-positioned with the middle plate through the positioning column, which can ensure the assembly accuracy of the camera bracket and the middle plate.

In a possible implementation manner, a card and a buckle are further provided in the accommodating space, the buckle is welded on the side of the main circuit board away from the middle board, and the inner side wall of the middle frame A card slot is provided on the card, the card abuts on the side of the camera bracket away from the main circuit board, and the two ends of the card are respectively clipped in the card slot and the clip.

The cooperation of the card slot, the buckle and the card can preliminarily fix the camera assembly on the middle frame assembly, which is beneficial to the subsequent re-fixing of the screw, and the card has a simple structure and low assembly difficulty.

In a possible implementation manner, a mainboard bracket is further arranged in the accommodating space, the mainboard bracket is arranged on the side of the camera bracket away from the main circuit board, and the middle plate is arranged with a first Mounting holes, the main circuit board is provided with a second mounting hole, the camera bracket is provided with a third mounting hole, the motherboard bracket is provided with a fourth mounting hole, the first mounting hole, the second mounting hole The hole, the third mounting hole and the fourth mounting hole are connected by screw fitting.

The main board bracket and the middle frame assembly are fixedly connected by screws, so that the assembly is convenient, and the main board bracket can play a supporting and protecting role on the main circuit board.

In a possible implementation manner, the spacer block is a grid array packaged LGA module.

The LGA module is a grid array package module. The TOF transmitter is connected to the top of the LGA module. The bottom of the LGA module is distributed with pads. The LGA module can be soldered on the main circuit board through the pads. The circuit board is electrically connected, no BTB connector is required, the structure is simpler, and the compactness of device arrangement in the electronic device is improved.

An embodiment of the present application provides an electronic device, in which a TOF transmitting device and a TOF receiving device are packaged independently of each other, so that the TOF receiving device is connected to a main circuit board through a BTB connector, and the TOF transmitting device is connected to the main circuit board through a pad On the other hand, it can improve the reusability of the TOF transmitting device and the TOF receiving device, and reduce the production cost and maintenance cost; the height of the TOF transmitting device in the thickness direction of the electronic equipment can be increased, and the field of view of the TOF transmitting device can be prevented from being affected by In addition, the TOF emitting device is connected to the main circuit board through the spacer block, which reuses the space in the thickness direction of the electronic device, which can improve the compactness of the device layout in the electronic device and is conducive to the miniaturization design of the electronic device.

Description of drawings

FIG. 1 is a schematic diagram of the overall structure of an electronic device provided by an embodiment of the present application;

2 is a partial cross-sectional schematic diagram of an electronic device provided by an embodiment of the present application;

Fig. 3 is the enlarged view of B place in Fig. 2;

4 is an exploded view of an electronic device provided by an embodiment of the present application;

FIG. 5 is a schematic diagram of an exploded structure of a display assembly provided by an embodiment of the present application;

6 is a schematic diagram of the overall structure of a display assembly provided by an embodiment of the present application;

7 is a schematic diagram of an exploded structure of a middle frame assembly provided by an embodiment of the present application;

8 is a schematic diagram of the overall structure of a middle frame assembly provided by an embodiment of the present application;

FIG. 9 is a schematic structural diagram of a shielding sheet provided by an embodiment of the present application;

10 is a schematic partial structure diagram of another angle of a middle frame and a middle plate provided by an embodiment of the application;

11 is a schematic diagram of an exploded structure of a circuit board assembly provided by an embodiment of the application;

12 is a schematic diagram of an overall structure of a circuit board assembly provided by an embodiment of the application;

Figure 13 is an enlarged view at C in Figure 12;

14 is a schematic diagram of an exploded structure of a camera assembly provided by an embodiment of the application;

15 is a schematic diagram of the overall structure of a camera assembly provided by an embodiment of the application;

16 is a schematic structural diagram of a display assembly, a middle frame assembly, a circuit board assembly, and a camera assembly provided by an embodiment of the application;

17 is a schematic partial cross-sectional structural diagram of an electronic device provided by an embodiment of the application;

FIG. 18 is a schematic structural diagram of a card provided by an embodiment of the application;

FIG. 19 is an assembly schematic diagram of a motherboard bracket provided by an embodiment of the application;

Figure 20 is an enlarged view at D in Figure 19;

FIG. 21 is a schematic structural diagram of a motherboard bracket according to an embodiment of the application.

Description of reference numbers:

100-electronic equipment; 11-display assembly; 111-cover plate; 112-screen; 1121-light transmission hole; 12-middle frame assembly; 121-middle frame; 1211-card slot; 122-middle plate; 1223-first through hole; 1224-first positioning hole; 1225-first mounting hole; 123-shield sheet; 1230-plate body; 1231-protrusion; 1231a-side wall; 1231b-top wall; 1232- 1233, 1234 - third through hole; 13 - camera assembly; 131 - camera; 1311 - base; 1312 - lens holder; 1313 - lens; 132 - TOF receiving device; 133 - camera bracket; 1331, 1332 - accommodating cavity; 1333 - positioning post; 1334 - third mounting hole; 14 - circuit board assembly; 141 - main circuit board; 1411, 1412 - avoidance holes; 1413 - second mounting hole; 1414 - second positioning hole ; 142 - Elevator block; 143 - TOF transmitter; 144 - Buckle; 15 - Motherboard bracket; 151 - Fourth mounting hole; 152 - First recess; 153 - Second recess; 154 - Third recess ; 16-card; 161-body segment; 162-connection segment; 163-first snap-on segment; 164-second snap-on segment; 171-first adhesive; 172-second adhesive; 173-third back Glue; 174-Fourth Adhesive; 175-Fifth Adhesive; 176-Screw.

detailed description

The embodiment of the present application provides an electronic device, including but not limited to a mobile phone, a tablet computer, a notebook computer, an ultra-mobile personal computer (UMPC), a handheld computer, a walkie-talkie, a netbook, a POS machine, a personal digital assistant ( Personal digital assistant, PDA), wearable devices, virtual reality devices, Bluetooth audio, vehicle-mounted devices and other mobile or fixed terminal devices with cameras.

In the embodiments of the present application, a mobile phone is used as an example of the above electronic device to specifically describe the structure of the electronic device.

It should be noted that, in the drawings of the embodiments of the present application, the X axis may be defined as the width direction of the electronic device 100 , the Y axis may be defined as the length direction of the electronic device 100 , and the Z axis may be defined as the thickness direction of the electronic device 100 . More specifically, the positive direction of the X-axis can be defined as the right-to-left direction on the display surface when the user uses the electronic device 100, and the positive direction of the Y-axis can be defined as the bottom-to-top direction on the display surface when the user uses the electronic device 100, The positive direction of the Z-axis is defined as the direction from the back of the electronic device 100 to the display surface.

FIG. 1 is a schematic diagram of an overall structure of an electronic device according to an embodiment of the present application. Referring to FIG. 1, the electronic device 100 includes a display assembly 11, a middle frame 121 and a camera assembly 13. The display assembly 11 and a back cover (not shown in the figure) are respectively connected on both sides of the middle frame 121. The display assembly 11, the middle frame The frame 121 and the back cover together form an accommodating space, and the main circuit board, the battery, the camera assembly 13 and other electronic devices are arranged in the accommodating space. When the user uses the electronic device 100 , the display component 11 faces the user's field of vision to display different images for the user, while the back cover is away from the user's field of view.

At least one camera may be provided in the electronic device 100 to realize a shooting function. In this embodiment of the present application, the TOF receiving device 132 and the TOF transmitting device 143 may be provided in the electronic device 100 . The TOF transmitting device 143 is used for sending out a detection light signal, and the TOF receiving device 132 is used for receiving the sensing light signal, the sensing light signal is the light signal formed by the detection light signal reflected by the object to be measured, and the sensing light signal carries the depth of field of the object to be measured information. By calculating the time difference or phase difference between the detection optical signal transmitted by the TOF transmitting device 143 and the sensing optical signal received by the TOF receiving device 132, the distance between the object to be measured and the TOF transmitting device 143 and the TOF receiving device 132 can be calculated. The TOF transmitting device 143 and the TOF receiving device 132 are used together, and can be applied to environments such as ranging, face recognition, avatar unlocking, gesture recognition, object modeling, 3D games, and smart homes.

A camera 131 may also be provided in the electronic device 100, and the camera 131 may be an RGB camera, an infrared camera, or a black and white camera.

The camera 131 , the TOF receiving device 132 and the TOF transmitting device 143 can be as shown in FIG. 1 , as the front camera of the electronic device 100 , with the light-transmitting side facing the side of the electronic device 100 with the display assembly 11 . In another possible implementation, they can also be used as rear cameras of the electronic device 100 , with the light-transmitting side facing the side of the electronic device 100 with the back cover. Among them, the light-transmitting side of the camera 131 and the TOF receiving device 132 refers to the light-in side, that is, the side facing the lens, and the light-transmitting side of the TOF transmitting device 143 refers to the light-emitting side, that is, the transmitted light signal of the TOF transmitting device 143 The side to which the light source is facing.

The camera 131 , the TOF receiving device 132 and the TOF transmitting device 143 are arranged adjacent to each other to save space and realize the miniaturized design of the electronic device 100 . The positions of the camera 131 , the TOF receiving device 132 and the TOF transmitting device 143 are not specifically limited in this embodiment, and may be located in the upper left corner of the electronic device 100 exemplarily.

In the related art, the TOF transmitting device and the TOF receiving device adopt an integrated design, the two are integrated in a bracket, and the wires are drawn out from the same BTB connector and connected to the main circuit board in the electronic device. The TOF transmitting device and the TOF receiving device are integrated together. This setting method will reduce the reusability of the TOF transmitting device and the TOF receiving device in the product design selection stage and the product after-sales maintenance stage, and increase the production cost and maintenance cost.

Based on the above description, an embodiment of the present application provides an electronic device in which the TOF transmitting device and the TOF receiving device are packaged independently of each other, so that the TOF receiving device is connected to the main circuit board through a BTB connector, and the TOF transmitting device is connected through a pad On the main circuit board, the reusability of the TOF transmitting device and the TOF receiving device can be improved, and the production cost and maintenance cost can be reduced.

FIG. 2 is a partial cross-sectional schematic diagram of an electronic device provided by an embodiment of the present application. The cutting position corresponds to A-A in FIG. 1 , and FIG. 3 is an enlarged view of B in FIG. 2 . Referring to FIGS. 2-3 , in the embodiment of the present application, a main circuit board 141 , a camera bracket 133 and a booster block 142 are arranged in the accommodating space of the electronic device 100 . The main circuit board 141 is provided with two avoidance holes, the camera bracket 133 is connected to the first side of the main circuit board 141 , and the camera 131 and the TOF receiving device 132 are connected to the camera bracket 133 , respectively extending into the two avoidance holes and extending out. To the second side of the main circuit board 141, the spacer block 142 is connected to the area of the main circuit board 141 between the two avoidance holes, and the spacer block 142 is connected to the second side of the main circuit board 141, and the TOF transmits The device 143 is connected to the side of the booster block 142 away from the main circuit board 141 , and the light-transmitting sides of the camera 131 , the TOF receiving device 132 and the TOF transmitting device 143 all face the second side of the main circuit board 141 . It should be noted that, the first side and the second side of the main circuit board 141 correspond to the lower side and the upper side of the main circuit board 141 in FIG. 2 , respectively.

In the embodiment of the present application, the camera 131 and the TOF receiving device 132 can be electrically connected to the main circuit board 141 through BTB connectors, respectively, and the TOF transmitting device 143 can be electrically connected to the main circuit board 141 through the pad block 142. Therefore, The TOF receiving device 132 and the TOF transmitting device 143 are separated and set up, which can improve the multiplexability of the TOF transmitting device and the TOF receiving device, and reduce the production cost and maintenance cost.

On the one hand, the spacer 142 can increase the height of the TOF emitting device 143 in the thickness direction of the electronic device 100 , and can prevent the field angle of the TOF emitting device 143 from being interfered. On the other hand, the TOF emitting device 143 is electrically connected to the main circuit board 141 through the spacer block 142, without the need to provide a BTB connector, the structure is simpler, and the volume occupied by the TOF emitting device 143 can be reduced, thereby facilitating the improvement of electronic equipment. The compactness of device arrangement within 100.

Exemplarily, the pad 142 may be a grid array packaged LGA module, the LGA module may be a grid array packaged module, the TOF emitting device 143 is connected on the top of the LGA module, and pads are distributed on the bottom of the LGA module, and the LGA module can pass The pads are soldered on the main circuit board 141 .

The camera 131 and the TOF receiving device 132 include a base 1311, a lens holder 1312 and a lens 1313 connected in sequence. The size of the lens holder 1312 and the lens 1313 is smaller than that of the base 1311, the base 1311 is connected in the camera bracket 133, and the lens holder is 1312 and the lens 1313 protrude from the avoidance hole to the second side of the main circuit board 141, and the minimum distance L1 between the booster block 142 and the surface of the camera bracket 133 away from the main circuit board 141 is greater than the base 1311 and the camera bracket 133 The maximum distance L2 between the surfaces away from the main circuit board 141

The radial dimensions of the lens mount 1312 and the lens 1313 are smaller than the radial dimensions of the base 1311 , that is, the distance between the edges of the lens mount 1312 and the lens 1313 and the axis of the camera 131 is smaller than the distance between the edge of the base 1311 and the camera 131 . distance. Therefore, the space between the camera 131 and the lens 1313 of the TOF receiving device 132 and between the camera 131 and the lens holder 1312 of the TOF receiving device 132 is larger than that between the respective bases 1311 of the two. space. The TOF emitting device 143 is stacked on the main circuit board 141 between the camera 131 and the TOF receiving device 132 through the booster block 142. Therefore, the booster block 142 and the TOF emitting device are arranged in the larger accommodating space, Compared with the way of arranging the TOF transmitting device 143 and the TOF receiving device 132 side by side, the space in the height direction of the camera 131 and the TOF receiving device 132 is multiplexed, which can improve the compactness of the device layout in the electronic device 100 .

Furthermore, by stacking the TOF transmitting device 143 on the main circuit board 141 between the camera 131 and the TOF receiving device 132 through the spacer block 142, the distance between the transmitting axis of the TOF transmitting device 143 and the receiving axis of the TOF receiving device 132 can be shortened The distance between the TOF transmitting device 143 and the receiving field of view of the TOF receiving device 132 is higher, so that the distance measurement effect is better.

In a possible implementation manner, the above arrangement of the camera 131 , the TOF receiving device 132 and the TOF transmitting device 143 may be applicable to the layout of the rear camera in the electronic device 100 . At this time, the second side of the main circuit board 141 is disposed toward the rear cover of the electronic device 100, and the rear cover is provided with an opening, and a transparent lens is connected to the opening, so that the external light can enter the camera 131 and the TOF receiving device 132, and the light emitted by the TOF emitting device 143 can be transmitted smoothly.

In another possible implementation manner, continuing to refer to FIGS. 2-3 , the above-mentioned arrangement of the camera 131 , the TOF receiving device 132 and the TOF transmitting device 143 may be applicable to the layout of the front camera in the electronic device 100 . At this time, the second side of the main circuit board 141 is disposed toward the display assembly 11 of the electronic device 100 . The display assembly 11 includes a screen 112 and a cover plate 111 disposed on the screen 112 . The screen 112 is provided with a corresponding camera 131 and a TOF receiver. The light-transmitting holes of the device 132 and the TOF emitting device 143 are used to facilitate light transmission.

The accommodating space of the electronic device 100 is also provided with a middle plate 122 . The middle plate 122 is connected to the inside of the middle frame 121 to support the display assembly 11 and connect other devices inside the electronic device 100 . The side bezels are exposed to the outside. The middle frame 121 and the middle plate 122 may be an integral piece, and may be made of materials such as metal, ceramics, and glass.

The screen 112 can be pasted on the middle plate 122 , the cover plate 111 can be connected to the screen 112 through an optical adhesive layer, and the surrounding edges of the cover plate 111 can be pasted and fixed on the middle frame 121 . Wherein, the screen 112 can be an organic light emitting diode (Organic light emitting diode, OLED) display assembly, and the screen 112 is a laminated structure, including a polarizer, a display panel, a touch layer, a substrate, and an optical adhesive layer connecting two adjacent layers. The cover plate 111 is exposed outside the electronic device 100 and can protect the screen 112 , the cover plate 111 can be transparent glass or plastic, and the screen 112 and the cover plate 111 can be flat or curved.

The main circuit board 141 may be fixedly connected to the middle frame 121 or the middle board 122 , and the main circuit board 141 and the middle board 122 are disposed opposite to each other and located on the side of the middle board 122 away from the display assembly 11 . The middle plate 122 may have first through holes corresponding to the camera 131 , the TOF receiving device 132 and the TOF transmitting device 143 , and the camera 131 and the TOF receiving device 132 pass through the avoidance hole on the main circuit board 141 and the first through hole on the middle plate 122 . The through hole extends into the light-transmitting hole on the screen 112 , so that the camera 131 and the TOF receiving device 132 are disposed close to the cover plate 111 and have a larger field of view.

The camera 131, the TOF transmitting device 143 and the TOF receiving device 132 can be arranged along the width direction of the electronic device 100. The TOF transmitting device 143 is arranged between the camera 131 and the TOF receiving device 132 and is connected to the main circuit board, using the electronic device The space in the thickness direction of the electronic device 100 can reduce the size of the light-transmitting hole on the screen 112 in the width direction of the electronic device 100, and improve the electronic device 100 aesthetics.

The side of the middle board 122 facing the main circuit board 141 is also connected with a shielding sheet 123, and the shielding sheet 123 is a metal sheet, such as a stainless steel sheet or an aluminum alloy sheet. The shielding sheet 123 is arranged between the middle plate 122 and the camera 131, the TOF transmitting device 143, and the TOF receiving device 132. A second through hole is provided on the shielding sheet 123 at a position corresponding to the TOF transmitting device 143, corresponding to the camera 131 and the TOF receiving device 132. A third through hole is disposed at the position of the receiving device 132 , and the second through hole and the third through hole on the shielding sheet 123 correspond to the first through hole on the middle plate 122 respectively, so as to facilitate light transmission.

The shielding sheet 123 includes a plate-shaped body 1230 and a protrusion 1231 protruding from the plate-shaped body 1230 . The protrusion 1231 is located in the middle of the plate-shaped body 1230 and extends into the middle plate 122 corresponding to the TOF emitting device 143 inside the first through hole. The third through holes provided corresponding to the camera 131 and the TOF receiving device 132 are respectively provided on the plate-shaped body 1230 on both sides of the protruding portion 1231 . The raised portion 1231 includes a side wall 1231a and a top wall 1232b, and the side wall 1231a is arranged around the TOF transmitting device 143 to play a shielding effect, so as to avoid the TOF transmitting device 143 and the camera 131 and the TOF receiving device 132 when the distance is small. cause signal interference with each other. A second through hole provided corresponding to the TOF emitting device 143 is located on the top wall 1232b.

A first adhesive 171 is disposed between the screen 112 and the middle plate 122. The first adhesive 171 is located around the light-transmitting holes on the screen 112 and around the first through holes on the middle plate 122, which can form a sealed space , to prevent dust from entering the lens area of the camera 131 , the TOF transmitting device 143 and the TOF receiving device 132 through the gap between the screen 112 and the middle plate 122 , so as to achieve a dustproof effect.

The plate-shaped main body 1230 of the shielding sheet 123 can be adhered to the middle plate 122 by the second back glue 172, and the second back glue 172 is located around the first through hole on the middle plate 122 and between the third through hole of the shielding sheet 123. Around, a sealed space can be formed to prevent dust from entering the lens area of the camera 131 , the TOF transmitting device 143 and the TOF receiving device 132 through the gap between the middle plate 122 and the shielding sheet 123 , thereby achieving a dustproof effect. In another possible implementation manner, the plate-shaped body 1230 of the shielding sheet 123 may be fixedly connected to the middle plate 122 by welding.

The side of the shielding sheet 123 away from the middle plate 122 is also connected with a third adhesive 173, a fourth adhesive 174 and a fifth adhesive 175, which are respectively connected to the shielding sheet 123, the camera 131, the TOF receiving device 132, and the TOF transmitting device. 143 to form a sealed space to prevent dust from entering the lens area through the gaps between the shielding sheet 122 and the camera 131, the TOF transmitting device 143, and the TOF receiving device 132, and has a dust-proof effect. The third adhesive 173 and the fourth adhesive 174 are connected to the plate-shaped body 1230 around the third through hole, and the fifth adhesive 175 is connected to the top wall 1231b of the raised portion 1231 and located in the second through hole. around the hole. It can be seen that in addition to shielding, the shielding sheet 123 can also provide an adhesive surface, so that the camera 131 , the TOF transmitting device 143 , and the TOF receiving device 132 can be sealed and connected to the middle plate 122 through adhesive backing.

FIG. 4 is an exploded view of an electronic device according to an embodiment of the present application. Referring to FIG. 4 , in a specific embodiment, the electronic device 100 includes a cover plate 111 , a screen 112 , a middle frame 121 , a middle plate 122 , a shielding sheet 123 , a TOF emitting device 143 , a spacer block 142 , and a main circuit The board 141, the buckle 144, the camera 131, the TOF receiving device 132, the camera bracket 133, the card 16, the main board bracket 15 and other components.

The structure of the electronic device 100 provided by the embodiments of the present application will be described in detail below with reference to the specific drawings and embodiments, and according to the assembly sequence of the electronic device 100 .

FIG. 5 is a schematic diagram of an exploded structure of a display assembly provided by an embodiment of the application, and FIG. 6 is a schematic diagram of an overall structure of a display assembly provided by an embodiment of the application. Referring to FIG. 5 and FIG. 6 , the display assembly 11 includes a screen 112 and a cover plate 111 , and the display assembly 11 can be obtained by attaching the screen 112 to one side surface of the cover plate 111 . Specifically, the bonding between the screen 112 and the cover plate 111 can be realized by optical glue, and the transparent optical glue will not affect the display effect of the screen 112 .

The screen 112 is provided with a light-transmitting hole 1121 , and the light-transmitting hole 1121 is arranged at the upper left corner of the screen 112 , and is arranged corresponding to the position of the camera assembly 13 . The light-transmitting hole 1121 is used to allow external light to enter the camera 131 and the TOF receiving device 132, and the light emitted by the TOF emitting device 143 can be emitted to the outside of the electronic device 100, so as to realize the photographing function. A plurality of light-transmitting holes 1121 may be provided, which are provided corresponding to the camera 131 , the TOF receiving device 132 and the TOF transmitting device 143 respectively. Alternatively, there is one light-transmitting hole 1121 , which corresponds to the camera 131 , the TOF receiving device 132 and the TOF transmitting device 143 at the same time. Setting one light-transmitting hole 1121 is more beneficial to the production and processing of the screen 112 than providing a plurality of light-transmitting holes, and the appearance of the display assembly 11 is more aesthetically pleasing.

FIG. 7 is a schematic diagram of an exploded structure of a middle frame assembly according to an embodiment of the application, FIG. 8 is a schematic diagram of an overall structure of a middle frame assembly according to an embodiment of the application, and FIG. 9 is a structure of a shielding sheet according to an embodiment of the application. Schematic. Referring to FIGS. 7-9 , the middle frame assembly 12 includes a middle frame 121 , a middle plate 122 and a shielding sheet 123 , and the middle frame 121 and the middle plate 122 are one piece. The first back glue 171 is pasted on the side of the middle plate 122 facing the screen 112 , the shielding sheet 123 is connected to the side of the middle plate 122 away from the screen 112 through the second back glue 172 , and the shielding sheet 123 is far away from the middle plate. The middle frame assembly 12 can be obtained by pasting the third adhesive 173 , the fourth adhesive 174 and the fifth adhesive 175 on one side of the 122 .

The middle plate 122 is provided with first through

holes

1221 , 1222 and 1223 , respectively corresponding to the camera 131 , the TOF receiving device 132 and the TOF transmitting device 143 , and the first through hole 1223 is located between the first through

holes

1221 and 1222 , the first through

holes

1221 and 1222 are circular through holes, and the first through hole 1223 is a rectangular through hole.

The shielding sheet 123 includes a plate-shaped body 1230 and a convex portion 1231 . The outer contour of the plate-shaped body 1230 may be in the shape of a racetrack, and the convex portion 1231 is connected to the middle of the plate-shaped body 1230 . The size of the raised portion 1231 matches the overall size of the TOF emitting device 143, so that the sidewall 1231a of the raised portion 1231 can be covered around the TOF emitting device 143, and the top wall 1231b of the raised portion 1231 is connected to the TOF emitting device 143. top of device 143.

The plate-shaped body 1230 is provided with third through

holes

1233 and 1234 , which are respectively located on both sides of the protruding portion 1231 and are set as circular holes, corresponding to the camera 131 and the TOF receiving device 132 respectively. A second through hole 1232 is provided on the top wall 1231b of the raised portion 1231 . The second through hole 1232 is a rectangular hole and its size matches the lens size of the TOF emitting device 143 so as not to obstruct the field of view of the TOF emitting device 143 .

The first back glue 171 covers the periphery of the first through

holes

1221 , 1222 and 1223 of the middle board 122 to seal and connect the middle board 122 and the screen 112 . The shape of the outer contour of the first adhesive tape 171 is not specifically limited, for example, a rectangle may be provided. The second back glue 172 covers the periphery of the first through

holes

1221 , 1222 and 1223 of the midboard 122 and the periphery of the

third vias

1233 and 1234 of the shielding sheet 123 , so as to seal and connect the midboard 122 and the shielding sheet 123 . The shape of the outer contour of the second adhesive tape 172 is the same as the shape of the outer contour of the shielding sheet 123 , and is in the shape of a racetrack. The second adhesive 172 may cover the entire area of the plate-shaped body 1230 to improve the sealing effect. The third adhesive tape 173 covers the periphery of the third through hole 1233 and has an annular shape as a whole, and the fourth adhesive adhesive 174 covers the periphery of the third through hole 1234 and has an annular shape as a whole. The fifth back glue 175 is adhered to the top wall 1231b of the protruding portion 1231, and covers the periphery of the second through hole 1232, and the outer contour is rectangular.

FIG. 10 is a schematic structural diagram of another angle of a middle frame and a middle plate according to an embodiment of the present application. Referring to FIG. 10 , the middle plate 122 is further provided with a first positioning hole 1224 and a first mounting hole 1225 , a columnar structure is protruded from the surface of the middle plate 122 facing the main circuit board 141 , and the first positioning hole 1224 and the first installation hole 1225 are blind holes provided on the columnar structure, wherein the first installation hole 1225 can be a screw hole. The number of the first positioning holes 1224 is at least two, which are respectively disposed near the first through

holes

1221 and 1222 to realize the positioning connection of the camera bracket 133 . The number of the first installation holes 1225 is at least two, which are respectively disposed near the first through

holes

1221 and 1222 , and are used to realize the fixed connection between the camera bracket 133 and the motherboard bracket 15 .

11 is a schematic diagram of an exploded structure of a circuit board assembly provided by an embodiment of the application, FIG. 12 is a schematic diagram of an overall structure of the circuit board assembly provided by an embodiment of the application, and FIG. 13 is an enlarged view of C in FIG. 12 . Referring to FIGS. 11-13 , the circuit board assembly 14 includes a main circuit board 141 , a spacer block 142 , a TOF emitting device 143 and a buckle 144 . Connect the booster block 142 to the side of the main circuit board 141 facing the middle board 122 , connect the TOF emitting device 143 to the booster block 142 , and connect the clip 144 to a side of the main circuit board 141 away from the middle board 122 . side, the circuit board assembly 14 is available.

Among them, the main circuit board 141 is provided with

avoidance holes

1411 and 1412, and the

avoidance holes

1411 and 1412 can be set as rectangular holes, which are opened in the upper left corner of the main circuit board 141 to avoid the camera 131 and the TOF receiving device 132 respectively. The spacer block 142 is located between the avoidance holes 1411 and 1422, and can be connected to the main circuit board 141 by welding. The spacer block 142 is used to increase the height of the TOF receiving device relative to the main circuit board 141, and the TOF receiving device 132 can be The electrical connection with the main circuit board 141 is achieved through the booster block 142 . The avoidance holes 1411 and 1412 may be openings formed inside the main circuit board 141 , or may be cut holes formed at the edge of the main circuit board 141 .

The main circuit board 141 is also provided with a second mounting hole 1413 and a second positioning hole 1414 . The second mounting hole 1413 and the second positioning hole 1414 are both through holes formed on the main circuit board 141 . The number of the second mounting holes 1413 is at least two, which are respectively provided close to the two

avoidance holes

1411 and 1412, corresponding to the first mounting holes 1225 on the middle board 122, and are used to realize the main circuit board 141, the middle board 122 and the camera. The bracket 133 is fixedly connected to the motherboard bracket 15 . The number of the second positioning holes 1414 is at least two, which are respectively provided close to the two

avoidance holes

1411 and 1412, and are respectively provided close to the two second mounting holes 1413, corresponding to the first positioning holes 1224 on the middle plate 122. To realize the positioning connection of the main circuit board 141 , the middle board 122 and the camera bracket 133 .

The clips 144 can be welded on the main circuit board 141 to cooperate with the card 16 to fix the camera bracket 133 on the main circuit board 141 and the middle frame 121 . The buckle 144 is connected to the side of the main circuit board 141 away from the middle board 122 , is located on the side of the two avoidance holes 1411 and 1422 facing the positive direction of the Y-axis, and is disposed close to the two avoidance holes 1411 in the X-axis direction. and the midpoint of 1422.

FIG. 14 is a schematic diagram of an exploded structure of a camera assembly provided by an embodiment of the application, and FIG. 15 is a schematic diagram of an overall structure of the camera assembly provided by an embodiment of the application. Referring to FIG. 14 and FIG. 15 , the camera assembly 13 includes a camera head 131 , a TOF receiving device 132 and a camera head bracket 133 . The camera assembly 13 can be obtained by installing the camera 131 and the TOF receiving device 132 in the camera bracket 133 respectively.

The camera bracket 133 is a rectangular frame as a whole, and

accommodating cavities

1331 and 1332 are arranged in the rectangular frame. The openings of the

accommodating cavities

1331 and 1332 are disposed toward the middle plate 122 for accommodating the camera 131 and the TOF receiving device 132 respectively. The camera 131 and the TOF receiving device 132 have the same structure, including a base 1311 at the bottom, a lens holder 1312 connected above the base 1311, and a lens 1313 connected above the lens holder 1312. The base 1311 is a cube, and the lens holder 1312 and The lens 1313 is cylindrical, the bottom of the base 1311 is installed in the accommodating cavity on the camera bracket 133, for example, it can be fixed by adhesive, and the upper part of the base 1311 extends out of the accommodating cavity and can be accommodated in the main circuit board 141. In the avoidance hole, the lens holder 1312 and the lens 1313 protrude to the side of the main circuit board 141 facing the middle board 122 .

The camera bracket 133 also includes a positioning column 1333 and a third mounting hole 1334. The positioning column 1333 and the third mounting hole 1334 are both columnar structures connected to the outside of the rectangular frame. The positioning column 1333 extends toward the side close to the main circuit board 141. The three mounting holes 1334 are through holes opened in the columnar structure. The number of the positioning posts 1333 is at least two, which are arranged corresponding to the first positioning holes 1224 on the middle board 122 and the second positioning holes 1414 on the main circuit board 141 . The number of the third mounting holes 1334 is at least two, which are provided corresponding to the first mounting holes 1225 on the middle board 122 and the second mounting holes 1413 on the main circuit board 141 .

FIG. 16 is a schematic structural diagram of a display assembly, a middle frame assembly, a circuit board assembly, and a camera assembly according to an embodiment of the application. Referring to FIG. 16, after the display assembly 11, the middle frame assembly 12, the circuit board assembly 14, and the camera assembly 13 are assembled respectively, the display assembly 11 can be connected to the middle frame assembly 12, and the circuit board assembly 14 can be connected to the middle frame On the assembly 12 , the camera assembly 13 is connected to the middle frame assembly 12 and the circuit board assembly 14 , and is further fixed by the card 16 .

Specifically, the screen 112 is pasted on the middle plate 122 by dispensing or back glue, and the light-transmitting holes 1121 on the screen 112 and the first through holes on the middle plate 122 are sealed by the first back glue 171; the circuit board The component 14 is connected to the middle frame component 12 by screws not shown in the figure, and the TOF emitting device 143 is pasted on the shielding sheet 123 by the fifth adhesive 175; the positioning column 1333 on the camera bracket 133 extends into the middle plate 122 The first positioning hole 1224 of the main circuit board 141 and the second positioning hole 1414 of the main circuit board 141 are fixed by the card 16, and the camera 131 and the TOF receiving device 132 are respectively pasted on the shielding sheet through the third adhesive 173 and the fourth adhesive 174. 123, so as to realize the connection between the camera assembly 13, the middle frame assembly 12 and the circuit board assembly 14.

FIG. 17 is a schematic diagram of a partial cross-sectional structure of an electronic device provided by an embodiment of the application, and FIG. 18 is a schematic diagram of a structure of a card provided by an embodiment of the application. 17 and 18 , the card 16 includes a main body section 161, a first clipping section 163, a second clipping section 164 and two connecting sections 162, wherein one connecting section 162 is connected between the main body section 161 and the first card Between the connecting segments 163 , another connecting segment 162 is connected between the main body segment 161 and the second clamping segment 164 .

The inner side wall of the middle frame 121 is provided with a card slot 1211 , the side of the main circuit board 141 away from the middle plate 122 is fixed with a buckle 144 , the main body section 161 of the card 16 abuts on the bottom of the camera bracket 133 , and the first A clamping segment 163 and a second clamping segment 164 are respectively clamped in the clamping slot 1211 and the clamping buckle 144 to further fix the camera assembly 13 , the middle frame assembly 12 and the circuit board assembly 14 .

FIG. 19 is an assembly schematic diagram of a mainboard bracket provided by an embodiment of the application, FIG. 20 is an enlarged view of D in FIG. 19 , and FIG. 21 is a schematic structural diagram of the mainboard bracket provided by an embodiment of the application. Referring to FIGS. 19-21 , after completing the assembly of the display assembly 11 , the middle frame assembly 12 , the circuit board assembly 14 , the camera assembly 13 and the card 16 in the above process, the motherboard bracket 15 can be fixed by screws 176 next on the midframe assembly 12.

The main board bracket 15 is provided with a fourth mounting hole 151 . The fourth mounting hole 151 is a through hole, and the number of the fourth mounting hole 151 is at least two. The mounting holes 1413 and the third mounting holes 1334 on the camera bracket 133 are correspondingly arranged, and the screws 176 are connected to the fourth mounting holes 151 , the third mounting holes 1334 , the second mounting holes 1413 and the first mounting holes 1225 , thereby fixing the motherboard bracket 15 on the midplane 122 .

The main board bracket 15 is disposed on the side of the main circuit board 141 away from the middle board 122 , and is disposed opposite to the main circuit board 141 for supporting the main circuit board 141 . The main circuit board 141 is also provided with a first concave portion 152 corresponding to the camera bracket 133 , a second concave portion 153 corresponding to the card 16 , and a third concave portion 154 corresponding to the buckle 144 to accommodate the camera bracket 133 and the card. 16 and snaps 144.

It should be understood that the electronic device 100 is also provided with other components that need to be connected to the main circuit board 141, including a battery. After the circuit board assembly 14 is pre-connected to the middle frame assembly 12 by screws, the camera assembly 13 can be connected in sequence. , fasten the BTB connector extending from the camera assembly 113 to the main circuit board 141 , and connect components such as batteries to the main circuit board 141 . Finally, the mainboard bracket 15 is fixed on the middle frame assembly 12 by screws 176. Except for the fourth mounting hole 151 shown in the figure, the mainboard bracket 15 is also provided with several screws at other positions. Fasten to ensure the reliable connection of the middle frame assembly 12 , the circuit board assembly 14 and the mainboard bracket 15 .

According to the above-mentioned assembly sequence of the electronic device 100, it can be obtained that the TOF transmitting device 143 and the TOF receiving device 132 are not integrated together, but are installed independently. In the product design selection stage, the TOF transmitting device 143 and the TOF receiving device 132 are decoupled, It does not need to be used together, you can choose different models for each, and the applicability is wider.

In the after-sales maintenance stage of the product, when one of the TOF transmitting device 143, the TOF receiving device 132 and the camera 131 fails, the screw 176 can be removed first, the motherboard bracket 15 can be removed, then the card 16 can be removed, and the camera assembly can be removed. 13. Repair or replace the faulty TOF receiving device 132 or camera 131 , or continue to remove the circuit board assembly 14 to repair or replace the faulty TOF transmitting device 143 . In the after-sales maintenance stage, only the faulty device can be repaired or replaced, which avoids the problem that the TOF transmitting device 143 and the TOF receiving device 132 need to be replaced at the same time when the TOF transmitting device 143 and the TOF receiving device 132 are integrated, thereby reducing the maintenance cost.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present application, but not to limit them; It should be understood that: it is still possible to modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements to some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the implementation of the application. scope of technical solutions.

Claims

An electronic device, characterized in that it comprises: a middle frame, a display assembly and a back cover respectively connected on both sides of the middle frame, and the display assembly, the middle frame and the back cover are jointly set to form an accommodating space , a main circuit board, a camera, a TOF transmitting device, a TOF receiving device, a spacer, and a camera bracket are arranged in the accommodating space;

The camera bracket is arranged on the first side of the main circuit board, the main circuit board is provided with two avoidance holes, the camera and the TOF receiving device are connected to the camera bracket, and are separated from the two Each of the avoidance holes extends to the second side of the main circuit board, the spacer is connected to the main circuit board in the area between the two avoidance holes, and the spacer is located on the main circuit board. On the second side of the main circuit board, the TOF emitting device is connected to the side of the pad away from the main circuit board and is electrically connected to the main circuit board through the pad, the camera, Both the light-transmitting sides of the TOF receiving device and the TOF transmitting device face the second side of the main circuit board.
The electronic device according to claim 1, wherein the camera head and the TOF receiving device each comprise a base, a lens holder and a lens which are connected in sequence, and the radial dimensions of the lens holder and the lens are smaller than those of the lens holder and the lens. The radial dimension of the base, the base is connected in the camera bracket, the lens holder and the lens protrude from the escape hole to the second side of the main circuit board, the pad is high The minimum distance between the block and the surface of the camera bracket away from the main circuit board is greater than the maximum distance between the base and the surface of the camera bracket away from the main circuit board.
The electronic device according to claim 1 or 2, wherein a middle plate is connected inside the middle frame, the display component and the main circuit board are respectively arranged on both sides of the middle plate, and the The display assembly includes a screen and a cover plate, the screen is pasted on the middle plate, the cover plate is covered on the screen, and the screen is provided with corresponding to the camera, the TOF receiving device and all the The light-transmitting hole of the TOF emitting device, the middle plate is provided with a first through hole corresponding to the camera, the TOF receiving device and the TOF emitting device.
The electronic device according to claim 3, wherein a first adhesive is adhered between the screen and the middle plate, and the first adhesive is disposed around the light-transmitting hole and the around the first through hole.
The electronic device according to claim 3 or 4, wherein a side of the middle board facing the main circuit board is further connected with a shielding sheet, and the shielding sheet comprises a plate-shaped main body and a shielding sheet connected to the board. The convex part on the main body, the convex part extends into the first through hole of the middle plate corresponding to the TOF emitting device, and the side wall of the convex part surrounds the TOF emitting device, so A second through hole corresponding to the TOF emitting device is provided on the top wall of the protruding portion, and a third through hole corresponding to the camera and the TOF receiving device is provided on the plate-shaped body.
The electronic device according to claim 5, wherein the plate-shaped body is welded on the middle plate; or,

The plate-shaped main body is bonded to the middle plate by a second back glue, and the second back glue is arranged around the first through hole and around the second through hole.
The electronic device according to claim 5 or 6, wherein a third adhesive and a fourth adhesive are respectively connected between the plate-shaped body, the camera, and the TOF receiving device, and the third adhesive is The back glue and the fourth back glue are respectively arranged around the third through hole.
The electronic device according to any one of claims 5-7, wherein a fifth adhesive is connected between the top wall of the raised portion and the TOF emitting device, and the fifth adhesive is arranged on the around the second through hole.
The electronic device according to any one of claims 3 to 8, wherein a positioning column is provided on the camera bracket, a first positioning hole is provided on the middle plate, and a first positioning hole is provided on the main circuit board. Two positioning holes, the positioning column is matched and connected with the first positioning hole and the second positioning hole.
The electronic device according to any one of claims 3 to 9, wherein a card and a buckle are further provided in the accommodation space, and the buckle is welded on a part of the main circuit board that faces away from the middle board. On one side, the inner side wall of the middle frame is provided with a card slot, the card abuts on the side of the camera bracket away from the main circuit board, and the two ends of the card are respectively clipped in the card slot and inside the snap.
The electronic device according to any one of claims 3-10, wherein a mainboard bracket is further provided in the accommodating space, and the mainboard bracket is arranged on a side of the camera bracket away from the main circuit board , the middle plate is provided with a first mounting hole, the main circuit board is provided with a second mounting hole, the camera bracket is provided with a third mounting hole, and the motherboard bracket is provided with a fourth mounting hole, The first mounting hole, the second mounting hole, the third mounting hole and the fourth mounting hole are connected by screw fit.
The electronic device according to any one of claims 1-11, wherein the spacer block is a grid array package LGA module.